SG11201605673VA - Workpiece processing apparatus and workpiece processing method - Google Patents
Workpiece processing apparatus and workpiece processing methodInfo
- Publication number
- SG11201605673VA SG11201605673VA SG11201605673VA SG11201605673VA SG11201605673VA SG 11201605673V A SG11201605673V A SG 11201605673VA SG 11201605673V A SG11201605673V A SG 11201605673VA SG 11201605673V A SG11201605673V A SG 11201605673VA SG 11201605673V A SG11201605673V A SG 11201605673VA
- Authority
- SG
- Singapore
- Prior art keywords
- workpiece processing
- processing apparatus
- processing method
- workpiece
- processing
- Prior art date
Links
- 238000003672 processing method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014014920A JP6015683B2 (en) | 2014-01-29 | 2014-01-29 | Workpiece processing apparatus and workwork processing method |
| PCT/JP2015/000170 WO2015115043A1 (en) | 2014-01-29 | 2015-01-16 | Workpiece machining device and workpiece machining method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201605673VA true SG11201605673VA (en) | 2016-08-30 |
Family
ID=53756630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201605673VA SG11201605673VA (en) | 2014-01-29 | 2015-01-16 | Workpiece processing apparatus and workpiece processing method |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10434621B2 (en) |
| JP (1) | JP6015683B2 (en) |
| KR (1) | KR102296692B1 (en) |
| CN (1) | CN105980105B (en) |
| DE (1) | DE112015000336T5 (en) |
| SG (1) | SG11201605673VA (en) |
| WO (1) | WO2015115043A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6269450B2 (en) * | 2014-11-18 | 2018-01-31 | 信越半導体株式会社 | Workpiece processing equipment |
| JP6443370B2 (en) * | 2016-03-18 | 2018-12-26 | 信越半導体株式会社 | Method for manufacturing carrier for double-side polishing apparatus and double-side polishing method for wafer |
| JP6589762B2 (en) * | 2016-07-13 | 2019-10-16 | 株式会社Sumco | Double-side polishing equipment |
| DE102018202059A1 (en) * | 2018-02-09 | 2019-08-14 | Siltronic Ag | Method for polishing a semiconductor wafer |
| JP7369067B2 (en) * | 2020-03-11 | 2023-10-25 | 日本発條株式会社 | Polishing equipment and method |
| CN115070511B (en) * | 2021-03-16 | 2023-12-15 | 华晨宝马汽车有限公司 | Method, apparatus and production line for monitoring a polishing operation on a vehicle |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02106269A (en) * | 1988-10-12 | 1990-04-18 | Toshiba Mach Co Ltd | Polishing machine having abnormal charging detector |
| JP2839331B2 (en) | 1990-05-17 | 1998-12-16 | レッキス工業株式会社 | Pipe scraper |
| JPH0425371A (en) * | 1990-05-17 | 1992-01-29 | Showa Alum Corp | Polishing device |
| JPH08216016A (en) * | 1995-02-14 | 1996-08-27 | Mitsubishi Materials Shilicon Corp | Method of polishing semiconductor wafer and polishing device |
| US6113165A (en) * | 1998-10-02 | 2000-09-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Self-sensing wafer holder and method of using |
| KR100737879B1 (en) * | 2000-04-24 | 2007-07-10 | 주식회사 사무코 | Method of manufacturing semiconductor wafer |
| US6709981B2 (en) | 2000-08-16 | 2004-03-23 | Memc Electronic Materials, Inc. | Method and apparatus for processing a semiconductor wafer using novel final polishing method |
| CN1315159C (en) | 2002-09-06 | 2007-05-09 | 大连淡宁实业发展有限公司 | Technique for precision finishing two side of plane wafer in large size |
| US6931330B1 (en) * | 2003-06-30 | 2005-08-16 | Lam Research Corporation | Methods for monitoring and controlling chemical mechanical planarization |
| JP4492155B2 (en) | 2004-02-27 | 2010-06-30 | 信越半導体株式会社 | Semiconductor wafer carrier holding hole detection device and detection method, and semiconductor wafer polishing method |
| JP2008227393A (en) | 2007-03-15 | 2008-09-25 | Fujikoshi Mach Corp | Double-side polishing apparatus for wafer |
| JP2009039827A (en) | 2007-08-09 | 2009-02-26 | Fujitsu Ltd | Polishing apparatus, substrate manufacturing method, and electronic device manufacturing method |
| US8834230B2 (en) | 2008-07-31 | 2014-09-16 | Shin-Etsu Handotai Co., Ltd. | Wafer polishing method and double-side polishing apparatus |
| JP5630414B2 (en) * | 2011-10-04 | 2014-11-26 | 信越半導体株式会社 | Wafer processing method |
| JP5973883B2 (en) * | 2012-11-15 | 2016-08-23 | 株式会社荏原製作所 | Substrate holding device and polishing device |
-
2014
- 2014-01-29 JP JP2014014920A patent/JP6015683B2/en active Active
-
2015
- 2015-01-16 US US15/109,954 patent/US10434621B2/en active Active
- 2015-01-16 CN CN201580006664.1A patent/CN105980105B/en active Active
- 2015-01-16 WO PCT/JP2015/000170 patent/WO2015115043A1/en active Application Filing
- 2015-01-16 KR KR1020167020714A patent/KR102296692B1/en active IP Right Grant
- 2015-01-16 SG SG11201605673VA patent/SG11201605673VA/en unknown
- 2015-01-16 DE DE112015000336.3T patent/DE112015000336T5/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015139857A (en) | 2015-08-03 |
| CN105980105B (en) | 2017-12-01 |
| US20160332279A1 (en) | 2016-11-17 |
| DE112015000336T5 (en) | 2016-09-29 |
| US10434621B2 (en) | 2019-10-08 |
| CN105980105A (en) | 2016-09-28 |
| KR102296692B1 (en) | 2021-09-02 |
| JP6015683B2 (en) | 2016-10-26 |
| KR20160113619A (en) | 2016-09-30 |
| WO2015115043A1 (en) | 2015-08-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB2558842B (en) | Processing apparatus and methods | |
| GB2545607B (en) | Apparatus and method for vector processing | |
| SG10201604456TA (en) | Substrate processing apparatus and substrate processing method | |
| SG11201609855WA (en) | Information processing apparatus and information processing method | |
| SG10201508119XA (en) | Substrate processing apparatus and processing method | |
| EP2991268A4 (en) | Data processing method and apparatus | |
| SG11201610951UA (en) | Information processing apparatus and information processing method | |
| HK1219315A1 (en) | Method for processing application and device thereof | |
| SG11201609143TA (en) | Plasma processing method and plasma processing apparatus | |
| GB201500628D0 (en) | Information processing apparatus and information processing method | |
| SG10201508134VA (en) | Workpiece Processing Method | |
| SG11201702404XA (en) | Plasma processing method and plasma processing apparatus | |
| SG11201709412PA (en) | Workpiece processing apparatus | |
| HK1211111A1 (en) | Method and apparatus for sorting objects | |
| ZA201902477B (en) | Operation object processing method and apparatus | |
| GB201414750D0 (en) | Data processing apparatus and method | |
| SG11201605673VA (en) | Workpiece processing apparatus and workpiece processing method | |
| SG11201610718YA (en) | Job processing method and device | |
| GB2533597B (en) | Material processing apparatus and method | |
| HK1222056A1 (en) | Method and apparatus for processing successive redirections | |
| PT3110210T (en) | Data processing apparatus and method | |
| SG11201607197YA (en) | Signal processing method and apparatus | |
| SI3028776T1 (en) | Delivery processing apparatus and delivery processing method | |
| SG10201505886XA (en) | Plasma processing apparatus and plasma processing method | |
| GB201513866D0 (en) | Method and apparatus for electrocagulation |