CN101069958A - Crystal-chip polishing method - Google Patents
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- CN101069958A CN101069958A CN 200710068274 CN200710068274A CN101069958A CN 101069958 A CN101069958 A CN 101069958A CN 200710068274 CN200710068274 CN 200710068274 CN 200710068274 A CN200710068274 A CN 200710068274A CN 101069958 A CN101069958 A CN 101069958A
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Abstract
A polishing method of wafers mainly contains the following steps: (1) put the wafers for processing on the planet gear of the polisher. (2) Startup the polisher and it can set technology parameters based on the wafers after self-checking. (3) Control the cylinder connecting with the upper polishing plate to descend and receive the signal from the position sensor. When the upper polishing plate arrive the working position, the cylinder stops and connects it with the long axis. (4) If the delivery device of polishing liquid is normal, open the polishing liquid. (5) Control the cylinder to drop continuously and test the pressure between the cylinder and the upper polishing plate by a pressure sensor. Start all conversion motors when the pressure reaches the desired value. (6) Polish the wafers by controlling the conversion motors and the cylinder based on control curves of rotating speed and pressure separately. The invention can realize infinite speed variation, adjust the pressure of the upper polishing plate, has good stationarity during processing and improves the polishing efficiency.
Description
(1) technical field
The present invention relates to the wafer polishing field, especially a kind of precise polishing method of wafer.
(2) background technology
Former traditional lapping and buffing machine adopts single driven by motor, referring to Fig. 1, realize going up polishing disk 22, the rotation of polishing disk 23, ring gear 24, ring gear 25 down by gear train assembly, polishing disk and planetary gear have only two kinds of velocity ratios up and down, limited the variation of twin polishing working motion track, lacked accurate control speed.
In order to improve polishing efficiency, someone improves the planetary plate of polishing machine, as the patent No. is 02292538.4, patent name is the Chinese utility model patent of Twp-sided polishing machine planetary plate, a kind of twin polishing dish is disclosed, 3 eccentric orfices are arranged on its planetary plate, place 3 separators in 3 eccentric orfices respectively, the aperture of each separator is 103 millimeters.Can partly improve the yield rate of polishing, and improve polishing efficiency.But it still adopts two of traditional lapping and buffing machines or three through-drive modes.
The shortcoming that existing wafer polishing method exists is: (1), can not realize stepless speed regulation; (2), can not regulate polishing disk pressure; (3), Jia Gong stationarity is poor; (4), polishing efficiency is lower.
(3) summary of the invention
In order to overcome can not the realizing stepless speed regulation, can not regulate the pressure of polishing disk of existing wafer polishing technology, the deficiency that stationarity is poor, polishing efficiency is low of processing, the invention provides a kind of wafer polishing method that realizes that the pressure of polishing disk in stepless speed regulation, the adjusting, process stationarity are good, can effectively promote polishing efficiency.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of finishing method of wafer, this method mainly may further comprise the steps:
(1), wafer to be processed is placed on the planetary gear of polishing machine;
(2), start polishing machine, after the polishing machine self check is normal, technological parameter is set: the rotating speed control curve of each variable-frequency motor, the pressure control curve of cylinder, the temperature and the flow of polishing fluid according to wafer to be processed;
(3), the cylinder that is connected with last polishing disk of control descends, and the signal of receiving position sensor, when last polishing disk arrived the operating position, cylinder stopped, and will go up polishing disk and be connected with major axis;
(4), whether normal, and open polishing fluid if detecting the polishing fluid conveying device;
(5), the control cylinder continue to descend, and detects pressure between cylinder and the last polishing disk by pressure sensor, when the pressure of pressure sensor reaches default pressure, starts each variable-frequency motor;
(6), rotate, pressure control curve controlled cylinder carries out wafer polishing according to rotating speed control curve controlled variable-frequency motor.
As preferred a kind of scheme: described finishing method also comprises: (7), in polishing process, whether normal periodically detecting rotating speed or pressure, whether whether flow and temperature normal or polishing fluid be normal, as be judged to be undesired, turn-off each variable-frequency motor, and the stop supplies polishing fluid;
(8), the control cylinder rises, finish when cylinder is returned to initial position when position sensor detects.
As preferred another kind of scheme: in described (2), rotating speed control curve comprises: the startup stage, in advance throw speed stage, slightly throw speed stage, smartly throw speed stage, cleaning speed stage, slow stopping the stage; Pressure control curve comprises: starting pressure stage, precompression stage, slightly throw the pressure stage, smartly throw pressure stage, cleaning pressure stage, slow stopping the stage.
As preferred another scheme: in described (6), at polishing in the stage, the rotating speed that detects as speed probe less than or greater than the operating rate in each stage, the control frequency converter increases or reduces rotating speed; The pressure that detects as pressure sensor less than or greater than the operating pressure in each stage, the controlled pressure control valve increases or reduces pressure.
Beneficial effect of the present invention mainly shows: soft start and soft the stopping that 1, can realizing stepless speed regulation, process; 2, little to the shock effect of workpiece, the stationarity of process is good; 3, can effectively promote polishing efficiency; 4, can bear the gravity of operating pressure and workbench, the machining accuracy height; 5, can accurately control the pressure of polishing disk, effectively promote the polishing precision workpiece;
(4) description of drawings
Fig. 1 is the structural representation of traditional double-faced grinding and polishing machine.
Fig. 2 is the structural representation of Twp-sided polishing machine of the present invention.
Fig. 3 is the structure chart of the spindle drive of polishing machine.
Fig. 4 is the structure chart of the upthrow disc drive mechanism of polishing machine.
Fig. 5 is the control functional diagram of polishing machine.
Fig. 6 is the control principle figure of industrial computer.
Fig. 7 is the pneumatic control schematic diagram.
Fig. 8 is the schematic diagram of polishing disk operational mode.
Fig. 9 is the control flow chart of processing automatically.
(5) specific embodiment
Below in conjunction with accompanying drawing the present invention is further described.
With reference to Fig. 2～Fig. 9, a kind of finishing method of wafer, this method mainly may further comprise the steps:
(1), wafer to be processed is placed on the planetary gear of polishing machine;
(2), start polishing machine, after the polishing machine self check is normal, technological parameter is set: the rotating speed control curve of each variable-frequency motor, the pressure control curve of cylinder, the temperature and the flow of polishing fluid according to wafer to be processed;
(3), the cylinder that is connected with last polishing disk of control descends, and the signal of receiving position sensor, when last polishing disk arrived the operating position, cylinder stopped, and will go up polishing disk and be connected with major axis;
(4), whether normal, and open polishing fluid if detecting the polishing fluid conveying device;
(5), the control cylinder continue to descend, and detects pressure between cylinder and the last polishing disk by pressure sensor, when the pressure of pressure sensor reaches default pressure, starts each variable-frequency motor;
(6), rotate, pressure control curve controlled cylinder carries out wafer polishing according to rotating speed control curve controlled variable-frequency motor.
(7), in polishing process, whether normal periodically detecting rotating speed or pressure, whether whether flow and temperature normal or polishing fluid normal, as are judged to be undesiredly, turn-off each variable-frequency motor, and the stop supplies polishing fluid; (8), the control cylinder rises, finish when cylinder is returned to initial position when position sensor detects.
In described (2), rotating speed control curve comprises: the startup stage, in advance throw speed stage, slightly throw speed stage, smartly throw speed stage, cleaning speed stage, slow stopping the stage; Pressure control curve comprises: starting pressure stage, precompression stage, slightly throw the pressure stage, smartly throw pressure stage, cleaning pressure stage, slow stopping the stage.In described (6), at polishing in the stage, the rotating speed that detects as speed probe less than or greater than the operating rate in each stage, the control frequency converter increases or reduces rotating speed; The pressure that detects as pressure sensor less than or greater than the operating pressure in each stage, the controlled pressure control valve increases or reduces pressure.
The four moving polishing principles that present embodiment adopts four variable-frequency motors to drag downshort disk, ring gear, ring gear respectively carry out design of Transmission System, and adopt axle sleeve structure to make four with one heart, compact conformation, can realize the soft start and soft the stopping of stepless speed regulation, process, shock effect to workpiece is little, and the stationarity of process is good.
First variable-frequency motor 2 is with synchronously by first and belt wheel will rotatablely move reaches major axis 6, goes up polishing disk 22 during work and descends, and major axis 6 links to each other with last polishing disk 11 by connector, makes polishing disk 22 rotations; Second variable-frequency motor 3 by second synchronously band and belt wheel will rotatablely move and reach little axle 7, little axle 7 links to each other with ring gear 24, and ring gear 24 is rotated; The 3rd variable-frequency motor 4 is with synchronously by the 3rd and belt wheel will rotatablely move reaches axis 8, and axis 8 links to each other with following polishing disk 23, makes down polishing disk 23 rotations; The 4th variable-frequency motor 5 is delivered to macro-axis 9 to motion by a pair of gear, and macro-axis 9 links to each other with external toothing 25, makes external toothing 25 motions; The motion of lifting drive (hydraulic cylinder) piston simultaneously makes expansion link 18 promote to move up and down, and external toothing 25 positions can be adjusted up and down.
For the Twp-sided polishing machine structure, its core is the mainshaft mechanism that drives upper and lower polishing disk and planetary gear and external toothing rotation.Below with reference to Fig. 3, the major axis 6 that polishing disk rotates in four variable-frequency motors, the driving, drive little axle 7 that ring gear rotates, drive the axis 8 that polishing disk down rotates and drive the macro-axis 9 that external toothing rotates, the output shaft of first variable-frequency motor 2 is connected to come transmission long axis 6 with first driving-belt 10, described major axis 6 bottoms connect major axis bearing 11, and described major axis bearing 11 is installed on the frame 1; The output shaft of second variable-frequency motor 3 is connected to come the little axle 7 of transmission with second driving-belt 12, and described little axle 7 bottoms connect little axle bearing 13, and described little axle bearing 13 is sleeved on the outside of major axis 6; The output shaft of the 3rd variable-frequency motor 4 is connected to come transmission axis 8 with the 3rd driving-belt 14, and described axis 8 bottoms connect bottom bracket bearing 15, and described bottom bracket bearing 15 is sleeved on the outside of little axle 7; The output shaft of the 4th variable-frequency motor 5 and the 4th gear 16 are in transmission connection, and described the 4th gear 16 connects macro-axis 6 by key, and described macro-axis 6 bottoms connect big axle bearing 17, and described big axle bearing 17 is sleeved on the outside of axis 8; On the described macro-axis bearing holder (housing, cover) 17 lifting drive is installed, described lifting drive has expansion link 18, and the other end of described expansion link 18 is fixedlyed connected with major axis 6, but described macro-axis 9 is provided with the keyway that donating bond slides up and down.
Described first driving-belt 10 be first synchronously the band; Described second driving-belt 12 be second synchronously the band; Described the 3rd driving-belt 14 be the 3rd synchronously the band; Idler gear 19 is sleeved on the output shaft of the 4th variable-frequency motor 5, described idler gear 19 and 5 engagements of the 4th gear.
The upper end dress D level single-row radial ball bearing and the single-row thrust ball bearing of described major axis 6, bottom are installed square seat jackscrew roller bearing units, and described square seat jackscrew roller bearing units is installed in the major axis bearing block; The upper end dress single-row radial ball bearing and the single-row thrust ball bearing of described little axle 7, needle bearing is installed in the bottom, and described needle bearing is installed in the little axle bearing seat; Axis 8 front ends are installed a pair of reverse taper roll bearing, and needle bearing is installed in the rear end, and described needle bearing is installed in the bottom bracket bearing seat; Macro-axis 9 and the 15 slip sockets of bottom bracket bearing seat adopt matched in clearance; The macro-axis bearing block is fixed on the workbench 20, adopts roller bearing between macro-axis 9 and macro-axis bearing block, and a thrust bearing 21 is placed in macro-axis 9 rear ends.Described lifting drive is hydraulic cylinder or cylinder.
Because spindle assemblies will guarantee certain machining accuracy and bear operating pressure and the gravity of workbench that therefore requiring has good precision, rigidity and bearing capacity.
------------key---drives round nut---and goes up polishing disk 22 major axis 6 key first belt pulley last polishing disk 22 motion transmittance process: first variable-frequency motor 2.For running accuracy and the positional precision that guarantees polishing disk 22, the running accuracy of major axis 6 and rigidity are crucial.Therefore at the front end dress precision height of major axis, the D level single-row radial ball bearing and the single-row thrust ball bearing of good rigidly, rear axle has taken up square seat jackscrew roller bearing units.The axial force of both direction and radial load can both be born like this, guarantee to have certain running accuracy and rigidity;
The transmittance process of ring gear 24 motions: second variable-frequency motor 3---second belt pulley---key---little axle 7---key---internal tooth ring support---ring gears 24.For running accuracy and the positional precision that guarantees ring gear 24, the running accuracy of little axle 7 and rigidity are crucial.Therefore little axle front end single-row radial ball bearing and single-row thrust ball bearing, adopt needle bearing between rear end major axis and the little axle, its radial structure compactness and bearing capacity are big, guarantee the depth of parallelism of major axis and little axle simultaneously, place a thrust bearing between little axle and supporting mass, bear axial force.
The transmittance process of following polishing disk 23 motions: the 3rd variable-frequency motor 4---the 3rd belt pulley---key---the following polishing disk 23 of axis 8---following polishing disk seat---.In order to guarantee down the running accuracy and the positional precision of polishing disk 23 motions, the running accuracy of axis 8 and rigidity are crucial.Following polishing disk is fixed on down on the polishing disk seat by screw, and locating surface is the end face of polishing disk seat down and the outer round surface of following polishing disk alignment pin thereof.The axis front end adopts a pair of reverse taper roll bearing to be installed on the bottom bracket bearing seat, and rear end axis and little between centers also adopt needle bearing, makes its radial structure compactness, bearing capacity is big, guarantee the depth of parallelism of axis and little between centers, place a thrust bearing between axis and supporting mass, bear axial force.
Control system comprises polishing machine micromanipulator 39, first frequency converter that is connected with first variable-frequency motor 2 that drives upward polishing disk 22 rotations, second frequency converter that is connected with second variable-frequency motor 3 that drives ring gear 24 rotations, the 3rd frequency converter that is connected with the 3rd variable-frequency motor 4 that drives polishing disk 23 rotations down, the 4th frequency converter that is connected with the 4th variable-frequency motor 5 that drives external toothing 25 rotations, be installed in the speed probe 40 on the main shaft of each variable-frequency motor, and regulate the pressure-regulating valve 29 of on-load pressure size and be installed in the piston rod 28 of cylinder and the pressure sensor 30 between the last polishing disk 22, described polishing machine micromanipulator comprises: motor speed adjustment module 41, be used for controlling curve controlled rotating speed size according to the loading rotating speed that the processing conditions of workpiece is formulated, send the rotational speed regulation instruction to each frequency converter, motor speed control module 42, be used for each polishing stage, receive the signal of speed probe, and with the working speed in the tachometer value of speed probe and default each polishing stage relatively, optionally send and increase or reduce rotary speed instruction to frequency converter; Last polishing disk pressure control module 31, be used for controlling the curve controlled magnitude of load according to the on-load pressure that the processing conditions of workpiece is formulated, send the pressure regulating command to pressure-regulating valve, be used for each polishing stage, receive the signal of pressure sensor, and with the operating pressure in the force value of pressure sensor and default each polishing stage relatively, optionally send and increase or reduce pressure instruction to pressure-regulating valve; Described motor speed control module 42 connects each speed probe 40, first frequency converter, second frequency converter, the 3rd frequency converter, the 4th frequency converter; The described polishing disk pressure control module 31 that goes up connects pressure-regulating valve 29, pressure sensor 30.
Described control system also comprises the position sensor 36 that is used to detect the upthrow CD position, described polishing machine micromanipulator 39 also comprises: upthrow CD position control module 37 is used for whether arriving the operating position according to polishing disk on the signal determining of displacement transducer; Described position sensor 36 connects described upthrow CD position control module 37.
Described control system also comprises thermoregulator 43, the temperature sensor 44 that is installed in the polishing fluid staving, described polishing machine micromanipulator also comprises: thermostatic control module 45, be used for that the control thermoregulator heats when temperature that temperature sensor records is lower than setting value, control thermoregulator refrigeration when the temperature that temperature sensor records is higher than setting value; Described temperature sensor 44 connects the input of thermostatic control module 45, and the output of described thermostatic control module 45 connects thermoregulator 43.
Described control system also comprises flow control valve 46, the flow sensor 47 that is installed on the polishing fluid conveyance conduit, described polishing machine micromanipulator also comprises: flow-control module 48, the signal that is used for the acquisition stream quantity sensor, flow-rate ratio preset flow as flow sensor is big, sends the instruction that reduces flow to flow control valve; Flow-rate ratio preset flow as flow sensor is little, the instruction of sending augmented flow to flow control valve; Described flow-control module 48 is connected with flow control valve 46, flow sensor 47.
The working method of the polishing machine of present embodiment has: during the noncontact polishing, float several microns with going up polishing disk 22 relative workpiece (on following polishing disk); And when polishing contact will on polishing disk load, maximum load will reach kgf more than 100; When stopping to polish, then will go up polishing disk again and lift certain altitude.
In order to realize above-mentioned functions, the last polishing disk of present embodiment adopts cylinder 27 to utilize the pressure of pressure-air to realize pressurization.Pressure-air enters the last chamber of cylinder by last tracheae, promotes piston rod 28 and moves down, and last polishing disk floats and is connected on the cylinder piston rod, thus required pressure in the realization process.Pressure-air goes up tracheae simultaneously and connect atmosphere, thereby the promotion piston drives connecting rod and polishing disk moves up, and can unload or check workpiece by descending tracheae to enter the following chamber of cylinder.The operating pressure of cylinder is regulated by the pressure-regulating valve of regulating in the baric systerm 29 and is realized, go up the pressure of polishing disk for accurately controlling to workpiece, a pressure sensor 30 is adorned in cylinder and polishing disk junction, forming a closed-loop control, thereby realizes accurate control to cylinder.Pressure during for the assurance polishing is adjusted requirement, adopts the static pressure piston.
Axially precision is guaranteed by the precision of cylinder lower surface, and debugging makes polishing disk reach very high radial location precision and axial location precision later.
Consider the applying of polishing disk up and down in addition, improve the machining accuracy of workpiece, adopt unsteady the connection that cylinder is linked to each other with last polishing disk.When load is connected in the cylinder piston boom end, use the connection of floating to absorb the eccentric or not parallel eccentric load and the lateral load that piston rod is produced of piston rod and load.Not only to add load but also need high speed rotating when considering simultaneously to go up polishing disk work, so different with general floating junction structure.Floating junction adopts the ball bearing of spherical cambered surface to connect, so allow to go up polishing disk shaking in x, y, three directions of z, allow to shake the angle in ± 5 °, following polishing disk axial line can be done micro-eccentric slippage in the vertical direction of joint axis, simultaneously because floating junction does not require that load is consistent with the cylinder axle center.
Situations such as ultraprecise twin polishing precision and efficient and processing environment, polishing rotating speed, polishing operational mode, polish pressure, polishing fluid temperature, flow have direct relation.Be the real ultra-precision surface processing that realizes wafer, the major requirement that control system is proposed has: (1) each main shaft polishing rotary speed precision is controlled at ± 0.1r/s in, make the workpiece total machining error in 1nm, with the uniformity that guarantees that allowance is removed; (2) adopt the reasonably polishing disk speed control mode of " low speed starting-stepless speed-raising-constant speed processing-stepless reduction of speed-low speed stops ", avoid the process velocity variation excessive to the workpiece damage that impacts, to obtain good crudy.(3) temperature of control processing environment is provided with compensation of high-precision polishing fluid temperature detection and polishing fluid flow-control, to reduce the heat that produced in the process adverse effect to workpiece and lathe itself; (4) realize the accurate control of cylinder pressure, with precision control polishing processing, realize steadily, high accuracy, high efficiency polishing processing; (5) pattern that adopts microcomputer automatic control equipment to operate to get rid of the influence of operating personnel's human factor to crudy, guarantees the crudy of high level, stable and consistent.
The processing mechanism of different processed wafer materials, working process parameter is all different, and control system has been proposed higher specification requirement, sums up above-mentioned control requirement, and its key factor has: (1) polishing disk pressure is accurately controlled; (2) smoothness of polishing disk steady-state operation; (3) polishing disk operational mode control; (4) the real-time detection of polishing fluid temperature and the fuzzy control of flow; (5) realization of microcomputer automatic control pattern.At above technological difficulties, following implementation has been proposed: adopt the electric control systems that jointly control of composition such as Windows software platform, the indication of graphic interface function, high-precision grating sensor, position and pressure sensor, digital valve, cylinder, use the automatic processing that novel electric Direct Digital control technology realizes this machine.
The whole control system mainly comprises electrical apparatus control system and atmospheric control.Electrical apparatus control system is mainly by industrial computer, frequency converter, and compositions such as D/A interface, speed probe according to the program that industrial computer is set, are accurately controlled the rotation of four variable-frequency motors.Atmospheric control is mainly by air accumulator, pressure-regulating valve, and displacement and pressure sensor and cylinder are formed.The atmospheric control major function is that accurate control is applied to the polish pressure on the polishing disk.In addition, also have polishing fluid flow control system and polishing fluid temperature control system.
The realization of the steady-state operation of polishing disk is mainly realized by electrical apparatus control system.Consider the timely control appliance of energy when in process, accident occurring, debug for convenience simultaneously that this equipment electrical equipment control can be controlled the process automatically except that the industrial computer unification, all right manual work.
Mainly consider following content when manually control designs: (1) is provided with power supply and opens the control of equipment running status, the work operation, and work stops, polishing fluid is opened, and polishing fluid stops, and ring gear is under the external toothing, the polishing disk crawl, about the external toothing, about the cylinder, thermostat.(2) break down in the equipment running process and warn, be provided with and have or not polishing fluid, electrical fault, air pressure deficiency, cylinder trouble.(3) break down in the equipment running process, carry out emergent management, have promptly to stop.The automatic control of electrical equipment mainly is the control to four motors.Because frequency converter can change the rotating speed of motor by the frequency that changes power supply, can realize that polishing adds the soft start in man-hour, soft stopping, and in the infinitely variable speeds of processing different phase, therefore four motors adopt four frequency converters to control.
Four motors connect four frequency converters, control by an industrial computer is unified by the D/A conversion, by the rotation of industrial computer setting program control motor again.Have a cover expert database in industrial computer, the information according to expert database provides reaches optimum control to motor, finishes the polishing processing to various materials.Simultaneously with four main shafts that four motors link to each other on four speed probes are housed respectively, the rotary speed information of main shaft is fed back in the industrial computer, form a closed-loop control, reach accurate control polishing disk rotating speed and planetary gear and move.
The control strategy of polishing disk pressure is realized by atmospheric control, mainly realizes the accurate control of load by the change in location of cylinder piston rod.Control pneumatic system with the software programming timer, realize the needed high-low pressure of polishing process pressing time, by the programme-control pressure-regulating valve of microcomputer by finishing, pressure-regulating valve is control cylinder again, simultaneously a load transducer is housed at cylinder and polishing disk junction, change by A/D, the pressure signal of cylinder is fed back in the industrial computer, check the polishing disk position by a displacement transducer, the position signalling of polishing disk is fed back in the industrial computer, form two closed-loop controls, thereby realize accurate control polishing disk pressure.Cylinder is to control its action by pressure-regulating valve, is the key of whole pneumatic system control to the design of pressure-regulating valve and control.
The pneumatic system source of the gas is provided by small-sized air compressor, compressed air is through cylinder and filter feed system, system pressure is set up by pressure-regulating valve, by microcomputer regulation voltage signal is set and gives pressure-regulating valve, thereby the pressure requirement of control cylinder, realize the accurate motion of cylinder, the accurate control of polishing disk pressure.
When the processing beginning, because surface of the work out-of-flatness, if directly be added on the workpiece with operating pressure, then the local pressure between workpiece high spot and polishing pad is big especially, frictional resistance is big, cause workpiece in planetary gear, to be subjected to very big extruding, easily wafer crushing or wafer are got rid of to take off in the planetary gear and cause fragment.Therefore just begun to add man-hour at lathe, by microcomputer the flow of less regulation voltage signal controlled pressure control valve has been set, compressed air enters the cylinder rodless cavity through pressure-regulating valve with lower pressure, makes the pressure on the processing work less.After processing a period of time, workpiece is thrown more smoothly, and the voltage signal that the microcomputer setting is bigger is given pressure-regulating valve, increase flow, compressed air enters the cylinder rodless cavity through pressure-regulating valve with higher pressure, and the pressure on the processing work is increased, to improve the polishing working (machining) efficiency.When the fast end of polishing processing, supply with low-voltage signal again, workpiece is worked under lower tonnage, this helps reducing the roughness of surface of the work.
Because this equipment four variable-frequency motors can change the relative rotation speed of polishing disk and workpiece fast in process, simultaneously also can regulate cylinder location and change polish pressure in the process by digital valve, so can break through polish pressure in traditional glossing, the restriction of polishing speed difference, design polishing disk operational mode as shown in Figure 7, it is divided into startup, throwing in advance, thick throwing, smart throwing, cleaning, slow stopping and gear shift stage.The pressure that accurately changes stage by stage in the operational mode is very little to the direct active force of frangible workpiece, and very light load of its effect makes thickness of workpiece begin to change on thicker workpiece.Programmable soft start speed control can prevent that frangible workpiece from rocking, and reduces the fragmentation at edge.The soft ordering that stops to break away from polishing disk and reduces or eliminates the residual volume that always is bonded at workpiece on the polishing disk.
According to the different phase of polishing disk operation curve, set up the control law of the suitable different situations of a cover, be written as the operation of operating software control polishing disk.
For realizing these service requirements, adopt rule-based PID control method, this control method has and lags behind for a short time, and followability is good, at the process medium speed smoothness control accuracy height that travels at the uniform speed, impacts little feature in starting process.
In the slow stopping time, the polishing disk rotating speed adopts the software precomputation, is evenly slowed down until stopping by polishing speed, prevents the slow suddenly impact that stops workpiece.
Polishing fluid is supplied with workpiece surface temperature and crudy has the fundamental influence effect.The supply mode of polishing fluid is to produce constant voltage by hydraulic pump, additional a kind of constant temperature conveyer of polishing solution that is used for polissoir, have constant temperature, purification and liquid level detection alarm function, its structure comprises stainless steel cask, thermal insulation layer, polishing fluid delivery pump, return duct, filter, conductor refrigeration sheet, fin, radiator fan, temperature sensor and liquid level sensor.This device adopts conductor refrigeration sheet as temperature control element, and magnetic float liquid level switch is as liquid level detection alarm sensor, and the microporous fibre filter screen is as the polishing fluid filter purifying, have simple in structure, noiseless, power consumption is few, the characteristics of high reliability.
Automatically process for the realization polishing machine, the design microcomputer is the control flow of processing automatically,, behind the lathe power connection, computer and each detection system all enter duty.Computer enters the System self-test state, checks PC integrated circuit board, each sensor, servomotor, and pneumatic system, whether Circuits System etc. normally put in place, if unusual, reporting to the police appears in the microcomputer interface, if all are normal, then prepares to begin processing.If woven technical papers or the technology that is complementary with processing work is arranged in expert database, just directly call; As do not have satisfactory technical papers, and the related parameter that has of processing work then is set earlier, generally need be set, the time of different processing stages such as the rotating speed of polishing disk, centre wheel and external toothing up and down, the polish pressure in each stage etc.Call the technological parameter file that sets; microcomputer just begins automatic processing; elder generation's cylinder descends fast; polishing disk 3cm distance stops extremely down; polishing disk mounting board in the connection; after opening polishing fluid, cylinder falls slowly, test pressure; if pressure reaches the polish pressure of setting; pressurize, four variable-frequency motors start carries out workpiece processing, in the processing work process; monitoring system is monitored polish pressure always; polishing velocity; the flow of polishing fluid and process time; in case polish pressure; polishing velocity; the polishing fluid flow occurs unusual or arrive the value of setting process time, then stops four motors, interrupts processing.Close polishing fluid at last, cylinder rises, and arrival is unloaded the location of workpiece and stopped process finishing.
Control software requirement as can be seen from the flow chart and can constantly obtain adding states such as rotating speed in man-hour, pressure, position, polishing fluid flow, this just requires to control the status poll instruction that software ceaselessly issues processing.This function is finished by set a timer in program.Timer makes the every 0.1s of control software carry out a status poll to machining state, checks whether machining state is normal, if the undesired corresponding prompt information that just has shows.
Twin polishing system of processing software requirement is realized a good man-machine interaction interface, in these software systems, can observe and set various data, mainly contain the planetary gear rotating speed, upthrow CD speed, following polishing disk rotating speed, the external toothing rotating speed, cylinder piston-rod displacement and pressure etc. can also be observed controller state, servo condition, cylinder state, polishing fluid is carried and temperature.By the analysis process condition for the twin polishing crudy of different wafer materials and the influence of working (machining) efficiency, optimize machined parameters, set up twin polishing processing expert system, realize processing such as important photoelectron material ultra-smooth surface polishing such as several typical light electronic materials such as sapphire, monocrystalline silicon etc.Native system software carries out the software design of system prototype from realizing that above-mentioned functions is a starting point.
The interactive menu operation interface that this systems soft ware adopts multistage pull-down and pop-up menu to combine.Complete system is divided into five functional modules altogether: user management, process management, system debug, data management, help.In each functional module, some concrete sub-function module are arranged again.
Claims (4)
1, a kind of finishing method of wafer, this method mainly may further comprise the steps:
(1), wafer to be processed is placed on the planetary gear of polishing machine;
(2), start polishing machine, after the polishing machine self check is normal, technological parameter is set: the rotating speed control curve of each variable-frequency motor, the pressure control curve of cylinder, the temperature and the flow of polishing fluid according to wafer to be processed;
(3), the cylinder that is connected with last polishing disk of control descends, and the signal of receiving position sensor, when last polishing disk arrived the operating position, cylinder stopped, and will go up polishing disk and be connected with major axis;
(4), detect the polishing fluid conveying device normal after, and open polishing fluid;
(5), the control cylinder continue to descend, and detects pressure between cylinder and the last polishing disk by pressure sensor, when the pressure of pressure sensor reaches default pressure, starts each variable-frequency motor;
(6), rotate, pressure control curve controlled cylinder carries out wafer polishing according to rotating speed control curve controlled variable-frequency motor.
2, the finishing method of a kind of wafer as claimed in claim 1 is characterized in that: described finishing method also comprises:
(7), in polishing process, whether normal periodically detecting rotating speed or pressure, whether whether flow and temperature normal or polishing fluid normal, as are judged to be undesiredly, turn-off each variable-frequency motor, and the stop supplies polishing fluid;
(8), the control cylinder rises, finish when cylinder is returned to initial position when position sensor detects.
3, the finishing method of a kind of wafer as claimed in claim 1 or 2, it is characterized in that: in described (2), rotating speed control curve comprises: the startup stage, in advance throw speed stage, slightly throw speed stage, smartly throw speed stage, cleaning speed stage, slow stopping the stage; Pressure control curve comprises: starting pressure stage, precompression stage, slightly throw the pressure stage, smartly throw pressure stage, cleaning pressure stage, slow stopping the stage.
4, the finishing method of a kind of wafer as claimed in claim 3 is characterized in that: in described (6), at polishing in the stage, the rotating speed that detects as speed probe less than or greater than the operating rate in each stage, the control frequency converter increases or reduces rotating speed; The pressure that detects as pressure sensor less than or greater than the operating pressure in each stage, the controlled pressure control valve increases or reduces pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710068274 CN101069958A (en) | 2007-05-09 | 2007-05-09 | Crystal-chip polishing method |
Applications Claiming Priority (1)
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| CN102658521A (en) * | 2012-02-24 | 2012-09-12 | 浙江工业大学 | Dynamic-pressure finishing method based on hierarchical structured compound-elastic abrasive disk |
| CN103341457A (en) * | 2013-06-03 | 2013-10-09 | 上海华力微电子有限公司 | Silicon wafer rotating speed measuring device and measuring method thereof |
| CN104753439A (en) * | 2015-03-26 | 2015-07-01 | 苏州工业职业技术学院 | PID (piping and instrument diagram) intelligent speed regulating method of electric motor |
| CN104786109A (en) * | 2015-04-30 | 2015-07-22 | 哈尔滨工业大学 | Flexible joint thin rib bottom electric corrosion layer removal device |
| CN104875101A (en) * | 2014-02-28 | 2015-09-02 | 中国科学院宁波材料技术与工程研究所 | Polishing method and polishing system |
| CN105127879A (en) * | 2015-09-18 | 2015-12-09 | 哈尔滨理工大学 | Gantry type sapphire wafer double-face grinding/polishing machine and grinding and polishing method |
| CN107309784A (en) * | 2017-09-03 | 2017-11-03 | 湖北天宝光电科技有限公司 | A kind of two-sided fine grinding technology of sapphire cover plate |
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| CN109849084A (en) * | 2019-03-20 | 2019-06-07 | 邢台职业技术学院 | A kind of building plaque processing unit (plant) and its processing method |
| CN110434681A (en) * | 2019-07-24 | 2019-11-12 | 中国科学院上海光学精密机械研究所 | The two-sided high-precision polishing method of heavy caliber sapphire window element |
| CN111855363A (en) * | 2020-08-21 | 2020-10-30 | 宝钢特钢韶关有限公司 | Metallographic phase sample preparation method for steel sulfide inclusion |
| CN112454173A (en) * | 2020-11-02 | 2021-03-09 | 杭州白绝科技有限公司 | Semiconductor substrate polishing solution compensation device for high-end manufacturing |
| CN112692706A (en) * | 2020-12-22 | 2021-04-23 | 苏州诺亚智造科技有限公司 | Method for automatically positioning and locking glass polishing machine brush |
| CN112847015A (en) * | 2021-01-11 | 2021-05-28 | 中国科学院西安光学精密机械研究所 | Device and method for multi-robot cooperative processing of optical element |
| CN114309920A (en) * | 2021-12-23 | 2022-04-12 | 潮州三环（集团）股份有限公司 | Ceramic cleaver and preparation method thereof |
| CN114378717A (en) * | 2021-12-30 | 2022-04-22 | 江苏云力云科技有限公司 | Polishing jig for dynamic interactive touch screen |
| CN114559365A (en) * | 2022-02-09 | 2022-05-31 | 洛阳师范学院 | Robot PCB board grinder based on artificial intelligence thing networking |
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| CN102658521B (en) * | 2012-02-24 | 2014-08-06 | 浙江工业大学 | Dynamic-pressure finishing method based on hierarchical structured compound-elastic abrasive disk |
| CN102658521A (en) * | 2012-02-24 | 2012-09-12 | 浙江工业大学 | Dynamic-pressure finishing method based on hierarchical structured compound-elastic abrasive disk |
| CN103341457A (en) * | 2013-06-03 | 2013-10-09 | 上海华力微电子有限公司 | Silicon wafer rotating speed measuring device and measuring method thereof |
| CN104875101A (en) * | 2014-02-28 | 2015-09-02 | 中国科学院宁波材料技术与工程研究所 | Polishing method and polishing system |
| CN104753439B (en) * | 2015-03-26 | 2018-03-06 | 苏州工业职业技术学院 | A kind of PID intelligent speed-regulating methods of motor |
| CN104753439A (en) * | 2015-03-26 | 2015-07-01 | 苏州工业职业技术学院 | PID (piping and instrument diagram) intelligent speed regulating method of electric motor |
| CN104786109A (en) * | 2015-04-30 | 2015-07-22 | 哈尔滨工业大学 | Flexible joint thin rib bottom electric corrosion layer removal device |
| CN105127879A (en) * | 2015-09-18 | 2015-12-09 | 哈尔滨理工大学 | Gantry type sapphire wafer double-face grinding/polishing machine and grinding and polishing method |
| CN105127879B (en) * | 2015-09-18 | 2018-06-22 | 哈尔滨理工大学 | The method of planer-type sapphire wafer double-faced grinding/polishing machine and grinding and polishing |
| CN107309784A (en) * | 2017-09-03 | 2017-11-03 | 湖北天宝光电科技有限公司 | A kind of two-sided fine grinding technology of sapphire cover plate |
| CN108422306A (en) * | 2018-04-13 | 2018-08-21 | 玉明福 | A kind of burnishing device |
| CN109849084A (en) * | 2019-03-20 | 2019-06-07 | 邢台职业技术学院 | A kind of building plaque processing unit (plant) and its processing method |
| CN109849084B (en) * | 2019-03-20 | 2021-06-04 | 邢台职业技术学院 | Building decorative plate processing device and processing method thereof |
| CN110434681A (en) * | 2019-07-24 | 2019-11-12 | 中国科学院上海光学精密机械研究所 | The two-sided high-precision polishing method of heavy caliber sapphire window element |
| CN110434681B (en) * | 2019-07-24 | 2021-09-07 | 中国科学院上海光学精密机械研究所 | Double-side high-precision polishing method for large-caliber sapphire window element |
| CN111855363A (en) * | 2020-08-21 | 2020-10-30 | 宝钢特钢韶关有限公司 | Metallographic phase sample preparation method for steel sulfide inclusion |
| CN112454173A (en) * | 2020-11-02 | 2021-03-09 | 杭州白绝科技有限公司 | Semiconductor substrate polishing solution compensation device for high-end manufacturing |
| CN112454173B (en) * | 2020-11-02 | 2021-12-14 | 深圳市旭昌辉半导体有限公司 | Semiconductor substrate polishing solution compensation device for high-end manufacturing |
| CN112692706A (en) * | 2020-12-22 | 2021-04-23 | 苏州诺亚智造科技有限公司 | Method for automatically positioning and locking glass polishing machine brush |
| CN112847015A (en) * | 2021-01-11 | 2021-05-28 | 中国科学院西安光学精密机械研究所 | Device and method for multi-robot cooperative processing of optical element |
| CN112847015B (en) * | 2021-01-11 | 2022-07-19 | 中国科学院西安光学精密机械研究所 | Device and method for processing optical element by cooperation of multiple robots |
| CN114309920A (en) * | 2021-12-23 | 2022-04-12 | 潮州三环（集团）股份有限公司 | Ceramic cleaver and preparation method thereof |
| CN114378717A (en) * | 2021-12-30 | 2022-04-22 | 江苏云力云科技有限公司 | Polishing jig for dynamic interactive touch screen |
| CN114559365A (en) * | 2022-02-09 | 2022-05-31 | 洛阳师范学院 | Robot PCB board grinder based on artificial intelligence thing networking |
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