JP2009194217A - Device for conveying plate-like object - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for conveying a plate-like object capable of preventing the plate-like object from dropping during conveyance. <P>SOLUTION: The device for conveying a plate-like object comprises a holding mechanism that holds a plate-like object and a moving mechanism capable of moving the holding mechanism between a first position and a second position, and the holding mechanism comprises a fixed plate, a plate-like object attracting member attached to the fixed plate, a vacuum sucking means that gives a sucking force to the plate-like object attracting member, a plurality of holding members attached to the fixed plate rotatably between a hold position in which the bottom surface of each plate-like object is held and a retract position in which the fixed plate retracts in the direction of outer circumference, and a drive means that moves the holding member between the hold position and the retract position. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a plate-like material conveying apparatus for conveying a plate-like material such as a semiconductor wafer.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a semiconductor wafer having a substantially disk shape, and devices such as ICs and LSIs are placed in the partitioned regions. Form. And a semiconductor wafer is divided | segmented into each semiconductor chip (device) by cut | disconnecting a semiconductor wafer along a street with a cutting device.

  The wafer to be divided is generally formed to have a predetermined thickness by grinding the back surface before cutting along the street. In recent years, in order to achieve a reduction in weight and size of electrical equipment, it has been required to make the wafer thinner, for example, about 50 μm.

  As a technique for dividing a semiconductor wafer into thinner devices, a dividing technique called a so-called tip dicing method has been developed and put into practical use (see, for example, JP-A-11-40520).

  This tip dicing method is a semiconductor in which a dividing groove having a predetermined depth (a depth corresponding to the finished thickness of the device) is formed along the line to be divided from the surface of the semiconductor wafer, and then the dividing groove is formed on the surface. This is a technique of grinding the back surface of a wafer to expose dividing grooves on the back surface and dividing the wafer into individual devices. The thickness of the device can be processed to about 50 μm.

  A grinding device provided with a chuck table is used for grinding a semiconductor wafer. The wafer that has been very thinly ground by the grinding device is transported from the chuck table to the cleaning device by the wafer suction transport device and cleaned.

The wafer suction transfer device generally has a suction pad, and the wafer is sucked and held by the suction pad during transfer. As another plate-like material transfer device, a transfer device that sucks and holds a semiconductor substrate in a non-contact manner using Bernoulli's principle is disclosed in Japanese Patent Laid-Open No. 5-36816.
JP-A-5-36816

  A wafer in which divided grooves are formed on the front surface by the first dicing method, and then the rear surface of the wafer is ground to display the divided grooves on the rear surface, is very easy to bend. On the other hand, a wafer whose back surface is formed very thin by grinding before being cut along the street is very warped.

  These thinly ground semiconductor wafers such as semiconductor wafers that tend to bend and warp are hindered by the vacuum suction force due to bending and warping during suction holding and conveyance in the grinding and cutting processes, and fall from the suction surface. As a result, there is a problem of damage.

  This invention is made | formed in view of such a point, The place made into the objective is providing the conveying apparatus of the plate-shaped object which does not drop a plate-shaped object during conveyance.

  According to the first aspect of the present invention, there is provided a plate-like material conveying apparatus comprising: a holding mechanism that holds the plate-like material; and a moving mechanism that can move the holding mechanism between the first position and the second position. The holding mechanism includes a fixed plate, a plate-like object adsorbing member attached to the fixed plate, a vacuum suction means for applying a suction force to the plate-like object adsorbing member, and a lower surface of each plate-like object. A plurality of holding members rotatably attached to the fixed plate between a holding position to hold and a retreat position to retreat in the outer peripheral direction of the fixed plate, and the holding position and the retreat position of each holding member And a driving means for moving the plate-like object to each other.

  Preferably, the driving means is disposed on the fixed plate, and has an annular plate having a plurality of elongated holes extending in a substantially radial direction, an air cylinder that rotates the annular plate in the circumferential direction, and A plurality of engaging pins that are fixed to one end of the holding member and are inserted into the long holes of the annular plate to engage the holding member with the annular plate.

  More preferably, each holding member has a positioning pin that aligns the center of the plate-like object with the center of the plate-like object adsorbing member when moved to the holding position.

  According to a fourth aspect of the present invention, there is provided a plate-like object conveying apparatus comprising: a holding mechanism that holds the plate-like object; and a moving mechanism that can move the holding mechanism between the first position and the second position. The holding mechanism is rotatable with respect to the plate-like object adsorbing member, a plate-like object adsorbing member for sucking and holding the plate-like object, a vacuum suction means for applying a suction force to the plate-like object adsorbing member, and the plate-like object adsorbing member A plurality of holding members slidably attached to the mounting plate between a mounting plate attached to the mounting plate, a holding position for holding the lower surface of the plate-like object, and a retracted position for retracting in the outer peripheral direction of the mounting plate And a driving means for moving each holding member between the holding position and the retracted position.

  Preferably, the holding mechanism further includes a plurality of guides that are spaced apart in a circumferential direction and attached to the plate-like object adsorption member, and the attachment plate circumscribes the guide and the plate-like object adsorption member. A first annular plate having a plurality of first elongated holes extending in a substantially radial direction and rotatably attached to the plate-like object adsorbing member inscribed in the guide. A second annular plate having a plurality of second elongated holes, and each holding member has a holding position for holding the lower surface of the plate-like object, and a retreating position for retreating in the outer circumferential direction of the first annular plate. A holding arm movable between the first link member, one end fixed to the base end of the holding arm and the other end slidably mounted in the first slot, and one end of the holding arm Against the proximal end of the holding arm A second link member movably attached and having the other end slidably attached in the second elongated hole, wherein the driving means rotates the first annular plate in a circumferential direction. A cylinder and a second air cylinder for rotating the second annular plate in a circumferential direction.

  More preferably, each holding member is provided at the base end portion of the holding arm that aligns the center of the plate-like object with the center of the plate-like object adsorbing member when moved to the holding position. It has a positioning part.

  According to the present invention, since the plate-like object is held by the plurality of holding members rotated to the holding position during the conveyance of the plate-like object, the plate-like object is prevented from falling during the conveyance. Also, suction is not performed by vacuum suction during transport, and the plate-like object is held by a plurality of holding members rotated to the holding position, so energy is saved compared to a transport device that holds the plate-like object by vacuum suction. Is possible.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 shows a perspective view of a grinding apparatus 2 equipped with a conveying apparatus according to an embodiment of the present invention.

  Reference numeral 4 denotes a housing of the grinding device 2, and two columns 6 a and 6 b are erected vertically on the rear side of the housing 4. A pair of guide rails (only one is shown) 8 extending in the vertical direction is fixed to the column 6a.

  A rough grinding unit 10 is mounted along the pair of guide rails 8 so as to be movable in the vertical direction. The rough grinding unit 10 is attached to a moving base 12 whose housing 20 moves up and down along a pair of guide rails 8.

  The rough grinding unit 10 includes a housing 20, a spindle (not shown) rotatably accommodated in the housing 20, a servo motor 22 that rotationally drives the spindle, and a plurality of rough grinding grinding wheels fixed to the tip of the spindle. A grinding wheel 24 having 26 is included.

  The rough grinding unit 10 includes a rough grinding unit moving mechanism 18 including a ball screw 14 and a pulse motor 16 that move the rough grinding unit 10 up and down along a pair of guide rails 8. When the pulse motor 16 is pulse-driven, the ball screw 14 rotates and the moving base 12 is moved in the vertical direction.

  A pair of guide rails 19 (only one is shown) 19 extending in the vertical direction are also fixed to the other column 6b. A finish grinding unit 28 is mounted along the pair of guide rails 19 so as to be movable in the vertical direction.

  The finish grinding unit 28 is attached to a moving base (not shown) in which the housing 36 moves in the vertical direction along the pair of guide rails 19. The finish grinding unit 28 includes a housing 36, a spindle (not shown) rotatably accommodated in the housing 36, a servo motor 38 that rotationally drives the spindle, and a grinding wheel 42 for finish grinding fixed to the tip of the spindle. A grinding wheel 40 is included.

  The finish grinding unit 28 includes a finish grinding unit moving mechanism 34 including a ball screw 30 and a pulse motor 32 that move the finish grinding unit 28 in the vertical direction along the pair of guide rails 19. When the pulse motor 32 is driven, the ball screw 30 rotates and the finish grinding unit 28 is moved in the vertical direction.

  The grinding device 2 includes a turntable 44 disposed so as to be substantially flush with the upper surface of the housing 4 on the front side of the columns 6a and 6b. The turntable 44 is formed in a relatively large-diameter disk shape, and is rotated in a direction indicated by an arrow 45 by a rotation drive mechanism (not shown).

  On the turntable 44, three chuck tables 46 are arranged so as to be rotatable in a horizontal plane, spaced from each other by 120 ° in the circumferential direction. The chuck table 46 has a suction chuck formed in a disk shape by a porous ceramic material, and sucks and holds the wafer placed on the holding surface of the suction chuck by operating a vacuum suction means. A thickness gauge 48 measures the thickness of the ground wafer.

  The three chuck tables 46 arranged on the turntable 44 are rotated in accordance with the turntable 44, so that the wafer loading / unloading area A, rough grinding area B, finish grinding area C, and wafer loading / unloading are performed. The region A is sequentially moved.

  The front portion of the housing 4 includes a first wafer cassette 50, a second wafer cassette 52, a wafer transfer robot 54, a positioning table 56 having a plurality of positioning pins 58, and a wafer carry-in mechanism (loading arm) 60. A wafer unloading mechanism (unloading arm) 62 and a spinner unit 63 are disposed. The wafer carry-out mechanism 62 is an embodiment of the plate-like object conveying device of the present invention.

  A cleaning water spray nozzle 67 that cleans the chuck table 46 is provided at the approximate center of the housing 4. The cleaning water spray nozzle 67 sprays cleaning water toward the chuck table 46 in a state where the chuck table 46 is positioned in the wafer carry-in / carry-out region A.

  The grinding operation of the grinding device 2 configured as described above will be described below. The semiconductor wafer accommodated in the first wafer cassette 50 is transported by the vertical motion and the forward / backward motion of the wafer transport robot 54 and is placed on the wafer positioning table 56.

  The wafer placed on the wafer positioning table 56 is centered by a plurality of positioning pins 58 and then moved to the chuck table 46 positioned in the wafer loading / unloading area A by the turning operation of the loading arm 60. It is placed and sucked and held by the chuck table 46.

  Next, the turntable 44 is rotated 120 °, and the chuck table 46 holding the wafer is positioned in the rough grinding region B. While rotating the chuck table 46 with respect to the wafer positioned in this manner at, for example, 300 rpm, the grinding wheel 24 is rotated in the same direction as the chuck table 46 at, for example, 6000 rpm, and the rough grinding unit moving mechanism 18 is operated to perform roughing. A grinding wheel 26 for grinding is brought into contact with the back surface of the wafer.

  Then, the grinding wheel 24 is ground and fed by a predetermined amount at a predetermined grinding feed speed to perform rough grinding of the wafer. While measuring the thickness of the wafer with the thickness gauge 48, the wafer is finished to a desired thickness.

  The chuck table 46 holding the wafer after the rough grinding is positioned in the finish grinding region C by rotating the turntable 44 by 120 °, and finish grinding by the finish grinding unit 28 having the grinding wheel 42 for finish grinding. Is implemented.

  The chuck table 46 holding the wafer for which finish grinding has been completed is positioned in the wafer loading / unloading area A by rotating the turntable 46 by 120 °. If the chuck table 46 is positioned in the wafer loading / unloading area A, the cleaning water is ejected from the cleaning water spray nozzle 67 to clean the chuck table 46.

  After the suction and holding of the wafer held on the chuck table 46 is released, the wafer is adsorbed by the wafer unloading mechanism (unloading arm) 62 and is transported to the spinner unit 63 by turning the unloading arm 62. .

  The wafer conveyed to the spinner unit 63 is cleaned and spin-dried here. Next, the wafer is stored in a predetermined position of the second wafer cassette 52 by the wafer transfer robot 54.

  Since the wafer after finish grinding is very thinly ground, it is likely to fall due to air leakage or the like when it is attracted by the wafer carry-out mechanism 62 and conveyed to the spinner unit 63. A plate-like material conveying apparatus according to a first embodiment of the present invention that solves this problem will be described below with reference to FIGS.

  FIG. 2 is a perspective view of a wafer adsorbing portion of a wafer carry-out mechanism (unloading arm) 62 as a plate-like object conveying device. FIG. 3 is an exploded perspective view thereof. As best shown in FIG. 3, the wafer unloading mechanism 62 includes a circular fixed plate 64 having a plurality of round holes 65 spaced equally in the circumferential direction.

  As shown in FIGS. 6 and 7, a wafer adsorbing member 66 is attached to the circular fixed plate 64. As shown in FIG. 7, the wafer adsorbing member 66 has a porous portion 68 formed of porous ceramics or the like.

  A vacuum suction part 70 connected to a vacuum suction source 74 via an air suction path 72 is mounted on the upper part of the circular fixed plate 64. As shown in FIG. 7, the air suction path 72 is formed across the arm 102 and the vacuum suction portion 70 of the wafer carry-out mechanism 62, and opens to the porous portion 68 attached to the wafer suction member 66.

  Mounted on the circular fixed plate 64 is an annular plate 76 having a plurality of elongated holes 80 which are spaced apart at equal intervals in the circumferential direction and extend in a generally radial direction. The distance between the long holes 80 in the circumferential direction is the same as the distance between the round holes 65 formed in the circular fixed plate 64. A projecting portion 78 is formed integrally with the annular plate 76.

  Reference numeral 82 denotes a wafer holding member that supports the lower surface of the wafer 104 as shown in FIG. 6 when the wafer adsorption by the wafer adsorption member 66 is released. The holding arm 84 and a drive arm 90 fixed to the holding arm 84 are provided. It consists of.

  The holding arm 84 has an arcuate shape along a substantially outer peripheral portion of the circular fixing plate 64, and has a boss portion 86 having a screw hole 86 a and a positioning pin 88. Of course, the shape of the holding arm 84 is not limited to the bow shape, but may be a linear shape.

  The drive arm 90 has an engagement pin 92 that engages with the elongated hole 80 of the annular plate 76 and a round hole 93. In order to assemble the wafer holding member 82, the holding arm 84 is disposed below the circular fixed plate 64 and the drive arm 90 is disposed between the circular fixed plate 64 and the annular plate 76 as shown in FIG. 3.

  Then, the holding arm 84 and the driving arm 90 are screwed into the screw hole 86a of the boss portion 86 of the holding arm 84 through the round hole 93 of the driving arm 90 and the round hole 65 of the circular fixing plate 64. The wafer holding member 82 is integrally attached to the circular fixed plate 64 so as to be rotatable about the boss portion 86 as a rotation center.

  Further, the engagement pin 92 of the drive arm 90 is inserted into the elongated hole 80 of the annular plate 76, and the cap 96 is fixed to the engagement pin 92 from above by press fitting or the like, whereby the wafer holding member 82 is engaged with the engagement pin 92. It is engaged with the annular plate 76 via. The piston rod 100 of the air cylinder 98 is connected to the protrusion 78 of the annular plate 76.

  However, when the piston rod 100 is retracted as shown in FIG. 4, the annular plate 76 rotates by a predetermined amount in the counterclockwise direction, the engaging pin 92 slides in the elongated hole 80, and the cap 96 is inside the elongated hole 80. At the same time, the holding arm 84 rotates clockwise around the boss portion 86 and is aligned with the outer peripheral portion of the circular fixing plate 64.

  In this state, since the holding arm 84 is located on the outer peripheral side of the wafer suction member 66, the holding arm 84 does not obstruct the suction action of the wafer suction member 66 at all. Therefore, in this state, the vacuum suction source 74 is operated and the wafer 104 is sucked and held by the porous portion 68.

  In the state where the wafer 104 is sucked and held by the wafer suction member 66 as described above, the air cylinder 98 is operated to extend the piston rod 100 as shown in FIG. As a result, the annular plate 76 rotates a predetermined amount clockwise.

  As a result, the engaging pin 92 of the wafer holding member 82 moves in the outer peripheral direction in the elongated hole 80 of the annular plate 76, and accordingly the holding arm 84 rotates counterclockwise about the boss portion 86. Thus, the wafer attracting member 66 protrudes downward.

  At this time, since each holding arm 84 has a positioning pin 88, the positioning pin 88 aligns the center of the wafer 104 with the center of the wafer suction member 66.

  Therefore, when the operation of the vacuum suction source 74 is stopped in this state, the wafer 104 falls from the wafer attracting member 66 and its lower surface is held by the holding arm 84 as shown in FIG. In this way, with the wafer 104 held by the holding arm 84, the arm 102 is turned, and the wafer 104 is conveyed from the chuck table 46 shown in FIG. 1 to the spinner unit 64.

  According to the wafer unloading device 62 of the first embodiment described above, while the wafer is being transported from the chuck table 46 to the spinner unit 64, the suction force of the wafer suction member 66 is cut off and the lower surface of the wafer is held by the wafer holding member 82. As a result, the wafer does not fall during transportation.

  Further, since the wafer is held by the wafer holding member 82 without being attracted to the wafer by the wafer adsorbing member 66 during wafer conveyance, energy can be saved as compared with a conveyance device that sucks and holds the wafer.

  Referring to FIG. 8, a schematic sectional view of a Bernoulli-type non-contact suction holder 110 is shown. Such a non-contact type suction holder 110 may be employed instead of the wafer suction member 66 described above.

  The non-contact suction holder 110 includes a disk-shaped main body 112, a connection portion 114 having an air supply path 118 connected to the main body 112, and a nozzle that is formed in the center of the main body 112 and jets air along the lower surface. 116.

  When air is ejected from the nozzle 116 along the lower surface of the main body 112 through the air supply path 118 as shown by an arrow 120, a negative pressure is generated at the center as shown by an arrow 122, and this negative pressure causes A plate-like object such as a wafer is attracted, but when the plate-like object approaches, the air flowing between the lower surface of the main body 112 and the plate-like object acts as a repulsive force, preventing contact with the plate-like object, and non-contact With suction, hold the plate.

  Next, with reference to FIG. 9 to FIG. 14, a wafer carry-out mechanism (plate-like object transfer device) according to the second embodiment of the present invention will be described. FIG. 9 is a plan view of a wafer adsorbing portion of a wafer unloading mechanism (unloading arm) 130 according to the second embodiment as a plate-like object conveying device, and FIG. 10 is a partial sectional side view.

  As best shown in FIG. 10, the wafer carry-out mechanism 130 includes a wafer suction member 132. The wafer adsorbing member 132 has a porous portion 134 formed of porous ceramics or the like. A vacuum suction part 136 connected to a vacuum suction source via an air suction path formed in the transfer arm 138 is mounted on the wafer suction member 132.

  A plurality (four in this embodiment) of guides 140 that are spaced apart at equal intervals in the circumferential direction are attached to the wafer adsorbing member 132. As shown in FIG. 11, the guide 140 includes a shaft 142 fixed to the wafer adsorbing member 132, and a first bearing 144 and a second bearing 146 that have an outer race rotatably attached to the shaft 142.

  A first annular plate 148 is rotatably attached so as to circumscribe the first bearing 144 of the guide 140, and a second annular plate 150 is rotatably attached so as to be inscribed in the second bearing 146 of the guide 140. .

  As shown in FIG. 9, the first annular plate 148 is formed with a plurality of first elongated holes 152 that are spaced apart at equal intervals in the circumferential direction and extend in a substantially radial direction. Are formed with a plurality of second long holes 154 spaced apart at equal intervals in the circumferential direction.

  Reference numeral 156 denotes a first link member. A pin 158 is rotatably attached to one end of the first link member 156, and the pin 158 is inserted into the first elongated hole 152. Reference numeral 160 denotes a second link member. A pin 162 is rotatably attached to one end of the second link member 160, and the pin 162 is inserted into the second elongated hole 154.

  The other end of the first link member 156 is fixed to the upper end portion of the slide rod 164, and the base end portion of the holding arm 166 is fixed to the lower end portion of the slide rod 164. Further, the other end of the second link member 160 is rotatably attached to the upper end portion of the slide rod 164.

  The combination of the first link member 156, the second link member 160 and the holding arm 166 constitutes the holding member 167. Since the first link member 156 and the holding arm 166 are both fixed to the slide rod 164, the angle formed by the first link member 156 and the holding arm 166 is always constant.

  As best shown in FIG. 10, a positioning portion 168 for aligning the center of the wafer with the center of the wafer attracting member 132 is provided adjacent to the lower end of the slide rod 164.

  The first annular plate 148 has an integrally formed operating arm 148a, and a piston rod 172 of the first air cylinder 170 is connected to the operating arm 148a.

  Similarly, the second annular plate 150 has an integrally formed operating arm 150a, and the piston rod 176 of the second air cylinder 174 is connected to the operating arm 150a.

  In the state shown in FIG. 9, the piston rod 172 of the first air cylinder 170 and the piston rod 176 of the second air cylinder 174 are also retracted, and each holding arm 166 is in the retracted position along the outer periphery of the wafer adsorbing member 132. It is positioned.

  From this state, as shown in FIG. 12, the second air cylinder 174 is operated to extend the piston rod 176. As a result, the second annular plate 148 rotates a predetermined amount in the counterclockwise direction.

  As a result, the pin 158 moves in the first elongated hole 152 to the end in the outer peripheral direction, and the pin 162 slides in the second elongated hole 154 and moves to the opposite end in the state shown in FIG. . As a result, the holding arm 166 moves away from the outer periphery of the wafer attracting member 132 and further moves in the outer peripheral direction.

  In this state, since the holding arm 166 is positioned on the outer peripheral side of the wafer attracting member 132, the holding arm 166 does not hinder the action of the wafer attracting member 132 at all. Therefore, in this state, a vacuum suction source (not shown) is operated to suck and hold the wafer by the porous portion 134.

  Next, as shown in FIG. 13, the first cylinder 170 is operated to extend the piston rod 172. As a result, the first annular plate 148 is rotated by a predetermined amount in the clockwise direction.

  As a result, the pin 158 rotatably attached to one end of the first link member 156 moves in the clockwise direction, so that the slide rod 164 fixed to the first link member 156 rotates in the counterclockwise direction, The holding arm 166 fixed to the slide rod 164 also rotates counterclockwise to the holding position for holding the lower surface of the wafer.

  When the operation of the vacuum suction source is stopped in the state shown in FIG. 13, the wafer falls from the wafer suction member 132 and its lower surface is held by the holding arm 166.

  From this state, as shown in FIG. 14, the piston rod 176 of the second air cylinder 174 is retracted, and the second annular plate 150 is rotated in the clockwise direction. As a result, the pin 162 slides in the second elongated hole 154 to the opposite end, and the pin 158 slides in the first elongated hole 152 toward the radial center.

  In accordance with this slide movement, the positioning portion 168 provided on the slide rod 164 contacts the outer periphery of the wafer and the slide rod 164 is moved to the center in the radial direction, and the center of the wafer is aligned with the center of the wafer attracting member 132. Is done. Therefore, in this state, by rotating the transfer arm 138, the wafer is transferred from the chuck table 46 shown in FIG.

  According to the wafer carry-out mechanism 130 of the second embodiment, as with the wafer carry-out mechanism 62 of the first embodiment, while the wafer is being transported from the chuck table 46 to the spinner unit 64, the suction force of the wafer suction member 132 is increased. Since it is cut and the lower surface of the wafer is held by the wafer holding arm 166, the wafer does not fall during conveyance.

  Further, since the wafer is held by the wafer holding arm 166 without being sucked by the wafer suction member 132 during wafer transfer, energy can be saved as compared with a transfer device that sucks and holds the wafer.

  Similarly to the wafer carry-out mechanism 62 of the first embodiment, a non-contact type suction holder 110 as shown in FIG. 8 may be adopted instead of the wafer suction member 132.

It is a perspective view of the grinding device provided with the conveyance device of the present invention. 1 is a perspective view of a wafer carry-out mechanism according to a first embodiment of the present invention. It is a disassembled perspective view of the wafer carrying-out mechanism of 1st Embodiment. It is a top view of the wafer carrying-out mechanism of the first embodiment when the holding arm is in the retracted position. It is a top view of the wafer carrying-out mechanism of the first embodiment when the holding arm is in the holding position. It is a partial cross section side view of the wafer carrying-out mechanism of 1st Embodiment of the state which hold | maintained the wafer with the wafer holding member. It is sectional drawing of the wafer carrying-out mechanism of 1st Embodiment of the state which hold | maintained the wafer with the wafer holding member. It is a schematic sectional drawing of a non-contact-type suction holder. It is a top view of the wafer carrying-out mechanism which concerns on 2nd Embodiment of this invention when a holding arm exists in a retracted position. It is a partial cross section side view of the wafer carrying-out mechanism of 2nd Embodiment. It is an expansion perspective view of a guide. It is a top view of the wafer carrying-out mechanism of 2nd Embodiment when a holding arm exists in a retracted position. It is a top view of the wafer carrying-out mechanism of the second embodiment when the holding arm is moved to the holding position. It is a top view of the wafer carrying-out mechanism of 2nd Embodiment in the state where the holding arm was moved to the holding position and the positioning part positioned the wafer.

Explanation of symbols

2 Grinding device 10 Rough grinding unit 28 Finish grinding unit 44 Turntable 46 Chuck table 60 Wafer loading mechanism (loading arm)
62 Wafer unloading mechanism (unloading arm)
63 Spinner unit 64 Circular fixed plate 66 Wafer adsorption member 68 Porous part 76 Annular plate 80 Elongated hole 82 Wafer holding member 84 Holding arm 88 Positioning pin 90 Drive arm 92 Engaging pin 98 Air cylinder 100 Piston rod 130 Wafer unloading mechanism 132 Wafer adsorption Member 134 Porous part 140 Guide 144 First bearing 146 Second bearing 148 First annular plate 150 Second annular plate 156 First link member 160 Second link member 164 Slide rod 166 Holding arm 167 Holding member 168 Positioning part 170 First air Cylinder 174 Second air cylinder

Claims (7)

A plate-like object conveying apparatus comprising a holding mechanism for holding a plate-like object and a moving mechanism capable of moving the holding mechanism between a first position and a second position,
The holding mechanism is
A fixed plate;
A plate-like object adsorbing member attached to the fixed plate;
A vacuum suction means for applying a suction force to the plate-like object adsorption member;
A plurality of holding members rotatably attached to the fixed plate between a holding position for holding the lower surface of the plate-like object and a retreat position for retreating in the outer peripheral direction of the fixed plate;
Drive means for moving each holding member between the holding position and the retracted position;
A plate-like material conveying apparatus comprising: The driving means includes
An annular plate having a plurality of elongated holes disposed in an upper portion of the fixed plate and extending in a substantially radial direction;
An air cylinder for rotating the annular plate in the circumferential direction;
A plurality of engaging pins, each fixed to one end of the holding member, inserted into each slot of the annular plate and engaging the holding member with the annular plate;
The plate-shaped article conveying apparatus according to claim 1, comprising:   Each of the holding members has a positioning pin that aligns the center of the plate-like object with the center of the plate-like object adsorbing member when moved to the holding position. The plate-shaped article conveying apparatus according to the description. A plate-like object conveying apparatus comprising a holding mechanism for holding a plate-like object and a moving mechanism capable of moving the holding mechanism between a first position and a second position,
The holding mechanism is
A plate-like object adsorbing member for sucking and holding the plate-like object;
A vacuum suction means for applying a suction force to the plate-like object adsorption member;
An attachment plate rotatably attached to the plate-like object adsorbing member;
A plurality of holding members slidably attached to the mounting plate between a holding position for holding the lower surface of the plate-like object and a retracted position for retracting in the outer peripheral direction of the mounting plate;
Drive means for moving each holding member between the holding position and the retracted position;
A plate-like material conveying apparatus comprising: The holding mechanism further includes a plurality of guides attached to the plate-like object adsorbing member so as to be separated from each other in the circumferential direction,
The mounting plate is
A first annular plate that has a plurality of first elongated holes that circumscribe the guide and are rotatably attached to the plate-like object adsorbing member and extend in a generally radial direction;
A second annular plate inscribed in the guide and rotatably attached to the plate-like object adsorbing member, and having a plurality of second elongated holes;
Each holding member is
A holding arm movable between a holding position for holding the lower surface of the plate-like object and a retreat position for retreating in the outer circumferential direction of the first annular plate;
A first link member having one end fixed to the base end of the holding arm and the other end slidably mounted in the first elongated hole;
A second link member having one end rotatably attached to the base end portion of the holding arm and the other end slidably attached to the second elongated hole;
The driving means includes
A first air cylinder that rotates the first annular plate in a circumferential direction;
The plate-shaped article conveying apparatus according to claim 4, further comprising a second air cylinder that rotates the second annular plate in a circumferential direction.   Each holding member has a positioning portion provided at the base end portion of the holding arm that aligns the center of the plate-like object with the center of the plate-like object adsorbing member when moved to the holding position. 6. A plate-like material conveying apparatus according to claim 5, wherein   The said vacuum suction means is comprised from a non-contact-type suction means, The conveying apparatus of the plate-shaped object in any one of Claims 1-6 characterized by the above-mentioned.

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