CN109551304A - A kind of ultra-thin ceramic fingerprint slice lapping technique - Google Patents
A kind of ultra-thin ceramic fingerprint slice lapping technique Download PDFInfo
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- CN109551304A CN109551304A CN201811278012.5A CN201811278012A CN109551304A CN 109551304 A CN109551304 A CN 109551304A CN 201811278012 A CN201811278012 A CN 201811278012A CN 109551304 A CN109551304 A CN 109551304A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention relates to a kind of ultra-thin ceramic fingerprint slice lapping techniques, the grinding technics is completed by ultra-thin ceramic fingerprint slice lapping equipment, the equipment includes rack and rack-mounted upper polishing disk, lower fixed disk, elevating mechanism, medium spraying mechanism, rotating mechanism and control cabinet, the upper polishing disk is driven by being located at upper rack elevating mechanism, lower fixed disk is located at the lower part of upper polishing disk, and corresponding with upper polishing disk；Several suction disks with suction hole are provided between the upper polishing disk and lower fixed disk, the lower part of each suction disk is mounted on lower fixed disk by what shaft rotated, and the outer wall of the suction disk is driven by rotating mechanism.The invention has the advantages that efficiently, stablize and can process ultra-thin (0.04mm≤thickness < 0.08mm) ceramics fingerprint piece, realize batch production.
Description
Technical field
The present invention relates to a kind of ultra-thin ceramic fingerprint slice lapping equipment and its grinding technics, are applicable in 0.04-0.3mm superthin section
The hard brittle materials grinding and polishing such as glass, ceramics, silicon wafer, sapphire field.
Background technique
With 2013, apple iPhone 5S was introduced after fingerprint technique, and the booting of mobile phone is arranged also from initial number
Password, figure unlock develop and have arrived present fingerprint recognition, our mobile phone also becomes increasingly safer.Short two or three time
Scape, thousand yuan of machines, even hundred yuan of machines have also had a large amount of types to be equipped with fingerprint identification technology, it may be said that fingerprint recognition is almost
Become the necessary functions of mobile phone.Also from single unlock before, unlock till now pays and opens the function of fingerprint recognition
Move various applications etc. function, the routine use having great convenience for the user while protecting user information safety.It 2016, takes
The market scale for carrying fingerprint identification device is at least up to 500,000,000, and such bio-identification can be also applied to other than mobile phone using future
Field, estimate 2018, this scale also will increase the level to 1,700,000,000.
Fingerprint recognition market potential is huge, but is not so readily in technical application.In view of fingerprint recognition mould
Group area is small, and application environment is complicated, but requires identification sensitivity and speed high, this is just to fingerprint recognition chip and surface
Protection materials also proposed very high requirement, and the scheme of comparative maturity has sapphire, coating type (coating), ceramics at present
Four kinds of schemes of cover board and glass.Sapphire hardness is high, corrosion-resistant, but there are higher cost, the indifferent costs of drop resistant
And aspect of performance, Sapphire advantage hardness is high, corrosion-resistant, and disadvantage is at high cost, drop resistant is indifferent, poor toughness can not accomplish
Thinner (most thin 0.175mm at present)；Coating type scheme advantage is at low cost, and disadvantage coating hardness is low, is prone to wear and by sweat corruption
Erosion, appearance are poor；Glass proposals advantage is at low cost, and disadvantage hardness is lower, dielectric constant is low, bending strength is poor can not accomplish more
Thin (most thin 0.175mm at present)；Zirconia ceramics scheme advantage hardness is higher, corrosion-resistant, dielectric constant is high, the good energy of bending strength
Enough accomplish thinner thickness (most thin 0.08mm at present, by process equipment and cost impact), can be realized faster higher more sensitive
Recognition effect, disadvantage cost are lower than sapphire but more at high cost than other schemes.It is reported that zirconia ceramics cover board is at present more
It is applied in family's famous brand name mobile phone, future has an opportunity gradually to popularize in more smart mobile phone application.
Comprehensive substitution of limitation zirconia ceramics fingerprint cover board uses maximum obstacle or cost and processing technology at present
Aspect；Influence cost main point is that post-processing, refer to current conventional machining process (most thin at present in terms of processing technology
Can accomplish 0.08mm) the thin slice ceramics of thinner (thickness < 0.08mm) cannot be processed, because relative to the toughness of ceramics and strong
Degree, can accomplish it is thinner for identification reaction speed faster, user experience is stronger；To reduce traditional zirconia ceramics fingerprint
It identifies the cost of cover board post-processing and processes thinner thin slice ceramics, essentially consist in more advanced, the higher yield of exploitation, higher efficiency
Processes and apparatus.The technique of grinding and polishing zirconia ceramics fingerprint piece at present are as follows: 1. corase grinding: ground using minor diameter (9B) is two-sided
Raw material are once thinned in grinding machine cast iron plate+blue steel dental lamina+SiC (green silicon carbide) (thickness is generally 0.25-0.35mm)
To 0.1-0.15mm；It grinds in 2.: first time being thinned using minor diameter (9B) twin grinder copper dish+blue steel piece+Liquid diamond
Material progress is secondary to be thinned to 0.08-0.09mm and reduces surface roughness；3. essence is thrown: using twin grinder polished leather+blue steel
Piece+silica solution carries out essence and throws finished product.Disadvantage: 1. since product thickness is thin, and the planetary plate (blue steel piece) used can only compare product
It is thinner, in order to which proof strength can only use minor diameter planetary gear to limit the use of major diameter planetary gear, add every time
Chemical product negligible amounts influence processing efficiency；It can only influence to process using the machined parameters of low speed, low pressure in process
Efficiency；It is easy that stir-fry machine (planetary plate deformed damaged, product are broken) phenomenon, complex process, process occur in process
De-stabilising effect yield, efficiency.2. since zirconia ceramics fingerprint piece is very high to surface roughness, flatness requirement, processing
Planetary gear revolution and rotation only have several fixed speed ratios in the process, cannot preferably realize that product is miscellaneous in the process footprint of movement
It is random, irregular, so that the uneven roughness in surface is big, it is bad to be easy to appear ripple.3. temperature increases during essence is thrown, lead
Product surface is caused to generate orange peel bad, and causing silica solution to condense too fast formation hard particulate causes product surface scuffing bad.
4. cannot achieve the processing of more thin product (thickness < 0.08mm).
Summary of the invention
To overcome the shortcomings of existing technologies, the present invention provides efficient one kind, stabilization and can process ultra-thin (0.04mm≤thickness
Spend < 0.08mm) technique of ceramic fingerprint slice lapping polishing, and can be realized volume production.The technical scheme is that
A kind of grinding technics of ultra-thin ceramic fingerprint piece, the grinding technics are complete by ultra-thin ceramic fingerprint slice lapping equipment
At, comprising the following steps:
S1, it selects cast iron plate as upper polishing disk, is made into suspension according to the grounds travel and water of mass ratio 1:5~30, it will
The suspension mixed pours into dress liquid device and selects starting blender；
S2, setting machined parameters: upper polishing disk rotating speed is arranged in 10~40rpm, and air-breathing disk rotating speed is equipped in 5~50rpm,
Same time is arranged in positive and negative rotation, and unit pressure is 0.2~0.7kg/cm2, rate-of flow 4L/min；
S3, it drives upper polishing disk to rise to safe altitude by cylinder, then product alignment suction hole is well placed, then open
Dynamic air-breathing switchs and checks whether product sucks admittedly, presses on product upper polishing disk after determining absorption securely and starts processing
Program；
S4, after the one side of product has been roughly ground, polishing disk and suction disk operation, and upper polishing disk are moved up in stopping, will
Product moves down upper polishing disk after changing face, and is again started up air-breathing switch, after determining absorption securely, then according in step S2
Processing program carries out being again started up processing, completes the corase grinding of product another side；
S5, replacement cast iron plate select polished leather as upper polishing disk, form according to the silica solution and water of mass ratio 1:2~6
Polishing medium；The polishing medium mixed is poured into dress liquid device and starting blender and temperature-controlling system, control temperature is selected to set
It is set to 25-40 DEG C.
S6, setting machined parameters: in 10~40rpm, air-breathing disk rotating speed is controlled in 5~40rpm for upper polishing disk rotating speed control,
Same time is arranged in positive and negative rotation, and unit pressure is 0.2~0.8kg/cm2, rate-of flow 5L/min；
S7, it drives upper polishing disk to rise to safe altitude by cylinder, then product alignment suction hole is well placed, then open
Air-breathing on dynamic control cabinet switchs and checks whether product sucks admittedly, presses to upper polishing disk on product after determining absorption securely
And start processing program；
S8, after the one side of product has been refined, polishing disk and suction disk operation, and upper polishing disk are moved up in stopping, will
Product moves down upper polishing disk after changing face, and is again started up air-breathing switch, after determining absorption securely, then according in step S6
Processing program carries out being again started up processing, completes the fine grinding of product another side；
S9, after the two sides of product is all polished, by product taking-up be put into cleaned up in clean water after take out.
Grounds travel in the step S1 is B4C with same particle sizes and polycrystalline diamond micro mist is according to mass ratio 10:1
It mixes, wherein B4C and polycrystalline diamond powder size are one of W3~W9.
The partial size of silica solution in the step S5 is 30~120nm.
The ultra-thin ceramic fingerprint slice lapping equipment includes rack and rack-mounted upper polishing disk, lower fixation
Disk, elevating mechanism, medium spraying mechanism, rotating mechanism and control cabinet, the upper polishing disk are gone up and down by being located at upper rack
Mechanism driving, lower fixed disk are located at the lower part of upper polishing disk, and corresponding with upper polishing disk；The upper polishing disk with it is lower solid
It is provided with several suction disks with suction hole between price fixing, fixation under being mounted on that the lower part of each suction disk is rotated by shaft
On disk, the outer wall of the suction disk is driven by rotating mechanism；One end of air intake duct is connected to the suction hole of each suction disk, another
End is connected to vacuum pump, and the vacuum pump, elevating mechanism, medium spraying mechanism and rotating mechanism access control cabinet.
The elevating mechanism includes cylinder, pressure sensor, connecting rod and bulb bearing, and the cylinder is mounted on machine
On frame, it is arranged along the vertical direction；One end of the connecting rod is linked together by the piston rod of pressure sensor and cylinder, another
End is linked together by bulb bearing and the upper polishing disk.
The rotating mechanism includes the inner shaft set gradually from the inside to the outside, axis and outer shaft, the inner shaft, axis and
Outer shaft coaxial arrangement forms inner shaft gear ring in the upper end of the inner shaft, is provided on the upper polishing disk sliding with inner shaft gear ring
Inner shaft lower gear is installed in the polishing disk gear ring of dynamic cooperation, the lower end of inner shaft, the inner shaft lower gear and is mounted on the first variable-frequency motor
On first gear engagement；Sun gear gear ring is arranged in the upper end of the axis, is provided on each suction disk and the sun
The suction disk gear ring of gear ring engagement is taken turns, the lower end of the axis is equipped with axis lower gear, the axis lower gear and is mounted on the
Second gear engagement on two variable-frequency motors, the upper end of the outer shaft form arc-shaped bracket, all suction disks are surrounded, should
Outer shaft ring gear is provided on the inside of arc-shaped bracket, the lower end of the outer shaft is equipped with outer shaft lower gear, the outer shaft lower gear
It is engaged with the third gear being mounted on third variable-frequency motor.
The medium spraying mechanism includes water pump and liquid pushing tube, the liquid outlet of the water pump and rack-mounted liquor charging
One end of pipe is connected to, and the other end of the liquid pushing tube is corresponding with the inlet on upper polishing disk, sets on the upper polishing disk
It is equipped with the feed pathway being connected to the inlet of upper polishing disk, the liquid outlet of the feed pathway is located at the lower end surface of upper polishing disk.
Sealing ring is embedded on the suction disk.
The invention has the advantages that
1. sealing air-breathing single-sided process technique using suction disk: consolidating by the way of sealing air-breathing with major diameter disk to product
Fixed (traditional is fixed using blue steel piece) is carried out single-sided process to product, is inhaled using sealing using Twp-sided polishing machine process principle
The fixed form of gas is fitted in product completely in fixed disk, and very securely, improves the stability of processing；
And the pressure and revolving speed of processing can be improved, to improve efficiency；It is not influenced by tradition polishing blue steel piece thickness, therefore
The product of thinner (0.04mm≤thickness < 0.08mm) out can be added
2. using gradual change parameter process: being carried out respectively using the realization of multiple variable-frequency motors to upper polishing disk, polishing disk gear ring
Individually (traditional cannot individually control, and can only realize several fixed speed ratios, and can only select in process of production wherein for control
It is a kind of), making it during operation may be implemented that different parameters (such as revolving speed and rotation direction) is separately provided, and adopt in process
Make the motion profile of product in process more random, mixed and disorderly, random with multiple groups different parameters (gradual change parameter process)
Rule, thus guarantee product surface more evenly, roughness is lower and prevents the generation of ripple.3. using constant temperature technique: refining
Process be easy to generate heat, there is orange peel bad phenomenon so as to cause product surface and silica solution rapid evaporation caused to crystallize into firmly
Little particle causes product surface to scratch；Thermostatic control is carried out using the polishing medium silica solution that temperature-controlling system throws section to essence, is guaranteed
Within the scope of a fixed temperature, to avoid orange peel bad and scratch to generate；Use blender always in process of production
Stirring guarantees that medium does not precipitate, and mixed liquor is uniformly to guarantee processing efficiency.
4. using coarse-fine two procedures technique: tradition needs point three process that could complete to process, by changing fixation side
(air-breathing is fixed to can be used high revolving speed high pressure to formula, and uses lesser, same particle size B4C (boron carbide) and polycrystalline diamond
Micro powder granule mixture improves grinding efficiency as abrasive media), (gradual change parameter process can make slightly optimization machined parameters
The surface of mill is uniform, roughness is low), it is possible to reduce roughly grinding operation only needs two procedures that can complete to process, promotion yield,
Efficiency saves human cost.
5. using two-sided while repairing disk technology: traditional single-side machine can not be two-sided while repairing disk, cannot guarantee well on
The relative flatness of lower wall, thus it cannot be guaranteed that in all disks product thickness consistency, this technique use single side grinding
Polishing machine have effects that Double-plate machine it is the same repair disk.
Detailed description of the invention
Fig. 1 is agent structure schematic diagram of the invention.
Fig. 2 is enlarged drawing at the A of Fig. 1.
Fig. 3 is the installation relation schematic diagram of outer shaft ring gear and suction disk in Fig. 1.
Fig. 4 is the connection relationship diagram of suction disk and sealing ring in Fig. 1.
Specific embodiment
The invention will now be further described with reference to specific embodiments, the advantages and features of the present invention will be with description and
It is apparent.But examples are merely exemplary for these, and it is not intended to limit the scope of the present invention in any way.Those skilled in the art
Member it should be understood that without departing from the spirit and scope of the invention can details to technical solution of the present invention and form into
Row modifications or substitutions, but these modifications and replacement are fallen within the protection scope of the present invention.
Referring to Fig. 1 to Fig. 4, the invention further relates to a kind of grinding technics of ultra-thin ceramic fingerprint piece, which passes through
Ultra-thin ceramic fingerprint slice lapping equipment is completed, comprising the following steps:
S1, it selects cast iron plate as upper polishing disk (corase grinding), is made into suspension according to the grounds travel and water of mass ratio 1:5~30
The suspension mixed is poured into dress liquid device and selects starting blender by liquid；
S2, setting machined parameters: upper polishing disk rotating speed is arranged in 10~40rpm, and air-breathing disk rotating speed is equipped in 5~50rpm,
Same time is arranged in positive and negative rotation, and unit pressure is 0.2~0.7kg/cm2, rate-of flow 4L/min；
S3, it drives upper polishing disk to rise to safe altitude by cylinder, then product alignment suction hole is well placed, then open
Dynamic air-breathing switchs and checks whether product sucks admittedly, presses on product upper polishing disk after determining absorption securely and starts processing
Program；
S4, after the one side of product has been roughly ground, polishing disk and suction disk operation, and upper polishing disk are moved up in stopping, will
Product moves down upper polishing disk after changing face, and is again started up air-breathing switch, after determining absorption securely, then according in step S2
Processing program carries out being again started up processing, completes the corase grinding of product another side；
S5, replacement cast iron plate, select polished leather as upper polishing disk (fine grinding), according to mass ratio 1:2~6 silica solution with
Water forms polishing medium；The polishing medium mixed is poured into dress liquid device and selects starting blender and temperature-controlling system, temperature control
Temperature setting is 25-40 DEG C.
S6, setting machined parameters: in 10~40rpm, air-breathing disk rotating speed is controlled in 5~40rpm for upper polishing disk rotating speed control,
Positive and negative rotation setting same time (refers to that the time for rotating forward processing in process is grown as the time setting of reversion processing, example
It is 30S+300S+300S=630S, the time of reversion as roughly ground the time that upper polishing disk and suction tray rotate forward in parameter in example 1
For 30S+300S+300S=630S, refer to that the two times are identical), unit pressure is 0.2~0.8kg/cm2, rate-of flow is
5L/min；
S7, it drives upper polishing disk to rise to safe altitude by cylinder, then product alignment suction hole is well placed, then open
Air-breathing on dynamic control cabinet switchs and checks whether product sucks admittedly, presses to upper polishing disk on product after determining absorption securely
And start processing program；
S8, after the one side of product has been refined, polishing disk and suction disk operation, and upper polishing disk are moved up in stopping, will
Product moves down upper polishing disk after changing face, and is again started up air-breathing switch, after determining absorption securely, then according in step S6
Processing program carries out being again started up processing, completes the fine grinding of product another side；
S9, after the two sides of product is all polished, by product taking-up be put into cleaned up in clean water after take out.
Grounds travel in the step S1 is B4C with same particle sizes and polycrystalline diamond micro mist is according to mass ratio 10:1
It mixes, wherein B4C and polycrystalline diamond powder size are one of W3~W9.
The partial size of silica solution in the step S5 is 30~120nm.
A kind of ultra-thin ceramic fingerprint slice lapping equipment include rack and rack-mounted upper polishing disk 6,
Lower fixed disk 14, elevating mechanism, medium spraying mechanism, rotating mechanism and control cabinet 20, the upper polishing disk 6 is by being located at machine
The driving of frame top elevating mechanism, lower fixed disk 14 are located at the lower part of upper polishing disk, and corresponding with upper polishing disk 6；Described
Several suction disks 4 with suction hole 2 are provided between upper polishing disk 6 and lower fixed disk 14, the lower part of each suction disk 4 is by turning
What axis 13 rotated is mounted on lower fixed disk 14, and the outer wall of the suction disk 4 is driven by rotating mechanism；One end of air intake duct 3 with
The suction hole 2 of each suction disk 4 is connected to, and the other end is connected to vacuum pump (not shown), the vacuum pump, elevating mechanism, Jie
Matter spraying mechanism and rotating mechanism access control cabinet 20.
The elevating mechanism includes cylinder 11, pressure sensor 9, connecting rod 8 and bulb bearing 7, the cylinder 11
It is mounted on the rack, is arranged along the vertical direction；One end of the connecting rod 8 is connected by the piston rod 10 of pressure sensor 9 and cylinder
It is connected together, the other end is linked together by bulb bearing 7 with the upper polishing disk 6.
The rotating mechanism includes the inner shaft 12 set gradually from the inside to the outside, axis 16 and outer shaft 18, the inner shaft
12, axis 16 and outer shaft 18 are coaxially disposed, and are formed inner shaft gear ring in the upper end of the inner shaft 12, are set on the upper polishing disk 6
It is equipped with the polishing disk gear ring being slidably matched with inner shaft gear ring, inner shaft lower gear, the inner shaft lower gear and peace are installed in the lower end of inner shaft
First gear engagement on the first variable-frequency motor 19-1；Sun gear gear ring 15, Mei Yisuo is arranged in the upper end of the axis 16
The suction disk gear ring engaged with sun gear gear ring 15 is provided on the suction disk 4 stated, the lower end of the axis 16 is equipped with axis
Lower gear, the axis lower gear are engaged with the second gear being mounted on the second variable-frequency motor 19-3, the outer shaft 18 it is upper
End forms arc-shaped bracket, and all suction disks 4 are surrounded, outer shaft ring gear 17 is provided on the inside of the arc-shaped bracket, the outer shaft
18 lower end is equipped with outer shaft lower gear, the outer shaft lower gear and the third gear being mounted on third variable-frequency motor 19-2
Engagement.
The medium spraying mechanism includes water pump and liquid pushing tube 21, and the liquid outlet of the water pump is sent with rack-mounted
Liquid pipe 21 one end connection (inlet of water pump and the reservoir for holding abrasive media solution, the solution of abrasive media according to
Difference that corase grinding, precision grinding process require and it is different), the other end of the liquid pushing tube 21 is with setting in the enterprising liquid channel phase of upper polishing disk
Corresponding, the liquid outlet of the feed pathway is located at the lower end surface of upper polishing disk, and abrasive media solution passes through the feed liquor on upper polishing disk
Channel is fallen on product to be ground.
Sealing ring 5 is embedded on the suction disk 4.
The working principle of the invention is: drive upper polishing disk 6 to do rotation movement by inner shaft 12 respectively when converted products 1, in
Axis 16 drives suction disk 4 to do rotation movement, and suction disk 4 does the planetary motion of rotation and revolution relative to upper polishing disk 6.Due to all
It is individually to control and may be implemented stepless time adjustment, so setting different phase different parameters by control cabinet 20 in process
Realize that irregular machining locus, 6 suction disks 4 are all by the driving of the same sun gear gear ring 15, therefore motion profile complete one
It causes；Keep the product surface quality on each suction disk 4 more preferable, thickness is more evenly.In converted products, outer shaft 18 is motionless, only
Plate wheel will be repaired when repairing disk to be placed on above suction disk 4 and be meshed with outer shaft ring gear 17, sun gear gear ring 15 respectively；Pass through
Axis 16 and 18 different rotating speeds of outer shaft are set, do planetary motion relative to upper polishing disk 6 and suction disk 4 to realize and repair plate wheel,
It realizes that two disks are modified simultaneously up and down, while polishing disk 6 is smooth in guarantee, guarantees that 64 disks of suction disk are smooth consistent
Property.Grinding and polishing medium connect by liquid pushing tube 21 with water pump, then by 20 property of can choose of control cabinet unlatching temperature-controlling system with
Blender (carries out control gentle agitation to the container for holding abrasive media solution), realizes constant temperature processing.
Since using air-breathing single-sided process is sealed, product is securely close to disk, therefore can process thinner thin slice
Ceramics, the most thin thin slice ceramics for being capable of processing out 0.04mm.
Embodiment 1:
Be 50mm by 180 diameters, with a thickness of 0.3mm mobile fingerprint cover board blank be processed into a thickness of 0.05mm at
Product.Roughly grind B4C and polycrystalline diamond micro mist mixture and 30kg water mixed solution that medium is 1kg partial size W9；Fine grinding medium is 4kg
The silica solution and 24kg water mixed solution of partial size 120nm.
Machined parameters:
It is 98.3% according to the product first-time qualification rate that the present embodiment technique obtains, surface roughness 2.9nm.
Embodiment 2: by 180 diameters be 50mm, with a thickness of 0.3mm mobile fingerprint cover board blank be processed into a thickness of
The finished product of 0.05mm.Roughly grind B4C and polycrystalline diamond microparticle mixture and 30kg water mixed solution that medium is 2kg partial size W5；
Refine the silica solution and 20kg water mixed solution that medium is 5kg partial size 50nm.
Machined parameters:
It is 99.4% according to the product first-time qualification rate that the present embodiment technique obtains, surface roughness 2.1nm.
Embodiment 3: by 180 diameters be 50mm, with a thickness of 0.3mm mobile fingerprint cover board blank be processed into a thickness of
The finished product of 0.05mm.The B4C that grinding (corase grinding) medium is 3kg partial size W7 is mixed with polycrystalline diamond microparticle mixture and 15kg water
Solution；Polish the silica solution and 21kg water mixed solution that (fine grinding) medium is 7kg partial size 80nm.
Machined parameters:
It is 98.8% according to the product first-time qualification rate that the present embodiment technique obtains, surface roughness 2.4nm.
Claims (8)
1. a kind of grinding technics of ultra-thin ceramic fingerprint piece, which is completed by ultra-thin ceramic fingerprint slice lapping equipment,
Characterized by comprising the following steps:
S1, it selects cast iron plate as upper polishing disk, is made into suspension according to the grounds travel and water of mass ratio 1:5~30, will mix
Good suspension pours into dress liquid device and selects starting blender；
S2, setting machined parameters: upper polishing disk rotating speed is arranged in 10~40rpm, and air-breathing disk rotating speed is equipped in 5~50rpm, positive and negative
Turn setting same time, unit pressure is 0.2~0.7kg/cm2, rate-of flow 4L/min；
S3, it drives upper polishing disk to rise to safe altitude by cylinder, then product alignment suction hole is well placed, then starting is inhaled
Air cock simultaneously checks whether product sucks admittedly, presses on product upper polishing disk after determining absorption securely and starts processing journey
Sequence；
S4, after the one side of product has been roughly ground, polishing disk and suction disk operation, and upper polishing disk are moved up, by product in stopping
Upper polishing disk is moved down after changing face, and is again started up air-breathing switch, after determining absorption securely, then according to the processing in step S2
Program carries out being again started up processing, completes the corase grinding of product another side；
S5, replacement cast iron plate, select polished leather as upper polishing disk, form polishing according to the silica solution and water of mass ratio 1:2~6
Medium；The polishing medium mixed is poured into dress liquid device and starting blender and temperature-controlling system, control temperature is selected to be set as
25-40℃。
S6, setting machined parameters: in 10~40rpm, the control of air-breathing disk rotating speed is positive and negative in 5~40rpm for upper polishing disk rotating speed control
Turn setting same time, unit pressure is 0.2~0.8kg/cm2, rate-of flow 5L/min；
S7, it drives upper polishing disk to rise to safe altitude by cylinder, then product alignment suction hole is well placed, then starting control
Air-breathing on case processed switchs and checks whether product sucks admittedly, and upper polishing disk is pressed on product and opened after determining absorption securely
Dynamic processing program；
S8, after the one side of product has been refined, polishing disk and suction disk operation, and upper polishing disk are moved up, by product in stopping
Upper polishing disk is moved down after changing face, and is again started up air-breathing switch, after determining absorption securely, then according to the processing in step S6
Program carries out being again started up processing, completes the fine grinding of product another side；
S9, after the two sides of product is all polished, by product taking-up be put into cleaned up in clean water after take out.
2. a kind of grinding technics of ultra-thin ceramic fingerprint piece according to claim 1, which is characterized in that the step S1
In grounds travel be that B4C with same particle sizes and polycrystalline diamond micro mist are mixed according to mass ratio 10:1, wherein B4C and more
Brilliant diamond powder size is one of W3~W9.
3. a kind of grinding technics of ultra-thin ceramic fingerprint piece according to claim 1, which is characterized in that the step S5
In silica solution partial size be 30~120nm.
4. according to claim 1 to a kind of grinding technics of ultra-thin ceramic fingerprint piece described in 3 any one, which is characterized in that
The ultra-thin ceramic fingerprint slice lapping equipment includes rack and rack-mounted upper polishing disk, lower fixed disk, lifting
Mechanism, medium spraying mechanism, rotating mechanism and control cabinet, the upper polishing disk are driven by being located at upper rack elevating mechanism
Dynamic, lower fixed disk is located at the lower part of upper polishing disk, and corresponding with upper polishing disk；The upper polishing disk and lower fixed disk it
Between be provided with several suction disks with suction hole, the lower part of each suction disk is mounted on lower fixed disk by what shaft rotated,
The outer wall of the suction disk is driven by rotating mechanism；One end of air intake duct is connected to the suction hole of each suction disk, the other end with
Vacuum pump connection, the vacuum pump, elevating mechanism, medium spraying mechanism and rotating mechanism access control cabinet.
5. a kind of grinding technics of ultra-thin ceramic fingerprint piece according to claim 4, which is characterized in that the elevator
Structure includes cylinder, pressure sensor, connecting rod and bulb bearing, and the cylinder is mounted on the rack, is arranged along the vertical direction；
One end of the connecting rod is linked together by the piston rod of pressure sensor and cylinder, the other end by bulb bearing with it is described
Upper polishing disk link together.
6. a kind of grinding technics of ultra-thin ceramic fingerprint piece according to claim 5, which is characterized in that the whirler
Structure includes the inner shaft set gradually from the inside to the outside, axis and outer shaft, the inner shaft, axis and outer shaft coaxial arrangement, described
The upper end of inner shaft forms inner shaft gear ring, is provided with the polishing disk gear ring being slidably matched with inner shaft gear ring on the upper polishing disk,
Inner shaft lower gear is installed in the lower end of inner shaft, which engages with the first gear being mounted on the first variable-frequency motor；Institute
The upper end setting sun gear gear ring of axis is stated, is provided with the suction disk tooth engaged with sun gear gear ring on each suction disk
Circle, the lower end of the axis are equipped with axis lower gear, the axis lower gear and the second tooth being mounted on the second variable-frequency motor
The upper end of wheel engagement, the outer shaft forms arc-shaped bracket, and all suction disks are surrounded, are provided on the inside of the arc-shaped bracket
Outer shaft ring gear, the lower end of the outer shaft are equipped with outer shaft lower gear, the outer shaft lower gear and are mounted on third variable-frequency motor
On third gear engagement.
7. a kind of grinding technics of ultra-thin ceramic fingerprint piece according to claim 1, which is characterized in that the medium spray
Spilling mechanism includes water pump and liquid pushing tube, and the liquid outlet of the water pump is connected to one end of rack-mounted liquid pushing tube, the liquor charging
The other end of pipe is corresponding with the inlet on upper polishing disk, and the feed liquor with upper polishing disk is provided on the upper polishing disk
The feed pathway of mouth connection, the liquid outlet of the feed pathway are located at the lower end surface of upper polishing disk.
8. a kind of grinding technics of ultra-thin ceramic fingerprint piece according to claim 4, which is characterized in that the suction disk
On be embedded with sealing ring.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811278012.5A CN109551304A (en) | 2018-10-30 | 2018-10-30 | A kind of ultra-thin ceramic fingerprint slice lapping technique |
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| CN201811278012.5A CN109551304A (en) | 2018-10-30 | 2018-10-30 | A kind of ultra-thin ceramic fingerprint slice lapping technique |
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| CN111958482A (en) * | 2020-09-16 | 2020-11-20 | 大连达利凯普科技股份公司 | Vacuum suction tool for ultrathin single-layer ceramic capacitor substrate and manufacturing process |
| WO2021008129A1 (en) * | 2019-07-18 | 2021-01-21 | 浙江科惠医疗器械股份有限公司 | Magneto-rheological polishing machine for ceramic lining in metal acetabulum |
| CN112476067A (en) * | 2020-11-23 | 2021-03-12 | 中国电子科技集团公司第十八研究所 | Method for thinning inorganic electrolyte ceramic wafer for lithium ion battery |
| CN114309920A (en) * | 2021-12-23 | 2022-04-12 | 潮州三环（集团）股份有限公司 | Ceramic cleaver and preparation method thereof |
| CN115847278A (en) * | 2023-01-09 | 2023-03-28 | 江苏纳沛斯半导体有限公司 | Wafer back grinding device and grinding process |
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