CN108389806A - A kind of chopper improving Wire bonding strength - Google Patents
A kind of chopper improving Wire bonding strength Download PDFInfo
- Publication number
- CN108389806A CN108389806A CN201810062208.4A CN201810062208A CN108389806A CN 108389806 A CN108389806 A CN 108389806A CN 201810062208 A CN201810062208 A CN 201810062208A CN 108389806 A CN108389806 A CN 108389806A
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- CN
- China
- Prior art keywords
- chopper
- tip
- wire bonding
- bonding strength
- improving
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
- H01L2224/78303—Shape of the pressing surface, e.g. tip or head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
Landscapes
- Wire Bonding (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
The invention discloses a kind of choppers improving Wire bonding strength, the chopper is welding ceramics chopper, the chopper includes ontology, the tip positioned at ontology one end and hole, the hole extends along the longitudinal axis of the ontology and the tip, and the tip end surface of the tip is made of alternatively distributed protrusion part and sunk part.The design of chopper surface texture of the present invention, its surface can be made to increase wear areas, improve the hardness of tip end surface, increase surface roughness, increase service life, compared with tradition polishing, heat treatment chopper, the chopper has better bonding effect and higher stability, on the one hand golden degree is stayed since the design effectively reduces tip, is on the other hand to improve the service life of porcelain mouth because increasing the wear-resisting degree of porcelain mouth.
Description
Technical field
The present invention relates to a kind of chopper, especially a kind of chopper improving Wire bonding strength.
Background technology
In the production and encapsulation of semiconductor equipment, wire bonding be always between two locations within a package (for example,
Between the pressure pad of semiconductor module and the conducting wire of lead frame) main method being electrically interconnected is provided.In order to form wire loop to carry
For this interconnection, therefore soldering tip or chopper are typically used, there is effective ultrasonic energy using in conducting wire and semiconductor equipment
The soldering appliance of transmission characteristic.
Conventional bonding tool or chopper typically have polished surface.This polished surface includes the tip portion of soldering tip.But
Not enough in the prevalence of easy to wear, short life, surface roughness deficiency and chopper endoporus scuffing bonding wire Wire bonding strength etc.
Disadvantage.Therefore, for wire bonding industry, it is necessary to which Wire bonding strength can be improved, reduce engagement work by developing one kind
The chopper of the help rate of work.
Invention content
Based on this, a kind of raising lead key is provided it is an object of the invention to overcome above-mentioned the deficiencies in the prior art place
Close the chopper of intensity.
To achieve the above object, the technical solution used in the present invention is：A kind of chopper improving Wire bonding strength, institute
It is welding ceramics chopper to state chopper, and the chopper includes ontology, the tip positioned at ontology one end and hole, and the hole is along the ontology
The longitudinal axis and the tip extend, the tip end surface of the tip is made of alternatively distributed protrusion part with sunk part.
The tip end surface structure design of chopper tip of the present invention, formed it is macroscopically coarse, protruding parts peak with it is recessed
Position minimum point forms difference in height, increases abradable region domain, increases service life；On microcosmic, chopper surface smoothness is high, effectively
It reduces tip and stays golden degree, increase service life.
Preferably, the protrusion part and sunk part are uniformly alternately distributed.
Preferably, the peak of the protrusion part and the minimum point of sunk part form difference in height, and the difference in height is 2
~20 μm.
It is highly preferred that the difference in height is 2~10 μm.The roughness for ensureing surface can be within the scope of this difference in height
Guarantee reaches higher weld strength, wear-resistant, anti-residual.
Preferably, the height of the protrusion part is 2~10 μm.It is wear-resistant, compared to the end face of polishing, pressure when welding
In the case of certain, end face can apply the pressure of bigger with butt welding point, lead to weld strength higher.
Preferably, the lateral distance of the adjacent projections intermediate point is 5~10 μm.
Preferably, half waist width of the protrusion part is 2~6 μm.
The wide size of the lateral distance of the adjacent projections intermediate point, half waist for protruding part may further ensure that
The width of protrusion, anti-residual.
Protrusion height is relatively high, the purpose of this design is that it is wear-resistant, even if chopper has used a period of time, wear away
A part of height, however it remains difference in height can reach substantially same effect.Then the wider reason of recess portion is, no
The pollutants such as the residue of residual gold thread are easy, because if if narrow, pollutant enters just to be not easy out later.
Preferably, the roughness Ra of the tip end surface of the tip is 0.5~3 μm.
Preferably, the roughness Ra of the hole inner wall surface is 0.1~0.5 μm.Endoporus roughness ratio is relatively low, prevents from staiing
Miscellaneous residue.
Meanwhile the present invention also provides a kind of preparation method of the chopper of the raising Wire bonding strength, the methods
For：Roughening treatment is carried out to the tip end surface of the tip by the way of laser roughening.
The method specifically includes following steps：
Step 1：First broadsword v.broadsword end face is polished pretreatment；
Step 2：Reach ideal roughness by laser treatment；
Step 3：It is heat-treated.
Compared with the existing technology, beneficial effects of the present invention are：
The design of chopper surface texture of the present invention can make its surface increase wear areas, improve tip end surface
Hardness increases surface roughness, increases service life, and compared with tradition polishing, heat treatment chopper, which has better key
Effect and higher stability are closed, on the one hand stays golden degree since the design effectively reduces tip, is on the other hand because increasing
The degree for having added porcelain mouth wear-resisting improves the service life of porcelain mouth.In addition to this, roughness range of the chopper endoporus in restriction
It is interior, the scuffing to bonding wire in welding process can be effectively reduced, ensures the mechanical strength of bonding wire itself, it helps improves solder joint
Binding force between substrate.
Description of the drawings
Fig. 1 is the chopper end face stereoscan photograph of the present invention for improving Wire bonding strength；
Fig. 2 is the chopper end face 3D laser microscope photos of the present invention for improving Wire bonding strength；
Fig. 3 is the tip end surface structure partial figure of the chopper tip of the present invention for improving Wire bonding strength；
A kind of structure chart of Fig. 4 choppers of the present invention for improving Wire bonding strength；
Fig. 5 is the end face stereoscan photograph after traditional chopper polishing treatment；
Fig. 6 is the end face stereoscan photograph after traditional chopper heat treatment；
Wherein, 1, protrusion part；2, sunk part；41, ontology；42, tip；43, hole.
Specific implementation mode
To better illustrate the object, technical solutions and advantages of the present invention, below in conjunction with the drawings and specific embodiments pair
The present invention is described further.
Embodiment 1
A kind of embodiment of the chopper of the present invention for improving Wire bonding strength, improves wire bonding described in the present embodiment
The end face surface stereoscan photograph of the chopper of intensity as shown in Figure 1, chopper end face 3D laser microscopes photo as shown in Fig. 2,
The tip end surface structure partial figure of chopper tip is as shown in figure 3, a kind of structure chart of chopper is as shown in Figure 4：
The chopper is welding ceramics chopper, and the chopper includes ontology 41, the tip 42 positioned at ontology one end and hole 43,
Hole 43 extends along the longitudinal axis and tip 42 of ontology 41, and the tip end surface of tip 42 is by alternatively distributed protrusion part 1 and recessed portion
Divide 2 compositions；Protrusion part 1 and sunk part 2 are uniformly alternately distributed；Protrude the minimum point of the peak and sunk part 2 of part 1
Difference in height is formed, the difference in height is 2 μm；The roughness Ra of the tip end surface of tip 42 is 0.5 μm；Protrude the height of part 1
It is 2 μm；The lateral distance of 1 intermediate point of adjacent projections is 5 μm；The half waist width for protruding part 1 is 2 μm；43 inner wall surface of hole
Roughness Ra be 0.1 μm.
Embodiment 2
A kind of embodiment of the chopper of the present invention for improving Wire bonding strength, improves wire bonding described in the present embodiment
The end face surface stereoscan photograph of the chopper of intensity as shown in Figure 1, chopper end face 3D laser microscopes photo as shown in Fig. 2,
The tip end surface structure partial figure of chopper tip is as shown in figure 3, a kind of structure chart of chopper is as shown in Figure 4：
The chopper is welding ceramics chopper, and the chopper includes ontology 41, the tip 42 positioned at ontology one end and hole 43,
Hole 43 extends along the longitudinal axis and tip 42 of ontology 41, and the tip end surface of tip 42 is by alternatively distributed protrusion part 1 and recessed portion
Divide 2 compositions；Protrusion part 1 and sunk part 2 are uniformly alternately distributed；Protrude the minimum point of the peak and sunk part 2 of part 1
Difference in height is formed, the difference in height is 20 μm；The roughness Ra of the tip end surface of tip 42 is 3 μm；Protrusion part 1 height be
10μm；The lateral distance of 1 intermediate point of adjacent projections is 10 μm；The half waist width for protruding part 1 is 2~6 μm；43 inner wall table of hole
The roughness Ra in face is 0.5 μm.
Embodiment 3
A kind of embodiment of the chopper of the present invention for improving Wire bonding strength, improves wire bonding described in the present embodiment
The end face surface stereoscan photograph of the chopper of intensity as shown in Figure 1, chopper end face 3D laser microscopes photo as shown in Fig. 2,
The tip end surface structure partial figure of chopper tip is as shown in figure 3, a kind of structure chart of chopper is as shown in Figure 4：
The chopper is welding ceramics chopper, and the chopper includes ontology 41, the tip 42 positioned at ontology one end and hole 43,
Hole 43 extends along the longitudinal axis and tip 42 of ontology 41, and the tip end surface of tip 42 is by alternatively distributed protrusion part 1 and recessed portion
Divide 2 compositions；Protrusion part 1 and sunk part 2 are uniformly alternately distributed；Protrude the minimum point of the peak and sunk part 2 of part 1
Difference in height is formed, the difference in height is 10 μm；The roughness Ra of the tip end surface of tip 42 is 2 μm；Protrusion part 1 height be
6μm；The lateral distance of 1 intermediate point of adjacent projections is 7 μm；The half waist width for protruding part 1 is 4 μm；43 inner wall surface of hole
Roughness Ra is 0.25 μm.
Comparative example 1
A kind of comparative example of the chopper of the present invention for improving Wire bonding strength, the end face end of chopper described in this comparative example
Surface scan electromicroscopic photograph is as shown in Figure 5：
The chopper end face is the end face surface after mechanical polishing, and roughness is：0.1 μm, endoporus roughness is：0.05
μm。
Comparative example 2
A kind of comparative example of the chopper of the present invention for improving Wire bonding strength, the end face of chopper described in this comparative example are swept
It is as shown in Figure 6 to retouch electromicroscopic photograph：
The chopper end face is the end face surface after heat treatment, and surface roughness is：0.3 μm, endoporus roughness is：
0.05μm。
Embodiment 4
By in embodiment 1-3 and comparative example 1-2 chopper carry out ultrasonic bonding test, parallel progress two groups (I, II),
Welding condition is：Power setting is：80mAps, pressure are set as：50g, time are set as 7ms, the bonding wire that this test uses
Line footpath is 0.7mil, and the second solder joint tensile test is carried out under conditions of different welding times, and test method is：Closing on second
The position of solder joint applies pulling force to surface, and the power that bonding wire is torn from weld pad is the pulling force of the second solder joint, and pulling force is bigger, illustrates to weld
The binding force of line and weld pad is bigger, and the welding effect of the second solder joint is better, and the product reliability for welding out is higher, test result
It is shown in Table 1.Using scanning electron microscope to being analyzed the case where chopper end face after using 2,000,000 times：
The second solder joint value of thrust when 1 difference welding times of table
As it can be seen from table 1 the second solder joint value of thrust is reduced with increasing for welding times, in the item of same weld number
Under part, the second solder joint value of thrust that the chopper of Wire bonding strength is improved described in Examples 1 to 3 is more than comparative example 1,2.Illustrate to pass through
Bond strength between bonding wire and substrate can be significantly improved by crossing laser roughening treatment and controlling the obtained chopper of endoporus roughness,
Improve the reliability of welding.Parallel two groups of result is not much different in Examples 1 to 3, due to coarsening-free processing and traditional thick
The chopper that change mode heat treatment process obtains can stain more impurity particle at the tip of welding ceramics chopper, and chopper end face is recessed
Convex form is uneven, to influence its surface topography, causes chopper welding performance unstable.Welding ceramics chopper is using process
In, when line footpath is 0.7mil, the value of thrust requirement of the second solder joint of general IC package is 3g.And welding ceramics of the present invention are split
The coating material of knife and the cementability of welding ceramics chopper are good, after multiple welding, still have higher second solder joint pulling force
Value, after 2,000,000 welding, the value of thrust of welding ceramics chopper of the present invention remains above comparative example 1,2 and minimum standard,
Illustrate that the chopper of present invention raising Wire bonding strength can effectively improve the service life of welding ceramics chopper.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention rather than is protected to the present invention
The limitation of range is protected, although being explained in detail to the present invention with reference to preferred embodiment, those skilled in the art should
Understand, technical scheme of the present invention can be modified or replaced equivalently, without departing from the essence of technical solution of the present invention
And range.
Claims (10)
1. a kind of chopper improving Wire bonding strength, which is characterized in that the chopper is welding ceramics chopper, the chopper packet
Ontology, the tip positioned at ontology one end and hole are included, the hole extends along the longitudinal axis of the ontology and the tip, the tip
Tip end surface is made of alternatively distributed protrusion part and sunk part.
2. improving the chopper of Wire bonding strength as described in claim 1, which is characterized in that the protrusion part and recessed portion
Divide and is uniformly alternately distributed.
3. improving the chopper of Wire bonding strength as claimed in claim 1 or 2, which is characterized in that the protrusion part is most
High point and the minimum point of sunk part form difference in height, and the difference in height is 2~20 μm.
4. improving the chopper of Wire bonding strength as claimed in claim 3, which is characterized in that the difference in height is 2~10 μm.
5. the chopper of the raising Wire bonding strength as described in claim 1,2 or 4, which is characterized in that the protrusion part
Height is 2~10 μm.
6. the chopper of the raising Wire bonding strength as described in claim 1,2 or 4, which is characterized in that the adjacent tabs
It is 5~10 μm to divide the lateral distance of intermediate point.
7. the chopper of the raising Wire bonding strength as described in claim 1,2 or 4, which is characterized in that the protrusion part
Half waist width is 2~6 μm.
8. improving the chopper of Wire bonding strength as described in claim 1, which is characterized in that the tip end surface of the tip
Roughness Ra is 0.5~3 μm.
9. as described in claim 1 improve Wire bonding strength chopper, which is characterized in that the hole inner wall surface it is coarse
It is 0.1~0.5 μm to spend Ra.
10. a kind of preparation method for the chopper improving Wire bonding strength such as claim 1~9 any one of them, feature
It is, roughening treatment is carried out to the tip end surface of the tip by the way of laser roughening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810062208.4A CN108389806B (en) | 2018-01-22 | 2018-01-22 | A kind of chopper improving Wire bonding strength |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810062208.4A CN108389806B (en) | 2018-01-22 | 2018-01-22 | A kind of chopper improving Wire bonding strength |
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| Publication Number | Publication Date |
|---|---|
| CN108389806A true CN108389806A (en) | 2018-08-10 |
| CN108389806B CN108389806B (en) | 2019-04-23 |
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ID=63076315
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810062208.4A Active CN108389806B (en) | 2018-01-22 | 2018-01-22 | A kind of chopper improving Wire bonding strength |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109332901A (en) * | 2018-09-14 | 2019-02-15 | 深圳市商德先进陶瓷股份有限公司 | Ceramic chopper and preparation method thereof and application |
| CN109860067A (en) * | 2019-02-03 | 2019-06-07 | 潮州三环（集团）股份有限公司 | A kind of welding ceramics chopper |
| CN110842339A (en) * | 2019-11-12 | 2020-02-28 | 潮州三环（集团）股份有限公司 | Ceramic riving knife |
| CN111546520A (en) * | 2020-05-13 | 2020-08-18 | 深圳市商德先进陶瓷股份有限公司 | Ceramic cleaver, manufacturing method thereof and semiconductor packaging method |
| CN113927187A (en) * | 2021-11-18 | 2022-01-14 | 深圳市商德先进陶瓷股份有限公司 | Ceramic cleaver and preparation method and application thereof |
| CN114309920A (en) * | 2021-12-23 | 2022-04-12 | 潮州三环（集团）股份有限公司 | Ceramic cleaver and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62190343U (en) * | 1986-05-26 | 1987-12-03 | ||
| US6523732B1 (en) * | 2001-10-10 | 2003-02-25 | Ford Global Technologies, Inc. | Ultrasonic welding apparatus |
| CN103658963A (en) * | 2012-09-26 | 2014-03-26 | Toto株式会社 | Welded chopper |
-
2018
- 2018-01-22 CN CN201810062208.4A patent/CN108389806B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62190343U (en) * | 1986-05-26 | 1987-12-03 | ||
| US6523732B1 (en) * | 2001-10-10 | 2003-02-25 | Ford Global Technologies, Inc. | Ultrasonic welding apparatus |
| CN103658963A (en) * | 2012-09-26 | 2014-03-26 | Toto株式会社 | Welded chopper |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109332901A (en) * | 2018-09-14 | 2019-02-15 | 深圳市商德先进陶瓷股份有限公司 | Ceramic chopper and preparation method thereof and application |
| CN109332901B (en) * | 2018-09-14 | 2021-01-08 | 深圳市商德先进陶瓷股份有限公司 | Ceramic cleaver and manufacturing method and application thereof |
| CN109860067A (en) * | 2019-02-03 | 2019-06-07 | 潮州三环（集团）股份有限公司 | A kind of welding ceramics chopper |
| CN110842339A (en) * | 2019-11-12 | 2020-02-28 | 潮州三环（集团）股份有限公司 | Ceramic riving knife |
| CN110842339B (en) * | 2019-11-12 | 2023-11-07 | 苏州三环科技有限公司 | Ceramic chopper |
| CN111546520A (en) * | 2020-05-13 | 2020-08-18 | 深圳市商德先进陶瓷股份有限公司 | Ceramic cleaver, manufacturing method thereof and semiconductor packaging method |
| CN113927187A (en) * | 2021-11-18 | 2022-01-14 | 深圳市商德先进陶瓷股份有限公司 | Ceramic cleaver and preparation method and application thereof |
| CN113927187B (en) * | 2021-11-18 | 2024-08-20 | 深圳市商德先进陶瓷股份有限公司 | Ceramic chopper and preparation method and application thereof |
| CN114309920A (en) * | 2021-12-23 | 2022-04-12 | 潮州三环（集团）股份有限公司 | Ceramic cleaver and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN108389806B (en) | 2019-04-23 |
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