JP2006286659A - Method of packaging electronic part and electronic part packaging machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of packaging an electronic part in which a clearance is not generated between stages for pushing supporting at the time of crimping even when a curvature occurs in a substrate when the electronic part is stuck by a pressure on the substrate. <P>SOLUTION: A method of packaging the electronic part includes the steps of absorbing the rear face edge of the substrate and holding it through the suction hole formed in the periphery of a guidance stage after laying on the guidance stage 14, which guides the substrate on the stage 15 for pushing supporting it which it is prepared in the pushing position, when pushing of an IC chip is laid and carried out and it is mounted on an electrode pattern 2 formed in the front surface of the substrate 1; moving the guidance stage so that the part which should carry out pushing of the substrate may serve as the pushing position, next; attracting the rear face of the substrate in a suction unit 17 arranged at both sides of the stage for pushing supporting and energization is carried out to the stage side for pushing supporting; and, then, sucking the substrate to the stage side for pushing supporting through the suction hole formed in the stage for pushing supporting. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a mounting method for mounting an electronic component on a semiconductor substrate and a mounting machine therefor.

  Usually, there are various methods for mounting an electronic component such as an IC chip on a substrate on which an electrode pattern is formed. In this method, a non-conductive resin film is disposed on the electrode pattern formed on the substrate. From this, there is a method in which an IC chip on which bumps are formed is placed on an electrode pattern for temporary attachment, and then the IC chip is pressed against the substrate while heat is applied thereto (for example, patent document). 1).

  When performing the main pressure bonding, the IC chips are guided one by one, for example, on the pressure support stage that supports the reaction force when pressed, and are pressed with a uniform force over the entire surface of the IC chip. .

At the time of pressing, conventionally, in order to prevent the position of the IC chip from being displaced with respect to the electrode pattern, for example, the substrate is adsorbed on the pressing support stage, that is, fixed in close contact. Alternatively, the IC chip is pressed against the reference block.
JP 2001-118885 A

  By the way, according to the conventional mounting method described above, when the IC chip is pressed, the substrate is brought into close contact with the pressing support stage. It was made impossible.

  And with the recent thinning of electronic devices, the substrate is also required to be thin, and due to the synergistic effect of this thinning and the solder resist applied to one side of the substrate, the substrate is warped, and therefore the IC chip In this main press-bonding step, a problem arises that a gap is generated between the press-supporting stage and the suction cannot be performed.

  Therefore, in order to solve the above-described problems, the present invention provides a gap between the pressure support stage and the electronic component on the substrate, even when the substrate is warped. An object of the present invention is to provide an electronic component mounting method and an electronic component mounting machine that are not required.

In order to solve the above-described problem, the electronic component mounting method according to claim 1 of the present invention mounts the electronic component on the wiring pattern formed on the surface of the substrate and presses and mounts it.
After the substrate is placed on a guide table that guides the substrate on a pressing support stage provided at the pressing position, the back edge of the substrate is sucked and held through a suction hole formed in the peripheral portion of the guide table. And move the guide table so that the place to be pressed on the substrate is the pressing position,
Next, the suction unit disposed on both sides of the pressure support stage sucks the back surface of the substrate and biases it toward the pressure support stage.
Next, there is a method in which the substrate is sucked to the side of the pressure support stage through the suction hole formed in the pressure support stage.

The electronic component mounting method according to claim 2 is the mounting method according to claim 1,
In this method, after the substrate is adsorbed to the side of the pressure support stage, the surface of the substrate is pressed to the side of the pressure support stage by a pair of pressing tools arranged on both sides of the pressure support stage and above.

The electronic component mounting method according to claim 3 is the mounting method according to claim 2,
In this method, a portion other than the wiring pattern of the substrate is pressed by a pair of pressing tools.
Furthermore, an electronic component mounting machine according to claim 4 of the present invention is a mounting machine that performs mounting by placing and pressing an electronic component on a wiring pattern formed on the surface of a substrate,
A pressing support stage disposed below the pressing tool for pressing the electronic component and supporting the reaction force of the pressing tool;
A guide table that places the substrate and guides it on the stage for pressing and supporting, and adsorbs and holds the back edge thereof;
A suction unit that is disposed on both sides of the pressing support stage and sucks the back surface of the substrate held by the guide table and biases it toward the pressing support stage.

An electronic component mounting machine according to claim 5 is the mounting machine according to claim 4,
A pair of pressing tools is provided to press the surface of the substrate at both sides of the pressed electronic component toward the pressing support stage.

An electronic component mounting machine according to claim 6 is the mounting machine according to claim 5,
It is comprised so that the space | interval of a pair of pressing tool can be adjusted.
Furthermore, the electronic component mounting machine according to claim 7 is the mounting machine according to claim 5 or 6,
A portion other than the wiring pattern is pressed by a pressing tool.

  According to the electronic component mounting method and the mounting machine, when the substrate is guided to the pressing support stage and the electronic component is crimped, the substrate is sucked and fixed by the guide table holding the substrate and the pressing support stage. At that time, since the substrate is sucked by the suction unit disposed in the middle, the substrate is further urged toward the pressing support stage by the pressing tool disposed above the substrate. Even if the substrate is warped upward, it can be attracted to the pressure support stage with almost no gap between it and the pressure support stage, so that a suction error occurs as in the conventional case. In other words, even when warping occurs, the substrate can be surely adsorbed and fixed to the pressing support stage side, and as a result, when the electronic component is crimped There are may prevent the position of the electronic component relative to the wiring pattern of the substrate is shifted.

[Embodiment]
Hereinafter, an electronic component mounting machine and an electronic component mounting method according to embodiments of the present invention will be described with reference to the drawings.

  In the present embodiment, as an electronic component, a case will be described in which, for example, an IC chip is mounted by being bonded one by one to an electrode pattern (an example of a wiring pattern) formed on a substrate.

  More specifically, as shown in FIG. 1A, the substrate 1 is, for example, a multilayer substrate (for example, four layers) formed by impregnating high-strength aramid fibers with epoxy, A large number of regularly identical electrode patterns 2 are formed, and a solder resist is applied to the back surface.

  Further, the thickness of the substrate 1 is very thin, about 0.25 to 0.35 mm, and the solder resist is applied to the back surface (one surface), so that the phantom line in FIG. As shown, the center is warped so that the center protrudes from the upper surface.

The gist of the present invention is to hold the substrate 1 warped upward on the stage for joining the IC chip using the flip chip method so that there is no gap.
In the following, the IC chip is guided onto the electrode pattern 2 via, for example, a non-conductive adhesive film, and the temporary substrate 1 is guided, and the adhesive film is heated to press the IC chip onto the substrate 1. A so-called mounting machine and a mounting method for bonding the IC chip to the electrode pattern 2 (which can also be referred to as a pressing machine and a pressing method in terms of work contents) will be described.

First, an electronic component mounting machine will be schematically described with reference to FIGS.
2 is a front view of the main part of the mounting machine, FIG. 3 is a side view of the main part of the mounting machine, and FIG. 4 is a plan view of the main part of the mounting machine.

  The electronic component mounting machine 11 is provided, for example, on the base 12 side via a support member 13, and places the peripheral portion of the substrate 1 and holds the substrate 1 by suction, and sequentially holds each electrode pattern 2. A guide table (also referred to as a substrate stage) 14 that guides to a predetermined pressing position (also referred to as a crimping position) (A), and a substrate 1 that is disposed at the pressing position (A) to support the substrate 1 from the lower surface, and the same substrate by suction. 1. A pressure support stage (also referred to as a quartz stage) 15 made of quartz glass for holding and fixing 1, and a stage that is provided on the pressure support stage 15 so as to be movable up and down and has a built-in heater. 15, a pressing tool (also referred to as a mounting head) 16 for pressing the IC chip temporarily attached to the substrate 1 on the substrate 15 and pressing the IC chip onto the electrode pattern 2, and the pressing support step. A pair of suction units (also referred to as suction units) 17 that are arranged at least on the left and right sides of the die 15 and suck the back surface (lower surface) of the substrate 1 to urge the substrate 1 downward, and above the pressure support stage 15. In addition, a pair of pressers 18 are provided which are arranged to be movable up and down at the left and right positions of the presser 16 and press the surface (upper surface) of the substrate 1 downward.

Here, the structure for pressing the pressing tool 16 will be briefly described.
On the base 12, a support column 21 having a vertical guide portion 22 formed on the front side is erected, and at the top and rear thereof, a pressing mechanism for pressing the pressing tool 16 downward. 23 is provided.

  The pressing mechanism 23 includes a downward biasing means (not shown, but using, for example, a ball screw mechanism, a cylinder device, etc.) disposed at a rear position of the column body 21 and an upper end of the biasing means. The pressing piece 24 is provided so as to project forward, and the holding member 27 is held at the tip of the pressing piece 24 through a pair of upper and lower roller members 25 and 26 so as to be swingable in a vertical plane. .

  The holding member 27 urges the supporting piece 29 in the direction of the holding piece 28 provided with the upper roller material 25, the supporting piece 29 provided with the lower roller material 26, and the holding piece 28. Thus, the holding member 27 is constituted by a tension spring 30 for holding the holding member 27 on the pressing piece 24 side via both roller members 25 and 26.

  The pressing tool 16 is provided with a slide part 31 guided by the guide part 22 and a pressing part 32 capable of pressing an IC chip arranged on the substrate 1 is provided at the lower end thereof. Further, the slide portion 31 is held on the support piece 29 of the holding member 27 via a tension spring 33. The pressing portion 32 is provided with a heater for heating the adhesive film described above.

  According to the pressing tool 16 and the pressing mechanism 23, when the pressing piece 24 is urged downward by the urging means, the pressing tool 16 is urged downward via the holding member 27, so that the IC chip is mounted on the substrate 1. Will be pressed. At the time of this pressing, the holding member 27 is transmitted with an urging force downward from the pressing piece 24 via the pair of roller members 25, 26, so that the bending moment caused by the deformation on the urging means side is held by the holding member. Therefore, a slight positional shift at the pressing portion 32 at the lower end of the pressing tool 16 can be prevented.

  3 and 5, the guide table 14 supports a peripheral portion (edge) of the substrate 1 and has a rectangular opening 41a that can access the back surface of the substrate 1 at the center. A frame-shaped plate material 41 and a moving mechanism (for example, a mechanism similar to an XY table is used, and a ball screw mechanism, a cylinder device, etc. are used) 42 move the frame-shaped plate material 41 in a horizontal plane. It is supported on the support member 13 side through this moving mechanism 42. A suction hole 41 b for sucking the peripheral edge of the substrate 1 is formed at a predetermined position of the frame-shaped plate material 41. Although not shown, a suction device such as a vacuum pump is connected to each of the suction holes 41b so as to suck and hold the substrate 1 placed on the frame-shaped plate member 41.

  The pressing support stage 15 fixes and supports the substrate 1 by suction, and as shown in FIGS. 6 and 7, the outer peripheral shape of the support main body 15a is, for example, a square shape and the IC chip. The mounting surface is formed into a circular shape, and further, a suction hole 15b that opens to the surface is formed at the center of the upper surface (which may be provided at four locations around the surface). A suction device (not shown) such as a vacuum pump is connected.

  Each of the suction units 17 is arranged so as to be movable up and down at both sides of the pressing support stage 15 and has a lifting body 46 formed with a suction hole 46a opened on the upper surface. It is composed of a lifting mechanism 47 that lifts and lowers. Of course, a suction device (not shown) such as a vacuum pump is connected to the suction hole 46a as described above, and the lifting bodies 46 on both sides are connected. Thus, the back surface of the substrate 1 is urged downward.

  Further, as shown in FIGS. 2 and 3, each pressing tool 18 is movable in a horizontal direction on a mounting plate 51 provided on the pressing portion 32 side of the pressing tool 16 and on both sides of the mounting plate 51. An attached moving member (for example, a member that is moved by a ball screw mechanism, a cylinder device, etc.) 52 and an elevating mechanism (for example, a ball screw mechanism, a cylinder device, etc.) 53 are respectively connected to these moving members 52. The side view provided so as to freely move up and down is constituted by, for example, an L-shaped pressing piece 54.

These pressers 18 are moved in the horizontal direction so as to coincide with, for example, a portion where the electrode pattern 2 is not formed, that is, a dicing line between the electrode patterns 2.
A protective tape 61 for protecting the surface of the IC chip is interposed between the pressing portion 32 when the IC chip is finally press-bonded onto the substrate 1 by the pressing portion 32 of the pressing tool 16. .

  That is, as shown in FIG. 2, the mounting member 62 provided on one side of the column body 21 is provided with an actual reel 63 around which the protective tape 61 is wound, and is also provided on the other side. A retracting tool (for example, a pair of winding rollers is used) 65 for retracting the protective tape 61 is disposed on the mounting member 64, and the protective tape is provided every time the IC chip is finally crimped. 61 is sequentially drawn out.

  Further, in order to guide the protective tape 61 between the pressing piece 54 of each pressing tool 18 and the IC chip, a notch for allowing movement of the protective tape 61 is provided on the lower surface of each pressing piece 54. 54a (see FIG. 8) is formed.

  As described above, the support main body portion 15a of the pressing support stage 15 is made of quartz glass. As shown in FIG. 7, the support main body portion 15a is moved from the lighting fixture 71 arranged on one side thereof. While irradiating light, this reflected light is made incident on the CCD camera 72 arranged on the other side so that the surface of the IC chip can be photographed.

Next, a method for mounting an electronic component, that is, an IC chip will be described with reference to FIG.
First, the substrate 1 in which an IC chip is temporarily attached to each electrode pattern 2 via a resin film is placed on the guide table 14 and sucked through the suction holes 41b provided in the plate frame 41. The substrate 1 is held on the guide table 14 (operation a).

Next, the plate-like frame member 41 is moved in the horizontal plane, and the predetermined IC chip is moved to the pressing position (A) (b operation).
Next, the suction unit 17 is slightly lifted to perform a suction operation, and the substrate 1 in the vicinity of both sides of the IC chip to be finally bonded is urged downward to place the surface of the substrate 1 on the pressing support stage 15. Then, the substrate 1 is sucked from the suction hole 15b provided in the support main body portion 15a of the pressing support stage 15 and held in close contact with the surface of the support main body portion 15a (d operation).

  Next, after each pressing piece 54 in both pressing tools 18 is moved so as to reach the position of the dicing line in the IC chip, it is lowered to press the surface of the substrate 1 onto the pressing support stage 15 (e operation), Then, the pressing tool 16 is lowered and the substrate 1 is securely fixed via the protective sheet 61 (f operation).

  That is, when the IC chip temporarily attached to the substrate 1 is finally pressure-bonded, the peripheral edge portion is held by the guide table 14, that is, the frame-like plate material 41, and then sucked by both suction units 17 to be biased downward. Then, after the substrate 1 is sucked by the suction hole 15b provided on the pressing support stage 15 side, the dicing line is pressed downward from above by the pressing members 18, so that the center of the substrate 1 is, for example, upward. Even when warped, the substrate 1 can be fixed in a state in which the substrate 1 is securely adhered to the pressing support stage 15.

  In this way, the substrate 1 is urged toward the pressing support stage 15 by the guide table 14, the suction unit 17, and the presser 18, and the substrate 1 is pressed and supported even when the substrate 1 is warped upward. The suction holes 15b of the stage 15 can be reliably sucked and sucked, so that the suction error does not occur as in the prior art, that is, even when warping has occurred, the substrate 1 can be surely attached. The IC chip can be adsorbed and fixed to the pressing support stage 15 side, so that the position of the IC chip relative to the electrode pattern 2 can be prevented from being shifted during the main pressure bonding of the IC chip.

  By the way, in the above-described embodiment, when the substrate is fixed to the pressing support stage by suction, the outer position of the substrate by the guide table, that is, the frame-shaped plate material, the inner position by the suction unit, and the suction unit by the presser In the above description, the substrate is pressed by the pressing support stage at the inner position, but the pressing tool may not be provided in some cases.

  Since the electronic component mounting method and the mounting machine of the present invention can suck the substrate at least in the order of the peripheral edge portion, the intermediate portion, and the pressing position, and can reliably suck the substrate to the pressing support table. For example, this is particularly effective when an IC chip is mounted on a substrate that is very thin and warps upward.

It is a figure which shows schematic structure of the semiconductor substrate applied with the mounting method which concerns on embodiment of this invention, (a) is a top view, (b) is a side view. It is a front view which shows schematic structure of the electronic component mounting machine which concerns on embodiment of this invention. It is a side view which shows schematic structure of the same electronic component mounting machine. It is a top view which shows schematic structure of the same electronic component mounting machine. It is a perspective view which shows schematic structure of the guide table in the same electronic component mounting machine. It is a front view which shows the principal part structure of the same electronic component mounting machine. It is a top view which shows the principal part structure of the same electronic component mounting machine. It is a schematic diagram for demonstrating the mounting method by the electronic component mounting machine.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Electrode pattern 11 Electronic component mounting machine 12 Base 14 Guide table 15 Press support stage 15a Support body part 15b Suction hole 16 Press tool 17 Suction unit 18 Press tool 21 Strut body 22 Guide part 23 Press mechanism 41 Frame-shaped board material 41a Opening 41b Suction hole 46 Lifting body 46a Suction hole 47 Lifting mechanism 54 Pressing piece 54a Notch 61 Protective tape

Claims (7)

When mounting electronic components by placing them on the wiring pattern formed on the surface of the board and pressing them,
After the substrate is placed on a guide table that guides the substrate on a pressing support stage provided at the pressing position, the back edge of the substrate is sucked and held through a suction hole formed in the peripheral portion of the guide table. And move the guide table so that the place to be pressed on the substrate is the pressing position,
Next, the suction unit disposed on both sides of the pressure support stage sucks the back surface of the substrate and biases it toward the pressure support stage.
Next, the electronic component mounting method, wherein the substrate is sucked to the pressing support stage side through the suction holes formed in the pressing support stage.   After the substrate is attracted to the side of the pressure support stage, the surface of the substrate is pressed to the side of the pressure support stage by a pair of pressing tools arranged on both sides of the pressure support stage and above. The electronic component mounting method according to claim 1.   3. The electronic component mounting method according to claim 2, wherein a portion other than the wiring pattern of the substrate is pressed by a pair of pressing tools. A mounting machine that mounts by placing and pressing electronic components on a wiring pattern formed on the surface of a substrate,
A pressing support stage disposed below the pressing tool for pressing the electronic component and supporting the reaction force of the pressing tool;
A guide table for placing the substrate and guiding it on the stage for pressing and supporting and adsorbing and holding the back edge thereof;
An electronic component mounting machine comprising: a suction unit that is disposed on both sides of the pressing support stage and sucks the back surface of the substrate held on the guide table and biases it toward the pressing support stage.   The electronic component mounting machine according to claim 4, further comprising a pair of pressing members that press the surface of the substrate at both sides of the pressed electronic component toward the pressing support stage.   6. The electronic component mounting machine according to claim 5, wherein an interval between the pair of pressing members can be adjusted. 7. The electronic component mounting machine according to claim 5, wherein a portion other than the wiring pattern is pressed by a pressing tool.

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