JPH0425373A - Polishing device - Google Patents

Abstract

PURPOSE:To receive a polished work without its damaging at a receiving part, by providing a work receiver in which liquid is stored at a work receiving part. CONSTITUTION:A work (aluminum substrate for magnetic disc) A transferred to a work receiving part 3 by a transfer device 5 from a polishing part 1 is apart from the transfer device 5 in the position of the work receiver 24 of the receiving part 3 and received into this receiver 24 while receiving the cushioning action by the liquid. In this case, the work A is arranged inside the liquid stored in the receiver 24 while under its standby at the receiving part 3, so it is not dried and no sticking of dirt while under polishing, etc., is caused.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a polishing apparatus for polishing a workpiece such as an aluminum substrate for a magnetic disk.

2. Description of the Related Art Conventionally, a processing machine (51) as shown in FIG. 3 has been used as a polishing machine for polishing, for example, an aluminum substrate for a magnetic disk.

The polishing machine (51) in the figure includes a lower surface plate (53) which is rotatably held and has a donut-shaped grindstone (52) attached to the upper surface, and an upper part of the lower surface plate (53). an upper surface plate (55) which is disposed coaxially with the surface plate (53), is rotatably driven and movable up and down, and has a donut-shaped grindstone (54) on its lower surface; ,
A sun gear (57) arranged between each grinding wheel (52) (54) at the axis of the grinding wheel;
An internal gear (59
) between the internal gears (59) and the sun gear (57) and placed on the grindstone (52) of the lower surface plate (53). It consists of a work carrier (56) arranged in the form of an external gear. This work carrier (5G) has an eccentric circular holding hole (60) that follows the outer circumferential shape of the magnetic disk substrate (A), and the magnetic disk substrate (A) is placed in the holding hole (60). ) is formed to be thinner than the substrate (A) so that both upper and lower surfaces of the substrate protrude outward from the holding hole (60) of the carrier (56).

In this polishing machine (51), the upper surface plate (55
) is located at the upper standby position, the magnetic disk substrate (A) is inserted into the holding hole (60) of the work carrier (56).
The upper surface plate (55) is lowered and both sides of the magnetic disk substrate (A) are placed inside the upper and lower grinding wheels (52).
It is caught in (54). In the pressurized state, the sun gear (57) is rotated, so that the work carrier (5B) is rotated and revolved around the sun gear (57), and the upper and lower surface plates (53) and (55) are also rotated. The magnetic disk substrate (A) is rotated, and both sides of the magnetic disk substrate (A) are polished. After polishing, the upper surface plate (55) is raised, the substrate (A) held by the carrier (56) is taken out, a new substrate is held by the carrier (56), and polishing is restarted. .

By the way, conventionally, when polishing a magnetic disk substrate using the above processing machine, an operator takes out the substrate (A) from the rack and inserts it into each holding hole (6) of the work carrier (56).
0) and the carrier (56) after polishing is completed.
The process was carried out by repeatedly taking out the board (A).

However, the repetitive manual work described above is
This places a heavy burden on workers and limits the ability to improve the workpiece processing efficiency of the device.

Therefore, there has been a demand for the development of automated equipment that automates the polishing process and automatically loads the substrate into the polishing machine (51) and automatically unloads it after polishing is completed.

Therefore, as one aspect of such automated equipment, the present inventors installed a polishing machine (51) adjacent to the polishing machine (51) as described above.
A raw workpiece take-out part and a processed workpiece receiving part are arranged respectively, and the unprocessed board in the takeout part is sent to the polishing machine (51), and the board that has been polished by the polishing machine (5■) We are attempting to put into practical use a polishing machine equipped with a workpiece transfer device that transfers processed workpieces to a receiving section.

In order to put such a polishing device into practical use, it is necessary to solve the problem of how to receive the substrate that has been polished by the polishing machine (51) into the processed workpiece receiving section without damaging the substrate. This was taken up as one of the issues that should be addressed.

That is, when placing a substrate in the receiving section by the work transfer device, the substrate may fall onto the bottom surface of the receiver in the receiving section, or
The board may be damaged by being pressed against it. This becomes a serious problem, especially when the workpiece requires a high surface quality, such as the above-mentioned magnetic disk substrate.

On the other hand, while waiting in the processed workpiece receiving section, dirt such as polishing liquid, chips, abrasive grains, etc. that adhered during polishing processes dry and stick to the substrate, causing problems in the cleaning process performed after polishing. Difficulties may also arise in cleaning the substrate.

The present invention solves these problems and allows the workpieces that have been polished in the polishing section to be received in the finished workpiece receiving section without causing any damage. It is an object of the present invention to provide a polishing device capable of preventing the occurrence of sticking.

Means for Solving the Problems In order to achieve the above-mentioned object, the present invention provides a machined workpiece receiving section in which a processed workpiece receiving section for receiving a processed workpiece is disposed adjacent to a polishing section that performs a polishing process on the workpiece, and in the workpiece receiving section,
A polishing device equipped with a workpiece transfer device for transporting a workpiece polished in the polishing section, wherein the workpiece receiving section includes a workpiece receiver containing a liquid. The gist is:

Operation In the above configuration, the workpiece transferred from the polishing section to the workpiece receiving section by the transfer device is separated from the transfer device at the position of the workpiece receiver of the receiving section, and is placed in the receiver while receiving a cushioning action from the liquid. I can accept it.

Moreover, since the work is placed in the liquid while it is waiting at the receiving section, it does not dry out, and dirt that has adhered during polishing or the like does not become stuck.

EXAMPLE Hereinafter, an example in which the present invention is applied to a polishing apparatus for automatically polishing a disk-shaped aluminum substrate for a magnetic disk will be described with reference to the drawings.

In the polishing apparatus shown in Fig. 1, (1) is a polishing processing section, (2) is an unprocessed workpiece special section, (3) is a processed workpiece special section as a work receiving section, and (4) is an unprocessed workpiece special section. Processed workpiece bulk transfer device (5) is a processed workpiece sliding transfer device. In addition, (6) is a raw workpiece storage rack, (7)
(8) is a cleaning/drying device, (8) is an unprocessed workpiece individual transfer device, and (9) is a processed workpiece individual transfer device.

The polishing part (1) has upper and lower surface plates (11) (12)
This polishing machine consists of a sun gear (13), an internal gear (14), and a work carrier (15).The carrier (15) is rotated by the rotation of the sun gear (13).
rotates and revolves, and then the upper and lower surface plates (11) (12)
is also rotationally driven to polish the substrate (A).

In this polishing part (1), the lower surface plate (11) is
A donut-shaped grindstone (17) with a predetermined thickness is attached to the upper part of the grindstone, and can be rotated around its own axis and moved in the vertical direction by a drive device (not shown).

The upper surface plate (I2) is disposed above the lower surface plate (11) coaxially and oppositely, and a donut-shaped grindstone (18) is attached to the bottom thereof so as to face the grindstone (17). It is what was done. And this upper surface plate (12) also,
A drive device (not shown) rotates about its own axis and moves vertically.

The sun gear (13) has both upper and lower surface plates (11) (12)
The grinding wheel (17) (1g) is placed between the grinding wheels at the center of its axis, and is rotated about its own axis by a drive device (not shown).

The internal gear (14) is arranged concentrically at a position radially outward of the sun gear (13) with a donut-shaped space between the internal gear (14) and the sun gear (13).

The work carrier (15) is a thin plate-shaped external gear, and one or more work carriers (15) are arranged in a donut-shaped space between the sun gear (13) and the internal gear (14). It meshes with both gears (13) and (14). The work carrier (15) also has a magnetic disk U plate (
One or more circular holding holes (19) are provided along the outer circumferential shape of A). The thickness of this work carrier (15) is formed to be thinner than that of the magnetic disk substrate (A), and when the magnetic disk substrate (A) is placed in the holding hole (19), The surface of the holding hole (19) protrudes outward from the holding hole (19).

Here, the ratio of the number of teeth between the sun gear (13), internal gear (14), and work carrier (15) is 1:3.
:1, and when the sun gear (13) is rotated an integral multiple of 4 times, the work carrier (15) returns to the position where it was at the start of revolution, and the carrier (1
The workpiece holding hole (19) (5) is also adapted to return to the position where it was at the start of rotation.

Unprocessed work special equipment section (2) and processed work special equipment section (3
) are arranged on both sides of the polishing section (1).

These special parts (2) and (3) are the table (21)
According to (22), a ring-shaped work receiver (23) of a predetermined height along the outer circumferential shape of the substrate is provided on the upper surface of the table (21) of the unprocessed work special equipment section (2).

Then, the table (22
A shallow-bottomed tray (28) is arranged on the upper surface of ), and a ring-shaped workpiece receiver (24) similar to the one described above is arranged inside the tray (28), and other than the workpiece receiver (24) An outlet portion of the water pipe (29) is disposed above the tray (28). As shown in Figure 2, the height of the workpiece receiver (24) is made relatively lower than the height of the tray (28), so that water from the water pipe (29) can flow into the tray (2B). It is filled with water by being supplied with water. Further, the workpiece receiver (24) is formed to have a depth such that the substrate (A) can be submerged under the water surface with the substrate (A) placed therein. preferable.

Each work receiving part (
23) (24) is the sun gear (
13) is arranged corresponding to the position of the holding hole (19) of the carrier (15) in a stopped state.

The unprocessed workpiece bulk transfer device (4) is connected to the polishing section (1)
, the position above the unprocessed work waiting table (21) and the polishing part (
1) It is designed to be reciprocated between the positions between the upper and lower surface plates (11) and (12). Also, the processed workpiece-sliding transfer device (5) is also connected to the guide rail (
25) and are guided by the upper and lower surface plates (1) of the polishing section (1).
It is designed to reciprocate between the position between 1) and (12) and the position above the processed work standby table (22). Both transfer devices (4) and (5) each have substrates (A
) is provided with substrate chuckers (26) and (27) for chucking the substrate by enlarging its diameter in its shaft hole.

The unprocessed work storage rack (6) stores the substrates (A) in a stacked state, and is arranged adjacent to the unprocessed work special equipment section (2) by a conveyor or the like.

In addition, the unprocessed work individual transfer device (8) is connected to the rack (6).
The board (A) is chucked and taken out one by one from the rack (6) and transferred to the work receiving part (21) of the unprocessed work standby table (21). 23), the patterned movement of placing the parts in the pattern is repeated.

The cleaning/drying device (7) is arranged adjacent to the processed workpiece special equipment section (3). The processed workpiece individual transfer device (9) is connected to the washing/drying device (7) and the processed workpiece special equipment section (
3) is placed between the machined workpiece standby table (
The substrate (
The patterned operation of chucking and taking out A) one by one and passing it on to the washing/drying device (7) is repeated.

Next, the operation of the polishing apparatus will be explained together with its control system.

In the above-mentioned polishing apparatus, the substrates (A) in the rack (6) are sequentially placed in the work receiving part (23) of the raw work standby table (21) by the unprocessed work individual transfer device (8). .

After the arrangement is completed, the unprocessed workpiece bulk transfer device (4) is lowered while being positioned above the table (21), and the chucker (26) collectively chucks the substrates (A).
Rise. Then, it moves to the polishing part (1) side and is located on the lower surface plate (11). Then, it descends and the substrate (A
) is placed in the holding hole (19) of the carrier (15), the chucker (2B) is released, the work is raised, and the unprocessed work is placed on the standby table (21) again.

In the polishing section (1), the upper surface plate (12) is moved downward, and the upper and lower surfaces of the substrate (A) are placed on the upper and lower grinding wheels (17).
(18) is held in a pressurized state, and in that state the sun gear (13) is rotated, and the upper and lower surface plates (11)
(12) is also rotated to polish the substrate (A). After the sun gear (13) completes rotation a predetermined number of times (an integral multiple of 4), the upper surface plate (12) is moved upward.

At that time, the workpiece (A) is placed on the carrier (15) in the same positional relationship as the sun gear (13) when it starts rotating.
is maintained.

After that, the machined workpiece bulk transfer device (5) moves onto the lower surface plate (11), lowers, chucks the substrates all at once, ascends, and moves to the machined workpiece waiting table (22). .

Then, the machined workpiece bulk transfer device (5) is lowered on the table (22), the chuck of the substrate (A) is released at a predetermined height position, and the substrate (A) is transferred to the workpiece receiver ( 24) placed submerged in the interior of the vehicle. At this time, the substrate (A) receives a cushioning effect from the water existing between it and the bottom surface of the workpiece receiver (24), and is placed without impacting the bottom surface of the workpiece receiver (24).

Thereafter, the transfer device (5) is moved to a position above the processed work standby table (22).

Then, the substrates (A) waiting on the processed work standby table (22) are taken out one by one by the processed work individual transfer device (9), and are sequentially transferred to the cleaning/drying device (7) in a wet state. Waved, washed and dried.

As mentioned above, the special equipment section (as the processed workpiece receiving section)
3) is configured with a receiver (24) containing water, so that the machined workpiece bulk transfer device (5
) can be carried out without damaging the substrate (A) by the cushioning action of the water contained in the receiver (24).

Particularly in the case of a flat work such as a magnetic disk substrate (A), the cushioning effect of water is strong, and the effect of preventing damage to the substrate (A) due to collision with the receiver (24) is more effective. Demonstrated. Moreover, since the substrate (A) is arranged in the water-containing container (24) as described above, the substrate (A) is placed immediately after polishing.
When A) is exposed to water, dirt such as polishing liquid, chips, abrasive grains, etc. is easily removed, and while waiting in the receiver (24), the board (A) dries and becomes caked with dirt. Therefore, it becomes possible to efficiently and reliably clean the substrate (A) in the next cleaning step. Furthermore, a board (A) is placed on standby in the machined workpiece special equipment section (3).
When taking out processed workpieces with the individual transfer device (9),
Due to the cushioning effect of water, the substrate (A) can be taken out without impacting it.

In addition, the polishing section in the present invention includes a polishing machine as described above that polishes the workpieces all at once by rotating and revolving a work carrier formed by an external gear by the action of a sun gear and an internal gear. For example, a polishing machine or the like may be used, which polishes the workpiece by holding the workpiece in an upwardly protruding fixed state, applying a polishing disk from above, and rotating the polishing disk. Further, the polishing section may be a polishing machine using a grindstone, or a polishing machine using a so-called puff polishing method using a polishing cloth instead of a grindstone.

Further, in the above embodiment, water is used as the liquid contained in the workpiece receiver (24), but the device of the present invention is not limited to this. There is no particular restriction on the type of liquid as long as it can prevent the workpiece from drying out.

Effects of the Invention As described above, in the polishing apparatus of the present invention, the workpiece receiving section that receives the workpiece from the polishing section is equipped with a workpiece receiver containing liquid. It is placed in the receptacle under the cushioning action of the liquid contained therein. Therefore, the polished workpiece can be received by the receiving portion without being damaged.

Moreover, since the processed workpiece can be received via liquid,
It does not dry and can prevent stains such as polishing fluid, cutting chips, abrasive grains, etc. from drying out and sticking to the surface.

In particular, when polishing workpieces that require high surface quality, such as aluminum substrates for magnetic disks, this polishing device allows the workpieces to be received by the receiving section without being damaged. This can contribute to improving the manufacturing yield.

[Brief explanation of the drawing]

FIG. 1 is an overall perspective view showing an embodiment of the polishing apparatus of the present invention, and FIG. 2 is a vertical sectional view of a processed workpiece receiving section. FIG. 3 is a perspective view showing the configuration of a conventional polishing machine. (1) Polishing section, (3) Finished workpiece special section (5)... Workpiece transfer device, (24)... Workpiece receiver, (A)... Aluminum substrate for magnetic disk (workpiece).

Claims (1)

[Claims] A processed workpiece receiving section for receiving a processed workpiece is arranged adjacent to a polishing section that performs polishing processing of a workpiece, and a workpiece transfer section that transfers the workpiece polished in the polishing section to the workpiece receiving section. What is claimed is: 1. A polishing apparatus equipped with a polishing apparatus, wherein the workpiece receiving section includes a workpiece receiver containing a liquid.