CN111775001A - Grinding equipment for controlling grinding surface shape of wafer - Google Patents

Grinding equipment for controlling grinding surface shape of wafer Download PDF

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Publication number
CN111775001A
CN111775001A CN202010748253.2A CN202010748253A CN111775001A CN 111775001 A CN111775001 A CN 111775001A CN 202010748253 A CN202010748253 A CN 202010748253A CN 111775001 A CN111775001 A CN 111775001A
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CN
China
Prior art keywords
wafer
grinding
sucker
lifting support
orientation
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Pending
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CN202010748253.2A
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Chinese (zh)
Inventor
王江涛
刘远航
赵德文
路新春
马旭
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Beijing Haike Technology Co ltd
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Beijing Haike Technology Co ltd
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Priority to CN202010748253.2A priority Critical patent/CN111775001A/en
Publication of CN111775001A publication Critical patent/CN111775001A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/22—Single-purpose machines or devices for particular grinding operations not covered by any other main group characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The invention discloses a grinding device for controlling the grinding surface shape of a wafer, which comprises: a table for supporting a plurality of chuck turntables; the sucking disc rotary table is used for holding the wafer and driving the wafer to rotate; the measuring unit is used for measuring the thickness of the wafer to obtain the grinding surface shape of the wafer; and the angle adjusting device is used for adjusting the sucker rotary table and is connected with the sucker rotary table so as to adjust the inclination angle of the sucker rotary table in at least two directions to adjust the grinding surface shape of the wafer. The invention can realize accurate control of the grinding surface shape of the wafer, and improves the processing effect and the manufacturing quality of the wafer, thereby providing technical guarantee for the stacking process of the ultra-high density semiconductor.

Description

Grinding equipment for controlling grinding surface shape of wafer
Technical Field
The invention relates to the technical field of semiconductor wafer processing, in particular to grinding equipment for controlling the grinding surface shape of a wafer.
Background
In the semiconductor industry, electronic circuits such as ICs (Integrated circuits) and LSIs (Large Scale Integrated circuits) are formed on the surface of a semiconductor wafer to manufacture semiconductor chips. Before the wafer is divided into semiconductor chips, the back surface of the wafer opposite to the device surface on which the electronic circuits are formed is ground by a grinding apparatus, thereby thinning the wafer to a predetermined thickness. The grinding of the back of the wafer can reduce the packaging volume of the chip and the packaging and mounting height, and the thickness of the chip after the back is thinned can even reach less than 5% of the initial thickness. Meanwhile, in order to increase the yield of the IC chip and reduce the unit manufacturing cost, the diameter of the wafer tends to be large, but the wafer is easy to generate warping deformation after the size of the wafer is increased, the requirement on surface shape precision is not easy to guarantee, and the processing effect is poor.
The thickness of the wafer is uneven after the wafer is thinned by using the prior art, the surface shape precision is difficult to ensure, and the subsequent process is influenced.
Disclosure of Invention
The embodiment of the invention provides grinding equipment for controlling the grinding surface shape of a wafer, and aims to at least solve one of the technical problems in the prior art.
The embodiment of the invention provides grinding equipment for controlling the grinding surface shape of a wafer, which comprises:
a table for supporting a plurality of chuck turntables;
the sucking disc rotary table is used for holding the wafer and driving the wafer to rotate and comprises a sucking disc, a rotating shaft and a supporting plate, wherein the sucking disc and the supporting plate are vertically stacked and sleeved on the rotating shaft so as to support the sucking disc to incline through the supporting plate;
the measuring unit is used for measuring the thickness and/or the appearance of the wafer; and
and the angle adjusting device is used for adjusting the sucker rotary table and is connected with the sucker rotary table so as to adjust the inclination angle of the sucker rotary table in at least two directions to adjust the grinding surface shape of the wafer.
In one embodiment, the angle adjustment device comprises a first lifting support and a second lifting support which are vertically liftable, and both the first lifting support and the second lifting support are connected between the support plate and the workbench to respectively raise or lower the support plate on two support points under the support of the workbench, so that the sucker turntable can respectively rotate around the first orientation and the second orientation.
In one embodiment, the angle adjusting device further includes a fixing support connected between the support plate and the worktable, wherein the fixing support, the first lifting support and the second lifting support are uniformly distributed along a circumferential direction of the sucker turntable.
In one embodiment, the fixed leg is located in the first orientation, the first and second lifting legs being symmetrically distributed about the first orientation;
the first lifting support and the second lifting support synchronously raise or lower the sucker turntable around respective pivots thereof to adjust an included angle between a central axis of the sucker turntable and the first orientation;
the first lifting support supports the sucker rotary table to act along a first direction, and the second lifting support supports the sucker rotary table to act along a second direction, so that the included angle between the central axis of the sucker rotary table and the second direction is adjusted, wherein the first direction and the second direction are opposite in direction and vertical direction.
In one embodiment, the fixed leg is in the second orientation, the first and second lifting legs being symmetrically distributed about the second orientation;
the first lifting support piece supports the sucker turntable to act along a first direction, and the second lifting support piece supports the sucker turntable to act along a second direction so as to adjust an included angle between a central axis of the sucker turntable and the first direction, wherein the first direction and the second direction are vertical and opposite in direction;
and the first lifting support piece and the second lifting support piece synchronously lift or lower the sucker rotary table around respective pivots thereof so as to adjust an included angle between the central axis of the sucker rotary table and the second orientation.
In one embodiment, the grinding apparatus further comprises a grinding tool having a grinding wheel for abutting the wafer to perform a grinding thinning process on the wafer;
the first orientation and the second orientation are orthogonal to the center of the sucker turntable, a rectangular coordinate system plane formed by the first orientation and the second orientation is parallel to the upper surface of the sucker turntable, and the first orientation is perpendicular to a connecting line of two end points of the grinding wheel, which are contacted with the wafer when the grinding wheel grinds the wafer.
In one embodiment, the first lifting support comprises a first connecting piece fastened on the support plate, a second connecting piece fastened on the workbench, a first support rod and a first driving unit, the first connecting piece is sleeved on the upper outer side of the first support rod so as to raise or lower the support plate through the first connecting piece, the second connecting piece is sleeved on the middle outer side of the first support rod so as to be supported on the workbench through the second connecting piece, and the bottom end of the first support rod is connected with the first driving unit so as to drive the first support rod to move.
In one embodiment, the second lifting support comprises a third connector fastened on the support plate, a fourth connector fastened on the workbench, a second strut sleeved outside the upper part of the second strut to raise or lower the support plate through the third connector, a fourth connector sleeved outside the middle part of the second strut to be supported on the workbench through the fourth connector, and a second driving unit connected to the bottom end of the second strut to drive the second strut to move.
In one embodiment, the fixing support comprises a ball head and a connecting rod, the ball head is arranged at the top end of the connecting rod, the spherical end of the ball head is installed in the adjusting cavity of the lower end face of the supporting plate in a matching mode, and the connecting rod is fixedly connected with the workbench.
In one embodiment, the measurement unit comprises a contact measurement device for measuring the thickness of the wafer and a non-contact optical measurement device for measuring the topography relief of the wafer, respectively.
In one embodiment, the contact measuring device has at least two probes, wherein one probe obtains the height of the chuck turntable by taking a point measurement at a fixed position, and the other probe obtains the total height of the chuck turntable and the wafer by taking a point measurement at a fixed position to obtain the thickness of the wafer; the optical measuring device moves its measuring sensor through the swing arm to acquire a plurality of point heights at different radial positions on the surface of the wafer.
The embodiment of the invention has the beneficial effects that: by adjusting the inclination angle of the sucker turntable for keeping the wafer, the accurate control of the grinding surface shape of the wafer can be realized, and the processing effect and the manufacturing quality of the wafer are improved, so that the technical support is provided for the stacking process of the ultra-high-density semiconductor, and the sucker turntable is an important component for the high-density packaging development of the semiconductor and the like.
Drawings
The advantages of the invention will become clearer and more readily appreciated from the detailed description given with reference to the following drawings, which are given by way of illustration only and do not limit the scope of protection of the invention, wherein:
fig. 1 shows a grinding apparatus provided by an embodiment of the present invention in a schematic perspective view;
fig. 2 schematically illustrates the working principle of wafer grinding;
FIG. 3 schematically illustrates a grinding area of a wafer;
FIG. 4 schematically illustrates various grinding profiles of a wafer;
FIG. 5 schematically illustrates two characteristic parameters for characterizing a wafer grinding profile;
FIG. 6 is a schematic perspective view of a platen for supporting a wafer according to an embodiment of the present invention;
FIG. 7 illustrates, in a schematic perspective view, a suction cup turntable of the machine table shown in FIG. 6;
fig. 8 shows the suction cup turntable shown in fig. 7 in a schematic sectional view, without the angle adjustment means;
fig. 9 schematically shows a layout arrangement of an angle adjusting apparatus provided by an embodiment of the present invention;
fig. 10 schematically shows a layout arrangement of an angle adjusting apparatus provided in another embodiment of the present invention;
FIG. 11 schematically illustrates an x-direction view of adjusting the tilt angle;
FIG. 12 schematically illustrates a y-direction view of adjusting the tilt angle;
FIG. 13 illustrates a top view of a chuck table provided in accordance with an embodiment of the present invention;
fig. 14 is a schematic structural diagram illustrating an angle adjustment apparatus according to an embodiment of the present invention.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the following embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the present invention for the purpose of illustrating the concepts of the invention; the description is intended to be illustrative and exemplary and should not be taken to limit the scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification thereof, and these technical solutions include technical solutions which make any obvious replacement or modification of the embodiments described herein. It should be understood that, unless otherwise specified, the following description of the embodiments of the present invention is made for the convenience of understanding, and the description is made in a natural state where relevant devices, apparatuses, components, etc. are originally at rest and no external control signals and driving forces are given.
Fig. 1 shows a grinding apparatus 1 for controlling a grinding profile of a wafer according to an embodiment of the present invention in a schematic perspective view. The grinding apparatus 1 shown includes a machine table 3 for carrying a wafer and a grinding tool 2 for bringing a grinding wheel into abutment with the wafer w to grind and thin the wafer.
As shown in fig. 1, the machine 3 for supporting a wafer mainly includes a worktable 31, and a plurality of chuck turntables 32 for holding and driving the wafer to rotate are disposed on the worktable 31. Wherein, the worktable 31 can rotate around the vertical central axis thereof so that the worktable 31 drives the plurality of sucker rotary tables 32 to rotate integrally, thereby realizing the position conversion of the sucker rotary tables 32 among different stations. Each suction cup turntable 32 is also independently rotatable.
As shown in fig. 1, as an implementation manner, three suction cup turntables 32 capable of rotating independently are uniformly distributed on a worktable 31, and each suction cup turntable is provided with a first suction cup, a second suction cup and a third suction cup for sucking a wafer, the three suction cups are porous ceramic suction cups with completely the same structure to realize vacuum suction of the wafer, and the connecting lines of the centers of the three suction cup turntables 32 and the worktable 31 form an included angle of 120 degrees. The three chuck tables 32 correspond to three stations, namely a rough grinding station, a finish grinding station and a loading and unloading station, wherein two stations opposite to the grinding wheel are respectively used for rough grinding and finish grinding, and the other station is used for loading and unloading and cleaning wafers. The three sucker rotary tables 32 can be driven to switch among the three stations through the rotation of the working table 31, so that the sucker rotary tables 32 can carry the wafer to circularly move according to the sequence of the loading and unloading station, the rough grinding station, the fine grinding station and the loading and unloading station. The embodiment realizes full-automatic loading and unloading and continuous grinding and cleaning of the wafer through repeated circulation. The rotary worktable 31 for grinding the wafer has the advantages of high material removal rate, small damage to the surface of the wafer and easy realization of automation.
As shown in fig. 1, the grinding tool 2 is mainly composed of a rough grinding portion 21 and a finish grinding portion 22, the rough grinding portion 21 being provided with a rough grinding wheel 211 for rough grinding the wafer, and the finish grinding portion 22 being provided with a finish grinding wheel 221 for finish grinding the wafer. The grinding process is to press the grinding wheel on the surface of the wafer and rotate the grinding wheel to grind off a certain thickness.
The rough grinding section 21 includes a rough grinding wheel 211 having a cup-shaped configuration, a rough grinding spindle base, and a rough grinding feed mechanism. The rough grinding wheel 211 is connected to the bottom of the rough grinding spindle so that the rough grinding spindle drives the rough grinding wheel 211 to rotate, the rough grinding wheel 211 rotates and grinds the surface of the wafer, the rough grinding spindle is connected with the rough grinding feeding mechanism through the rough grinding spindle seat to move up and down, and the rough grinding wheel 211 is controlled by the rough grinding feeding mechanism to be close to or far away from the wafer to carry out axial plunge feeding grinding. In this embodiment, the rough grinding wheel 211 may be a diamond wheel, and the surface thereof is rough to realize rapid wafer grinding, thereby reducing the wafer thinning time. During rough grinding, the feeding speed of the rough grinding wheel 211 relative to the wafer is 2-10 μm/s so as to realize high-speed feeding, and the rotating speed of the rough grinding wheel 211 is 2000-4000 rpm. The radius of the rough grinding wheel 211 matches the radius of the wafer, and may be 1 to 1.2 times the radius of the wafer. The thickness of the wafer is reduced by more than 600 μm in the rough grinding process, and after the rough grinding process, the thickness of the wafer can be reduced to be within 150 μm.
The refining section 22 includes a refining wheel 221 in the shape of a cup-shaped structure, a refining spindle holder, and a refining feed mechanism. The fine grinding wheel 221 is connected to the bottom of the fine grinding spindle so that the fine grinding spindle drives the fine grinding wheel 221 to rotate, the fine grinding spindle is connected with the fine grinding feeding mechanism through the fine grinding spindle seat so as to achieve up-and-down movement, and the fine grinding wheel 221 is controlled to approach or move away from the wafer through the fine grinding feeding mechanism so as to achieve axial plunge feeding grinding. In this embodiment, the finish grinding wheel 221 may be a diamond wheel with a surface roughness lower than that of the rough grinding wheel 211, which may cause serious surface defects and losses due to the rough grinding to rapidly remove the surface material of the wafer, and the fine surface of the finish grinding wheel 221 is used for low-speed grinding to reduce the thickness of the damaged layer on the surface of the wafer and improve the surface quality of the wafer. In the finish grinding, the feed speed of the finish grinding wheel 221 relative to the wafer is 0.1 to 1 μm/s to realize low-speed feed to improve the grinding precision, and the rotation speed of the finish grinding wheel 221 is 2000-4000 rpm. The radius of the lapping wheel 221 matches the radius of the wafer, which may be 1 to 1.2 times the radius of the wafer.
As shown in fig. 1, the grinding apparatus 1 further includes a measuring unit 4, which includes a contact measuring instrument and a non-contact measuring instrument, which may be an optical measuring instrument, and can realize online monitoring of the wafer thickness. The probe of the contact type measuring instrument is pressed on the surface of the wafer to measure the thickness of the wafer by utilizing the height difference of the upper surface and the lower surface of the wafer. Two sets of contact gauges are provided, and are disposed in the rough grinding section 21 and the finish grinding section 22, respectively. The non-contact optical measuring instrument irradiates the wafer with infrared light and calculates the thickness of the wafer according to different reflected lights on the upper and lower surfaces of the wafer. It should be noted that, in the present disclosure, the wafer thickness refers to the entire thickness from the upper surface to the lower surface of the wafer, and not the thickness of the coating film laid on the wafer surface.
It should be noted that the contact measuring apparatus has two measuring heads, which respectively measure the distance between the upper surface of the chuck table and one measuring head and the distance between the upper surface of the wafer and the other measuring head, so as to calculate the overall thickness of the wafer by the difference between the two distances, in general, the measuring head for measuring the surface of the wafer arbitrarily selects 1, 2 or more points on the surface of the wafer, which are more than one-half of the center of the wafer, for measurement, and the sensor and related components of the contact measuring apparatus are not arranged on or carried on the swing arm, but fixedly arranged along the radial direction of the wafer, in other words, can be used for measuring the height of a specific fixed point as much as possible;
the noncontact measuring instrument is used for measuring the heights of a plurality of points with different radial distances along the radius direction on the surface of the wafer to obtain the topography of the surface of the wafer, namely the height difference between different points, and preferably has a swing arm, so that the sensor of the noncontact measuring instrument can measure any point in the radius 1/2 of the wafer, is preferably arranged to measure any point in the radius 1/10 of the wafer, and is further preferably arranged to measure the height difference between the center point and the edge point of the wafer.
As shown in fig. 1, the grinding apparatus 1 further includes a cleaning unit 5, and the cleaning unit 5 includes a first cleaning portion 51 and a second cleaning portion 52. The first cleaning part 51 is used for cleaning and polishing the suction disc, has a rotatable first body, is provided with a suction disc cleaning brush and a suction disc polishing oilstone at the bottom of the first body, and is also provided with a through hole for spraying cleaning fluid to the suction disc through a pipeline inside the first body. The second cleaning portion 52 is used for cleaning the wafer and has a rotatable second body, a wafer cleaning brush is disposed at the bottom of the second body, and a through hole is disposed at the bottom of the second body for spraying cleaning liquid to the wafer through a pipeline inside the second body.
As shown in fig. 1, the grinding apparatus 1 further includes a simple robot 6, and the simple robot 6 is used for placing the wafer on the machine table 3 for grinding, and taking out the wafer from the machine table 3 for subsequent transportation after the grinding and cleaning are completed. As an implementation manner, a vacuum pipeline is arranged inside the simple robot 6 to realize vacuum adsorption of the wafer.
In addition, in the specific implementation, the grinding apparatus 1 further includes a grinding fluid supply unit for spraying a grinding fluid, which may be deionized water, onto the surface of the wafer to aid grinding during rough grinding and/or finish grinding.
Fig. 2 shows the working principle of grinding using a grinding wheel and a chuck turntable 32, as shown in the figure, a rotary chuck turntable 32 equipped with a vacuum chuck is used for grinding, the vacuum chuck adsorbs the wafer and drives the wafer to rotate, the center of the wafer coincides with the center of the chuck turntable 32, the grinding wheel presses on the wafer to rotate and feeds along the axial direction F according to a certain feeding speed, and thereby the wafer is ground.
Fig. 3 shows, in a schematic simplified diagram, a semi-contact grinding mode employed in the present disclosure, such as a grinding zone 34 shown by a hatched area in fig. 3, and the grinding wheel is in contact with only a center-to-edge area of the wafer, i.e., the grinding zone 34, for grinding, so that the wafer forms various grinding profiles after grinding, as shown in fig. 4. As shown in FIG. 5, the roughness is used for one of the grinding surfaces1And fullness2Two characteristic parameters are used for representing the specific grinding surface shape.
It can be understood that the grinding surface shape of the wafer is related to the included angle between the grinding wheel and the axis of the sucking disc, and the control of the grinding surface shape can be realized by adjusting the included angle between the axis of the grinding wheel and the axis of the sucking disc. The following describes an embodiment of the present disclosure for adjusting the grinding surface shape of the wafer by adjusting the tilt angle of the chuck table 32.
Fig. 6 is a schematic perspective view illustrating a wafer-supporting machine 3 according to an embodiment of the present invention, which includes:
a table 31 that rotatably supports a plurality of suction cup turn tables 32;
a chuck turntable 32 for holding the wafer and rotating the wafer;
an angle adjusting device 33 (not shown) is connected to the chuck turntable 32 to adjust the inclination angle of the chuck turntable 32 in at least two directions to control the grinding surface shape of the wafer.
As shown in fig. 6, the table 31 is rotatable about its vertical central axis, and three suction cup rotating tables 32 which are individually rotatable are uniformly distributed on the table 31, the three suction cup rotating tables 32 being rotated respectively between the loading and unloading station, the rough grinding station and the finish grinding station.
Fig. 7 and 8 show the structure of the suction cup turntable 32 provided in one embodiment of the present invention in a schematic perspective view and a sectional view, respectively. For the sake of clarity, the angle adjustment device 33 is not shown in fig. 8. The illustrated suction cup turntable 32 includes: suction cup 321, pressure plate (not shown), mounting plate 322, one support plate 323, bushing 325, rotary shaft 326, connecting shaft 327, pulley 328, and rotary joint 329. The sucker 321 is fixed on the mounting plate 322 through a pressing plate, the mounting plate 322 is fixed at the top end of the rotating shaft 326, a shaft sleeve 325 is sleeved outside the rotating shaft 326, the rotating shaft 326 and the shaft sleeve 325 penetrate through a hollow area in the center of the supporting plate 323 to enable the annular supporting plate 323 to be sleeved outside the shaft sleeve 325, the shaft sleeve 325 is fixedly connected with the supporting plate 323, and the sucker 321 is located above the supporting plate 323. The bottom end of the rotating shaft 326 is fixedly connected with a connecting shaft 327, the connecting shaft 327 is connected with a belt wheel 328, and the belt wheel 328 is connected with a motor through a transmission belt to realize electric rotation. A rotary joint 329 is fixed to the bottom end of the connecting shaft 327.
Referring to fig. 8, the working principle of the present embodiment for realizing the rotation and tilt control of the suction cup turntable 32 is: the rotation shaft 326 drives the sucker 321 to rotate through motor control and transmission of a transmission belt, a belt wheel 328 and a connecting shaft 327, the supporting plate 323 is fixedly connected with the shaft sleeve 325, and when the supporting plate 323 inclines, the shaft sleeve 325 is inclined together with the rotation shaft 326, so that the sucker 321 inclines.
The embodiment of the present disclosure in which the inclination angle of the suction cup turntable 32 is adjusted by the angle adjusting device 33 will be described in detail below.
Fig. 9 and 10 show the layout of the angle adjusting device 33 provided by two embodiments of the present invention, respectively. For ease of understanding, the x-direction is defined herein as the first orientation and the y-direction is defined herein as the second orientation in fig. 9 and 10.
As shown, the first orientation (x direction) and the second orientation (y direction) are specifically arranged as follows: when the table 31 drives the suction cup turntable 32 to move to the refining station, that is, when the suction cup turntable 32 carries the wafer at the refining station so that the refining wheel 221 performs the refining on the wafer, the first orientation (x direction) is perpendicular to a line connecting two end points of the wafer, which are in contact with the refining wheel 221. After the direction of the first orientation (x direction) is set, based on the fact that the first orientation (x direction) and the second orientation (y direction) are perpendicular to each other, the xy rectangular coordinate system plane formed by the first orientation (x direction) and the second orientation (y direction) is parallel to the upper surface of the sucker turntable 32 and intersects the center of the sucker turntable 32, and specific positions and directions of the first orientation (x direction) and the second orientation (y direction) can be determined.
The angle adjusting means 33 includes first and second elevating supports 35 and 36 which are vertically elevatable, and a fixing support 37 slidably coupled to the support plate. The fixed support 37, the first lifting support 35 and the second lifting support 36 are uniformly distributed along the circumferential direction of the suction cup turntable. The first lifting support 35 and the second lifting support 36 cooperate to effect rotation of the suction cup turntable about the first orientation and about the second orientation, respectively. The angle adjusting means 33 can be implemented in two ways.
In one embodiment shown in fig. 9, the fixed leg 37 is positioned in a first orientation and the first 35 and second 36 lifting legs are symmetrically distributed about the first orientation.
Specifically, the first lifting support 35 and the second lifting support 36 lift or lower the chuck table around their respective fulcrums in synchronization to adjust the included angle between the central axis of the chuck table and the first orientation, even if the chuck table 32 rotates around the second orientation (y direction), thereby realizing adjustment of the plumpness of the wafer grinding surface shape2。
The first elevating support 35 supports the suction cup turntable in the first direction and second elevates the suction cup turntable at the same timeThe descending support member 36 supports the chuck table in the second direction to adjust the included angle between the central axis of the chuck table and the second orientation, i.e. the chuck table 32 rotates around the first orientation (x direction), thereby realizing adjustment of the roughness of the grinding surface shape of the wafer1. Wherein, the first direction and the second direction are both along vertical direction and opposite direction.
In another embodiment shown in fig. 10, the fixed leg 37 is in a second orientation, and the first lifting leg 35 and the second lifting leg 36 are symmetrically distributed about the second orientation.
Specifically, the first lifting support 35 supports the action of the chuck turntable along the first direction, and the second lifting support 36 supports the action of the chuck turntable along the second direction to adjust the included angle between the central axis of the chuck turntable and the first orientation, so as to adjust the plumpness of the grinding surface shape of the wafer2. Wherein, the first direction and the second direction are both along vertical direction and opposite direction.
The first lifting support 35 and the second lifting support 36 synchronously raise or lower the chuck table around their respective fulcrums to adjust the included angle between the central axis of the chuck table and the second orientation, thereby adjusting the roughness of the wafer grinding surface1。
Wherein, fixed branch 37, first lift branch 35 and second lift branch 36 all connect between backup pad and workstation, specifically adopt the mode of being connected with the backup pad to through the slope of angle adjusting device 33 direct control backup pad, thereby make the sucking disc slope. In fig. 6, the three chuck turntables 32 on the table 31 are each connected with an angle adjusting device 33, and in the specific process, when the chuck turntables 32 are rotated to the fine grinding station for fine grinding of the wafer, the angle adjusting step is performed.
With reference to fig. 11 and 12, it will be appreciated that the chuck table 32 alone rotated in the y-direction controls the fullness of the wafer grinding profile2. The concave-convex degree of the grinding surface shape of the wafer can be controlled when the sucker turntable 32 rotates around the x direction independently1. Therefore, the concave-convex degree of the grinding surface shape of the wafer can be respectively and independently controlled by adopting the angle adjusting device 33 in the disclosure1And fullness2The control precision is high and the effect is good.
Fig. 13 shows a top view of the suction cup turntable 32 provided in an embodiment of the present invention. The sucking disc and the supporting plate in the sucking disc rotary table are vertically stacked and sleeved outside the rotary shaft.
In this embodiment, a supporting plate 323 is adopted to support the sucker 321 to incline, and the first lifting support 35, the second lifting support 36 and the fixing support 37 are all arranged on the supporting plate 323, so that the rigidity and stability of the structure are improved, and the complexity of the whole device is reduced. Compared with a structure with multiple layers of supporting plates, the structure of one supporting plate 323 can improve rigidity by increasing the thickness of one supporting plate 323, so that deformation caused by small thickness of the supporting plate can not occur under the condition that the stress is uneven due to inclination, however, the angle control is unstable due to the fact that the multiple layers of supporting plates are limited by size and weight, the thicker supporting plates are inconvenient to adopt and then deformation easily occurs when a certain supporting plate is stressed and inclined, and accurate control of the grinding surface shape of the wafer is difficult to achieve.
Fig. 14 is a schematic structural diagram of the first lifting support 35 according to an embodiment of the present invention. Fig. 14 is a sectional view taken along the direction F-F shown in fig. 13.
As shown in fig. 14, the first lifting support 35 includes a first connecting member fastened to the support plate, a second connecting member fastened to the worktable, a first support rod sleeved with the first connecting member at an upper outer side thereof to raise or lower the support plate via the first connecting member, and a first driving unit connected to a bottom end of the first support rod to drive the first support rod to move.
Similarly, second lift branch piece 36 is including fastening the third connecting piece in the backup pad, fastening the fourth connecting piece on the workstation, second branch and second drive unit, and second branch upper portion outside suit third connecting piece is in order to raise or reduce the backup pad through the third connecting piece, and second branch middle part outside suit fourth connecting piece is in order to support on the workstation through the fourth connecting piece, and second drive unit is connected in order to drive the action of second branch in second branch bottom.
It should be understood that in the present invention, the first lifting support and the second lifting support may be implemented in various ways, such as screw transmission, motor drive, etc.
As shown in fig. 14, the fixing support 37 includes a ball head and a connecting rod, the ball head is disposed at the top end of the connecting rod, the spherical end of the ball head is installed in the adjusting cavity of the lower end face of the supporting plate in a matching manner, and the connecting rod is fixedly connected with the workbench.
The embodiment of the invention adopts a three-point support layout design, and realizes the purpose of respectively controlling the roughness of the grinding surface shape of the wafer by adjusting the inclination angle of the sucker turntable in two directions1And fullness2The method avoids the cross change of the two, is easy to realize accurate wafer surface shape control and improves the grinding effect. In addition, this disclosure accomplishes the angle modulation function through the mating reaction of two regulation branches spare, compact structure.
The drawings in the present specification are schematic views to assist in explaining the concept of the present invention, and schematically show the shapes of respective portions and their mutual relationships. It should be understood that the drawings are not necessarily to scale, the same reference numerals being used to identify the same elements in the drawings in order to clearly show the structure of the elements of the embodiments of the invention.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A grinding apparatus for controlling a grinding profile of a wafer, comprising:
a table for supporting a plurality of chuck turntables;
the sucking disc rotary table is used for holding the wafer and driving the wafer to rotate and comprises a sucking disc, a rotating shaft and a supporting plate, wherein the sucking disc and the supporting plate are vertically stacked and sleeved on the rotating shaft so as to support the sucking disc to incline through the supporting plate;
the measuring unit is used for measuring the thickness and/or the appearance of the wafer; and
the angle adjusting device is used for adjusting the sucker turntable and is connected with the sucker turntable so as to adjust the inclination angle of the sucker turntable in at least two directions to adjust the grinding surface shape of the wafer;
the angle adjusting device comprises a first lifting support piece and a second lifting support piece which can lift along the vertical direction, the first lifting support piece and the second lifting support piece are connected between the supporting plate and the workbench so as to respectively lift or lower the supporting plate on two supporting points under the support of the workbench, and therefore the sucker rotary table can respectively rotate around the first orientation and rotate around the second orientation.
2. The grinding apparatus of claim 1,
the angle adjusting device further comprises a fixed support connected between the supporting plate and the workbench, wherein the fixed support, the first lifting support and the second lifting support are uniformly distributed along the circumferential direction of the sucker turntable.
3. The grinding apparatus of claim 2,
the fixed support is positioned in the first orientation, and the first lifting support and the second lifting support are symmetrically distributed about the first orientation;
the first lifting support and the second lifting support synchronously raise or lower the sucker turntable around respective pivots thereof to adjust an included angle between a central axis of the sucker turntable and the first orientation;
the first lifting support supports the sucker rotary table to act along a first direction, and the second lifting support supports the sucker rotary table to act along a second direction, so that the included angle between the central axis of the sucker rotary table and the second direction is adjusted, wherein the first direction and the second direction are opposite in direction and vertical direction.
4. The grinding apparatus of claim 2,
the fixed leg is in the second orientation, the first and second lifting legs being symmetrically distributed about the second orientation;
the first lifting support piece supports the sucker turntable to act along a first direction, and the second lifting support piece supports the sucker turntable to act along a second direction so as to adjust an included angle between a central axis of the sucker turntable and the first direction, wherein the first direction and the second direction are vertical and opposite in direction;
and the first lifting support piece and the second lifting support piece synchronously lift or lower the sucker rotary table around respective pivots thereof so as to adjust an included angle between the central axis of the sucker rotary table and the second orientation.
5. The grinding apparatus according to any one of claims 1 to 4, further comprising a grinding tool having a grinding wheel for abutting against the wafer to grind thinning the wafer;
the first orientation and the second orientation are orthogonal to the center of the sucker turntable, a rectangular coordinate system plane formed by the first orientation and the second orientation is parallel to the upper surface of the sucker turntable, and the first orientation is perpendicular to a connecting line of two end points of the grinding wheel, which are contacted with the wafer when the grinding wheel grinds the wafer.
6. The grinding apparatus of claim 1,
the first lifting support piece comprises a first connecting piece fastened on the supporting plate, a second connecting piece fastened on the workbench, a first supporting rod and a first driving unit, the first connecting piece is sleeved on the outer side of the upper portion of the first supporting rod to raise or lower the supporting plate through the first connecting piece, the second connecting piece is sleeved on the outer side of the middle portion of the first supporting rod to be supported on the workbench through the second connecting piece, and the bottom end of the first supporting rod is connected with the first driving unit to drive the first supporting rod to move.
7. The grinding apparatus of claim 1,
the second lifting support piece comprises a third connecting piece fastened on the supporting plate, a fourth connecting piece fastened on the workbench, a second supporting rod and a second driving unit, the third connecting piece is sleeved outside the upper portion of the second supporting rod so as to raise or lower the supporting plate through the third connecting piece, the fourth connecting piece is sleeved outside the middle portion of the second supporting rod so as to be supported on the workbench through the fourth connecting piece, and the bottom end of the second supporting rod is connected with the second driving unit so as to drive the second supporting rod to move.
8. The grinding apparatus of claim 2,
the fixed supporting piece comprises a ball head and a connecting rod, the ball head is arranged at the top end of the connecting rod, the spherical end of the ball head is installed in an adjusting cavity of the lower end face of the supporting plate in a matched mode, and the connecting rod is fixedly connected with the workbench.
9. The grinding apparatus of claim 2,
the measuring unit comprises a contact type measuring device and a non-contact type optical measuring device, wherein the contact type measuring device is used for measuring the thickness of the wafer, and the non-contact type optical measuring device is used for measuring the surface topography fluctuation of the wafer.
10. The grinding apparatus of claim 9,
the contact type measuring device is provided with at least two probes, wherein one probe obtains the height of the sucker rotary table by taking point measurement at a fixed position, and the other probes obtain the total height of the sucker rotary table and the wafer by taking point measurement at fixed positions so as to obtain the thickness of the wafer;
the optical measuring device moves its measuring sensor through the swing arm to acquire a plurality of point heights at different radial positions on the surface of the wafer.
CN202010748253.2A 2020-07-30 2020-07-30 Grinding equipment for controlling grinding surface shape of wafer Pending CN111775001A (en)

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112548845A (en) * 2021-02-19 2021-03-26 清华大学 Substrate processing method
CN113211216A (en) * 2021-04-23 2021-08-06 科莱思半导体智造(浙江)有限公司 Polishing equipment for semiconductor silicon wafer
CN113732851A (en) * 2021-11-05 2021-12-03 四川明泰微电子有限公司 Device for polishing back of semiconductor wafer
CN113787452A (en) * 2021-09-14 2021-12-14 奥士康科技股份有限公司 Rotatory grinding device of section
CN114472278A (en) * 2021-12-31 2022-05-13 华海清科股份有限公司 Cleaning method and cleaning device for substrate thinning
CN114871887A (en) * 2021-12-21 2022-08-09 华海清科股份有限公司 Grinding surface shape prediction method and system using mixed kernel function and terminal equipment
CN114871876A (en) * 2021-12-13 2022-08-09 华海清科股份有限公司 Wafer grinding monitoring method and monitoring system
CN115091287A (en) * 2022-07-15 2022-09-23 华海清科股份有限公司 Ultra-precise grinding parameter adjusting method and grinding system
CN115106925A (en) * 2022-06-20 2022-09-27 苏州富强科技有限公司 Multi-station wafer polishing mechanism
CN115723035A (en) * 2022-09-08 2023-03-03 西安奕斯伟材料科技有限公司 System and method for monitoring processing state of grinding device and double-sided grinding device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008238341A (en) * 2007-03-27 2008-10-09 Disco Abrasive Syst Ltd Machining device
CN102229087A (en) * 2011-06-02 2011-11-02 大连理工大学 Device and method for regulating dip angle of wafer grinder
CN105988310A (en) * 2015-02-26 2016-10-05 中芯国际集成电路制造(上海)有限公司 Photo-etching method and wafer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008238341A (en) * 2007-03-27 2008-10-09 Disco Abrasive Syst Ltd Machining device
JP5025297B2 (en) * 2007-03-27 2012-09-12 株式会社ディスコ Processing equipment
CN102229087A (en) * 2011-06-02 2011-11-02 大连理工大学 Device and method for regulating dip angle of wafer grinder
CN105988310A (en) * 2015-02-26 2016-10-05 中芯国际集成电路制造(上海)有限公司 Photo-etching method and wafer

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112548845A (en) * 2021-02-19 2021-03-26 清华大学 Substrate processing method
CN113211216A (en) * 2021-04-23 2021-08-06 科莱思半导体智造(浙江)有限公司 Polishing equipment for semiconductor silicon wafer
CN113787452A (en) * 2021-09-14 2021-12-14 奥士康科技股份有限公司 Rotatory grinding device of section
CN113732851A (en) * 2021-11-05 2021-12-03 四川明泰微电子有限公司 Device for polishing back of semiconductor wafer
CN114871876A (en) * 2021-12-13 2022-08-09 华海清科股份有限公司 Wafer grinding monitoring method and monitoring system
CN114871887A (en) * 2021-12-21 2022-08-09 华海清科股份有限公司 Grinding surface shape prediction method and system using mixed kernel function and terminal equipment
CN114871887B (en) * 2021-12-21 2024-01-30 华海清科股份有限公司 Grinding surface shape prediction method and system using mixed kernel function and terminal equipment
CN114472278A (en) * 2021-12-31 2022-05-13 华海清科股份有限公司 Cleaning method and cleaning device for substrate thinning
CN114472278B (en) * 2021-12-31 2023-10-03 华海清科股份有限公司 Cleaning method and cleaning device for thinning substrate
CN115106925A (en) * 2022-06-20 2022-09-27 苏州富强科技有限公司 Multi-station wafer polishing mechanism
CN115091287A (en) * 2022-07-15 2022-09-23 华海清科股份有限公司 Ultra-precise grinding parameter adjusting method and grinding system
CN115091287B (en) * 2022-07-15 2023-12-29 华海清科股份有限公司 Ultra-precise grinding parameter adjustment method and grinding system
CN115723035A (en) * 2022-09-08 2023-03-03 西安奕斯伟材料科技有限公司 System and method for monitoring processing state of grinding device and double-sided grinding device
TWI826082B (en) * 2022-09-08 2023-12-11 大陸商西安奕斯偉材料科技股份有限公司 System and method for monitoring processing status of grinding device and double-sided grinding device
CN115723035B (en) * 2022-09-08 2024-05-28 西安奕斯伟材料科技股份有限公司 System, method and double-sided grinding device for monitoring processing state of grinding device

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