CN115781424B - Method, system, equipment and medium for grinding outer radius of ceramic riving knife - Google Patents
Method, system, equipment and medium for grinding outer radius of ceramic riving knife Download PDFInfo
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- CN115781424B CN115781424B CN202211461556.1A CN202211461556A CN115781424B CN 115781424 B CN115781424 B CN 115781424B CN 202211461556 A CN202211461556 A CN 202211461556A CN 115781424 B CN115781424 B CN 115781424B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
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Abstract
The invention discloses a method, a system, equipment and a medium for grinding the outer radius of a ceramic chopper, wherein the method comprises the following steps: the ceramic riving knife to be ground is arranged on a clamp head of the grinding equipment; adjusting the tip end point of the ceramic chopper to be ground to a swing fulcrum by adjusting a clamp chuck of the grinding equipment; establishing a rectangular coordinate system according to the swing fulcrum, and swinging the center of the outer radius of the ceramic riving knife to be ground to the longitudinal axis of the rectangular coordinate system; calculating according to specification indexes of the ceramic cleaver to be ground to obtain grinding time; and grinding the ceramic cleaver to be ground through grinding equipment according to the negative direction of the grinding time along the longitudinal axis of the rectangular coordinate system, and determining the outer radius of the ceramic cleaver to be ground after grinding. The embodiment of the invention can effectively improve the production efficiency of grinding the outer radius of the ceramic chopper, is beneficial to obtaining a more accurate grinding product with the outer radius of the ceramic chopper, and can be widely applied to the technical field of semiconductor packaging.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a method, a system, equipment and a medium for grinding the outer radius of a ceramic chopper.
Background
The ceramic chopper is a necessary consumable in the field of semiconductor packaging, and is mainly used for wire bonding welding of gold wires, silver wires and alloy wires in IC packaging. At present, the outer radius grinding processing mode of the riving knife is to contact the tip of the riving knife with a grinding sheet, and the grinding tool and the riving knife are driven by a motor to relatively rotate for grinding. The grinding mode only depends on the relative rotation grinding of the grinding tool and the riving knife, along with the grinding removal amount at the outer radius of the riving knife, the grinding angle and the grinding tool feeding amount are required to be adjusted manually and continuously according to the change of the outer radius, the grinding precision is difficult to control, and the grinding size is required to be controlled by the grinding time. Because the grinding parameters and the test grinding time are required to be adjusted manually continuously for grinding the outer radius of the ceramic chopper in the related technology, the production efficiency is limited, the production cost is increased, and the product precision is poor. In view of the foregoing, there is a need for solving the technical problems in the related art.
Disclosure of Invention
In view of the above, the embodiments of the present invention provide a method, a system, an apparatus, and a medium for polishing an outer radius of a ceramic chopper, so as to improve production efficiency and product precision.
In one aspect, the invention provides a method for grinding an outer radius of a ceramic chopper, comprising the following steps:
the method comprises the steps that a ceramic riving knife to be ground is mounted on a clamp head of grinding equipment, the grinding equipment comprises a rotating device and a swinging device, the rotating device is used for rotating the ceramic riving knife to be ground around a rotating shaft, and the swinging device is used for swinging the ceramic riving knife to be ground around a swinging fulcrum;
adjusting the tip end point of the ceramic riving knife to be ground to the swing fulcrum by adjusting the clamp chuck of the grinding equipment;
establishing a rectangular coordinate system according to the swing fulcrum, and swinging the center of the outer radius of the ceramic riving knife to be ground to the longitudinal axis of the rectangular coordinate system;
calculating according to the specification index of the ceramic riving knife to be ground to obtain grinding time;
and grinding the ceramic cleaver to be ground through the grinding equipment according to the grinding time along the negative direction of the longitudinal axis of the rectangular coordinate system, and determining the outer radius of the ceramic cleaver to be ground after grinding.
Optionally, the calculating to obtain the grinding time according to the specification index of the ceramic cleaver to be ground includes:
acquiring a sample ceramic chopper, grinding the sample ceramic chopper according to preset time, and determining specification indexes of a ground sample;
calculating to obtain the grinding volume of the sample according to the specification index of the grinding sample by a fixed integral calculation formula;
calculating according to the sample grinding volume and the preset time to obtain a grinding rate;
calculating according to the specification index of the ceramic riving knife to be ground through the fixed integral calculation formula to obtain the volume to be ground;
and calculating according to the grinding rate and the volume to be ground to obtain grinding time.
Optionally, the polishing treatment of the ceramic cleaver to be polished by the polishing device along the negative direction of the longitudinal axis of the rectangular coordinate system according to the polishing time includes:
the grinding apparatus further comprises a grinding wheel;
coating grinding paste on the grinding wheel, and contacting with the tip end point of the ceramic riving knife to be ground along the negative direction of the longitudinal axis of the rectangular coordinate system;
starting the grinding equipment according to the grinding time, and grinding the outer radius of the ceramic riving knife to be ground through the grinding wheel;
the ceramic riving knife to be ground is rotated through the rotating device, and the rotating shaft is the central axis of the ceramic riving knife to be ground;
and carrying out swinging treatment on the ceramic riving knife to be ground through the swinging device.
Optionally, the applying the polishing paste to the polishing wheel makes contact with a tip end point of the ceramic cleaver to be polished along a negative direction of a longitudinal axis of the rectangular coordinate system, including:
the grinding device further comprises a pressure display module;
the grinding paste is prepared from diamond and an oily solvent according to the proportion of 1:1, wherein the oily solvent is rapeseed oil solvent;
and contacting with the tip end point of the ceramic riving knife to be ground along the negative direction of the longitudinal axis of the rectangular coordinate system until the pressure displayed by the pressure display module is 8-12g.
Optionally, the grinding the outer radius of the ceramic riving knife to be ground through the grinding wheel comprises:
starting the grinding wheel, grinding the outer radius of the ceramic riving knife to be ground through the grinding wheel, wherein the rotating speed of the grinding wheel is 100-150r/min.
Optionally, the rotating the ceramic riving knife to be ground by the rotating device includes:
and carrying out rotation treatment on the ceramic riving knife to be ground through the rotation device, wherein the rotation speed of the rotation device is 1200-1500r/min.
Optionally, the swinging treatment of the ceramic riving knife to be ground by the swinging device includes:
and carrying out swinging treatment on the ceramic riving knife to be ground through the swinging device, wherein the swinging angular speed of the swinging device is 0.8-1.2rad/s.
In another aspect, an embodiment of the present invention further provides a system, including:
the grinding device comprises a rotating device and a swinging device, wherein the rotating device is used for rotating the ceramic riving knife to be ground around a rotating shaft, and the swinging device is used for swinging the ceramic riving knife to be ground around a swinging fulcrum;
the second module is used for adjusting the tip end point of the ceramic chopper to be ground to the swing fulcrum by adjusting the clamp chuck of the grinding equipment;
the third module is used for establishing a rectangular coordinate system according to the swing fulcrum and swinging the circle center of the outer radius of the ceramic riving knife to be ground to the longitudinal axis of the rectangular coordinate system;
a fourth module, configured to calculate a grinding time according to the specification index of the ceramic cleaver to be ground;
and the fifth module is used for carrying out grinding treatment on the ceramic riving knife to be ground through the grinding equipment according to the grinding time along the negative direction of the longitudinal axis of the rectangular coordinate system, and determining the outer radius of the ceramic riving knife to be ground after grinding.
On the other hand, the embodiment of the invention also discloses electronic equipment, which comprises a processor and a memory;
the memory is used for storing programs;
the processor executes the program to implement the method as described above.
In another aspect, embodiments of the present invention also disclose a computer readable storage medium storing a program for execution by a processor to implement a method as described above.
In another aspect, embodiments of the present invention also disclose a computer program product or computer program comprising computer instructions stored in a computer readable storage medium. The computer instructions may be read from a computer-readable storage medium by a processor of a computer device, and executed by the processor, to cause the computer device to perform the foregoing method.
Compared with the prior art, the technical scheme provided by the invention has the following technical effects: according to the embodiment of the invention, the ceramic riving knife to be ground is mounted on the clamp head of the grinding equipment, the grinding equipment comprises a rotating device and a swinging device, the rotating device is used for rotating the ceramic riving knife to be ground around a rotating shaft, and the swinging device is used for swinging the ceramic riving knife to be ground around a swinging fulcrum; adjusting the tip end point of the ceramic riving knife to be ground to the swing fulcrum by adjusting the clamp chuck of the grinding equipment; establishing a rectangular coordinate system according to the swing fulcrum, and swinging the center of the outer radius of the ceramic riving knife to be ground to the longitudinal axis of the rectangular coordinate system; calculating according to the specification index of the ceramic riving knife to be ground to obtain grinding time; and grinding the ceramic cleaver to be ground through the grinding equipment according to the grinding time along the negative direction of the longitudinal axis of the rectangular coordinate system, and determining the outer radius of the ceramic cleaver to be ground after grinding. The method can effectively improve the production efficiency of grinding the outer radius of the ceramic chopper, and is beneficial to obtaining a more accurate grinding product of the outer radius of the ceramic chopper.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for grinding an outer radius of a ceramic cleaver according to an embodiment of the present application;
FIG. 2 is a schematic view of placement of a ceramic cleaver according to an embodiment of the present application;
FIG. 3 is a schematic diagram illustrating a process of swinging a ceramic riving knife to a swing fulcrum according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of a ceramic riving knife swinging to a swinging fulcrum according to an embodiment of the present application;
FIG. 5 is a schematic view of a ceramic riving knife according to an embodiment of the present application feeding in the positive Y-axis direction;
FIG. 6 is a schematic diagram of a ceramic cleaver calculating a polishing time according to an embodiment of the present disclosure;
FIG. 7 is a schematic view of a ceramic cleaver provided in an embodiment of the present application for polishing an outer radius;
FIG. 8 is a left limit diagram of an outer radius grinding swing angle of a ceramic cleaver according to an embodiment of the present disclosure;
FIG. 9 is a right limit diagram of an outer radius grinding swing angle of a ceramic cleaver according to an embodiment of the present application;
FIG. 10 is a schematic diagram of an outer radius grinding swing process of a ceramic cleaver according to an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
First, several nouns referred to in this application are parsed:
the ceramic chopper (Ceramicbonding tool), also called ceramic nozzle, is an axisymmetric ceramic tool with vertical holes, and belongs to a precise microstructure ceramic component. The ceramic chopper is used as a wire bonding tool in the wire bonding process, and can be used for bonding packaging of circuits such as silicon controlled rectifier, surface acoustic wave, LED, diode, triode, IC chip and the like.
In the related art, the outer radius of the riving knife is generally ground by contacting the tip of the riving knife with a grinding sheet and relatively rotating the grinding tool and the riving knife under the drive of a motor. The grinding mode only depends on the relative rotation grinding of the grinding tool and the riving knife, and along with the grinding removal amount at the outer radius of the riving knife, the grinding angle and the grinding tool feeding amount are required to be adjusted manually and continuously according to the change of the outer radius, so that the grinding precision is difficult to control.
In view of this, the embodiment of the invention provides a method for polishing an outer radius of a ceramic chopper, which can be applied to a terminal, a server, software running in the terminal or the server, and the like. The terminal may be, but is not limited to, a servo control cabinet, a machine tool controller, etc. The server may be an independent physical server, or may be a server cluster or a distributed system formed by a plurality of physical servers. The grinding method in the embodiment of the application can be applied to the technical field of automation, can reduce labor cost and improves product precision.
Referring to fig. 1, an embodiment of the present invention provides a method for polishing an outer radius of a ceramic chopper, including:
s101, mounting a ceramic riving knife to be ground on a clamp head of grinding equipment, wherein the grinding equipment comprises a rotating device and a swinging device, the rotating device is used for rotating the ceramic riving knife to be ground around a rotating shaft, and the swinging device is used for swinging the ceramic riving knife to be ground around a swinging fulcrum;
s102, adjusting the tip end point of the ceramic chopper to be ground to the swing fulcrum by adjusting a clamp chuck of the grinding equipment;
s103, establishing a rectangular coordinate system according to the swing fulcrum, and swinging the circle center of the outer radius of the ceramic riving knife to be ground to the longitudinal axis of the rectangular coordinate system;
s104, calculating to obtain grinding time according to the specification index of the ceramic cleaver to be ground;
and S105, grinding the ceramic cleaver to be ground through the grinding equipment according to the grinding time along the negative direction of the longitudinal axis of the rectangular coordinate system, and determining the outer radius of the ceramic cleaver to be ground after grinding.
Referring to fig. 2, in an embodiment of the present invention, a ceramic riving knife to be ground is mounted to a clamp jaw of a grinding apparatus, thereby fixing the riving knife. The grinding equipment provided by the embodiment of the invention comprises the rotating device and the swinging device, wherein the rotating device can rotate the riving knife, and the swinging device can swing the riving knife. In a possible embodiment, the grinding device may further comprise a camera unit and a two-dimensional adjustment table, the two-dimensional adjustment table being located above the first swinging means, the first rotating means being located above the two-dimensional adjustment table. And observing the position of the chopper through the camera unit, and adjusting the point B of the tip end point of the chopper to the point 0 of the swing fulcrum through the two-dimensional adjusting table.
Referring to fig. 3, in the embodiment of the present invention, a rectangular coordinate system is established according to the point O of the swing fulcrum, at this time, the central axis of the riving knife is parallel to the Y line, the point B of the tip end of the riving knife is located at the point O of the center O of the swing fulcrum, and the center of the outer radius OR is not located on the Y line, so that the swingable and rotatable device is required to swing counterclockwise by a certain angle, so that the center of the outer radius OR is located in the direction of the Y feeding amount; because the center of the outer radius OR must pass through the angular bisector of the end face angle FA and the taper angle TA, the swing angle is the angle between the angular bisector of the end face angle FA and the taper angle TA and the central axis of the riving knife, and the center of the outer radius OR of the riving knife after swing is in the Y direction, referring to fig. 4, the swing angle can be calculated by the following formula:
wherein FA is the end face angle of the ceramic riving knife to be ground, and TA is the cone angle of the ceramic riving knife to be ground.
Referring to fig. 5, according to the indexes of the outer radius OR, the end face angle FA and the taper angle TA of the chopper specification, the BD point distance can be calculated, the main shaft of the ceramic chopper to be ground is fed in the positive Y-axis direction, the feeding amount is BD point distance, the circle center of the outer radius OR after grinding is ensured to overlap with the O point of the center of the swing fulcrum, and the BD point distance has the following calculation formula:
wherein OR is the outer radius of the ceramic riving knife to be ground, FA is the end face angle of the ceramic riving knife to be ground, and TA is the cone angle of the ceramic riving knife to be ground.
Further as a preferred embodiment, in step S104, the calculating the polishing time according to the specification index of the ceramic cleaver to be polished includes:
acquiring a sample ceramic chopper, grinding the sample ceramic chopper according to preset time, and determining specification indexes of a ground sample;
calculating to obtain the grinding volume of the sample according to the specification index of the grinding sample by a fixed integral calculation formula;
calculating according to the sample grinding volume and the preset time to obtain a grinding rate;
calculating according to the specification index of the ceramic riving knife to be ground through the fixed integral calculation formula to obtain the volume to be ground;
and calculating according to the grinding rate and the volume to be ground to obtain grinding time.
Referring to fig. 6, according to the embodiment of the invention, a calculation formula of a required grinding volume V is obtained according to various indexes of a tip diameter T, an outer radius OR, an end face angle FA, a cone angle TA and an inner hole diameter H of a ceramic riving knife to be ground. Before calculating the required grinding volume of the ceramic riving knife to be ground, the sample ceramic riving knife of the same material needs to be mechanically ground for a preset time t 1 ，t 1 Setting the diameter of the sample ceramic chopper to be 20s, taking down the sample ceramic chopper after finishing grinding to measure the outer radius size of the sample after grinding, and calculating the grinding volume V of the sample according to the actual specification of the sample ceramic chopper, namely the indexes of the tip diameter T, the outer radius OR, the end face angle FA, the cone angle TA and the inner hole diameter H of the sample ceramic chopper after grinding, and calculating the grinding volume V of the sample by a fixed integral calculation formula 1 Calculating the grinding rate of the grinding sheet on the materialThen the grinding time required by the outer radius OR of the ceramic riving knife to be ground can be calculated>In FIG. 6, point A is the intersection of OR and FA, B is the intersection of FA and TA before grinding OR, C is the intersection of OR and TA, D is the center of OR, X A 、X B 、X C And the abscissa of points a, B and C, respectively. The calculation principle of the grinding volume is that a coordinate system is established by using the point O of the tip of the chopper, the volume obtained by rotating the shadow part around the x axis is the ground part in the grinding process of the outer radius OR, namely the grinding volume, and the volume obtained by rotating the shadow part around the x axis can be calculated by using the principle of calculating the volume of the rotating body through fixed integration.
Further as a preferred embodiment, the polishing treatment of the ceramic cleaver to be polished by the polishing device according to the polishing time along the negative direction of the longitudinal axis of the rectangular coordinate system includes:
the grinding apparatus further comprises a grinding wheel;
coating grinding paste on the grinding wheel, and contacting with the tip end point of the ceramic riving knife to be ground along the negative direction of the longitudinal axis of the rectangular coordinate system;
starting the grinding equipment according to the grinding time, and grinding the outer radius of the ceramic riving knife to be ground through the grinding wheel;
the ceramic riving knife to be ground is rotated through the rotating device, and the rotating shaft is the central axis of the ceramic riving knife to be ground;
and carrying out swinging treatment on the ceramic riving knife to be ground through the swinging device.
In an embodiment of the present invention, the grinding apparatus further includes a grinding wheel, and the grinding wheel is coated with a grinding paste to be brought into contact with the tip end point of the ceramic cleaver to be ground along the negative direction of the longitudinal axis of the rectangular coordinate system. And starting grinding equipment according to the calculated grinding time, grinding the outer radius of the ceramic riving knife to be ground through a grinding wheel, rotating the ceramic riving knife to be ground through a rotating device, wherein the rotating shaft is the central axis of the ceramic riving knife to be ground, and swinging the ceramic riving knife to be ground through a swinging device.
Further as a preferred embodiment, the applying the polishing paste to the polishing wheel makes contact with the tip end point of the ceramic cleaver to be polished along the negative direction of the longitudinal axis of the rectangular coordinate system, including:
the grinding device further comprises a pressure display module;
the grinding paste is prepared from diamond and an oily solvent according to the proportion of 1:1, wherein the oily solvent is rapeseed oil solvent;
and contacting with the tip end point of the ceramic riving knife to be ground along the negative direction of the longitudinal axis of the rectangular coordinate system until the pressure displayed by the pressure display module is 8-12g.
Referring to fig. 7, the grinding apparatus in the embodiment of the present invention further includes a pressure display device 701, a spring 702, and a grinding wheel 703. According to the embodiment of the invention, the grinding wheel is coated with the grinding paste, and is fed in the direction of the riving knife to be contacted with the point B of the riving knife until the pressure display device is 8-12g. In the embodiment of the invention, the grinding pressure is controlled to be 8-12g, and is lower than the grinding pressure, so that the problems of low grinding efficiency and instability are easy to occur; above this pressure, there is no more significant increase in grinding efficiency and finer riving knives are prone to break risk. The grinding paste used in the embodiment of the invention is prepared from diamond and an oily solvent according to the proportion of 1:1, wherein the oily solvent is rapeseed oil, and the diamond granularity is 1-2 mu m. The polishing paste selected in the embodiment of the invention comprises, but is not limited to, common riving knife polishing paste.
Further as a preferred embodiment, the grinding the outer radius of the ceramic riving knife to be ground by the grinding wheel includes:
starting the grinding wheel, grinding the outer radius of the ceramic riving knife to be ground through the grinding wheel, wherein the rotating speed of the grinding wheel is 100-150r/min.
In the embodiment of the invention, the outer radius of the ceramic riving knife to be ground is ground through the grinding wheel, the rotating speed of the grinding wheel is 100-150r/min, wherein the diameter of the grinding wheel is 30mm, the corresponding linear speed is 9420-14130mm/min, and the linear speed of the grinding wheel is far greater than the linear speed of a product per se, which is a factor mainly influencing the grinding efficiency, so that the rotating speed of the grinding wheel needs to be controlled at 100-150r/min, and the problem of low grinding efficiency is easy to occur when the rotating speed of the grinding wheel is lower than the rotating speed; above this speed, the outer radius OR is out of round and polygonal.
Further as a preferred embodiment, the rotating the ceramic riving knife to be ground by the rotating device includes:
and carrying out rotation treatment on the ceramic riving knife to be ground through the rotation device, wherein the rotation speed of the rotation device is 1200-1500r/min.
In the embodiment of the invention, the ceramic riving knife to be ground is rotated by the rotating device, and the rotating speed of the rotating device is 1200-1500r/min. Wherein, the rotating speed of the main shaft of the rotating device is controlled to be 1000-1200r/min, and the corresponding product linear speed is 376.8-452.2mm/min. The rotating speed of the main shaft cannot be lower than the speed, the symmetry degree of the outer radius OR of the chopper is insufficient easily, and the outer radius OR is unstable in size easily; above this speed, the rotating device is prone to jitter, affecting the polishing stability.
Further as a preferred embodiment, the swinging treatment of the ceramic riving knife to be ground by the swinging device includes:
and carrying out swinging treatment on the ceramic riving knife to be ground through the swinging device, wherein the swinging angular speed of the swinging device is 0.8-1.2rad/s.
In the embodiment of the invention, the ceramic riving knife to be ground is subjected to swinging treatment through the swinging device, and the swinging angular speed of the swinging device is 0.8-1.2rad/s. The swing angular speed of the swing device is controlled to be 0.8-2.0rad/s, and is lower than the swing angular speed, the problems of out-of-round and multilateral outer radius OR are easy to occur, and the torque required by the swing device is larger and is easy to damage equipment and influence the grinding precision. In addition, in order to ensure that the end face angle FA and the taper angle TA cannot be ground in the swing process, the left limit is a state when the end face angle FA is parallel to a tangent line where a contact point of the riving knife and the grinding wheel is located, and at the moment, the included angle between the central axis of the riving knife and the Y axis is as follows: FA, as shown in fig. 8; the right limit is the state when the cone angle TA is parallel to the tangent line where the contact point of the riving knife and the grinding wheel is located, and the included angle between the central axis of the riving knife and the Y axis is:as shown in fig. 9; i.e. the first wobble device can only be at +.>Is swung back and forth each time the left and right limits are reached, as shown in fig. 10.
In one possible embodiment, an outer radius OR grind is performed on a certain gauge riving knife product, where the face angle fa=8°; cone angle ta=20°; inner hole diameter h=25 μm; tip diameter t=130 μm; the outer radius or=25 μm. Firstly, inserting the riving knife into a swingable and rotatable equipment clamp head to fix the riving knife. And then, under the camera unit, the rotatable equipment is adjusted through the two-dimensional adjusting table, and the tip of the riving knife is adjusted to the center of the swing fulcrum. Then the swingable and rotatable apparatusSwinging anticlockwise, and calculating according to a calculation formula in the summary to obtain a swinging angle as follows: 44 deg. so that the outer radius OR center is in the Y feed direction. Then calculating the point distance according to each index of T, OR, FA, TA, H of the riving knife specification, feeding the main shaft to the Y-axis positive direction, wherein the feeding amount is the point distance, and ensuring that the center of the outer radius OR overlaps with the center point of the swing pivot; the calculated point distance according to the calculation formula in the summary of the invention is: 30.9 μm. In addition, the grinding wheel is coated with grinding paste, and is fed in the direction of the chopper, and is contacted with the end point of the tip end of the chopper until the pressure display device is 10g, wherein the grinding paste is prepared from diamond and an oily solvent according to the following ratio of 1:1, wherein the oily solvent is rapeseed oil, and the diamond granularity is 1-2 mu m. According to the calculation formula of the grinding volume obtained by calculation in the calculation process of the invention, the required grinding volume is 24162 mu m 3 . Finally, the riving knife sample is put on a machine to be ground for a period of time t 1 ，t 1 Setting to 20s, taking down the sample and measuring the outer radius OR of the ground sample 1 The size is 30 mu m, and the grinding volume V of the sample is calculated by applying a fixed integral calculation formula according to the actual specification of the sample 1 ＝34440μm 3 Calculating the grinding rate of the grinding sheet to the sample chopper1148 μm 3 And/s. The outer radius OR of the target riving knife product and the required grinding time are calculated as follows:setting the polishing time t to 21S; starting a rotating device in the equipment according to the grinding time to enable the riving knife to start rotating at a required rotating speed of 1300r/min; starting the grinding wheel to rotate at the required rotating speed of 120r/min; setting a swinging angle, starting a swinging device in the equipment, wherein the required swinging angular speed is 1.0rad/s, and grinding according to the set time t to finish the outer radius grinding of the riving knife.
In order to ensure that FA and TA cannot be ground in the swinging process, the left limit is a state when the tangent line where the contact point of FA with the riving knife and the grinding wheel is positioned is parallel, and the included angle between the central axis of the riving knife and the Y axis is as follows: 8 °; the right limit is the state when TA is parallel to the tangent line where the contact point of the riving knife and the grinding wheel is located, and the included angle between the central axis of the riving knife and the Y axis is: 80 °; that is, the swinging device can only swing back and forth within the range of 8-80 degrees, and the direction is changed when the left and right limits are reached each time. The accuracy qualification rate of the external radius grinding dimension OR+/-2 mu m of the ceramic chopper obtained by grinding by the external radius grinding method of the ceramic chopper can be more than OR equal to 99 percent.
In another aspect, an embodiment of the present invention further provides a system, including:
the grinding device comprises a rotating device and a swinging device, wherein the rotating device is used for rotating the ceramic riving knife to be ground around a rotating shaft, and the swinging device is used for swinging the ceramic riving knife to be ground around a swinging fulcrum;
the second module is used for adjusting the tip end point of the ceramic chopper to be ground to the swing fulcrum by adjusting the clamp chuck of the grinding equipment;
the third module is used for establishing a rectangular coordinate system according to the swing fulcrum and swinging the circle center of the outer radius of the ceramic riving knife to be ground to the longitudinal axis of the rectangular coordinate system;
a fourth module, configured to calculate a grinding time according to the specification index of the ceramic cleaver to be ground;
and the fifth module is used for carrying out grinding treatment on the ceramic riving knife to be ground through the grinding equipment according to the grinding time along the negative direction of the longitudinal axis of the rectangular coordinate system, and determining the outer radius of the ceramic riving knife to be ground after grinding.
Corresponding to the method of fig. 1, the embodiment of the invention also provides an electronic device, which comprises a processor and a memory; the memory is used for storing programs; the processor executes the program to implement the method as described above.
Corresponding to the method of fig. 1, an embodiment of the present invention also provides a computer-readable storage medium storing a program to be executed by a processor to implement the method as described above.
Embodiments of the present invention also disclose a computer program product or computer program comprising computer instructions stored in a computer readable storage medium. The computer instructions may be read from a computer-readable storage medium by a processor of a computer device, and executed by the processor, to cause the computer device to perform the method shown in fig. 1.
In summary, the embodiment of the invention has the following advantages: the invention provides a polishing process for the outer radius of a riving knife, wherein the process parameters of the polishing process are quantized through design, the polishing time and the polishing tool feeding amount are calculated through the polishing amount and the polishing speed, the testing cost of new specifications is reduced, and the production stability and the product precision are improved.
In some alternative embodiments, the functions/acts noted in the block diagrams may occur out of the order noted in the operational illustrations. For example, two blocks shown in succession may in fact be executed substantially concurrently or the blocks may sometimes be executed in the reverse order, depending upon the functionality/acts involved. Furthermore, the embodiments presented and described in the flowcharts of the present invention are provided by way of example in order to provide a more thorough understanding of the technology. The disclosed methods are not limited to the operations and logic flows presented herein. Alternative embodiments are contemplated in which the order of various operations is changed, and in which sub-operations described as part of a larger operation are performed independently.
Furthermore, while the invention is described in the context of functional modules, it should be appreciated that, unless otherwise indicated, one or more of the described functions and/or features may be integrated in a single physical device and/or software module or one or more functions and/or features may be implemented in separate physical devices or software modules. It will also be appreciated that a detailed discussion of the actual implementation of each module is not necessary to an understanding of the present invention. Rather, the actual implementation of the various functional modules in the apparatus disclosed herein will be apparent to those skilled in the art from consideration of their attributes, functions and internal relationships. Accordingly, one of ordinary skill in the art can implement the invention as set forth in the claims without undue experimentation. It is also to be understood that the specific concepts disclosed are merely illustrative and are not intended to be limiting upon the scope of the invention, which is to be defined in the appended claims and their full scope of equivalents.
The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
Logic and/or steps represented in the flowcharts or otherwise described herein, e.g., a ordered listing of executable instructions for implementing logical functions, can be embodied in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device, such as a computer-based system, processor-containing system, or other system that can fetch the instructions from the instruction execution system, apparatus, or device and execute the instructions. For the purposes of this description, a "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device.
More specific examples (a non-exhaustive list) of the computer-readable medium would include the following: an electrical connection (electronic device) having one or more wires, a portable computer diskette (magnetic device), a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). In addition, the computer readable medium may even be paper or other suitable medium on which the program is printed, as the program may be electronically captured, via, for instance, optical scanning of the paper or other medium, then compiled, interpreted or otherwise processed in a suitable manner, if necessary, and then stored in a computer memory.
It is to be understood that portions of the present invention may be implemented in hardware, software, firmware, or a combination thereof. In the above-described embodiments, the various steps or methods may be implemented in software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, may be implemented using any one or combination of the following techniques, as is well known in the art: discrete logic circuits having logic gates for implementing logic functions on data signals, application specific integrated circuits having suitable combinational logic gates, programmable Gate Arrays (PGAs), field Programmable Gate Arrays (FPGAs), and the like.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.
While the preferred embodiment of the present invention has been described in detail, the present invention is not limited to the embodiments described above, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and these equivalent modifications or substitutions are included in the scope of the present invention as defined in the appended claims.
Claims (9)
1. A method for grinding an outer radius of a ceramic cleaver, the method comprising:
the method comprises the steps that a ceramic riving knife to be ground is mounted on a clamp head of grinding equipment, the grinding equipment comprises a rotating device and a swinging device, the rotating device is used for rotating the ceramic riving knife to be ground around a rotating shaft, and the swinging device is used for swinging the ceramic riving knife to be ground around a swinging fulcrum;
adjusting the tip end point of the ceramic riving knife to be ground to the swing fulcrum by adjusting the clamp chuck of the grinding equipment;
establishing a rectangular coordinate system according to the swing fulcrum, and swinging the center of the outer radius of the ceramic riving knife to be ground to the longitudinal axis of the rectangular coordinate system;
calculating according to the specification index of the ceramic riving knife to be ground to obtain grinding time;
the grinding time is calculated according to the specification index of the ceramic riving knife to be ground, and the method comprises the following steps:
acquiring a sample ceramic chopper, grinding the sample ceramic chopper according to preset time, and determining specification indexes of a ground sample;
calculating to obtain the grinding volume of the sample according to the specification index of the grinding sample by a fixed integral calculation formula; calculating according to the sample grinding volume and the preset time to obtain a grinding rate;
calculating according to the specification index of the ceramic riving knife to be ground through the fixed integral calculation formula to obtain the volume to be ground;
calculating according to the grinding rate and the volume to be ground to obtain grinding time;
and grinding the ceramic cleaver to be ground through the grinding equipment according to the grinding time along the negative direction of the longitudinal axis of the rectangular coordinate system, and determining the outer radius of the ceramic cleaver to be ground after grinding.
2. The method according to claim 1, wherein the grinding of the ceramic cleaver to be ground by the grinding device according to the grinding time in a negative direction along the longitudinal axis of the rectangular coordinate system comprises:
the grinding apparatus further comprises a grinding wheel;
coating grinding paste on the grinding wheel, and contacting with the tip end point of the ceramic riving knife to be ground along the negative direction of the longitudinal axis of the rectangular coordinate system;
starting the grinding equipment according to the grinding time, and grinding the outer radius of the ceramic riving knife to be ground through the grinding wheel;
the ceramic riving knife to be ground is rotated through the rotating device, and the rotating shaft is the central axis of the ceramic riving knife to be ground;
and carrying out swinging treatment on the ceramic riving knife to be ground through the swinging device.
3. The method of claim 2, wherein the applying the abrasive paste to the abrasive wheel in contact with the tip end point of the ceramic cleaver to be abraded in the negative direction of the longitudinal axis of the rectangular coordinate system comprises:
the grinding device further comprises a pressure display module;
the grinding paste is prepared from diamond and an oily solvent according to the proportion of 1:1, wherein the oily solvent is rapeseed oil solvent;
and contacting with the tip end point of the ceramic riving knife to be ground along the negative direction of the longitudinal axis of the rectangular coordinate system until the pressure displayed by the pressure display module is 8-12g.
4. The method of claim 2, wherein the grinding the outer radius of the ceramic cleaver to be ground by the grinding wheel comprises:
starting the grinding wheel, grinding the outer radius of the ceramic riving knife to be ground through the grinding wheel, wherein the rotating speed of the grinding wheel is 100-150r/min.
5. The method of claim 2, wherein the rotating the ceramic cleaver to be ground with the rotating device comprises:
and carrying out rotation treatment on the ceramic riving knife to be ground through the rotation device, wherein the rotation speed of the rotation device is 1200-1500r/min.
6. The method according to claim 2, wherein the swinging the ceramic cleaver to be ground by the swinging device includes:
and carrying out swinging treatment on the ceramic riving knife to be ground through the swinging device, wherein the swinging angular speed of the swinging device is 0.8-1.2rad/s.
7. A ceramic riving knife outer radius grinding system, the system comprising:
the grinding device comprises a rotating device and a swinging device, wherein the rotating device is used for rotating the ceramic riving knife to be ground around a rotating shaft, and the swinging device is used for swinging the ceramic riving knife to be ground around a swinging fulcrum;
the second module is used for adjusting the tip end point of the ceramic chopper to be ground to the swing fulcrum by adjusting the clamp chuck of the grinding equipment;
the third module is used for establishing a rectangular coordinate system according to the swing fulcrum and swinging the circle center of the outer radius of the ceramic riving knife to be ground to the longitudinal axis of the rectangular coordinate system;
a fourth module, configured to calculate a grinding time according to the specification index of the ceramic cleaver to be ground;
the fourth module is configured to calculate, according to the specification index of the ceramic cleaver to be polished, a polishing time, and includes:
acquiring a sample ceramic chopper, grinding the sample ceramic chopper according to preset time, and determining specification indexes of a ground sample;
calculating to obtain the grinding volume of the sample according to the specification index of the grinding sample by a fixed integral calculation formula; calculating according to the sample grinding volume and the preset time to obtain a grinding rate;
calculating according to the specification index of the ceramic riving knife to be ground through the fixed integral calculation formula to obtain the volume to be ground;
calculating according to the grinding rate and the volume to be ground to obtain grinding time;
and the fifth module is used for carrying out grinding treatment on the ceramic riving knife to be ground through the grinding equipment according to the grinding time along the negative direction of the longitudinal axis of the rectangular coordinate system, and determining the outer radius of the ceramic riving knife to be ground after grinding.
8. An electronic device comprising a memory and a processor;
the memory is used for storing programs;
the processor executing the program implements the method of any one of claims 1 to 6.
9. A computer readable storage medium storing a computer program, characterized in that the computer program, when executed by a processor, implements the method of any one of claims 1 to 6.
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| CN202211461556.1A CN115781424B (en) | 2022-11-17 | 2022-11-17 | Method, system, equipment and medium for grinding outer radius of ceramic riving knife |
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| CN115781424A (en) | 2023-03-14 |
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