JP2004273755A - Device and method for fixing substrate - Google Patents

Device and method for fixing substrate Download PDF

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Publication number
JP2004273755A
JP2004273755A JP2003062244A JP2003062244A JP2004273755A JP 2004273755 A JP2004273755 A JP 2004273755A JP 2003062244 A JP2003062244 A JP 2003062244A JP 2003062244 A JP2003062244 A JP 2003062244A JP 2004273755 A JP2004273755 A JP 2004273755A
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Japan
Prior art keywords
substrate
lower receiving
suction
contact member
fixing
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JP2003062244A
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Japanese (ja)
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JP3922191B2 (en
Inventor
Tomoaki Nakanishi
智昭 中西
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2003062244A priority Critical patent/JP3922191B2/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and method for fixing substrate by which various kinds of substrates are fixed certainly by means of a simple mechanism. <P>SOLUTION: In the substrate fixing device which is positioned to the mounting position 13a of an electronic component mounting device and fixes a substrate 13 by receiving the substrate 13 from the downside, a carrier 11 having an opening 11a is caused to hold the substrate 13 and a substrate contacting member 15 having an opening 15a formed correspondingly to a component mounting position 13a is positioned above a receiving member 5 in a state where the member 15 is placed on the top surface of the substrate 13. When the substrate 13 is received by means of the receiving member 5, the substrate 13 is held by suction by bringing a receiving surface 7a into contact with the bottom surface of the substrate 13 by lowering transport rails 10 and, at the same time, the substrate 13 is fixed by pressing the substrate 13 against the receiving surface 7a by exerting draw-in forces on the substrate contacting member 15 from suction pads 8. Consequently, various kinds of substrates are fixed certainly by means of the simple mechanism. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、例えば電子部品実装装置において基板を下受けして固定する基板固定装置および基板固定方法に関するものである。
【0002】
【従来の技術】
電子部品実装装置では、基板に電子部品を実装する実装位置において基板の位置と姿勢を固定するための基板固定装置が用いられる。この基板固定装置では、基板を水平方向に位置決めするとともに、基板の反り変形を矯正して上面を正しく面合わせする必要がある。従来よりこの面合わせの方法として、基板の下面を支持する下受け部材によって基板を真空吸着する方法(例えば特許文献1参照)や、基板搬送用のキャリアに反り変形矯正用の基板押さえ部を設けたものを用いる方法などが知られている(例えば特許文献2参照)。
【0003】
【特許文献1】
特開2002−134992号公報
【特許文献2】
特開平5−299828号公報
【0004】
【発明が解決しようとする課題】
しかしながら上記従来の方法には、次のような難点がある。まず、特許文献1に示すような真空吸着による方法は、基板の剛性がある程度以上あって姿勢保持が容易で、かつ基板に真空吸着を妨げる貫通孔が存在しないような基板に対しては有効であるものの、個片分割用のスリットが予め形成されたタイプの基板などに対しては適用が困難である。
【0005】
また特許文献2に示すような基板押さえ部を用いる方法では、基板の反りをある程度矯正することは可能であるものの、フレキシブル基板などフィルム状で薄く反り変形の大きい種類の基板に対しては、正しく面合わせした状態で基板を確実に固定することができない。このため形状や厚みの異なる種々の基板を対象とする場合には、ねじ式やばね式のクランプ機構などの基板押さえ機構を備えた専用治具を用いることも考えられるが、この場合は多種類の基板を簡易な機構で固定することが困難である。
【0006】
そこで本発明は、様々な種類の基板を確実かつ簡易的な機構で固定することができる基板固定装置および基板固定方法を提供することを目的とする。
【0007】
【課題を解決するための手段】
請求項1記載の基板固定装置は、作業位置において基板を下方から下受けして固定する基板固定装置であって、前記作業位置に配置され上面に前記基板に当接して下受けする下受け面が設けられた下受け部材と、前記基板の上面に載置され下面が基板の上面に当接する基板当接部材と、前記下受け部材の上方に位置する前記基板当接部材に吸引力を作用させることにより前記基板を前記下受け面に押し付けて固定する吸引手段とを備えた。
【0008】
請求項2記載の基板固定装置は、請求項1記載の基板固定装置であって、前記基板当接部材は前記作業位置に基板を搬送する基板搬送手段に取り付けられ、この基板搬送手段に対して前記下受け部材を相対的に昇降させる昇降手段を備えた。
【0009】
請求項3記載の基板固定装置は、請求項1または2記載の基板固定装置であって、前記吸引手段は、前記基板当接部材を真空吸着するために前記下受け部材に設けられた吸引部およびこの吸引部から真空吸引する真空吸引手段である。
【0010】
請求項4記載の基板固定装置は、請求項3記載の基板固定装置であって、前記基板には基板を貫通する基板貫通孔が設けられており、この基板貫通孔の少なくとも一部を介して前記基板当接部材を真空吸着する。
【0011】
請求項5記載の基板固定装置は、請求項4記載の基板固定装置であって、前記基板当接部材が可撓性部材である。
【0012】
請求項6記載の基板固定装置は、請求項1または2記載の基板固定装置であって、前記基板当接部材が磁性体であり、前記吸引手段は、前記基板当接部材を磁力により吸引するために前記下受け部材に設けられた引磁手段である。
【0013】
請求項7記載の基板固定方法は、作業位置において基板を下方から下受けして固定する基板固定方法であって、前記作業位置に配置され上面に前記基板に当接して下受けする下受け面が設けられた下受け部材の上方に基板当接部材が上面に載置された基板を位置させる位置合わせ工程と、この下受け部材の上方に位置する前記基板当接部材に吸引手段によって吸引力を作用させることにより前記基板を前記下受け面に押し付けて固定する基板固定工程とを含む。
【0014】
請求項8記載の基板固定方法は、請求項7記載の基板固定方法であって、前記基板当接部材は、前記作業位置に基板を搬送する基板搬送手段に取り付けられ、前記基板固定工程に先立ってこの基板搬送手段に対して前記下受け部材を相対的に昇降させる基板昇降工程を含む。
【0015】
請求項9記載の基板固定方法は、請求項7または8記載の基板固定方法であって、前記基板固定工程において、前記下受け部材に設けられた吸引部から真空吸引することにより前記基板当接部材を真空吸着する。
【0016】
請求項10記載の基板固定方法は、請求項9記載の基板固定方法であって、前記基板には基板を貫通する基板貫通孔が設けられており、この基板貫通孔の少なくとも一部を介して前記基板当接部材を真空吸着する。
【0017】
請求項11記載の基板固定方法は、請求項10記載の基板固定方法であって、前記基板当接部材が可撓性部材である。
【0018】
請求項12記載の基板固定方法は、請求項7または8記載の基板固定方法であって、前記基板当接部材が磁性体であり、前記基板固定工程において、前記下受け部材に設けられた引磁手段によって前記基板当接部材を磁力により吸引する。
【0019】
本発明によれば、作業位置に配置され基板に当接して下受けする下受け面が設けられた下受け部材の上方に基板当接部材が上面に載置された基板を位置させ、基板当接部材に吸引手段によって吸引力を作用させて基板を下受け面に押し付けて固定することにより、様々な種類の基板を確実かつ簡易的な機構で固定することができる。
【0020】
【発明の実施の形態】
(実施の形態1)
図1は本発明の実施の形態1の基板固定装置の斜視図、図2は本発明の実施の形態1の基板固定装置の側面図、図3は本発明の実施の形態1の基板固定装置の部分断面図である。
【0021】
まず図1を参照して基板固定装置の構造を説明する。この基板固定装置は、電子部品実装装置の実装位置(作業位置)に配置され、フレキシブル基板など薄くて撓み易い基板を下方から下受けして固定する機能を有するものである。図1において、Xテーブル2、Yテーブル3より成る移動テーブル1上にはベースプレート4が装着されており、ベースプレート4の上面の中央部には、基板を下受けして高さ位置を保持する下受け部材5が配設されている。
【0022】
下受け部材5は、矩形のブロック5aの上面に凸部7を設けた形状となっており、凸部7の周囲にはストッパピン6が立設されている。凸部7の上面は基板の下面に当接して下受けする下受け面7aとなっており、下受け面7aには、基板吸着用の吸着溝7bおよび後述する基板当接部材吸着用の吸着パッド8が設けられている。吸着溝7bおよび吸着パッド8は、吸引管17を介して真空吸引手段18に接続されている。
【0023】
ベースプレート4上面の下受け部材5の両側方には、シリンダ9が垂直姿勢で配設されており、シリンダ9のロッド9aはX方向に配設された搬送レール10に結合されている。搬送レール10上では薄いフィルム状の基板13を保持したキャリア11が図示しない搬送機構によって搬送され、実装位置に位置決めされる。基板13は、板状の基板当接部材15とキャリア11との間に挟み込まれた形で搬送され、この実装位置において、基板13の部品実装位置に13aには、基板当接部材15に設けられた開口部15aを介して電子部品16が実装ヘッド(図示省略)によって実装される。なお、図1においては、キャリア11を搬送レール10から、また基板当接部材15をキャリア11から離した状態を示している。搬送レール10は、基板13を搬送して位置決めする基板搬送手段となっている。
【0024】
シリンダ9を駆動することにより、搬送レール10はガイド部材10aによって案内されて上下動する。搬送レール10はキャリア11の両側部を下方から支持する支持部となっており、シリンダ9は、キャリア11に保持された基板13を下受け部材5に対して相対的に昇降させる昇降手段となっている。搬送レール10を下降させた状態では、キャリア11の下面はストッパピン6の上面に当接し、上下方向の位置が固定される。
【0025】
ここでキャリア11および基板13の上面に載置される基板当接部材15について説明する。キャリア11は矩形の板部材であり、中央部には下受け部材5の凸部7が挿通可能な開口部11aが設けられている。キャリア11のコーナ部には、位置決めピン12が立設されており、基板当接部材15に設けられた位置決め孔15bに位置決めピン12を挿通させることにより、基板当接部材15はキャリア11に対して位置決めされる。
【0026】
基板当接部材15には、開口部15aが設けられた範囲の対角位置に、位置決め孔15cが設けられている。キャリア11と基板当接部材15によって基板13を挟み込んだ状態では、キャリア11に設けられた位置決めピン14が基板13に設けられた位置決め孔および位置決め孔15cに嵌合し、これにより基板13は基板当接部材15に対して、さらにキャリア11に対して位置決めされる。
【0027】
そしてこの位置決め状態では、基板13の下面側は、両側端部のみをキャリア11によって下方から支持され、部品実装位置13aは開口部11aの中央部に位置し、その下面側は下方に露呈される。そして基板13の上面には、開口部15aの範囲を除いて基板当接部材15の下面が当接し、電子部品実装位置13aは開口部15aを介して上方に露呈される。
【0028】
キャリア11に設けられた開口部11aの長手方向寸法は、基板13の長さよりも大きく設定されている。このため、基板13をキャリア11に保持させた状態で開口部11aは完全には塞がれた状態とはならず、基板13の前後両側に吸着パッド8が挿通可能な大きさの開口が残存する。
【0029】
基板13をキャリア11に保持させた状態で搬送レール10を下降させると、下受け面7aはキャリア11の開口部11aを挿通してキャリア11上の基板13の下面に当接するとともに、吸着パッド8が基板13の前後両側に残存する開口を挿通して基板当接部材15の下面に当接する。
【0030】
下受け面7aの吸着溝7bは、基板13の各部品実装位置13aを囲む配列で配置されている。下受け面7aに基板13が当接した状態で真空吸引手段18を駆動することにより、基板13は下受け面7aに真空吸着され保持される。これとともに、基板当接部材15は吸着パッド8によって下面側から吸引され、この吸引力によって基板13は下受け面7aに押し付けられ固定される。このようにして位置決めされ、固定された基板13に対して電子部品16が実装される。
【0031】
上記構成において、吸着パッド8は基板当接部材5を真空吸着するために下受け部材5に設けられた吸引部となっている。そして吸着パッド8および真空吸引手段18は、下受け部材5の上方に位置する基板当接部材15に吸引力を作用させることにより、基板13を下受け面7aに押し付けて固定する吸引手段となっている。
【0032】
次に図2、図3を参照して基板固定方法について説明する。まず、基板13が載置され、さらにその上から基板当接部材15が装着されたキャリア11を搬送レール10によって搬送して図2(a)に示すように、実装位置に配置された下受け部材5上に位置させる(位置合わせ工程)。図3(a)は、このときのキャリア11および下受け部材5のY方向の断面を示しており、基板13の下方および基板13の前後両端側には吸着溝7b、吸着パッド8がそれぞれ位置している。
【0033】
図2(b)、図3(b)は、シリンダ9のロッド9aを没入させて搬送レール10を下降させ、吸引管17から真空吸引した状態を示している。この状態では、キャリア11の下面がストッパピン6の上端部に当接して支持され、搬送レール10から離れる。そして基板13の下面が吸着溝7bによって真空吸引されるとともに、基板当接部材15の下面には吸着パッド8が当接し、基板当接部材15には真空吸引による吸引力が作用する。そしてこの吸引力により、基板13は下受け面7aに押し付けられ固定される(基板固定工程)。
【0034】
これにより、フィルム状のフレキシブル基板など、薄くて撓みやすい基板13を対象とする場合にあっても、基板13を安定した状態で位置決めし、固定することができる。このとき、基板当接部材15の装着は、ねじやばねを用いた基板クランプ機構を必要とせず、単に位置決め孔によってキャリア11に位置合わせして載置するのみでよい。このためキャリア製作コストを低減するとともに、基板をキャリアにセットする際の作業を簡略化することができる。
【0035】
なお上記実施の形態では、基板13を吸引するための吸着溝7bと、基板当接部材15を吸引するための吸着パッド8を共通の真空吸引回路に接続して同時に真空吸引する例を示しているが、基板吸引用と基板当接部材吸引用とにそれぞれ個別の真空吸引回路を設けるようにしてもよい。これにより、基板と基板当接部材をそれぞれ適正吸引力・適正タイミングで吸引することができ、さらに安定した基板固定が実現される。以下に示す各実施の形態において、真空吸引によって基板および基板当接部材を固定する場合についても同様である。
【0036】
(実施の形態2)
図4は本発明の実施の形態2の基板固定装置の動作説明図である。本実施の形態2は、実施の形態1において予め基板13とともにキャリア11に装着される基板当接部材15を、実装位置に固定的に取り付けるようにしたものである。本実施の形態においては、基板13はキャリア11に保持され上面がフリーな状態で搬送される。
【0037】
図4(a)において、位置決めテーブル1上のベースプレート4には、実施の形態1と同様の下受け部材5が配置されており、下受け部材5の側方には、実施の形態1と同様に搬送レール10がシリンダ9によって昇降自在に配設されている。搬送レール10の下降時の高さ位置は、搬送レール10に設けられた位置決め部材21が、ベースプレートに設けられたストッパボルト20に当接することによって位置決めされる。
【0038】
下受け部材5の上方に位置する搬送レール10の上面には、フィルム状の可撓性部材よりなる基板当接部材15Aがボルト固定によって取り付けられている。搬送レール10には、上流側から搬送され基板当接部材15Aの下方に入り込んだキャリア11が位置決めされ、下受け部材5の上方に位置する(位置合わせ工程)。キャリア11には予め基板13がセットされており、基板13は、キャリア11に設けられた位置決めピン12によって、キャリア11に対して位置合わせされている。
【0039】
基板当接部材15Aには、図1に示す基板当接部材15と同様の開口部が設けられており、この開口部は実施の形態1に示す開口部15aと同様にキャリア11に保持された基板13の部品搭載位置13aに対応している。さらに基板当接部材15Aには、基板13の幅よりも外側に相当する位置に、基板当接部材15Aを構成する膜を蛇腹状に折り曲げた屈曲部22が長手方向に連続して設けられている。これにより屈曲部22より内側の基板当接部材15Aは、屈曲部22を介して上下方向の変位が許容されるようになっている。
【0040】
図4(b)は、シリンダ9のロッド9aを没入させて搬送レール10を下降させ、図2(b)と同様に吸着溝7bおよび吸着パッド8から真空吸引した状態を示している。搬送レール10を下降させることにより、まずキャリア11の下面がストッパピン6の上端部に当接して支持され、搬送レール10から離れる。そして位置決め部材21がストッパボルト20に当接し、搬送レール10が高さ方向に位置決めされる。
【0041】
これにより、基板13の下面が吸着溝7bによって真空吸引されるとともに、基板当接部材15Aの下面に吸着パッド8が当接し、基板当接部材15Aには真空吸引による吸引力が作用する。そしてこの吸引力により、基板当接部材15Aが下方に変位して基板13を下受け面7aに押し付け固定する(基板固定工程)。
【0042】
すなわち上記構成では、基板当接部材15Aは実装位置に基板13を搬送する搬送レール10に取り付けられ、この搬送レール10に対して下受け部材5を相対的に昇降させる昇降手段を備えた構成となっている。そして本実施の形態2における下受け部材5による基板固定においては、基板固定工程に先立って、搬送レール10を下降させて、搬送レール10に対して下受け部材5を相対的に昇降させる基板昇降工程を含む形態となっている。この構成によれば、基板13を保持するキャリア11に実施の形態1のような基板当接部材15をその都度載置する必要が無く、キャリア11への基板装着作業をさらに簡略化することができる。
【0043】
(実施の形態3)
図5は本実施の形態3の基板固定装置の部分斜視図である。図5は、図1に示す基板固定装置と同様の機能を有する基板固定装置を構成する各部のうち、下受け部材、キャリア、基板および基板当接部材のみを示しており、図外の位置決めテーブル、搬送レール、真空吸引手段などは、図1に示す実施の形態1と同様である。
【0044】
図5において、基板131には複数の部品搭載位置131aが形成されており、各部品搭載位置131aの両側にはスリット131cが長手方向に形成されている。基板131は実施の形態1と同様のキャリア11に保持され、基板131のキャリア11への位置決めは、基板131の位置決め穴131bにキャリア11の位置決めピン12を嵌合させることにより行われる。そして、部品搭載位置131aに対応した開口部151aが設けられた基板当接部材151は、同じ位置決めピン12を位置決め孔151bに嵌合させることによって、基板131の上面に位置合わせされ載置される。
【0045】
下受け部材51に設けられた凸部71の上面は基板131の下面に当接して下受けする下受け面71aとなっており、下受け面71aには、スリット131cの位置に対応して長手方向に連続した吸着溝71bが形成されている。下受け面71aによってキャリア11に保持された基板131を下受けして固定する際には、基板当接部材151とキャリア11との間に挟み込まれた状態の基板131の下面に対して、キャリア11の開口部11aを介して下受け面71aを当接させ、吸着溝71bから真空吸引する。
【0046】
これにより、下受け部材51に設けられた吸引部である吸着溝71bから、基板131のスリット131cを介して基板当接部材151に対して真空吸引による吸引力が作用する。そしてこの吸引力により、基板131は下受け面71aに押し付けられ固定される。すなわち、本実施の形態3においては、基板131には基板131を貫通する基板貫通孔としてのスリット131cが設けられており、この基板貫通孔の少なくとも一部を介して基板当接部材151を真空吸着する形態となっている。
【0047】
(実施の形態4)
図6は本実施の形態4の基板固定装置の部分斜視図である。図6は、図1に示す基板固定装置と同様の機能を有する基板固定装置を構成する各部のうち、下受け部材、キャリア、基板および基板当接部材のみを示しており、図外の位置決めテーブル、搬送レールなどは、図1に示す実施の形態1と同様である。
【0048】
図6において、基板132には格子状に複数の部品搭載位置132aが形成されており、各部品搭載位置132aを区分する境界には、個片分割用のスリット132cが縦横方向に形成されている。基板131はキャリア11に保持され、基板132のキャリア11への位置決めは、基板132の位置決め穴132bにキャリア11の位置決めピン12を嵌合させることにより行われる。ここでキャリア11は非磁性の金属(例えばオーステナイト系ステンレス鋼など)を実施の形態1と同様の形状に加工したものである。
【0049】
基板132の上面に載置される基板当接部材152は、磁性体の金属(例えばマルテンサイト系ステンレス鋼など)で製作されている。基板当接部材152には部品搭載位置132aに対応した開口部152aが格子状に設けられており、基板当接部材152は、キャリア11の同じ位置決めピン12を位置決め孔152bに嵌合させることによって、基板132の上面に位置合わせされ載置される。
【0050】
下受け部材52に設けられた凸部72の上面は、基板132の下面に当接して下受けする下受け面72aとなっており、下受け面72aには複数のマグネット23が埋設されている。下受け部材52によってキャリア11に保持された基板132を下受けして固定する際には、基板当接部材152とキャリア11との間に挟み込まれた状態の基板132の下面に対して、キャリア11の開口部11aを介して下受け面72aを当接させる。
【0051】
これにより、下受け部材52に設けられた引磁手段であるマグネット23によって基板132を介して磁性体の基板当接部材152に対して吸引力としての磁力が作用する。そしてこの吸引力により、基板132は下受け面72aに押し付けられ固定される。すなわち、本実施の形態4においては、基板当接部材152が磁性体であり、マグネット23が基板152を磁力によって吸引する吸引手段となっている。
【0052】
(実施の形態5)
図7は本実施の形態5の基板固定装置の部分斜視図である。図7は、図1に示す基板固定装置と同様の機能を有する基板固定装置を構成する各部のうち、下受け部材、搬送レールに保持された基板および基板当接部材のみを示しており、図外の位置決めテーブルなどは、図1に示す実施の形態1と同様である。
【0053】
図7において、基板132Aは実施の形態4に示す基板132と同様に、格子状に複数の部品搭載位置132aが形成されており、各部品搭載位置132aを区分する境界には、個片分割用のスリット132cが縦横方向に形成されている。ここでは、部品搭載位置132a、スリット132cの図示を省略している(図6参照)。基板132Aは、搬送レール10上での搬送作業に十分な剛性を有しており、実施の形態4のようなキャリア11を用いることなく、実装位置への搬入・搬出が可能となっている。
【0054】
基板132Aの上面に載置される基板当接部材152Aは、基板当接部材152と同様に磁性体の金属で製作されており、基板当接部材152と同様の開口部152aが格子状に設けられている(図6参照)。基板当接部材152Aは、位置決めピン24を位置決め孔25に嵌合させることによって、基板132Aの上面に位置合わせされ載置される。
【0055】
下受け部材53に設けられた凸部73の上面は基板132Aの下面に当接して下受けする下受け面73aとなっており、下受け面73aには複数のマグネット23が埋設されている。下受け部材53によって基板132Aを下受けして固定する際には、上面に基板当接部材152Aが載置された状態の基板132Aの下面に対して下受け面73aを当接させる。
【0056】
これにより、下受け部材53に設けられた引磁手段であるマグネット23によって基板132Aを介して磁性体の基板当接部材152Aに対して吸引力としての磁力が作用する。そしてこの吸引力により、基板132Aは下受け面73aに押し付けられ固定される。すなわち、本実施の形態5においても、基板当接部材152Aが磁性体であり、マグネット23が基板152Aを磁力によって吸引する吸引手段となっている。
【0057】
(実施の形態6)
図8は本実施の形態6の基板固定装置の部分斜視図である。図8は、図1に示す基板固定装置と同様の機能を有する基板固定装置を構成する各部のうち、下受け部材、搬送レールの保持された状態の基板および基板当接部材のみを示しており、図外の位置決めテーブル、真空吸引手段などは、図1に示す実施の形態1と同様である。
【0058】
図8において、基板133は複数のアイランドが設けられたリードフレームであり、各アイランドには部品搭載位置133aが形成されており、各アイランドの周囲は切り欠き部133cが形成されている。基板133は搬送レール10上での搬送作業に十分な剛性を有しており、実施の形態1のようなキャリア11を用いることなく、実装位置への搬入・搬出が可能となっている。そして、部品搭載位置133aに対応した開口部153aが設けられた基板当接部材153は、位置決めピン26を基板133に設けられた位置決め孔133bに嵌合させることによって、基板133の上面に位置合わせされ載置される。
【0059】
下受け部材54に設けられた凸部74の上面は基板133の下面に当接して下受けする下受け面74aとなっており、下受け面74aには、切り欠き部133cの範囲に対応して連続した吸着用凹部74bが形成されている。吸着用凹部74b内には、真空吸引孔74cが開孔しており、真空吸引手段18(図1参照)を駆動することにより、吸着用凹部74b全体が真空吸引される。また吸着用凹部74bの底面には、部品搭載位置133aに対応した位置に下受け凸部74dが設けられている。
【0060】
下受け部材54によって基板133を下受けして固定する際には、下受け面74aを基板131の下面に当接させることにより、下受け凸部74dによって部品搭載位置133aの下面を支持し、この状態で吸着用凹部74bから真空吸引する。これにより、下受け部材54に設けられた吸引部である吸着用凹部74bから、基板133の切り欠き部133cを介して基板当接部材153に対して真空吸引による吸引力が作用する。そしてこの吸引力により、基板133は下受け面74aに押し付けられ固定される。
【0061】
すなわち、本実施の形態3においては、基板133には基板133を貫通する基板貫通孔としての切り欠き部133cが設けられており、この基板貫通孔の少なくとも一部を介して基板当接部材153を真空吸着する形態となっている。
【0062】
(実施の形態7)
図9は本実施の形態7の基板固定装置の部分斜視図、図10は本発明の実施の形態7の基板固定装置に用いられるキャリアおよび基板の斜視図である。図9は、図1に示す基板固定装置と同様の機能を有する基板固定装置を構成する各部のうち、下受け部材、搬送レールの保持された状態の基板および基板当接部材のみを示しており、図外の位置決めテーブル、真空吸引手段などは、図1に示す実施の形態1と同様である。
【0063】
図9において、基板134に複数の部品搭載位置134aが形成されており、各部品搭載位置134aの周囲には、個片分割用のスリット134cが縦横方向に形成されている。基板134は搬送レール10上での搬送作業に十分な剛性を有しており、実施の形態1のようなキャリア11を用いることなく、実装位置への搬入・搬出が可能となっている。
【0064】
基板134の上面には、予め基板当接部材154が載置されており、基板当接部材154は、位置決めピン27を基板134に設けられた位置決め孔134bに嵌合させることによって、基板134に位置合わせされる。基板当接部材154は、金属製の枠部材の内部に可撓性に富む樹脂フィルム28を貼張した構成となっており、樹脂フィルム28には部品搭載位置134aに対応した開口部154aが設けられている。
【0065】
下受け部材54は、実施の形態6と同様の構成となっており、下受け部材54によって基板134を下受けして固定する際には、下受け面74aを基板134の下面に当接させることにより、下受け凸部74dによって部品搭載位置134aの下面を支持し、この状態で吸着用凹部74bから真空吸引する。これにより、下受け部材54に設けられた吸引部である吸着用凹部74bから基板134のスリット134cを介して、基板当接部材154の樹脂フィルム28に対して真空吸引による吸引力が作用する。そしてこの吸引力により、基板134は下受け面74aに押し付けられ固定される。
【0066】
すなわち、本実施の形態7においては、基板134には基板133を貫通する基板貫通孔としてのスリット134cが設けられており、この基板貫通孔の少なくとも一部を介して、可撓性部材である樹脂フィルム28を真空吸着する形態となっている。なお本実施の形態7は、キャリアに保持させた基板に対しても適用可能である。
【0067】
例えば図10に示すように、実施の形態1に示すものと同様の開口部が設けられたキャリア11に基板134を保持させ、キャリア11の上面に基板134を押さえつけるための樹脂フィルム29を直接装着するようにしてもよい。基板134および樹脂フィルム29は、位置決めピン12によってキャリア11に位置合わせされる。位置決めピン12は樹脂フィルム29に設けられた位置決め孔29bに挿通する。基板134の下受け時には、スリット134cを介して樹脂フィルム29が真空吸引され、基板134を下受け面74aに押し付ける。そしてこの状態で樹脂フィルム29に設けられた開口部29aを介して電子部品が搭載される。
【0068】
上記各実施の形態において示したように、本発明の基板固定装置は、基板の上面に載置された基板当接部材に対して下受け部材に設けられた吸引手段によって吸引力を作用させることにより、基板を下受け部材に押し付けるようにしたものである。これにより、個片分割用のスリットが予め形成された基板であっても、確実に下受けして固定することができる。またフレキシブル基板などフィルム状で薄く反り変形の大きい種類の基板であっても、基板押さえ機構を備えた専用治具を用いること無く、反りを矯正した状態で固定することができ、様々な種類の基板を確実かつ簡易的な機構で固定することができる。
【0069】
【発明の効果】
本発明によれば、作業位置に配置され基板に当接して下受けする下受け面が設けられた下受け部材の上方に基板当接部材が上面に載置された基板を位置させ、基板当接部材に吸引手段によって吸引力を作用させて基板を下受け面に押し付けて固定するようにしたので、様々な種類の基板を確実かつ簡易的な機構で固定することができる。
【図面の簡単な説明】
【図1】本発明の実施の形態1の基板固定装置の斜視図
【図2】本発明の実施の形態1の基板固定装置の側面図
【図3】本発明の実施の形態1の基板固定装置の部分断面図
【図4】本発明の実施の形態2の基板固定装置の動作説明図
【図5】本発明の実施の形態3の基板固定装置の部分斜視図
【図6】本発明の実施の形態4の基板固定装置の部分斜視図
【図7】本発明の実施の形態5の基板固定装置の部分斜視図
【図8】本発明の実施の形態6の基板固定装置の部分斜視図
【図9】本発明の実施の形態7の基板固定装置の部分斜視図
【図10】本発明の実施の形態7の基板固定装置に用いられるキャリアおよび基板の斜視図
【符号の説明】
5、51,52,53,53、54 下受け部材
7a、71a、72a、73a、74a 下受け面
7b、71b、 吸着溝
9 シリンダ
10 搬送レール
11 キャリア
12 位置決めピン
13、131,132,133,134 基板
15,151,152,153,154 基板当接部材
18 真空吸引手段
23 マグネット
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a board fixing device and a board fixing method for receiving and fixing a board in an electronic component mounting apparatus, for example.
[0002]
[Prior art]
2. Description of the Related Art In an electronic component mounting apparatus, a substrate fixing device for fixing a position and a posture of a substrate at a mounting position for mounting an electronic component on the substrate is used. In this substrate fixing device, it is necessary to position the substrate in the horizontal direction, correct the warpage of the substrate, and properly align the upper surface. Conventionally, as a method of this surface matching, a method of vacuum-sucking a substrate by a lower receiving member that supports the lower surface of the substrate (see, for example, Patent Document 1), or a method of correcting a warpage and providing a substrate pressing portion on a substrate-transporting carrier. A method using such a method is known (for example, see Patent Document 2).
[0003]
[Patent Document 1]
JP 2002-134992 A
[Patent Document 2]
JP-A-5-299828
[0004]
[Problems to be solved by the invention]
However, the above-mentioned conventional method has the following disadvantages. First, the method using vacuum suction as disclosed in Patent Document 1 is effective for a substrate in which the rigidity of the substrate is more than a certain level, the posture can be easily maintained, and there is no through hole in the substrate that prevents vacuum suction. However, it is difficult to apply the method to a substrate or the like in which a slit for dividing an individual piece is formed in advance.
[0005]
Further, in the method using the substrate pressing portion as disclosed in Patent Document 2, although it is possible to correct the warpage of the substrate to a certain extent, it is correctly applied to a thin film-type substrate such as a flexible substrate which has a large warp deformation. The substrate cannot be reliably fixed in a state where the surfaces are aligned. For this reason, when targeting various substrates having different shapes and thicknesses, it is conceivable to use a dedicated jig provided with a substrate holding mechanism such as a screw-type or spring-type clamping mechanism. It is difficult to fix the substrate with a simple mechanism.
[0006]
Therefore, an object of the present invention is to provide a substrate fixing device and a substrate fixing method capable of fixing various types of substrates with a simple and simple mechanism.
[0007]
[Means for Solving the Problems]
The substrate fixing device according to claim 1, wherein the substrate fixing device is configured to receive the substrate from below in a working position and to fix the substrate, wherein the lower receiving surface is disposed at the working position and abuts on the upper surface and receives the substrate. A suction force is applied to a lower receiving member provided with a base member, a substrate contact member placed on the upper surface of the substrate, and a lower surface contacting the upper surface of the substrate, and the substrate contact member positioned above the lower receiving member. Suction means for pressing and fixing the substrate to the lower receiving surface.
[0008]
The substrate fixing device according to claim 2 is the substrate fixing device according to claim 1, wherein the substrate contact member is attached to a substrate transfer unit that transfers the substrate to the work position. Elevating means for relatively elevating and lowering the lower receiving member is provided.
[0009]
The substrate fixing device according to claim 3 is the substrate fixing device according to claim 1 or 2, wherein the suction unit is provided on the lower receiving member for vacuum-sucking the substrate contact member. And vacuum suction means for performing vacuum suction from the suction unit.
[0010]
According to a fourth aspect of the present invention, there is provided the substrate fixing apparatus according to the third aspect, wherein the substrate is provided with a substrate through hole penetrating the substrate, and at least a part of the substrate through hole is provided. The substrate contact member is vacuum-sucked.
[0011]
A substrate fixing device according to a fifth aspect is the substrate fixing device according to the fourth aspect, wherein the substrate contact member is a flexible member.
[0012]
The substrate fixing device according to claim 6 is the substrate fixing device according to claim 1 or 2, wherein the substrate contact member is a magnetic material, and the suction unit suctions the substrate contact member by magnetic force. Magnetic attraction means provided on the lower receiving member.
[0013]
8. The method of fixing a substrate according to claim 7, wherein the substrate is fixed at a work position by receiving the substrate from below, wherein the lower receiving surface is disposed at the work position and abuts on the upper surface of the substrate to receive the substrate. A positioning step of positioning the substrate on which the substrate contact member is mounted on the upper surface of the lower receiving member provided with, and a suction force by the suction means on the substrate contact member positioned above the lower receiving member. And fixing the substrate by pressing the substrate against the lower receiving surface.
[0014]
The substrate fixing method according to claim 8 is the substrate fixing method according to claim 7, wherein the substrate contact member is attached to a substrate transport unit that transports the substrate to the work position, and prior to the substrate fixing step. The method includes a substrate elevating step of elevating and lowering the lower receiving member with respect to the lever conveying means.
[0015]
A substrate fixing method according to a ninth aspect is the substrate fixing method according to the seventh or the eighth aspect, wherein, in the substrate fixing step, the substrate abutment is performed by vacuum suction from a suction portion provided on the lower receiving member. The member is vacuum-sucked.
[0016]
According to a tenth aspect of the present invention, there is provided the substrate fixing method according to the ninth aspect, wherein the substrate is provided with a substrate through-hole penetrating the substrate, and at least a part of the substrate through-hole is provided. The substrate contact member is vacuum-sucked.
[0017]
A substrate fixing method according to an eleventh aspect is the substrate fixing method according to the tenth aspect, wherein the substrate contact member is a flexible member.
[0018]
A substrate fixing method according to a twelfth aspect of the present invention is the substrate fixing method according to the seventh or the eighth aspect, wherein the substrate contact member is a magnetic material, and in the substrate fixing step, the pull provided on the lower receiving member is provided. The substrate contact member is attracted by magnetic force by magnetic means.
[0019]
According to the present invention, the substrate on which the substrate contact member is mounted is positioned above the lower receiving member provided with the lower receiving surface which is disposed at the work position and abuts against the substrate and receives the lower surface. By applying a suction force to the contact member by the suction means to press and fix the substrate against the lower receiving surface, various types of substrates can be reliably fixed by a simple mechanism.
[0020]
BEST MODE FOR CARRYING OUT THE INVENTION
(Embodiment 1)
FIG. 1 is a perspective view of a substrate fixing device according to Embodiment 1 of the present invention, FIG. 2 is a side view of the substrate fixing device of Embodiment 1 of the present invention, and FIG. 3 is a substrate fixing device of Embodiment 1 of the present invention. FIG.
[0021]
First, the structure of the substrate fixing device will be described with reference to FIG. This substrate fixing device is disposed at a mounting position (working position) of the electronic component mounting device and has a function of receiving a thin and flexible substrate such as a flexible substrate from below and fixing it. In FIG. 1, a base plate 4 is mounted on a moving table 1 composed of an X table 2 and a Y table 3, and a central portion of the upper surface of the base plate 4 is provided with a lower plate for receiving a substrate and holding a height position. A receiving member 5 is provided.
[0022]
The lower receiving member 5 has a shape in which a convex portion 7 is provided on the upper surface of a rectangular block 5a, and a stopper pin 6 stands upright around the convex portion 7. The upper surface of the convex portion 7 is a lower receiving surface 7a which abuts against the lower surface of the substrate and receives the lower surface. The lower receiving surface 7a has a suction groove 7b for sucking a substrate and a suction groove for sucking a substrate contact member described later. A pad 8 is provided. The suction groove 7b and the suction pad 8 are connected to a vacuum suction means 18 via a suction pipe 17.
[0023]
On both sides of the lower receiving member 5 on the upper surface of the base plate 4, cylinders 9 are disposed in a vertical posture, and rods 9 a of the cylinders 9 are connected to transport rails 10 disposed in the X direction. On the transport rail 10, the carrier 11 holding the thin film-shaped substrate 13 is transported by a transport mechanism (not shown) and positioned at the mounting position. The board 13 is conveyed while being sandwiched between the plate-shaped board contact member 15 and the carrier 11. At this mounting position, the board 13 is provided at the component mounting position 13 a of the board 13. The electronic component 16 is mounted by a mounting head (not shown) through the opening 15a. FIG. 1 shows a state in which the carrier 11 is separated from the transport rail 10 and the substrate contact member 15 is separated from the carrier 11. The transfer rail 10 serves as a board transfer unit that transfers and positions the board 13.
[0024]
By driving the cylinder 9, the transport rail 10 moves up and down while being guided by the guide member 10a. The transport rail 10 serves as a support for supporting both sides of the carrier 11 from below, and the cylinder 9 serves as an elevating means for elevating and lowering the substrate 13 held by the carrier 11 with respect to the lower receiving member 5. ing. When the transport rail 10 is lowered, the lower surface of the carrier 11 abuts on the upper surface of the stopper pin 6, and the vertical position is fixed.
[0025]
Here, the substrate contact member 15 placed on the upper surfaces of the carrier 11 and the substrate 13 will be described. The carrier 11 is a rectangular plate member, and is provided with an opening 11a at the center thereof, through which the projection 7 of the lower receiving member 5 can be inserted. Positioning pins 12 are erected at the corners of the carrier 11, and the substrate contact members 15 are moved relative to the carrier 11 by inserting the positioning pins 12 into positioning holes 15 b provided in the substrate contact members 15. Is positioned.
[0026]
The substrate contact member 15 is provided with a positioning hole 15c at a diagonal position in a range where the opening 15a is provided. In a state where the substrate 13 is sandwiched between the carrier 11 and the substrate contact member 15, the positioning pins 14 provided on the carrier 11 are fitted into the positioning holes and the positioning holes 15c provided on the substrate 13, whereby the substrate 13 is It is positioned with respect to the contact member 15 and further with respect to the carrier 11.
[0027]
In this positioning state, the lower surface side of the substrate 13 is supported from below only at both side ends by the carrier 11, the component mounting position 13a is located at the center of the opening 11a, and the lower surface side is exposed downward. . The lower surface of the substrate contact member 15 contacts the upper surface of the substrate 13 except for the range of the opening 15a, and the electronic component mounting position 13a is exposed upward through the opening 15a.
[0028]
The longitudinal dimension of the opening 11 a provided in the carrier 11 is set to be larger than the length of the substrate 13. For this reason, when the substrate 13 is held by the carrier 11, the opening 11 a is not completely closed, and an opening large enough to allow the suction pad 8 to be inserted remains on both front and rear sides of the substrate 13. I do.
[0029]
When the transport rail 10 is lowered while the substrate 13 is held by the carrier 11, the lower receiving surface 7 a penetrates the opening 11 a of the carrier 11 to contact the lower surface of the substrate 13 on the carrier 11, and the suction pad 8 Are in contact with the lower surface of the substrate contact member 15 through the openings remaining on both the front and rear sides of the substrate 13.
[0030]
The suction grooves 7b of the lower receiving surface 7a are arranged in an array surrounding each component mounting position 13a of the substrate 13. By driving the vacuum suction means 18 while the substrate 13 is in contact with the lower receiving surface 7a, the substrate 13 is vacuum-adsorbed and held on the lower receiving surface 7a. At the same time, the substrate contact member 15 is sucked from the lower surface by the suction pad 8, and the substrate 13 is pressed and fixed to the lower receiving surface 7a by the suction force. The electronic component 16 is mounted on the board 13 positioned and fixed as described above.
[0031]
In the above configuration, the suction pad 8 serves as a suction unit provided on the lower receiving member 5 for vacuum-sucking the substrate contact member 5. The suction pad 8 and the vacuum suction means 18 serve as suction means for pressing and fixing the substrate 13 against the lower receiving surface 7a by applying a suction force to the substrate contact member 15 located above the lower receiving member 5. ing.
[0032]
Next, a method of fixing the substrate will be described with reference to FIGS. First, the carrier 11 on which the substrate 13 is placed and on which the substrate contact member 15 is mounted is transported by the transport rail 10 from above, and as shown in FIG. It is positioned on the member 5 (positioning step). FIG. 3A shows a cross section in the Y direction of the carrier 11 and the lower receiving member 5 at this time, and the suction groove 7b and the suction pad 8 are located below the substrate 13 and on both front and rear ends of the substrate 13, respectively. are doing.
[0033]
2 (b) and 3 (b) show a state in which the rod 9a of the cylinder 9 is immersed, the transport rail 10 is lowered, and vacuum suction is performed from the suction pipe 17. In this state, the lower surface of the carrier 11 abuts on the upper end of the stopper pin 6 and is supported, and separates from the transport rail 10. Then, the lower surface of the substrate 13 is vacuum-sucked by the suction groove 7b, and the lower surface of the substrate contact member 15 is in contact with the suction pad 8, and the substrate contact member 15 receives a suction force by vacuum suction. Then, the substrate 13 is pressed and fixed to the lower receiving surface 7a by the suction force (substrate fixing step).
[0034]
Thus, even when the thin and flexible substrate 13 such as a film-like flexible substrate is targeted, the substrate 13 can be positioned and fixed in a stable state. At this time, the mounting of the substrate abutting member 15 does not require a substrate clamping mechanism using screws or springs, and may be simply performed by positioning the carrier 11 with the positioning holes. For this reason, the carrier manufacturing cost can be reduced, and the operation for setting the substrate on the carrier can be simplified.
[0035]
In the above embodiment, an example is shown in which the suction groove 7b for sucking the substrate 13 and the suction pad 8 for sucking the substrate contact member 15 are connected to a common vacuum suction circuit and vacuum suction is performed simultaneously. However, separate vacuum suction circuits may be provided for the substrate suction and for the substrate contact member suction, respectively. As a result, the substrate and the substrate contacting member can be sucked with the appropriate suction force and the appropriate timing, respectively, and further stable substrate fixing can be realized. In each of the embodiments described below, the same applies to the case where the substrate and the substrate contact member are fixed by vacuum suction.
[0036]
(Embodiment 2)
FIG. 4 is an operation explanatory diagram of the substrate fixing device according to the second embodiment of the present invention. In the second embodiment, the board contact member 15 previously mounted on the carrier 11 together with the board 13 in the first embodiment is fixedly attached to a mounting position. In the present embodiment, the substrate 13 is held by the carrier 11 and transported with the upper surface free.
[0037]
In FIG. 4A, a lower receiving member 5 similar to that of the first embodiment is disposed on a base plate 4 on a positioning table 1, and a side of the lower receiving member 5 that is the same as that of the first embodiment. A transfer rail 10 is arranged to be able to move up and down by a cylinder 9. The height position of the transport rail 10 when the transport rail 10 is lowered is determined by the positioning member 21 provided on the transport rail 10 abutting against the stopper bolt 20 provided on the base plate.
[0038]
On the upper surface of the transport rail 10 located above the lower receiving member 5, a board contact member 15A made of a film-like flexible member is attached by bolt fixing. The carrier 11 transported from the upstream side and entering under the substrate contact member 15A is positioned on the transport rail 10, and is positioned above the lower receiving member 5 (positioning step). A substrate 13 is set on the carrier 11 in advance, and the substrate 13 is aligned with the carrier 11 by positioning pins 12 provided on the carrier 11.
[0039]
The substrate contact member 15A is provided with an opening similar to the substrate contact member 15 shown in FIG. 1, and this opening is held by the carrier 11 similarly to the opening 15a shown in the first embodiment. It corresponds to the component mounting position 13a of the substrate 13. Further, the substrate contact member 15A is provided at the position corresponding to the outside of the width of the substrate 13 with a bent portion 22 formed by bending a film constituting the substrate contact member 15A in a bellows shape, continuously in the longitudinal direction. I have. Accordingly, the substrate contact member 15A inside the bent portion 22 is allowed to be vertically displaced via the bent portion 22.
[0040]
FIG. 4B shows a state in which the rod 9a of the cylinder 9 is immersed, the transport rail 10 is lowered, and vacuum suction is performed from the suction groove 7b and the suction pad 8 as in FIG. 2B. By lowering the transport rail 10, first, the lower surface of the carrier 11 is supported in contact with the upper end of the stopper pin 6, and separates from the transport rail 10. Then, the positioning member 21 comes into contact with the stopper bolt 20, and the transport rail 10 is positioned in the height direction.
[0041]
As a result, the lower surface of the substrate 13 is vacuum-suctioned by the suction groove 7b, and the suction pad 8 comes into contact with the lower surface of the substrate contact member 15A, so that a suction force by vacuum suction acts on the substrate contact member 15A. Then, the substrate contact member 15A is displaced downward by this suction force to press and fix the substrate 13 against the lower receiving surface 7a (substrate fixing step).
[0042]
That is, in the above-described configuration, the board contact member 15A is attached to the transport rail 10 that transports the board 13 to the mounting position, and includes a lifting unit that raises and lowers the lower receiving member 5 relative to the transport rail 10. Has become. In the fixing of the substrate by the lower receiving member 5 in the second embodiment, before the substrate fixing step, the transport rail 10 is moved down to raise and lower the lower receiving member 5 relative to the transport rail 10. It has a form including a process. According to this configuration, it is not necessary to mount the substrate contact member 15 as in the first embodiment on the carrier 11 holding the substrate 13 each time, and the work of mounting the substrate on the carrier 11 can be further simplified. it can.
[0043]
(Embodiment 3)
FIG. 5 is a partial perspective view of the substrate fixing device according to the third embodiment. FIG. 5 shows only a lower receiving member, a carrier, a substrate, and a substrate contact member among the components constituting the substrate fixing device having the same functions as the substrate fixing device shown in FIG. The transfer rail, vacuum suction means, and the like are the same as those in the first embodiment shown in FIG.
[0044]
In FIG. 5, a plurality of component mounting positions 131a are formed on the substrate 131, and slits 131c are formed in the longitudinal direction on both sides of each component mounting position 131a. The substrate 131 is held by the same carrier 11 as in the first embodiment, and the positioning of the substrate 131 with respect to the carrier 11 is performed by fitting the positioning pins 12 of the carrier 11 into the positioning holes 131b of the substrate 131. The board contact member 151 provided with the opening 151a corresponding to the component mounting position 131a is positioned and placed on the upper surface of the board 131 by fitting the same positioning pin 12 into the positioning hole 151b. .
[0045]
The upper surface of the convex portion 71 provided on the lower receiving member 51 is a lower receiving surface 71a which comes into contact with the lower surface of the substrate 131 and receives the lower surface. The lower receiving surface 71a has a longitudinal shape corresponding to the position of the slit 131c. A suction groove 71b continuous in the direction is formed. When the substrate 131 held by the carrier 11 is received and fixed by the lower receiving surface 71a, the lower surface of the substrate 131 sandwiched between the substrate contact member 151 and the carrier 11 is The lower receiving surface 71a is brought into contact with the opening 11a through the opening 11a, and vacuum suction is performed from the suction groove 71b.
[0046]
As a result, a suction force by vacuum suction acts on the substrate contact member 151 from the suction groove 71b, which is a suction portion provided in the lower receiving member 51, via the slit 131c of the substrate 131. The substrate 131 is pressed and fixed to the lower receiving surface 71a by the suction force. That is, in the third embodiment, the substrate 131 is provided with the slit 131c as a substrate through hole penetrating the substrate 131, and the substrate contact member 151 is evacuated through at least a part of the substrate through hole. It is in the form of adsorbing.
[0047]
(Embodiment 4)
FIG. 6 is a partial perspective view of the substrate fixing device according to the fourth embodiment. FIG. 6 shows only the lower receiving member, the carrier, the substrate, and the substrate contacting member among the components constituting the substrate fixing device having the same function as the substrate fixing device shown in FIG. The transport rails and the like are the same as those in the first embodiment shown in FIG.
[0048]
In FIG. 6, a plurality of component mounting positions 132a are formed on the substrate 132 in a lattice shape, and slits 132c for dividing the individual components are formed in the vertical and horizontal directions at boundaries that divide the respective component mounting positions 132a. . The substrate 131 is held by the carrier 11, and the positioning of the substrate 132 with respect to the carrier 11 is performed by fitting the positioning pins 12 of the carrier 11 into the positioning holes 132 b of the substrate 132. Here, the carrier 11 is formed by processing a non-magnetic metal (for example, austenitic stainless steel) into a shape similar to that of the first embodiment.
[0049]
The substrate contact member 152 mounted on the upper surface of the substrate 132 is made of a magnetic metal (for example, martensitic stainless steel). Openings 152a corresponding to the component mounting positions 132a are provided in a lattice shape in the board contact member 152, and the board contact member 152 is formed by fitting the same positioning pins 12 of the carrier 11 into the positioning holes 152b. , Is positioned and placed on the upper surface of the substrate 132.
[0050]
The upper surface of the convex portion 72 provided on the lower receiving member 52 is a lower receiving surface 72a which comes into contact with the lower surface of the substrate 132 and receives the lower surface. The plurality of magnets 23 are embedded in the lower receiving surface 72a. . When the substrate 132 held by the carrier 11 is received and fixed by the lower receiving member 52, the lower surface of the substrate 132 sandwiched between the substrate contact member 152 and the carrier 11 is The lower receiving surface 72a is brought into contact via the opening 11a.
[0051]
As a result, a magnetic force as an attractive force acts on the substrate contact member 152 made of a magnetic material via the substrate 132 by the magnet 23 that is a magnetic attraction means provided on the lower receiving member 52. The substrate 132 is pressed against and fixed to the lower receiving surface 72a by the suction force. That is, in the fourth embodiment, the substrate contact member 152 is a magnetic material, and the magnet 23 serves as a suction unit that suctions the substrate 152 by magnetic force.
[0052]
(Embodiment 5)
FIG. 7 is a partial perspective view of the substrate fixing device according to the fifth embodiment. FIG. 7 shows only the lower receiving member, the substrate held on the transport rail, and the substrate contact member among the components constituting the substrate fixing device having the same functions as the substrate fixing device shown in FIG. The outside positioning table and the like are the same as in the first embodiment shown in FIG.
[0053]
In FIG. 7, a board 132A has a plurality of component mounting positions 132a formed in a lattice like a substrate 132 shown in the fourth embodiment, and a boundary for dividing each component mounting position 132a is Are formed in the vertical and horizontal directions. Here, illustration of the component mounting position 132a and the slit 132c is omitted (see FIG. 6). The substrate 132A has sufficient rigidity for the transfer operation on the transfer rail 10, and can be carried into and out of the mounting position without using the carrier 11 as in the fourth embodiment.
[0054]
The substrate contact member 152A placed on the upper surface of the substrate 132A is made of a magnetic metal like the substrate contact member 152, and the openings 152a similar to the substrate contact member 152 are provided in a lattice shape. (See FIG. 6). The board contact member 152A is positioned and placed on the upper surface of the board 132A by fitting the positioning pins 24 into the positioning holes 25.
[0055]
The upper surface of the convex portion 73 provided on the lower receiving member 53 is a lower receiving surface 73a that abuts on the lower surface of the substrate 132A and receives the lower surface. The plurality of magnets 23 are embedded in the lower receiving surface 73a. When the substrate 132A is received and fixed by the lower receiving member 53, the lower receiving surface 73a is brought into contact with the lower surface of the substrate 132A in a state where the substrate contact member 152A is placed on the upper surface.
[0056]
As a result, a magnetic force as an attractive force acts on the substrate contact member 152A made of a magnetic material via the substrate 132A by the magnet 23 as the magnetic attraction means provided on the lower receiving member 53. The substrate 132A is pressed against and fixed to the lower receiving surface 73a by the suction force. That is, also in the fifth embodiment, the substrate contact member 152A is a magnetic material, and the magnet 23 serves as a suction unit that suctions the substrate 152A by magnetic force.
[0057]
(Embodiment 6)
FIG. 8 is a partial perspective view of the substrate fixing device according to the sixth embodiment. FIG. 8 shows only the lower receiving member, the substrate in which the transfer rail is held, and the substrate abutting member among the components constituting the substrate fixing device having the same functions as the substrate fixing device shown in FIG. The positioning table, vacuum suction means, and the like (not shown) are the same as those in the first embodiment shown in FIG.
[0058]
In FIG. 8, a substrate 133 is a lead frame provided with a plurality of islands, a component mounting position 133a is formed in each island, and a cutout 133c is formed around each island. The board 133 has sufficient rigidity for the transfer operation on the transfer rail 10, and can be loaded and unloaded to the mounting position without using the carrier 11 as in the first embodiment. The board contact member 153 provided with the opening 153a corresponding to the component mounting position 133a is positioned on the upper surface of the board 133 by fitting the positioning pin 26 into the positioning hole 133b provided on the board 133. And placed.
[0059]
The upper surface of the convex portion 74 provided on the lower receiving member 54 is a lower receiving surface 74a which abuts on the lower surface of the substrate 133 and receives the lower surface. The lower receiving surface 74a corresponds to the range of the notch 133c. Thus, a continuous suction concave portion 74b is formed. A vacuum suction hole 74c is opened in the suction concave portion 74b, and by driving the vacuum suction means 18 (see FIG. 1), the entire suction concave portion 74b is vacuum suctioned. On the bottom surface of the suction concave portion 74b, a lower receiving convex portion 74d is provided at a position corresponding to the component mounting position 133a.
[0060]
When the substrate 133 is received and fixed by the lower receiving member 54, the lower receiving surface 74a is brought into contact with the lower surface of the substrate 131, whereby the lower surface of the component mounting position 133a is supported by the lower receiving convex portion 74d. In this state, vacuum suction is performed from the suction concave portion 74b. As a result, a suction force by vacuum suction acts on the substrate contact member 153 from the suction concave portion 74b, which is a suction portion provided in the lower receiving member 54, through the cutout portion 133c of the substrate 133. The substrate 133 is pressed against and fixed to the lower receiving surface 74a by the suction force.
[0061]
That is, in the third embodiment, the substrate 133 is provided with the cutout 133c as a substrate through-hole penetrating the substrate 133, and the substrate contact member 153 is provided through at least a part of the substrate through-hole. Is vacuum-adsorbed.
[0062]
(Embodiment 7)
FIG. 9 is a partial perspective view of the substrate fixing device according to the seventh embodiment, and FIG. 10 is a perspective view of a carrier and a substrate used in the substrate fixing device according to the seventh embodiment of the present invention. FIG. 9 shows only the lower receiving member, the substrate holding the transfer rail, and the substrate abutting member, among the components constituting the substrate fixing device having the same functions as the substrate fixing device shown in FIG. The positioning table, vacuum suction means, and the like (not shown) are the same as those in the first embodiment shown in FIG.
[0063]
In FIG. 9, a plurality of component mounting positions 134a are formed on a substrate 134, and slits 134c for dividing individual pieces are formed in the vertical and horizontal directions around each component mounting position 134a. The substrate 134 has sufficient rigidity for the transfer operation on the transfer rail 10, and can be carried in and out of the mounting position without using the carrier 11 as in the first embodiment.
[0064]
A substrate contact member 154 is mounted on the upper surface of the substrate 134 in advance, and the substrate contact member 154 is attached to the substrate 134 by fitting the positioning pins 27 into the positioning holes 134b provided in the substrate 134. Aligned. The substrate contact member 154 has a configuration in which a highly flexible resin film 28 is adhered to the inside of a metal frame member, and the resin film 28 is provided with an opening 154a corresponding to the component mounting position 134a. Have been.
[0065]
The lower receiving member 54 has the same configuration as that of the sixth embodiment. When the lower receiving member 54 receives and fixes the substrate 134, the lower receiving surface 74a is brought into contact with the lower surface of the substrate 134. Thus, the lower surface of the component mounting position 134a is supported by the lower receiving convex portion 74d, and in this state, vacuum suction is performed from the suction concave portion 74b. Thus, a suction force by vacuum suction acts on the resin film 28 of the substrate contact member 154 from the suction concave portion 74b, which is a suction portion provided in the lower receiving member 54, via the slit 134c of the substrate 134. The substrate 134 is pressed and fixed to the lower receiving surface 74a by the suction force.
[0066]
That is, in the seventh embodiment, the substrate 134 is provided with the slit 134c as a substrate through-hole penetrating the substrate 133, and is a flexible member through at least a part of the substrate through-hole. The resin film 28 is vacuum-adsorbed. Note that Embodiment 7 is also applicable to a substrate held by a carrier.
[0067]
For example, as shown in FIG. 10, the substrate 134 is held by the carrier 11 provided with an opening similar to that shown in the first embodiment, and the resin film 29 for pressing the substrate 134 is directly mounted on the upper surface of the carrier 11. You may make it. The substrate 134 and the resin film 29 are aligned with the carrier 11 by the positioning pins 12. The positioning pins 12 are inserted into positioning holes 29b provided in the resin film 29. At the time of receiving the substrate 134, the resin film 29 is vacuum-sucked through the slit 134c, and presses the substrate 134 against the lower receiving surface 74a. Then, in this state, the electronic component is mounted via the opening 29a provided in the resin film 29.
[0068]
As described in each of the above embodiments, the substrate fixing apparatus of the present invention applies a suction force to the substrate contact member mounted on the upper surface of the substrate by the suction means provided on the lower receiving member. Thus, the substrate is pressed against the lower receiving member. This makes it possible to reliably receive and fix even a substrate on which a slit for dividing an individual piece is formed in advance. In addition, even if the substrate is a thin film with a large warp deformation such as a flexible substrate, it can be fixed in a straightened state without using a special jig with a substrate holding mechanism, and various types of substrates can be fixed. The substrate can be fixed by a reliable and simple mechanism.
[0069]
【The invention's effect】
According to the present invention, the substrate on which the substrate contact member is mounted is positioned above the lower receiving member provided with the lower receiving surface which is disposed at the work position and abuts against the substrate and receives the lower surface. Since a suction force is applied to the contact member by the suction means to press and fix the substrate against the lower receiving surface, various types of substrates can be reliably and simply fixed.
[Brief description of the drawings]
FIG. 1 is a perspective view of a substrate fixing device according to a first embodiment of the present invention.
FIG. 2 is a side view of the substrate fixing device according to the first embodiment of the present invention.
FIG. 3 is a partial cross-sectional view of the substrate fixing device according to the first embodiment of the present invention.
FIG. 4 is an operation explanatory view of the substrate fixing device according to the second embodiment of the present invention;
FIG. 5 is a partial perspective view of a substrate fixing device according to a third embodiment of the present invention.
FIG. 6 is a partial perspective view of a substrate fixing device according to a fourth embodiment of the present invention.
FIG. 7 is a partial perspective view of a substrate fixing device according to a fifth embodiment of the present invention.
FIG. 8 is a partial perspective view of a substrate fixing device according to a sixth embodiment of the present invention.
FIG. 9 is a partial perspective view of a substrate fixing device according to a seventh embodiment of the present invention.
FIG. 10 is a perspective view of a carrier and a substrate used in a substrate fixing device according to a seventh embodiment of the present invention.
[Explanation of symbols]
5, 51, 52, 53, 53, 54 Lower receiving member
7a, 71a, 72a, 73a, 74a Lower receiving surface
7b, 71b, suction groove
9 cylinders
10 Transport rail
11 Career
12 Positioning pin
13, 131, 132, 133, 134 substrate
15,151,152,153,154 Substrate contact member
18 Vacuum suction means
23 magnet

Claims (12)

作業位置において基板を下方から下受けして固定する基板固定装置であって、前記作業位置に配置され上面に前記基板に当接して下受けする下受け面が設けられた下受け部材と、前記基板の上面に載置され下面が基板の上面に当接する基板当接部材と、前記下受け部材の上方に位置する前記基板当接部材に吸引力を作用させることにより前記基板を前記下受け面に押し付けて固定する吸引手段とを備えたことを特徴とする基板固定装置。A substrate fixing device for receiving and fixing a substrate from below in a working position, wherein the lower receiving member is provided in the working position and provided with a lower receiving surface that abuts against the substrate and receives a lower surface on the upper surface, A substrate contact member placed on the upper surface of the substrate and having a lower surface in contact with the upper surface of the substrate; and a suction force acting on the substrate contact member located above the lower receiving member, thereby causing the substrate to receive the lower receiving surface. And a suction means for pressing and fixing the substrate. 前記基板当接部材は前記作業位置に基板を搬送する基板搬送手段に取り付けられ、この基板搬送手段に対して前記下受け部材を相対的に昇降させる昇降手段を備えたことを特徴とする請求項1記載の基板固定装置。2. The apparatus according to claim 1, wherein said substrate contacting member is attached to substrate transporting means for transporting the substrate to said working position, and further comprises elevating means for elevating said lower receiving member relative to said substrate transporting means. 2. The substrate fixing device according to 1. 前記吸引手段は、前記基板当接部材を真空吸着するために前記下受け部材に設けられた吸引部およびこの吸引部から真空吸引する真空吸引手段であることを特徴とする請求項1または2記載の基板固定装置。3. The suction unit according to claim 1, wherein the suction unit is a suction unit provided on the lower receiving member for vacuum-sucking the substrate contact member, and a vacuum suction unit for vacuum-sucking from the suction unit. Substrate fixing device. 前記基板には基板を貫通する基板貫通孔が設けられており、この基板貫通孔の少なくとも一部を介して前記基板当接部材を真空吸着することを特徴とする請求項3記載の基板固定装置。4. The substrate fixing device according to claim 3, wherein the substrate is provided with a substrate through-hole penetrating the substrate, and the substrate contact member is vacuum-sucked through at least a part of the substrate through-hole. . 前記基板当接部材が可撓性部材であることを特徴とする請求項4記載の基板固定装置。The substrate fixing device according to claim 4, wherein the substrate contact member is a flexible member. 前記基板当接部材が磁性体であり、前記吸引手段は、前記基板当接部材を磁力により吸引するために前記下受け部材に設けられた引磁手段であることを特徴とする請求項1または2記載の基板固定装置。The said board | substrate contact member is a magnetic body, The said attraction | suction means is the magnetic attraction provided in the said lower receiving member in order to attract | suck the said board | substrate contact member by magnetic force, The Claim 1 or Claim 2 characterized by the above-mentioned. 3. The substrate fixing device according to 2. 作業位置において基板を下方から下受けして固定する基板固定方法であって、前記作業位置に配置され上面に前記基板に当接して下受けする下受け面が設けられた下受け部材の上方に基板当接部材が上面に載置された基板を位置させる位置合わせ工程と、この下受け部材の上方に位置する前記基板当接部材に吸引手段によって吸引力を作用させることにより前記基板を前記下受け面に押し付けて固定する基板固定工程とを含むことを特徴とする基板固定方法。A substrate fixing method for receiving and fixing a substrate from below in a working position, wherein the lower receiving member is provided in the working position and has a lower receiving surface provided on an upper surface for contacting and receiving the substrate. A positioning step of positioning the substrate on which the substrate contacting member is placed, and applying a suction force to the substrate contacting member located above the lower receiving member by a suction means to lower the substrate into the lower position. Fixing the substrate by pressing it against the receiving surface. 前記基板当接部材は、前記作業位置に基板を搬送する基板搬送手段に取り付けられ、前記基板固定工程に先立ってこの基板搬送手段に対して前記下受け部材を相対的に昇降させる基板昇降工程を含むことを特徴とする請求項7記載の基板固定方法。The substrate abutting member is attached to a substrate transporting unit that transports the substrate to the work position, and performs a substrate elevating step of relatively elevating the lower receiving member with respect to the substrate transporting unit prior to the substrate fixing step. The method for fixing a substrate according to claim 7, comprising: 前記基板固定工程において、前記下受け部材に設けられた吸引部から真空吸引することにより前記基板当接部材を真空吸着することを特徴とする請求項7または8記載の基板固定方法。9. The substrate fixing method according to claim 7, wherein, in the substrate fixing step, the substrate contact member is vacuum-adsorbed by vacuum suction from a suction unit provided on the lower receiving member. 10. 前記基板には基板を貫通する基板貫通孔が設けられており、この基板貫通孔の少なくとも一部を介して前記基板当接部材を真空吸着することを特徴とする請求項9記載の基板固定方法。The substrate fixing method according to claim 9, wherein the substrate is provided with a substrate through-hole penetrating the substrate, and the substrate contact member is vacuum-sucked through at least a part of the substrate through-hole. . 前記基板当接部材が可撓性部材であることを特徴とする請求項10記載の基板固定方法。The substrate fixing method according to claim 10, wherein the substrate contact member is a flexible member. 前記基板当接部材が磁性体であり、前記基板固定工程において、前記下受け部材に設けられた引磁手段によって前記基板当接部材を磁力により吸引することを特徴とする請求項7または8記載の基板固定方法。9. The substrate abutting member is a magnetic material, and in the substrate fixing step, the substrate abutting member is attracted by magnetic force by magnetic attraction means provided on the lower receiving member. Substrate fixing method.
JP2003062244A 2003-03-07 2003-03-07 Substrate fixing apparatus and substrate fixing method Expired - Fee Related JP3922191B2 (en)

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