CN114261751A - Wafer feeding system and feeding and discharging method - Google Patents
Wafer feeding system and feeding and discharging method Download PDFInfo
- Publication number
- CN114261751A CN114261751A CN202111627519.9A CN202111627519A CN114261751A CN 114261751 A CN114261751 A CN 114261751A CN 202111627519 A CN202111627519 A CN 202111627519A CN 114261751 A CN114261751 A CN 114261751A
- Authority
- CN
- China
- Prior art keywords
- wafer
- wafers
- polished
- loading
- unloading
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The embodiment of the invention discloses a wafer blanking system and a wafer blanking method; the wafer loading and unloading system comprises: a feeding buffer area capable of temporarily storing a plurality of wafers to be polished; a blanking cache area capable of temporarily storing a plurality of polished wafers; the swinging mechanical arm is used for simultaneously transferring a plurality of wafers to be polished, which are temporarily stored in the feeding cache area, to corresponding carriers; and simultaneously transferring a plurality of polished wafers in each carrier to the blanking cache area.
Description
Technical Field
The embodiment of the invention relates to the technical field of semiconductors, in particular to a wafer blanking system and a wafer blanking method.
Background
At present, in an automatic loading and unloading system of a wafer double-sided polishing device, a blanking cache area is a fixed mode, and an independent mechanical arm needs to be added to transfer polished wafers in the blanking cache area to a wafer cassette, so that the manufacturing cost of the device is correspondingly increased due to the addition of the mechanical arm, and the later maintenance cost is also increased.
On the other hand, in the automatic loading and unloading system of the existing wafer double-side polishing equipment, both the loading robot and the unloading robot can only complete the loading and unloading process through single-chip transmission, so that the loading and unloading time of the wafer is long, and the production efficiency of the wafer is seriously influenced.
Disclosure of Invention
In view of the above, embodiments of the present invention are directed to a wafer unloading system and a wafer unloading method; the feeding and discharging time of the wafer can be shortened, the production efficiency is improved, and meanwhile, the manufacturing cost and the later maintenance cost of the equipment are reduced.
The technical scheme of the embodiment of the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a wafer loading and unloading system, including:
a feeding buffer area capable of temporarily storing a plurality of wafers to be polished;
a blanking cache area capable of temporarily storing a plurality of polished wafers;
the swinging mechanical arm is used for simultaneously transferring a plurality of wafers to be polished, which are temporarily stored in the feeding cache area, to corresponding carriers; and simultaneously transferring a plurality of polished wafers in each carrier to the blanking cache area.
In a second aspect, an embodiment of the present invention provides a method for feeding a wafer, where the method for feeding a wafer includes:
after absorbing a plurality of wafers to be polished in a loading buffer area by using a swinging mechanical arm, simultaneously transferring the plurality of wafers to be polished into corresponding carriers;
and after the wafers to be polished are polished on the two sides, sequentially adsorbing the polished wafers in each carrier by using the swinging mechanical arm, and transferring the polished wafers to a blanking cache area.
The embodiment of the invention provides a wafer blanking system and a wafer blanking method; a plurality of wafers to be polished temporarily stored in the feeding buffer area can be transferred to any corresponding carrier by swinging the mechanical arm; the polished wafers in each carrier can be transferred to a blanking cache area simultaneously by swinging the mechanical arm, so that the wafer loading and unloading time is shortened, and the production efficiency is improved; meanwhile, in the wafer loading and unloading system provided by the embodiment of the invention, the wafer loading and unloading process is completed by utilizing the swinging mechanical arm, so that the number of robot equipment is reduced, and the manufacturing cost and the later maintenance cost of the robot equipment are reduced.
Drawings
Fig. 1 is a schematic view of a wafer loading and unloading system used in a conventional technical solution according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a system for unloading a wafer according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating a state of a swing robot arm after a wafer loading and unloading process according to an embodiment of the present invention is completed;
fig. 4 is a schematic diagram illustrating a wafer blanking process according to an embodiment of the present invention;
fig. 5 is a schematic view illustrating another wafer blanking process according to an embodiment of the present invention;
fig. 6 is a schematic flow chart illustrating a method for feeding a wafer according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1, a wafer loading and unloading system 1A used in double-side polishing of a wafer W in a conventional technical solution is shown, and as shown in fig. 1, the wafer loading and unloading system 1A specifically includes: the device comprises a bearing device 10, a feeding area 20A and a discharging area 30A; wherein the content of the first and second substances,
the bearing device 10 comprises a grinding disc 101, a plurality of carriers 102 and an inner pin ring 103, wherein the carriers 102 are arranged on the grinding disc 101; wherein, the grinding disc 101 is used for grinding the wafer W (the circular area filled with black in the figure), the carrier 102 is used for fixing the wafer W, and the inner pin ring 103 is used for driving the carrier 102 to rotate, so that the wafer W is polished by the rotation of the grinding disc 101 and the carrier 102; each carrier 102 is provided with a carrier identification hole 1021;
the loading area 20A includes a first wafer cassette 201, a loading robot 202 and a loading buffer area 203A; after the wafer W to be polished is taken out from the first wafer cassette 201 and placed in the loading buffer area 203A by the loading manipulator 2021 arranged at the end of the loading robot 202, the wafer W to be polished in the loading buffer area 203A is transferred to the carrier 102 by the vacuum chuck 2022 arranged at the end of the loading robot 202; it should be noted that, as shown in fig. 1, in the wafer loading and unloading system 1A, only a single wafer W to be polished can be temporarily stored in the loading buffer area 203A in sequence; and in order to be able to stably adsorb the wafer W, the end of the loading robot 202 may be provided with a plurality of vacuum chucks 2022, for example, as shown in fig. 1, 3 vacuum chucks 2022 are provided at the lower end of the loading robot 202 for simultaneously adsorbing the wafer W to be polished; as can be appreciated, the first cassette 201 is provided with an opening to facilitate taking and placing the wafer W to be polished;
the blanking area 30 comprises a second wafer box 301, a blanking robot 302, a blanking cache area 303A and a blanking water tank 304; after the polished wafer W is taken out of the carrier 102 and placed in the unloading buffer area 303A by the unloading robot 3021 provided at the end of the unloading robot 302, the wafer W in the unloading buffer area 303 is transferred to the second wafer cassette 301 by the unloading robot 3021; similarly, the second cassette 301 is also provided with an opening for facilitating the taking and placing of the polished wafer W; it should be noted that a transfer robot (not shown) is further disposed in the wafer loading/unloading system 1A for transferring the second wafer cassette 301 into the unloading water tank 304 to prevent contaminants in the external environment from contaminating the polished surface of the wafer W.
It can be understood that, when the wafer loading and unloading system 1A is used for loading and unloading the wafer W, only single wafer W can be transmitted, the wafer transmission efficiency is low, and when the loading robot 202 and the unloading robot 302 are required to work simultaneously, a carrying mechanical arm needs to be added separately, which results in high manufacturing cost and high post-maintenance cost of the equipment. Therefore, the embodiment of the invention is expected to provide a wafer feeding system, which shortens the wafer feeding and discharging time, improves the production efficiency, and reduces the equipment manufacturing cost and the later maintenance cost.
Referring to fig. 2, a wafer loading and unloading system 1 according to an embodiment of the present invention is shown, and as shown in fig. 2, the wafer loading and unloading system 1 includes:
a feeding buffer area 203 capable of temporarily storing a plurality of wafers W to be polished;
a blanking buffer area 303 capable of temporarily storing a plurality of polished wafers W;
a swing mechanical arm 40, wherein the swing mechanical arm 40 is configured to simultaneously transfer a plurality of wafers W to be polished, which are temporarily stored in the loading buffer area 203, to corresponding carriers 102; and simultaneously transferring a plurality of polished wafers W in each carrier 102 into the blanking buffer area 303.
It should be noted that, in the embodiment of the present invention, the embodiment of the present invention is described by taking the simultaneous transfer of 3 wafers W as an example shown in fig. 2, but the wafer loading and unloading system 1 provided in the embodiment of the present invention is not limited to simultaneously transfer only 3 wafers W.
With the wafer loading and unloading system 1 shown in fig. 2, after a plurality of wafers W to be polished are transferred from the first wafer cassette 201 to the loading buffer area 203 by the loading robot 202, the plurality of wafers W temporarily stored in the loading buffer area 203 are transferred to any corresponding carrier 102 by the swing robot 40; and, the plurality of polished wafers W in each carrier 102 can be transferred to the blanking buffer area 303 at the same time by swinging the robot arm 40, so that the time for loading and unloading the wafers W is shortened, and the production efficiency is improved; meanwhile, in the wafer loading and unloading system 1 provided by the embodiment of the invention, the swinging mechanical arm 40 is used for completing the loading and unloading process of the wafer W, so that the number of the robot equipment is reduced, and the manufacturing cost and the later maintenance cost of the robot equipment are reduced.
As shown in fig. 3, after the loading and unloading operation for the wafer W is completed by the swing robot 40, the swing robot 40 returns to the original state to prepare for the next loading and unloading operation.
As some possible embodiments of the wafer loading and unloading system 1 shown in fig. 2, with reference to fig. 2 and fig. 3, a plurality of vacuum chucks 2022 are disposed at an end of the swing robot 40, and are configured to respectively adsorb a plurality of wafers W to be polished in the loading buffer area 203 during loading; and, the polished wafers W of each carrier 102 are respectively adsorbed during the unloading process, that is, in the embodiment of the present invention, each vacuum chuck 2022 disposed at the end of the swing robot 40 is used for adsorbing a single wafer W during the loading and unloading processes, and in order to ensure the adsorption effect, the adsorption force of the vacuum chuck 2022 can be increased during the actual implementation process, and the specific method of the embodiment of the present invention is not specifically described.
For the wafer loading and unloading system 1 shown in fig. 2, preferably, as some possible embodiments, as shown in fig. 2 and 3, an end of the swing robot arm 40 is provided with a positioning device 401, specifically, the positioning device 401 may be a positioning camera, and in a specific implementation, the positioning device 401 is configured to:
determining the placing positions of the wafers W to be polished in each carrier according to the acquired images of the carrier identification holes 1021, so that the wafers W to be polished adsorbed by the vacuum chucks 2022 can be accurately placed in the carrier 102;
and determining the positions of the plurality of polished wafers W in the carrier 102 according to the acquired images of the carrier identification holes 1021, so that the plurality of vacuum chucks 2022 can accurately suck the polished wafers W in the carrier 102.
It should be noted that, in the implementation process, if the positioning camera acquires a complete image of any one of the carrier recognition holes 1021, it is determined that the plurality of wafers W to be polished, which are adsorbed by the vacuum chuck 2022, can be accurately placed in the carrier 102; and, the plurality of vacuum chucks 2022 can accurately chuck the polished wafer W in the carrier 102. Of course, in some examples, if the distance difference between the cross-shaped focusing point of the positioning camera and the image center position of the carrier recognition hole 1021 satisfies the set threshold range, it can also be determined that the plurality of wafers W to be polished, which are adsorbed by the vacuum chuck 2022, can be accurately placed in the carrier 102; and, the plurality of vacuum chucks 2022 can accurately chuck the polished wafer W in the carrier 102.
As some possible embodiments of the wafer loading and unloading system 1 shown in fig. 2, a plurality of water slide trays 402 are disposed in the unloading buffer area 303 for respectively carrying a plurality of polished wafers W transferred from the carrier 102 to the unloading buffer area 303.
In some examples of the possible embodiments described above, as shown in fig. 2, each water slide plate 402 is provided with a water outlet 4021, and the water outlet 4021 is connected to a water supply device (not shown in the figure) for spraying deionized water to the corresponding water slide plate 402.
In some examples of the possible embodiments, as shown in fig. 4, each water slide plate 402 is connected with a first tilting device 403, and the first tilting device 403 is used for driving the corresponding water slide plate 402 to tilt.
For the wafer loading and unloading system 1 shown in fig. 2, in some possible embodiments, as shown in fig. 4, the wafer loading and unloading system 1 further includes a wafer cassette driving mechanism 50, and the wafer cassette driving mechanism 50 includes a wafer cassette supporting device 501, a second tilting device 502 and a wafer cassette lifting device 503; wherein the content of the first and second substances,
the wafer cassette supporting device 501 is connected to the second wafer cassette 301, and is configured to fix the second wafer cassette 301;
the second tilting device 502 is connected to the cassette supporting device 501, and is configured to drive the cassette supporting device 501 to tilt such that the second cassette 301 is tilted, and further, the opening of the second cassette 301 is aligned with the water slide plate 402 in the tilted state, so that the polished wafer W in the water slide plate 402 slides into the second cassette 301, and the cassette lifting device 503 extends to abut against the cassette supporting device 501 in the tilted state to support the second cassette 301;
and, as shown in fig. 5, after the second cassette 301 is filled with polished wafers W, the second tilting device 502 drives the cassette supporting device 501 to be horizontally placed so that the second cassette 301 is in a horizontal state, and the cassette lifting device 502 retracts to an original height position.
It is understood that, during the unloading process, after the polished wafer W is placed in the unloading buffer area 303, any one of the water slides 402 is driven to be in the inclined state by the first tilting device 403, and at the same time, the second tilting device 502 is extended in the axial direction to drive the second cassette 301 to be also in the inclined state matching with the water slide 402, and the second cassette 301 is supported and fixed by the cassette support device 501 to maintain the inclined state, so that the wafer W on the water slide 402 can slide into the second cassette 301. As can be appreciated, the outlet holes 4021 continuously inject the deionized water into the corresponding water slide 402 during the process of sliding the wafer W to the second cassette 301, so as to ensure that the wafer W slides to the second cassette 301 under the combined action of the deionized water and its own weight. It can be understood that, after the wafer W in the water slide 402 slides into the second cassette 301, the blanking buffer 303 is rotated along the axial direction of the blanking buffer 303, so that the next water slide 402 with the polished wafer W temporarily stored therein is rotated to a position corresponding to the opening of the second cassette 301, and the polished wafer W is transferred in the same manner as described above. It should be noted that, in order to ensure that the wafer W in each water slide plate 402 slides to the corresponding position in the second wafer cassette 301, in the implementation process, the height position and the tilt angle of the second wafer cassette 301 can be properly adjusted by the wafer driving mechanism 50 to ensure that the opening of the second wafer cassette 301 is aligned with the water slide plate 402.
It should be noted that the inclined angle of the water slide plate 402 is a preset angle, so that the wafer W in each water slide plate 402 can be accurately slid to a corresponding position in the second wafer cassette 301.
It is understood that after the second cassette 301 is filled with the wafers W, the second tilting device 502 is retracted in the axial direction to restore the second cassette 301 to the original horizontal state, and the cassette supporting device 501 is also retracted to the original height position.
In some examples, as shown in fig. 2, the wafer cassette conveying device 305 is used for conveying the second wafer cassette 301 in a horizontal state into the blanking water tank 304.
Referring to fig. 6, a method for feeding a wafer according to an embodiment of the present invention is shown, where the method for feeding a wafer can be applied to the system 1 for loading and unloading a wafer shown in fig. 2, and the method for loading and unloading a wafer includes:
s601, adsorbing a plurality of wafers to be polished in a feeding buffer area by using a swinging mechanical arm, and simultaneously transferring the plurality of wafers to be polished into corresponding carriers;
and S602, after the wafers to be polished are polished on both sides, sequentially adsorbing the polished wafers in each carrier by using the swing mechanical arm, and transferring the polished wafers to a blanking cache area.
It can be understood that, since the wafer loading and unloading method shown in fig. 6 can be applied to the wafer loading and unloading system 1 in the foregoing technical solution, for specific details of the wafer loading and unloading method, reference may be made to the detailed description of each component in the wafer loading and unloading system 1 in the foregoing technical solution, and further description is omitted here.
For example, for the wafer loading and unloading method shown in fig. 6, in some possible embodiments, the wafer loading and unloading method further includes:
deionized water is supplied to the water sliding discs through the water outlet holes, and each water sliding disc in the blanking cache region is sequentially driven to be in an inclined state, so that polished wafers in the water sliding discs slide to a second wafer box in the inclined state;
and after the polished wafers are filled in the second wafer box, adjusting the second wafer box to be in a horizontal state, and transferring the second wafer box into a blanking water tank through a wafer box conveying device.
It should be noted that: the technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A wafer unloading system, the wafer unloading system comprising:
a feeding buffer area capable of temporarily storing a plurality of wafers to be polished;
a blanking cache area capable of temporarily storing a plurality of polished wafers;
the swinging mechanical arm is used for simultaneously transferring a plurality of wafers to be polished, which are temporarily stored in the feeding cache area, to corresponding carriers; and simultaneously transferring a plurality of polished wafers in each carrier to the blanking cache area.
2. The wafer loading and unloading system as claimed in claim 1, wherein a plurality of vacuum chucks are disposed at an end of the swing robot arm, and the vacuum chucks are configured to respectively adsorb a plurality of wafers to be polished in the loading buffer area during loading; and adsorbing the polished wafer of each carrier respectively in a blanking process.
3. The wafer loading and unloading system according to claim 1, wherein the end of the swing arm is provided with a positioning device configured to:
determining the placing positions of the multiple wafers to be polished in each carrier according to the acquired images of the carrier identification holes;
and determining the positions of the polished wafers in the carrier according to the acquired images of the carrier identification holes.
4. The wafer loading and unloading system according to claim 1, wherein a plurality of water slide trays are disposed in the unloading buffer area for respectively carrying a plurality of polished wafers transferred from the carrier to the unloading buffer area.
5. The wafer loading and unloading system as claimed in claim 4, wherein each water slide plate is provided with a water outlet for spraying deionized water to the corresponding water slide plate.
6. The wafer loading and unloading system as recited in claim 4, wherein each water slide plate is connected with a first tilting device, and the first tilting device is used for driving the corresponding water slide plate to be in a tilting state.
7. The wafer loading and unloading system of claim 4, wherein the wafer loading and unloading system further comprises a wafer cassette driving mechanism, the wafer cassette driving mechanism comprises a wafer cassette supporting device, a second tilting device and a wafer cassette lifting device; wherein the content of the first and second substances,
the wafer box supporting device is connected with a second wafer box and used for fixing the second wafer box;
the second tilting device is connected with the wafer cassette supporting device and used for driving the wafer cassette supporting device to be tilted so that the second wafer cassette is in a tilted state, and further, an opening of the second wafer cassette is aligned with the water slide disc in the tilted state, so that polished wafers in the water slide disc slide into the second wafer cassette, and the wafer cassette lifting device extends to be abutted against the wafer cassette supporting device in the tilted state so as to fix the second wafer cassette;
and after the second wafer box is filled with polished wafers, the second tilting device drives the wafer box supporting device to be horizontally placed so that the second wafer box is in a horizontal state, and the wafer box lifting device retracts to an original height position.
8. The wafer loading and unloading system of claim 7, wherein the wafer cassette handling device is used for handling the second wafer cassette in a horizontal state into a loading water tank.
9. A method for loading and unloading wafers, wherein the method for loading and unloading wafers can be applied to the system for loading and unloading wafers as claimed in any one of claims 1 to 8, and the method for loading and unloading wafers comprises the following steps:
after absorbing a plurality of wafers to be polished in a loading buffer area by using a swinging mechanical arm, simultaneously transferring the plurality of wafers to be polished into corresponding carriers;
and after the wafers to be polished are polished on the two sides, sequentially adsorbing the polished wafers in each carrier by using the swinging mechanical arm, and transferring the polished wafers to a blanking cache area.
10. The method as claimed in claim 9, further comprising:
deionized water is supplied to the water sliding discs through the water outlet holes, and each water sliding disc in the blanking cache area is sequentially driven to be in an inclined state, so that polished wafers in the water sliding discs slide to a second wafer box in the inclined state;
and after the polished wafers are filled in the second wafer box, adjusting the second wafer box to be in a horizontal state, and transferring the second wafer box into a blanking water tank through a wafer box conveying device.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111627519.9A CN114261751A (en) | 2021-12-28 | 2021-12-28 | Wafer feeding system and feeding and discharging method |
| TW111131099A TWI834252B (en) | 2021-12-28 | 2022-08-18 | Wafer loading and unloading system and loading and unloading method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111627519.9A CN114261751A (en) | 2021-12-28 | 2021-12-28 | Wafer feeding system and feeding and discharging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114261751A true CN114261751A (en) | 2022-04-01 |
Family
ID=80830891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111627519.9A Pending CN114261751A (en) | 2021-12-28 | 2021-12-28 | Wafer feeding system and feeding and discharging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114261751A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115338717A (en) * | 2022-09-13 | 2022-11-15 | 江苏京创先进电子科技有限公司 | Wafer thinning equipment |
| CN115625619A (en) * | 2022-12-01 | 2023-01-20 | 西安奕斯伟材料科技有限公司 | Intermediate carrier, double-sided polishing system and feeding and discharging method |
| CN116145113A (en) * | 2023-02-13 | 2023-05-23 | 上海福赛特机器人股份有限公司 | MOCVD wafer integrated loading and unloading device |
| CN116145113B (en) * | 2023-02-13 | 2024-05-03 | 上海福赛特机器人股份有限公司 | MOCVD wafer integrated loading and unloading device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11274119A (en) * | 1998-03-19 | 1999-10-08 | Speedfam Co Ltd | Automatic wafer polishing device and method for polishing wafer |
| JP2000061831A (en) * | 1998-08-19 | 2000-02-29 | Speedfam-Ipec Co Ltd | Wafer supplying mechanism for polishing device |
| JP2005294378A (en) * | 2004-03-31 | 2005-10-20 | Shin Etsu Handotai Co Ltd | Apparatus and method for polishing double-surface of semiconductor wafer |
| JP2006294786A (en) * | 2005-04-08 | 2006-10-26 | Ulvac Japan Ltd | Substrate conveying system |
| CN206529053U (en) * | 2017-03-08 | 2017-09-29 | 广东共力建材有限公司 | A kind of corrugated sheet stacking adapter |
| CN110465877A (en) * | 2019-08-08 | 2019-11-19 | 浙江大学 | A kind of full-automatic loading and unloading system of wafer for polissoir |
| CN210282347U (en) * | 2019-06-12 | 2020-04-10 | 无锡职业技术学院 | Robot arm structure of wafer parameter measuring instrument |
| CN112850162A (en) * | 2021-03-02 | 2021-05-28 | 上海致领半导体科技发展有限公司 | Vacuum chuck with positioning groove design and feeding and discharging tray |
-
2021
- 2021-12-28 CN CN202111627519.9A patent/CN114261751A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11274119A (en) * | 1998-03-19 | 1999-10-08 | Speedfam Co Ltd | Automatic wafer polishing device and method for polishing wafer |
| JP2000061831A (en) * | 1998-08-19 | 2000-02-29 | Speedfam-Ipec Co Ltd | Wafer supplying mechanism for polishing device |
| JP2005294378A (en) * | 2004-03-31 | 2005-10-20 | Shin Etsu Handotai Co Ltd | Apparatus and method for polishing double-surface of semiconductor wafer |
| JP2006294786A (en) * | 2005-04-08 | 2006-10-26 | Ulvac Japan Ltd | Substrate conveying system |
| CN206529053U (en) * | 2017-03-08 | 2017-09-29 | 广东共力建材有限公司 | A kind of corrugated sheet stacking adapter |
| CN210282347U (en) * | 2019-06-12 | 2020-04-10 | 无锡职业技术学院 | Robot arm structure of wafer parameter measuring instrument |
| CN110465877A (en) * | 2019-08-08 | 2019-11-19 | 浙江大学 | A kind of full-automatic loading and unloading system of wafer for polissoir |
| CN112850162A (en) * | 2021-03-02 | 2021-05-28 | 上海致领半导体科技发展有限公司 | Vacuum chuck with positioning groove design and feeding and discharging tray |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115338717A (en) * | 2022-09-13 | 2022-11-15 | 江苏京创先进电子科技有限公司 | Wafer thinning equipment |
| CN115625619A (en) * | 2022-12-01 | 2023-01-20 | 西安奕斯伟材料科技有限公司 | Intermediate carrier, double-sided polishing system and feeding and discharging method |
| CN116145113A (en) * | 2023-02-13 | 2023-05-23 | 上海福赛特机器人股份有限公司 | MOCVD wafer integrated loading and unloading device |
| CN116145113B (en) * | 2023-02-13 | 2024-05-03 | 上海福赛特机器人股份有限公司 | MOCVD wafer integrated loading and unloading device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202303818A (en) | 2023-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114261751A (en) | Wafer feeding system and feeding and discharging method | |
| US9728436B2 (en) | Transfer mechanism with multiple wafer handling capability | |
| JP5322822B2 (en) | Wafer prober for semiconductor inspection and inspection method | |
| KR101751551B1 (en) | Substrate processing system, substrate transfer method and computer storage medium | |
| KR100479161B1 (en) | Centering apparatus and semiconductor processing apparatus | |
| US9931730B2 (en) | Automatic handling apparatus with positioning pins | |
| US6478532B1 (en) | Wafer orienting and reading mechanism | |
| WO2023185202A1 (en) | Wafer polishing system, and loading method and use method therefor | |
| CN115139217A (en) | Intelligent feeding system suitable for wafer double-side polishing and grinding equipment | |
| TW506879B (en) | Polishing apparatus | |
| TW201347935A (en) | Robot system | |
| US7984543B2 (en) | Methods for moving a substrate carrier | |
| US20150221536A1 (en) | Substrate processing apparatus, substrate transfer method and substrate transfer device | |
| KR20160022244A (en) | Edge clamp transfer mechanism | |
| CN110610888A (en) | Automatic wafer attaching and fixing device | |
| CN111354668A (en) | Silicon wafer transmission system and method | |
| TWI834252B (en) | Wafer loading and unloading system and loading and unloading method | |
| CN113579937B (en) | PCB drill point grinder | |
| TWI631652B (en) | Electronic component operating equipment | |
| CN220491862U (en) | Silicon wafer detection conveying device | |
| JPH04157755A (en) | Wafer transferring pen holder device for vertical semiconductor manufacturing apparatus | |
| JP2004363455A (en) | Wafer inspection equipment | |
| JPH09148392A (en) | Wafer observing apparatus | |
| JPH09148394A (en) | Wafer conveyer | |
| CN114473847A (en) | Rotary wafer interaction system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant after: Xi'an Yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710100 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant before: Xi'an yisiwei Material Technology Co.,Ltd. Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |