JP2013093383A - Holding method of plate-like object and machining method of plate-like object - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a holding method of a plate-like object, with which even a warped plate-like object can be sucked and held surely.SOLUTION: A holding method of a plate-like object for sucking and holding a warped plate-like object with a chuck table includes a chuck table preparation step, a deposition step, a placement step and a hold step. In the chuck table preparation step, a chuck table is prepared. The chuck table comprises a hold part including a hold surface of which the area is larger than the plate-like object and a suction path of which one end is communicated to the hold part and the other end is connected selectively to a suction source. In the deposition step, the plate-like object is deposited on an adhesive tape having an area equal to or more than the area of the hold part of the chuck table before or after implementing the chuck table preparation step. In the placement table, the plate-like object deposited to the adhesive tape is placed on the chuck table via the adhesive tape and the overall surface of the hold surface is covered with the adhesive tape. In the hold step, the plate-like object is sucked and held via the adhesive tape by operating the suction source after implementing the placement step.

Description

  The present invention relates to a holding method and a processing method for a plate-like object in which a plate-like object having warpage is sucked and held by a chuck table.

  In the manufacturing process of a semiconductor device or an optical device, a grid-like division planned line called street is formed on the surface of the semiconductor wafer or the optical device wafer, and a semiconductor device or an optical device is formed in each region partitioned by the division planned line. Is done.

  After these wafers are ground and thinned to a predetermined thickness, the individual semiconductor devices and optical devices are manufactured by being divided along the streets by a cutting device or a laser processing device.

  When a plate-like object such as a semiconductor wafer or an optical device wafer is subjected to grinding or cutting with a tool, for example, a plate is used with a chuck table as disclosed in Japanese Patent Laid-Open No. 5-23941 or Japanese Patent Laid-Open No. 2008-140832. Suction and hold the material.

  Then, the front surface side of the wafer is held by a chuck table of a grinding device via a protective tape, and the grinding wheel is slid while abutting against the back surface of the wafer, and grinding is performed by feeding the grinding wheel.

  In addition, when cutting a plate-shaped object, the chuck table holding the plate-shaped object is processed and fed at a predetermined processing feed rate while rotating the bite tool in a circular orbit, and is held on the chuck table. The surface of the plate-like product is turned and flattened with a bite tool.

Japanese Patent No. 5-23941 JP 2008-140832 A

  However, some plate-like objects have warpage, and in particular, a wafer in which a bumped wafer is coated with an underfill material or an ACF (Anisotropic Conductive Film) material, a WL-CSP (Wafer Level-Chip Size Package) wafer, etc. Some wafers are laminated with different materials and have large warpage.

  Even if it is attempted to suck and hold a warped plate-like object by the chuck table, there is a problem that the negative pressure leaks from a portion where the plate-like object is not in close contact with the holding surface of the chuck table, and the plate-like object cannot be sucked and held.

  This invention is made in view of such a point, The place made into the objective is to provide the holding | maintenance method of the plate-shaped object which can carry out suction suction holding | maintenance of even the plate-shaped object which has curvature. is there.

  According to the first aspect of the present invention, there is provided a method for holding a plate-like object by sucking and holding a warped plate-like object with a chuck table, wherein the holding part has a holding surface having a larger area than the plate-like object, and one end is A chuck table preparing step for preparing a chuck table having a suction path that communicates with the holding portion and has the other end selectively connected to a suction source, and before or after performing the chuck table preparing step, the chuck table A sticking step of sticking a plate-like material on an adhesive tape having an area equal to or larger than the area of the holding surface, and a plate-like material attached to the adhesive tape on the chuck table via the adhesive tape A placement step of placing and covering the entire surface of the holding surface with the adhesive tape, and after performing the placement step, the suction source is operated to suck and hold the plate-like object via the adhesive tape. Holding step and Method of holding the plate-like material, characterized by comprising a are provided.

  According to invention of Claim 2, it is a processing method of the plate-shaped object which processes the plate-shaped object hold | maintained at the chuck table by the holding method of Claim 1, Comprising: It is perpendicular | vertical with respect to the said holding surface of the said chuck table A surface of a plate-like object held on the chuck table via the adhesive tape by linearly moving the chuck table at a predetermined processing feed speed while rotating a bite tool mounted on the tip of a simple spindle There is provided a processing method of a plate-like object provided with a turning step of turning the tool with the cutting tool.

  According to the method for holding a plate-like object of the present invention, the plate-like object is attached to an adhesive tape having an area larger than the holding surface of the chuck table, and the entire surface of the holding surface of the chuck table is covered with the adhesive tape. The plate-like object can be reliably sucked and held by the chuck table via the adhesive tape without leaking negative pressure.

It is a perspective view of the chuck table suitable for using for the holding method of the plate-shaped object of this invention. It is a disassembled perspective view which shows a sticking step. It is a perspective view which shows a mounting step. 4A is a longitudinal sectional view showing the placing step, and FIG. 4B is a longitudinal sectional view showing the holding step. It is a perspective view of a cutting tool. It is a partial cross section side view which shows a turning step.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, there is shown a perspective view of a chuck table 2 suitable for carrying out the plate-like object holding method according to the embodiment of the present invention.

  The chuck table 2 has a suction holding portion 4 formed of porous ceramics having a larger area than a plate-like object (plate-like workpiece) to be held, and the suction holding portion 4 is a metal material such as a stainless steel hole. Is fitted in the fitting recess 7 (see FIG. 4) of the chuck table main body 6 formed by the above. The holding surface 4 a of the suction holding unit 4 is formed flush with the upper surface of the chuck table body 6.

  As shown in FIG. 4, the chuck table body 6 of the chuck table 2 has a suction path in which one end communicates with the suction holding unit 4 and the other end is selectively connected to the negative pressure suction source 10 via a switching valve (not shown). 8.

  The suction holding unit 4 may be composed of a pin chuck as disclosed in Patent Document 2. In the method for holding a plate-like object according to the embodiment of the present invention, the chuck table 2 having the above-described configuration is prepared.

  Then, as shown in FIG. 2, an adhesive tape 13 having an area equal to or larger than the area of the chuck table 2 is prepared, and a sticking step of sticking a plate-like object (plate-like workpiece) 11 on the adhesive tape 13 is performed. carry out.

  Next, as shown in FIG. 13 and FIG. 4 (A), the plate-like object 11 adhered to the adhesive tape 13 is placed on the chuck table 2 via the adhesive tape 13 and the holding surface 4a is covered with the adhesive tape 13. Cover the entire surface (mounting step).

  After performing the mounting step, as shown in FIG. 4 (B), the suction source 10 is operated to apply a negative pressure to the negative pressure suction portion 4 via the suction path 8, and via the adhesive tape 13. A holding step for sucking and holding the plate-like object 11 is performed.

  In the holding method of the plate-like object of the present embodiment, since the entire surface of the holding surface 4a of the chuck table 2 is covered with the adhesive tape 13, the negative pressure does not leak from the holding surface 4a and the adhesive tape 13 is interposed. The plate-like object 11 can be reliably sucked and held on the chuck table 2.

  After the plate-like object 11 is sucked and held by the chuck table 2 in this way, the plate-like object 13 is turned by, for example, a cutting tool 12 as shown in FIG. In FIG. 5, reference numeral 14 denotes a base of the cutting tool 12, and a column 16 is erected on the rear side of the base 14. A pair of guide rails (only one is shown) 18 extending in the vertical direction is fixed to the column 16.

  A cutting tool unit 20 is mounted along the pair of guide rails 18 so as to be movable in the vertical direction. The cutting tool unit 20 is attached to a moving base 22 whose housing 30 moves in the vertical direction along a pair of guide rails 18.

  The cutting tool unit 20 is detachably mounted on the housing 30, a spindle 32 (see FIG. 4) rotatably accommodated in the housing 30, a mount 34 fixed to the tip of the spindle 32, and the mount 34. And a bite wheel 35. A bite tool 36 is detachably attached to the bite wheel 35.

  The cutting tool unit 20 includes a cutting tool feed mechanism 28 that includes a ball screw 24 and a pulse motor 26 that move the cutting tool unit 20 in a vertical direction along a pair of guide rails 18. When the pulse motor 26 is pulse-driven, the ball screw 24 rotates and the moving base 22 is moved in the vertical direction.

  A chuck table mechanism 38 having a chuck table 2 is disposed at an intermediate portion of the base 14, and the chuck table 2 is moved in the Y-axis direction by a chuck table moving mechanism (not shown). A bellows 43 covers the chuck table mechanism 38. The spindle 32 has an axis that is perpendicular to the holding surface 4 a of the chuck table 2.

  The front portion of the base 14 includes a first wafer cassette 42, a second wafer cassette 44, a wafer transfer robot 46, a positioning mechanism 48 having a plurality of positioning pins 50, and a wafer carry-in mechanism (loading arm). 52, a wafer unloading mechanism (unloading arm) 54, and a spinner cleaning unit 56 are provided.

  A cleaning water spray nozzle 58 that cleans the chuck table 2 is provided at the approximate center of the base 14. The cleaning water spray nozzle 58 sprays cleaning water toward the chuck table 2 in a state where the chuck table 2 is positioned in the wafer loading / unloading area on the front side of the apparatus.

  The plate-like object 11 is sucked and held by the chuck table 2 of the cutting tool 12 via the adhesive tape 13, and the spindle table 32 is rotated to rotate the cutting tool 32 in a circular path as shown in FIG. The plate-like object 11 held on the chuck table 2 is cut into a predetermined depth on the surface of the plate-like object 11 held by 2 and the chuck table 2 is linearly processed and fed at a predetermined machining feed rate in the direction of arrow Y. A turning step of turning the surface of the plate-like object 11 with a bite tool 36 is carried out to process the surface of the plate-like object 11 flat.

  According to the method for holding a plate-like object of the above-described embodiment, even a plate-like object 11 having a warp can be sucked and held by the chuck table 2 via the adhesive tape 13, so that, for example, an underfill material for a wafer with a bump having a warp or a WL -A CSP wafer or the like can be turned by a bite tool 36.

2 Chuck table 4 Suction holding part 4a Holding surface 8 Suction path 10 Negative pressure suction source 11 Plate-like object 13 Adhesive tape 12 Bite cutting device 36 Bite tool

Claims (2)

A method for holding a plate-like object by sucking and holding a plate-like object having warpage with a chuck table,
A chuck table preparation step for preparing a chuck table having a holding portion having a holding surface larger than a plate-like object, and a suction path having one end communicating with the holding portion and the other end selectively connected to a suction source When,
Before or after performing the chuck table preparation step, an adhesion step of adhering a plate-like material on an adhesive tape having an area equal to or larger than the area of the holding surface of the chuck table;
A placing step of placing the plate attached to the adhesive tape on the chuck table via the adhesive tape and covering the entire surface of the holding surface with the adhesive tape;
After carrying out the placing step, the holding step of operating the suction source to suck and hold the plate-like object via the adhesive tape;
A method for holding a plate-like object. A plate-like material processing method for processing a plate-like material held on a chuck table by the holding method according to claim 1,
While rotating the bite tool mounted on the tip of the spindle perpendicular to the holding surface of the chuck table on a circular path, the chuck table is linearly moved at a predetermined processing feed rate via the adhesive tape. A method for processing a plate-like object, comprising: a turning step of turning the surface of the plate-like object held on the chuck table with the bite tool.

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