JPH02106269A - Polishing machine having abnormal charging detector - Google Patents

Polishing machine having abnormal charging detector

Info

Publication number
JPH02106269A
JPH02106269A JP63256332A JP25633288A JPH02106269A JP H02106269 A JPH02106269 A JP H02106269A JP 63256332 A JP63256332 A JP 63256332A JP 25633288 A JP25633288 A JP 25633288A JP H02106269 A JPH02106269 A JP H02106269A
Authority
JP
Japan
Prior art keywords
workpiece
surface plate
detector
polishing
polishing machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63256332A
Other languages
Japanese (ja)
Inventor
Hideo Kawakami
川上 英雄
Osamu Yoneya
米屋 修
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Machine Co Ltd
Original Assignee
Toshiba Machine Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Machine Co Ltd filed Critical Toshiba Machine Co Ltd
Priority to JP63256332A priority Critical patent/JPH02106269A/en
Publication of JPH02106269A publication Critical patent/JPH02106269A/en
Pending legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To prevent the generation of rejectives by providing a detector for detecting the abnormal position in the vertical direction of a surface plate member at the time of abnormal charging of a workpiece in the vicinity of an upper surface plate member. CONSTITUTION:In a polishing machine for polishing a workpiece 5 while interposingly pressing same between upper/lower surface plates 1, 2, when the workpiece 5 is interposed between the upper/lower surface plates 1, 2 by lowering the upper surface plate 1, a detector 17 detects the abnormal position in the vertical direction of the upper surface plate member 1. By the detecting signal of this detector 17, the operation hereafter is stopped until the workpiece 5 is normally charged. As a result, it becomes possible to recharge the workpiece 5 while enabling an unmanned operation.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はウエノ・やメモリーディスクなどの被加工物の
研磨に行う研磨機およびポリシャにおいて、被加工物の
異状装填を検知する検知器を設けた異状装填検知器を有
する研磨機に関するものである。
[Detailed Description of the Invention] [Field of Industrial Application] The present invention provides a polisher and a polisher for polishing workpieces such as wafers and memory disks, which are equipped with a detector for detecting abnormal loading of the workpiece. The present invention relates to a polishing machine having an abnormal loading detector.

〔従来の技術〕[Conventional technology]

従来使用されている両面研磨機の場合で説明する。第4
図に示すように上定盤lと下定盤2は不図示の駆動源に
よりそれぞれ単独に駆動されている。また、上定盤lは
上定盤保持板3に取付けられ、上定盤保持板3は保持軸
4に不図示の自動調心型軸受金倉して取付けられている
。そのため上定盤1は下定盤2に対して若干傾いても回
転可能となっている。上定盤lと下定盤2の間にを工、
円板状で内側にウニ・・等の被加工物5を平面状に保持
するための被加工物保持穴6を有するとともに外周面に
歯部を設け、内歯車7と太陽歯車8に噛合い自転しなが
ら公転するキャリア9が複数個セットされている。また
、上定盤1と下定盤2の対向面にはそれぞれ不図示の研
磨布が貼られている。
The case of a conventionally used double-sided polisher will be explained. Fourth
As shown in the figure, the upper surface plate 1 and the lower surface plate 2 are each independently driven by a drive source (not shown). The upper surface plate 1 is attached to an upper surface plate holding plate 3, and the upper surface plate holding plate 3 is attached to a holding shaft 4 with a self-aligning type bearing (not shown). Therefore, the upper surface plate 1 can rotate even if it is slightly inclined with respect to the lower surface plate 2. Cut between the upper surface plate L and the lower surface plate 2,
It is disc-shaped and has a workpiece holding hole 6 on the inside for holding a workpiece 5 such as a sea urchin in a flat shape, and teeth are provided on the outer peripheral surface, meshing with an internal gear 7 and a sun gear 8. A plurality of carriers 9 are set which revolve while rotating. In addition, polishing cloths (not shown) are applied to opposing surfaces of the upper surface plate 1 and the lower surface plate 2, respectively.

また、研磨加工に必要な研磨剤供給手段12が上定盤l
から上部に設けられており、この研磨剤供給手段12は
上定盤1の上部中央に設けた上定盤保持板3に取付けの
研磨剤受13と、研磨剤受13から上定盤1を上下方向
に貫通して設けた研磨剤供給口14との間に配設したチ
ューブ15から構成されており、研磨剤は不図示の研磨
剤供給ラインから研磨剤受13に供給され次にチューブ
15、研磨剤供給口14ヲ流下し、被加工物5に供給さ
れるようになっている。従来、被加工物の異状装填検知
装置等は特に設けられていない。
Further, the abrasive supply means 12 necessary for polishing is provided on the upper surface plate l.
This abrasive supply means 12 connects an abrasive receiver 13 attached to an upper surface plate holding plate 3 provided at the center of the upper part of the upper surface plate 1, and an abrasive agent receiver 13 that feeds the upper surface plate 1 from the abrasive agent receiver 13. It consists of a tube 15 disposed between an abrasive supply port 14 and an abrasive supply port 14 provided vertically through the tube 15. The abrasive is supplied from an abrasive supply line (not shown) to an abrasive receiver 13, and then passed through the tube 15. , the abrasive flows down through the abrasive supply port 14 and is supplied to the workpiece 5. Conventionally, a device for detecting abnormal loading of a workpiece has not been particularly provided.

なお、上定盤l、上定盤保持板3等は下定盤2上にキャ
リア9を残して上昇し、下定盤2から離れるようになっ
ている。
Note that the upper surface plate 1, the upper surface plate holding plate 3, etc. rise leaving the carrier 9 on the lower surface plate 2 and move away from the lower surface plate 2.

以上のように構成されており研磨加工においてはキャリ
ア9の被加工物保持穴6にウェハ等の被加工物5を保持
させ研磨剤を供給するとともに上定盤1.!:下定盤2
で被加工物5を押圧しながらキャリア9全自転、公転さ
せ上、下定盤1.2の相対運動により研磨加工が行なわ
れる。
With the above structure, during polishing, the workpiece 5 such as a wafer is held in the workpiece holding hole 6 of the carrier 9, and abrasive is supplied to the upper surface plate 1. ! :Lower surface plate 2
While pressing the workpiece 5, the carrier 9 fully rotates and revolves, and the polishing process is performed by the relative movement of the upper and lower surface plates 1.2.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

ウェハやメモリーディスク等の被加工物5の研磨加工に
際して、キャリア9の被加工物保持穴6内に被加工物が
装填され、第5図に示すように被加工物5が被加工物保
持穴6内に完全に入らず一部がキヤIJア9に載置され
次状態で上、下定盤間で押圧して研磨加工が行なわれる
場合、正常に装填された他の被加工物5においても均一
な加工圧力が作用しないため、被加工物によって研磨加
工にバラツキが生じる。また、研磨中に正常に装填され
ていない被加工物5が被加工物保持穴6から外れて上、
下定盤間で移動し、割れ易い被加工物5の場合は簡単に
割れ、この割れて飛散した小片が残りの被加工物5の部
分にも侵入し、残りの全数に影響し、ひどい時はキャリ
ア9を破損させ研磨機全も損傷させる場合も起っている
。したがって研磨加工時運転者は研磨機の側に常駐し細
心の注意をはらって監視しなければならないなど問題が
あった。
When polishing a workpiece 5 such as a wafer or a memory disk, the workpiece is loaded into the workpiece holding hole 6 of the carrier 9, and the workpiece 5 is held in the workpiece holding hole 6 as shown in FIG. If a part of the workpiece 5 does not fully enter the carrier IJ 9 and is pressed between the upper and lower surface plates to perform polishing in the next state, the workpiece 5 that has been loaded normally will also Since uniform processing pressure is not applied, variations occur in the polishing process depending on the workpiece. Also, during polishing, the workpiece 5 that is not properly loaded may come off the workpiece holding hole 6, and
If the workpiece 5 moves between the lower surface plates and is easily broken, it will easily break, and the broken and scattered small pieces will also invade the remaining workpieces 5, affecting all remaining workpieces, and in severe cases. In some cases, the carrier 9 is damaged and the entire polishing machine is also damaged. Therefore, during the polishing process, there were problems such as the operator having to stay near the polishing machine and supervising it with utmost care.

本発明はこれらの問題を解消するため、被加工物5をキ
ャリア9の被加工物保持穴6内に装填し、上定盤部材を
研磨位置に下降させた時、上定盤部材が正常位置より上
部に持ち上っている場合(異状装填の場合)を検知器で
検知し、被加工物の装填をやり直すことができ、その上
無人運転をも可能にすることができる研磨機全提供する
ことにある。
In order to solve these problems, the present invention has been developed so that when the workpiece 5 is loaded into the workpiece holding hole 6 of the carrier 9 and the upper surface plate member is lowered to the polishing position, the upper surface plate member is in the normal position. We provide a complete polishing machine that can use a detector to detect when the workpiece is lifted higher (in the case of abnormal loading), reload the workpiece, and also enable unmanned operation. There is a particular thing.

〔課題を解決するための手段〕[Means to solve the problem]

本発明は、キャリアの保持穴に被加工物を装填して、上
・下定盤間で挾圧して被加工物全研磨する研磨機におい
て、上定盤部材を下降させ、上・下定盤間で被加工物を
挾んだ時、上定盤部材の上下方向の異状位置を検知させ
る検知器を設けて、この検知器により、これより先の運
転を停止させることができる検知器全有する研磨機であ
る。
The present invention is a polishing machine that completely polishes the workpiece by loading the workpiece into a holding hole of a carrier and clamping it between the upper and lower surface plates, by lowering the upper surface plate member and moving the workpiece between the upper and lower surface plates. This polishing machine is equipped with a detector that detects abnormal positions in the vertical direction of the upper surface plate member when the workpiece is clamped, and this detector can stop further operation. It is.

〔作 用〕[For production]

研磨加工に際し、上・下定盤で被加工物を挾んだ時、上
定盤部材の上下方向の異状位置を検知し、被加工物が正
常に装填されるまでこれより先の運転を停止させる。そ
のため被加工物の再装填が可能になるほか、無人運転も
可能となる。
During polishing, when the workpiece is held between the upper and lower surface plates, abnormal positions in the vertical direction of the upper surface plate members are detected and further operations are stopped until the workpiece is loaded correctly. . This not only makes it possible to reload the workpiece, but also enables unmanned operation.

〔実施例〕〔Example〕

本発明の一実施例を第1図、両面研磨機の場合で説明す
る。第4図により説明した従来の両面研磨装置と同一部
材は説明済みにつき同一符号を付し説明は省略する。
An embodiment of the present invention will be described with reference to FIG. 1, which is a double-sided polisher. The same members as those of the conventional double-side polishing apparatus explained with reference to FIG. 4 have already been explained, so the same reference numerals are given and the explanation will be omitted.

内歯車の外側に位置するフレーム16の上面の定盤寄り
に上定盤1の上下方向の異状位置を検知するための検知
器である光電スイッチ17の取付用支柱】8が数個等ピ
ツチで立設され、これらの支柱18には光電スイッチ(
反射形)が上定盤の中心に向って、それぞれ光電スイッ
チの光軸が上定盤の上面よりわずか(ウェハ等の厚さよ
り、わずか大きい距離)上になるように取付けられてい
る。
On the upper surface of the frame 16 located on the outside of the internal gear, near the surface plate, there are several mounting posts for mounting a photoelectric switch 17, which is a detector for detecting abnormal positions in the vertical direction of the upper surface plate 1. These pillars 18 are equipped with photoelectric switches (
(reflective type) are mounted toward the center of the upper surface plate so that the optical axis of each photoelectric switch is slightly above the top surface of the upper surface plate (a distance slightly greater than the thickness of the wafer, etc.).

したがって、研磨加工に際してキャリアの被加工物保持
穴6内にウェハやメモリーディスク等の被加工物5fc
装填して、上定盤1を下降させ上・下定盤間で被加工物
5を挾んだ時、第2図に示すように被加工物5が被加工
物保持穴6内に全体が挿入されず、その一部がキャリア
9に載置されている場合、上定盤1は保持軸4に設けた
不図示の自動調心型の軸受を中心として傾き概略被加工
物5の厚さ分だけ上方に持ち上った位置となる。
Therefore, during polishing, the workpiece 5fc, such as a wafer or memory disk, is held in the workpiece holding hole 6 of the carrier.
After loading, when the upper surface plate 1 is lowered and the workpiece 5 is sandwiched between the upper and lower surface plates, the workpiece 5 is completely inserted into the workpiece holding hole 6 as shown in FIG. If the upper surface plate 1 is not mounted on the carrier 9 and a part of it is placed on the carrier 9, the upper surface plate 1 is tilted about the self-aligning type bearing (not shown) provided on the holding shaft 4 approximately by the thickness of the workpiece 5. It will be in a position where it is lifted upward.

このように上定盤1が上方にわずか移動すると光電スイ
ッチ17より放射された光が上定盤1の側面上部に当た
り反射し、被加工物5の異状装填を検知し、警報を出す
とともに、これより先の運転を停止させる。そこで上定
盤1金上昇させて再度被加工物5?:正しく装填しなお
した後、上定盤1を下降させ研磨剤を供給しなから上・
下定盤を回転させ研磨加工を再開する。被加工物5が正
しく装填された場合は光電スイッチの光軸が上定盤1か
も外れるため検知されず正常運転ができる。
When the upper surface plate 1 moves slightly upward in this way, the light emitted from the photoelectric switch 17 hits the upper side of the upper surface plate 1 and is reflected, detecting abnormal loading of the workpiece 5 and issuing an alarm. Stop further operation. Then, raise the upper surface plate by 1 gold and check the workpiece 5 again. : After reloading correctly, lower the upper surface plate 1 and supply the abrasive, then lower the upper surface plate.
Rotate the lower surface plate and restart polishing. When the workpiece 5 is loaded correctly, the optical axis of the photoelectric switch also comes off the upper surface plate 1, so it is not detected and normal operation can be performed.

第3図は他の実施例金示すもので、この場合光電スイフ
チの代シに近接スイッチ19ヲ上定盤1の上方に設けた
もので、被加工物5の異状装填検知は上定盤1の上面と
近接スイフチの距離の差により検知させるものである。
FIG. 3 shows another embodiment, in which a proximity switch 19 is provided above the upper surface plate 1 in place of the photoelectric switch, and abnormal loading of the workpiece 5 is detected on the upper surface plate 1. Detection is performed based on the difference in distance between the top surface of the camera and the proximity switch.

被加工物の装填特上定盤1を上昇させる時は近接スイッ
チが邪魔になるので近接スイッチ19取付用のアーム2
0ヲ回転式とし、上定盤1の外周より外側に遠ざけてお
く。
The proximity switch gets in the way when lifting the surface plate 1 for loading the workpiece, so the arm 2 for mounting the proximity switch 19 is
0 is a rotary type and is kept away from the outer periphery of the upper surface plate 1.

その他の構成および動作は第1図の実施例のものと同一
であるので説明は省略する。
The rest of the configuration and operation are the same as those of the embodiment shown in FIG. 1, so their explanation will be omitted.

前述した実施例では検知器として光電スイッチまたは近
接スイッチを使用したが、上定盤部材の上下位置を検知
できるものであれば他の検知器の使用も可能である。
In the embodiments described above, a photoelectric switch or a proximity switch was used as the detector, but other detectors may be used as long as they can detect the vertical position of the upper surface plate member.

〔発明の効果〕〔Effect of the invention〕

検知器を取付は被加工物の異状装填検知が可能になり、
被加工物の再装填ができるため不良品の発生を未然に防
止することができるとともにキャリアおよび機械の損傷
防止も可能となった。また、機械の無人運転が可能とな
るなど顕著な効果を有する。
Installing a detector makes it possible to detect abnormal loading of the workpiece.
Since the workpiece can be reloaded, it is possible to prevent the production of defective products, and it is also possible to prevent damage to the carrier and machine. It also has remarkable effects, such as making it possible to operate machines unmanned.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図は本発明の一実施例全示すもので、第1
図は正常装填時の断面図、第2図は異状装填時の断面図
、第3図は本発明の他の実施例の断面図、第4図、第5
図は従来研磨機を示すもので、第4図は正常装填時の断
面図、第5図は異状装填時の断面図である。 1・・・・・・上定盤、2・・・・・・下定盤、5・・
・・・・被加工物、6・・・・・・被加工物保持穴、9
・・・・・・キャリア、17・・・・・光電スイッチ(
検知器)、19・・・・・・近接スイッチ(検知器)。
FIG. 1 and FIG. 2 show one embodiment of the present invention.
The figure is a sectional view when normally loaded, FIG. 2 is a sectional view when abnormally loaded, FIG. 3 is a sectional view of another embodiment of the present invention, FIGS.
The figures show a conventional polishing machine, with FIG. 4 being a sectional view when normally loaded, and FIG. 5 being a sectional view when being abnormally loaded. 1...Upper surface plate, 2...Lower surface plate, 5...
...Workpiece, 6...Workpiece holding hole, 9
...Carrier, 17...Photoelectric switch (
Detector), 19... Proximity switch (detector).

Claims (1)

【特許請求の範囲】[Claims] キャリアの保持穴に被加工物を装填し、上下定盤間で挾
圧して被加工物を研磨する研磨機において、前記被加工
物の異状装填時、上定盤部材の上下方向の異状位置を検
知する検知器を上定盤部材の近傍に設けたことを特徴と
する異状装填検知器を有する研磨機。
In a polishing machine that loads a workpiece into a holding hole in a carrier and presses it between an upper and lower surface plate to polish the workpiece, when the workpiece is loaded with abnormality, the abnormal position of the upper surface plate member in the vertical direction is detected. A polishing machine having an abnormal loading detector, characterized in that a detector for detecting the abnormality is provided near an upper surface plate member.
JP63256332A 1988-10-12 1988-10-12 Polishing machine having abnormal charging detector Pending JPH02106269A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63256332A JPH02106269A (en) 1988-10-12 1988-10-12 Polishing machine having abnormal charging detector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63256332A JPH02106269A (en) 1988-10-12 1988-10-12 Polishing machine having abnormal charging detector

Publications (1)

Publication Number Publication Date
JPH02106269A true JPH02106269A (en) 1990-04-18

Family

ID=17291203

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63256332A Pending JPH02106269A (en) 1988-10-12 1988-10-12 Polishing machine having abnormal charging detector

Country Status (1)

Country Link
JP (1) JPH02106269A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425371A (en) * 1990-05-17 1992-01-29 Showa Alum Corp Polishing device
JPH1110525A (en) * 1997-06-17 1999-01-19 Ebara Corp Polishing device
WO2013051184A1 (en) * 2011-10-04 2013-04-11 信越半導体株式会社 Wafer processing method
JP2015139857A (en) * 2014-01-29 2015-08-03 信越半導体株式会社 Machining device of workpiece and machining method of workpiece
WO2016079923A1 (en) * 2014-11-18 2016-05-26 信越半導体株式会社 Workpiece processing apparatus

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425371A (en) * 1990-05-17 1992-01-29 Showa Alum Corp Polishing device
JPH1110525A (en) * 1997-06-17 1999-01-19 Ebara Corp Polishing device
US9490180B2 (en) 2011-10-04 2016-11-08 Shin-Etsu Handotai Co., Ltd. Method for processing wafer
WO2013051184A1 (en) * 2011-10-04 2013-04-11 信越半導体株式会社 Wafer processing method
JP2015139857A (en) * 2014-01-29 2015-08-03 信越半導体株式会社 Machining device of workpiece and machining method of workpiece
WO2015115043A1 (en) * 2014-01-29 2015-08-06 信越半導体株式会社 Workpiece machining device and workpiece machining method
US10434621B2 (en) 2014-01-29 2019-10-08 Shin-Etsu Handotai Co., Ltd. Workpiece processing apparatus and workpiece processing method
JP2016097450A (en) * 2014-11-18 2016-05-30 信越半導体株式会社 Processing device for workpiece
KR20170084084A (en) * 2014-11-18 2017-07-19 신에쯔 한도타이 가부시키가이샤 Workpiece processing apparatus
CN107073683A (en) * 2014-11-18 2017-08-18 信越半导体株式会社 The processing unit (plant) of workpiece
TWI603394B (en) * 2014-11-18 2017-10-21 Shin-Etsu Handotai Co Ltd Workpiece processing device
US10166649B2 (en) 2014-11-18 2019-01-01 Shin-Etsu Handotai Co., Ltd. Machining apparatus for workpiece
WO2016079923A1 (en) * 2014-11-18 2016-05-26 信越半導体株式会社 Workpiece processing apparatus

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