CN110962021A - Polishing equipment - Google Patents
Polishing equipment Download PDFInfo
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- CN110962021A CN110962021A CN201911418971.7A CN201911418971A CN110962021A CN 110962021 A CN110962021 A CN 110962021A CN 201911418971 A CN201911418971 A CN 201911418971A CN 110962021 A CN110962021 A CN 110962021A
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- Prior art keywords
- polishing
- station
- polishing head
- head
- fine
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to the technical field of silicon wafer processing equipment, in particular to polishing equipment. The polishing equipment provided by the invention comprises a workbench, a polishing disk module and a polishing head module, wherein the polishing head module comprises a polishing head and a polishing head driving device, a feeding and discharging station, a rough polishing station, a middle polishing station and a fine polishing station are sequentially arranged on the workbench, the polishing disk devices are arranged on the rough polishing station, the middle polishing station and the fine polishing station, the polishing head driving device drives the polishing head to carry a silicon wafer to be matched with the polishing disk devices on the corresponding stations, the operating mechanisms of all the processes in the polishing equipment are reasonable in layout, the rough polishing, the middle polishing and the fine polishing can be simultaneously carried out, and the polishing efficiency is high. In addition, in the whole polishing operation flow, the polishing head carries the silicon wafer to carry out rough polishing, intermediate polishing and fine polishing in sequence, damage caused in the silicon wafer transfer process is reduced, and the yield of the silicon wafer is improved.
Description
Technical Field
The invention relates to the technical field of silicon wafer processing equipment, in particular to polishing equipment.
Background
The silicon wafer polishing process method comprises the following steps: front cleaning, sticking, rough polishing, middle polishing, fine polishing, stripping, dewaxing and cleaning. At present, polishing heads are usually used by polishing equipment for silicon wafers to drive ceramic discs to rotate on a grinding machine so as to carry out polishing operation, and the existing polishing equipment has the problems of unreasonable layout of operation mechanisms of all working procedures and low operation efficiency. In addition, when the silicon wafer is transferred between the working procedures, the risk of damaging the silicon wafer exists, and the yield of the silicon wafer is reduced.
Therefore, a polishing apparatus is urgently needed to solve the above problems.
Disclosure of Invention
The invention aims to provide polishing equipment to solve the problems of unreasonable layout, low polishing efficiency and low silicon wafer yield of the prior art.
In order to realize the purpose, the following technical scheme is provided:
a polishing apparatus comprising:
the workbench comprises a feeding and discharging station, a rough polishing station, a middle polishing station and a fine polishing station;
the three polishing disc modules are respectively arranged on the rough polishing station, the middle polishing station and the fine polishing station;
and the polishing head modules comprise polishing heads and polishing head driving devices, the polishing heads are arranged on the polishing head driving devices, and the polishing head driving devices can drive the polishing heads to absorb the silicon wafers and switch between different stations, so that the polishing heads can be matched with the polishing disk modules on corresponding stations to perform rough polishing, medium polishing and fine polishing on the silicon wafers at the same time.
As a preferable scheme of the polishing apparatus, the polishing head driving device includes a turntable and a polishing head driving mechanism, the polishing head driving mechanism is disposed on the turntable, the polishing head is disposed on the polishing head driving mechanism, and the turntable is capable of rotating to enable the polishing head on the polishing head driving mechanism to be matched with the polishing disk module on the corresponding station.
As a preferable scheme of the polishing equipment, the number of the polishing head driving mechanisms is four, and the four polishing head driving mechanisms are respectively arranged opposite to the feeding and discharging station, the rough polishing station, the middle polishing station and the fine polishing station.
As a preferable scheme of the polishing apparatus, the polishing head driving mechanism includes a mounting plate and a rotary lifting driving assembly, the mounting plate is fixedly disposed on the turntable, and the rotary lifting driving assembly is connected to the polishing head to drive the polishing head to rotate and/or lift.
As a preferable scheme of the polishing apparatus, one polishing head is disposed on each of the rotary lifting drive assemblies, and a plurality of the rotary lifting drive assemblies are disposed on the mounting plate.
As a preferable aspect of the polishing apparatus, the polishing head is a floating type polishing head.
As a preferable scheme of the polishing apparatus, the polishing apparatus further includes a positioning device, and the positioning device is capable of making the turntable stand at a position where the polishing head can be matched with the polishing disk module.
As a preferred scheme of the polishing equipment, the number of the positioning devices is four, and the four positioning devices are respectively arranged opposite to the feeding and discharging station, the rough polishing station, the middle polishing station and the fine polishing station.
As a preferable aspect of the polishing apparatus, the polishing apparatus further includes a brake device capable of decelerating the turntable to stop rotating.
As a preferable scheme of the polishing apparatus, the polishing disk module includes a polishing disk and a polishing disk driving device, and the polishing disk driving device can drive the polishing disk to rotate and move in a horizontal plane.
Compared with the prior art, the invention has the beneficial effects that:
the polishing equipment provided by the invention comprises a workbench, a polishing disk module and a polishing head module, wherein the polishing head module comprises a polishing head and a polishing head driving device, a feeding and discharging station, a rough polishing station, a middle polishing station and a fine polishing station are sequentially arranged on the workbench, the polishing disk devices are arranged on the rough polishing station, the middle polishing station and the fine polishing station, the polishing head driving device drives the polishing head to carry a silicon wafer to be matched with the polishing disk devices on the corresponding stations so as to simultaneously perform rough polishing, middle polishing and fine polishing on the silicon wafer, the operating mechanisms of all the processes in the polishing equipment are reasonable in layout, the rough polishing, the middle polishing and the fine polishing can be simultaneously performed, and the polishing efficiency is high. In addition, in the whole polishing operation flow, the polishing head carries the silicon wafer to carry out rough polishing, intermediate polishing and fine polishing in sequence, damage caused in the silicon wafer transfer process is reduced, and the yield of the silicon wafer is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.
Fig. 1 is a sectional view of a polishing apparatus provided by an embodiment of the present invention;
FIG. 2 is a top view of a polishing apparatus provided in an embodiment of the present invention;
fig. 3 is a sectional view of a polishing head driving apparatus according to an embodiment of the present invention in one direction;
fig. 4 is a sectional view of a polishing head driving apparatus according to another embodiment of the present invention;
fig. 5 is a partial plan view of a polishing head driving apparatus according to an embodiment of the present invention;
FIG. 6 is a cross-sectional view of a polishing head provided by an embodiment of the present invention;
fig. 7 is a sectional view of a polishing pad driving apparatus according to an embodiment of the present invention;
fig. 8 is a partial top view of a polishing pad drive apparatus according to an embodiment of the present invention.
Reference numerals:
1-a workbench; 11-a loading and unloading station; 12-a rough polishing station; 13-middle polishing station; 14-a fine polishing station;
2-a polishing disk module; 21-a polishing disk; 22-polishing disc drive means; 221-fixing disc; 2211-upper fixed plate; 2212-first lower fixed plate; 2213-second lower fixed plate; 222-a polishing disc rotation drive mechanism; 2221-a first motor; 2222-main shaft; 223-a fixed seat; 2231-a first fixed seat; 2232-a second fixed seat; 2233-a third fixing seat; 2234-a fourth fixing seat; 2235-follower; 224-polishing disk horizontal drive mechanism; 2241-a second motor; 2242-lead screw; 2243-a guide rail; 2244-a slide block; 225-moving plate; 226-pipeline shaft;
3-polishing head; 31-a rotating shaft; 311-outer spur gear; 32-a slider; 321-internal spur gears; 33-polishing plate; 34-a base; 35-mounting flange; 36-an elastic member; 37-intermediate connectors;
4-a polishing head driving device; 41-a turntable; 42-a polishing head drive mechanism; 421-a mounting plate; 422-polishing head rotation drive assembly; 423-polishing head lifting driving component;
5-a positioning device;
6-a brake device.
Detailed Description
In order to make the technical solutions of the present invention better understood by those skilled in the art, the technical solutions of the present invention are further described below by way of specific embodiments with reference to the accompanying drawings.
In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally laid out when the product is used, and are only for convenience of description of the present invention, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", and the like are used for descriptive purposes only or to distinguish between different structures or components and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1 to 2, the present embodiment provides a polishing apparatus including a table 1, a polishing disk module 2, and a polishing head module including a polishing head 3 and a polishing head driving device 4. The workbench 1 comprises a loading and unloading station 11, a rough polishing station 12, a middle polishing station 13 and a fine polishing station 14, the three polishing disc modules 2 are respectively arranged on the rough polishing station 12, the middle polishing station 13 and the fine polishing station 14, and the polishing head driving device 4 can drive the polishing head 3 to absorb the silicon wafer and switch between different stations, so that the polishing head 3 can be matched with the polishing disc modules 2 on the corresponding stations to simultaneously perform rough polishing, middle polishing and fine polishing on the silicon wafer. The operation mechanisms of all processes in the polishing equipment are reasonable in layout, can perform rough polishing, medium polishing and fine polishing simultaneously, and is high in polishing efficiency. In addition, in the whole polishing operation flow, the polishing head 3 carries the same silicon wafer to carry out rough polishing, middle polishing and fine polishing in sequence, damage caused in the silicon wafer transfer process is reduced, and the silicon wafer yield is improved.
As shown in fig. 2, in order to ensure that the polishing head 3 can be disposed opposite to the polishing disk module 2 at the corresponding station, the polishing apparatus further includes a positioning device 5, and the positioning device 5 can make the turntable 41 stand still at a position where the polishing head 3 is opposite to the polishing disk module 2.
Preferably, the number of the positioning devices 5 is four, and the four positioning devices 5 are respectively arranged corresponding to the loading and unloading station 11, the rough polishing station 12, the middle polishing station 13 and the fine polishing station 14. Illustratively, four positioning devices 5 are located at the rear side of the respective stations, respectively. In other embodiments, four positioning devices 5 may also be provided at the front side of the respective stations.
Further, the polishing equipment also comprises a brake device 6, the brake device 6 can enable the polishing head driving device 4 to decelerate to stop rotating, and the brake device 6 can ensure that the rotating polishing head driving device 4 stops stably.
Illustratively, in the present embodiment, the number of the brake devices 6 is two, and one of the two brake devices 6 is disposed at the front side of the fine polishing station 14, and the other is disposed at the rear side of the fine polishing station 14. Of course, in other embodiments, the number of the braking devices 6 may also be three, four, etc., and the setting positions and the setting number of the braking devices 6 may be set as required.
Preferably, the polishing disk module 2 comprises a polishing disk 21 and a polishing disk driving device 22, and the polishing disk driving device 22 can drive the polishing disk 21 to rotate in a horizontal plane. Specifically, the polishing disk 21 and the polishing head 3 are both capable of rotating to polish silicon wafers. In this embodiment, the structures of the polishing disk modules 2 at the rough polishing station 12, the middle polishing station 13 and the fine polishing station 14 are the same, and during the polishing process, rough polishing, middle polishing and fine polishing are realized by arranging different polishing liquids and polishing particles between the polishing disk modules 2 and the polishing head 3. Illustratively, the polishing disc driving device 22 includes a polishing disc rotation driving mechanism, the polishing disc rotation driving mechanism includes a first motor, a transmission assembly and a spindle, the spindle is indirectly connected with the polishing disc 21, and the first motor can drive the spindle to rotate through the transmission assembly so as to drive the polishing disc 21 to rotate.
Preferably, the polishing disk driving device 22 is also capable of driving the polishing disk 21 to move in a horizontal plane to adjust the position of the polishing disk 21 so that the polishing disk 21 can cooperate with the polishing head 3 to perform polishing. Illustratively, the polishing disk driving device 22 further includes a polishing disk horizontal driving mechanism, the polishing disk horizontal driving mechanism includes a second motor, a ball screw and a moving plate, the polishing disk rotational driving mechanism is disposed on the moving plate, the moving plate is fixedly connected to the nut seat of the ball screw, and the second motor can drive the ball screw to rotate so as to move the moving plate along the ball screw, i.e., the polishing disk rotational driving mechanism drives the polishing disk 21 to move along the ball screw.
Preferably, as shown in fig. 2 in combination with fig. 1, the polishing head driving device 4 includes a turntable 41 and a polishing head driving mechanism 42, the polishing head driving mechanism 42 is disposed on the turntable 41, the polishing head 3 is disposed on the polishing head driving mechanism 42, and the turntable 41 can rotate to enable the polishing head 3 on the polishing head driving mechanism 42 to cooperate with the polishing disk module 2 on the corresponding station to polish the silicon wafer.
Further, as shown in fig. 2, the number of the polishing head driving mechanisms 42 is four, four polishing head driving mechanisms 42 are disposed on the turntable 41, and the turntable 41 can rotate to enable the four polishing head driving devices 4 to be respectively disposed opposite to the loading and unloading station 11, the rough polishing station 12, the middle polishing station 13, and the fine polishing station 14, so as to respectively perform loading and unloading, rough polishing, middle polishing, and fine polishing operations at the same time.
Preferably, the polishing head driving mechanism 42 can drive the polishing head 3 to move in the vertical direction to adsorb the silicon wafer. In order to improve the polishing precision, the polishing head driving mechanism 42 can also drive the polishing head 3 to rotate to cooperate with the polishing disk module 2 for silicon wafer polishing. The three polishing disk modules 2 can be matched with the polishing head 3 to perform rough polishing, medium polishing and fine polishing on the silicon wafer.
Further, as shown in fig. 3 to 5, the polishing head driving mechanism 42 includes a mounting plate 421 and a rotary lifting driving assembly, the mounting plate 421 is fixedly disposed on the turntable 41, and the rotary lifting driving assembly is connected to the polishing head 3 to drive the polishing head 3 to rotate and/or lift.
Preferably, one polishing head 3 is disposed on each of the rotary elevating driving assemblies, and a plurality of the rotary elevating driving assemblies are disposed on the mounting plate 421. For example, as shown in fig. 5 in combination with fig. 4, two rotary lifting drive assemblies are disposed on the mounting plate 421, that is, two polishing heads 3 are correspondingly disposed at each station, and there are eight polishing heads 3 in total, so that simultaneous loading and unloading of two silicon wafers can be realized, and six silicon wafers are polished simultaneously, which can improve the operation efficiency of the polishing apparatus. In other embodiments, the number of the rotary lifting driving assemblies can be any other number, and the design can be carried out according to the requirement and the size of the working space.
In other embodiments, the number of the rotary lifting driving assemblies can be any other number, and can be designed according to needs, which is not illustrated herein.
Optionally, the rotary lifting drive assembly comprises a polishing head rotary drive assembly 422 and a polishing head lifting drive assembly 423, and the polishing head rotary drive assembly 422 can drive the polishing head 3 to rotate, so that the polishing head 3 cooperates with the polishing disk module 2 to polish the silicon wafer; the polishing head lifting/lowering drive assembly 423 is capable of driving the polishing head 3 to move in a direction close to or away from the polishing platen module 2 to adjust the distance between the polishing head 3 and the polishing platen 21.
Further, polishing head rotation driving assembly 422 includes rotating electrical machines, rotatory synchronous pulley group and rotatory connecting axle, and rotatory connecting axle is connected with polishing head 3, and rotating electrical machines drives rotatory connecting axle through rotatory synchronous pulley group and rotates. Rubbing head lift drive subassembly 423 includes elevator motor and lift ball, and the nut seat and the indirect fixed connection of rotation connecting axle of lift ball, elevator motor can drive lift ball and rotate in order to drive rotation connecting axle and move along vertical direction, further drives rubbing head 3 and moves along vertical direction. Illustratively, the rotating connecting shaft is a hollow shaft, and the other end of the rotating connecting shaft is connected with an air source for regulating the acting force between the polishing head 3 and the polishing disk 21 into the polishing head 3 or exhausting air to make the polishing head 3 suck the silicon wafer.
Preferably, the polishing head 3 is a floating type polishing head. When the polishing head 3 is matched with the polishing disk 21 for polishing, the polishing head driving device 4 drives the polishing head 3 to rotate, the polishing disk driving device 22 drives the polishing disk 21 to rotate, the polishing head 3 and the polishing disk 21 rotate simultaneously to polish a silicon wafer, the polishing head 3 is set to be a floating type polishing head, the vertical distance between the polishing head 3 and the polishing disk 21 can be adjusted according to needs, and the polishing pressure of the polishing head 3 and the polishing disk 21 on the silicon wafer is adjusted.
Alternatively, as shown in fig. 6, the polishing head 3 includes a rotating shaft 31, a slider 32, and a polishing plate 33, wherein the rotating shaft 31 and the slider 32 are connected by a gear, and the polishing plate 33 is fixedly connected to the slider 32. Furthermore, a step is arranged on the rotating shaft 31, and a limiting protrusion is arranged on the inner wall of the floating block 32 and is abutted against the step of the rotating shaft 31 to prevent the floating block 32 from being separated from the rotating shaft 31. The rotating shaft 31 and the floating block 32 are connected through a gear, so that the rotating shaft 31 can drive the floating block 32 to rotate when rotating, and when the floating block 32 or the polishing plate 33 is subjected to an axial force, the floating block 32 can move axially relative to the rotating shaft 31, namely, the polishing plate 33 is driven to move axially along the rotating shaft 31, and the floating design of the polishing plate 33 is realized.
Illustratively, in this embodiment, an outer spur gear 311 is fixedly connected to an end of the rotating shaft 31, an inner spur gear 321 is fixedly connected to an end of the slider 32, and the inner spur gear 321 of the slider 32 and the outer spur gear 311 of the rotating shaft 31 cooperate to realize that the rotating shaft 31 drives the slider 32 to rotate and the slider 32 can move in the axial direction relative to the rotating shaft 31.
Preferably, the polishing head 3 further comprises a base 34 and a mounting flange 35, the rotating shaft 31 is fixedly disposed on the lower surface of the base 34, the mounting flange 35 is fixedly disposed on the upper surface of the base 34, and the mounting flange 35 is used for connecting with the polishing head rotation driving assembly 422.
Further, an elastic member 36 is disposed on the lower surface of the base 34, wherein a ventilation channel is disposed on the base 34, an external power member is detachably connected to one side of the base 34, an edge of the elastic member 5 is attached to one side surface of the base 34 and can form a sealed space with the base 34, and the external power member inflates the sealed space through the ventilation channel, so that the elastic member 5 expands to drive the polishing plate 33 to move axially along the rotating shaft 31. Specifically, the polishing plate 33 is fixedly disposed on the middle connecting member 37, the middle connecting member 37 is sleeved on the outer side of the slider 32, when the external power member inflates the sealed space through the ventilation channel to expand the elastic member 5, the elastic member 5 pushes the middle connecting member 37 to move downward, and the middle connecting member 37 can drive the polishing plate 33 to move downward. Preferably, the elastic member 36 may be a rubber pad.
As shown in fig. 7 to 8, the polishing disk drive unit 22 includes a fixed disk 221, and the fixed disk 221 is used for adsorbing and supporting the polishing disk 21 so that the polishing disk 21 cooperates with the polishing head 3 to polish the silicon wafer.
Preferably, the fixed tray 221 includes an upper fixed tray 2211, a first lower fixed tray 2212 and a second lower fixed tray 2213, the upper fixed tray 2211 is provided with vent holes, the first lower fixed tray 2212 and the second lower fixed tray 2213 are both provided with vent grooves, after the first lower fixed tray 2212 and the second lower fixed tray 2213 are fixedly connected, the vent grooves therebetween form a vent channel, and the vent channel is communicated with the vent holes on the upper fixed tray 2211, so that the upper fixed tray 2211 can absorb the polishing tray 21.
Further, the polishing disc driving device 22 further includes a polishing disc rotation driving mechanism 222, the polishing disc rotation driving mechanism 222 includes a first motor 2221 and a main shaft 2222, the main shaft 2222 is fixedly connected to the fixed disc 221, and the first motor 2221 drives the main shaft 2222 to drive the fixed disc 221 to rotate, that is, drive the polishing disc 21 to rotate.
Specifically, the main shaft 2222 and the second lower fixed plate 2213 are fixedly connected through the fixed seat 223. The fixing seat 223 includes a first fixing seat 2231, a second fixing seat 2232, a third fixing seat 2233 and a fourth fixing seat 2234, wherein, the first fixing seat 2231 is fixedly connected with the main shaft 2222, the first fixing seat 2231 is fixedly connected with the second fixing seat 2232, the second fixing seat 2232 is fixedly connected with the second lower fixed plate 2213, the third fixing seat 2233 is sleeved on the outer side of the second fixing seat 2232 and is fixedly connected with the second fixing seat 2232 relatively, the third fixing seat 2233 is rotatably connected with the fourth fixing seat 2234 through a rolling bearing, namely, under the action of the main shaft 2222, the first fixing seat 2231, the second fixing seat 2232, the third fixing seat 2233 and the fixed plate 221 can both rotate.
Illustratively, a follower 2234 is disposed in the fixing seat 223, and the follower 2234 is disposed below the second fixing seat 2232 and outside the first fixing seat 2231.
Preferably, the polishing disk driving device further comprises a polishing disk horizontal driving mechanism 224, and the polishing disk horizontal driving mechanism 224 can drive the polishing disk 21 to move in the horizontal plane so as to adjust the position of the polishing disk 21.
Specifically, the polishing disk drive 22 further includes a moving plate 225, and the fixed base 223 and the polishing disk rotation drive mechanism 222 are provided on the moving plate 225. The polishing disk horizontal driving mechanism 224 can drive the moving plate 225 to move in the horizontal plane, and the moving plate 225 drives the polishing disk 21 on the fixed seat 223 to move.
Further, the polishing disc horizontal driving mechanism 224 includes a second motor 2241 and a lead screw 2242, the lead screw 2242 extends along a plane parallel to the plane of the polishing disc 21, a nut seat of the lead screw 2242 is fixedly connected to the moving plate 225, and the second motor 2241 drives the lead screw 2242 to rotate, so that the moving plate 225 moves along the lead screw 2242, even if the polishing disc 21 moves along the lead screw 2242, the polishing disc 21 moves in a horizontal plane. Specifically, the polishing-disk horizontal driving mechanism 224 drives the polishing-disk rotation driving mechanism 222 and the polishing disk 21 to move in the horizontal plane.
In order to ensure the directional stable movement of the polishing disc 21, the polishing disc horizontal driving mechanism 224 further comprises a guide rail 2243 and a sliding block 2244 which are matched with each other, wherein the guide rail 2243 and the sliding block 2244 are both parallel to the screw 2242, the guide rail 2243 is arranged on the lower surface of the moving plate 225, the sliding block 2244 is arranged on the mounting rack, and when the second motor 2241 drives the screw 2242 to drive the moving plate 225 to move, the moving plate 225 can be directionally stably moved under the matching of the guide rail 2243 and the sliding block 2244.
As shown in fig. 8, the polishing disk drive apparatus 22 further includes a pipe shaft 226, one end of the pipe shaft 226 is communicated with the fixed disk 221, and the other end thereof is configured to be communicated with the polishing liquid supply mechanism, so as to supply the polishing liquid onto the fixed disk 221 and deliver the polishing liquid to the polishing disk 21 through the fixed disk 221. For convenience of understanding, taking polishing a silicon wafer as an example, the working process of the polishing apparatus provided by the present embodiment is as follows:
1) on the loading and unloading station 11, the polishing head driving device 4 drives the polishing head 3 to absorb the two silicon wafers A;
2) the turntable 41 rotates 90 degrees clockwise, the stations are switched, in the process, the brake device 6 stops the turntable 41, and the positioning device 5 positions the turntable 41; then, on the loading and unloading station 11, the polishing head driving device 4 drives the polishing head 3 to absorb the two silicon wafers B; on the rough polishing station 12, the polishing disk module 2 is matched with the polishing head 3 to carry out rough polishing on the two silicon wafers A;
3) the turntable 41 rotates clockwise by 90 degrees, and stations are switched; then, on the loading and unloading station 11, the polishing head driving device 4 drives the polishing head 3 to absorb the two silicon wafers C; in the rough polishing station 12, the polishing disk module 2 is matched with the polishing head 3 to roughly polish the two silicon wafers B; on the middle polishing station 13, polishing heads 3 of the polishing disk module 2 are matched to perform middle polishing on the two silicon wafers C;
4) the turntable 41 rotates clockwise by 90 degrees, and stations are switched; then, on the loading and unloading station 11, the polishing head driving device 4 drives the polishing head 3 to absorb the two silicon wafers D; in the rough polishing station 12, the polishing disk module 2 is matched with the polishing head 3 to roughly polish the two silicon wafers C; on the middle polishing station 13, the polishing disk module 2 is matched with the polishing head 3 to perform middle polishing on the two silicon wafers B; on the fine polishing station 14, the polishing disc module 2 is matched with the polishing head 3 to perform fine polishing on the two silicon wafers A;
5) the turntable 41 rotates anticlockwise for 270 degrees, and stations are switched; two silicon wafers A are fed and discharged on the feeding and discharging station 11, and then two silicon wafers E are fed on the feeding and discharging station 11; in the rough polishing station 12, the polishing disk module 2 is matched with the polishing head 3 to roughly polish the two silicon wafers D; on the middle polishing station 13, the polishing disk module 2 is matched with the polishing head 3 to perform middle polishing on the two silicon wafers C; on the fine polishing station 14, the polishing disk module 2 is matched with the polishing head 3 to perform fine polishing on the two silicon wafers B;
by repeating the operation, the polishing equipment can simultaneously polish six silicon wafers, and the two silicon wafers are simultaneously loaded and unloaded.
The setting of the movement stroke of the turntable 41 as 90 ° clockwise rotation, and 270 ° counterclockwise rotation is to prevent the electric wire from being wound around the rotating shaft of the turntable 41 when the turntable 41 rotates clockwise continuously, and to avoid damage to the electric wire.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A polishing apparatus, characterized by comprising:
the workbench (1) comprises a feeding and discharging station (11), a rough polishing station (12), a middle polishing station (13) and a fine polishing station (14);
the three polishing disc modules (2) are respectively arranged on the rough polishing station (12), the middle polishing station (13) and the fine polishing station (14);
and the polishing head module comprises polishing heads (3) and a polishing head driving device (4), wherein the polishing heads (3) are arranged on the polishing head driving device (4), and the polishing head driving device (4) can drive the polishing heads (3) to absorb the silicon wafer and switch between different stations, so that the polishing heads (3) can be matched with the polishing disc modules (2) on corresponding stations to perform rough polishing, medium polishing and fine polishing on the silicon wafer simultaneously.
2. The polishing apparatus according to claim 1, wherein the polishing head driving device (4) comprises a turntable (41) and a polishing head driving mechanism (42), the polishing head driving mechanism (42) is provided on the turntable (41), the polishing heads (3) are provided on the polishing head driving mechanism (42), and the turntable (41) is rotatable to mate the polishing heads (3) on the polishing head driving mechanism (42) with the polishing disk modules (2) on the respective stations.
3. The polishing apparatus according to claim 2, wherein the number of the polishing head driving mechanisms (42) is four, and the four polishing head driving mechanisms (42) are respectively disposed opposite to the loading and unloading station (11), the rough polishing station (12), the middle polishing station (13) and the fine polishing station (14).
4. The polishing apparatus according to claim 3, wherein the polishing head driving mechanism (42) comprises a mounting plate (421) and a rotary lifting driving assembly, the mounting plate (421) is fixedly arranged on the turntable (41), and the rotary lifting driving assembly is connected with the polishing head (3) to drive the polishing head (3) to rotate and/or lift.
5. A polishing apparatus according to claim 4, characterized in that one polishing head (3) is provided on each of the rotary elevation drive assemblies, and a plurality of the rotary elevation drive assemblies are provided on the mounting plate (421).
6. Polishing apparatus according to claim 1, characterized in that the polishing head (3) is a floating polishing head.
7. A polishing apparatus according to claim 2, characterized in that it further comprises a positioning device (5), said positioning device (5) being capable of resting said carousel (41) in a position in which said polishing head (3) is capable of cooperating with said polishing disc module (2).
8. The polishing apparatus according to claim 7, wherein the number of the positioning devices (5) is four, and the four positioning devices (5) are respectively arranged opposite to the loading and unloading station (11), the rough polishing station (12), the middle polishing station (13) and the fine polishing station (14).
9. A polishing apparatus according to claim 2, characterized in that it further comprises a braking device (6), said braking device (6) being capable of decelerating the turntable (41) to stop rotating.
10. A polishing apparatus according to claim 1, characterized in that the polishing disc module (2) comprises a polishing disc (21) and a polishing disc drive (22), the polishing disc drive (22) being capable of driving the polishing disc (21) to rotate and move in a horizontal plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911418971.7A CN110962021A (en) | 2019-12-31 | 2019-12-31 | Polishing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911418971.7A CN110962021A (en) | 2019-12-31 | 2019-12-31 | Polishing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110962021A true CN110962021A (en) | 2020-04-07 |
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ID=70037693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911418971.7A Pending CN110962021A (en) | 2019-12-31 | 2019-12-31 | Polishing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110962021A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113211216A (en) * | 2021-04-23 | 2021-08-06 | 科莱思半导体智造(浙江)有限公司 | Polishing equipment for semiconductor silicon wafer |
-
2019
- 2019-12-31 CN CN201911418971.7A patent/CN110962021A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113211216A (en) * | 2021-04-23 | 2021-08-06 | 科莱思半导体智造(浙江)有限公司 | Polishing equipment for semiconductor silicon wafer |
| CN113211216B (en) * | 2021-04-23 | 2023-07-21 | 史穆康科技(浙江)有限公司 | Polishing equipment for semiconductor silicon wafer |
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