JP2556605B2 - Polishing equipment - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus for polishing a work such as an aluminum substrate for a magnetic disk.

Conventional Technology and Problems Conventionally, a processing machine (51) as shown in FIG. 3 has been used as a polishing processing machine for polishing an aluminum substrate for a magnetic disk, for example.

The polishing machine (51) shown in the figure has a lower surface plate (53), which is rotatably held and has a donut disk-shaped grindstone (52) attached to the upper surface, and an upper surface of the lower surface plate (53). An upper surface plate (55), which is arranged coaxially with the surface plate (53) so as to be opposed to the surface plate, is rotatably driven and vertically held, and has a donut disk-shaped grindstone (54) attached to the lower surface thereof. , Each whetstone (5
2) A sun gear (57) arranged at the axial center position of the grindstone between (54), and an internal gear (59) arranged concentrically at a radially outer position of the sun gear (57), The internal gear (59)
And an external gear-like work carrier arranged between both gears (57) (59) in a state of being meshed with both gears of the sun gear (57) and placed on the grindstone (52) of the lower turn table (53). (56) consists of The work carrier (56) has a circular holding hole (6) along the outer peripheral shape of the magnetic disk substrate (A).
0) in an eccentric state, and with the magnetic disk substrate (A) arranged in the holding hole (60), the upper and lower surfaces of the substrate are outward from the holding hole (60) of the carrier (56). The plate thickness is formed thinner than the substrate (A) so as to be in a protruding state.

And in this polishing machine (51), the upper surface plate (55)
Is placed in the upper standby position, the magnetic disk substrate (A) is placed in the holding hole (60) of the work carrier (56), and the upper surface plate (55) is lowered to move the magnetic disk substrate ( Both sides of A) are sandwiched by the upper and lower grindstones (52) (54). Then, in the machining state, the sun gear (57) is rotated to revolve the work carrier (56) around the sun gear (57), and the upper and lower surface plates (53) (55) are also rotated. The magnetic disk substrate (A)
Both sides are polished. After polishing, the upper surface plate (5
5) is raised, the substrate (A) held by the carrier (56) is taken out, a new substrate is held by the carrier (56), and polishing is restarted.

By the way, conventionally, in polishing a magnetic disk substrate using the above-mentioned processing machine, an operator takes out the substrate (A) from the rack and puts it on each holding hole (60) of the work carrier (56).
And the substrate (A) of the carrier (56) is taken out after the polishing is completed.

However, the manual repetitive work as described above imposes a heavy burden on the worker and limits the improvement of the work processing efficiency of the apparatus.

Therefore, there has been a demand for the development of automated equipment for automating the polishing process, automatically loading the substrate into the polishing machine (51), and automatically unloading the substrate after the polishing is completed.

Therefore, the present inventors, as one aspect of such automated equipment, adjacent to the polishing machine (51) as described above,
An unprocessed work standby part for temporarily waiting an unprocessed substrate in a mounted state, and a processed work standby part for temporarily holding a polished substrate in a mounted state, respectively, and
The substrate is chucked with the unprocessed substrate set on the unprocessed work standby part in the polishing machine (51), and the substrate polished by the polishing machine (51) in the processed work standby part. Then, an attempt is made to put into practical use a polishing apparatus equipped with a work transfer device that transfers and places the work in a floating state.

However, in order to put this polishing device into practical use,
One of the problems to be solved is how to place a substrate, which has been polished by the polishing machine (51), on the processed workpiece standby part by the transfer device as described above without damaging the substrate. There is a problem.

That is, when a substrate that is chucked and floated by the work transfer device is placed on the processed work standby portion, the substrate is dropped onto the bottom surface of the receiving portion of the standby portion or is pressed against the substrate. It can cause scratches. This becomes a serious problem particularly when the work is one that requires high surface properties such as the above-mentioned magnetic disk substrate.

On the other hand, while waiting in the processed work standby part, dirt such as polishing liquid, cutting chips, and abrasive particles adhered during the polishing process sticks to the substrate due to drying, and in the cleaning process performed after polishing. It may cause difficulty in cleaning the substrate.

The present invention solves the above problem and chucks a machined workpiece polished by a polishing section by a transfer device and transfers the machined workpiece to a machined workpiece standby section in a floating state, and the machined workpiece to the standby section. In a polishing device configured to place and temporarily stand by, it is possible to place the processed work in the processed work standby portion without damaging the processed work with the transfer device as described above, and An object of the present invention is to provide a polishing apparatus that can prevent various kinds of dirt from sticking to a work due to drying during standby in the standby unit.

Means for Solving the Problems In the above object, according to the present invention, a processed work standby unit for temporarily holding a processed work in a mounted state is disposed adjacent to a polishing processing unit that performs a polishing process on a work. In addition, the polishing device is provided with a work transfer device that chucks the workpiece polished by the polishing portion and transfers it to the processed workpiece standby portion in a floating state and places the workpiece on the workpiece. A liquid supply for supplying a cushioning liquid to the tray excluding the work receiver, and a tray having a shallow bottom in which the standby portion is horizontally arranged, a ring-shaped work receiver having a predetermined height provided in the tray And a source for supplying the liquid from the liquid supply source into the tray, the liquid is supplied from the tray into the work receiver, and the work receiver is filled with the cushioning liquid. The upper edge height of the receiving is, the gist of the polishing apparatus characterized by comprising been designed lower than the upper edge height of the shallow form tray.

Function In the above configuration, in the state where the inside of the workpiece receiver of the processed workpiece standby portion that temporarily holds the processed workpiece polished by the polishing portion in the mounted state is filled with the cushion liquid, The processed work is chucked by the transfer device and transferred in a floating state, and the work is placed in the work receiver of the processed work standby unit. In the process of this placement, the processed work is subjected to a cushioning action by the cushion liquid in the work receiving part, and the cushioning action allows the work to be placed in the work receiving part without being damaged. .

In addition, the workpiece comes into contact with the liquid in the receiver during standby in the processed workpiece standby portion, so that the portion in contact with the liquid does not dry, and dirt that has adhered during polishing etc. It is hard to get stuck.

In addition, the processed workpiece standby unit is a liquid supply for supplying a cushioning liquid to a tray having a shallow bottom arranged in a horizontal state, a workpiece receiver provided in the tray, and a tray excluding the workpiece receiver. And a liquid source for supplying the liquid into the tray so that the inside of the work receiver is filled with the cushioning liquid so that the upper edge position of the work receiver is above the shallow tray. By being designed lower than the edge height position, the supply of the cushioning liquid to the work receiver can be performed without disturbing the placement operation of the processed work on the work receiver and the work receiver can be processed. The lowering and placing operation of the finished work is also performed without disturbing the supply of the cushioning liquid to the work receiver.

Moreover, since the liquid is supplied to the shallow-bottom tray, the work receiver is filled with the liquid for a small amount of the cushion liquid.

Embodiment An embodiment in which the present invention is applied to a polishing apparatus for automatically polishing a disk-shaped aluminum substrate for a magnetic disk will be described below with reference to the drawings.

In the polishing apparatus shown in FIG. 1, (1) is a polishing processing section, (2) is an unprocessed workpiece standby section, (3) is a processed workpiece standby section, and (4) is an unprocessed workpiece batch transfer apparatus.
(5) is a machined work batch transfer device. Also,
(6) is an unprocessed work storage rack, (7) is a cleaning / drying device, (8) is an unprocessed work individual transfer device, and (9) is a processed work individual transfer device.

The polishing part (1) includes upper and lower surface plates (11) and (12), a sun gear (13), an internal gear (14), and a work carrier (1).
5) With a grinding machine composed of a sun gear (1
The carrier (15) is rotated and revolved by the rotation of (3), and the upper and lower surface plates (11, 12) are also rotationally driven to polish the substrate (A).

In this polishing part (1), the lower surface plate (11) is
A grindstone (17) in the shape of a donal disc having a predetermined thickness is attached to the upper portion of the grindstone, and can be rotated about its own axis and moved in the vertical direction by a driving device (not shown).

The upper surface plate (12) is coaxially disposed above the lower surface plate (11), and a donut disk-shaped grindstone (18) is attached to the lower part of the upper surface plate (12) so as to face the grindstone (17). It was done. The upper surface plate (12) can also rotate about its own axis and move in the vertical direction by a driving device (not shown).

The sun gear (13) is arranged at the axial center position of the grindstones (17) and (18) between the upper and lower surface plates (11) and (12), and is rotated around its own axis by a drive device (not shown). Has been done.

The internal gear (14) and the sun gear (13) at the radially outer position of the sun gear (13) and the work carrier (15) are thin plate-shaped external gears. One or a plurality of them are arranged in a donut-shaped space between the internal gear (14) and meshed with both sun and internal gears (13) (14). Further, the work carrier (15) is provided with one or a plurality of circular holding holes (19) along the outer peripheral shape of the magnetic disk substrate (A) at a position eccentric from the center position thereof. The work carrier (15) has a thickness smaller than that of the magnetic disk substrate (A), and the upper and lower sides of the work carrier (15) with the magnetic disk substrate (A) arranged in the holding hole (19). The surface of is capable of protruding to the outside of the holding hole (19).

The ratio of the number of teeth among the sun gear (13), the internal gear (14) and the work carrier (15) is set to 1: 3: 1, and the sun gear (13) is an integer of 4. When rotated multiple times, the work carrier (15) returns to the position it was in when the revolution started, and the work holding hole (19) of the carrier (15) also returns to the position it had when starting rotation. Has been

The unprocessed work standby part (2) and the processed work standby part (3) are arranged on both sides of the polishing process part (1).

These standby units (2) and (3) are attached to the tables (21) and (2).
2), a ring-shaped work receiver (23) having a predetermined height along the outer peripheral shape of the substrate is provided on the upper surface of the table (21) of the unprocessed work standby portion (2).

Then, the table (2
A shallow tray (28) is arranged on the upper surface of (2), and a ring-shaped work receiver (24) similar to the above is arranged in the tray (28), and other than the work receiver (24). In the above position, the outlet of the water pipe (29) as a liquid supply source is arranged above the tray (28). As shown in FIG. 2, the work receiver (24) has a height relatively lower than that of the tray (28), and the water in the water pipe (29) is placed in the tray (28). By being supplied, the water is filled. Further, the work receiver (24) is formed to have a depth such that the substrate (A) can be submerged below the water surface with the substrate (A) arranged therein. preferable.

The work receiving portions (23) and (24) of the two standby portions (2) and (3) are holding holes (19) of the carrier (15) when the sun gear (13) of the polishing portion (1) is stopped. )
It is arranged corresponding to the position of.

The unprocessed workpiece batch transfer device (4) is guided by a guide rail (25) arranged in parallel with the polishing processing section (1) and the workpiece standby sections (2) and (3), and is not processed. A reciprocating operation is performed between an upper position of the work standby table (21) and a position between the upper and lower surface plates (11, 12) of the polishing section (1). In addition, the machined work batch transfer device (5) is also guided by the guide rails (25) on the back, and the upper and lower surface plates (11) (12) of the polishing part (1).
It is reciprocally operated between a position between them and a position above the processed workpiece waiting table (22). Then, in each of the transfer devices (4) and (5), the substrate (A) is provided in its shaft hole corresponding to the positions of the work receiving portions (23) and (24) of the standby tables (21) and (22). Substrate chuckers (26) (27) for expanding and chucking the diameter are provided.

The unprocessed work accommodating rack (6) accommodates the substrates (A) in a stacked state, and is arranged adjacent to the unprocessed work standby part (2) by a conveyor or the like.

Further, the unprocessed workpiece individual transfer device (8) is arranged between the rack (6) and the unprocessed workpiece standby unit (2),
The substrates (A) are chucked one by one from the rack (6) and placed on the workpiece receiving portion (23) of the unprocessed workpiece standby table (21). The patterned operation is repeated. Has been done.

The cleaning / drying device (7) is arranged adjacent to the processed workpiece standby part (3). The machined work individual transfer device (9) is arranged between the cleaning / drying device (7) and the machined work standby unit (3), and the machine work receiving unit (24) of the machined work standby table (22). Substrate (A) waiting for each of the substrates is picked up one by one, taken out, and passed to the cleaning / drying device (7) to repeat the patterned operation.

Next, the operation of the polishing apparatus will be described together with its control system.

In the above-mentioned polishing device, the unworked work individual transfer device (8)
Thus, the substrates (A) in the rack (6) are sequentially arranged in the work receiving portion (23) of the unprocessed work standby table (21).

After the arrangement is completed, the unprocessed workpiece batch transfer device (4) descends while being positioned above the table (21), and the chucker (26) collectively chucks the substrates (A) and ascends. Then, it moves to the side of the polishing section (1) and is located on the lower surface plate (11). Then, the substrate (A) is lowered, and the substrate (A) is collectively placed in the holding hole (19) of the carrier (15), and then the chucker (26) is released, and the substrate is moved up to the raw work standby table (21) again. I will do it.

Then, in the polishing section (1), the upper surface plate (12) is moved downward, and the upper and lower surfaces of the substrate (A) are the upper and lower grindstones (17) (1
It is held under pressure in 8) and the sun gear (13) is held in that state.
Is rotated, and the upper and lower surface plates (11, 12) are also rotated to polish the substrate (A). Then, after the sun gear (13) has been rotated a predetermined number of times (an integer multiple of 4), the upper surface plate (12) is moved up. At that time, the work (A) is held by the carrier (15) in the same positional relationship as that of the sun gear (13) at the start of rotation.

Thereafter, the machined work batch transfer device (5) moves to the lower surface plate (11), descends, collectively chucks the substrate, and ascends, and moves to the machined work standby table (22) side.

Then, the processed work batch transfer device (5) is lowered on the table (22), the chuck of the substrate (A) is released at a predetermined height position, and the substrate (A) receives the work (24). ) Is placed under water. At this time, the substrate (A) receives the cushioning action of the water existing between the substrate (A) and the bottom surface of the receiver (24) and is arranged without impacting the bottom surface of the work receiver (24).

Then, the transfer device (5) is moved to a position above the processed workpiece standby table (22).

Then, the substrates (A) waiting on the processed work standby table (22) are taken out one by one by the processed work individual transfer device (9) and sequentially in the wet state to the cleaning / drying device (7). Handed over, washed and dried.

As described above, since the waiting part (3) as the processed work receiving part is configured to have the receiver (24) containing water, the processed work batch transfer device (5) The substrate (A) can be arranged on the receiver (24) without damaging the substrate (A) by the cushioning action of the water contained in the receiver (24). In particular, in the case of a flat work such as the magnetic disk substrate (A), the cushioning effect of water appears strongly,
The effect of preventing the substrate (A) from being damaged by the collision with the receiver (24) is more effectively exhibited. Moreover, since the substrate (A) is arranged in the receiver (24) containing water as described above, the substrate (A) is exposed to water immediately after the polishing process so that the polishing can be performed. Dirt such as liquid, cutting chips, and abrasive grains can be easily removed, and it is also prevented that the substrate (A) dries and stands by in the receiver (24) during standby, so that the next cleaning step can be performed. It becomes possible to efficiently and surely wash the substrate (A). Further, the substrate (A) which is on standby in the processed workpiece standby unit (3)
When taking out the processed work with the individual work transfer device (9),
The cushioning action of water allows the substrate (A) to be taken out without impact.

Incidentally, the polishing portion in the present invention, in addition to those by the above-described polishing machine for polishing the workpieces collectively by revolving the work carrier by the external gear by the action of the sun gear and the internal gear, For example, it may be a polishing machine or the like that holds the work in a state of protruding and fixed, applies a polishing platen from above, and rotates the polishing plate to polish the work. Further, the polishing section may be a polishing machine using a grindstone, or a so-called buffing polishing machine using a polishing cloth instead of the grinding stone.

Although water is used as the liquid contained in the work receiver (24) in the above embodiment, the device of the present invention is not limited to this, and the point is that it serves as a cushion when receiving the work, and There is no particular limitation on the type of liquid as long as it can prevent the work from drying.

EFFECTS OF THE INVENTION As described above, the polishing apparatus of the present invention is configured such that the inside of the workpiece receiving portion of the processed workpiece standby portion for temporarily holding the processed workpiece polished by the polishing portion in the mounted state is the cushion liquid. In the state where the inside of the work receiver of the processed work standby part is filled with the cushioning liquid, the processed work of the polishing part is chucked by the transfer device and floated. And the work is placed in the work receiver of the work waiting portion, the work is subjected to the cushioning action of the liquid in the work receiver during the placement. Therefore, by this cushioning action, the work can be placed on the processed work standby portion without damaging it.

Especially when polishing a workpiece such as an aluminum substrate for a magnetic disk, which requires high surface properties, this polishing device can be used to place the workpiece on the processed workpiece standby section without damaging it. It is possible to contribute to the improvement of the manufacturing yield of the work.

Moreover, the workpiece comes into contact with the liquid in the receiver during standby in the processed workpiece standby portion, and therefore the portion in contact with the liquid does not dry, and the polishing liquid, cutting chips, It is also possible to prevent sticking due to drying of dirt such as abrasive grains.

In addition, the processed workpiece standby unit is a liquid supply for supplying a cushioning liquid to a tray having a shallow bottom arranged in a horizontal state, a workpiece receiver provided in the tray, and a tray excluding the workpiece receiver. And a liquid supply source for supplying liquid into the tray so that the inside of the work receiver is filled with the cushioning liquid. Since it is designed to be lower than the edge height position, the supply of the cushioning liquid to the work receiver can be performed without hindering the placement operation of the processed work on the work receiver, and the work receiver It is possible to perform the descending mounting operation of the processed work without hindering the supply of the cushioning liquid to the work receiver.

Moreover, since the liquid is supplied to the shallow-bottomed tray, the work receiver can be filled with the cushion liquid with a small amount of the liquid, and the cushion liquid can be economically supplied.

[Brief description of drawings]

FIG. 1 is an overall perspective view showing an embodiment of the polishing apparatus of the present invention, and FIG. 2 is a vertical sectional view of a processed work receiving portion. FIG. 3 is a perspective view showing the structure of a polishing machine that has been conventionally used. (1) …… Polishing part, (3) …… Processed work standby part (processed work receiving part), (5) …… Work transfer device, (24) …… Work receiver, (A) …… Magnetic Aluminum base (work) for disks.

Front page continued (72) Inventor Isao Tezuka, 6-224, Kaiyama-cho, Sakai-shi, Osaka, Showa Aluminum Co., Ltd. (72) Yoshinobu Kimura, 6-224, Haiyama-cho, Sakai-shi, Osaka Prefecture, Showa Aluminum Co., Ltd. (56) References JP-A-62-136365 (JP, A)

Claims (1)

(57) [Claims] 1. A machined workpiece standby section for temporarily holding a machined workpiece in a mounted state is arranged adjacent to a machined section for polishing a workpiece, and the machined workpiece is polished by the machined section. A polishing apparatus equipped with a work transfer device that chucks the formed work and transfers it to the processed work standby part in a floating state and places the work, wherein the processed work standby part is arranged in a horizontal state. A shallow-bottom tray, a ring-shaped work receiver having a predetermined height provided in the tray, and a liquid supply source for supplying a cushioning liquid to the tray excluding the work receiver are provided. By supplying the liquid into the tray, the liquid is supplied from the tray into the work receiver, and the upper edge height position of the work receiver is set so that the work receiver is filled with the cushioning liquid. Shallow tray Polishing apparatus characterized by comprising been designed lower than the upper edge height.