KR100951494B1 - Loader for hole cutting machine - Google Patents

Abstract

The present invention relates to a work loader provided in a disk substrate or other substrate processing machine of an information recording medium, and obtains a loader capable of carrying in and out of a substrate at a processing position in a short time for mounting on a substrate processing machine having a short processing time.

A rotary table having at least three holders arranged at equal intervals on the same circumference with respect to the pivot axis in the vertical direction, intermittently rotating in one direction around the pivot axis, and the substrate before processing from the stocker to the standby position (4 And a second hand for conveying the processed substrate from the cleaning position to the stocker. The said standby position is a position where the holding stand of the upstream of the rotation direction is located, when one of the holding stands is located in a processing position by the intermittent rotation of the said rotary table, The said cleaning position is hold | maintained by the intermittent rotation of the said rotary table. When one of the stands is located at the machining position, it is a position where the holding table on the downstream side in the turning direction is located.

Description

Work loader of substrate processing machine {LOADER FOR HOLE CUTTING MACHINE}

1 is a perspective view showing an embodiment

2 is a plan view of the main part of the apparatus of FIG.

3 is a perspective view showing an example of a hand;

4 is a perspective view showing an example of a hand of a conventional device;

<Code description>

1: stocker 3a, 3b: finger

4: waiting position 5: machining position

6: cleaning position 9: substrate

16: Traverse Guide 17: Traverse Arm

12a, 12b: Hand 24: Whetstone

27: pivot axis 28: rotary table

30: holder

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a work loader (hereinafter simply referred to as a “loader”) installed in a punching machine or other substrate processing machine for drilling a central hole in a disk substrate used as an information recording medium. The present invention relates to an apparatus for carrying out an operation of carrying out a substrate into a stocker from the processing position by carrying in the substrate.

The punching machine of a disk board | substrate centers (positions) the disk board | substrate carried in horizontally at the process position by the external reference | standard, and inserts a disk board with the cylindrical or ring-shaped clasp (gripping body) arrange | positioned up and down. After supporting, at the circumferential edge of the downward cup-shaped grinding wheel placed in the center of the upper clasp, a hole is drilled in the center of the disk substrate by a hole saw. Machine tool. The disc-shaped chopped chips which come out after a hole are discharged | emitted through the hollow part of a lower clasp.

The punching machine of the disk board | substrate is provided with the stocker which stores the disk board | substrate before and behind a process adjacent to a process position, and the loader which conveys a disk board between this stocker and a process position. In general, a plurality of cassettes containing a large number of disk substrates are mounted on a stocker, and the loader unloads the substrate before processing and the processed substrate in sequence to perform continuous processing of the disk substrate stored in the stocker. have.

Conventionally, as a loader of a punching machine, the X-Y traveling type | system | group hand provided with two fingers for the board | substrate before a process and the processed board | substrate was used. In order to avoid interference with the clasp and other members provided at the machining position, the finger is led from the hand main body toward the machining position, and a plurality of suction pads facing downward to adsorb and hold the workpiece at the tip of the finger are provided. It is installed. The plurality of suction pads are provided at positions for sucking two to three radial portions in the radial direction of the disk substrate to avoid interference with tools and clasps provided at the machining positions.

The disk board | substrate is accommodated with the surface perpendicular | vertical to the cassette for conveyance. On the other hand, the disk substrate is processed with the surface horizontal. The finger of the loader is capable of swinging in a horizontal direction and a downward direction of 90 degrees. The finger of the loader is swinged downward to remove and insert the disk substrate between the cassettes, and to move the finger to the machining position in a horizontal state. Loading and unloading of the disk substrate is performed in between.

Referring to Fig. 4, the operation of the loader of this kind of conventional structure will be described. The hand 12 moves to the cassette which accommodated the board | substrate before processing by the Y direction movement of the traverse arm 17, and the X direction movement of the hand on the said arm, and descend | falls the carry-in finger 3a downward. Then, one board | substrate 9a is adsorb | sucked before a process with the adsorption pad of a finger tip. Next, the carry-in finger 3a is raised and returned to horizontal again, and the hand 12 moves to a machining position. Then, the distal end of the discharging finger 3b is inserted into the machining position, and the disengaging operation of the discharging finger 3b is used to adsorb the finished substrate 9b by the suction pad at the distal end thereof. The upper clasp, which is not in use, is spaced apart, and then the carrying finger 3b is moved upward to pick up the finished substrate 9b from the lower clasp.

Then, the hand 12 inserts the tip of the carrying-in finger 3a into a machining position, and by the said ping fall, the board | substrate 9a is mounted on a lower clasp before processing, and an upper clasp is lowered, and a board | substrate 9a is lowered. Is inserted, the adsorption of the suction pad is released, and the carrying-in finger 3a is raised, and the board | substrate 9a is handed over to a processing machine. Next, the hand 12 conveys the processed substrate 9b to a cleaning position (a position for removing the processing liquid and dust attached to the processed substrate) provided between the stocker and the processing position. At this cleaning position, the processing liquid (generally water) adhering to the finished substrate 9b is removed and dried, and then moved to the cassette containing the finished substrate 9b.

Then, after the carrying-out finger 3b is made downward, the processed substrate 9b is stored in the cassette by lowering and releasing the suction pad of the finger tip. Thereafter, the carrying-out finger 3b is raised to return to the horizontal position and moved to the take-out position of the next substrate before processing.

By repeating the above operation, the continuous processing of the disk substrate accommodated in the cassette on the stocker is performed.

[Patent Document 1] Japanese Patent Application Laid-Open No. 2000-153425

[Patent Document 2] Japanese Patent Application Laid-Open No. 2006-26874

In the above conventional loader, while the substrate is being processed at the processing position, the loader conveys the processed substrate to the cleaning position, waits for the cleaning operation, inserts the processed substrate into the cassette, and the cassette image containing the substrate before processing is received. It is necessary to perform the operation of accepting the substrate before processing and moving to the machining position.

In the chamfering machine which performs the chamfering process of the periphery of a board | substrate, since the processing time of about 30 second is required for processing of one board | substrate, the loader can perform said operation | movement during this. However, the processing time of the punching process of a disk substrate is about 15 second, According to the punching machine currently developed by this applicant, processing time can be shortened to about 10 second. When such a shortening of the processing time is realized, the loader does not perform the above operation within the processing time, and after the processing of the substrate is finished, the processing machine has to wait for the completion of the transfer operation of the loader.

In other words, the productivity of the substrate processing machine is determined not by the capacity of the processing machine but by the work conveying time of the loader, and the improvement of productivity by shortening the processing time of the substrate processing machine cannot be expected.

Therefore, this invention aims at obtaining the loader which can carry out a board | substrate to a processing position in a short time for mounting in a board | substrate processing machine with a short processing time like the punching machine of a disk substrate.

The work loader of the substrate processing machine which concerns on the invention of Claim 1 which solved the said subject is the at least 3 holding stand 30 arrange | positioned at equal intervals on the same circumference centering on the pivot axis 27 of a perpendicular direction. A rotary table 28 intermittently rotating in one direction around the pivot axis, the first hand 12a for conveying the substrate before processing from the stocker 1 to the standby position 4, and the processed substrate. The second hand 12b which conveys from the cleaning position 6 to the stocker 1 is provided, and in the said standby position 4, one holding stand is located in the processing position 5 by the intermittent rotation of the said rotary table. Is the position where the holding stand on the upstream side of the turning direction is located, and the cleaning position 6 is located on the downstream side of the turning direction when the holding stand is positioned at the machining position 5 by intermittent rotation of the rotary table. Characterized in that the position is located It is to be.

Although there are various kinds of substrates, such as a large glass substrate used for a liquid crystal display, a small substrate for card type information recording media, and an electronic device such as an IC, the work loader of the present invention processes a relatively small substrate. It is suitable for the work loader of the processing machine, and is especially suitable for the work loader of the disk-shaped board | substrate which does not need to define the in-plane direction at the time of processing, especially the punching machine of a fast processing cycle.

Three holders 30 may be provided on the rotary table 28. However, three holders may be used, such as a case in which a longer time is required for drying or cleaning the finished substrate, such as when the holder is used. It is possible to have a structure for providing the cleaning position of the first and second two stages on the downstream side of the. In addition, the cleaning position 6 is a position which removes cutting liquid, cutting powder, etc. which are affixed on the processed board | substrate, and is generally cutting liquid of the surface of a board | substrate with injection air blown out from the nozzle arrange | positioned at the said position. Or blows dust away. If necessary, a switching device for switching and holding the substrate between the processing tables is provided at this cleaning position so that the cutting fluid and the dust do not remain in the portion held by the holding table of the rotary table.

The holder 30 of the rotary table includes a holding tool such as an absorbing pad or an elastic finger (a finger which opens when the substrate is inserted and holds the substrate by the return force of the bending), which grips the outer circumference of the substrate. (Not shown) so that the substrate does not fall off the holder 30 when the rotary table 28 is rotated. It is preferable to perform holding | maintenance of the board | substrate in a process position with the clasps 21 and 22 provided in the process position 5. It is preferable to also provide the centering device 25 in the processing position 5. This is because the positioning accuracy and the holding rigidity of the substrate can be increased.

The holding tool provided on the holding table 30 of the rotary table has a structure that does not interfere with the clasps 21 and 22 provided at the machining position and the holding tanks 25a and 25b of the centering device. This may be, for example, an adsorption pad positioned radially outward of the clasps 21 and 22, an elastic finger that grips the outer circumference of the disk in a direction orthogonal to the gripping direction of the gripping tanks 25a and 25b of the centering device, or the like. to be.

BEST MODE FOR CARRYING OUT THE INVENTION [

EMBODIMENT OF THE INVENTION Below, this invention is demonstrated further more concretely with reference to the accompanying drawing which shows an example of preferable embodiment of this invention. 1 is a perspective view of a device, FIG. 2 is a schematic plan view of a main part, and FIG. 3 is a perspective view of a hand.

As shown to FIG. 1, 2, the punching apparatus shown in the figure is equipped with the stocker 1 of a square, and the processing position 5 arrange | positioned at the outer side of the one side. The machining position 5 includes ring-shaped upper and lower clasps 21 and 22 for holding the work, a vertical grindstone shaft 23 arranged at the shaft center of the upper clasp 21, and the grinding wheel shaft ( 23 is provided with a downward cup-shaped punching grindstone 24 and a positioning tool 25 attached to the lower end. The positioning tool 25 is provided with a pair of holding tanks 25a and 25b facing each other with the opposite side in a V-shape, moved in a direction approaching each other, and mounted on the lower clasp 22. The centering of the disk substrate processed on the outer circumferential basis is performed by sandwiching the gaps therebetween. After this centering, the upper clasp 21 descends to clamp the disk substrate between the lower clasp 22 and the punching grindstone 24 rotates to lower the inner peripheral hole in the center of the disk substrate. Processing.

The disk substrate 9 before and after processing is mounted on the stocker 1 in the state accommodated in the cassette 18 (18a, 18b). The cassette 18 has a plurality of rows of receiving frames (storing portions 19) each having an upper surface open and having a U-shaped support edge at equal intervals inside. The disk substrate 9 is supported by the peripheral edge part under the support blade of this receiving frame, and is accommodated in the state arranged in the perpendicular direction to the disk surface in the vertical direction.

On the machining position 5 side of the stocker 1, a rotary table 28 which can pivot around the pivot axis 27 in the vertical direction and which is intermittently rotated by 120 degrees in the direction of arrow A in FIG. It is installed. The rotary table 28 in the figure has an equilateral triangle shape having a protrusion at its apex, and each holding table 30 is provided at the protrusion at an interval of 120 degrees on the same circumference around the pivot axis 27. .

The rotary table 28 is intermittently rotated by 120 degrees so that one of the three holders stops at the machining position 5, and the rotary table 28 holds the rotary table 28 downstream of the rotary table 28 from the machining position 5 at the time of stopping. The position where the stand is located becomes the cleaning position 6, and the position where the holding stand on the upstream of the turning direction is located becomes the standby position 4. The cleaning position 6 is provided with an air nozzle or the like for blowing air for cleaning, but since the structure is conventionally known, illustration and description are omitted.

On the opposite side of the stocker 1 on the opposite side of the machining position, an elongated traverse guide 16 in the Y direction of the drawing is provided in a circular structure, not shown, and two traverse arms 17a, which extend toward the machining position 5, are provided. The base end of 17b) is freely supported along the traverse guide 16. The traverse arms 17a and 17b are provided with hands 12a and 12b running in the extending direction (X direction in the drawing). The hands 12a and 12b are moved along the traverse arms 17a and 17b by the rotation of the X-direction servo motors 32a and 32b, and the traverse arms 17a and 17b are the respective Y-direction servo motors. The movement position is determined along the traverse guide 16 by the rotation of the 33a and 33b.

The hands 12a and 12b are each provided with one finger 3a and 3b, and each finger is provided with a suction pad (not shown) for vacuum-adsorbing the disk substrate 9 at its tip. .

As shown in FIG. 3, the finger 3a is free to rotate around the axis 10 in the horizontal direction, and is connected to the rod of the swinging cylinder 11, respectively, and the rod 14a of the swinging cylinder 11. By forward and backward retreat, the direction can be changed in the downward direction, which swings downward by 90 degrees with the horizontal direction shown in the drawing. The finger 3a is attached to the frame of the hand 12 via the lifting cylinder 13 in which the lifting guide was built. Finger 3b is also attached to hand 12b in the same structure as finger 3a.

The lifting operation of the finger 3a by the lifting cylinder 13 is performed by inserting the finger 3a into the cassette 18a from above and taking out the disk substrate 9, and the disk substrate 9 in its standby position ( It is made when it is mounted on the holder of 4). The lifting operation of the finger 3b is performed when the disk substrate 9 is received from the holder of the cleaning position 6 and when the disk substrate 9 is inserted into the cassette 18b from above. .

The pre-processing substrate accommodated in the cassette 18a on the stocker 1 in the vertical direction is held downward by the adsorption pad of the finger 3a which has moved downward and moved downward, and then raises the finger 3a. It is taken out from the cassette 18a. Next, with the finger 3a in the horizontal direction, the disk substrate 9 is placed on the holding table at the standby position 4 by the movement of the hand 12 and the lowering operation of the finger 3a. The rotary table 28 rotates 120 degrees in the arrow A direction of FIG. 2 when the processing of the preceding disk substrate is completed and the upper and lower clasps 21 and 22 are separated from the processed substrate. By this rotation, the processed substrate is moved to the cleaning position 6, and the substrate before processing mounted at the standby position 4 is moved to the processing position 5. An empty holding stand moves to the standby position 4. The disk substrate moved to the machining position 5 is punched out in the same procedure as the conventional apparatus described above.

In the cleaning position 6, the processing liquid, the cutting powder, and other dust adhering to the processed substrate having been moved are blown with the jet air to further evaporate the moisture adhering to the substrate. The dry processed substrate is received from the holding table at the cleaning position 6 by a series of operations such as the lowering of the finger 3b, the adsorption of the substrate on the suction pad of the finger, and the raising of the finger. The next substrate before processing is mounted on the holding table of the standby position 4 by the finger 3a.

When the machining at the machining position 5 ends and the clasps 21 and 22 are spaced apart, the rotary table 28 pivots 120 degrees to send the finished substrate to the cleaning position 6, whereby the standby position (4 The board | substrate before processing newly mounted in the holding stand of () is sent to the processing position 5. Punching of the disk substrate at the machining position (5) and drying of the processed substrate at the cleaning position (6) are performed in parallel, during which the finger 3a moves the new pre-processing substrate to the holding table at the standby position (4). It mounts and the finger 3b returns the processed board | substrate which was received from the holding stand of the cleaning position 6 to the cassette which accommodates a punched disk. This return operation is performed by moving the hand 12b onto the cassette to move the finger 3b downward, and then lowering the suction of the suction pad at the tip of the finger after the finger 3b is lowered. Is done.

By repeating the above operation, the pre-processed disk substrates stored in the cassette 18a of the main projection process are sequentially processed and accommodated in the cassette 18b. When the processing of the substrates in one cassette is finished, the next cassette It moves to and processes the board | substrate mounted in the stocker 1 continuously. On the other hand, the cassettes 18a and 18b do not need to be other cassettes. In general, the cassettes 18a and 18b are operations in which the processed disks are stored one after another in the empty cassettes from which the disks before processing are taken out or the empty portions of the cassettes from which the disks before processing are taken out.

According to the loader of the above structure, the carry-in hand 12a moves from the standby position 4 onto the cassette 18 of the substrate before processing to take out the substrate before processing and return to the standby position 4, and the carry-out hand ( Each operation 12b) may be completed within the processing time of the substrate with the operation of inserting the substrate into the cassette 18 of the processed substrate from the cleaning position 6 and returning to the cleaning position 6. Since the end of the process is much shorter than that of a conventional loader, the productivity of the machine is not limited by the operating time of the loader even in the short machining of the machining time, and thus the substrate processing such as punching of the disk substrate is performed. Therefore, there is an effect that the substrate processing with high productivity can be realized.

On the other hand, when the drying or cleaning time of the processed substrate is longer than the processing time, the holding table of the rotary table 28 may be four to five, and the cleaning position 6 may be two to three places. The productivity of the processing machine is not limited by drying or cleaning time.

Claims (2)

A rotary table having three holders 30 arranged at equal intervals on the same circumference with respect to the pivot axis 27 in the vertical direction, wherein the holder is formed by intermittent rotation in one direction around the pivot axis. Rotary table 28 which sequentially moves to the standby position 4, the processing position 5, and the cleaning position 6 set on the circumference, and the 1st hand which conveys a board | substrate before processing from the stocker 1 to the said standby position. 12a and a second hand 12b for conveying the processed substrate from the cleaning position to the stocker, The substrate before processing and the substrate after processing are accommodated in the stocker in a state where the surface of the substrate is erected in parallel with the vertical direction and parallel to the vertical direction. The first hand and the second hand are arranged side by side along each extension line of the standby position 4 and the cleaning position 6 on the opposite side to the machining position 5, The first and second hands, each has one finger (3a, 3b), And said finger moves up and down when conveying the substrate in said stocker from said standby position or to a cleaning position. The work loader of the substrate processing machine according to claim 1, wherein the substrate processing machine is a punching machine for a disk substrate.

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