CN110465877A - A kind of full-automatic loading and unloading system of wafer for polissoir - Google Patents
A kind of full-automatic loading and unloading system of wafer for polissoir Download PDFInfo
- Publication number
- CN110465877A CN110465877A CN201910728658.7A CN201910728658A CN110465877A CN 110465877 A CN110465877 A CN 110465877A CN 201910728658 A CN201910728658 A CN 201910728658A CN 110465877 A CN110465877 A CN 110465877A
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- CN
- China
- Prior art keywords
- manipulator
- wafer
- star wheel
- erratic star
- gear ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to semiconductor electronic component technical field of processing equipment, in particular to the full-automatic loading and unloading system of a kind of wafer for polissoir.Including pedestal, pedestal upper surface is equipped with gear ring and sun gear, intermarginal uniformly distributed multiple erratic star wheels outside gear ring inner edge circumference and sun gear, and erratic star wheel is equipped with multiple wafer slide glasses position, and the price fixing for polishing wafer is arranged below in erratic star wheel；Laser induced is additionally provided on erratic star wheel, the pedestal of gear ring side is equipped with laser sensor, and driving mechanism is equipped in pedestal and is connected for driven gear ring, sun gear, erratic star wheel and price fixing rotation, driving mechanism with laser sensor；Manipulator platform is set to pedestal side, and the first manipulator and the second manipulator are set on manipulator platform, and visual pattern identification module is equipped on the second manipulator.The present invention realizes the full-automation of equipment, replaces artificial loading and unloading completely, improves production efficiency and safety while saving cost of labor, and the automation for whole polishing producing line lays the foundation.
Description
Technical field
It is the invention belongs to semiconductor electronic component technical field of processing equipment, in particular to a kind of for polissoir
The full-automatic loading and unloading system of wafer.
Background technique
Semicon industry be always in China's manufacturing industry weak plate, the development of semiconductor equipment and technology seriously lag behind
Foreign countries, many key equipments and technology all rely on import, and autonomy nevertheless suffers from yoke and constraint.In recent years, with demand
Lasting increase and country also increase support to chip technology, domestic semiconductor production and processing technology are obviously improved, and
Domestic emerged rapidly many semiconductor equipments and processor, including manufacture silicon wafer molding, cut, are thinned, grinding, polishing etc.
The manufacturer of various semiconductor productions and process equipment, wherein equipment corresponding to polishing process is the most key, and also difficulty is maximum.
Although different size and the polissoir of type are developed success, home equipment is restrict there are still many technical problems
Further development, such as domestic polissoir machining accuracy and import equipment still have gap, stabilization of equipment performance still needs
It improves, and what is especially fallen behind is that degree of automation and efficiency is not high.
Summary of the invention
The technical problem to be solved by the present invention is to overcome deficiency in the prior art, provide a kind of for polissoir
The full-automatic loading and unloading system of wafer.
In order to solve the above technical problems, solution of the invention is:
A kind of full-automatic loading and unloading system of the wafer for polissoir, including pedestal, the first manipulator, the second machine are provided
Tool hand and manipulator platform；
Pedestal upper surface is equipped with gear ring, and gear ring center is equipped with sun gear, outside gear ring inner edge circumference and sun gear it is intermarginal
The multiple erratic star wheels of cloth, erratic star wheel are equipped with multiple wafer slide glasses position, and the price fixing for polishing wafer is arranged below in erratic star wheel；Wandering star
Laser induced is additionally provided on wheel, the pedestal of gear ring side is equipped with laser sensor, and driving mechanism is equipped in pedestal for driving
Movable tooth circle, sun gear, erratic star wheel and price fixing rotation, driving mechanism are connected with laser sensor；
Manipulator platform is set to pedestal side, and the first manipulator and the second manipulator are set on manipulator platform, manipulator
Feeding terminal and blanking terminal are additionally provided on platform, where feeding terminal and blanking terminal by the manipulator platform of side
Side is correspondingly provided with feeding cassette and blanking the storage box；Visual pattern identification module is installed on the second manipulator.
As an improvement the first manipulator is six degree of freedom manipulator, the machinery for clamping wafer is installed in front end
Pawl is able to achieve edge clamping and transfer to wafer.
As an improvement being hatch frame at the top of feeding terminal, and outer rim is equipped with multiple positioning columns；It can store every time
Wafer, and its position immobilizes relative to polishing machine main body, is able to achieve positioning function.
As an improvement the second manipulator is six degree of freedom manipulator, front end is equipped with the suction for picking up wafer
Disk is able to achieve absorption and transfer to wafer.
As an improvement erratic star wheel quantity is 5, each erratic star wheel is equipped with 3 wafer slide glass positions.
Visual pattern identification module is the visual pattern identification module of the CV-X series of Keyemce company production.
Operation workflow of the invention is: wafer to be processed being stored in feeding cassette, the mechanical claw clip of the first manipulator
The firmly edge of wafer to be processed, is then moved to right above feeding terminal, and mechanical arm is slowly vertically moved down again, put
It is placed in the center of feeding terminal；Then the second manipulator passes through visual performance, then to be processed in feeding terminal
Wafer is picked up and is transferred to by sucker in first erratic star wheel of device Host, the three pieces wafer load in first erratic star wheel
After the completion, the gear ring in equipment body, sun gear and erratic star wheel rotation, stop after laser sensor senses second erratic star wheel
Only, the wafer to be processed in feeding terminal is transferred in second erratic star wheel of device Host by the second manipulator again, according to this
Then operation starts to process until 15 wafers completely fill out erratic star wheel；After processing is completed, mechanical according to feeding process, second
The wafer completed the process is vertically picked up and is transferred in blanking terminal and stored by hand, and then the first manipulator passes through mechanical claw clip
It stays and expects the edge of wafer in terminal, move to above blanking the storage box, then after being rotated by 90 °, wafer is perpendicularly inserted into
Corresponding position in blanking the storage box, until 15 wafers all take.
Compared with prior art, the beneficial effect of the invention patent is:
The present invention realizes the full-automation of equipment, replaces artificial loading and unloading completely, improves while saving cost of labor
Production efficiency and safety, the automation for whole polishing producing line lay the foundation.
Detailed description of the invention
Fig. 1 is top view of the present invention；
Fig. 2 is normal axomometric drawing of the present invention；
Fig. 3 is the laser sensor position enlarged drawing in the present invention；
Fig. 4 is the feeding terminal enlarged drawing in the present invention；
Fig. 5 is that the second manipulator in the present invention clamps wafer to feeding terminal schematic diagram；
Fig. 6 is that wafer is picked up from feeding transfer and shifts schematic diagram by the first manipulator in the present invention；
Fig. 7 is that wafer is shifted and is placed in erratic star wheel schematic diagram by the first manipulator in the present invention；
Fig. 8 is that wafer is placed in blanking terminal schematic diagram by the first manipulator in the present invention；
Fig. 9 is that wafer is picked up and shifts schematic diagram by the second manipulator in the present invention；
Figure 10 is that wafer is picked up and is placed in blanking the storage box schematic diagram by the second manipulator in the present invention.
The label in accompanying drawing is: 1- pedestal, 2- gear ring, 3- sun gear, 4- price fixing, 5- erratic star wheel, 6- wafer, 7- laser sense
Answer piece, 8- laser sensor, 9- manipulator platform, 10- feeding terminal, the first manipulator of 11-, 12- feeding cassette, under 13-
Expect the storage box, the second manipulator of 14-, 15- blanking terminal, 101- positioning column.
Specific embodiment
Present invention is further described in detail with specific embodiment with reference to the accompanying drawing:
A kind of full-automatic loading and unloading system of wafer for polissoir as shown in Figure 1, Figure 2, Figure 3 and Figure 4, including base
The 1, first manipulator 11 of seat, the second manipulator 14 and manipulator platform 9.
1 upper surface of pedestal is equipped with gear ring 2, and 2 center of gear ring is equipped with sun gear 3, outside 2 inner edge circumference of gear ring and sun gear 3
Intermarginal uniformly distributed 5 erratic star wheels 5, erratic star wheel 5 are equipped with 36 slide glass positions of wafer.Laser induced 7 is additionally provided on erratic star wheel 5, tooth
The pedestal 1 for enclosing 2 sides is equipped with laser sensor 8, and driving mechanism is equipped in pedestal 1 for driven gear ring 2, sun gear 3 and trip
Star-wheel 5 rotates, and driving mechanism is connected with laser sensor 8.Laser sensor 8 can sense laser induced on erratic star wheel 5
Piece 7, to be positioned to erratic star wheel 5, as shown in Figure 3.Price fixing 4 is connect with driving mechanism, and transmission systems at different levels drive respectively
4 synergic rotation of gear ring 2, sun gear 3 and price fixing realizes wafer polishing.
Manipulator platform 9 is set to 1 side of pedestal, and the first manipulator 11 and the second manipulator 14 are set on manipulator platform 9,
Feeding terminal 10 and blanking terminal 15,15 place of feeding terminal 10 and blanking terminal are additionally provided on manipulator platform 9
9 side of manipulator platform of side is correspondingly provided with feeding cassette 12 and blanking the storage box 13.Vision is installed on second manipulator 14
Picture recognition module can guarantee wafer 6 by being placed in erratic star wheel 5 clockwise or counterclockwise.
First manipulator 11 is six degree of freedom manipulator, and front end installs the gripper for clamping wafer 6, is able to achieve pair
The edge of wafer 6 clamps and transfer.Second manipulator 14 is six degree of freedom manipulator, and front end is equipped with for picking up wafer 6
Sucker, be able to achieve the absorption and transfer to wafer 6.
It is hatch frame at the top of feeding terminal 10, and outer rim is equipped with 3 positioning columns 101.Wafer can be stored every time
6, and its position immobilizes relative to polishing machine main body, is able to achieve positioning function.
Feeding cassette 12 can store wafer 6.
Blanking the storage box 13 can store wafer 6 after processing is completed.
Operation workflow of the invention is:
Wafer 6 to be processed is stored in feeding cassette 12, the gripper of the first manipulator 11 clamps wafer 6 to be processed
Then edge is moved to right above feeding terminal 10, mechanical arm slowly vertically moves down again, is placed on feeding transfer
Stand 10 center, realize wafer 6 positioning, as shown in Figure 5；Then the second manipulator 14 utilizes visual pattern identification module
It identifies position and the quantity of wafer, then the wafer to be processed 6 in feeding terminal 10 is picked up by sucker and is transferred to equipment
In first erratic star wheel 5 of host, as shown in Figure 6 and Figure 7, after the completion of three wafers 6 in first erratic star wheel 5 load, if
Gear ring 2, sun gear 3 and erratic star wheel 5 in standby main body rotate, and stop after laser sensor 8 senses second erratic star wheel 5,
Wafer to be processed 6 in feeding terminal 10 is transferred in second erratic star wheel of device Host by the second manipulator 14 again, according to
Then this operation starts to process until 15 wafers 6 completely fill out erratic star wheel 5；After processing is completed, according to feeding process, second
The wafer 6 completed the process is vertically picked up and is transferred in blanking terminal 15 and stored by manipulator 14, as shown in figure 8, then
One manipulator 11 clamps the edge of wafer 6 in blanking terminal 15 by gripper, moves to 13 top of blanking the storage box, then revolve
After turning 90 °, wafer 6 is perpendicularly inserted into corresponding position in blanking the storage box 13, as shown in Figure 9 and Figure 10, until 15 platelets
Circle 6 all takes.
Finally it should be noted that the above enumerated are only specific embodiments of the present invention.It is clear that the invention is not restricted to
Above embodiments can also have many variations.Those skilled in the art can directly lead from present disclosure
Out or all deformations for associating, such as 5 numbers of erratic star wheel and the quantity etc. for processing wafer 6, it is considered as guarantor of the invention
Protect range.
Claims (5)
1. a kind of full-automatic loading and unloading system of wafer for polissoir, which is characterized in that including pedestal, the first manipulator,
Second manipulator and manipulator platform；
The pedestal upper surface is equipped with gear ring, is equipped with price fixing in gear ring, and gear ring center is equipped with sun gear, gear ring inner edge circumference with
Intermarginal uniformly distributed multiple erratic star wheels, erratic star wheel are equipped with multiple wafer slide glasses position outside sun gear, and erratic star wheel is arranged below for wafer
The price fixing of polishing；Laser induced is additionally provided on erratic star wheel, the pedestal of gear ring side is equipped with laser sensor, is equipped in pedestal
Driving mechanism is connected for driven gear ring, sun gear, erratic star wheel and price fixing rotation, driving mechanism with laser sensor；
The manipulator platform is set to pedestal side, and the first manipulator and the second manipulator are set on manipulator platform, manipulator
Feeding terminal and blanking terminal are additionally provided on platform, where feeding terminal and blanking terminal by the manipulator platform of side
Side is correspondingly provided with feeding cassette and blanking the storage box；Visual pattern identification module is installed on the second manipulator.
2. loading and unloading system according to claim 1, which is characterized in that first manipulator is that six degree of freedom is mechanical
The gripper for clamping wafer is installed in hand, front end, is able to achieve edge clamping and transfer to wafer.
3. loading and unloading system according to claim 1, which is characterized in that be opening knot at the top of the feeding terminal
Structure, and outer rim is equipped with multiple positioning columns；Wafer can be stored every time, and its position immobilizes relative to polishing machine main body,
It is able to achieve positioning function.
4. loading and unloading system according to claim 1, which is characterized in that second manipulator is that six degree of freedom is mechanical
Hand, front end are equipped with the sucker for picking up wafer, are able to achieve absorption and transfer to wafer.
5. loading and unloading system according to claim 1, which is characterized in that the erratic star wheel quantity is 5, each wandering star
Wheel is equipped with 3 wafer slide glass positions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910728658.7A CN110465877A (en) | 2019-08-08 | 2019-08-08 | A kind of full-automatic loading and unloading system of wafer for polissoir |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910728658.7A CN110465877A (en) | 2019-08-08 | 2019-08-08 | A kind of full-automatic loading and unloading system of wafer for polissoir |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110465877A true CN110465877A (en) | 2019-11-19 |
Family
ID=68511643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910728658.7A Pending CN110465877A (en) | 2019-08-08 | 2019-08-08 | A kind of full-automatic loading and unloading system of wafer for polissoir |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110465877A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112917359A (en) * | 2021-01-21 | 2021-06-08 | 合肥范平塑胶科技有限公司 | Silicon wafer forming and polishing equipment for chip manufacturing and polishing method thereof |
| CN113246004A (en) * | 2021-06-08 | 2021-08-13 | 四川上特科技有限公司 | Wafer end surface finish grinding device |
| CN114261751A (en) * | 2021-12-28 | 2022-04-01 | 西安奕斯伟材料科技有限公司 | Wafer feeding system and feeding and discharging method |
| CN117001448A (en) * | 2023-10-07 | 2023-11-07 | 通威微电子有限公司 | Grinding device and control method thereof |
Citations (4)
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| CN86107726A (en) * | 1985-12-25 | 1987-06-17 | 狄普敦股份有限公司 | Automatic centrifugal running barrel working machine |
| US20090280727A1 (en) * | 2008-05-09 | 2009-11-12 | Lakshmanan Karuppiah | Polishing system with three headed carousel |
| CN106002606A (en) * | 2016-05-16 | 2016-10-12 | 苏州辰轩光电科技有限公司 | Polishing and wax pasting machine for sapphire substrate |
| CN106425830A (en) * | 2016-11-14 | 2017-02-22 | 宜兴市晶科光学仪器有限公司 | Double-side grinding and polishing machine |
-
2019
- 2019-08-08 CN CN201910728658.7A patent/CN110465877A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86107726A (en) * | 1985-12-25 | 1987-06-17 | 狄普敦股份有限公司 | Automatic centrifugal running barrel working machine |
| US20090280727A1 (en) * | 2008-05-09 | 2009-11-12 | Lakshmanan Karuppiah | Polishing system with three headed carousel |
| CN106002606A (en) * | 2016-05-16 | 2016-10-12 | 苏州辰轩光电科技有限公司 | Polishing and wax pasting machine for sapphire substrate |
| CN106425830A (en) * | 2016-11-14 | 2017-02-22 | 宜兴市晶科光学仪器有限公司 | Double-side grinding and polishing machine |
Non-Patent Citations (1)
| Title |
|---|
| 刘文波，陈白宁，段智敏: "《工业机器人》", 31 December 2007 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112917359A (en) * | 2021-01-21 | 2021-06-08 | 合肥范平塑胶科技有限公司 | Silicon wafer forming and polishing equipment for chip manufacturing and polishing method thereof |
| CN113246004A (en) * | 2021-06-08 | 2021-08-13 | 四川上特科技有限公司 | Wafer end surface finish grinding device |
| CN113246004B (en) * | 2021-06-08 | 2021-10-12 | 四川上特科技有限公司 | Wafer end surface finish grinding device |
| CN114261751A (en) * | 2021-12-28 | 2022-04-01 | 西安奕斯伟材料科技有限公司 | Wafer feeding system and feeding and discharging method |
| CN117001448A (en) * | 2023-10-07 | 2023-11-07 | 通威微电子有限公司 | Grinding device and control method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191119 |
|
| RJ01 | Rejection of invention patent application after publication |