CN113211216B - Polishing equipment for semiconductor silicon wafer - Google Patents
Polishing equipment for semiconductor silicon wafer Download PDFInfo
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- CN113211216B CN113211216B CN202110441648.2A CN202110441648A CN113211216B CN 113211216 B CN113211216 B CN 113211216B CN 202110441648 A CN202110441648 A CN 202110441648A CN 113211216 B CN113211216 B CN 113211216B
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- polishing
- silicon wafer
- assemblies
- pressing
- seat
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to the technical field of silicon wafers, in particular to polishing equipment for semiconductor silicon wafers, which comprises a silicon wafer position adjusting mechanism, wherein the polishing equipment is arranged on a rack, a polishing station total rotating turntable which is rotationally connected with the rack is arranged on the polishing station total rotating turntable, a plurality of polishing station sub rotating assemblies which are circumferentially distributed on the polishing station total rotating turntable are arranged on the polishing station total rotating turntable, each polishing station sub rotating assembly is provided with a polishing position adjusting assembly, a polishing bearing assembly is connected to the polishing position adjusting assembly in a transmission manner, a pressing assembly for pressing the silicon wafer to be polished is arranged on the upper polishing bearing assembly, and the pressing assembly is rotationally connected with the polishing bearing assembly; the polishing mechanism is arranged on the frame and is positioned beside the silicon wafer position adjusting mechanism and used for polishing the silicon wafer to be polished; the dropping component is arranged on the frame and positioned on the silicon wafer, and the invention realizes the full polishing of the silicon wafer.
Description
Technical Field
The invention relates to the technical field of silicon wafers, in particular to polishing equipment for semiconductor silicon wafers.
Background
The semiconductor silicon wafer is a main substrate material for manufacturing a very large scale integrated circuit, along with the rapid development of the semiconductor industry, the precision requirement on the substrate material is higher and higher, and the outer circumferential surface of the silicon wafer is generally required to be polished during the substrate processing, so that the edge of the silicon wafer is ensured not to generate defects during the subsequent processing, the stress concentration is reduced, the fragment rate is reduced, and the yield is further improved. The edge polishing of the silicon wafer is generally finished on special polishing equipment, and is realized under the process conditions of certain pressure and rotating speed by using polishing solution and polishing cloth by adopting a mechanochemical polishing method.
The silicon wafer is required to have uniform surface roughness after polishing, and if a certain portion of the outer circumferential surface is insufficiently polished or has defects such as scratches, a problem of aggregation of the polycrystalline grains is easily formed in the subsequent process. The existing polishing mode has dead angles during polishing, and insufficient polishing can be caused.
Disclosure of Invention
In order to solve the technical problems, the technical scheme solves the problem of insufficient polishing and realizes the full polishing of the silicon wafer.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the present invention provides a polishing apparatus for a semiconductor silicon wafer, comprising:
a frame;
the polishing device comprises a frame, a polishing station rotating mechanism, a polishing position adjusting mechanism, a polishing bearing assembly and a pressing assembly, wherein the polishing station rotating mechanism is arranged on the frame and is rotationally connected with the frame, a plurality of polishing station rotating assemblies distributed on the polishing station rotating mechanism in a circumference mode are arranged on the polishing station rotating mechanism, the polishing position adjusting assemblies are respectively provided with a polishing position adjusting assembly, the polishing bearing assembly is in transmission connection with the polishing bearing assembly and is used for carrying a silicon wafer to be polished, the polishing bearing assembly and the corresponding polishing station rotating assembly are in eccentric relation, the polishing bearing assembly is provided with the pressing assembly used for pressing the silicon wafer to be polished, and the pressing assembly is rotationally connected with the polishing bearing assembly;
the polishing mechanism is arranged on the frame and is positioned beside the silicon wafer position adjusting mechanism and used for polishing the silicon wafer to be polished;
and the dropping liquid component is arranged on the frame and is positioned beside the silicon wafer position adjusting mechanism and used for dropping polishing liquid into the silicon wafer to be polished before the polishing mechanism polishes the silicon wafer.
The silicon wafer position adjustment mechanism includes:
the cam divider is arranged on the frame;
the polishing station total rotating turntable is in transmission connection with the output shaft of the cam divider, and is in rotary connection with the frame;
the polishing station sub-rotating assemblies are circumferentially distributed on the polishing station total rotating turntable;
the polishing position adjusting assemblies are equal to the polishing station sub-rotating assemblies in number and correspond to each other one by one, and are arranged on the corresponding polishing station sub-rotating assemblies;
the polishing bearing assemblies are equal in number and correspond to the polishing position adjusting assemblies one by one, and are in transmission connection with output shafts of the corresponding polishing position adjusting assemblies;
the polishing device comprises a plurality of pressing assemblies, wherein each polishing bearing assembly is provided with two pressing assemblies which are arranged in pairs, and the pressing assemblies which are arranged in pairs are circumferentially distributed on the corresponding polishing bearing assemblies.
The polishing station sub-rotating assembly includes:
the motor mounting seat is mounted on the polishing station total rotating turntable;
the sub-rotation driving motor is arranged on the motor mounting seat;
the polishing station sub-rotating turntable is rotationally connected with a rotating shaft seat fixed on the polishing station main rotating turntable, an output shaft of the sub-rotating driving motor is connected with the polishing station sub-rotating turntable through a belt pulley group in a transmission way, and the belt pulley group is rotationally connected with the rotating shaft seat.
The polishing position adjustment assembly includes:
the first screw rod sliding table is arranged on the polishing station sub-rotating turntable;
the base is in transmission connection with the output end of the first screw rod sliding table;
a first rotary drive motor disposed on the base;
the second rotary driving motor is arranged on the base and is positioned at the side part of the first rotary driving motor;
and the rotary gear is in transmission connection with an output shaft of the second rotary driving motor.
Optionally, the polishing carrier assembly comprises:
the station disc is in transmission connection with an output shaft of the first rotary driving motor, and a placing groove for placing a silicon wafer to be polished is coaxially arranged in the center of the station disc;
the pressing substrate is in transmission connection with the output shaft of the second rotary driving motor and is in rotary connection with the station disc, the inner diameter of the pressing substrate is matched with the outer diameter of the placing groove, and the outer ring of the pressing substrate is provided with insections meshed with the rotary gear.
Optionally, the compression assembly includes:
the compressing seat is arranged on the compressing base plate;
the position adjusting motor is arranged on the pressing seat;
the screw rod is in transmission connection with the output shaft of the compression seat;
the lifting seat is in threaded fit with the screw rod, and a guide rail in sliding fit with the lifting seat is arranged on the pressing seat;
the two lifting cylinders are arranged at two ends of the lifting seat;
and the pressing plate is in transmission connection with the output shafts of the two lifting cylinders and is used for pressing the silicon wafer to be polished.
Optionally, the output shaft overcoat of lift cylinder is equipped with first damping spring, first damping spring's one end offsets with the clamp plate, and first damping spring's the other end offsets with the lifting seat.
Optionally, the polishing mechanism comprises;
the polishing rack is arranged on the rack and is positioned at the side part of the silicon wafer position adjusting mechanism;
the second screw rod sliding table is arranged on the polishing rack;
the polishing movable seat is in transmission connection with an output shaft of the second screw rod sliding table, and the second screw rod sliding table is used for driving the polishing movable seat to move along the horizontal direction;
the polishing base is arranged on the polishing movable seat and is rotationally connected with the polishing movable seat;
the cylinder body part of the adjusting cylinder is hinged with the polishing movable seat, and the output shaft of the adjusting cylinder is hinged with the polishing base;
a polishing driving motor mounted on the polishing base;
and the polishing disk is in transmission connection with an output shaft of the polishing driving motor.
Optionally, a second damping spring is arranged on the polishing base.
Optionally, the drip assembly includes:
the liquid dropping rack is arranged on the rack and positioned at the side part of the silicon wafer position adjusting mechanism;
the third screw rod sliding table is arranged on the liquid dropping rack;
the fourth screw rod sliding table is in transmission connection with an output shaft of the third screw rod sliding table, and the third screw rod sliding table is used for driving the fourth screw rod sliding table to move along the horizontal direction;
the liquid dropping seat is in transmission connection with an output shaft of a fourth screw rod sliding table, and the fourth screw rod sliding table is used for driving the liquid dropping seat to move along the vertical direction;
the liquid storage tank is arranged on the liquid dropping seat and filled with polishing liquid;
the dropping head is arranged on the dropping seat and used for dropping polishing liquid, and the liquid storage tank is communicated with the dropping head through the pump.
Compared with the prior art, the invention has the following beneficial effects: the polishing device comprises a polishing station, a polishing bearing component, a polishing mechanism, a pressing component, a polishing mechanism and a polishing disc, wherein the polishing bearing component is driven to rotate in the rotating process of the polishing station, the polishing bearing component is rotated to the position of the polishing mechanism, the polishing mechanism can polish the polishing bearing component positioned at the corresponding position of the polishing bearing component, during polishing, the pressing component presses a silicon wafer placed on the polishing bearing component, in the polishing device, the polishing disc used for polishing is smaller than the area of the silicon wafer, during polishing of the polishing disc, the pressing component can be controlled by the polishing bearing component and then rotates along the silicon wafer, during polishing of the polishing disc, the pressing of the silicon wafer can be always kept, interference to the polishing disc is avoided, the pressed position of the silicon wafer is switched, during the continuous polishing process, and meanwhile, the pressing bearing component and the polishing station rotating component are in eccentric relation, after the polishing bearing component is driven to rotate through the polishing station, the polishing bearing component is different from the traditional concentric rotation and is contacted with the polishing disc, and therefore each position on the silicon wafer can be fully contacted with the polishing disc.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic diagram of a second perspective structure of the present invention;
FIG. 3 is a schematic view showing the structure of a silicon wafer position adjusting mechanism according to the present invention;
FIG. 4 is a schematic view of a first configuration of the polishing station sub-rotating assembly of the present invention;
FIG. 5 is a schematic view of a first configuration of the polishing station sub-rotating assembly of the present invention;
FIG. 6 is a schematic view of the structure of the pressing assembly of the present invention;
FIG. 7 is a schematic view of a polishing mechanism according to the present invention;
FIG. 8 is a schematic diagram of a polishing mechanism according to a second embodiment of the present invention;
FIG. 9 is a schematic view showing a structure of a drip mechanism according to the present invention.
The reference numerals in the figures are:
1-a frame;
2-a silicon wafer position adjustment mechanism; a 21-cam divider; 22-a polishing station total rotating turntable; 23-polishing station sub-rotation assembly; 231-motor mount; 232-dividing a rotary driving motor; 233-pulley sets; 234-a rotating shaft seat; 235-a polishing station is divided into a rotary table and a rotary table; 24-a polishing position adjustment assembly; 241-a first screw rod sliding table; 242-base; 243-a first rotary drive motor; 244-a second rotary drive motor; 245-rotating a gear; 25-polishing a carrier assembly; 251-station disc; 252-pressing the substrate; 253-insection; 254-placing groove; 26-a hold-down assembly; 261-pressing a seat; 262-position adjusting motor; 263-screw rod; 264-lifting seat; 265-a guide rail; 266-lifting cylinder; 267-pressing plate; 268-a first shock absorbing spring;
3-a polishing mechanism; 31-a polishing rack; 32-a second screw rod sliding table; 33-polishing the movable seat; 34-adjusting the cylinder; 35-polishing a base; 36-polishing driving motor; 37-polishing disc; 38-a second damper spring;
4-a drip assembly; 41-a drip frame; 42-a third screw rod sliding table; 43-a fourth screw rod sliding table; 44-a dropping seat; 45-a liquid storage tank; 46-pumping; 47-dropping head.
Detailed Description
The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art.
As a preferred embodiment of the present invention, the present invention discloses a polishing apparatus for a semiconductor silicon wafer, comprising:
a frame;
the polishing device comprises a frame, a polishing station rotating mechanism, a polishing position adjusting mechanism, a polishing bearing assembly, a pressing assembly and a polishing bearing assembly, wherein the frame is provided with a polishing station rotating turntable which is connected with the frame in a rotating way;
the polishing mechanism is arranged on the frame and is positioned beside the silicon wafer position adjusting mechanism and used for polishing the silicon wafer to be polished;
and the dropping liquid component is arranged on the frame and is positioned beside the silicon wafer position adjusting mechanism and used for dropping polishing liquid into the silicon wafer to be polished before the polishing mechanism polishes the silicon wafer.
The polishing equipment for the semiconductor silicon wafer can drive the polishing bearing component to rotate in the process of rotating the polishing station total rotating turntable, the polishing bearing component is rotated to the position of the polishing mechanism, the polishing mechanism can polish the polishing bearing component positioned at the corresponding position of the polishing bearing component, during polishing, the pressing component can press the silicon wafer placed on the polishing bearing component, in the polishing equipment, the polishing disk which is used for polishing, is smaller than the area of the silicon wafer, the pressing component can be controlled by the polishing bearing component and then rotates along the silicon wafer during polishing of the polishing disk, the pressing of the silicon wafer can be always kept during polishing of the polishing disk, interference to the polishing disk is avoided, the switching of the pressed part of the silicon wafer is realized, and simultaneously, the pressing bearing component and the polishing station rotating component are in eccentric relation, so that after the polishing bearing component is driven to rotate by the polishing station rotating component, the polishing bearing component can eccentrically rotate, the polishing bearing component is different from the traditional concentric rotation to realize polishing, and each part of the silicon wafer can be fully contacted with the polishing disk during polishing.
Preferred embodiments of the polishing apparatus for a semiconductor silicon wafer according to the present invention will be described below with reference to the accompanying drawings.
Referring to fig. 1 to 9, the polishing apparatus includes:
the silicon wafer position adjusting mechanism 2 is arranged on the machine frame 1, a polishing station total rotating turntable 22 which is rotationally connected with the machine frame 1 is arranged on the polishing station total rotating turntable 22, a plurality of polishing station sub-rotating assemblies 23 which are circumferentially distributed on the polishing station total rotating turntable 22 are arranged on each polishing station sub-rotating assembly 23, a polishing position adjusting assembly 24 is arranged on each polishing station sub-rotating assembly 23, a polishing bearing assembly 25 is in transmission connection with the polishing position adjusting assembly 24, the polishing bearing assembly 25 is used for carrying a silicon wafer to be polished, the polishing bearing assembly 25 and the corresponding polishing station sub-rotating assembly 23 are in eccentric relation, a pressing assembly 26 for pressing the silicon wafer to be polished is arranged on the polishing bearing assembly 25, and the pressing assembly 26 is rotationally connected with the polishing bearing assembly 25.
And the polishing mechanism 3 is arranged on the frame 1 and is positioned beside the silicon wafer position adjusting mechanism 2 and used for polishing the silicon wafer to be polished.
And a dropping unit 4, which is installed on the frame 1 and is located at the side of the silicon wafer position adjusting mechanism 2, for dropping polishing liquid into the silicon wafer to be polished before the polishing mechanism 3 performs polishing.
When polishing is required, a silicon wafer to be polished is placed on the polishing bearing component 25 of one of the silicon wafer position adjusting mechanisms 2, then the polishing station total rotating turntable 22 is controlled to rotate, the polishing bearing component 25 is driven to rotate in the rotating process of the polishing station total rotating turntable 22, the polishing bearing component 25 is rotated to the position of the polishing mechanism 3, the polishing mechanism 3 can polish the polishing bearing component 25 positioned at the corresponding position, in the polishing process, the pressing component 26 can press the silicon wafer placed on the polishing bearing component 25, in the polishing equipment, a polishing disk 37 used for polishing by the polishing mechanism 3 is smaller than the area of the silicon wafer, the pressing component 26 is controlled by the polishing bearing component 25 to rotate along the silicon wafer when the polishing disk 37 is polished, the pressing of the silicon wafer can be always kept when the polishing disk 37 is polished, the pressed position of the silicon wafer is prevented from being interfered, in the continuous polishing process, the pressed position is polished by the polishing disk 37, and simultaneously, the polishing bearing component 25 and the polishing disk 23 are concentric with the polishing disk 37 through the eccentric rotation of the polishing bearing component 23, and the polishing disk 37 can be contacted with the polishing disk 37 in a concentric manner after the polishing disk 37 is driven to rotate, and the polishing disk 37 rotates, and the polishing disk 37 is contacted with the polishing disk 37 in a concentric manner. The dropping liquid component 4 drops the polishing liquid on the surface of the silicon wafer before the polishing mechanism 3 polishes, so that the subsequent polishing mechanism 3 can polish the silicon wafer conveniently.
Referring to fig. 3 to 6, specifically, the silicon wafer position adjustment mechanism 2 includes:
the cam divider 21 is arranged on the frame 1, and polishing bearing assemblies 25 are circumferentially distributed on the polishing station total rotating turntable 22, so that the rotating angle of the polishing station total rotating turntable 22 can be controlled by adopting the cam divider 21, and the process flow switching of silicon wafer feeding, dropping, polishing and discharging placed on each polishing bearing assembly 25 can be accurately realized.
The polishing station total rotating turntable 22 is in transmission connection with the output shaft of the cam divider 21, and the polishing station total rotating turntable 22 is in rotary connection with the frame 1.
The polishing stations are divided into rotating assemblies 23, and are circumferentially distributed on the polishing station total rotating turntable 22.
The polishing position adjusting assemblies 24 are equal in number and correspond to the polishing station sub-rotating assemblies 23 one by one, and the polishing position adjusting assemblies 24 are arranged on the corresponding polishing station sub-rotating assemblies 23.
The polishing position adjusting assembly 24 is used for adjusting the eccentric distance of the polishing bearing assembly 25 relative to the center of the corresponding polishing station rotating assembly 23, and under different eccentric distances, the polishing bearing assembly 25 can contact with each position of the silicon wafer for polishing when being rotated under the control of the polishing station rotating assembly 23.
The polishing bearing assemblies 25 are equal in number and correspond to the polishing position adjusting assemblies 24 one by one, and the polishing bearing assemblies 25 are in transmission connection with the output shafts of the corresponding polishing position adjusting assemblies 24.
The polishing carrier assemblies 25 are provided with two pressing assemblies 26 arranged in pairs, and the pressing assemblies 26 arranged in pairs are circumferentially distributed on the corresponding polishing carrier assemblies 25.
The polishing station sub-rotation assembly 23 includes:
and a motor mounting seat 231 mounted on the polishing station general rotary turntable 22. A sub-rotation driving motor 232 is mounted on the motor mount 231. The polishing station sub-rotating turntable 235 is rotationally connected with a rotating shaft seat 234 fixed on the polishing station main rotating turntable 22, an output shaft of the sub-rotating driving motor 232 is connected with the polishing station sub-rotating turntable 235 through a belt pulley group 233 in a transmission manner, and the belt pulley group 233 is rotationally connected with the rotating shaft seat 234.
When the sub-rotation driving motor 232 installed on the motor installation seat 231 works, the belt pulley group 233 drives the polishing station sub-rotation turntable 235 to rotate, so that the polishing position adjusting assembly 24 and the polishing bearing assembly 25 installed on the polishing station sub-rotation turntable are rotated, and when the polishing bearing assembly 25 rotates, the silicon wafer and the polishing disc 37 in the same rotation process can be polished without dead angles.
The polishing position adjustment assembly 24 includes:
the first screw sliding table 241 is installed on the polishing station sub-rotating turntable 235. The base 242 is in transmission connection with the output end of the first screw rod sliding table 241. The first rotation driving motor 243 is provided on the base 242. The second rotary drive motor 244 is provided on the base 242 and is located at a side of the first rotary drive motor 243. The rotary gear 245 is in driving connection with the output shaft of the second rotary drive motor 244.
The polishing carrier assembly 25 includes:
the station disc 251 is in transmission connection with the output shaft of the first rotary driving motor 243, and a placing groove 254 for placing a silicon wafer to be polished is coaxially arranged at the center of the station disc 251.
The pressing base plate 252 is in transmission connection with the output shaft of the second rotary driving motor 244 and is in rotary connection with the station disc 251, the inner diameter of the pressing base plate 252 is matched with the outer diameter of the placing groove 254, and the outer ring of the pressing base plate 252 is provided with a tooth pattern 253 meshed with the rotary gear 245.
The first screw sliding table 241 is used for adjusting the eccentric distance of the polishing bearing assembly 25 relative to the center of the circle of the polishing station rotating assembly 23, and when the polishing bearing assembly 25 rotates under the control of the polishing station rotating assembly 23 under different eccentric distances, the polishing disc 37 can contact with each position of the silicon wafer for polishing. When the first rotary driving motor 243 and the second rotary driving motor 244 mounted on the base 242 rotate, the station disc 251 and the rotary gear 245 are respectively driven to rotate, and when the station disc 251 rotates, the pressing substrate 252 and the silicon wafer mounted thereon are driven to rotate, and during the rotation process of the silicon wafer, the polishing of the silicon wafer is performed in cooperation with the rotation of the upper polishing disc 37. When the rotating gear 245 rotates, the pressing substrate 252 is driven to rotate by the meshing of the rotating gear 245 and the tooth pattern 253, and the position of the pressing assembly 26 is adjusted, so that the pressing position of the pressing assembly 26 is changed.
The hold-down assembly 26 includes:
a pressing base 261 mounted on the pressing substrate 252. A position adjusting motor 262 mounted on the pressing seat 261. The screw rod 263 is connected with the output shaft of the pressing seat 261 in a transmission way. The lifting seat 264 is in threaded fit with the screw rod 263, and the compression seat 261 is provided with a guide rail 265 in sliding fit with the lifting seat 264. Two lifting cylinders 266 are mounted at both ends of the lifting base 264. And the pressing plate 267 is in transmission connection with the output shafts of the two lifting cylinders 266 and is used for pressing the silicon wafer to be polished. The output shaft of the lifting cylinder 266 is sleeved with a first damping spring 268, one end of the first damping spring 268 abuts against the pressing plate 267, and the other end of the first damping spring 268 abuts against the lifting seat 264.
The height of the pressing plate 267 can be adjusted through the position adjusting motor 262 and the lifting air cylinder 266, the pressing of the silicon wafer is achieved, and the pressing plate 267 can be protected through the arrangement of the first damping spring 268.
Referring to fig. 7 and 8, the polishing mechanism 3 includes:
a polishing frame 31 mounted on the frame 1 at a side of the silicon wafer position adjusting mechanism 2. A second screw slider 32 is mounted on the polishing frame 31. The polishing movable seat 33 is in transmission connection with an output shaft of the second screw rod sliding table 32, and the second screw rod sliding table 32 is used for driving the polishing movable seat 33 to move along the horizontal direction. And a polishing base 35 disposed on the polishing movable base 33 and rotatably coupled to the polishing movable base 33. The adjusting cylinder 34 is arranged on the polishing movable seat 33, the cylinder body part of the adjusting cylinder 34 is hinged with the polishing movable seat 33, and the output shaft of the adjusting cylinder 34 is hinged with the polishing base 35. A polishing drive motor 36 is mounted on the polishing base 35. The polishing disk 37 is in transmission connection with the output shaft of the polishing driving motor 36. The polishing base 35 is provided with a second damper spring 38.
The second screw sliding table 32 is used for adjusting the forward-looking distance of the polishing disk 37, and the adjusting cylinder 34 is used for adjusting whether the polishing disk 37 will execute the polishing process.
Referring to fig. 9, the drip assembly 4 includes:
the drip frame 41 is mounted on the frame 1 at the side of the silicon wafer position adjusting mechanism 2. A third screw sliding table 42 is mounted on the drip frame 41. The fourth screw rod sliding table 43 is in transmission connection with an output shaft of the third screw rod sliding table 42, and the third screw rod sliding table 42 is used for driving the fourth screw rod sliding table 43 to move along the horizontal direction. The drip stand 44 is in transmission connection with an output shaft of the fourth screw rod sliding table 43, and the fourth screw rod sliding table 43 is used for driving the drip stand 44 to move along the vertical direction. A liquid storage tank 45 is mounted on the liquid dropping seat 44, and polishing liquid is contained in the liquid storage tank. A dripper 47 disposed on the dripper holder 44 for dripping polishing liquid, and a liquid tank 45 communicating with the dripper 47 via a pump 46.
The third screw rod sliding table 42 and the fourth screw rod sliding table 43 are respectively used for adjusting the positions of the liquid dropping heads 47, and when the pump 46 works, polishing liquid in the liquid storage tank 45 can be dropped through the liquid dropping heads 47.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made therein without departing from the spirit and scope of the invention, which is defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. A polishing apparatus for a semiconductor silicon wafer, comprising:
a frame (1);
the polishing device comprises a frame (1), a polishing station total rotating turntable (22) rotationally connected with the frame (1), a plurality of polishing station sub rotating assemblies (23) circumferentially distributed on the polishing station total rotating turntable (22) are arranged on the polishing station total rotating turntable (22), polishing position adjusting assemblies (24) are arranged on each polishing station sub rotating assembly (23), polishing bearing assemblies (25) are connected to the polishing position adjusting assemblies (24) in a transmission manner, the polishing bearing assemblies (25) are used for carrying silicon wafers to be polished, the polishing bearing assemblies (25) are in eccentric relation with the corresponding polishing station sub rotating assemblies (23), pressing assemblies (26) used for pressing the silicon wafers to be polished are arranged on the polishing bearing assemblies (25), and the pressing assemblies (26) are rotationally connected with the polishing bearing assemblies (25);
the polishing mechanism (3) is arranged on the frame (1) and is positioned beside the silicon wafer position adjusting mechanism (2) and used for polishing a silicon wafer to be polished;
the dropping component (4) is arranged on the frame (1) and is positioned beside the silicon wafer position adjusting mechanism (2) and used for dropping polishing liquid into the silicon wafer to be polished before the polishing mechanism (3) polishes the silicon wafer;
the silicon wafer position adjustment mechanism (2) comprises:
a cam divider (21) mounted on the frame (1);
the polishing station total rotating turntable (22) is in transmission connection with the output shaft of the cam divider (21), and the polishing station total rotating turntable (22) is in rotary connection with the frame (1);
the polishing station sub-rotating assemblies (23) are circumferentially distributed on the polishing station total rotating turntable (22);
the polishing position adjusting assemblies (24) are equal to the polishing station sub-rotating assemblies (23) in number and correspond to each other one by one, and the polishing position adjusting assemblies (24) are arranged on the corresponding polishing station sub-rotating assemblies (23);
the polishing bearing assemblies (25) are equal in number and correspond to the polishing position adjusting assemblies (24) one by one, and the polishing bearing assemblies (25) are in transmission connection with output shafts of the corresponding polishing position adjusting assemblies (24);
the polishing device comprises a plurality of pressing assemblies (26), wherein each polishing bearing assembly (25) is provided with two pressing assemblies (26) which are arranged in pairs, and the pressing assemblies (26) which are arranged in pairs are circumferentially distributed on the corresponding polishing bearing assemblies (25);
the polishing station sub-rotating assembly (23) comprises:
the motor mounting seat (231) is mounted on the polishing station total rotating turntable (22);
a sub-rotation driving motor (232) mounted on the motor mounting seat (231);
the polishing station sub-rotating turntable (235) is rotationally connected with a rotating shaft seat (234) fixed on the polishing station main rotating turntable (22), an output shaft of the sub-rotating driving motor (232) is in transmission connection with the polishing station sub-rotating turntable (235) through a belt pulley group (233), and the belt pulley group (233) is rotationally connected with the rotating shaft seat (234);
the polishing position adjustment assembly (24) includes:
the first screw rod sliding table (241) is arranged on the polishing station sub-rotating turntable (235);
the base (242) is in transmission connection with the output end of the first screw rod sliding table (241);
a first rotary drive motor (243) provided on the base (242);
a second rotary drive motor (244) provided on the base (242) and located on the side of the first rotary drive motor (243);
and the rotary gear (245) is in transmission connection with an output shaft of the second rotary driving motor (244).
2. A polishing apparatus for a semiconductor silicon wafer according to claim 1, wherein the polishing carrier assembly (25) comprises:
a station disc (251) in transmission connection with an output shaft of the first rotary driving motor (243), wherein a placing groove (254) for placing a silicon wafer to be polished is coaxially arranged at the center of the station disc (251);
the pressing substrate (252) is in transmission connection with an output shaft of the second rotary driving motor (244) and is in rotary connection with the station disc (251), the inner diameter of the pressing substrate (252) is matched with the outer diameter of the placing groove (254), and the outer ring of the pressing substrate (252) is provided with a tooth pattern (253) meshed with the rotary gear (245).
3. A polishing apparatus for a semiconductor silicon wafer according to claim 2, wherein the pressing assembly (26) comprises:
a pressing base 261 mounted on the pressing substrate 252;
a position adjusting motor (262) mounted on the pressing seat (261);
the screw rod (263) is in transmission connection with an output shaft of the compression seat (261);
the lifting seat (264) is in threaded fit with the screw rod (263), and the compression seat (261) is provided with a guide rail (265) in sliding fit with the lifting seat (264);
two lifting cylinders (266) mounted at both ends of the lifting base (264);
and the pressing plate (267) is in transmission connection with the output shafts of the two lifting cylinders (266) and is used for pressing the silicon wafer to be polished.
4. The polishing apparatus for a semiconductor silicon wafer according to claim 1, wherein the output shaft of the lifting cylinder (266) is sleeved with a first damper spring (268), one end of the first damper spring (268) abuts against the pressing plate (267), and the other end of the first damper spring (268) abuts against the lifting seat (264).
5. A polishing apparatus for a semiconductor silicon wafer according to claim 1, wherein the polishing mechanism (3) comprises;
a polishing frame (31) mounted on the frame (1) and located at the side of the silicon wafer position adjusting mechanism (2);
the second screw rod sliding table (32) is arranged on the polishing rack (31);
the polishing movable seat (33) is in transmission connection with an output shaft of the second screw rod sliding table (32), and the second screw rod sliding table (32) is used for driving the polishing movable seat (33) to move along the horizontal direction;
a polishing base (35) which is arranged on the polishing movable seat (33) and is rotationally connected with the polishing movable seat (33);
the adjusting cylinder (34) is arranged on the polishing movable seat (33), the cylinder body part of the adjusting cylinder (34) is hinged with the polishing movable seat (33), and the output shaft of the adjusting cylinder (34) is hinged with the polishing base (35);
a polishing drive motor (36) mounted on the polishing base (35);
and the polishing disk (37) is in transmission connection with an output shaft of the polishing driving motor (36).
6. A polishing apparatus for a semiconductor silicon wafer according to claim 5, wherein the polishing base (35) is provided with a second damper spring (38).
7. A polishing apparatus for a semiconductor silicon wafer according to claim 1, wherein said drip assembly (4) comprises:
a drip frame (41) which is arranged on the frame (1) and is positioned at the side part of the silicon wafer position adjusting mechanism (2);
the third screw rod sliding table (42) is arranged on the liquid dropping frame (41);
the fourth screw rod sliding table (43) is in transmission connection with an output shaft of the third screw rod sliding table (42), and the third screw rod sliding table (42) is used for driving the fourth screw rod sliding table (43) to move along the horizontal direction;
the liquid dropping seat (44) is in transmission connection with an output shaft of the fourth screw rod sliding table (43), and the fourth screw rod sliding table (43) is used for driving the liquid dropping seat (44) to move along the vertical direction;
a liquid storage tank (45) which is arranged on the liquid dropping seat (44) and is filled with polishing liquid;
the liquid dropping head (47) is arranged on the liquid dropping seat (44) and used for dropping polishing liquid, and the liquid storage tank (45) is communicated with the liquid dropping head (47) through the pump (46).
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| CN202110441648.2A CN113211216B (en) | 2021-04-23 | 2021-04-23 | Polishing equipment for semiconductor silicon wafer |
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| CN202110441648.2A CN113211216B (en) | 2021-04-23 | 2021-04-23 | Polishing equipment for semiconductor silicon wafer |
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| CN114734319B (en) * | 2022-03-20 | 2023-08-22 | 深圳市陆和神州科技有限公司 | Semiconductor material processing system and method |
| CN117260516B (en) * | 2023-11-22 | 2024-03-08 | 北京特思迪半导体设备有限公司 | Eccentric driving mechanism and polishing machine |
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