JPS62190343U - - Google Patents
Info
- Publication number
- JPS62190343U JPS62190343U JP1986079860U JP7986086U JPS62190343U JP S62190343 U JPS62190343 U JP S62190343U JP 1986079860 U JP1986079860 U JP 1986079860U JP 7986086 U JP7986086 U JP 7986086U JP S62190343 U JPS62190343 U JP S62190343U
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- wire bonding
- tip surface
- view
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000011148 porous material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第１図ａは本考案に係るワイヤボンデイング用
キヤピラリーの先端部を示す斜視図、第１図ｂは
同図ａにおけるＡ―Ａ線の拡大断面図である。第
２図ａは本考案に係る他の実施例のキヤピラリー
の先端部を示す斜視図、第２図ｂは同図ａにおけ
るＢ―Ｂ線の拡大断面図である。第３図は従来の
ポリツシユ仕上げのキヤピラリー先端部を示す斜
視図である。第４図ａは従来のマツト仕上げのキ
ヤピラリー先端部を示す斜視図、第４図ｂは同図
ａにおけるＣ―Ｃ線の拡大断面図である。
１，１０，１１，１２……キヤピラリー、１ａ
，１０ａ，１１ａ，１２ａ……細孔、１ｂ，１０
ｂ，１１ｂ，１２ｂ……先端面。
FIG. 1a is a perspective view showing the tip of a capillary for wire bonding according to the present invention, and FIG. 1b is an enlarged sectional view taken along line A--A in FIG. 1a. FIG. 2a is a perspective view showing the tip of a capillary according to another embodiment of the present invention, and FIG. 2b is an enlarged sectional view taken along line BB in FIG. 2a. FIG. 3 is a perspective view showing a conventional polished capillary tip. FIG. 4a is a perspective view showing the tip of a conventional matte-finished capillary, and FIG. 4b is an enlarged sectional view taken along line CC in FIG. 4a. 1, 10, 11, 12... Capillary, 1a
, 10a, 11a, 12a... Pore, 1b, 10
b, 11b, 12b... Tip surface.
Claims (1)
ピラリーの先端面を平面状もしくは曲面状に形成
するとともに、該先端面に丸味をもつた凸凹を形
成したことを特徴とするワイヤボンデイング用キ
ヤピラリー。 1. A capillary for wire bonding, which is used for wire bonding a semiconductor chip, and the capillary has a flat or curved tip surface, and has rounded irregularities formed on the tip surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986079860U JPH0445241Y2 (en) | 1986-05-26 | 1986-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986079860U JPH0445241Y2 (en) | 1986-05-26 | 1986-05-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62190343U true JPS62190343U (en) | 1987-12-03 |
| JPH0445241Y2 JPH0445241Y2 (en) | 1992-10-23 |
Family
ID=30930127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986079860U Expired JPH0445241Y2 (en) | 1986-05-26 | 1986-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0445241Y2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD771168S1 (en) | 2014-10-31 | 2016-11-08 | Coorstek, Inc. | Wire bonding ceramic capillary |
| USD797172S1 (en) | 2015-02-03 | 2017-09-12 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD797171S1 (en) | 2015-02-03 | 2017-09-12 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD797826S1 (en) | 2015-02-03 | 2017-09-19 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| CN108389806A (en) * | 2018-01-22 | 2018-08-10 | 潮州三环（集团）股份有限公司 | A kind of chopper improving Wire bonding strength |
| CN109332901A (en) * | 2018-09-14 | 2019-02-15 | 深圳市商德先进陶瓷股份有限公司 | Ceramic chopper and preparation method thereof and application |
| USD868123S1 (en) | 2016-12-20 | 2019-11-26 | Coorstek, Inc. | Wire bonding wedge tool |
| JP2022114619A (en) * | 2021-01-27 | 2022-08-08 | 三菱電機株式会社 | Wire bonding apparatus and method of manufacturing semiconductor device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014116334A (en) * | 2012-12-06 | 2014-06-26 | Mitsubishi Electric Corp | Wedge bonding tool and wedge bonding method |
-
1986
- 1986-05-26 JP JP1986079860U patent/JPH0445241Y2/ja not_active Expired
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD771168S1 (en) | 2014-10-31 | 2016-11-08 | Coorstek, Inc. | Wire bonding ceramic capillary |
| USD797172S1 (en) | 2015-02-03 | 2017-09-12 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD797171S1 (en) | 2015-02-03 | 2017-09-12 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD797826S1 (en) | 2015-02-03 | 2017-09-19 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD821468S1 (en) | 2015-02-03 | 2018-06-26 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD824970S1 (en) | 2015-02-03 | 2018-08-07 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD824969S1 (en) | 2015-02-03 | 2018-08-07 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD868123S1 (en) | 2016-12-20 | 2019-11-26 | Coorstek, Inc. | Wire bonding wedge tool |
| CN108389806A (en) * | 2018-01-22 | 2018-08-10 | 潮州三环（集团）股份有限公司 | A kind of chopper improving Wire bonding strength |
| CN109332901A (en) * | 2018-09-14 | 2019-02-15 | 深圳市商德先进陶瓷股份有限公司 | Ceramic chopper and preparation method thereof and application |
| CN109332901B (en) * | 2018-09-14 | 2021-01-08 | 深圳市商德先进陶瓷股份有限公司 | Ceramic cleaver and manufacturing method and application thereof |
| JP2022114619A (en) * | 2021-01-27 | 2022-08-08 | 三菱電機株式会社 | Wire bonding apparatus and method of manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0445241Y2 (en) | 1992-10-23 |