USD797171S1 - Ceramic bonding tool with textured tip - Google Patents

Ceramic bonding tool with textured tip Download PDF

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Publication number
USD797171S1
USD797171S1 US29/516,523 US201529516523F USD797171S US D797171 S1 USD797171 S1 US D797171S1 US 201529516523 F US201529516523 F US 201529516523F US D797171 S USD797171 S US D797171S
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United States
Prior art keywords
bonding tool
ceramic bonding
textured tip
textured
tip
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US29/516,523
Inventor
Cesar Alfaro
Russell Bell
Anne Cenedella
Steve Govorchin
Mark S. Greenwell
Brian Seegmiller
Matthew Simpson
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Coorstek Inc
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Coorstek Inc
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Priority to US29/516,523 priority Critical patent/USD797171S1/en
Assigned to COORSTEK, INC. reassignment COORSTEK, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CENEDELLA, ANNE, GOVORCHIN, STEVE, SEEGMILLER, BRIAN, SIMPSON, MATTHEW, ALFARO, CESAR, BELL, RUSSELL, GREENWELL, MARK S.
Application granted granted Critical
Publication of USD797171S1 publication Critical patent/USD797171S1/en
Assigned to WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT reassignment WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: COORSTEK, INC.
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Anticipated expiration legal-status Critical

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Description

FIG. 1 depicts a perspective view of a ceramic bonding tool with textured tip.

FIG. 2 depicts a side elevation view of the ceramic bonding tool with textured tip of FIG. 1.

FIG. 3 depicts a top plan view of the ceramic bonding tool with textured tip of FIG. 1.

FIG. 4 depicts a bottom plan view of the ceramic bonding tool with textured tip of FIG. 1.

FIG. 5 depicts a detailed bottom plan view of the ceramic bonding tool with textured tip shown in FIG. 4; and,

FIG. 6 depicts a detailed side cross-section view of the ceramic bonding tool with textured tip, the cross-section taken along cross-section indicator line 6-6 of FIG. 5.

The broken lines in the drawings illustrate environmental structure on the article and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a ceramic bonding tool with textured tip, as shown and described.
US29/516,523 2015-02-03 2015-02-03 Ceramic bonding tool with textured tip Active USD797171S1 (en)

Priority Applications (1)

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US29/516,523 USD797171S1 (en) 2015-02-03 2015-02-03 Ceramic bonding tool with textured tip

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US29/516,523 USD797171S1 (en) 2015-02-03 2015-02-03 Ceramic bonding tool with textured tip
JPD2016-8038F JP1560541S (en) 2015-02-03 2015-07-29
JPD2015-16867F JP1551108S (en) 2015-02-03 2015-07-29
US29/612,581 USD824970S1 (en) 2015-02-03 2017-08-02 Ceramic bonding tool with textured tip

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US29/612,581 Division USD824970S1 (en) 2015-02-03 2017-08-02 Ceramic bonding tool with textured tip

Publications (1)

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USD797171S1 true USD797171S1 (en) 2017-09-12

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US29/612,581 Active USD824970S1 (en) 2015-02-03 2017-08-02 Ceramic bonding tool with textured tip

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JP (2) JP1560541S (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD821468S1 (en) 2015-02-03 2018-06-26 Coorstek, Inc. Ceramic bonding tool with textured tip
USD824969S1 (en) 2015-02-03 2018-08-07 Coorstek, Inc. Ceramic bonding tool with textured tip
USD824970S1 (en) 2015-02-03 2018-08-07 Coorstek, Inc. Ceramic bonding tool with textured tip
USD855089S1 (en) * 2016-02-29 2019-07-30 Moldman Systems Llc Mixer assembly
USD877219S1 (en) * 2017-04-27 2020-03-03 Hakko Corporation Soldering tip

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD868123S1 (en) 2016-12-20 2019-11-26 Coorstek, Inc. Wire bonding wedge tool

Citations (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2721250A (en) * 1953-01-15 1955-10-18 Milton N Franklin Inert gas welding torch nozzle
US3101634A (en) 1960-09-12 1963-08-27 Gulton Ind Inc Sonic welder
US3453142A (en) * 1966-03-14 1969-07-01 Air Reduction Welding electrode and composition
US3585352A (en) * 1969-11-24 1971-06-15 Stoody Co Arc welding process and electrode for stainless steel
US3690538A (en) 1970-02-25 1972-09-12 Gaiser Tool Co Bonding tool
US3698646A (en) * 1971-01-08 1972-10-17 Pfizer Composite carbon insert for gas shielded welding torch nozzle
US4030657A (en) 1972-12-26 1977-06-21 Rca Corporation Wire lead bonding tool
USD255318S (en) 1977-11-22 1980-06-10 Ultrasonic welding head for polypropylene strapping
US4343983A (en) * 1979-09-20 1982-08-10 Westinghouse Electric Corp. Non-consumable composite welding electrode
USD269521S (en) * 1980-12-02 1983-06-28 Aga Aktiebolag Nozzle component for a cutting torch
US4405074A (en) * 1981-08-31 1983-09-20 Kulicke And Soffa Industries Inc. Composite bonding tool and method of making same
US4411411A (en) * 1983-02-22 1983-10-25 Barthelmess Casey E Cutting torch guide attachment
US4415115A (en) * 1981-06-08 1983-11-15 Motorola, Inc. Bonding means and method
USD271741S (en) 1981-02-02 1983-12-13 Eldon Industries, Inc. Soldering iron tip
US4600138A (en) 1984-07-25 1986-07-15 Hughes Aircraft Company Bonding tool and clamp assembly and wire handling method
JPS62190343U (en) 1986-05-26 1987-12-03
JPS6380845U (en) 1986-11-14 1988-05-27
US5217154A (en) 1989-06-13 1993-06-08 Small Precision Tools, Inc. Semiconductor bonding tool
US5248076A (en) 1989-08-22 1993-09-28 Cooper Industries, Inc. Soldering tool
US5445306A (en) 1994-05-31 1995-08-29 Motorola, Inc. Wedge wire bonding tool tip
US5485949A (en) 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
US5683603A (en) 1995-04-19 1997-11-04 Fortune; William S. Electric soldering iron tip improvements
US5954260A (en) 1996-12-17 1999-09-21 Texas Instruments Incorporated Fine pitch bonding technique
JPH11354569A (en) 1998-06-05 1999-12-24 Hitachi Ltd Method and device for bonding wire and manufacture of semiconductor device
US6041995A (en) 1997-03-06 2000-03-28 Kabushiki Kaisha Shinkawa Wire bonding method
US6068174A (en) 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
US6158647A (en) 1998-09-29 2000-12-12 Micron Technology, Inc. Concave face wire bond capillary
US6247631B1 (en) * 1999-01-18 2001-06-19 Hakko Corporation Electric soldering iron
USD444175S1 (en) 2000-05-23 2001-06-26 Pentel Kabushiki Kaisha Correction pen
US6260753B1 (en) 1998-08-07 2001-07-17 Stmicroelectronics S.R.L. Gold bumps bonding on connection pads and subsequent coining of their vertex
US6352197B1 (en) 1999-01-29 2002-03-05 Rohm Co., Ltd. Method and apparatus for wire-bonding for electric components
US6457627B1 (en) * 2000-03-09 2002-10-01 Oki Electric Industry Co., Ltd. Bonding capillary and semiconductor device
US6511389B2 (en) * 1999-09-16 2003-01-28 Callaway Golf Company Golf ball with an aerodynamic surface on a thermoset cover
JP2003068784A (en) 2001-08-28 2003-03-07 Kyocera Corp Capillary for wire bonding
US6564989B2 (en) 2000-08-22 2003-05-20 Mitsubishi Denki Kabushiki Kaisha Wire bonding method and wire bonding apparatus
US6646228B2 (en) 1999-08-18 2003-11-11 Hyperion Innovations, Inc. Cordless soldering iron
JP2004087822A (en) 2002-08-27 2004-03-18 Mitsubishi Materials Corp Wedge tool
US6715658B2 (en) * 2001-07-17 2004-04-06 Kulicke & Soffa Investments, Inc. Ultra fine pitch capillary
US6729527B2 (en) 2001-01-30 2004-05-04 Kulicke & Soffa Investments, Inc. Bonding tool with polymer coating
US20040109980A1 (en) * 2002-12-10 2004-06-10 Chen Sam H. Grip tape with self-textured surface
US6910612B2 (en) * 2001-07-17 2005-06-28 Kulicke & Soffa Investments, Inc. Capillary with contained inner chamfer
USD517384S1 (en) 2004-01-22 2006-03-21 Pentel Kabushiki Kaisha Wire solder applicator
US7051915B2 (en) 2002-08-29 2006-05-30 Rohm Co., Ltd. Capillary for wire bonding and method of wire bonding using it
US7216794B2 (en) 2005-06-09 2007-05-15 Texas Instruments Incorporated Bond capillary design for ribbon wire bonding
US7247588B2 (en) 2002-11-22 2007-07-24 Saint-Gobain Ceramics & Plastics, Inc. Zirconia toughened alumina ESD safe ceramic composition, component, and methods for making same
US7249702B2 (en) 2003-12-04 2007-07-31 Kulicke And Soffa Industries, Inc. Multi-part capillary
USD549255S1 (en) 2004-11-08 2007-08-21 Dragos Axinte Soldering iron tip
US7261230B2 (en) * 2003-08-29 2007-08-28 Freescale Semiconductor, Inc. Wirebonding insulated wire and capillary therefor
US7320425B2 (en) * 2004-05-12 2008-01-22 Kulicke And Soffa Industries, Inc. Low-profile capillary for wire bonding
US7407080B2 (en) 2004-04-02 2008-08-05 Chippac, Inc. Wire bond capillary tip
JP2009147103A (en) 2007-12-14 2009-07-02 Renesas Technology Corp Semiconductor device and manufacturing method of same
USD598721S1 (en) 2008-04-24 2009-08-25 Luis Meza Motorcycle maintenance tool
JP2009283814A (en) 2008-05-26 2009-12-03 Toshiba Lighting & Technology Corp Capillary for wire bonding and electronic component assembling apparatus
US7918378B1 (en) 2010-08-06 2011-04-05 National Semiconductor Corporation Wire bonding deflector for a wire bonder
US8056794B2 (en) 2006-10-09 2011-11-15 Kulicke And Soffa Industries, Inc. Combination wedge bonding and ball bonding transducer
US20120045614A1 (en) * 2010-08-19 2012-02-23 Hon Hai Precision Industry Co., Ltd. Coating, article coated with coating, and method for manufacturing article
USD667857S1 (en) 2009-06-04 2012-09-25 Smk Co., Ltd. Electrode tip for resistive welders
US8292160B2 (en) 2009-02-23 2012-10-23 Shinkawa Ltd. Method of manufacturing semiconductor device, and bonding apparatus
JP2013135008A (en) 2011-12-26 2013-07-08 Fuji Electric Co Ltd Wedge tool for wire bonding, bonding device, wire bonding method, and method of manufacturing semiconductor device
US20130341874A1 (en) * 2012-06-26 2013-12-26 Garlock Sealing Technologies Llc Gasket Material, Gaskets, and Related Methods
USD697956S1 (en) 2013-01-24 2014-01-21 Tesa Tape Inc. Ultrasonic welding sheath
TW201412448A (en) 2012-09-26 2014-04-01 Toto Ltd Soldering iron tip
TW201429600A (en) 2013-01-25 2014-08-01 Toto Ltd Solder pin
TW201429601A (en) 2013-01-25 2014-08-01 Toto Ltd Bonding capillary
JP2014222729A (en) 2013-05-14 2014-11-27 住友電気工業株式会社 Method and apparatus for manufacturing semiconductor device
USD720785S1 (en) 2013-10-30 2015-01-06 Sei Optifrontier Co., Ltd. Electrode bar for optical fiber fusion splicer
USD735787S1 (en) * 2014-09-22 2015-08-04 Victor Equipment Company Tapered nozzle
USD741127S1 (en) 2013-11-14 2015-10-20 Robert Bosch Gmbh Glue applicator
USD744560S1 (en) * 2014-09-22 2015-12-01 Victor Equipment Company Tapered contact tip
USD753739S1 (en) * 2015-04-17 2016-04-12 Coorstek, Inc. Wire bonding wedge tool
US9455544B2 (en) * 2010-08-10 2016-09-27 Kulicke And Soffa Industries, Inc. Wire loops, methods of forming wire loops, and related processes

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1439262B2 (en) 1963-07-23 1972-03-30 Method of contacting of semiconductor devices by thermocompression
US5816472A (en) 1994-01-28 1998-10-06 Hewlett-Packard Company Bonding tool for tape automated assembly
US6651864B2 (en) * 1999-02-25 2003-11-25 Steven Frederick Reiber Dissipative ceramic bonding tool tip
WO2006116288A2 (en) 2005-04-22 2006-11-02 Regents Of The University Of Michigan Rotatable multi-pin apparatus, and process for friction driven stitch welding and structural modification of materials
JP5734236B2 (en) 2011-05-17 2015-06-17 株式会社新川 Wire bonding apparatus and bonding method
USD797826S1 (en) 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797171S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797172S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip

Patent Citations (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2721250A (en) * 1953-01-15 1955-10-18 Milton N Franklin Inert gas welding torch nozzle
US3101634A (en) 1960-09-12 1963-08-27 Gulton Ind Inc Sonic welder
US3453142A (en) * 1966-03-14 1969-07-01 Air Reduction Welding electrode and composition
US3585352A (en) * 1969-11-24 1971-06-15 Stoody Co Arc welding process and electrode for stainless steel
US3690538A (en) 1970-02-25 1972-09-12 Gaiser Tool Co Bonding tool
US3698646A (en) * 1971-01-08 1972-10-17 Pfizer Composite carbon insert for gas shielded welding torch nozzle
US4030657A (en) 1972-12-26 1977-06-21 Rca Corporation Wire lead bonding tool
USD255318S (en) 1977-11-22 1980-06-10 Ultrasonic welding head for polypropylene strapping
US4343983A (en) * 1979-09-20 1982-08-10 Westinghouse Electric Corp. Non-consumable composite welding electrode
USD269521S (en) * 1980-12-02 1983-06-28 Aga Aktiebolag Nozzle component for a cutting torch
USD271741S (en) 1981-02-02 1983-12-13 Eldon Industries, Inc. Soldering iron tip
US4415115A (en) * 1981-06-08 1983-11-15 Motorola, Inc. Bonding means and method
US4405074A (en) * 1981-08-31 1983-09-20 Kulicke And Soffa Industries Inc. Composite bonding tool and method of making same
US4411411A (en) * 1983-02-22 1983-10-25 Barthelmess Casey E Cutting torch guide attachment
US4600138A (en) 1984-07-25 1986-07-15 Hughes Aircraft Company Bonding tool and clamp assembly and wire handling method
USD297704S (en) 1985-03-11 1988-09-20 Miniature welding torch with disposable tip
JPS62190343U (en) 1986-05-26 1987-12-03
JPS6380845U (en) 1986-11-14 1988-05-27
USD305720S (en) 1987-02-09 1990-01-30 Olgesby & Butler Plc Soldering iron with removable cap
US5217154A (en) 1989-06-13 1993-06-08 Small Precision Tools, Inc. Semiconductor bonding tool
US5248076A (en) 1989-08-22 1993-09-28 Cooper Industries, Inc. Soldering tool
US5485949A (en) 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
US5445306A (en) 1994-05-31 1995-08-29 Motorola, Inc. Wedge wire bonding tool tip
US5683603A (en) 1995-04-19 1997-11-04 Fortune; William S. Electric soldering iron tip improvements
US6068174A (en) 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
US5954260A (en) 1996-12-17 1999-09-21 Texas Instruments Incorporated Fine pitch bonding technique
US6041995A (en) 1997-03-06 2000-03-28 Kabushiki Kaisha Shinkawa Wire bonding method
USD431434S (en) 1998-01-08 2000-10-03 Hakko Corporation Soldering iron tip
JPH11354569A (en) 1998-06-05 1999-12-24 Hitachi Ltd Method and device for bonding wire and manufacture of semiconductor device
US6260753B1 (en) 1998-08-07 2001-07-17 Stmicroelectronics S.R.L. Gold bumps bonding on connection pads and subsequent coining of their vertex
US6158647A (en) 1998-09-29 2000-12-12 Micron Technology, Inc. Concave face wire bond capillary
US6247631B1 (en) * 1999-01-18 2001-06-19 Hakko Corporation Electric soldering iron
US6352197B1 (en) 1999-01-29 2002-03-05 Rohm Co., Ltd. Method and apparatus for wire-bonding for electric components
US6646228B2 (en) 1999-08-18 2003-11-11 Hyperion Innovations, Inc. Cordless soldering iron
US6511389B2 (en) * 1999-09-16 2003-01-28 Callaway Golf Company Golf ball with an aerodynamic surface on a thermoset cover
US6457627B1 (en) * 2000-03-09 2002-10-01 Oki Electric Industry Co., Ltd. Bonding capillary and semiconductor device
USD444175S1 (en) 2000-05-23 2001-06-26 Pentel Kabushiki Kaisha Correction pen
US6564989B2 (en) 2000-08-22 2003-05-20 Mitsubishi Denki Kabushiki Kaisha Wire bonding method and wire bonding apparatus
US6729527B2 (en) 2001-01-30 2004-05-04 Kulicke & Soffa Investments, Inc. Bonding tool with polymer coating
US6910612B2 (en) * 2001-07-17 2005-06-28 Kulicke & Soffa Investments, Inc. Capillary with contained inner chamfer
US6715658B2 (en) * 2001-07-17 2004-04-06 Kulicke & Soffa Investments, Inc. Ultra fine pitch capillary
JP2003068784A (en) 2001-08-28 2003-03-07 Kyocera Corp Capillary for wire bonding
JP2004087822A (en) 2002-08-27 2004-03-18 Mitsubishi Materials Corp Wedge tool
US7051915B2 (en) 2002-08-29 2006-05-30 Rohm Co., Ltd. Capillary for wire bonding and method of wire bonding using it
US7247588B2 (en) 2002-11-22 2007-07-24 Saint-Gobain Ceramics & Plastics, Inc. Zirconia toughened alumina ESD safe ceramic composition, component, and methods for making same
US20040109980A1 (en) * 2002-12-10 2004-06-10 Chen Sam H. Grip tape with self-textured surface
US7261230B2 (en) * 2003-08-29 2007-08-28 Freescale Semiconductor, Inc. Wirebonding insulated wire and capillary therefor
US7249702B2 (en) 2003-12-04 2007-07-31 Kulicke And Soffa Industries, Inc. Multi-part capillary
US7500590B2 (en) * 2003-12-04 2009-03-10 Kulicke And Soffa Industries, Inc. Multi-part capillary
USD517384S1 (en) 2004-01-22 2006-03-21 Pentel Kabushiki Kaisha Wire solder applicator
US7407080B2 (en) 2004-04-02 2008-08-05 Chippac, Inc. Wire bond capillary tip
US7320425B2 (en) * 2004-05-12 2008-01-22 Kulicke And Soffa Industries, Inc. Low-profile capillary for wire bonding
USD549255S1 (en) 2004-11-08 2007-08-21 Dragos Axinte Soldering iron tip
US7216794B2 (en) 2005-06-09 2007-05-15 Texas Instruments Incorporated Bond capillary design for ribbon wire bonding
US8056794B2 (en) 2006-10-09 2011-11-15 Kulicke And Soffa Industries, Inc. Combination wedge bonding and ball bonding transducer
JP2009147103A (en) 2007-12-14 2009-07-02 Renesas Technology Corp Semiconductor device and manufacturing method of same
USD598721S1 (en) 2008-04-24 2009-08-25 Luis Meza Motorcycle maintenance tool
JP2009283814A (en) 2008-05-26 2009-12-03 Toshiba Lighting & Technology Corp Capillary for wire bonding and electronic component assembling apparatus
US8292160B2 (en) 2009-02-23 2012-10-23 Shinkawa Ltd. Method of manufacturing semiconductor device, and bonding apparatus
USD667857S1 (en) 2009-06-04 2012-09-25 Smk Co., Ltd. Electrode tip for resistive welders
US7918378B1 (en) 2010-08-06 2011-04-05 National Semiconductor Corporation Wire bonding deflector for a wire bonder
US9455544B2 (en) * 2010-08-10 2016-09-27 Kulicke And Soffa Industries, Inc. Wire loops, methods of forming wire loops, and related processes
US20120045614A1 (en) * 2010-08-19 2012-02-23 Hon Hai Precision Industry Co., Ltd. Coating, article coated with coating, and method for manufacturing article
JP2013135008A (en) 2011-12-26 2013-07-08 Fuji Electric Co Ltd Wedge tool for wire bonding, bonding device, wire bonding method, and method of manufacturing semiconductor device
US20130341874A1 (en) * 2012-06-26 2013-12-26 Garlock Sealing Technologies Llc Gasket Material, Gaskets, and Related Methods
JP2014082450A (en) 2012-09-26 2014-05-08 Toto Ltd Bonding capillary
TW201412448A (en) 2012-09-26 2014-04-01 Toto Ltd Soldering iron tip
USD697956S1 (en) 2013-01-24 2014-01-21 Tesa Tape Inc. Ultrasonic welding sheath
TW201429600A (en) 2013-01-25 2014-08-01 Toto Ltd Solder pin
TW201429601A (en) 2013-01-25 2014-08-01 Toto Ltd Bonding capillary
JP2014222729A (en) 2013-05-14 2014-11-27 住友電気工業株式会社 Method and apparatus for manufacturing semiconductor device
USD720785S1 (en) 2013-10-30 2015-01-06 Sei Optifrontier Co., Ltd. Electrode bar for optical fiber fusion splicer
USD741127S1 (en) 2013-11-14 2015-10-20 Robert Bosch Gmbh Glue applicator
USD735787S1 (en) * 2014-09-22 2015-08-04 Victor Equipment Company Tapered nozzle
USD744560S1 (en) * 2014-09-22 2015-12-01 Victor Equipment Company Tapered contact tip
USD753739S1 (en) * 2015-04-17 2016-04-12 Coorstek, Inc. Wire bonding wedge tool

Non-Patent Citations (23)

* Cited by examiner, † Cited by third party
Title
Decision of Grant issued on Jan. 26, 2016 in Japanese Design Application No. 2015-21935 with a listing of references considered.
Decision to Grant date Apr. 19, 2016 issued in Japanese Patent Application No. 2015-016867.
Decision to Grant date Apr. 19, 2016 issued in Japanese Patent Application No. 2015-016912.
Decision to Grant date Apr. 19, 2016 issued in Japanese Patent Application No. 2015-017097.
Decision to Grant dated Apr. 19, 2016 issued in Japanese Patent Application No. 2016-008039.
Decision to Grant dated Aug. 23, 2016 issued in Japanese Patent Application No. 2016-008037.
Decision to Grant dated Aug. 23, 2016 issued in Japanese Patent Application No. 2016-008038.
Gaiser Precision Bonding Tools "Capillary Wire Bonding", pp. 5-27, located at http://www.coorstek.com/markets/semiconductors-equipment/bonding-tools/capillaries.php, catalog published 2006.
Gaiser Precision Bonding Tools "Fine-Ptich Capillaries", pp. 41-59, located at http://www.coorstek.com/markets/semiconductors-equipment/bonding-tools/capillaries.php, catalog published 2006.
Gaiser Precision Bonding Tools "Thermosonic Capillaries", pp. 28-40, located at http://www.coorstek.com/markets/semiconductors-equipment/bonding-tools/capillaries.php, catalog published 2006.
Gaiser Precision Bonding Tools "Thermosonic Capillaries", pp. 28-40, located at http://www.coorstek.com/markets/semiconductors-equipment/bondingtools/cappillaries.php, catalog published 2006. NPL p. 36. *
Gaiser Tool Company "Single Point T.A.B.", p. 109, catalog vol. 11, published 2000.
Information about Related Patents and Patent Applications, see section 6 of the accompanying Information Disclosure Statement Letter, which concerns Related Patents and Patent Applications.
JPS62190343 Japanese Laid-Open Utility Model Publication No. S62-190343, Dec. 3, 1987, NPL. *
Office Action dated Oct. 6, 2015, issued in Japanese Design Application No. 2015-9731.
Search Report dated May 13, 2016 issued in Taiwan Application No. 104305492.
Search Report issued in Taiwan Design Patent Application No. 105302375, dated Jul. 12, 2016.
Search Report issued in Taiwan Design Patent Application No. 105302376, dated Jul. 12, 2016.
Search Report issued in Taiwan Design Patent Application No. 105302377, dated Jul. 12, 2016.
Search Report issued on Dec. 7, 2015 in Taiwanese Design Patent Application No. 104302295 (English Translation provided).
Search Report issued on Mar. 15, 2016 in Taiwanese Design Patent Application No. 104304080 (English translation).
Search Report issued on Mar. 15, 2016 in Taiwanese Design Patent Application No. 104304081 (English translation).
Search Report issued on Mar. 15, 2016 in Taiwanese Design Patent Application No. 104304143 (English translation).

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD821468S1 (en) 2015-02-03 2018-06-26 Coorstek, Inc. Ceramic bonding tool with textured tip
USD824969S1 (en) 2015-02-03 2018-08-07 Coorstek, Inc. Ceramic bonding tool with textured tip
USD824970S1 (en) 2015-02-03 2018-08-07 Coorstek, Inc. Ceramic bonding tool with textured tip
USD855089S1 (en) * 2016-02-29 2019-07-30 Moldman Systems Llc Mixer assembly
USD877219S1 (en) * 2017-04-27 2020-03-03 Hakko Corporation Soldering tip

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USD824970S1 (en) 2018-08-07
JP1551108S (en) 2016-06-06

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