CN116145113A - MOCVD wafer integrated loading and unloading device - Google Patents
MOCVD wafer integrated loading and unloading device Download PDFInfo
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- CN116145113A CN116145113A CN202310104957.XA CN202310104957A CN116145113A CN 116145113 A CN116145113 A CN 116145113A CN 202310104957 A CN202310104957 A CN 202310104957A CN 116145113 A CN116145113 A CN 116145113A
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- 238000002488 metal-organic chemical vapour deposition Methods 0.000 title claims abstract description 67
- 235000012431 wafers Nutrition 0.000 claims abstract description 154
- 239000004575 stone Substances 0.000 claims abstract description 90
- 238000000034 method Methods 0.000 claims abstract description 36
- 238000003860 storage Methods 0.000 claims abstract description 20
- 230000005540 biological transmission Effects 0.000 claims abstract description 13
- 238000000227 grinding Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 230000000903 blocking effect Effects 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 241000252254 Catostomidae Species 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 239000007789 gas Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of integrated circuit processes and discloses an MOCVD wafer integrated loading and unloading device which comprises a storage unit, a loading unit, a wafer positioning unit and a stone mill positioning unit which are arranged in a closed cavity, wherein the closed cavity is communicated with MOCVD equipment; the storage unit is used for storing a plurality of clamping plugs, and a plurality of wafers are stacked at equal intervals from top to bottom inside each clamping plug; the wafer positioning unit is used for bearing a wafer and adjusting the angle of the wafer; the stone mill positioning unit is used for bearing a stone mill and adjusting the angle of the stone mill; the loading unit is used for realizing the one-by-one transmission of the wafers between the clamping plug and the wafer positioning unit, between the wafer positioning unit and the stone mill positioning unit and one-by-one transmission of the stone mill between the stone mill positioning unit and the MOCVD equipment.
Description
Technical Field
The invention relates to the technical field of integrated circuit processes, in particular to an MOCVD wafer integrated loading and unloading device.
Background
When carrying out MOCVD (chemical vapor deposition) process, a wafer made of germanium and gallium arsenide is required to be placed into a stone mill by a glove box manually in a pure nitrogen environment, then the stone mill filled with the wafer is placed into MOCVD equipment for carrying out the MOCVD process, and after the MOCVD process is finished, the wafer is taken out from the stone mill by the glove box manually and is put back into a clamping plug. Because of low manual operation efficiency and high mobility of workers, the wafers are easily polluted by the front surfaces of the wafers in the process of taking and placing the wafers in the stone grinding disc, the wafer rejection rate is more than 5%, and great loss is caused to production benefits.
Disclosure of Invention
The invention provides an integrated wafer loading and unloading device for MOCVD wafers, which can realize full automation of wafer loading and unloading in the MOCVD process, fully ensure the consistency of placing the wafers on a graphite disc, ensure that the rejection rate is 10% of that of manual operation, ensure that the production efficiency and the qualification rate of equipment are far higher than those of manual production, bring great economic benefit to factories, and solve the technical problems of difficult labor, high rejection rate and the like caused by great mobility of workers. In addition, the whole device has simple structure and is convenient to popularize and apply.
The invention can be realized by the following technical scheme:
the MOCVD wafer integrated loading and unloading device comprises a storage unit, a loading unit, a wafer positioning unit and a stone mill positioning unit which are arranged in a closed cavity, wherein the closed cavity is communicated with MOCVD equipment;
the storage unit is used for storing a plurality of clamping plugs, and a plurality of wafers are stacked at equal intervals from top to bottom inside each clamping plug;
the wafer positioning unit is used for bearing a wafer and adjusting the angle of the wafer;
the stone mill positioning unit is used for bearing a stone mill and adjusting the angle of the stone mill;
the loading unit is used for realizing the one-by-one transmission of the wafers between the clamping plug and the wafer positioning unit, between the wafer positioning unit and the stone mill positioning unit and one-by-one transmission of the stone mill between the stone mill positioning unit and the MOCVD equipment.
Further, the loading unit is provided with three sets of tools, namely a U-shaped fork, a round fork and a sucker fork,
when the MOCVD process is carried out for loading, the loading unit firstly uses the U-shaped fork to transmit the wafers to the wafer positioning unit one by one from the clamping plug, then uses the sucker fork to transmit the wafers with the adjusted angles to the stone mill positioning unit one by one from the wafer positioning unit, and finally uses the round fork to transmit the stone mill with the adjusted angles to MOCVD equipment one by one from the stone mill positioning unit;
when the MOCVD process is carried out for blanking, the loading unit firstly uses the round fork to transmit the stone grinding discs which finish the MOCVD process to the stone grinding disc positioning unit one by one from MOCVD equipment, then uses the sucking disc fork to transmit the wafers in the stone grinding disc to the wafer positioning unit one by one from the stone grinding disc positioning unit, and finally uses the U-shaped fork to transmit the wafers from the wafer positioning unit to the clamping plugs one by one.
Further, the U-shaped fork contacts with the back surface of the wafer, the free ends of the two side fork arms and the central position of the middle connecting arm are respectively provided with a sucker,
the sucker fork is provided with a working surface matched with the shape of the wafer, and a plurality of suckers are uniformly arranged at intervals on the edge of the working surface;
the circular fork is provided with two arc arms matched with the shape of the stone mill, the two arc arms are oppositely arranged, and notches matched with the shape of the stone mill part are formed in the arc arms.
Further, the loading unit is arranged as a multi-degree-of-freedom mechanical arm, and three sets of tools are arranged at the tail end of the mechanical arm.
Further, the closed cavity is surrounded by a closed cover, a glove operation opening is arranged at one side of the closed cover corresponding to the position of the storage unit, a material conveying opening is arranged at the other side of the closed cover, the material conveying opening is used for conveying wafers from outside to the closed cavity or from the closed cavity to outside, and a plurality of pairs of gloves extending towards the closed cavity are arranged at the glove operation opening and are used for enabling operators to extend hands into the gloves to sort the wafers in the storage unit;
the sealing cover is also provided with a gas conveying port which is used for conveying nitrogen to the cavity to be sealed.
Further, a reverse blocking unit is arranged in the closed cavity and corresponds to the position of the material conveying port, and the reverse blocking unit is used for temporarily storing blocking.
The beneficial technical effects of the invention are as follows:
1. the loading unit is used for completing the transmission of the wafers and the stone mill discs among the storage unit, the wafer positioning unit, the stone mill disc positioning unit and the MOCVD equipment, so that the full-automatic operation of the upper and lower wafers of the MOCVD process is realized, a large amount of manual operation is saved, the risk of pollution and damage to the wafers is reduced, the production efficiency can be effectively improved, and meanwhile, the wafer positioning unit and the stone mill disc positioning unit can execute the angle adjustment of the wafers and the stone mill discs, a physical basis is provided for the transportation of the loading unit, and the smooth proceeding of the MOCVD process is ensured.
2. In consideration of the physical structures of the wafer positioning unit, the stone mill positioning unit and the storage unit, the loading unit is provided with three sets of tools to match with the transportation of the wafers and the stone mill, so that the stability of the transportation process is ensured, the wafers or the stone mill is prevented from being damaged due to abnormal conditions such as falling and the like, and the practicability is higher.
3. The whole device is sealed by means of the sealing cover and is communicated with MOCVD equipment, and pure nitrogen is introduced into the device to fully ensure the cleanliness of the whole MOCVD process, so that the quality of the MOCVD process is improved.
Drawings
FIG. 1 is an internal schematic view of the general structure of the present invention;
FIG. 2 is an external schematic view of the general structure of the present invention;
FIG. 3 is a schematic view of the structure of three sets of tools on the loading unit of the present invention;
FIG. 4 is a schematic diagram of a chuck filled with wafers according to the present invention;
FIG. 5 is a schematic view of a wafer-mounted stone disk of the present invention;
FIG. 6 is a schematic diagram of a wafer positioning unit according to the present invention;
FIG. 7 is a schematic view of the structure of the stone disk positioning unit of the present invention;
the device comprises a 1-storage unit, a 2-loading unit, a 21-U-shaped fork, a 22-sucker fork, a 23-round fork, a 24-sucker, a 25-notch, a 3-wafer positioning unit, a 4-graphite sheet positioning unit, a 5-MOCVD device, a 6-closed cover, a 61-glove operation port, a 62-material conveying port and a 7-inverted blocking unit.
Detailed Description
The following detailed description of the invention refers to the accompanying drawings and preferred embodiments.
As shown in fig. 1 and 2, the invention provides an MOCVD wafer integrated loading and unloading device, which comprises a storage unit 1, a loading unit 2, a wafer positioning unit 3 and a stone mill positioning unit 4 which are arranged in a closed cavity, wherein the closed cavity is communicated with MOCVD equipment 5; the storage unit 1 is used for storing a plurality of clamping plugs, and a plurality of wafers are stacked in each clamping plug at equal intervals from top to bottom, as shown in fig. 4; the wafer positioning unit 3 is used for bearing a wafer and adjusting the angle of the wafer; the stone mill positioning unit 4 is used for bearing a stone mill and adjusting the angle of the stone mill; the loading unit 2 is used for realizing the one-by-one transmission of wafers between the clamping plug and the wafer positioning unit 3, between the wafer positioning unit 3 and the stone mill positioning unit 4, and one-by-one transmission of stone mill between the stone mill positioning unit 4 and the MOCVD equipment 5. Therefore, the angle adjustment of the wafer and the stone mill is completed by means of the wafer positioning unit and the stone mill positioning unit, a physical basis is provided for the transmission of the loading unit, and then the transmission of the wafer and the stone mill among the storage unit, the wafer positioning unit, the stone mill positioning unit and the MOCVD equipment is realized by utilizing the loading unit, so that the full-automatic operation of wafer unloading and wafer unloading in the MOCVD process is realized, excessive manual operation is avoided, the technical problems of wafer scrapping, low production efficiency and the like caused by objective factors such as personnel flow, unskilled operation and the like are reduced, the rejection rate of the wafer can be effectively reduced, the production efficiency of the MOCVD process is improved, and the benefit of the whole production flow is improved.
The method comprises the following steps:
in order to meet the production requirement, as shown in fig. 2, a closed cavity is formed by enclosing a closed cover 6, and in consideration of the necessity of manual participation in the wafer arranging process, a glove operation opening 61 is arranged at one side of the closed cover 6 corresponding to the storage unit, and a plurality of pairs of gloves extending towards the closed cavity are arranged at the glove operation opening 61, so that an operator can conveniently extend the gloves to arrange wafers in the storage unit, and the loading unit can conveniently execute wafer transmission operation;
a material conveying port 62 is arranged on the other side of the closed cover 6 and is used for conveying wafers from outside to the closed cavity or from the closed cavity to outside, and in the normal case, the wafers which are subjected to MOCVD process or are required to be subjected to MOCVD process are uniformly loaded into the clamping plugs and then conveyed through the material conveying port, and in order to match the smoothness of clamping plug conveying, an inverted clamping plug unit 7 is arranged at the position of the material conveying port 62 and is used for temporarily storing the clamping plugs, so that the wafers which are required to be subjected to MOCVD process or the clamping plugs which are subjected to MOCVD process can be temporarily stored in the inverted clamping plug unit 7, and an operator can conveniently take and put the wafers;
because the MOCVD process is required to be carried out in a relatively clean environment, the gas delivery port is formed in the sealing cover 6, pure nitrogen is conveniently input into the sealing cavity, the cleanliness inside the sealing cavity is ensured, and meanwhile, the sealing cover is also communicated with MOCVD equipment into an integrated structure, so that the stone mill is conveniently transmitted to the MOCVD equipment by the loading unit, and the clean environment where the whole MOCVD process is located can reach ISOClass5.
The storage unit 1 adopts a tiled clothes closet structure, and a plurality of notches capable of containing the clamping plugs are formed in the clothes closet structure, so that the clamping plugs can be conveniently taken and placed, and the loading unit can carry out transportation of wafers.
In order to accommodate the transport of wafers, stone pans, as shown in fig. 3, the loading unit 2 is provided with three sets of tools, respectively a U-shaped fork 21, a suction cup fork 22 and a circular fork 23,
when the MOCVD process is carried out for loading, the loading unit 2 firstly uses the U-shaped fork 21 to transfer wafers to the wafer positioning unit 3 one by one from the clamping plugs, then uses the sucker fork 22 to transfer the wafers with the adjusted angles to the stone mill positioning unit 4 one by one from the wafer positioning unit 3, and finally uses the round fork 23 to transfer the stone mill with the adjusted angles to the MOCVD equipment 5 one by one from the stone mill positioning unit;
when the MOCVD process is carried out for blanking, the loading unit 2 firstly uses the circular fork 23 to transfer the stone grinding discs which finish the MOCVD process from the MOCVD equipment 5 to the stone grinding disc positioning unit 4 one by one, then uses the sucking disc fork 22 to transfer the wafers in the stone grinding disc from the stone grinding disc positioning unit 4 to the wafer positioning unit 3 one by one, and finally uses the U-shaped fork 21 to transfer the wafers from the wafer positioning unit 3 to the clamping plugs one by one.
Because the wafers loaded on the clamping plugs are uniformly arranged at intervals from top to bottom as shown in fig. 4, the wafer positioning unit is implemented by adopting a structure disclosed by a wafer flat edge identification deviation correcting device with the application number of 201820879100.X, and the patent name of the wafer flat edge identification deviation correcting device, as shown in fig. 6, the placed wafers are in a suspended state from top to bottom, so that the wafers can be transported by adopting a U-shaped fork 21, the free ends of two side fork arms of the U-shaped fork 21 and the central position of one middle connecting arm are respectively provided with a sucker 24, when the upper wafer is transported, the U-shaped fork is firstly inserted into the gap between two adjacent wafers, then the three suckers 24 on the U-shaped fork are started to absorb the back surfaces of the wafers, then the sucked wafers are driven to move to the upper part of the wafer positioning unit, and finally the wafers are released by the suckers, so that the wafers can be placed on the corresponding positions of the wafer positioning unit; and when the next sheet is transmitted, the opposite operation is performed.
Because the stone mill positioning unit 4 adopts the mechanism disclosed by the positioning mechanism which is applied for 201821201170.6 and has the patent name of a disc-type part to execute, the bottom surface of a wafer placed on the stone mill is completely contacted with the stone mill, as shown in fig. 7, the stone mill is transmitted by adopting the sucker fork 22, the sucker fork 22 is provided with a working surface matched with the shape of the wafer, and a plurality of suckers are uniformly arranged at the edge of the working surface at intervals, so that the contact area between the working surface and the front surface of the wafer can be reduced as much as possible, the risk of pollution to the wafer is reduced, and the stability of movement of the wafer can be completely ensured by the plurality of suckers arranged at the edge.
Because the stone mill adopts circular structure more, consequently can adopt circular fork 23 to transmit, this circular fork 23 be provided with stone mill dish appearance complex two arc arms, these two arc arms set up relatively, all be provided with on it with stone mill dish part appearance complex notch 25 to the convenient centre gripping stone mill transmits.
The loading unit 2 may be configured as a multi-degree-of-freedom mechanical arm or a cleaning robot with a multi-degree-of-freedom mechanical arm, and the cleaning robot is generally used in an integrated circuit manufacturing process, and the three tools are disposed at the tail end of the mechanical arm, so as to facilitate the transmission operation of wafers and stone grinding discs.
When the MOCVD process is carried out by utilizing the automatic MOCVD wafer integration up-down device, the operation is as follows:
1. preparation work
Firstly, an operator places a clamping plug filled with wafers in a clamping plug inverting unit through a material conveying port, then places the clamping plug in a clothes closet of a storage unit through a glove operation port, and finishes finishing work so as to facilitate a loading unit to take and place the wafers;
2. sheet loading operation
The loading unit firstly utilizes the U-shaped fork of the mechanical arm to transport the wafers one by one from the clamping plug to the wafer positioning unit for angle adjustment, after the wafer positioning unit completes the angle adjustment, the loading unit then absorbs the wafers one by one to the stone mill positioning unit through the sucking disc fork, and as the stone mill positioning unit can bear three wafers at one time, as shown in fig. 5, after the three wafers are transported, the angle adjustment of the stone mill is executed, and then the loading unit utilizes the round fork to transport the stone mill to the MOCVD equipment for executing the MOCVD process; considering the carrying capacity of MOCVD equipment, carrying out MOCVD process uniformly after transporting a plurality of stone grinding discs;
3. sheet feeding operation
The plurality of stone grinding discs for finishing the MOCVD process can be uniformly pushed out by MOCVD equipment, and as the wafers are finally placed into the clamping plugs and then conveyed to the outside through the material conveying ports, the physical structure of the clamping plugs determines that the wafers can only be loaded into the clamping plugs through the U-shaped fork, so that the process opposite to the loading operation is required to be executed to finish the unloading, namely the loading unit firstly conveys the stone grinding discs to the stone grinding disc positioning unit by using the round fork, then conveys the wafers from the stone grinding disc positioning unit to the wafer positioning unit by using the sucking disc fork, and finally conveys the wafers from the wafer positioning unit to the clamping plugs by using the U-shaped fork.
While particular embodiments of the present invention have been described above, it will be appreciated by those skilled in the art that these are merely illustrative, and that many changes and modifications may be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims.
Claims (6)
1. The utility model provides an integrated piece device about MOCVD wafer which characterized in that: the device comprises a storage unit, a loading unit, a wafer positioning unit and a stone mill positioning unit which are arranged in a closed cavity, wherein the closed cavity is communicated with MOCVD equipment;
the storage unit is used for storing a plurality of clamping plugs, and a plurality of wafers are stacked at equal intervals from top to bottom inside each clamping plug;
the wafer positioning unit is used for bearing a wafer and adjusting the angle of the wafer;
the stone mill positioning unit is used for bearing a stone mill and adjusting the angle of the stone mill;
the loading unit is used for realizing the one-by-one transmission of the wafers between the clamping plug and the wafer positioning unit, between the wafer positioning unit and the stone mill positioning unit and one-by-one transmission of the stone mill between the stone mill positioning unit and the MOCVD equipment.
2. The MOCVD wafer integrated wafer loading and unloading device according to claim 1, wherein: the loading unit is provided with three sets of tools, namely a U-shaped fork, a round fork and a sucking disc fork,
when the MOCVD process is carried out for loading, the loading unit firstly uses the U-shaped fork to transmit the wafers to the wafer positioning unit one by one from the clamping plug, then uses the sucker fork to transmit the wafers with the adjusted angles to the stone mill positioning unit one by one from the wafer positioning unit, and finally uses the round fork to transmit the stone mill with the adjusted angles to MOCVD equipment one by one from the stone mill positioning unit;
when the MOCVD process is carried out for blanking, the loading unit firstly uses the round fork to transmit the stone grinding discs which finish the MOCVD process to the stone grinding disc positioning unit one by one from MOCVD equipment, then uses the sucking disc fork to transmit the wafers in the stone grinding disc to the wafer positioning unit one by one from the stone grinding disc positioning unit, and finally uses the U-shaped fork to transmit the wafers from the wafer positioning unit to the clamping plugs one by one.
3. The MOCVD wafer integrated wafer loading and unloading device according to claim 2, wherein: the U-shaped fork contacts with the back surface of the wafer, the free ends of the two side fork arms and the central position of the middle connecting arm are respectively provided with a sucker,
the sucker fork is provided with a working surface matched with the shape of the wafer, and a plurality of suckers are uniformly arranged at intervals on the edge of the working surface;
the circular fork is provided with two arc arms matched with the shape of the stone mill, the two arc arms are oppositely arranged, and notches matched with the shape of the stone mill part are formed in the arc arms.
4. The MOCVD wafer integrated wafer loading and unloading device according to claim 3, wherein: the loading unit is arranged as a multi-degree-of-freedom mechanical arm, and three sets of tools are arranged at the tail end of the mechanical arm.
5. The MOCVD wafer integrated wafer loading and unloading device according to claim 1, wherein: the closed cavity is surrounded by a closed cover, a glove operation opening is arranged at one side of the closed cover corresponding to the storage unit, a material conveying opening is arranged at the other side of the closed cover, the material conveying opening is used for conveying wafers from outside to the closed cavity or from the closed cavity to outside, and a plurality of pairs of gloves extending towards the closed cavity are arranged at the glove operation opening and are used for enabling operators to extend hands into the gloves to tidy the wafers in the storage unit;
the sealing cover is also provided with a gas conveying port which is used for conveying nitrogen to the cavity to be sealed.
6. The MOCVD wafer integrated wafer loading and unloading device according to claim 5, wherein: and an inverted blocking unit is arranged in the closed cavity and corresponds to the position of the material conveying port, and the inverted blocking unit is used for temporarily storing blocking.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202310104957.XA CN116145113B (en) | 2023-02-13 | 2023-02-13 | MOCVD wafer integrated loading and unloading device |
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|---|---|---|---|
| CN202310104957.XA CN116145113B (en) | 2023-02-13 | 2023-02-13 | MOCVD wafer integrated loading and unloading device |
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| CN116145113A true CN116145113A (en) | 2023-05-23 |
| CN116145113B CN116145113B (en) | 2024-05-03 |
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| CN115662929A (en) * | 2022-10-25 | 2023-01-31 | 中山德华芯片技术有限公司 | Automatic epitaxial wafer loading and unloading equipment and manufacturing process |
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