CN114309920A - Ceramic cleaver and preparation method thereof - Google Patents
Ceramic cleaver and preparation method thereof Download PDFInfo
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- CN114309920A CN114309920A CN202111587535.XA CN202111587535A CN114309920A CN 114309920 A CN114309920 A CN 114309920A CN 202111587535 A CN202111587535 A CN 202111587535A CN 114309920 A CN114309920 A CN 114309920A
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- ceramic
- polishing
- cylinder
- riving knife
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- 239000000919 ceramic Substances 0.000 title claims abstract description 58
- 235000014820 Galium aparine Nutrition 0.000 title claims abstract description 20
- 240000005702 Galium aparine Species 0.000 title claims abstract description 20
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 238000005498 polishing Methods 0.000 claims abstract description 50
- 230000003746 surface roughness Effects 0.000 claims abstract description 22
- 238000003466 welding Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000006061 abrasive grain Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000004377 microelectronic Methods 0.000 abstract description 3
- 238000006073 displacement reaction Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Images
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention discloses a ceramic cleaver and a preparation method thereof, wherein the ceramic cleaver comprises a cylinder and a conical body, and the surface roughness of the side surface of the cylinder is not more than 0.05 mu m; the conical body is connected with the cylinder; the ceramic riving knife is provided with an axial through hole, the axial through hole penetrates from the rear end to the front end of the ceramic riving knife, and the axial through hole forms a welding nozzle at the tip end of the conical body. In the process of preparing the ceramic cleaver, the surface roughness of the cylinder is reduced through polishing, so that the actual contact area on the contact interface is increased, the ultrasonic wave propagation capacity of the contact interface is increased, and the purpose of increasing the ultrasonic wave energy output of the tip end of the ceramic cleaver is achieved. The invention can be widely applied to the technical field of microelectronic tools.
Description
Technical Field
The invention relates to the technical field of microelectronic tools, in particular to a ceramic cleaver and a preparation method thereof.
Background
Wire bonding is the mainstream mode of internal connection of packaging, and bonding wires and metal bonding pads are tightly combined by using heat, pressure and ultrasonic energy, so that signal transmission among chips and between the chips and a packaging body is realized. In the ultrasonic welding process, the lead wire needs to be pressed by a ceramic chopper, and the ceramic chopper is an axisymmetric ceramic tool with a vertical hole. The ceramic riving knife receives the bonding wire, bonds one end of the wire to the electrode (first bond), and then leads the wire to the lead frame (second bond), in the process, the ceramic riving knife is used to press the wire and ultrasonic wave is applied to complete the bonding.
During this welding process, the ultrasonic waves propagate through the contact interface of the ceramic chopper cylinder and the ultrasonic transducer. However, the interface impedance and energy loss of the common ceramic cleaver are large during the ultrasonic welding process, so that the ultrasonic energy output of the tip of the ceramic cleaver is low.
Disclosure of Invention
In order to solve at least one of the above technical problems, the present invention provides a ceramic riving knife and a preparation method thereof, and the adopted technical scheme is as follows.
The ceramic cleaver provided by the invention comprises a cylinder and a conical body, wherein the surface roughness of the side surface of the cylinder is not more than 0.05 mu m; the conical body is connected with the cylinder; the ceramic riving knife is provided with an axial through hole, the axial through hole penetrates from the rear end to the front end of the ceramic riving knife, and the axial through hole forms a welding nozzle at the tip end of the conical body.
According to the preparation method of the ceramic riving knife, the ceramic riving knife is placed between an upper polishing disk and a lower polishing disk, polishing liquid is added, the two polishing disks rotate in opposite directions to polish a cylinder of the ceramic riving knife, the surface roughness D of the cylinder is controlled by controlling the polishing pressure A, the polishing time B and the grain diameter C of abrasive grains of the polishing liquid, and the surface roughness D is not more than 0.05 mu m.
In some embodiments of the present invention, the polishing pressure A is set to 0.05 MPa.ltoreq.A.ltoreq.0.2 MPa.
In some embodiments of the present invention, the polishing pressure A is set to 0.08 MPa.ltoreq.A.ltoreq.0.15 MPa.
In some embodiments of the present invention, the polishing time B is set to 40min ≦ B ≦ 300 min.
In some embodiments of the present invention, the polishing time B is set to 60min ≦ B ≦ 250 min.
In certain embodiments of the present invention, the particle size C is set to 0.01 μm C0.1 μm.
In some embodiments of the invention, the polishing disk is a copper disk.
In certain embodiments of the invention, the polishing disk is threaded.
The embodiment of the invention has at least the following beneficial effects: in the process of preparing the ceramic cleaver, the surface roughness of the cylinder is reduced through polishing, so that the actual contact area on the contact interface is increased, the ultrasonic wave propagation capacity of the contact interface is increased, and the purpose of increasing the ultrasonic wave energy output of the tip end of the ceramic cleaver is achieved. The invention can be widely applied to the technical field of microelectronic tools.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings.
FIG. 1 is a schematic view of a ceramic riving knife.
Fig. 2 is a partial view of the area a in fig. 1.
Fig. 3 is a graph of surface roughness versus vibration displacement, with the horizontal axis representing surface roughness and the vertical axis representing vibration displacement (in the figure, the vibration displacement is expressed in micrometers).
Reference numerals: 101. a cylinder; 102. a conical body; 103. an axial through hole.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that if the terms "center", "middle", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., are used in an orientation or positional relationship indicated based on the drawings, it is merely for convenience of description and simplicity of description, and it is not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore, is not to be considered as limiting the present invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The invention relates to a ceramic chopper, which is provided with a welding nozzle, in particular to an axial through hole 103, wherein the axial through hole 103 penetrates from the rear end to the front end of the ceramic chopper, and the welding nozzle is formed at the front end of the ceramic chopper by the axial through hole 103.
Referring to the drawings, the ceramic riving knife comprises a cylinder 101 and a cone 102, the cone 102 is connected with the cylinder 101, the tip of the cone 102 is the front end of the ceramic riving knife, and it can be understood that the axial through hole 103 forms a welding tip at the tip of the cone 102.
The surface roughness of the side surface of the cylinder 101 is not more than 0.05 mu m, and the actual contact area of the cylinder 101 of the ceramic cleaver and the ultrasonic transducer can be increased by reducing the surface roughness of the cylinder 101, so that the propagation capacity of the contact interface ultrasonic wave is increased, and the ultrasonic energy output of the tip of the ceramic cleaver is improved.
Other configurations and operations of the ceramic chopper are well known to those skilled in the art and will not be described in detail herein, and the method for making the ceramic chopper will be described below.
The invention relates to a preparation method of a ceramic cleaver, which comprises the steps of placing the ceramic cleaver between an upper polishing disk and a lower polishing disk, applying polishing pressure E to the upper polishing disk, adding polishing liquid, rotating the two polishing disks in opposite directions, polishing a cylinder 101 of the ceramic cleaver, and controlling the surface roughness D of the cylinder 101 by controlling the polishing pressure A, the polishing time B and the grain diameter C of abrasive grains of the polishing liquid, so as to obtain the surface roughness D not more than 0.05 mu m.
Compared with the method for manufacturing the ceramic chopper, which designs the special structure of the cylinder of the ceramic chopper to increase the contact area in the related art, the manufacturing method provided by the invention increases the contact area by reducing the surface roughness of the cylinder, reduces the processing difficulty of the ceramic chopper, improves the yield of products, and can ensure the consistency of the quality of the products.
As an embodiment, the polishing pressure A is set to 0.05 MPa.ltoreq.A.ltoreq.0.2 MPa. Further, the polishing pressure A is set to be 0.08MPa or more and 0.15MPa or less.
As an embodiment, the polishing time B is set to 40min ≦ B ≦ 300 min. Further, the polishing time B is set to be more than or equal to 60min and less than or equal to 250 min.
As an embodiment, the particle size C is set to 0.01 μm C0.1 μm, which is more helpful in controlling the surface roughness D of the cylindrical body 101.
As an embodiment, the polishing disk is a copper disk. Further, the polishing disk has threads provided on the polishing surface to enable inward circulation of the polishing liquid. In particular, the threads on the polishing disk are provided as fine threads.
The relationship between the surface roughness D and the polishing pressure E and the polishing time B is shown in Table 1.
| E/Mpa | B/min | D/μm |
| 0.1 | 20 | 0.2 |
| 0.1 | 40 | 0.1 |
| 0.1 | 60 | 0.05 |
| 0.1 | 90 | 0.04 |
| 0.1 | 130 | 0.03 |
| 0.1 | 180 | 0.02 |
| 0.1 | 250 | 0.01 |
The vibration displacement of the ceramic riving knife with different surface roughness D of the cylinder in the welding process is tested, the relation curve is shown in figure 3, the larger the surface roughness of the cylinder is, the smaller the ultrasonic energy at the tip of the ceramic riving knife is, and the vibration displacement is reduced, as shown in figure 3, the surface roughness is controlled within the range of not more than 0.05 mu m, the vibration displacement is more smooth, and the change is less obvious.
In the actual welding process, the larger the ultrasonic energy is, the larger the diameter of the solder ball of the first welding point is, the larger the thrust force of the solder ball is required, and thus the smaller the time required for achieving the same thrust force is. As can be seen from Table 2, when the thrust of the first welding point is close to the diameter of the solder ball, the required USG current is small for the ceramic chopper with the surface roughness D less than or equal to 0.05 μm, which indicates that the ultrasonic energy output is large at this time.
In the description herein, references to the terms "one embodiment," "some examples," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" or the like, if any, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While the embodiments of the present invention have been described in detail with reference to the drawings, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
Claims (9)
1. A ceramic riving knife is characterized in that: comprises that
A cylinder, the surface roughness of the side surface of the cylinder is not more than 0.05 μm;
the conical body is connected with the cylinder;
the ceramic riving knife is provided with an axial through hole, the axial through hole penetrates from the rear end to the front end of the ceramic riving knife, and the axial through hole forms a welding nozzle at the tip end of the conical body.
2. A preparation method of a ceramic cleaver is characterized by comprising the following steps: the method comprises the steps of placing a ceramic cleaver between an upper polishing disc and a lower polishing disc, adding polishing liquid, enabling the two polishing discs to rotate in opposite directions, polishing a cylinder of the ceramic cleaver, and controlling the surface roughness D of the cylinder by controlling polishing pressure A, polishing time B and the grain diameter C of abrasive grains of the polishing liquid, wherein the surface roughness D is not more than 0.05 mu m.
3. The method of manufacturing a ceramic riving knife of claim 2 wherein: the polishing pressure A is set to be more than or equal to 0.05Mpa and less than or equal to 0.2 Mpa.
4. The method of making a ceramic riving knife of claim 3 wherein: the polishing pressure A is set to be more than or equal to 0.08Mpa and less than or equal to 0.15 Mpa.
5. The method of manufacturing a ceramic riving knife of claim 2 wherein: the polishing time B is set to be more than or equal to 40min and less than or equal to 300 min.
6. The method of making a ceramic riving knife of claim 5 wherein: the polishing time B is set to be more than or equal to 60min and less than or equal to 250 min.
7. The method of manufacturing a ceramic riving knife of claim 2 wherein: the grain diameter C is set to be more than or equal to 0.01 mu m and less than or equal to 0.1 mu m.
8. The method of manufacturing a ceramic riving knife of claim 2 wherein: the polishing disc adopts a copper disc.
9. The method of manufacturing a ceramic riving knife of claim 2 or 8 wherein: the polishing disk has threads.
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| CN202111587535.XA CN114309920A (en) | 2021-12-23 | 2021-12-23 | Ceramic cleaver and preparation method thereof |
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| CN202111587535.XA CN114309920A (en) | 2021-12-23 | 2021-12-23 | Ceramic cleaver and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115674001A (en) * | 2022-10-24 | 2023-02-03 | 苏州三环科技有限公司 | Internal chamfer grinding process for riving knife |
| CN115781424A (en) * | 2022-11-17 | 2023-03-14 | 苏州三环科技有限公司 | Method, system, equipment and medium for grinding outer radius of ceramic chopper |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115674001A (en) * | 2022-10-24 | 2023-02-03 | 苏州三环科技有限公司 | Internal chamfer grinding process for riving knife |
| CN115674001B (en) * | 2022-10-24 | 2023-07-14 | 苏州三环科技有限公司 | Inner chamfer grinding process of riving knife |
| CN115781424A (en) * | 2022-11-17 | 2023-03-14 | 苏州三环科技有限公司 | Method, system, equipment and medium for grinding outer radius of ceramic chopper |
| CN115781424B (en) * | 2022-11-17 | 2023-08-04 | 苏州三环科技有限公司 | Method, system, equipment and medium for grinding outer radius of ceramic riving knife |
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Effective date of registration: 20220913 Address after: 4th Floor, Building B4, Dongchuang Science and Technology Park, No. 216, Jinfeng Road, Mudu Town, Wuzhong District, Suzhou City, Jiangsu Province 215100 Applicant after: Suzhou Sanhuan Technology Co.,Ltd. Applicant after: CHAOZHOU THREE-CIRCLE (Group) Co.,Ltd. Address before: 515646 complex building of Fengtang Third Ring Industrial City, Chaozhou City, Guangdong Province Applicant before: CHAOZHOU THREE-CIRCLE (Group) Co.,Ltd. |
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