CN112850162A - Vacuum chuck with positioning groove design and feeding and discharging tray - Google Patents
Vacuum chuck with positioning groove design and feeding and discharging tray Download PDFInfo
- Publication number
- CN112850162A CN112850162A CN202110227386.XA CN202110227386A CN112850162A CN 112850162 A CN112850162 A CN 112850162A CN 202110227386 A CN202110227386 A CN 202110227386A CN 112850162 A CN112850162 A CN 112850162A
- Authority
- CN
- China
- Prior art keywords
- vacuum chuck
- tray
- wafer
- positioning
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Abstract
The invention is suitable for the technical field of semiconductor processing, and provides a vacuum chuck with a positioning groove design and a feeding and discharging tray, which comprise a vacuum chuck and a tray which is matched with the vacuum chuck in a clamping manner and used for feeding and discharging materials, wherein a positioning column is arranged on the tray, corresponds to a notch on the vacuum chuck and is used for positioning the vacuum chuck when the vacuum chuck and the tray are clamped, and three positions for wafer adsorption are distributed on the vacuum chuck and the tray according to an equilateral triangle; the vacuum chuck is provided with a notch for positioning, and the tray is provided with a positioning column for positioning in an inserting and matching manner, so that the accurate positioning of a vacuum adsorption area and a wafer is realized, and the feeding or discharging operation of the accurate positioning of the whole wafer is realized; vacuum chuck and tray all set up and distribute according to equilateral triangle and have three to be used for the absorptive position of wafer, can use vacuum chuck to adsorb when processing the wafer, operate a plurality of wafers, realize the last unloading of a plurality of wafers, have improved work efficiency.
Description
Technical Field
The invention belongs to the technical field of semiconductor processing, and particularly relates to a vacuum chuck with a positioning groove and a feeding and discharging tray.
Background
When a semiconductor wafer is fixed by using a vacuum adsorption mode for grinding or polishing or precision grinding, only one wafer is usually adsorbed at the center of a vacuum chuck; if a plurality of wafers are adsorbed, it is usually necessary to perform a precise loading operation by means of a robot or to place the wafers more accurately on the adsorption area by careful manual operation, which causes the following problems: when only one wafer is adsorbed in the central area of the sucking disc to be processed, the processing precision of the wafer is influenced because the track difference formed on the grinding disc or the polishing disc is large due to the large difference of the inner linear speed and the outer linear speed of the wafer; the use of a manipulator for loading and unloading means that the equipment needs to be matched with an automatic loading and unloading system, so that the cost is very high; the feeding rate and the accuracy of the feeding position are seriously influenced by purely manually positioning the feeding, and the processing precision is influenced while the efficiency is low.
Disclosure of Invention
The invention provides a vacuum chuck with a positioning groove design and a feeding and discharging tray, and aims to solve the problem that the conventional vacuum chuck is inconvenient to adsorb and process a plurality of wafers.
The invention is realized in such a way that a vacuum chuck with a positioning groove design and a feeding and discharging tray comprise the vacuum chuck and a tray which is matched with the vacuum chuck in a clamping way and used for feeding and discharging, wherein a positioning column is arranged on the tray and corresponds to a notch on the vacuum chuck for positioning when the vacuum chuck and the tray are clamped, and the vacuum chuck and the tray are respectively provided with three positions which are distributed according to an equilateral triangle and used for wafer adsorption.
Preferably, three accommodating grooves for accommodating the wafers are distributed on the surface of the tray according to three vertexes of an equilateral triangle, a plurality of circles of support rings are arranged in the accommodating grooves, and each circle of support rings are equally spaced and disconnected.
Preferably, the upper part of the vacuum chuck is fixedly connected with a control device, and three groups of adsorption hole groups are correspondingly arranged on the body of the vacuum chuck according to the distribution situation of three corners of an equilateral triangle.
Preferably, each group of adsorption hole groups comprises a plurality of circles of air suction holes which are annularly distributed from inside to outside, and the diameter range of the adsorption hole groups is the same as that of the accommodating groove.
Preferably, the annular equidistance of vacuum chuck's outside edge is provided with twelve semicircular notches, be provided with threely on the inside wall of tray the reference column, it is three the reference column is with arbitrary three the notch is pegged graft mutually and is corresponded.
Preferably, the shape of the wafer is a figure shape formed by cutting a section in a circle, and the accommodating groove is correspondingly matched with the wafer so as to be in the shape.
Compared with the prior art, the invention has the beneficial effects that: according to the vacuum chuck with the positioning groove design and the feeding and discharging tray, the notch processed on the vacuum chuck for positioning is matched with the positioning column processed on the tray for positioning in an inserted manner, so that the accurate positioning of a vacuum adsorption area and a wafer is realized, and the feeding or discharging operation of the accurate positioning of the whole wafer is realized; vacuum chuck and tray all set up and distribute according to equilateral triangle and have three to be used for the absorptive position of wafer, can use vacuum chuck to adsorb when processing the wafer, operate a plurality of wafers, realize the last unloading of a plurality of wafers, have improved work efficiency.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of a tray structure according to the present invention;
FIG. 3 is a schematic top view of the tray for mounting the wafer according to the present invention;
FIG. 4 is a schematic bottom view of the vacuum chuck of the present invention;
FIG. 5 is a schematic view of the structure of the vacuum chuck after sucking the wafer;
in the figure: 1. a vacuum chuck; 11. adsorption hole groups; 111. a suction hole; 12. a notch; 2. a tray; 21. an accommodating groove; 211. a support ring; 22. a positioning column; 3. a wafer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1-5, the present invention provides a technical solution: the utility model provides a take vacuum chuck 1 and last unloading tray 2 of constant head tank design, includes vacuum chuck 1 and the tray 2 that is used for going up unloading with vacuum chuck 1 looks joint complex, is provided with the location when reference column 22 and the notch 12 on vacuum chuck 1 are applied to both joints relatively on the tray 2, and vacuum chuck 1 all sets up with tray 2 and distributes according to equilateral triangle and have three be used for the absorbent position of wafer 3.
In the embodiment, the notch 12 for positioning is processed on the vacuum chuck 1 and the positioning column 22 for positioning is processed on the tray 2 to be matched in an inserted manner, so that the accurate positioning of the vacuum adsorption area and the wafer 3 is realized, and the loading or unloading operation of the accurate positioning of the whole tray of wafers 3 is realized; vacuum chuck 1 and tray 2 all set up and distribute three positions that are used for wafer 3 to adsorb according to equilateral triangle, can use vacuum chuck 1 to adsorb when processing wafer 3, operate a plurality of wafers 3, realize the last unloading of a plurality of wafers 3, have improved work efficiency.
Further, three receiving grooves 21 for receiving the wafers 3 are distributed on the surface of the tray 2 according to three vertexes of an equilateral triangle, a plurality of circles of supporting rings 211 are arranged in the receiving grooves 21, and each circle of supporting rings 211 are equally spaced and disconnected.
In the present embodiment, the receiving grooves 21 are used for receiving the wafers 3, the supporting rings 211 in the receiving grooves 21 are used for supporting the wafers 3 in the receiving grooves 21, and the gaps between the supporting rings 211 are cut off, so that when the wafers 3 are placed, air at the bottom can extend outwards from the cut-off parts and finally be discharged from the side walls, thereby ensuring the stable placement of the wafers 3.
Furthermore, a control device is fixedly connected above the vacuum chuck 1, and three groups of adsorption hole groups 11 are distributed on the disk body of the vacuum chuck 1 according to three corners of an equilateral triangle.
In this embodiment, the control device drives the vacuum chuck 1 to move, the wafer 3 sucked by the vacuum chuck 1 is transferred to a processing place to be processed, and the three groups of suction holes 11 can simultaneously suck three wafers 3 and then process the wafers.
Further, each group of adsorption hole groups 11 comprises a plurality of circles of air suction holes 111 distributed annularly from inside to outside, and the diameter range of the adsorption hole group 11 is the same as that of the accommodating groove 21.
In the present embodiment, the adsorption hole group 11 composed of the circles of suction holes 111 can adsorb different parts of the wafer 3, so as to ensure uniform stress on the wafer 3 and stability during adsorption, the range of the accommodating groove 21 is the same as that of the adsorption hole group 11, so as to ensure that the adsorption hole group 11 can completely adsorb the wafer 3 in the accommodating groove 21, and ensure the transportation of the wafer 3.
Furthermore, twelve semicircular notches 12 are arranged at the edge of the outer side of the vacuum chuck 1 in an annular equidistant mode, three positioning columns 22 are arranged on the inner side wall of the tray 2, and the three positioning columns 22 correspond to any three notches 12 in an inserted connection mode.
In this embodiment, three positioning posts 22 disposed on the tray 2 are inserted into any three of the twelve semicircular notches 12 at the outer edge of the vacuum chuck 1, and are used for positioning the tray 2 and the vacuum chuck 1, and avoiding the dislocation therebetween.
Further, the shape of the wafer 3 is a figure shape formed by cutting a segment of a circle, and the accommodating groove 21 is adapted to correspond to the wafer 3 and thus is also the shape.
In the present embodiment, the wafer 3 with a figure shape formed by cutting a circle is a notch of the wafer 3, and the accommodating groove 21 is provided with a protruding portion corresponding to the notch for positioning and limiting the position of the wafer 3, so as to ensure the accuracy of the position of the wafer 3 on the tray 2, and prevent the wafer 3 from rotating in the accommodating groove 21 to affect the accuracy of the subsequent processing.
The working principle and the using process of the invention are as follows: an operator firstly places a wafer 3 in a containing groove 21 of a tray 2 for loading and unloading, and fits with a convex part of the containing groove 21 according to the shape of a notch of the wafer 3 to realize the accurate positioning between the wafer 3 and the tray 2, then controls the vacuum chuck 1 to descend, when the vacuum chuck 1 descends, a notch 12 on the vacuum chuck 1 is inserted and positioned with a positioning column 22 on the tray 2 to realize the positioning between the vacuum chuck 1 and the tray 2, then the vacuum chuck 1 is contacted with the wafer 3 on the tray 2, so that each adsorption hole group 11 corresponding to the containing groove 21 adsorbs the wafer 3, the wafer 3 is accurately adsorbed in the center of an adsorption area, the placing precision is ensured, and the processing precision of the wafer 3 is ensured at the same time.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. The utility model provides a take vacuum chuck and last unloading tray of constant head tank design which characterized in that: including vacuum chuck (1) and with vacuum chuck (1) looks joint complex tray (2) that are used for going up unloading, be provided with on tray (2) reference column (22) with notch (12) on vacuum chuck (1) are applied to the location when both joints relatively, vacuum chuck (1) with tray (2) all set up and distribute three position that is used for wafer (3) to adsorb according to equilateral triangle.
2. The vacuum chuck and loading and unloading tray with positioning slot design as claimed in claim 1, characterized in that: three containing grooves (21) for placing the wafers (3) are distributed on the surface of the tray (2) according to three vertexes of an equilateral triangle, a plurality of circles of support rings (211) are arranged in the containing grooves (21), and each circle of support rings (211) are disconnected at equal intervals.
3. The vacuum chuck and loading and unloading tray with positioning slot design as claimed in claim 2, characterized in that: the upper part of the vacuum sucker (1) is fixedly connected with a control device, and three groups of adsorption hole groups (11) are correspondingly arranged on the body of the vacuum sucker (1) according to the distribution condition of three corners of an equilateral triangle.
4. A vacuum chuck and loading and unloading tray with a positioning slot design as claimed in claim 3, wherein: every group adsorb the hole group (11) and include by interior outside ring shape distribution many circles suction hole (111) constitute, adsorb the diameter range of hole group (11) with holding tank (21) diameter range is the same.
5. The vacuum chuck and loading and unloading tray with positioning slot design as claimed in claim 1, characterized in that: the annular equidistance of the outside edge of vacuum chuck (1) is provided with twelve semicircular notches (12), be provided with threely on the inside wall of tray (2) reference column (22), it is three reference column (22) and arbitrary three notch (12) are pegged graft mutually and are corresponded.
6. The vacuum chuck and loading and unloading tray with positioning slot design as claimed in claim 2, characterized in that: the shape of the wafer (3) is a figure shape formed by cutting a section in a circular shape, and the containing groove (21) is correspondingly matched with the wafer (3) so as to be also in the shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110227386.XA CN112850162A (en) | 2021-03-02 | 2021-03-02 | Vacuum chuck with positioning groove design and feeding and discharging tray |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110227386.XA CN112850162A (en) | 2021-03-02 | 2021-03-02 | Vacuum chuck with positioning groove design and feeding and discharging tray |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112850162A true CN112850162A (en) | 2021-05-28 |
Family
ID=75990827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110227386.XA Pending CN112850162A (en) | 2021-03-02 | 2021-03-02 | Vacuum chuck with positioning groove design and feeding and discharging tray |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112850162A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114261751A (en) * | 2021-12-28 | 2022-04-01 | 西安奕斯伟材料科技有限公司 | Wafer feeding system and feeding and discharging method |
-
2021
- 2021-03-02 CN CN202110227386.XA patent/CN112850162A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114261751A (en) * | 2021-12-28 | 2022-04-01 | 西安奕斯伟材料科技有限公司 | Wafer feeding system and feeding and discharging method |
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