JP2001334456A - Work polishing method and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently drive works without causing the mutual sliding contact and rotation speed difference by a surface plate in polishing the outer circumferential edge and to drive the works in their slide contact state by the surface plate in polishing the both surfaces in a composite type polishing device performing the surface polishing and the outer circumferential edge polishing of the works. SOLUTION: This work polishing device is provided with a support roller 40 rotatably supporting the outer circumference of a disc work W, a pair of small-diameter surface plates 11b for polishing the both surfaces of the work, a polishing drum 29 polishing the outer circumferential edge of the work, and a moving mechanism relatively moving the support roller 40 and the work W to the surface plate 11b. In polishing the outer circumferential edge, the surface plate 11b concentrically abut on the central parts of the both faces of the work W, the work W is driven and polished by the surface plate 11b in the position, and in the case of polishing the both surfaces of the work W, the surface plate 11b polishes it by abutting on a position close to one end of the work in an eccentric position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a means for polishing both surfaces and a peripheral edge of a substantially disk-shaped work such as a semiconductor wafer or a glass substrate.

[0002]

2. Description of the Related Art A double-side polishing apparatus for polishing both surfaces of a work using two platens having a smaller diameter than the work is disclosed in, for example, JP-A-10-80861 and JP-A-10-217113.
It is already known as described in Japanese Patent Publication No. As shown in principle in FIGS. 10 and 11, these polishing apparatuses are provided on both surfaces of a disk-shaped work W whose outer periphery is rotatably supported by a plurality of support rollers 2, and have substantially the same radius as the work W. Two platens 1, 1 having a diameter are pressed at a position close to one end, and both sides of the work W are rotated while the work W is forcibly rotated by some support rollers or another drive roller 3. It is to be polished by two platens 1,1.

Since such a polishing apparatus can polish a large-diameter work W using the small-diameter platens 1 and 1, it is possible to avoid the enlargement of the polishing apparatus along with the increase in the diameter of the semiconductor wafer. In recent years, which have disappeared, attention has been paid to a large-sized semiconductor wafer that can be polished by a small-sized polishing apparatus.

Incidentally, in the case of a work having an outer peripheral edge which is chamfered like a semiconductor wafer, it is necessary to polish the outer peripheral edge in the same manner as the surface. However, in the above-mentioned conventional apparatus, since only the surface of the work can be polished, the outer peripheral edge must be polished using another polishing apparatus. For this reason, a plurality of polishing apparatuses and related equipment such as transport means for transporting a work between the respective polishing apparatuses are required, and the whole mechanism becomes large and complicated, so that a large installation space is required, or a polishing process is required. And the control mechanism becomes complicated. Further, for example, if the edge of the workpiece is polished after the surface of the workpiece is polished by another apparatus, there is a problem that the polished surface is easily scratched or stained by vacuum chucking.

Accordingly, the present inventors have disclosed in Japanese Patent Application Laid-Open No. 11-254.
As disclosed in Japanese Patent Publication No. 309, there has been proposed a composite-type polishing apparatus capable of performing both polishing of the surface of a work and polishing of an edge with one apparatus. This has a pair of small-diameter platens serving also as a work surface polishing means and a driving means, and a polishing roller for edge polishing. The pair of platens are eccentric to a position near the end of the work. By contacting and rotating, while rotating the work by the frictional force between these surface plate and the work, after polishing the outer peripheral edge by contacting the rotating polishing roller to the outer periphery of the work, The polishing roller is separated from the motor so as to be in a free rotation state, and in this state, both surfaces of the work are polished by increasing the number of rotations of the platen.

According to such a compound type polishing apparatus, since both the surface polishing of the work and the polishing of the edge can be performed in one apparatus, the polishing is very simple and efficient, and the polishing of the edge is also very simple. There is no problem such as scratching the polished surface by the chuck at the time of polishing, and almost all the various disadvantages of the previous apparatus can be eliminated.

[0007] However, the above-mentioned composite polishing apparatus is
Since the work is driven by the platen which rotates while abutting eccentrically at a position near the end of the work when the outer peripheral edge is polished, the platen and the work are relatively slid in contact with each other. As a result, the rotation speed of the work is lower than the rotation speed of the platen, and it is relatively difficult to increase the rotation speed of the work. For this reason, there is a demand for a more efficient work driving method and a simple and specific mechanism for realizing the method.

[0008]

SUMMARY OF THE INVENTION A technical problem of the present invention is to provide a polishing apparatus of a composite type capable of performing both the surface polishing and the outer peripheral edge of a work when polishing the outer peripheral edge of the work. The workpiece can be easily and efficiently driven by the platen without causing sliding contact and a difference in rotational speed between the workpieces, and when polishing the surface of the workpiece, the workpiece is brought into sliding contact with the platen. That is, it is configured to be driven by the

[0009]

According to the present invention, there is provided, in accordance with the present invention, a plurality of support rollers which abut against the outer periphery of a disk-shaped work and rotatably support the work around a central axis. Using a pair of polishing surface plates opposed to each other smaller in diameter than the work to grind both surfaces of the work, and a polishing apparatus having an edge polishing mechanism to grind the outer peripheral edge of the work, the pair of surface plates By contacting the center of both sides of the work concentrically and rotating them in the same direction,
While rotating the work using these surface plates as a driving means, the outer peripheral edge of the work is polished by the edge polishing mechanism, and then the pair of surface plates are moved to a position near one end in the radial direction of the work to remove the work. Abrading both surfaces of the work with these two surfaces while rotating the work in the same direction by rotating the surface in the same direction. A method is provided.

According to the above-mentioned method of the present invention, both surfaces and the outer peripheral edge of a work can be polished by one apparatus. When the outer peripheral edge is polished, the two platens are concentrically brought into contact with the center portions of both surfaces of the work, and the work is driven and rotated. Without causing any problems, the rotational force of the surface plate can be directly transmitted to the work to drive and rotate the work simply and efficiently, and when polishing both surfaces, by moving the surface plate to the eccentric position, In addition, the surface can be polished while the work is driven and rotated in a sliding state.

In the present invention, it is preferable that, during the step of polishing both surfaces of the work with the two surface plates, the surface plate and the work are relatively swung in the radial direction of the work.

According to the present invention, in order to carry out the above method, a plurality of support rollers abut on the outer periphery of the disk-shaped work and rotatably support the work around a central axis.
A pair of polishing plates, which are arranged on both sides of the work and serve both as a polishing means for polishing the surface of the work and a driving means for rotating the work, and have a smaller diameter than the work and opposed to each other, A motor for driving and rotating these surface plates, an edge polishing mechanism for polishing the outer peripheral edge of the work, and two surface plates being concentric with the center of the work when polishing the work edge by the edge polishing mechanism. When the work surface is polished by the two surface plates, the surface plates eccentrically abut on a position near one end in the radial direction of the work to polish the work when the surface of the work is polished by the two surface plates. A work polishing apparatus is provided, comprising: a moving mechanism for relatively moving the two surface plates and the work so as to occupy a polishing position for polishing.

According to a specific embodiment of the present invention, the moving mechanism includes a linear guide attached to the machine body and extending in a direction along a radius of the work, a movable table movable along the linear guide, Table moving means for moving the movable table along the linear guide, wherein the support rollers or a pair of platens are supported on the movable table so as to move together with the movable table. ing.

In the present invention, preferably, a swing mechanism is provided for swinging the work table and the work relatively in the radial direction of the work when the work surface is polished by the two work tables. The swing mechanism can be also used by the moving mechanism.

According to another specific embodiment of the present invention,
The edge polishing mechanism includes an inclined surface polishing unit for polishing two inclined surfaces on both surfaces of an outer peripheral portion of the work with a polishing band, and a peripheral surface polishing unit for polishing the peripheral surface of the work with the polishing band.
The inclined surface polishing portion and the peripheral side surface polishing portion are arranged at positions different from each other.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the drawings. 1 and 2 show a first embodiment of a double-side polishing apparatus according to the present invention. This polishing apparatus 10A is driven and rotated around the vertical center axis at opposite positions near one end in the radial direction of the disk-shaped work W supported rotatably about the vertical center axis. Upper and lower pair of polishing surface plates 11
The outer peripheral edge of the workpiece W, which has been chamfered, is polished by the edge polishing mechanism 12 while being polished by a and 11b. The specific configuration is as follows.

The polishing apparatus 10A has a machine body 13 formed by combining mold members having various cross-sectional shapes, and the machine body 13 supports the pair of upper and lower platens 11a and 11b described above. These platens 11a and 11b are obtained by attaching a polishing pad to the entire surface of a metal or ceramic substrate, and have a diameter larger than the radius of the work W but smaller than the diameter. Preferably, the diameter is substantially the same as or slightly larger than the radius of the work W.

The lower first surface plate 11a of the two surface plates 11a and 11b has a drive shaft 1 extending downward.
5a, the drive shaft 15a is rotatably supported by a support member 16 fixed to the body 13, and is connected to a drive motor 17 attached to the support member 16; It is designed to be driven and rotated at the position.

The second surface plate 11b located above is
It has a drive shaft 15b extending upward, and the drive shaft 15b is rotatably supported by the support member 19,
A drive motor 20 attached to the support member 19
, And is driven and rotated by the motor 20. Further, the support member 19 is
1, the platen can be raised and lowered by the platen lifting mechanism 21.

The platen elevating mechanism 21 includes a support frame 23 erected on the body 13, a rail-shaped linear guide 24 fixedly attached to the support frame 23 and extending in the vertical direction, and a linear guide 24. A slide table 25 movable along the slide table 24;
And driving means 26 for raising and lowering the member 5 along the linear guide 24. The driving means 26 is constituted by an air cylinder, and moves the second platen 11b up and down when the work W is loaded or unloaded, or presses the second platen 11b during polishing, so that the two platens 11a, 1
1b to generate a required working pressure. Therefore, the driving means 26 also serves as a pressing means for pressing both the platens against the work W with a required processing pressure.

At the position adjacent to the work W, the machine body 13 is provided with the edge polishing mechanism 12 for polishing the chamfered outer peripheral edge of the work W. The edge polishing mechanism 12 has a cylindrical edge polishing drum 29 driven and rotated around a vertical axis, and a polishing pad attached to the outer peripheral surface of the edge polishing drum 29 uses an outer peripheral edge of the work W. Is to be polished. The polishing drum 29 includes a drum shaft 2 extending downward.
9a, the drum shaft 29a is rotatably supported by a support member 30, and is connected to a driving motor 31 attached to the support member 30 via a clutch 32 so as to be detachable. Since the support member 30 is supported by the drum elevating mechanism 33, the drum elevating mechanism 33 can move up and down to change the contact position with the workpiece. The outer peripheral surface of the polishing drum is provided with a plurality of polishing grooves in which the outer peripheral portion of the work W fits tightly, and the outer peripheral edge of the work can be polished by selectively using these grooves. it can.

The drum lifting mechanism 33 includes a ball screw 3 rotatably mounted on the body 13 and extending vertically.
4, a nut member 35 which is screwed into the ball screw 34 and moves up and down along the ball screw 34 by the rotation thereof;
And a motor 36 for rotating the ball screw 34. The nut member 35 is coupled to the support member 30. Therefore, with this configuration, by driving the ball screw 34 to move the nut member 35 up and down, the support member 30, that is, the edge polishing drum 29 can be moved up and down together with the nut member 35.

In the polishing area of the work W, the work W
A polishing tank 39 is provided so as to surround the surface plates 11a, 11b and the edge polishing drum 29, and the work W is polished in the polishing tank 39. The polishing tank 39 has a substantially rectangular planar shape, and the inside thereof is divided into a first portion 39a having a small depth and a second portion 39b having a large depth. The upper and lower surface plates 11a and 11b are housed, and the edge polishing drum 29 is housed in the second portion 39b. Then, the drive shaft 15a of the first platen 11a
The first portion 39a penetrates the bottom of the polishing tank 39 in a sealed state and extends outside the tank, and the edge polishing drum 29
Similarly, the drum shaft 29a extends through the tank bottom in the second portion 39b in a sealed state and extends out of the tank, and is connected to the respective motors.

Inside the polishing tank 39, the work W
A plurality of support rollers 40 are attached so as to contact the outer periphery of the workpiece W and rotatably support the work W about an axis. Each of these support rollers 40 has an arm 41
Each arm 41 is attached to the bottom of the polishing tank 39 so as to be rotatable. At least a part of these support rollers 40 can be shifted to an unsupported position by turning or moving the arm 41 so as not to disturb the work when loading or unloading the work W. Is desirable. Further, these support rollers 40 may be grooved rollers provided on the outer periphery with grooves, steps, and the like into which the work fits.

The polishing tank 39 and the edge polishing drum 29 are mounted on a common moving mechanism 43, and the moving mechanism 43 causes the supporting arm 41 to move as shown in FIG.
Center O ₁ and the surface plate 11a of the supported workpiece W, 11b
Can be moved together in the radial direction of the work W along a straight line L connecting the center O _{2 of the} work W. The movement causes the work to be relatively displaced with respect to the two bases, and when the outer peripheral edge of the work is polished, the two bases 11a and 11b are positioned at the center of the work W as shown by a chain line in FIG. 2 and occupy a driving position for rotating the work concentrically, and when polishing the surface of the work with the surface plate, as shown by solid lines in FIG.
b occupies an eccentric state at a position near one end in the radial direction of the work W and occupies a polishing position for polishing the work.

The moving mechanism 43 includes a rail-shaped linear guide 44 mounted horizontally on the machine body 13 and extending in a direction along the radius (straight line L) of the work W.
And a table driving means 46 for reciprocating the movable table 45 along the linear guide 44. The polishing table 39 and the edge polishing are mounted on the movable table 45. The support member 30 of the mechanism 12 is attached. Therefore, by moving the movable table 45 by the driving means 46,
The workpiece W is moved by a predetermined distance via the polishing tank 39, and the polishing drum 29 is moved together therewith. In this case, since the two bases 11a and 11b do not move,
The polishing tank 39 and the drive shaft 15b of the second platen 11b extending to the outside through the tank bottom of the polishing tank 39 are related so as to be relatively movable in a sealed state. .

The table driving means 46 is rotatably mounted on the body 13 so that the linear guide 44 is rotatable.
A ball screw 47 extending in parallel with the ball screw 47
And a motor 49 for rotating the ball screw 47. The nut member 48 is coupled to the movable table 45. ing. Therefore, the movable table 45 can be moved by driving the ball screw 47 to move the nut member 48 back and forth.

When the work surface is polished by the two surface plates, the moving mechanism 43 further moves the work W and the surface plate 1.
1a, 11b also serves as a swing means for relatively swinging the work W in the radial direction.

In the double-side polishing apparatus 10A having the above configuration, the work W supported by each support roller 40 includes:
Polishing of both upper and lower surfaces by the two surface plates 11a and 11b and polishing of the outer peripheral edge by the edge polishing drum 29 are performed. In this case, both polishing may be performed at the same time, or may be performed separately at different times before and after. Here, a case where the outer peripheral edge is polished first and the both surfaces are polished later will be described. In the case of performing the above-mentioned polishing, a polishing liquid is supplied to the processed portion. However, since a known mechanism is used for this polishing liquid supply mechanism, it is not shown.

FIG. 2 shows the polishing of the outer peripheral edge.
The work W is moved by the moving mechanism 43 along the straight line L via the polishing tank 39 such that the upper and lower platens 11a and 11b occupy the drive position concentric with the work W as shown by a chain line. Then, at that position, the upper second surface plate 11b
Is lowered so that both surface plates 11a and 11b
The workpiece W is driven and rotated by abutting against a predetermined pressure on both surfaces of the central portion of the workpiece and rotating at the same speed in the same direction. In this state, the outer peripheral edge of the work W is polished by driving and rotating the edge polishing drum 29 abutting on the outer periphery of the work W by the motor 31. At this time, the rotation direction of the polishing drum 29 may be the same as or opposite to the rotation direction of the workpiece W. However, when rotating in the opposite direction, that is, when the rotation directions of the outer peripheral portions that are in sliding contact with each other are the same. It is desirable to rotate either the polishing drum 29 or the work W at a speed sufficiently faster than the other. The rotational force of the surface plates 11a and 11b is
The rotation speed of the platen 11a, 11b and the rotation speed of the workpiece W are the same, because the rotation speed difference is not generated between them due to slippage. Therefore, the rotation speed of the work can be easily and accurately controlled by changing the rotation speed of the platen.

When the polishing of the outer peripheral edge is completed, the rotation of both the surface plates 11a and 11b and the edge polishing drum 29 is temporarily stopped, and the drum shaft 29a is separated from the motor 31 by releasing the clutch 32 to free the edge polishing drum 29. At the same time, the work W
Are moved so that the two platens 11a and 11b occupy the polishing positions near one end in the radial direction of the work. At this time, it is desirable to raise the upper second platen 11b so as to separate it from the work, or to slightly raise the second platen 11b to reduce the pressure applied by both platens 11a and 11b. Subsequently, both surfaces of the work W are polished by pressing the bases 11a and 11b against the work W with a predetermined pressing force and rotating them in the same direction. At this time, the work W is in sliding contact with both of the surface plates while being driven and rotated in a certain direction by the frictional force between the work surfaces 11a and 11b, and the surfaces thereof are polished. The work W supported by the support rollers 40 in the polishing tank 39 is moved by operating the moving mechanism 43 as a rocking mechanism and slowly reciprocating the polishing tank 39 along the linear guide 44. Surface plate 11
a and 11b are swung in the radial direction.
At this time, the polishing drum 29 also swings together. As a result, the work W and the two surface plates 11a and 11b
Sliding while changing the relative position in the radial direction of the
The sliding contact length at each point in the radial direction of the work W is made substantially uniform, and the entire surface is uniformly processed.

The swing stroke of the work W is
In FIG. 2, the center O ₁ of the work W and the surface plates 11a and 11b
Smaller than the distance from the center O ₂ of Further, the edge polishing drum 29 may be provided so as to be able to freely contact and separate from the work W, and may be separated from the edge when polishing the surface of the work.

FIGS. 3 and 4 show a second embodiment of the present invention. The difference between the polishing apparatus 10B of the second embodiment and the first embodiment is that the moving mechanism 43 is used in the first embodiment. While the work W is moved, in the second embodiment, the upper and lower platens 11a and 11b are moved.

That is, the polishing tank 39 and the edge polishing mechanism 12 are fixed at fixed positions of the body 13, and the upper and lower
a and 11b are supported by a set of moving mechanisms 50. The moving mechanism 50 includes a rail-shaped linear guide 51 mounted horizontally on the machine body 13 and extending in a direction along the radius of the work W, a movable table 52 movable along the linear guide 51, and a movable table 52. Table driving means 53 for reciprocating the rocking along the linear guide 51
And a lower first platen 11 on the movable table 52.
a support member 16 for supporting the motor 17 and the support plate 23 for supporting the upper second platen 11b and the platen lifting mechanism 21. Therefore, by moving the movable table 52 by the driving means 53, the two bases 11a and 11b can be moved in the radial direction of the work W. The moving mechanism 50 also serves as a swing mechanism for relatively swinging the work W and the surface plates 11a and 11b when polishing the surface of the work W.

Since the configuration and operation of the second embodiment other than those described above are substantially the same as those of the first embodiment, the same components as those of the first embodiment are denoted by the same reference numerals and the description thereof is omitted. I do.

In each of the above embodiments, the first platen 11a and the second platen 11a
Although the surface plate 11b and the surface plate 11b have the same size, they do not necessarily have to be the same size. As shown in FIG.
It can also be smaller than 1a. When one of the surface plates has a small diameter, the work W can be easily loaded and unloaded from that side.

In each of the above embodiments, the polishing drum 29 in which a polishing pad is adhered to the outer peripheral surface of a cylinder is shown as a means for polishing the outer peripheral edge of the work, but other mechanisms can be used. FIGS. 6 and 7 show another example of the edge polishing mechanism using a polishing band 60 made of a flexible polishing material such as a polishing pad. The edge polishing mechanism 12A includes an inclined surface polishing section 61 for polishing two inclined surfaces E1 and E2 formed on both surfaces of an outer peripheral portion of the work W, and a work peripheral portion located between the inclined surfaces E1 and E2. A peripheral side polishing portion 62 for polishing the side surface E3 is provided. The inclined surface polishing portion 61 and the peripheral side polishing portion 62 are located at positions opposite to each other across the work W inside the polishing tank 39. is set up.

The inclined surface polishing section 61 is used for the first work W
Mechanism 61a for polishing the inclined surface E1 formed on the surface
And a second mechanism 61b for polishing the inclined surface E2 formed on the second surface on the opposite side. These mechanisms 61
Reference numerals a and 61b denote a reel 63 in which the polishing band 60 is spirally wound, a feed roller 64 for feeding the polishing band 60 from the reel 63, and a feed roller 64 positioned between the reel 63 and the feed roller 64. Polishing head 6 that presses the polished belt 60 against the inclined surfaces E1 and E2 of the workpiece W.
5 and a guide roller 66 for guiding the unwound polishing band 60, and each member except the polishing band 60 is attached to a common support frame 67. Each of the polishing heads 65 has a pressing surface 65a parallel to the inclined surfaces E1 and E2 of the work W, and presses the polishing band 60 against the inclined surfaces E1 and E2 with the pressing surface 65a. The polishing heads 65, 65 are respectively symmetrically attached to the support frame 67 by brackets 68, and the polishing heads 65, 65 can simultaneously polish the inclined surfaces E 1, E 2 on both surfaces of the work. The support frame 67 includes a polishing head 65,
65 can move in the direction of coming and going with respect to the workpiece W.

One of the peripheral side polishing portions 62 includes a reel 70 in which the polishing band 60 is spirally wound, a feed roller 71 for feeding the polishing band 60 from the reel 70, and a portion between the reel 70 and the feed roller 71. And a guide roller 73 for guiding the unwound polishing band 60 against the peripheral side surface E3 of the work W, and a guide roller 73 for guiding the unwound polishing band 60. Each member except the polishing band 60 is supported. It is attached to a frame 74. The polishing head 72 has a pressing surface 72a parallel to the peripheral side surface of the work.
And is attached to the support frame 74 by two brackets 75, 75. The support frame 74 is movable in a direction in which the polishing head 65 comes into contact with and separates from the work w. The peripheral side polishing unit 62 is basically made of the same member as the inclined surface polishing unit 61 except for the polishing head 72. The polishing head 72 is a polishing head 65 for polishing an inclined surface.
By changing the path of the polishing band 60 in exchange for 65, the polishing band 60 can be used as the inclined surface polishing section 61.

When the outer peripheral edge of the workpiece W is polished by the edge polishing mechanism 12A, the inclined surfaces E1 and E2 on both surfaces of the work are polished by the inclined surface polishing portion 61 and the peripheral side polishing portion 62.
2 and the peripheral side surface E3 are simultaneously polished. When the polishing of the work surface is performed after the polishing of the edge, the inclined surface polishing portion 61 and the peripheral surface polishing portion 62 are separated from the work W by the displacement of the support frames 67 and 74, respectively.

In each of the above embodiments, the work W and the surface plate 11
Although a and 11b are arranged horizontally and polished while rotating them around a vertical axis, respectively, the work W and both stools 11a and 11b are arranged vertically and each is laid around a horizontal axis. It is also possible to configure so as to grind while rotating.

FIGS. 8 and 9 schematically show the main part of such a vertical polishing apparatus. In the figure, reference numeral 80 denotes a polishing tank in which a support roller 81 for vertically supporting the work W is attached, and first and second platens 82a and 82b for polishing both surfaces of the work W are relatively opposed to each other. The drive shafts 83 of the platens 82a and 82b penetrate the tank wall of the polishing tank 80 so as to be liquid-tight and relatively movable, and extend out of the tank, and to a motor (not shown). Are linked. An edge polishing drum 84 is accommodated inside the polishing tank 80 so as to rotate around a horizontal axis, and the drum shaft 84a penetrates the tank wall of the polishing tank 80 in a liquid-tight manner and extends outside the tank. , And a motor (not shown). The work W can be moved and rocked by supporting the polishing tank 80 and the edge polishing drum 84 on the moving mechanism 43 also serving as a rocking mechanism as in the first embodiment. 82a, 82
b is supported by a moving mechanism (not shown) also serving as a swing mechanism as in the second embodiment, so that
a, 82b can be moved and rocked.

In each of the above embodiments, the surface plates 11a, 11b,
Disc-shaped ones in which a polishing pad is attached to the entire surface of the substrate are illustrated as 82a and 82b, but the platen may be annular. In each of the above embodiments, the polishing liquid may be contained in the polishing tank so that the work and the upper and lower platens are immersed, and the work may be polished in the polishing liquid.

[0044]

As described above, according to the present invention, in a composite polishing apparatus capable of performing both polishing of the surface of the work and polishing of the outer peripheral edge, when polishing the outer peripheral edge, the work is polished by two platens. It is possible to easily and efficiently drive and rotate without generating a sliding contact and a difference in rotation speed between the two.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a main part showing a first embodiment of a double-side polishing apparatus according to the present invention.

FIG. 2 is a plan view of a main part of the polishing apparatus.

FIG. 3 is a sectional view of a main part showing a second embodiment of the double-side polishing apparatus according to the present invention.

FIG. 4 is a plan view of a main part of the polishing apparatus.

FIG. 5 is a main part side view showing a modification of the surface plate.

FIG. 6 is a main part plan view showing another example of the edge polishing mechanism used in the present invention.

FIG. 7 is a side sectional view of FIG. 6;

FIG. 8 is a sectional view schematically showing a main part of a third embodiment of the present invention.

FIG. 9 is a side view of FIG.

FIG. 10 is a front view showing a conventional double-side polishing apparatus in principle.

FIG. 11 is a side view of FIG. 10;

[Explanation of symbols]

 10A, 10B Polishing device 11a, 11b, 82a, 82b Surface plate 12, 12A Edge polishing mechanism 13 Airframe 17, 20 Motor 40, 81 Support roller 43, 50 Moving mechanism 44, 51 Linear guide 45, 52 Movable table 46, 53 Table Moving means 60 Polishing band 61 Inclined surface polishing section 62 Peripheral side surface polishing section W Work E1, E2 Inclined surface E3 Peripheral side surface

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/304 621 H01L 21/304 621E F term (Reference) 3C043 BC06 CC04 CC12 3C049 AA07 AA11 AA18 BC02 CA05 CB03 3C058 AA07 AA11 AA18 BC02 CA05 CB03 DA17

Claims (7)

[Claims] 1. A plurality of support rollers which abut against the outer periphery of a disk-shaped work and rotatably support the work around a central axis, and a pair of opposed rollers each having a smaller diameter than the work for polishing both surfaces of the work. Polishing plate, using a polishing device equipped with an edge polishing mechanism for polishing the outer peripheral edge of the work, the pair of platens concentrically contact the center of both surfaces of the work, in the same direction to each other By rotating, while rotating the work using these surface plates as driving means, the outer peripheral edge of the work is polished by the edge polishing means, and then the pair of surface plates are moved to a position near one end in the radial direction of the work. Moved to abut on both sides of the work in an eccentric state,
By rotating these platens in the same direction,
A method for polishing a work, characterized in that both sides of the work are polished with these two platens while the work is driven and rotated by frictional force. 2. The polishing method according to claim 1, wherein during the step of polishing both surfaces of the work with the two bases, the base and the work are relatively swung in the radial direction of the work. Characterized by the following. 3. A plurality of support rollers which are in contact with the outer periphery of a disk-shaped work and rotatably support the work around a central axis, and are disposed on both sides of the work to polish the surface of the work. A pair of opposite polishing plates having a smaller diameter than the work, a motor for driving and rotating these surface plates, and an outer peripheral edge of the work. An edge polishing mechanism for polishing the workpiece, at the time of polishing the work edge by the edge polishing mechanism,
The two surface plates abut the center of the work concentrically and occupy a driving position for rotating the work, and when the surface of the work is polished by the two surface plates, these surface plates are at one end in the radial direction of the work. A work mechanism for relatively moving the two surface plates and the work so as to occupy a polishing position for polishing the work by abutting on a eccentric state at a near position; Polishing equipment. 4. The polishing apparatus according to claim 3, wherein the moving mechanism is a linear guide attached to the machine body and extending in a direction along a radius of the work; a movable table movable along the linear guide; Table moving means for moving the movable table along the linear guide, and each of the support rollers or a pair of platens is supported on the movable table so as to move together with the movable table. That are characterized by 5. A swinging mechanism according to claim 3, wherein when the work surface is polished by two surface plates, the surface plate and the work are relatively swung in the radial direction of the work. Characterized by having: 6. A polishing apparatus according to claim 5, wherein said moving mechanism also serves as a swing mechanism. 7. The polishing apparatus according to claim 3, wherein the edge polishing mechanism is configured to polish two inclined surfaces on both sides of an outer peripheral portion of the work with a polishing band, and a peripheral side surface of the work with a polishing band. And a peripheral surface polishing portion for polishing the surface, and wherein the inclined surface polishing portion and the peripheral surface polishing portion are arranged at different positions from each other.