CN115847278A - Wafer back grinding device and grinding process - Google Patents
Wafer back grinding device and grinding process Download PDFInfo
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- CN115847278A CN115847278A CN202310028535.9A CN202310028535A CN115847278A CN 115847278 A CN115847278 A CN 115847278A CN 202310028535 A CN202310028535 A CN 202310028535A CN 115847278 A CN115847278 A CN 115847278A
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- pressure plate
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- 238000000034 method Methods 0.000 title claims abstract description 15
- 230000008569 process Effects 0.000 title claims abstract description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 13
- 239000010703 silicon Substances 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims description 13
- 238000005498 polishing Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 abstract description 58
- 230000000694 effects Effects 0.000 abstract description 9
- 230000001360 synchronised effect Effects 0.000 abstract description 3
- 230000002457 bidirectional effect Effects 0.000 abstract description 2
- 238000004140 cleaning Methods 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to the technical field of wafer processing, and discloses a wafer back grinding device and a grinding process. According to the invention, the multiple groups of bearing discs are arranged in the chip removal turntable, so that the device can grind the surface of the bearing disc through the arrangement of the multiple groups of pressure discs and grinding wheels, and the grinding wheels and the bearing disc can realize the grinding work of the grinding wheels under downward pressure through the arrangement of the grinding wheels and the bearing disc, and simultaneously the bearing disc reversely rotates in a friction mode to plane and grind the back silicon layer of the wafer, thereby achieving the thinning effect, realizing the bidirectional thinning of the wafer, and through the arrangement of the multiple groups of bearing discs, the device can synchronously process the multiple groups of wafers simultaneously, so that the working efficiency of the device and the synchronous precision of the wafer planing and grinding are improved.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to a wafer back grinding device and a grinding process.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular, various circuit element structures can be manufactured on the silicon wafer to form IC products with specific electrical functions, the original material of the wafer is silicon, and the surface of the earth crust has inexhaustible silicon dioxide.
For example, the device and the process for grinding a wafer disclosed in the Chinese patent application publication No. CN216829586U disclose that a driving component works to drive a transmission component to rotate, the transmission component drives a plurality of cleaning components on a sliding component to move towards one side close to a grinding mechanism, when the cleaning components are contacted with the grinding mechanism, the cleaning components are started, the cleaning components work to clean the grinding mechanism, and meanwhile, two dust suction mechanisms work to collect dust generated by the cleaning components cleaning and grinding mechanism.
Although the technical scheme disclosed above realizes the collection of impurities during the grinding of the wafer, the device carries out unidirectional grinding through the simple grinding assembly during the grinding of the wafer, has poor planing and grinding effects on the silicon layer on the back of the wafer, influences the thinning effect of the wafer, and reduces the grinding efficiency and the production quality of the wafer.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a wafer back grinding device and a grinding process, which solve the problems that the existing wafer grinding device and the grinding process grind a wafer in a single direction through a simple grinding assembly, have poor planing and grinding effects on a silicon layer on the back of the wafer, influence the thinning effect of the wafer, and reduce the grinding efficiency and the production quality of the wafer.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: a wafer back grinding device and a grinding process comprise a machine body and a workbench arranged on the surface of the machine body, wherein a chip removal rotary table is arranged on the surface of the workbench, a plurality of groups of bearing discs are embedded in the chip removal rotary table, a pressure plate is arranged above the bearing discs, and the pressure plate is arranged below an installation plate;
a top frame is arranged above the mounting plate, and a telescopic cylinder is arranged at the top end of the top frame;
the bottom end of the telescopic cylinder is connected with the servo motor through a telescopic end, the servo motor is fixedly mounted on the surface of the mounting plate, the output end of the servo motor is connected with a grinding wheel through a coupler, and the grinding wheel is arranged at the bottom end of the pressure plate;
the inside of chip removal carousel is through the drive of active lever, and the outer wall connection of active lever has the master gear, the lateral wall meshing of master gear is connected with the multiunit side gear, and the side gear passes through the connecting rod and installs the top at the layer board, the top of connecting rod is connected with the bottom of bearing the dish, and the outer wall meshing of side gear is connected with the ring gear, the ring gear is installed in the bottom of chip removal carousel.
Preferably, a guide wheel is arranged between the pressure plate and the grinding wheel, the guide wheel is fixedly installed at the bottom end of the pressure plate, and the bottom end of the guide wheel is in sliding connection with the surface of the grinding wheel.
Preferably, be connected with the telescopic link between mounting panel and the pressure disk, and the surface of pressure disk is connected with the output of telescopic link.
Preferably, the driving rod is connected with an output end of the material transferring motor, and the material transferring motor is fixedly installed inside the machine body.
Preferably, the outer wall of the gear ring is fixedly provided with a sliding block, the outer wall of the sliding block is connected with a sliding chute in a sliding manner, and the sliding chute is formed in the machine body.
Preferably, a first sliding table is fixedly mounted on the rear end face of the mounting plate, the first sliding table is connected to the surface of the first track in a sliding mode, and the first track is fixedly mounted on the surface of the moving seat.
Preferably, the lower part of the movable seat is fixedly connected with a fixed plate, the bottom end of the fixed plate is fixedly connected with a second sliding table, the inner wall of the second sliding table is slidably connected with a second rail, and the second rail is fixedly arranged on the surface of the machine body.
Preferably, the outside of fixed plate is connected with the limiting plate, and one side of limiting plate is connected with flexible rubber, the opposite side of flexible rubber and the fixed surface installation of organism.
A grinding process of a wafer back is applied to a grinding device of the wafer back, and is characterized in that: the method comprises the following steps:
s1, placing a wafer on the surface of a bearing disc;
s2, the movable base is moved to be correspondingly arranged above the bearing plate on the pressure plate;
s3, attaching the pressure plate to the surface of the wafer through the telescopic cylinder;
s4, starting rotation through the servo motor and the material transferring motor, so that the pressure plate and the bearing plate realize reverse rotation friction, the silicon layer on the back of the wafer is conveniently planed and ground, and the wafer is thinned;
s5, taking out the finished wafer on the surface of the bearing disc, and fixing the wafer on the iron ring.
(III) advantageous effects
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, the multiple groups of bearing discs are arranged in the chip removal turntable, so that the device can grind the surface of the bearing disc through the arrangement of the multiple groups of pressure discs and grinding wheels, and the grinding wheels and the bearing disc can realize the grinding work of the grinding wheels under downward pressure through the arrangement of the grinding wheels and the bearing disc, and simultaneously the bearing disc reversely rotates in a friction mode to plane and grind the back silicon layer of the wafer, thereby achieving the thinning effect, realizing the bidirectional thinning of the wafer, and through the arrangement of the multiple groups of bearing discs, the device can synchronously process the multiple groups of wafers simultaneously, so that the working efficiency of the device and the synchronous precision of the wafer planing and grinding are improved.
2. According to the invention, the mounting plate can be driven by the moving seat to move on the surface of the machine body through the arrangement of the mounting plate and the moving seat, the mounting plate can move on the surface of the moving seat through the arrangement of the first sliding table and the first track, the mounting plate can drive the pressure plate and the grinding wheel to adjust the position conveniently, the pressure plate and the grinding wheel can be precisely ground above the bearing plate, and the wafer can be precisely and reversely ground in a two-way mode.
Drawings
FIG. 1 is a schematic perspective view of a wafer backside polishing apparatus according to the present invention;
FIG. 2 is a schematic perspective view of a platen and grinding wheel according to the present invention;
FIG. 3 is a schematic side view of the grinding wheel of the present invention;
FIG. 4 is a schematic perspective view of the movable base and the body of the present invention;
fig. 5 is a schematic cross-sectional structure view of the chip removal turntable and the bearing disc in the invention;
fig. 6 is a schematic perspective view of a gear ring and a side gear according to the present invention.
In the figure: 1. a body; 2. a work table; 3. a chip removal turntable; 4. a carrier tray; 5. a platen; 6. mounting a plate; 7. a top frame; 8. a telescopic cylinder; 9. a first sliding table; 10. a first track; 11. a movable seat; 12. a fixing plate; 13. a second sliding table; 14. a second track; 15. a limiting plate; 16. a flexible rubber; 17. a telescopic end; 18. a guide bar; 19. a servo motor; 20. a coupling; 21. a guide wheel; 22. a grinding wheel; 23. a telescopic rod; 24. a driving lever; 25. a material transferring motor; 26. a main gear; 27. a side gear; 28. a connecting rod; 29. a gear ring; 30. a support plate; 31. a slider; 32. a chute.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, a wafer back grinding device includes a machine body 1, a worktable 2 mounted on the surface of the machine body 1, a chip removal turntable 3, a bearing plate 4, a pressure plate 5, a mounting plate 6, a top frame 7, a telescopic cylinder 8, a first sliding table 9, a first rail 10, a movable seat 11, a fixing plate 12, a second sliding table 13, a second rail 14, a limiting plate 15, a telescopic rubber 16, a telescopic end 17, a guide rod 18, a servo motor 19, a coupling 20, a guide wheel 21, a grinding wheel 22, a telescopic rod 23, a driving rod 24, a material transferring motor 25, a main gear 26, a side gear 27, a connecting rod 28, a gear ring 29, a supporting plate 30, a sliding block 31 and a sliding chute 32, wherein the chip removal turntable 3 is disposed on the surface of the machine body 2, three groups of bearing plates 4 are embedded in the chip removal turntable 3, the inside of the turntable 3 is driven by the driving rod 24, the driving rod 24 is connected to the output end of the material transferring motor 25, and the material transferring motor 25 is fixedly installed in the machine body 1, so that the material transferring motor 25 can drive the chip removal turntable 3 to rotate through the driving rod 24, a V-shaped groove is formed on the surface of the chip removal turntable 3, which is convenient for chip removal of the chips ground in the bearing disc 4 and is beneficial to improving the grinding accuracy of the chips, a baffle is arranged on the outer side of the chip removal turntable 3, the baffle is arranged on the surface of the worktable 2 and is convenient for shielding the silicon layer processed by planing grinding on the outer side of the chip removal turntable 3, so as to avoid splashing of the scraps, a main gear 26 is connected to the outer wall of the driving rod 24, three groups of side gears 27 are meshed and connected to the outer side wall of the main gear 26, the side gears 27 are installed above the supporting plate 30 through connecting rods 28, the top end of the connecting rod 28 is connected with the bottom end of the bearing disc 4, so that the main gear 26 realizes the transmission of the connecting rods 28 through the side gears 27, the bearing disc 4 can conveniently rotate in the chip removal turntable 3 through the connecting rod 28, the gear ring 29 is connected with the outer wall of the side gear 27 in a meshed mode, the gear ring 29 is installed at the bottom end of the chip removal turntable 3, under the meshing action of the inner wall of the gear ring 29 and the outer wall of the side gear 27, the gear ring 29 reversely rotates on the outer wall of the side gear 27, the chip removal turntable 3 and three groups of bearing discs 4 in the chip removal turntable 3 are reversely rotated through the connection of the gear ring 29 and the chip removal turntable 3, the bearing discs 4 can conveniently drive wafers to be ground, the rotation accuracy of the chip removal turntable 3 is considered, a sliding block 31 is fixedly installed on the outer wall of the gear ring 29, a sliding groove 32 is slidably connected to the outer wall of the sliding block 31, the sliding groove 32 is formed in the machine body 1, the gear ring 29 can accurately rotate in the machine body 1, and the deviation and separation of the gear ring 29 are avoided;
referring to fig. 1-3, in view of grinding wafers with different thicknesses, a pressure plate 5 is disposed above a carrier plate 4, the pressure plate 5 is mounted below a mounting plate 6 through a telescopic rod 23, the surface of the pressure plate 5 is connected to the output end of the telescopic rod 23, so that the pressure plate 5 can adjust the height below the mounting plate 6 through the telescopic rod 23, which facilitates synchronous adjustment during wafer grinding, and realizes precise wafer grinding, a top frame 7 is disposed above the mounting plate 6, a telescopic cylinder 8 is mounted at the top end of the top frame 7, the bottom end of the telescopic cylinder 8 is connected to a servo motor 19 through a telescopic end 17, the servo motor 19 is fixedly mounted on the surface of the mounting plate 6, a grinding wheel 22 is connected to the output end of the servo motor 19 through a coupler 20, the grinding wheel 22 is disposed at the bottom end of the pressure plate 5, the diameter of the grinding wheel 22 is larger than that of the pressure plate 5, so that the grinding wheel 22 can grind wafers with different diameters, which is convenient for expanding the applicable range of the device, and in order to ensure the rotating effect of the grinding wheel 22 at the bottom of the pressure plate 5, a guide wheel 21 is disposed between the pressure plate 5 and the guide wheel 21, and the grinding wheel 21 is connected to the grinding wheel 21, and the bottom end of the grinding wheel 22, and the grinding wheel 21 is connected to the grinding wheel 21, and the grinding wheel 21, when the grinding wheel 22 is connected to the grinding wheel 21, and the grinding wheel 21, the grinding wheel is connected to the bottom end of the grinding wheel 21, and the grinding wheel.
Referring to fig. 1 to 4, a first sliding table 9 is fixedly mounted on a rear end surface of a mounting plate 6, the first sliding table 9 is slidably connected to a surface of a first rail 10, the first rail 10 is fixedly mounted on a surface of a movable base 11, so that the mounting plate 6 can move on the surface of the movable base 11 through the first sliding table 9, the mounting plate 6 drives a platen 5 and a grinding wheel 22 to move, a fixed plate 12 is fixedly connected to a lower portion of the movable base 11, a second sliding table 13 is fixedly connected to a bottom end of the fixed plate 12, a second rail 14 is slidably connected to an inner wall of the second sliding table 13, and the second rail 14 is fixedly mounted on the surface of the machine body 1, so that the movable base 11 can move on the surface of the machine body 1 through the fixed plate 12, the movable base 11 drives the mounting plate 6 to move, in order to ensure movement stability of the movable base 11, a limiting plate 15 is connected to an outer side of the fixed plate 12, the limiting plate 15 is supported on one side of the movable base 11, thereby preventing the movable base 11 from shifting and tilting when the movable base 11 moves, a telescopic rubber 16 is connected to one side of the limiting plate, and a good dustproof effect of the second sliding rail 14 is ensured, and a telescopic rubber 16 is provided on the other side of the fixed surface of the second sliding rail 14, and a telescopic rubber 14, which is beneficial to prolong service life of the telescopic rubber.
A grinding process for the back surface of a wafer comprises the following steps:
s1, placing a wafer at the center of the surface of a bearing disc 4, and enabling the circle center of the wafer to correspond to the circle center of the bearing disc 4;
s2, moving the moving seat 11 through the second rail 14 and the second sliding table 13, so that the moving seat 11 drives the mounting plate 6 to move to be correspondingly arranged above the bearing disc 4, and adjusting the pressure plate 5 to be correspondingly arranged above the bearing disc 4 through the first sliding table 9 and the first rail 10;
s3, adjusting the pressure plate 5 and the grinding wheel 22 to be at a proper height above the wafer through the telescopic cylinder 8, so that the grinding wheel 22 can gradually descend during grinding, and the grinding wheel 22 is always attached to the surface of the wafer on the pressure plate 5 for planing and grinding;
s4, the servo motor 19 and the material transferring motor 25 are started to rotate, so that the pressure plate 5 and the bearing plate 4 realize reverse rotation friction, the silicon layer on the back of the wafer is convenient to plane and grind, the wafer is thinned, and the device can synchronously plane and grind a plurality of groups of wafers through the arrangement of the plurality of groups of pressure plates 5, so that the production efficiency of the device is improved;
and S5, taking out the wafer finished product with the thinned back silicon wafer on the surface of the bearing disc 4, and fixing the wafer on an iron ring processed in the subsequent step.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides a wafer back grinding device, includes organism (1) and installs workstation (2) on organism (1) surface, its characterized in that: the surface of the workbench (2) is provided with a chip removal turntable (3), a plurality of groups of bearing discs (4) are embedded in the chip removal turntable (3), a pressure plate (5) is arranged above the bearing discs (4), and the pressure plate (5) is arranged below the mounting plate (6);
a top frame (7) is arranged above the mounting plate (6), and a telescopic cylinder (8) is arranged at the top end of the top frame (7);
the bottom end of the telescopic cylinder (8) is connected with a servo motor (19) through a telescopic end (17), the servo motor (19) is fixedly mounted on the surface of the mounting plate (6), the output end of the servo motor (19) is connected with a grinding wheel (22) through a coupler (20), and the grinding wheel (22) is arranged at the bottom end of the pressure plate (5);
the inside of chip removal carousel (3) is through drive lever (24) drive, and the outer wall connection of drive lever (24) has master gear (26), the lateral wall meshing of master gear (26) is connected with multiunit side gear (27), and side gear (27) are installed in the top of layer board (30) through connecting rod (28), the top of connecting rod (28) is connected with the bottom of bearing dish (4), and the outer wall meshing of side gear (27) is connected with ring gear (29), ring gear (29) are installed in the bottom of chip removal carousel (3).
2. The wafer back side grinding apparatus of claim 1, wherein: a guide wheel (21) is arranged between the pressure plate (5) and the grinding wheel (22), the guide wheel (21) is fixedly installed at the bottom end of the pressure plate (5), and the bottom end of the guide wheel (21) is in sliding connection with the surface of the grinding wheel (22).
3. The wafer back side polishing apparatus of claim 1, wherein: be connected with telescopic link (23) between mounting panel (6) and pressure disk (5), and the surface of pressure disk (5) is connected with the output of telescopic link (23).
4. The wafer back side grinding apparatus of claim 1, wherein: the driving rod (24) is connected with the output end of the material transferring motor (25), and the material transferring motor (25) is fixedly arranged in the machine body (1).
5. The wafer back side polishing apparatus of claim 1, wherein: the outer wall of the gear ring (29) is fixedly provided with a sliding block (31), the outer wall of the sliding block (31) is connected with a sliding groove (32) in a sliding mode, and the sliding groove (32) is formed in the machine body (1).
6. The wafer back side polishing apparatus of claim 3, wherein: the rear end face fixed mounting of mounting panel (6) has first slip table (9), and first slip table (9) at first track (10) surface sliding connection, first track (10) is at the fixed surface installation who removes seat (11).
7. The wafer back side polishing apparatus of claim 6, wherein: the lower part fixedly connected with fixed plate (12) of removal seat (11), and the bottom fixedly connected with second slip table (13) of fixed plate (12), the inner wall sliding connection of second slip table (13) has second track (14), and second track (14) is at the fixed surface installation of organism (1).
8. The wafer back side grinding apparatus of claim 7, wherein: the outer side of the fixed plate (12) is connected with a limiting plate (15), one side of the limiting plate (15) is connected with a telescopic rubber (16), and the other side of the telescopic rubber (16) is fixedly mounted on the surface of the machine body (1).
9. A process for grinding the back surface of a wafer, which is applied to the device for grinding the back surface of a wafer according to any one of claims 1 to 8, wherein: the method comprises the following steps:
s1, placing a wafer on the surface of a bearing disc (4);
s2, the movable base (11) is moved to be correspondingly arranged above the bearing plate (4) on the pressure plate (5);
s3, attaching the pressure plate (5) to the surface of the wafer through the telescopic cylinder (8);
s4, starting the servo motor (19) and the material transferring motor (25) to rotate, so that the pressure plate (5) and the bearing plate (4) realize reverse rotation friction, a silicon layer on the back of the wafer is conveniently planed and ground, and the wafer is thinned;
s5, taking out the finished wafer on the surface of the bearing disc (4), and fixing the wafer on the iron ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310028535.9A CN115847278A (en) | 2023-01-09 | 2023-01-09 | Wafer back grinding device and grinding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310028535.9A CN115847278A (en) | 2023-01-09 | 2023-01-09 | Wafer back grinding device and grinding process |
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| Publication Number | Publication Date |
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| CN115847278A true CN115847278A (en) | 2023-03-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310028535.9A Pending CN115847278A (en) | 2023-01-09 | 2023-01-09 | Wafer back grinding device and grinding process |
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| Country | Link |
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| CN (1) | CN115847278A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116564873A (en) * | 2023-06-05 | 2023-08-08 | 江苏纳沛斯半导体有限公司 | Fixed-point positioning mechanism and fixed-point positioning step for semiconductor wafer |
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| CN216940089U (en) * | 2022-03-28 | 2022-07-12 | 南通元兴智能科技有限公司 | A repair face and groove integral type equipment for carborundum processing |
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2023
- 2023-01-09 CN CN202310028535.9A patent/CN115847278A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| DE102009038942A1 (en) * | 2008-10-22 | 2010-04-29 | Peter Wolters Gmbh | Apparatus for double-sided machining of flat workpieces and method for simultaneous double-sided material removing machining of multiple semiconductor wafers |
| CN109551304A (en) * | 2018-10-30 | 2019-04-02 | 广东劲胜智能集团股份有限公司 | A kind of ultra-thin ceramic fingerprint slice lapping technique |
| CN112117204A (en) * | 2020-09-10 | 2020-12-22 | 安徽龙芯微科技有限公司 | Manufacturing method of packaging structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116564873A (en) * | 2023-06-05 | 2023-08-08 | 江苏纳沛斯半导体有限公司 | Fixed-point positioning mechanism and fixed-point positioning step for semiconductor wafer |
| CN116564873B (en) * | 2023-06-05 | 2024-05-10 | 江苏纳沛斯半导体有限公司 | Fixed-point positioning mechanism and fixed-point positioning step for semiconductor wafer |
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