1352993 九、發明說明： 【發明所屬之技術領域】 本發明涉及設置於在作爲資訊記錄介質而使用的盤 (⑷的基板上開設中心孔的開孔機及其它基板加工機 中的工件裝卸器（下面簡稱爲“裝，器”。、 )’涉及進行如 下動作的裝置，即，從儲料器取出加 lie加工别基板並將其搬入 到加工位置，將加工完基板從 位置搬出到儲料器 中。 【先前技術】 盤基板的開孔機是如下的工作設備：按外形基準對以 面處於水平狀態的方式被搬入到加工位置的盤基板進行定 (定位）利用上下配置的圓筒或環狀的壓目（把持體） 夹持盤基板之後，在配置於上壓圈中心的向下的杯狀的旋 轉砂輪的周緣’利用孔錯在板上開孔，以此爲要領，在盤 基板的中心進行開孔加工。開孔之後産生的圓板狀的切屑 通過下壓圈的中空部排出。 盤基板的開孔機中設置有：儲料器，其與加工位置鄰 接，儲存加工前後的盤基板；以及裝卸器，Μ該儲料器 矛加工位置之間搬送盤基板。通常，將多個收容有多個盤 基板的皿搭載到儲料器中’利用裝卸器依次進行加工前基 板和加工兀基板的裝卸，從而對储料器中儲存的盤基板進 行連續加工。 以在’作爲開孔機的裝却器，使用具有加工前基板用 和加工完基板用的2個爪部（finger)的X-Υ行走式的 5 1352993 機械手。爲了避免爪部與安裝在加工位置的愿圈及其它部 件發生干涉’爪部從機械手主體向加工位置延伸，在該爪 部的前端設置有用於吸附保持工件的朝向下方的多個吸 盤。多個吸盤設置於對盤基板的半徑方向的中間㈣^ 部位或3個部位進行吸附的位置，避免與設置於加工位置 的工具和壓圈發生干涉β 盤基板以面處於垂直狀態的方式收容在搬送用盒内。 另一方面，盤基板的加工是以面處於水平狀態的方式進行 的。裝卸器的上述爪部可在水平方向和與9〇纟向下的方 ::間擺動，使爪部擺動成向下’與盒之間進行盤基板的 :出和插A，爪部在水平的狀態下與加工位置之 基板的搬入搬出。 參照第四圖’說明這種現有結構的裝卸器的動作。機 X方：:：橫臂17的Y方向移動和該機械手在該臂上的 入：：二！動到收容有加工前基板的盒上方，使搬 爪4 3a向下並下降，利用爪部前端的 工前基板9a。接著，使搬入爪部3a上升，進=張加 水平狀態之後，機械手12向加工 回到 出爪部3b的前端插入到加工位 動。然後，將搬 降動你通過搬出爪部3b的下 圖中夫’ ^用其前端的吸盤吸附加工完基& 9b之後，使 圖中未不的上壓圈從該基板離開，接吏 向上移η/. 使搬出爪部3b 门马動，從下壓圈取出加工完基板9be 接著’機械手12將搬入爪部3a的前端 置’通過該爪部的下降，將加 加工位 土板9a放置到下壓圈 6 U52993 . 使上壓圈下降而夾持基板9a之後，解除吸盤的吸附， 使搬入爪部3a上升，將加工前基板9a移交給加工機。然 後’機械手12將加工完基板此搬送到設置於儲料器和： 工位置之間的清理位置（除去附著在加工完基板上的加工 液和灰塵的位置），在該清理位置除去加工完基板此上 附著的加工液（通常爲水）而進行乾燥之後，將加工完義 板9b向收容加工完基板此的盒上方移動。 土 _ ’使搬出爪部3b肖下之後下降，解除該爪部前 籲端的吸盤的吸附，從而將加工完基板此收容到盒中。之 後，使搬出爪部3b上升，返回到水平狀態，移動到下一 個加工前基板的取出位置。 通過重復上述的動作，從而對儲料器上的盒中收 盤基板進行連續加工β ' 專利文獻1 :日本特開2000 — 153425號公報 專利文獻2 :日本特開2〇〇6 — 26874號公報1352993 IX. EMBODIMENT OF THE INVENTION The present invention relates to a workpiece loader provided in a hole-opening machine and a other substrate processing machine in which a center hole is formed in a disk used as an information recording medium ((4)) Hereinafter, it is simply referred to as "package, device". , ) 'Including the device that performs the following operations, that is, taking out the lie processing substrate from the hopper and carrying it into the processing position, and moving the processed substrate from the position to the hopper [Prior Art] The hole punching machine of the disk substrate is a working device that fixes (positions) the disk substrate that has been loaded into the processing position so that the surface is horizontal, using the cylinder or ring arranged up and down. After pressing the disk substrate, the peripheral edge of the downward cup-shaped rotating grinding wheel disposed at the center of the upper pressing ring is opened by a hole in the hole, and the method is on the disk substrate. The center of the hole is processed by the hole. The disc-shaped chips generated after the opening are discharged through the hollow portion of the lower pressing ring. The opening device of the disk substrate is provided with: a hopper, which is processed with the processing position. Adjacently, the disk substrate before and after the processing is stored; and the loader transports the disk substrate between the hopper processing positions. Usually, a plurality of dishes containing a plurality of disk substrates are loaded into the hopper. The pre-processing substrate and the processing ruthenium substrate are sequentially loaded and unloaded, thereby continuously processing the disc substrate stored in the hopper. In the case of the ejector for the boring machine, the pre-processing substrate and the processed substrate are used. Two claws of the X-Υ walking type 5 1352993 robot. In order to prevent the claw from interfering with the wishing ring and other components attached to the machining position, the claw extends from the robot body to the machining position. The front end of the claw portion is provided with a plurality of suction cups for sucking and holding the workpiece downward. The plurality of suction cups are disposed at positions in the middle (four) or three portions of the radial direction of the disc substrate, and are prevented from being disposed at the processing position. The tool and the pressure ring interfere with each other. The β-disk substrate is housed in the transfer cassette so that the surface is in a vertical state. On the other hand, the processing of the disk substrate is horizontal. By way of example, the above-mentioned claw portion of the loader can be swung in the horizontal direction and the side that is 9 〇纟 downward, so that the claw portion is swung downward to perform the disk substrate between the box and the box: The claw portion is carried in and out of the substrate at the processing position in a horizontal state. The operation of the loader of the conventional configuration will be described with reference to the fourth drawing. The machine X side:: the Y direction of the cross arm 17 and the robot are The insertion of the arm is moved to the upper side of the case in which the pre-processed substrate is accommodated, and the claws 4 3a are lowered downward, and the front substrate 9a at the tip end of the claw portion is used. Then, the carry-in claw portion 3a is raised and advanced. After the horizontal state is applied, the robot 12 is inserted into the front end of the processing and returning to the claw portion 3b to be inserted into the machining position. Then, the lowering of the claws 3b is carried out by moving the claws 3b. After the adsorption processing of the base & 9b, the upper pressing ring of the figure is removed from the substrate, and the joint is moved upward by η/. The moving claw portion 3b is moved, and the processed substrate 9be is taken out from the lower pressing ring. The robot 12 will be moved into the front end of the claw portion 3a, and the drop will be added through the claw portion. After the station earth plate 9a placed under the pressure ring 6 U52993. Lowered upper pressure ring 9a and the substrate holder, the suction of the suction is released, so that the pawl 3a of increased loading, before the processing machine transferred to the substrate 9a. Then, the robot 12 transports the processed substrate to a cleaning position between the hopper and the working position (removing the position of the machining liquid and dust attached to the processed substrate), and the processing is removed at the cleaning position. After the substrate is dried by the processing liquid (usually water) attached thereto, the processing plate 9b is moved over the case in which the substrate is processed. The soil _ ' lowers the unloading claw portion 3b and then lowers it, and releases the suction of the suction cup at the front end of the claw portion, thereby accommodating the processed substrate into the case. Thereafter, the carry-out claw portion 3b is raised, returned to the horizontal state, and moved to the take-out position of the next pre-processed substrate. By repeating the above-described operation, the continuous processing of the disk substrate in the cassette on the hopper is carried out. [Patent Document 1: JP-A-2000-153425 Patent Document 2: JP-A-2002-26874
在上述現有的裝卸器中，必須進行如下動作：在加工 位置加工基板期間’裝卸器將加工完基板搬送到清理位 置’等待清理動作，將加工完基板插入盒中，肖收In the above conventional loader, it is necessary to perform an operation of "loading the processed substrate to the cleaning position during the processing of the substrate at the processing position", waiting for the cleaning operation, and inserting the processed substrate into the case.
板的盒上方移動，取出加工前基板，向加工位置J 在進行基板的周緣的倒角加工的倒角加工機 1張基板需要30秒左右的力工 々及石的加工％間，所以裝卸器 期間進行上述動作。丫曰是，盤其把 ° 致Γ 開孔加卫的加工時間 爲15私左右，本發明申請人根據目前開發中的開孔加工 7 1352993 機，能夠將加工時間縮短到10秒左右。若實現這種加工 時間的縮短，則裝卸器不能在加工時間内進行上述動作， 基板加工結束之後，加工機必須等待裝卸器結束搬 作。 即，基板加工機的生產率不是取決於加工機的能力， 而是由裝卸器的卫件搬送時間決^而不能期待通過縮 短基板加工機的加工時間來提高生產率。 【發明内容】 因此’本發明的課題在於，得到一種用於搭載到像盤 基板的開孔機那樣加工時間短的基板加工機中的、能夠在 短時間内在加工位置進行基板的搬入搬出的裝卸器。 解決了上述課題的本申請第一方面所涉及的基板加工 機的工件裝卸器的特徵在於’所述工件裝卸器具備：旋轉 工作臺：其具有在以鉛直方向的旋轉軸爲中心的同一圓周 上寻間1¾地配置的至少^ >(田α a 個保持σ，該旋轉工作臺繞所述 旋轉轴向一個方向間歇旋轉1 1機械手，其將加工前基 ^足儲^向待機位置搬送；以及第2機械手，其將加工 元基板仗清理位置向儲粗哭 4抖器搬送，所述待機位置是保持台 的1個通過所述旋轉工作臺的間歇旋轉而位於加工位置 向上游側的保持台所處的位置，所述清理位置 '、《的1個通過所述旋轉卫作臺的間歇旋轉而位於 %其旋轉方向下游側的保持台所處的位置。 士：二板存在液晶顯示器中使用的大型的玻璃基 板Ή型的資訊記錄介質用或IC等電子設備用小型基 8 1352993 =種基板，但本發明的工件裝卸器適用於 ==的加工機的工件裝卸器，特別適合於 於加工周期快的開孔機的工件裝卸器/特別優選適合 設置於旋轉工作臺的保持台通常爲3個即 工完基板的乾燥或清理所需時間比加工時間長的情況° 也可以採用如下結構··設置4個保持台， / ’ 游侧…！和第2的2級的清理位置。另 是去除附著在加工&其位置 ^ θ 凡基板上的切削液或切粉等的位置，通 吊疋利用從配置於該位置的喷嘴 面的切削液和灰塵吹走來去^ 士 、、氣將基板表 人蜃人走來去除的結構。如果需要主 理位置上設置抓換裝置，該 人m 基板，從而不會出現在…！f 台之間抓換 不會出現在由紋轉工作臺的保持台保持的部分 有切削液或灰塵未被清理而殘留的情況。 在旋轉工作臺的保持台上設置用於把持吸盤或基 爪部（插入有基板„曲並打開，利用該彎曲的 恢復力夾持基板的爪部）等保持工具，從而在旋轉工作臺 旋轉時基板不會從保持台脫落。基板在加工位置的保持優 選利用設置於力:工位置的壓圈進行。優選定心裝置也設置 :加工位置。這是因爲能夠提高定位精度和基板的保持剛 性。 j =於旋轉工作臺的保持台的上述保持工具構成爲不 加工位置的壓圈和定心裝置的把持爪發生干 涉。它是例如位於壓圈的半徑方向外側的吸盤、或 9 1352993 心裝置的把持爪的把拉t Α τ > 持方向正父的方向上把持盤外周的彈 性爪部等。 坪 根據上述結構的裝卸器，只要在基板的加工時間内完 成下述的各個動作$ Ρ 卩，搬入機械手從待機位置移動 到加工前基板的盒上方， 出加工則基板，返回到待機位 置的動作；以及搬出機械手 攻饿于從/月理位置向加工完基板的盒 中插入基板後，返回到清理位置的動作，這些動作在遠遠 =於現有的裝卸器的動作時間内結束，所以即使在加工時 ，的加工中’也不會因裝卸器的動作時間而限制加工機 /産率，在盤基板的開孔加工那樣的基板加工中，具有 能夠實現生產率高的基板加工的效果。 /、 另外’當加工完基板的乾燥或清理時間長於加工時間 ^情況下’只要將旋轉工作臺的保持台設爲4〜5個，將 月理位置設置爲2處〜3處即可，所以尤各m + P 了所以不會因乾燥或清理 4間而限制加工機的生產率。 【實施方式】 下面，參照示出本發明的優選實施 J苽进貰狍方式的一例的附 圖 進—步具體地說明本發明。箆一圄3壯屯 赞月帛®疋装置的立體圖， 圖疋主要部分的示意俯視圖，第三圖是機械手的立體 撞| 。 矩形:m示’圖中所示的開孔裝置具有俯視爲 儲枓益1以及配置於其一邊外側的加工位置5。加 工位置5具有：環形的上下壓圈21、22，其用於夹持工件； 垂直方向的砂輪軸23 ’其配置於上壓圈Μ的軸心上；向 10 1352993 2機位置4。在清理位置6設置有用於噴出清理用空氣的 二氧噴嘴等，但由於採用現有公知的結 和說明。 胃口八 在健料器1的加工位置相反側的上方以圖中未示的門 形結構設置有沿圖的γ方向爲細長的縱向引導件16’ =位置5延伸的2根橫臂17a、17b的基端被支樓成可 4縱向引導件16自由移動。在橫臂17a、m±設置有 =延伸方向（圖的X方向）上行走的機械手i2a m。 械:12a、12b通過X方向飼服電動機咖、挪的 而沿橫臂17a、17b移動定位，橫f 17a、m通過各γ方 ^司服電動機33a、33b的旋轉而沿著縱向引導件ΐ6 疋位。 叫 機械手12a、12b分別具有一個爪部Μ，各爪部 、别端具有對盤基板9進行真空吸附的吸盤（圖中未示）。 如第三圖所示，爪部3a可繞水平方向的軸1〇自由轉 的、=且’與擺動氣虹11的活塞杆連結，通過擺動氣缸U ，塞杆的進退’能夠將方向改變爲圖中所示的水 和向下擺動90度的向下的方向。爪部3a經由内 ： 引導件的料氣缸13裝配在機械手12的框架h爪部 也t木用與爪部3a相同的結構而裝配在機械手咖上 ^於升降氣缸13的爪部3a的升降動作在將爪部h :方插入到盒18a中而取出盤基板9時， 板9搭载到待機位44的保持臺上進行。另外’盤基 的升降動作在將盤基板9從清理位置6的保持台提起時， 12 以及在將盤基板9從上方插入到盒m中時進行。 以面處於垂直方向的方式收容在儲料器1上的各18a 令的加工前基板被朝向下方且向^ 乃且向下方移動的爪部3a的吸 盤吸附保持之後，通過使爪部3a上升，而被從盒“a中 抽出。接者’使爪部3a處於水平方向，通過機械手π的 移動和爪部％的下降動作，將盤基板9放置到待機位置4 的保持臺上。在先前的盤基板的加工結束、上下麼圈21、 ^從加工完基板離開的時刻，旋轉工作臺⑼向第二圖的 箭頭A方向轉動12〇度。诵讲兮 -逋過該轉動，加工完基板向清理 位置6移動’搭載在待機 1 4的加工刖基板向加工位置 移動。空的保持台移動到待機位置4。移動到加工位置5 工〇 的盤基板按照與上料現有裝置㈣的步料行開孔加 在清理位置6中’利用喷射空氣將附著在移動過來的 CSS的加工液和切粉及其它灰塵吹走，進而使附 分蒸發。通過…b的下降、由該爪部 =對基板的吸附以及該爪部的上升這-系列的動作， 成α理位置6的保持台提起 ^ 部3a將下-個加工前基 凡基利用爪 】丞扳搭載到待機位置4的保持臺上。 链在加工位置5的加工結束、壓圈2卜22分離時，旋 轉工作臺28旋轉12〇 將新搭載到待機位置I的;：臺完上基的， 工…。在加工位置5的=二加工前基板輸送到加 的加工完基板的乾燥二基在板，^ 丁在此期間，爪部3a將新 13 1352993 的加工胃 前基板搭裁到待機位置 的保持臺上，爪部 從清理位置I 孔盤的盒中。 移動到盒上方The top of the box moves, the pre-processed substrate is taken out, and the chamfering machine for chamfering the periphery of the substrate at the processing position J takes about 30 seconds between the workpiece and the processing of the stone. Therefore, the loader is used. The above actions are performed during the period. The processing time of the 其 Γ Γ Γ Γ 加 加 加 加 加 加 15 , , , , , , , , , , , 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本If such a processing time is shortened, the loader cannot perform the above operation within the machining time, and after the substrate processing is completed, the processing machine must wait for the loader to finish the operation. That is, the productivity of the substrate processing machine is not dependent on the capability of the processing machine, but is determined by the transport time of the keeper of the detacher, and it is not expected to improve the productivity by shortening the processing time of the substrate processing machine. In view of the above, an object of the present invention is to provide a substrate processing machine having a short processing time such as a hole puncher mounted on an image disk substrate, and capable of loading and unloading substrates at a processing position in a short time. Device. A workpiece loader for a substrate processing machine according to a first aspect of the present invention, which is characterized in that the workpiece loader includes: a rotary table having a same circumference centered on a rotation axis in a vertical direction At least ^ > (the field α a holding σ, the rotating table intermittently rotates the 1 1 manipulator in one direction around the rotating axis, which transports the pre-processing base to the standby position And a second robot that transports the processing target substrate cleaning position to the storage device, wherein the standby position is one of the holding tables being intermittently rotated by the rotary table and located at the processing position to the upstream side The position where the holding table is located, the cleaning position ', one position of the holding table on the downstream side of the rotation direction by the intermittent rotation of the rotary table. The second plate is present in the liquid crystal display. A large-sized glass substrate used for information recording media or a small base for electronic devices such as ICs, 1 1352993 = type of substrate, but the workpiece handler of the present invention is suitable for a workpiece of a == machine The unloader is particularly suitable for a workpiece loader of a tapping machine with a fast processing cycle. Particularly preferably, the holding table which is suitable for the rotary table is usually required to dry or clean the three substrates, which are longer than the processing time. Case ° The following structure can also be used: • Set up 4 holding tables, / 'Travel side...! and 2nd level 2 cleaning position. Also remove the cutting fluid attached to the processing & position ^ θ on the substrate or The position of the powder is cut, and the structure is removed by using the cutting fluid and dust from the nozzle surface disposed at the position, and the structure of the substrate is removed by the person who removes the substrate. If it is necessary to set the position at the main position The gripping device, the person m substrate, so that the catch does not occur between the ...! f stations does not occur in the portion held by the holding table of the grain turning table, and the cutting fluid or dust remains without being cleaned. A holding tool for holding the suction cup or the base claw portion (the claw is inserted and the substrate is inserted and the clamping force is held by the restoring force of the bending) is provided on the holding table of the rotary table, thereby rotating the rotary table The substrate does not fall off from the holding table. The holding of the substrate at the processing position is preferably performed by a pressure ring provided at the force: the working position. Preferably, the centering device is also provided with the processing position. This is because the positioning accuracy and the holding rigidity of the substrate can be improved. j = the above-mentioned holding tool of the holding table of the rotary table is configured such that the pressing ring in the unmachined position interferes with the holding claw of the centering device. It is, for example, a suction cup located outside the radial direction of the pressing ring, or a 9 1352993 core device. Pulling the gripper of the gripper t Α τ > Holding the elastic claw portion of the outer circumference of the disc in the direction of the positive parent. Depending on the loader of the above configuration, the following operations are completed within the processing time of the substrate $ Ρ 卩The moving robot moves from the standby position to the upper side of the cassette of the pre-processing substrate, and the substrate is returned to the standby position; and the unloading robot is hungry from the position of the substrate to the substrate after the substrate is processed. , the action of returning to the cleaning position, these actions end in the far time = the operating time of the existing loader, so even during processing, In the processing, the processing machine/yield is not limited by the operation time of the loader, and the substrate processing in the case of the hole processing of the disk substrate can achieve the effect of high-performance substrate processing. /, In addition, 'When the processing of the substrate is dry or the cleaning time is longer than the processing time ^, as long as the holding table of the rotary table is set to 4 to 5, the position of the month is set to 2 to 3, so Ume m + P so there is no limit to the productivity of the machine due to drying or cleaning 4 rooms. [Embodiment] Hereinafter, the present invention will be specifically described with reference to the accompanying drawings showing an example of a preferred embodiment of the present invention.箆一圄3屯屯 The three-dimensional diagram of the Zhanyue 帛® device, the schematic top view of the main part of the figure, and the third picture is the three-dimensional collision of the manipulator. Rectangular: m indicates that the opening device shown in the figure has a processing position 5 which is disposed in a plan view and is disposed on the outer side of one side. The machining position 5 has an annular upper and lower pressure ring 21, 22 for holding the workpiece, and a vertical grinding wheel shaft 23' disposed on the axis of the upper pressure ring ;; 10 to 10 1352993 2 machine position 4. A dioxing nozzle or the like for ejecting the cleaning air is provided at the cleaning position 6, but a conventionally known knot and description are employed. The appetite eight is provided with two cross arms 17a, 17b extending along the y-direction of the figure in the y-direction of the longitudinal direction of the opposite side of the processing position of the health feeder 1 (not shown). The base end is freely moved by the branch 4 into the longitudinal guides 16. The robot arm i2a m that travels in the extending direction (the X direction in the drawing) is provided in the cross arms 17a and m±. The tools: 12a, 12b are moved and positioned along the cross arms 17a, 17b by the X-direction feeding motor, and the transverse f 17a, m are rotated along the longitudinal guides 6 by the rotation of the respective γ-motors 33a, 33b.疋 position. Each of the robots 12a and 12b has a claw portion, and each of the claw portions and the other end has a suction cup (not shown) for vacuum-absorbing the disk substrate 9. As shown in the third figure, the claw portion 3a can be freely rotated about the axis 1〇 in the horizontal direction, and is connected to the piston rod of the swinging gas rainbow 11, and by swinging the cylinder U, the advance and retreat of the plug rod can change the direction to The water shown in the figure and the downward direction of swinging 90 degrees downward. The claw portion 3a is attached to the frame h claw portion of the robot 12 via the inner portion: the material cylinder 13 of the guide member is also attached to the robot hand on the claw portion 3a of the lift cylinder 13 by the same structure as the claw portion 3a. In the lifting operation, when the claw portion h is inserted into the case 18a and the disk substrate 9 is taken out, the plate 9 is mounted on the holding table of the standby position 44. Further, the lifting operation of the disc substrate is performed when the disc substrate 9 is lifted from the holding table of the cleaning position 6, 12 and when the disc substrate 9 is inserted into the cassette m from above. The pre-processed substrate of each of the 18a-orders accommodated in the hopper 1 in the vertical direction is sucked and held by the suction cup of the claw portion 3a that moves downward and downward, and then the claw portion 3a is raised. On the other hand, the disk substrate 9 is placed on the holding table of the standby position 4 by the movement of the robot π and the lowering of the claw portion by the withdrawal of the claw portion 3a in the horizontal direction. When the processing of the disk substrate is completed, the upper and lower rings 21, ^ are separated from the processed substrate, the rotary table (9) is rotated by 12 degrees in the direction of the arrow A of the second figure. Moving to the cleaning position 6 'The processing substrate mounted on the standby 14 moves to the processing position. The empty holding table moves to the standby position 4. The disk substrate that has moved to the processing position 5 is in accordance with the material of the existing device (4) The row opening is added in the cleaning position 6 'Using the jet air to blow away the machining liquid and the cutting powder and other dust adhering to the moving CSS, thereby evaporating the attachment. By the drop of ... b, by the claw = pair Substrate adsorption And the operation of the series of raising of the claw portion, the holding table lifting portion 3a of the α-position position 6 is mounted on the holding table of the standby position 4 by the lower-stage machining front base. When the machining of the machining position 5 is completed and the press ring 2 is separated by 22, the rotary table 28 is rotated 12 turns to be newly mounted to the standby position I; the base is finished, and the work is finished. The substrate is transported to the dried substrate of the processed substrate, and during this period, the claw portion 3a laps the processed stomach front substrate of the new 13 1352993 to the holding table at the standby position, and the claw portion is cleaned from the position I hole. In the box of the disc. Move to the top of the box
後，解除該爪部前端的吸盤的吸附After that, the suction of the suction cup at the front end of the claw is released.
【圖式簡單說明】 工元的盤的動作。 第—圖為本發明實施例的立體圖。 第一圖為第—圖的裝置的主要部分的俯視圖。 第三圖為機械手的例子的立體圖。 第四圖為現有裝置的機械手的例子的立體圖。 【主要元件符號說明】 1儲料器 3a、3b爪部 4待機位置 5加工位置 6清理位置 9基板 12a、i2b機械手 1352993 1 6縱向引導件 17橫臂 24砂輪 27旋轉軸 28旋轉工作臺 30保持台。[Simple description of the figure] The action of the disk of the work element. The first drawing is a perspective view of an embodiment of the invention. The first figure is a top view of the main part of the device of the first figure. The third figure is a perspective view of an example of a robot. The fourth figure is a perspective view of an example of a robot of the prior art device. [Main component symbol description] 1 stocker 3a, 3b claw portion 4 standby position 5 processing position 6 cleaning position 9 substrate 12a, i2b robot 1352993 1 6 longitudinal guide 17 cross arm 24 grinding wheel 27 rotating shaft 28 rotating table 30 Keep the table.