CN106425830A - Double-side grinding and polishing machine - Google Patents

Double-side grinding and polishing machine Download PDF

Info

Publication number
CN106425830A
CN106425830A CN201611000010.0A CN201611000010A CN106425830A CN 106425830 A CN106425830 A CN 106425830A CN 201611000010 A CN201611000010 A CN 201611000010A CN 106425830 A CN106425830 A CN 106425830A
Authority
CN
China
Prior art keywords
sun gear
double
polishing machine
grinding
lower wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201611000010.0A
Other languages
Chinese (zh)
Inventor
欧仕明
姜建军
石矿
欧国春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YIXING JINGKE OPTICAL INSTRUMENTS CO Ltd
Original Assignee
YIXING JINGKE OPTICAL INSTRUMENTS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YIXING JINGKE OPTICAL INSTRUMENTS CO Ltd filed Critical YIXING JINGKE OPTICAL INSTRUMENTS CO Ltd
Priority to CN201611000010.0A priority Critical patent/CN106425830A/en
Publication of CN106425830A publication Critical patent/CN106425830A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • B24B37/013Devices or means for detecting lapping completion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • B24B37/28Work carriers for double side lapping of plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention discloses a double-side grinding and polishing machine. The double-side grinding and polishing machine comprises an upper disc. A lower disc (1) is arranged under the upper disc. The upper disc and the lower disc (1) are driven by different motors and are opposite in rotation direction. An inner gear ring (2) is arranged at the outer edge side of the lower disc (1), and a sun gear (3) is arranged in the middle of the lower disc (1). Planet gears (4) serving as tools and clamps are placed on the lower disc (1). The two sides of each planet gear (4) are engaged with the inner gear ring (2) and the sun gear (3) correspondingly; and the inner gear ring (2) and the sun gear (3) are driven by different motors, and therefore the planet gears (4) can rotate and can also revolve around the sun gear (3) under the action of the inner gear ring (2) and the sun gear (3). By means of the double-side grinding and polishing machine, workpieces can form grinding motion with the speeds coordinated with one another in three or more directions in a carrier; the two sides are ground uniformly; resistance is small; efficiency is high; the workpieces are not damaged; and the double-side grinding and polishing machine is applicable to grinding and polishing of silicon wafers, sapphire substrates and epitaxial wafers.

Description

A kind of double-faced grinding and polishing machine
Technical field
The present invention relates to optical technical field, specifically a kind of the two-sided of Two sides milling and polishing can be carried out to workpiece and grind Grinding and polishing ray machine.
Background technology
In existing optical work processing, typically using the polisher lapper of one side, either grinding step is still polished Operation, optical work reprocesses another side after will first processing one side, wastes time and energy and production cost height.
Content of the invention
The purpose of the present invention is the problem for existing for prior art, and providing one kind can carry out twin grinding throwing to workpiece The double-faced grinding and polishing machine of light.
The purpose of the present invention is solved by the following technical programs:
A kind of double-faced grinding and polishing machine, including upper disk, it is characterised in that:The upper disk be arranged right below corresponding under Disk, upper disk and lower wall are using different Motor drives and both rotation directions conversely, the outer edge side of the lower wall is provided with internal tooth The middle part of circle and lower wall is provided with sun gear, the planetary gear being placed with lower wall as frock clamp, and the both sides of planetary gear are respectively Engage from ring gear and sun gear and ring gear and sun gear adopt different Motor drives so that planetary gear is in ring gear and too In the presence of sun wheel can rotation again can revolve round the sun around sun gear.
The ring gear is contrary with the rotation direction of sun gear and ring gear is identical with the rotation direction of planetary gear.
Described sun gear is stretched out the sun gear installing hole from the middle part of lower wall.
Described lower wall can rise pickup or dropping place piece installing in the presence of elevating mechanism.
Dish driving part is installed in the drive installation hole in the middle part of the sun gear, upper dish driving part protrude sun gear and on Dish driving part is provided with the positioning groove for fixing upper disk.
Described upper disk, lower wall, ring gear adopt four different Motor drives with sun gear.
The present invention has the following advantages compared to existing technology:
The present invention is by using different Motor drives and the contrary upper disk of both rotation directions and lower wall are ground to workpiece Polishing, and the setting by ring gear, sun gear and planetary gear so that workpiece had not only revolved round the sun but also the wandering star of rotation fortune in carrier Dynamic, the little not disfiguring workpiece of grinding resistance, and two sides Even Grinding production efficiency height, need the workpiece of Two sides milling and polishing to use double It is more fast again than the efficiency of single-side machine that face machine is ground polishing;The birth of the double-faced grinding and polishing machine and develop into a lot of industries Production efficiency bring improvement, it is adaptable to the silicon chip of optical glass industry, Sapphire Substrate and epitaxial wafer etc..
The double-faced grinding and polishing machine of the present invention enable to workpiece formed in carrier at least three directions speed mutual The grinding motion of coordination, the upper and lower surface of workpiece can be while uniformly grind and as upper disk, lower wall are while rotate, erratic star wheel moves Resistance is little, processes workpiece and particularly processes the workpiece of thin, fragility material not cracky.
The double-faced grinding and polishing machine of the present invention is provided with variable speed commutator apparatus, is obtained in that the positive and negative both direction of erratic star wheel oneself Transhipment is dynamic, the isostatic compensation of the grinding motion track of generation and cause upper disk, lower wall after the grinding of long period, its flatness It is basically unchanged, the correction wheel being additionally equipped with is for repairing the flatness error of upper disk, lower wall.
The double-faced grinding and polishing machine of the present invention adopts stepless time adjustment motor, starts and stop steadily, no impact, can be effectively Prevent crisp fritter workpiece crush, can also make various unlike materials work pieces process when, obtain preferable grinding rate;Employ counting Automatically control, when machine reaches preset amount of grinding(Revolution or thickness)When be autostop, therefore can realize multiple stage lathe While operating;In addition the variable pressing mechanism having to workpiece pressurization, when unlike material, the workpiece of size is processed, can basis Need arbitrarily to select light, in, the different pressures such as again.
Description of the drawings
Accompanying drawing 1 is the structural representation of the double-faced grinding and polishing machine of the present invention.
Wherein:1 lower wall;2 ring gears;3 sun gears;4 planetary gears;5 sun gear installing holes;6 drive peace Dress hole;Dish driving part on 7;8 positioning grooves.
Specific embodiment
The present invention is further illustrated with embodiment below in conjunction with the accompanying drawings.
As shown in Figure 1:A kind of double-faced grinding and polishing machine, including upper disk, upper disk be arranged right below corresponding under Disk 1, upper disk and lower wall 1 are using different Motor drives and both rotation directions conversely, the outer edge side of lower wall 1 is provided with ring gear 2 and the middle part of lower wall 1 is provided with sun gear 3, the planetary gear 4 being placed with lower wall 1 as frock clamp, the both sides of planetary gear 4 Engage from ring gear 2 and sun gear 3 respectively and ring gear 2 and sun gear 3 are using different Motor drives, ring gear 2 and the sun The rotation direction of wheel 3 is contrary and ring gear 2 is identical with the rotation direction of planetary gear 4 so that planetary gear 4 is in ring gear 2 and the sun In the presence of wheel 3 can rotation again can revolve round the sun around sun gear 3.Specific to mounting structure, sun gear 3 is from 1 middle part of lower wall too Stretch out in sun wheel installing hole 5 and lower wall 1 can rise pickup or dropping place piece installing in the presence of elevating mechanism;In sun gear 3 Dish driving part 7 is installed in the drive installation hole 6 in portion, upper dish driving part 7 protrudes sun gear 3 and upper dish driving part 7 is provided with Positioning groove for fixing upper disk.It is further to note that:Upper disk, lower wall 1, ring gear 2 and sun gear 3 are using four not Same Motor drive.
Below by specific operation process, the double-faced grinding and polishing machine of the present invention is further detailed.Concrete mistake Journey is as follows:
1st, air switch button is pressed, revolution display lamp is bright, represents that the stop button signal lighties of different operating content are bright;
2nd, host-initiated and stopping, being controlled by host-initiated button and stop button;
3rd, sand pump starts and stops, and is controlled by sand pump start button and stop button;
4th, the lifting of upper disk is controlled by the inching button for controlling raising and lowering respectively, impacts work during concrete raising and lowering Part, at 20 millimeters of upper disk and workpiece distance, presses slow drop button so as to slowly contact workpiece, after contact workpiece really, presses Button once drops soon so as to after full contact, just can start main frame;
5th, before host-initiated, speed regulator potentiometer should be screwed to zero position, after startup, slowly adjusts speed-regulating potentiometer so as to The speed needed for grinding is obtained, at this moment the speed of main shaft is shown by tachoscope, the rotating speed of grinding is stepless time adjustment;
6th, amount of grinding is by counting mode control, and start is front preset for required grinding number(Preset front counting relay is reset to Zero).During work, when the revolution of operation is consistent with preset number, just autostop, if next amount of grinding with previous identical if be not required to Revolution is reinitialized, only need to click counting relay SR;
7th, grinding pressure, the machine starts to grinding in a cycle for finishing in grinding, can automatically provide three kinds of different grindings Pressure, divides four-stage successively, i.e. light pressure, middle pressure, weight and grinding(Light pressure), the selection of abrasive power, should be according to the material of workpiece Matter, quantity, the size shape of abradant surface, the factor such as formula of amount of grinding and abrasive material is determining.The various pressure stages are lasting Time is also accordingly to be controlled by the preset rotating speed of enumerator, and the time that certain pressure needs is long, and its preset revolution is just many, needs The time that wants is short, and its preset revolution is just few, when certain pressure is not needed, only need to be by preset for relay zero-bit;
8th, when machinery requirement dallies, switching button is placed in stop position, now main frame has been turned on, then adjusts speed governing current potential Device, obtains the required speed that dallies, when work is ground, it is necessary to which switching button is placed in operating position, otherwise, no light, in, Weight power;
9th, lapping liquid supply, can directly press sand pump start button, sand pump startup optimization, and lapping liquid is voluntarily imported from conduit;
10th, after grinding terminates, section switch power supply and source of the gas is asked, and speed regulator potentiometer is screwed to zero position;
11st, the machine adds polishing fluid carry out table as polishing cloth during twin polishing, is please pasted on upper and lower abrasive disk Mirror polish.
The present invention is by using different Motor drives and the contrary upper disk of both rotation directions and lower wall 1 are carried out to workpiece Grinding and polishing, and the setting by ring gear 2, sun gear 3 and planetary gear 4 so that workpiece had not only been revolved round the sun but also rotation in carrier Wandering star motion, the little not disfiguring workpiece of grinding resistance, and two sides Even Grinding production efficiency height, need Two sides milling and polishing It is more fast again than the efficiency of single-side machine that workpiece Double-plate machine is ground polishing;The birth of the double-faced grinding and polishing machine and develop into The production efficiency of a lot of industries brings improvement, it is adaptable to the silicon chip of optical glass industry, Sapphire Substrate and epitaxial wafer etc.. The double-faced grinding and polishing machine enables to the mutually coordinated grinding motion of speed that workpiece forms at least three directions in carrier, The upper and lower surface of workpiece can be while uniformly grind and as upper disk, lower wall 1 are while rotate, 4 resistance of motion of erratic star wheel is little, processing work Part particularly processes the workpiece of thin, fragility material not cracky.
The double-faced grinding and polishing machine of the present invention is provided with variable speed commutator apparatus, is obtained in that the positive and negative both direction of erratic star wheel 4 Spinning motion, the isostatic compensation of the grinding motion track of generation and cause upper disk, lower wall 1 after the grinding of long period, which is put down Face degree is basically unchanged, and the correction wheel being additionally equipped with is for repairing the flatness error of upper disk, lower wall 1.The double-faced grinding and polishing machine Using stepless time adjustment motor, start and stop steadily, no impact, crisp fritter workpiece can be effectively prevented and crushed, can also make various not During the work pieces process of same material, preferable grinding rate is obtained;Employ counting to automatically control, when machine reaches preset grinding Amount(Revolution or thickness)When be autostop, therefore can realize multiple stage lathe at the same operation;In addition have to workpiece pressurization Variable pressing mechanism, when unlike material, the workpiece of size is processed, arbitrarily can select as needed light, in, the different pressures such as again Power.
Above example technological thought only to illustrate the invention, it is impossible to which protection scope of the present invention is limited with this, every According to technological thought proposed by the present invention, any change that is done on the basis of technical scheme, the scope of the present invention is each fallen within Within;The technology that the present invention is not directed to all can be realized by prior art.

Claims (6)

1. a kind of double-faced grinding and polishing machine, including upper disk, it is characterised in that:The upper disk be arranged right below corresponding under Disk(1), upper disk and lower wall(1)Using different Motor drives and both rotation directions conversely, the lower wall(1)Outer edge side It is provided with ring gear(2)And lower wall(1)Middle part be provided with sun gear(3), in lower wall(1)On be placed with planet as frock clamp Wheel(4), planetary gear(4)Both sides respectively with ring gear(2)And sun gear(3)Engagement and ring gear(2)And sun gear(3)Using Different Motor drive so that planetary gear(4)In ring gear(2)And sun gear(3)In the presence of can rotation again can surround too Sun wheel(3)Revolution.
2. double-faced grinding and polishing machine according to claim 1, it is characterised in that:The ring gear(2)And sun gear(3)'s The contrary and ring gear of rotation direction(2)And planetary gear(4)Rotation direction identical.
3. double-faced grinding and polishing machine according to claim 1, it is characterised in that:Described sun gear(3)From lower wall(1)In The sun gear installing hole in portion(5)In stretch out.
4. the double-faced grinding and polishing machine according to claim 1 or 3, it is characterised in that:Described lower wall(1)Can be in lifting Rise pickup or dropping place piece installing in the presence of mechanism.
5. double-faced grinding and polishing machine according to claim 3, it is characterised in that:The sun gear(3)The driving peace at middle part Dress hole(6)In dish driving part is installed(7), upper dish driving part(7)Protrude sun gear(3)And upper dish driving part(7)It is provided with Positioning groove for fixing upper disk(8).
6. double-faced grinding and polishing machine according to claim 1, it is characterised in that:Described upper disk, lower wall(1), ring gear (2)And sun gear(3)Using four different Motor drives.
CN201611000010.0A 2016-11-14 2016-11-14 Double-side grinding and polishing machine Pending CN106425830A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611000010.0A CN106425830A (en) 2016-11-14 2016-11-14 Double-side grinding and polishing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201611000010.0A CN106425830A (en) 2016-11-14 2016-11-14 Double-side grinding and polishing machine

Publications (1)

Publication Number Publication Date
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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107097121A (en) * 2017-07-04 2017-08-29 大连桑姆泰克工业部件有限公司 Optical polish apparatus and system
CN107263278A (en) * 2017-07-03 2017-10-20 适新科技(苏州)有限公司 Twin grinder and grinding technics
CN107838756A (en) * 2017-11-29 2018-03-27 重庆水工机械有限公司 A kind of bearing sander
CN108068008A (en) * 2017-12-01 2018-05-25 哈尔滨理工大学 Fluid drive formula optical glass screen double-faced grinding/polishing machine
CN108068003A (en) * 2017-12-29 2018-05-25 上海驰声新材料有限公司 The method and apparatus that a kind of non-crystaline amorphous metal glue-feeder quickly grinds removal
CN108481184A (en) * 2018-06-08 2018-09-04 新乡日升数控轴承装备股份有限公司 A kind of Stop Control System and control method of grinder
CN108687650A (en) * 2017-04-05 2018-10-23 创技股份有限公司 Two sides grinding device
CN108789133A (en) * 2018-07-13 2018-11-13 航天精工股份有限公司 A kind of grinding load plate and grinding device suitable for bearing ring
CN110465877A (en) * 2019-08-08 2019-11-19 浙江大学 A kind of full-automatic loading and unloading system of wafer for polissoir
CN111136574A (en) * 2019-12-31 2020-05-12 淮安信息职业技术学院 Double-sided grinding and polishing machine
CN111975627A (en) * 2020-08-27 2020-11-24 中国电子科技集团公司第十一研究所 Grinding method of irregular tellurium-zinc-cadmium wafer
CN112372377A (en) * 2020-10-30 2021-02-19 中国电子科技集团公司第十一研究所 Polishing method of irregular tellurium-zinc-cadmium wafer
CN113611593A (en) * 2021-08-02 2021-11-05 中国电子科技集团公司第四十六研究所 Method for controlling warping morphology of ultrathin germanium sheet
CN114290230A (en) * 2021-12-31 2022-04-08 华侨大学 Device and method for laser-induced plasma-assisted double-sided grinding of transparent material
CN114850976A (en) * 2022-05-26 2022-08-05 浙江工业大学 Efficient high-precision machining method for bottom surface of four-way valve seat
CN116273259A (en) * 2023-04-28 2023-06-23 广西鑫来农业发展有限公司 Polishing machine and polishing method for polished rice processing
CN116273259B (en) * 2023-04-28 2024-06-07 广西鑫来农业发展有限公司 Polishing machine and polishing method for polished rice processing

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108687650B (en) * 2017-04-05 2022-05-03 创技股份有限公司 Double-side grinding device
CN108687650A (en) * 2017-04-05 2018-10-23 创技股份有限公司 Two sides grinding device
CN107263278A (en) * 2017-07-03 2017-10-20 适新科技(苏州)有限公司 Twin grinder and grinding technics
CN107097121A (en) * 2017-07-04 2017-08-29 大连桑姆泰克工业部件有限公司 Optical polish apparatus and system
CN107838756A (en) * 2017-11-29 2018-03-27 重庆水工机械有限公司 A kind of bearing sander
CN107838756B (en) * 2017-11-29 2023-11-28 重庆水工机械有限公司 Bearing polisher
CN108068008A (en) * 2017-12-01 2018-05-25 哈尔滨理工大学 Fluid drive formula optical glass screen double-faced grinding/polishing machine
CN108068003A (en) * 2017-12-29 2018-05-25 上海驰声新材料有限公司 The method and apparatus that a kind of non-crystaline amorphous metal glue-feeder quickly grinds removal
CN108481184A (en) * 2018-06-08 2018-09-04 新乡日升数控轴承装备股份有限公司 A kind of Stop Control System and control method of grinder
CN108789133A (en) * 2018-07-13 2018-11-13 航天精工股份有限公司 A kind of grinding load plate and grinding device suitable for bearing ring
CN110465877A (en) * 2019-08-08 2019-11-19 浙江大学 A kind of full-automatic loading and unloading system of wafer for polissoir
CN111136574A (en) * 2019-12-31 2020-05-12 淮安信息职业技术学院 Double-sided grinding and polishing machine
CN111975627A (en) * 2020-08-27 2020-11-24 中国电子科技集团公司第十一研究所 Grinding method of irregular tellurium-zinc-cadmium wafer
CN112372377A (en) * 2020-10-30 2021-02-19 中国电子科技集团公司第十一研究所 Polishing method of irregular tellurium-zinc-cadmium wafer
CN113611593A (en) * 2021-08-02 2021-11-05 中国电子科技集团公司第四十六研究所 Method for controlling warping morphology of ultrathin germanium sheet
CN114290230A (en) * 2021-12-31 2022-04-08 华侨大学 Device and method for laser-induced plasma-assisted double-sided grinding of transparent material
CN114850976A (en) * 2022-05-26 2022-08-05 浙江工业大学 Efficient high-precision machining method for bottom surface of four-way valve seat
CN114850976B (en) * 2022-05-26 2024-04-19 浙江工业大学 High-efficiency high-precision machining method for bottom surface of valve seat of four-way valve
CN116273259A (en) * 2023-04-28 2023-06-23 广西鑫来农业发展有限公司 Polishing machine and polishing method for polished rice processing
CN116273259B (en) * 2023-04-28 2024-06-07 广西鑫来农业发展有限公司 Polishing machine and polishing method for polished rice processing

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Application publication date: 20170222