CN113211216A - Polishing equipment for semiconductor silicon wafer - Google Patents
Polishing equipment for semiconductor silicon wafer Download PDFInfo
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- CN113211216A CN113211216A CN202110441648.2A CN202110441648A CN113211216A CN 113211216 A CN113211216 A CN 113211216A CN 202110441648 A CN202110441648 A CN 202110441648A CN 113211216 A CN113211216 A CN 113211216A
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- Prior art keywords
- polishing
- silicon wafer
- position adjusting
- pressing
- seat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to the technical field of silicon wafers, in particular to polishing equipment for semiconductor silicon wafers, which comprises a silicon wafer position adjusting mechanism, a polishing station main rotating turntable, a plurality of polishing station sub-rotating assemblies, a polishing position adjusting assembly, a polishing bearing assembly and a pressing assembly, wherein the silicon wafer position adjusting mechanism is arranged on a rack, the polishing station main rotating turntable is rotationally connected with the rack, the polishing station main rotating turntable is provided with the plurality of polishing station sub-rotating assemblies which are circumferentially distributed on the polishing station main rotating turntable, each polishing station sub-rotating assembly is provided with the polishing position adjusting assembly, the polishing position adjusting assembly is in transmission connection with the polishing bearing assembly, the upper polishing bearing assembly is provided with the pressing assembly for pressing the silicon wafer to be polished, and the pressing assembly is rotationally connected with the polishing bearing assembly; the polishing mechanism is arranged on the rack, is positioned beside the silicon wafer position adjusting mechanism and is used for polishing the silicon wafer to be polished; the dropping liquid component is arranged on the frame and is positioned on the silicon wafer.
Description
Technical Field
The invention relates to the technical field of silicon wafers, in particular to polishing equipment for a semiconductor silicon wafer.
Background
The semiconductor silicon wafer is a main substrate material for manufacturing a super large scale integrated circuit, along with the rapid development of the semiconductor industry, the precision requirement on the substrate material is higher and higher, and the outer circumferential surface of the silicon wafer needs to be polished during substrate processing, so that the edge of the silicon wafer is ensured not to generate defects during subsequent processing, the stress concentration is reduced, the fragment rate is reduced, and the yield is further improved. The edge polishing of the silicon wafer is generally finished on special polishing equipment, and the edge polishing is realized by adopting a mechanochemical polishing method under the process conditions of certain pressure and rotating speed by using polishing solution and polishing cloth.
The silicon wafer is required to have uniform surface roughness after polishing, and if a certain portion of the outer circumferential surface is insufficiently polished or has defects such as scratches, the problem of polycrystalline grain aggregation is easily caused in the subsequent process. The prior polishing mode has dead corners during polishing, which can lead to insufficient polishing.
Disclosure of Invention
In order to solve the technical problem, the technical scheme provides the polishing equipment for the semiconductor silicon wafer, solves the problem of insufficient polishing and realizes the sufficient polishing of the silicon wafer.
In order to achieve the above purposes, the technical scheme adopted by the invention is as follows:
the present invention provides a polishing apparatus for a semiconductor silicon wafer, comprising:
a frame;
the polishing device comprises a frame, a silicon wafer position adjusting mechanism, a polishing station main rotating turntable, a polishing position adjusting assembly and a polishing bearing assembly, wherein the silicon wafer position adjusting mechanism is arranged on the frame and is provided with a polishing station main rotating turntable which is rotationally connected with the frame;
the polishing mechanism is arranged on the rack, is positioned beside the silicon wafer position adjusting mechanism and is used for polishing the silicon wafer to be polished;
and the dropping liquid component is arranged on the rack, is positioned beside the silicon wafer position adjusting mechanism and is used for dropping polishing liquid on the silicon wafer to be polished before the polishing mechanism polishes.
Optionally, the silicon wafer position adjusting mechanism comprises:
the cam divider is arranged on the frame;
the polishing station total rotating turntable is in transmission connection with an output shaft of the cam divider and is in rotating connection with the frame;
the polishing stations are divided into rotating assemblies which are circumferentially distributed on the polishing station main rotating turntable;
the polishing position adjusting assemblies are equal in number and correspond to the polishing station sub-rotating assemblies one by one, and the polishing position adjusting assemblies are arranged on the corresponding polishing station sub-rotating assemblies;
the polishing bearing assemblies are equal in number and correspond to the polishing position adjusting assemblies one by one, and the polishing bearing assemblies are in transmission connection with output shafts of the corresponding polishing position adjusting assemblies;
and each polishing bearing component is provided with two pressing components which are arranged in pairs, and the pressing components which are arranged in pairs are circumferentially distributed on the corresponding polishing bearing component.
Optionally, the polishing station sub-rotating assembly comprises:
the motor mounting seat is mounted on the polishing station main rotating turntable;
the sub-rotation driving motor is arranged on the motor mounting seat;
the polishing station divides the rotary table, rotates with the pivot seat of fixing on the total rotary table of polishing station and is connected, divide rotary drive motor's output shaft to be connected with through the driving of belt pulley group the polishing station divides the rotary table, the belt pulley group with the pivot seat rotates to be connected.
Optionally, the polishing position adjusting assembly includes:
the first screw rod sliding table is arranged on the polishing station sub-rotating turntable;
the base is in transmission connection with the output end of the first screw rod sliding table;
a first rotary driving motor disposed on the base;
the second rotary driving motor is arranged on the base and is positioned on the side part of the first rotary driving motor;
and the rotating gear is in transmission connection with an output shaft of the second rotating driving motor.
Optionally, the polishing carrier assembly comprises:
the station disc is in transmission connection with an output shaft of the first rotary driving motor, and a placing groove for placing a silicon wafer to be polished is coaxially arranged at the center of the station disc;
the pressing base plate is in transmission connection with an output shaft of the second rotary driving motor and is in rotation connection with the station disc, the inner diameter of the pressing base plate is matched with the outer diameter of the placing groove, and the outer ring of the pressing base plate is provided with insections meshed with the rotary gear.
Optionally, the pressing assembly comprises:
the pressing base is arranged on the pressing base plate;
the position adjusting motor is arranged on the pressing seat;
the screw rod is in transmission connection with an output shaft of the pressing seat;
the lifting seat is in threaded fit with the screw rod, and the pressing seat is provided with a guide rail in sliding fit with the lifting seat;
two lifting cylinders are arranged at two ends of the lifting seat;
and the pressing plate is in transmission connection with output shafts of the two lifting cylinders and is used for pressing the silicon wafer to be polished.
Optionally, an output shaft of the lifting cylinder is sleeved with a first damping spring, one end of the first damping spring abuts against the pressing plate, and the other end of the first damping spring abuts against the lifting seat.
Optionally, the polishing mechanism comprises;
a polishing frame mounted on the frame and located at a side of the silicon wafer position adjusting mechanism;
the second screw rod sliding table is arranged on the polishing rack;
the polishing movable seat is in transmission connection with an output shaft of the second screw rod sliding table, and the second screw rod sliding table is used for driving the polishing movable seat to move along the horizontal direction;
the polishing base is arranged on the polishing movable seat and is rotationally connected with the polishing movable seat;
the adjusting cylinder is arranged on the polishing movable seat, the cylinder body part of the adjusting cylinder is hinged with the polishing movable seat, and the output shaft of the adjusting cylinder is hinged with the polishing base;
a polishing driving motor installed on the polishing base;
and the polishing disk is in transmission connection with an output shaft of the polishing driving motor.
Optionally, a second damping spring is arranged on the polishing base.
Optionally, the drip assembly comprises:
the dropping liquid rack is arranged on the rack and positioned at the side part of the silicon wafer position adjusting mechanism;
the third screw rod sliding table is arranged on the liquid dropping rack;
the third screw rod sliding table is used for driving the fourth screw rod sliding table to move along the horizontal direction;
the liquid dropping seat is in transmission connection with an output shaft of a fourth screw rod sliding table, and the fourth screw rod sliding table is used for driving the liquid dropping seat to move along the vertical direction;
the liquid storage tank is arranged on the liquid dropping seat and filled with polishing liquid;
the liquid dropper is arranged on the liquid dropping seat and is used for dropping polishing liquid, and the liquid storage tank is communicated with the liquid dropper through a pump.
Compared with the prior art, the invention has the beneficial effects that: the polishing bearing assembly is driven to rotate in the rotation process of the polishing station main rotating turntable, the polishing bearing assembly is rotated to the position of the polishing mechanism, the polishing mechanism can polish the polishing bearing assembly located at the corresponding position of the polishing bearing assembly, the pressing assembly can press the silicon wafer placed on the polishing bearing assembly in the polishing process, in the polishing equipment, a polishing disc used for polishing by the polishing mechanism and described later is smaller than the area of the silicon wafer, the pressing assembly is controlled by the polishing bearing assembly to rotate along the silicon wafer when the polishing disc polishes, the silicon wafer can be always pressed when the polishing disc polishes, the polishing of the polishing disc is avoided being interfered, the pressed part of the silicon wafer is switched, the pressed part can be polished by the polishing disc in the continuous polishing process, and meanwhile, because the polishing bearing assembly and the polishing station sub-rotating assembly are in an eccentric relation, therefore, after the polishing bearing assembly is driven to rotate by the rotating assembly of the polishing station, the polishing bearing assembly can rotate eccentrically, and the polishing station is different from the traditional concentric rotation mode in which the polishing bearing assembly is contacted with the polishing disk to realize polishing, so that each part on a silicon wafer can be contacted with the polishing disk, and the polishing is more sufficient.
Drawings
FIG. 1 is a first perspective view of the present invention;
FIG. 2 is a schematic perspective view of the present invention;
FIG. 3 is a schematic view of the structure at the position regulating mechanism of the silicon wafer in the present invention;
FIG. 4 is a first schematic view of a polishing station rotating assembly according to the present invention;
FIG. 5 is a first schematic view of a polishing station rotating assembly according to the present invention;
FIG. 6 is a schematic view of the construction of the hold-down assembly of the present invention;
FIG. 7 is a first schematic view of the polishing mechanism according to the present invention;
FIG. 8 is a second schematic view of the polishing mechanism according to the present invention;
fig. 9 is a schematic view of the structure of the dropping mechanism of the present invention.
The reference numbers in the figures are:
1-a frame;
2-silicon wafer position adjusting mechanism; 21-a cam divider; 22-polishing station total rotating turntable; 23-polishing station sub-rotating assembly; 231-motor mount; 232-minute rotary drive motor; 233-pulley sets; 234-rotating shaft seat; 235-the polishing station separately rotates the turntable; 24-a polishing position adjustment assembly; 241-a first screw rod sliding table; 242-a base; 243-a first rotary drive motor; 244 — a second rotary drive motor; 245-a rotating gear; 25-polishing the carrier assembly; 251-a station disk; 252-compressing the substrate; 253-insection; 254-placing the groove; 26-a hold down assembly; 261-a compression seat; 262-a position adjustment motor; 263-screw rod; 264-lifting seat; 265-guide rail; 266-a lifting cylinder; 267-a pressure plate; 268 — a first damping spring;
3-a polishing mechanism; 31-a polishing machine frame; 32-a second screw rod sliding table; 33-polishing movable seat; 34-a regulating cylinder; 35-polishing the base; 36-polishing drive motor; 37-a polishing disk; 38-a second damping spring;
4-a drip assembly; 41-dropping liquid rack; 42-a third screw rod sliding table; 43-a fourth screw rod sliding table; 44-drip seat; 45-a liquid storage tank; 46-a pump; 47-liquid dropper.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art.
As a preferred embodiment of the present invention, the present invention discloses a polishing apparatus for a semiconductor silicon wafer, comprising:
a frame;
the silicon wafer position adjusting mechanism is arranged on the rack, a polishing station main rotating turntable which is rotationally connected with the rack is arranged on the polishing station main rotating turntable, a plurality of polishing station sub-rotating assemblies which are circumferentially distributed on the polishing station main rotating turntable are arranged on the polishing station main rotating turntable, a polishing position adjusting assembly is arranged on each polishing station sub-rotating assembly, a polishing bearing assembly is connected to the polishing position adjusting assembly in a transmission mode and used for carrying a silicon wafer to be polished, the polishing bearing assemblies and the corresponding polishing station sub-rotating assemblies are in an eccentric relation, a pressing assembly used for pressing the silicon wafer to be polished is arranged on each polishing bearing assembly, and the pressing assembly is rotationally connected with the polishing bearing assembly;
the polishing mechanism is arranged on the rack, is positioned beside the silicon wafer position adjusting mechanism and is used for polishing the silicon wafer to be polished;
and the dropping liquid component is arranged on the rack, is positioned beside the silicon wafer position adjusting mechanism and is used for dropping polishing liquid on the silicon wafer to be polished before the polishing mechanism polishes.
In the polishing equipment for the semiconductor silicon wafer, the polishing bearing component is driven to rotate in the rotation process of the polishing station total rotating turntable, the polishing bearing component is rotated to the position of the polishing mechanism, the polishing mechanism polishes the polishing bearing component positioned at the corresponding position of the polishing mechanism, the pressing component can press the silicon wafer placed on the polishing bearing component during polishing, in the polishing equipment, a polishing disk used for polishing by the polishing mechanism and described later is smaller than the area of the silicon wafer, the pressing component is controlled by the polishing bearing component to rotate along the silicon wafer during polishing of the polishing disk, the pressing of the silicon wafer can be always kept during polishing of the polishing disk, the polishing of the polishing disk is avoided being interfered, the switching of the pressed parts of the silicon wafer is realized, the pressed parts can be polished by the polishing disk during continuous polishing, and simultaneously, because the polishing bearing component and the polishing station partial rotating component are in an eccentric relation, therefore, after the polishing bearing assembly is driven to rotate by the rotating assembly of the polishing station, the polishing bearing assembly can rotate eccentrically, and the polishing station is different from the traditional concentric rotation mode in which the polishing bearing assembly is contacted with the polishing disk to realize polishing, so that each part on a silicon wafer can be contacted with the polishing disk, and the polishing is more sufficient.
Preferred embodiments of the polishing apparatus for semiconductor silicon wafers according to the present invention will be described below with reference to the accompanying drawings.
Referring to fig. 1 to 9, the polishing apparatus includes:
the silicon wafer position adjusting mechanism 2 is installed on the rack 1, a polishing station main rotating turntable 22 which is rotatably connected with the rack 1 is arranged on the polishing station main rotating turntable 22, a plurality of polishing station sub-rotating assemblies 23 which are circumferentially distributed on the polishing station main rotating turntable 22 are arranged on the polishing station main rotating turntable 22, a polishing position adjusting assembly 24 is arranged on each polishing station sub-rotating assembly 23, a polishing bearing assembly 25 is connected to the polishing position adjusting assembly 24 in a transmission mode, the polishing bearing assembly 25 is used for carrying a silicon wafer to be polished, the polishing bearing assembly 25 and the corresponding polishing station sub-rotating assemblies 23 are in an eccentric relation, a pressing assembly 26 which is used for pressing the silicon wafer to be polished is arranged on the polishing bearing assembly 25, and the pressing assembly 26 is rotatably connected with the polishing bearing assembly 25.
And the polishing mechanism 3 is arranged on the frame 1 and positioned beside the silicon wafer position adjusting mechanism 2 and is used for polishing the silicon wafer to be polished.
And the dropping component 4 is arranged on the frame 1, is positioned beside the silicon wafer position adjusting mechanism 2 and is used for dropping polishing liquid on the silicon wafer to be polished before the polishing mechanism 3 polishes the silicon wafer.
When polishing is needed, a silicon wafer to be polished is placed on a polishing bearing component 25 of one silicon wafer position adjusting mechanism 2, then a polishing station total rotating turntable 22 is controlled to rotate, the polishing bearing component 25 is driven to rotate in the rotating process of the polishing station total rotating turntable 22, the polishing bearing component 25 is rotated to the position of a polishing mechanism 3, the polishing mechanism 3 polishes the polishing bearing component 25 located at the corresponding position, in the polishing process, a pressing component 26 presses the silicon wafer placed on the polishing bearing component 25, in the polishing device, a polishing disc 37, which is described later and used for polishing, of the polishing mechanism 3 is smaller than the area of the silicon wafer, the pressing component 26 is controlled by the polishing bearing component 25 to rotate along the silicon wafer when the polishing disc 37 polishes, and the silicon wafer can be always pressed when the polishing disc 37 polishes, and the interference to the polishing of the polishing disk 37 is avoided, the switching of the pressed parts of the silicon wafer is realized, the pressed parts are polished by the polishing disk 37 in the continuous polishing process, and meanwhile, because the polishing bearing component 25 and the polishing station sub-rotating component 23 are in an eccentric relation, after the polishing bearing component 25 is driven to rotate by the polishing station sub-rotating component 23, the polishing bearing component 25 can perform eccentric rotation, which is different from the traditional concentric rotation and polishing disk contact to realize polishing, and in this way, every part on the silicon wafer can be in contact with the polishing disk 37. The dropping component 4 drops polishing liquid on the surface of the silicon wafer before the polishing mechanism 3 polishes, so that the subsequent polishing mechanism 3 can polish conveniently.
Referring to fig. 3 to 6, in detail, the silicon wafer position adjusting mechanism 2 includes:
the cam divider 21 is installed on the frame 1, and because the polishing bearing assemblies 25 are circumferentially distributed on the polishing station total rotating turntable 22, the rotation angle of the polishing station total rotating turntable 22 can be controlled by adopting the cam divider 21, and the process flow switching of silicon wafer feeding-dripping-polishing-blanking placed on each polishing bearing assembly 25 is accurately realized.
And the polishing station total rotating turntable 22 is in transmission connection with an output shaft of the cam divider 21, and the polishing station total rotating turntable 22 is in rotating connection with the frame 1.
A plurality of polishing stations are divided into rotating assemblies 23 which are circumferentially distributed on the polishing station general rotating turntable 22.
And the polishing position adjusting assemblies 24 are equal in number and correspond to the polishing station sub-rotating assemblies 23 one by one, and the polishing position adjusting assemblies 24 are arranged on the corresponding polishing station sub-rotating assemblies 23.
The polishing position adjusting assembly 24 is used for adjusting the eccentric distance of the polishing bearing assembly 25 relative to the center of the polishing station sub-rotating assembly 23 corresponding to the polishing bearing assembly 25, and under different eccentric distances, when the polishing bearing assembly 25 rotates under the control of the polishing station sub-rotating assembly 23, the polishing disc 37 can be contacted with each position of the silicon wafer to polish.
And the polishing bearing assemblies 25 are equal in number and correspond to the polishing position adjusting assemblies 24 one by one, and the polishing bearing assemblies 25 are in transmission connection with the output shafts of the corresponding polishing position adjusting assemblies 24.
And each polishing bearing component 25 is provided with two pressing components 26 which are arranged in pairs, and the pressing components 26 which are arranged in pairs are circumferentially distributed on the corresponding polishing bearing component 25.
The polishing station sub-rotating unit 23 includes:
and the motor mounting seat 231 is mounted on the polishing station general rotating turntable 22. And a sub-rotation driving motor 232 mounted on the motor mount 231. The polishing station sub-rotating turntable 235 is rotatably connected with a rotating shaft seat 234 fixed on the polishing station main rotating turntable 22, an output shaft of the sub-rotating drive motor 232 is in transmission connection with the polishing station sub-rotating turntable 235 through a belt pulley set 233, and the belt pulley set 233 is rotatably connected with the rotating shaft seat 234.
When the sub-rotary driving motor 232 arranged on the motor mounting seat 231 works, the sub-rotary turntable 235 of the polishing station is driven to rotate through the belt pulley set 233, so that the polishing position adjusting component 24 and the polishing bearing component 25 arranged on the sub-rotary turntable rotate, and when the polishing bearing component 25 rotates, the silicon wafer and the polishing disc 37 in the rotating process can be polished without dead angles.
The polishing position adjusting assembly 24 includes:
and the first screw rod sliding table 241 is arranged on the polishing station sub-rotating turntable 235. And the base 242 is in transmission connection with the output end of the first screw rod sliding table 241. The first rotary drive motor 243 is provided on the base 242. And a second rotary driving motor 244 provided on the base 242 and located at a side of the first rotary driving motor 243. The rotary gear 245 is drivingly connected to an output shaft of the second rotary drive motor 244.
The polishing carrier assembly 25 includes:
and a station disc 251 which is in transmission connection with an output shaft of the first rotary driving motor 243, wherein a placing groove 254 for placing the silicon wafer to be polished is coaxially arranged at the center of the station disc 251.
And the pressing base plate 252 is in transmission connection with an output shaft of the second rotary driving motor 244 and is in rotational connection with the station disc 251, the inner diameter of the pressing base plate 252 is matched with the outer diameter of the placing groove 254, and the outer ring of the pressing base plate 252 is provided with insections 253 meshed with the rotary gear 245.
The first screw rod sliding table 241 is used for adjusting the eccentric distance of the polishing bearing assembly 25 relative to the center of the polishing station sub-rotating assembly 23 corresponding to the first screw rod sliding table, and under different eccentric distances, when the polishing bearing assembly 25 rotates under the control of the polishing station sub-rotating assembly 23, the polishing disk 37 can contact with each position of the silicon wafer to polish. When the first rotary driving motor 243 and the second rotary driving motor 244 mounted on the base 242 rotate, the station disk 251 and the rotary gear 245 are respectively driven to rotate, when the station disk 251 rotates, the pressing base plate 252 and the silicon wafer carried thereon are driven to rotate, and during the rotation of the silicon wafer, the silicon wafer is polished in cooperation with the rotation of the upper polishing disk 37. When the rotating gear 245 rotates, the pressing base plate 252 is driven to rotate by the meshing of the rotating gear 245 and the insections 253, and the position of the pressing assembly 26 thereon is adjusted, so that the pressing position of the pressing assembly 26 is changed.
The hold-down assembly 26 includes:
and a pressing base 261 mounted on the pressing base plate 252. And a position adjusting motor 262 installed on the pressing base 261. And the screw rod 263 is in transmission connection with an output shaft of the pressing seat 261. The lifting seat 264 is in threaded fit with the screw rod 263, and the pressing seat 261 is provided with a guide rail 265 in sliding fit with the lifting seat 264. Two lifting cylinders 266 are installed at both ends of the lifting base 264. And the pressure plate 267 is in transmission connection with the output shafts of the two lifting cylinders 266 and is used for pressing the silicon wafer to be polished. A first damping spring 268 is sleeved outside an output shaft of the lifting cylinder 266, one end of the first damping spring 268 abuts against the pressure plate 267, and the other end of the first damping spring 268 abuts against the lifting seat 264.
The height of the pressing plate 267 can be adjusted through the position adjusting motor 262 and the lifting cylinder 266, so that the silicon wafer is pressed, and the pressing plate 267 can be protected by the arrangement of the first damping spring 268.
Referring to fig. 7 and 8, the polishing mechanism 3 includes.
And a polishing frame 31 mounted on the frame 1 at a side of the silicon wafer position adjusting mechanism 2. And a second screw rod sliding table 32 mounted on the polishing machine frame 31. And the polishing movable seat 33 is in transmission connection with an output shaft of the second screw rod sliding table 32, and the second screw rod sliding table 32 is used for driving the polishing movable seat 33 to move along the horizontal direction. And a polishing base 35 disposed on the polishing movable base 33 and rotatably connected to the polishing movable base 33. And the adjusting cylinder 34 is arranged on the polishing movable seat 33, the cylinder body part of the adjusting cylinder 34 is hinged with the polishing movable seat 33, and the output shaft of the adjusting cylinder 34 is hinged with the polishing base 35. And a polishing driving motor 36 mounted on the polishing base 35. And the polishing disk 37 is in transmission connection with an output shaft of the polishing driving motor 36. The polishing base 35 is provided with a second damper spring 38.
The second screw slide 32 is used for adjusting the distance of the front projection of the polishing disk 37, and the adjusting cylinder 34 is used for adjusting whether the polishing disk 37 will perform the polishing process.
Referring to fig. 9, the dropping unit 4 includes:
the dropping frame 41 is mounted on the frame 1 and located on the side of the silicon wafer position adjusting mechanism 2. And the third screw rod sliding table 42 is installed on the liquid dropping rack 41. And the fourth screw rod sliding table 43 is in transmission connection with an output shaft of the third screw rod sliding table 42, and the third screw rod sliding table 42 is used for driving the fourth screw rod sliding table 43 to move along the horizontal direction. And the liquid dropping seat 44 is in transmission connection with an output shaft of the fourth screw rod sliding table 43, and the fourth screw rod sliding table 43 is used for driving the liquid dropping seat 44 to move along the vertical direction. And a liquid storage tank 45 mounted on the liquid dropping seat 44 and filled with polishing liquid. And a liquid dropping head 47 disposed on the liquid dropping seat 44 for dropping the polishing liquid, wherein the liquid storage tank 45 is communicated with the liquid dropping head 47 through a pump 46.
The third screw rod sliding table 42 and the fourth screw rod sliding table 43 are respectively used for adjusting the position of the liquid dropping head 47, and when the pump 46 works, polishing liquid in the liquid storage tank 45 can drop through the liquid dropping head 47.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. A polishing apparatus for a semiconductor silicon wafer, characterized by comprising:
a frame (1);
a silicon wafer position adjusting mechanism (2) which is arranged on the frame (1) and is provided with a polishing station total rotating turntable (22) rotationally connected with the frame (1), a plurality of polishing station sub-rotating assemblies (23) which are circumferentially distributed on the polishing station main rotating turntable (22) are arranged on the polishing station main rotating turntable (22), a polishing position adjusting assembly (24) is arranged on each polishing station sub-rotating assembly (23), the polishing position adjusting component (24) is in transmission connection with a polishing bearing component (25), the polishing bearing component (25) is used for carrying a silicon wafer to be polished, and the polishing bearing component (25) and the corresponding polishing station sub-rotating component (23) are in an eccentric relation, a pressing component (26) for pressing the silicon wafer to be polished is arranged on the polishing bearing component (25), the pressing component (26) is rotationally connected with the polishing bearing component (25);
the polishing mechanism (3) is arranged on the rack (1), is positioned beside the silicon wafer position adjusting mechanism (2) and is used for polishing the silicon wafer to be polished;
and the dropping component (4) is arranged on the frame (1), is positioned beside the silicon wafer position adjusting mechanism (2), and is used for dropping polishing liquid on the silicon wafer to be polished before the polishing mechanism (3) polishes.
2. A polishing apparatus for semiconductor silicon wafers as set forth in claim 1, characterized in that the silicon wafer position adjusting mechanism (2) comprises:
the cam divider (21) is arranged on the frame (1);
the polishing station total rotating turntable (22) is in transmission connection with an output shaft of the cam divider (21), and the polishing station total rotating turntable (22) is in rotating connection with the rack (1);
the polishing station sub-rotating assemblies (23) are circumferentially distributed on the polishing station main rotating turntable (22);
the polishing position adjusting assemblies (24) are equal in number and correspond to the polishing station sub-rotating assemblies (23) one by one, and the polishing position adjusting assemblies (24) are arranged on the corresponding polishing station sub-rotating assemblies (23);
the polishing bearing assemblies (25) are equal in number and correspond to the polishing position adjusting assemblies (24) one by one, and the polishing bearing assemblies (25) are in transmission connection with output shafts of the corresponding polishing position adjusting assemblies (24);
and each polishing bearing component (25) is provided with two pressing components (26) which are arranged in pairs, and the pressing components (26) which are arranged in pairs are circumferentially distributed on the corresponding polishing bearing component (25).
3. A polishing apparatus for semiconductor silicon wafers as set forth in claim 2, wherein the polishing station minute rotating assembly (23) comprises:
the motor mounting seat (231) is mounted on the polishing station main rotating turntable (22);
a sub-rotation driving motor (232) mounted on the motor mounting seat (231);
polishing station divides swivel turntable (235), rotates with pivot seat (234) of fixing on polishing station total swivel turntable (22) to be connected, the output shaft that divides rotary drive motor (232) is connected with through pulley group (233) transmission polishing station divides swivel turntable (235), pulley group (233) with pivot seat (234) rotate to be connected.
4. A polishing apparatus for semiconductor silicon wafers as set forth in claim 3, wherein the polishing position adjusting assembly (24) comprises:
the first screw rod sliding table (241) is arranged on the polishing station sub-rotating turntable (235);
the base (242) is in transmission connection with the output end of the first screw rod sliding table (241);
a first rotary drive motor (243) provided on the base (242);
a second rotary driving motor (244) provided on the base (242) and located at a side of the first rotary driving motor (243);
and a rotating gear (245) which is in transmission connection with an output shaft of the second rotating and driving motor (244).
5. A polishing equipment for semiconductor silicon wafers as set forth in claim 4 characterized in that the polishing carrier assembly (25) comprises:
the station disc (251) is in transmission connection with an output shaft of a first rotary driving motor (243), and a placing groove (254) for placing a silicon wafer to be polished is coaxially arranged at the center of the station disc (251);
and the pressing base plate (252) is in transmission connection with an output shaft of the second rotary driving motor (244) and is in rotary connection with the station disc (251), the inner diameter of the pressing base plate (252) is matched with the outer diameter of the placing groove (254), and the outer ring of the pressing base plate (252) is provided with insections (253) meshed with the rotary gear (245).
6. A polishing apparatus for semiconductor silicon wafers as set forth in claim 5 wherein the hold-down assembly (26) comprises:
a pressing base (261) mounted on the pressing substrate (252);
a position adjusting motor (262) mounted on the pressing base (261);
the screw rod (263) is in transmission connection with an output shaft of the pressing seat (261);
the lifting seat (264) is in threaded fit with the screw rod (263), and the pressing seat (261) is provided with a guide rail (265) in sliding fit with the lifting seat (264);
two lifting cylinders (266) which are arranged at two ends of the lifting seat (264);
and the pressure plate (267) is in transmission connection with output shafts of the two lifting cylinders (266) and is used for pressing the silicon wafer to be polished.
7. A semiconductor silicon wafer polishing device according to claim 1, characterized in that the output shaft of the elevating cylinder (266) is externally sleeved with a first damping spring (268), one end of the first damping spring (268) abuts against the pressure plate (267), and the other end of the first damping spring (268) abuts against the elevating seat (264).
8. A polishing apparatus for semiconductor silicon wafers as set forth in claim 1 characterized in that the polishing mechanism (3) comprises;
a polishing frame (31) mounted on the frame (1) and located at the side of the silicon wafer position adjusting mechanism (2);
the second screw rod sliding table (32) is arranged on the polishing rack (31);
the polishing movable seat (33) is in transmission connection with an output shaft of the second screw rod sliding table (32), and the second screw rod sliding table (32) is used for driving the polishing movable seat (33) to move along the horizontal direction;
the polishing base (35) is arranged on the polishing movable seat (33) and is rotationally connected with the polishing movable seat (33);
the adjusting cylinder (34) is arranged on the polishing movable seat (33), the cylinder body part of the adjusting cylinder (34) is hinged with the polishing movable seat (33), and the output shaft of the adjusting cylinder (34) is hinged with the polishing base (35);
a polishing drive motor (36) mounted on the polishing base (35);
and the polishing disc (37) is in transmission connection with an output shaft of the polishing driving motor (36).
9. A semiconductor silicon wafer polishing apparatus according to claim 8, characterized in that the polishing base (35) is provided with a second damper spring (38).
10. A polishing apparatus for semiconductor silicon wafers as set forth in claim 1 wherein the dropping liquid assembly (4) comprises:
a dropping liquid frame (41) which is arranged on the frame (1) and is positioned at the side part of the silicon wafer position adjusting mechanism (2);
the third screw rod sliding table (42) is arranged on the liquid dropping rack (41);
the fourth screw rod sliding table (43) is in transmission connection with an output shaft of the third screw rod sliding table (42), and the third screw rod sliding table (42) is used for driving the fourth screw rod sliding table (43) to move along the horizontal direction;
the liquid dropping seat (44) is in transmission connection with an output shaft of the fourth screw rod sliding table (43), and the fourth screw rod sliding table (43) is used for driving the liquid dropping seat (44) to move along the vertical direction;
a liquid storage tank (45) which is arranged on the liquid dropping seat (44) and is filled with polishing liquid;
the liquid dropping head (47) is arranged on the liquid dropping seat (44) and used for dropping polishing liquid, and the liquid storage tank (45) is communicated with the liquid dropping head (47) through a pump (46).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110441648.2A CN113211216B (en) | 2021-04-23 | 2021-04-23 | Polishing equipment for semiconductor silicon wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110441648.2A CN113211216B (en) | 2021-04-23 | 2021-04-23 | Polishing equipment for semiconductor silicon wafer |
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| CN113211216B CN113211216B (en) | 2023-07-21 |
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| CN117260516A (en) * | 2023-11-22 | 2023-12-22 | 北京特思迪半导体设备有限公司 | Eccentric driving mechanism and polishing machine |
| CN117549157A (en) * | 2023-11-28 | 2024-02-13 | 南轩（天津）科技有限公司 | Rotary polishing head assembly for silicon wafer |
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| CN113211216B (en) | 2023-07-21 |
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