CN116021359B - Silicon wafer fine grinding device capable of automatically adjusting polished workpiece - Google Patents
Silicon wafer fine grinding device capable of automatically adjusting polished workpiece Download PDFInfo
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- CN116021359B CN116021359B CN202310324929.9A CN202310324929A CN116021359B CN 116021359 B CN116021359 B CN 116021359B CN 202310324929 A CN202310324929 A CN 202310324929A CN 116021359 B CN116021359 B CN 116021359B
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Abstract
The invention discloses a silicon wafer fine grinding device capable of automatically adjusting and grinding workpieces, which relates to the technical field of surface treatment and comprises a machine body and processing cavities, wherein each processing cavity is internally provided with a processing device, and the processing device comprises: grind the intracavity, be provided with grinder in the grinding chamber, grinder intercommunication has the heat sink, grinder includes: the lifting ring is in sliding connection with the inner wall of the grinding cavity, a sliding ring is arranged on the surface of the lifting ring, and the inner wall of the sliding ring is a placing opening; the grinding device is started in the accurate grinding process, the controller controls the cooling device, the cooling device sprays grinding liquid to the accurate-ground silicon wafers immediately, the grinding liquid then enters between the grinding ring and the silicon wafers, the grinding liquid immediately cools the silicon wafers and the grinding ring, and scraps generated by grinding are moved to one side far away from the silicon wafers while cooling, so that the situation that the grinding scraps remain on the surfaces of the silicon wafers to damage the surfaces of the silicon wafers is avoided, and the grinding quality of the silicon wafers is improved.
Description
Technical Field
The invention relates to the technical field of surface treatment, in particular to a silicon wafer fine grinding device capable of automatically adjusting and grinding workpieces.
Background
The semiconductor material is widely applied to industries such as electronics, new energy and the like, and the solar cell is a device for converting light energy into electric energy by using the semiconductor material such as a silicon wafer, has the advantages of low carbon, environmental protection, no pollution, abundant resources, simple utilization, high reliability and the like, and has been increasingly utilized;
in the production process of the silicon wafer, surface treatment is usually required, the production requirement can be met after the surface treatment, in the existing silicon wafer surface treatment process, the ground silicon wafer surface is scratched more due to unreasonable structural design of a grinding device, meanwhile, the worn grinding particles are often adhered between the silicon wafer and a grinding plate, scraps are easily adhered to the silicon wafer surface in the accurate grinding process, so that scratches or damage to the silicon wafer surface are easy to occur, the rejection rate of accurate grinding of the silicon wafer is increased, and the production cost is increased.
Disclosure of Invention
The invention aims to provide a silicon wafer fine grinding device capable of automatically adjusting and grinding workpieces, so as to solve the problems in the background art.
In order to solve the technical problems, the invention provides the following technical scheme:
the utility model provides an automatic adjustment polishing workpiece's silicon chip correct grinding processingequipment, includes the organism, a plurality of processing chamber has been seted up on the organism, the center of organism is provided with the arm, every be provided with processingequipment in the processing chamber, processingequipment includes: grind the intracavity, be provided with grinder in the grinding chamber, grinder intercommunication has the heat sink, grinder includes: the lifting ring is in sliding connection with the inner wall of the grinding cavity, a rack is arranged on the side wall of the lifting ring, a rotating gear is arranged on the inner wall of the grinding cavity, the rotating gear is driven by a micro motor, and the rack is meshed with the rotating gear;
a sliding ring is arranged on the surface of the lifting ring, and the inner wall of the sliding ring is a placing opening; the bottom of the sliding ring is provided with a grinding ring, the sliding ring and the grinding ring form a C-shaped structure, the grinding ring consists of a plurality of sector plates, and the sector plates are connected with the sliding ring through clamping grooves.
The mechanical arm is controlled by a worker to start, the mechanical arm conveys the silicon wafer to be refined into one of the processing cavities, the silicon wafer immediately enters the grinding cavity through the placement opening under the action of the mechanical arm, then the silicon wafer is placed in the grinding device, then the grinding device is controlled by the controller to start, the silicon wafer is immediately refined by the grinding device, the grinding device is started in the refining process, the cooling device is controlled by the controller to start, the cooling device immediately sprays grinding liquid to the refined silicon wafer, the grinding liquid then enters between the grinding ring and the silicon wafer, the grinding liquid immediately cools the silicon wafer and the grinding ring, and scraps generated by grinding are moved to one side far away from the silicon wafer while cooling, so that the phenomenon that the surface of the silicon wafer is damaged due to residual grinding scraps on the surface of the silicon wafer is avoided, and the grinding quality of the silicon wafer is improved.
Preferably, the lifting ring and the sliding ring are composed of two semicircular rings, the two semicircular rings forming the lifting ring are respectively in sliding connection with the side wall of the grinding cavity, the two semicircular rings forming the sliding ring are respectively connected with the two semicircular rings forming the lifting ring, and the semicircular rings in the sliding ring are consistent with the semicircular ring opening directions in the lifting ring.
Preferably, the grinding device further comprises: the arc piece, the arc piece is provided with a plurality of, a plurality of the arc piece encircles along grinding the chamber axis and arranges, one side that grinding intracavity wall was kept away from to the arc piece is provided with the rotating block, the rotating block surface is provided with the sucking disc, the inside of rotating block is provided with the air pump, the sucking disc passes through the pipe connection air pump, a plurality of arc groove has been seted up around on the lateral wall of rotating block, arc groove and arc piece outer wall contact.
Preferably, the bottom of turning block is provided with the pivot, one side that the turning block was kept away from to the pivot is provided with the rotor arm, one side that the rotor arm was kept away from the pivot is provided with the motor cabinet, be provided with the motor in the motor cabinet, the drive shaft in the motor is connected the rotor arm, one side that the rotor arm was kept away from to the motor cabinet is provided with removes the seat, remove the seat and pass through slide rail and grind chamber bottom sliding connection.
Preferably, a main gear is arranged at one end of the motor driving shaft in the motor seat penetrating through the rotating arm, a driven gear is arranged at one end of the rotating shaft penetrating through the rotating arm, the rotating shaft is rotationally connected with the rotating arm through the driven gear, and an idler gear is meshed between the main gear and the driven gear;
the mechanical arm places the silicon chip on the surface of the rotating block through the placing opening, so that the lower surface of the silicon chip is in contact with the sucker, then the controller controls the air pump in the rotating block to be started, the air pump pumps air in the sucker outwards, then the silicon chip is extruded on the surface of the rotating block under the action of pressure, when the axis of the placing opening is coincident with the axis of the rotating block, the moving seat is at an eccentric position, then the controller controls the motor in the moving seat to be started, a driving shaft in the motor drives the moving seat to move, the moving seat moves towards the center of the grinding cavity along the sliding rail, the moving seat drives the motor seat to move in the moving process of the moving seat, the motor seat drives the rotating arm to move, the rotating arm moves, the rotating shaft drives the rotating block to move, and the rotating block drives the silicon chip to move, so that the silicon chip stretches into a gap between the arc block and the grinding ring;
when the silicon wafer moves to the bottom of the grinding ring, at the moment, the moving seat and the motor seat are positioned at the axial line position of the grinding cavity, the motor in the motor seat is controlled by the controller to start, the driving shaft in the motor drives the rotating arm to rotate, the rotating arm rotates around the axial line of the grinding cavity, and in the rotating process of the rotating arm, the rotating arm drives the rotating shaft to rotate, and the rotating shaft drives the rotating block to rotate, and the rotating block drives the silicon wafer to rotate, so that the silicon wafer revolves around the axial line of the grinding cavity;
in the process that the motor in the motor seat drives the rotating arm to rotate, the driving shaft in the motor also drives the main gear in the rotating arm to rotate, the main gear is meshed with the transmission idler gear when rotating, the idler gear rotates to drive the driven gear to rotate, the driven gear rotates to drive the rotating shaft to rotate, the rotating shaft rotates to generate rotation, the rotating shaft rotates to drive the rotating block to rotate, and the rotating block drives the silicon wafer to rotate, so that the silicon wafer rotates around the axis of the rotating block;
the silicon wafer makes revolution motion and autorotation motion, so that the grinding ring can uniformly conduct fine grinding treatment on the surface of the silicon wafer, the fine grinding quality of the surface of the silicon wafer is improved, as the grinding ring only covers two thirds of the silicon wafer during grinding, scraps on the part of the surface of the silicon wafer outside the grinding ring can be thrown outwards under the action of centrifugal force during grinding, the scraps leave the surface of the silicon wafer, and the silicon wafer is prevented from being damaged by the scraps during grinding;
the grinding ring consists of a plurality of sector plates, when the sector plates are seriously worn, the controller controls the micro motor in the inner wall of the grinding cavity to start, the driving shaft in the micro motor drives the gear to rotate, the gear is meshed with the transmission rack, then the lifting ring moves under the action of the gear rack, the lifting ring moves to one side far away from the grinding cavity, the lifting ring moves to drive the sliding ring to move, when the lifting ring moves to the farthest stroke, a worker removes the severely worn sector plates from the clamping grooves in the sliding ring, then the severely worn sector plates are conveyed out of the grinding cavity through the placement opening, then the mechanical arm is completely replaced, then the controller controls the lifting ring to reset, the lifting ring moves the grinding ring to reset, so that the abrasion of the grinding ring is avoided, the quality problem of a silicon wafer in the accurate grinding process is caused, and the accurate grinding quality of the silicon wafer is improved;
when the silicon wafer needs to be subjected to simple surface treatment, staff can sequentially increase the number of sector plates forming the grinding ring, so that the silicon wafer is polished for a plurality of circles in the grinding cavity, the simple treatment of the surface of the silicon wafer is finished, the time for the surface treatment of the silicon wafer is saved, and the efficiency of the surface treatment of the silicon wafer is improved;
when one of them sector plate wearing and tearing are serious after, the regional rising of semicircle ring that the serious sector plate of controller control wearing and tearing is located, and the staff replaces the serious sector plate of wearing and tearing, need not to carry out the lifting with whole lift ring at the in-process of replacement, has saved the time of lift ring lifting, and then has improved the efficiency of sector plate replacement, and when one of them semicircle ring was risen, does not influence another semicircle ring.
Preferably, the cooling device includes: the movable groove is formed in the arc-shaped block, a pushing block is connected in the movable groove in a sliding mode, a pushing plate is arranged on one side, close to the movable groove, of the pushing block, and a spring is arranged between the pushing plate and the pushing block; the one side that the push plate is close to the organism is provided with the transfer line, be provided with the rubber hose in the transfer line, the rubber hose top is provided with the liquid outlet, the rubber hose bottom is provided with the inlet, liquid outlet and inlet all are provided with the check valve.
Preferably, the top of transfer line is provided with the spout, the inside of lifting ring is encircleed and is set up spouting the groove, spout groove intercommunication spout, spout the groove and constitute by chute and flat groove, spout the upper surface in groove flat groove and the lower surface of grinding ring and be in the coplanar.
Preferably, a filter cavity is arranged at the bottom of the grinding cavity, and grinding liquid is filled in the filter cavity; a plurality of layers of filter screens are arranged in the filter cavity, a pump is arranged at the bottom of the filter cavity, and the filter cavity is communicated with a transfusion tube;
when the movable seat drives the silicon wafer to move below the grinding ring, the controller controls the pump in the filter cavity to start, the pump conveys grinding fluid to the top of the infusion tube, in the process of rotating the rotating block, the inner wall of the arc-shaped groove is contacted with the outer wall of the arc-shaped block, in the process of contacting, the arc-shaped groove is contacted with the pushing block, the pushing block pushes the pushing block to one side far away from the rotating block, the pushing block moves along the movable groove, in the process of moving the pushing block, the pushing block drives the pushing plate to move to one side close to the rubber hose, the pushing plate immediately extrudes the rubber hose, the internal pressure of the rubber hose is increased after extrusion, the grinding fluid in the rubber hose is immediately sprayed to the top of the infusion tube through a one-way valve in a liquid outlet, then the grinding fluid is conveyed to a spraying groove through a spout in the top of the infusion tube, and slides to a flat groove of the spraying groove through a chute of the spraying groove, as the upper surface of the flat groove of the spraying groove is in the same plane with the lower surface of the grinding ring, the grinding fluid is sucked between the ring and the silicon wafer under the action of capillary phenomenon, the grinding fluid immediately dissipates heat of the pushing block, the pushing plate moves to one side close to the pushing plate, the grinding fluid immediately extrudes the silicon wafer, and the grinding fluid is prevented from flowing into the surface of the silicon wafer under the action of the grinding fluid, and the grinding chips are prevented from being scraped and the grinding dust and the silicon wafer is prevented from being moved under the action of the grinding surface of the grinding wafer and the grinding wafer;
the grinding fluid is mixed with the fragments and is thrown out of the surface of the silicon wafer and falls into the filter cavity, then the grinding fluid is filtered by the multi-layer filter screen in the filter cavity, the fragments are blocked and collected by the multi-layer filter screen, the filtered grinding fluid is conveyed into the infusion tube under the action of the pump, after the fine grinding of the silicon wafer is completed, the controller controls the movable seat to move, the movable seat drives the rotary block to move, the axis of the rotary block coincides with the axis of the placement opening, then the air pump in the rotary block is controlled by the controller to suck air, and the air is conveyed into the sucker through the pipeline, so that the silicon wafer is separated from the sucker, and then the silicon wafer is taken away by the mechanical arm.
Compared with the prior art, the invention has the following beneficial effects:
1. the silicon wafer is subjected to revolution motion and autorotation motion, so that the grinding ring can uniformly conduct fine grinding treatment on the surface of the silicon wafer, the fine grinding quality of the surface of the silicon wafer is improved, and as the grinding ring can only cover two thirds of the silicon wafer during grinding, scraps on the surface of the silicon wafer outside the grinding ring can be thrown outwards under the action of centrifugal force in the grinding process, scraps leave the surface of the silicon wafer, and the silicon wafer is prevented from being damaged by scraps in the grinding process.
2. The grinding fluid in the rubber hose is sprayed to the top of the infusion tube through the one-way valve in the liquid outlet, then the grinding fluid is conveyed to the spraying groove through the nozzle at the top of the infusion tube, and slides to the flat groove of the spraying groove through the chute of the spraying groove.
3. When the sector plates are seriously worn, the controller controls the micro motor in the inner wall of the grinding cavity to start, the driving shaft in the micro motor drives the gear to rotate, the gear is meshed with the transmission rack, then the lifting ring moves under the action of the gear and the rack, the lifting ring moves to the side far away from the grinding cavity, the sliding ring is driven to move when the lifting ring moves, the sliding ring drives the grinding ring to move, when the lifting ring moves to the farthest stroke, a worker takes down the severely worn sector plates from the clamping grooves in the sliding ring, then the severely worn sector plates are conveyed out of the grinding cavity through the placement opening, then the mechanical arm is completely replaced, then the controller controls the lifting ring to reset, the lifting ring moves the grinding ring to reset, abrasion of the grinding ring is avoided, so that quality problems of silicon wafers in the accurate grinding process are caused, and the accurate grinding quality of the silicon wafers is improved.
4. When the silicon wafer needs to be subjected to simple surface treatment, the number of sector plates forming the grinding ring can be sequentially increased by staff, so that the silicon wafer is polished for a plurality of circles in the grinding cavity, the simple treatment of the surface of the silicon wafer is finished, the time for the surface treatment of the silicon wafer is saved, and the efficiency of the surface treatment of the silicon wafer is improved.
5. When one of them sector plates wearing and tearing are serious, the controller control wearing and tearing are serious the sector plate and are located semicircle ring region and rise, and the staff replaces the serious sector plate of wearing and tearing, need not to carry out the lifting with whole lift ring at the in-process of replacement, has saved the time of lift ring lifting, and then has improved the efficiency that the sector plate was replaced.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of the structure of the present invention during processing of a silicon wafer;
FIG. 3 is a schematic view of the structure of the present invention in the process of transporting silicon wafers;
FIG. 4 is a schematic view of the internal structure of the present invention;
FIG. 5 is a schematic diagram of the structure of the rotating block and the arc-shaped block;
FIG. 6 is a top view of the rotating block and arcuate block;
FIG. 7 is a schematic view of the internal structure of the rotating arm;
fig. 8 is an enlarged view at a in fig. 4;
fig. 9 is an exploded view of the construction of the lift ring, the grind ring and the slip ring.
In the figure: 1. a body; 11. a processing chamber; 12. a grinding chamber; 13. a placement port;
2. a grinding device; 21. a lifting ring; 212. a spraying groove; 22. a slip ring; 23. a grinding ring; 24. an arc-shaped block; 25. a rotating block; 251. an arc-shaped groove; 26. a rotating shaft; 27. a rotating arm; 28. a motor base; 29. a movable seat;
3. a cooling device; 31. a moving groove; 32. a pushing block; 33. a pushing plate; 34. an infusion tube; 35. a rubber hose; 36. a filter chamber.
Description of the embodiments
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 9, the present invention provides the following technical solutions:
the utility model provides an automatic adjustment polishing workpiece's silicon chip finish grinding processingequipment, includes organism 1, a plurality of processing chamber 11 has been seted up on the organism 1, the center of organism 1 is provided with the arm, every be provided with processingequipment in the processing chamber 11, processingequipment includes: grind chamber 12, be provided with grinder 2 in the grind chamber 12, grinder 2 intercommunication has heat sink 3, grinder 2 includes: the lifting ring 21 is in sliding connection with the inner wall of the grinding cavity 12, a rack is arranged on the side wall of the lifting ring 21, a rotating gear is arranged on the inner wall of the grinding cavity 12, the rotating gear is driven by a micro motor, and the rack is meshed with the rotating gear;
the surface of lift ring 21 is provided with slip ring 22, the inner wall of slip ring 22 is for placing mouth 13, the bottom of slip ring 22 is provided with grinding ring 23, slip ring 22 and grinding ring 23 constitute C type structure, grinding ring 23 comprises a plurality of sector plate, the sector plate passes through the draw-in groove with slip ring 22 and is connected.
The mechanical arm is controlled by a worker to start, the mechanical arm conveys the silicon wafer to be refined into one of the processing chambers 11, the silicon wafer immediately enters the grinding chamber 12 through the placement opening 13 under the action of the mechanical arm, then the silicon wafer is placed in the grinding device 2, then the grinding device 2 is controlled by the controller to start, the grinding device 2 immediately carries out fine grinding processing on the silicon wafer, the grinding device 2 is controlled by the controller to start the cooling device 3 in the fine grinding process, the cooling device 3 immediately sprays grinding liquid to the fine grinding silicon wafer, the grinding liquid then enters between the grinding ring 23 and the silicon wafer, the grinding liquid immediately cools the silicon wafer and the grinding ring 23, and meanwhile, the chips generated by grinding are moved to the side far away from the silicon wafer, so that the damage to the surface of the silicon wafer caused by the residual grinding chips on the surface of the silicon wafer is avoided.
As a specific embodiment of the present invention, the lifting ring 21 and the sliding ring 22 are composed of two semicircular rings, the two semicircular rings that compose the lifting ring 21 are respectively slidably connected with the side wall of the grinding chamber 12, the two semicircular rings that compose the sliding ring 22 are respectively connected with the two semicircular rings that compose the lifting ring 21, and the semicircular rings in the sliding ring 22 are consistent with the semicircular ring opening direction in the lifting ring 21.
As a specific embodiment of the present invention, the polishing apparatus 2 further includes: the arc piece 24, the arc piece 24 is provided with a plurality of, and a plurality of the arc piece 24 encircles along grinding chamber 12 axis and arranges, one side that grinding chamber 12 inner wall was kept away from to the arc piece 24 is provided with the rotating block 25, the rotating block 25 surface is provided with the sucking disc, the inside of rotating block 25 is provided with the air pump, the sucking disc passes through the pipe connection air pump, a plurality of arc groove 251 has been seted up around on the lateral wall of rotating block 25, arc groove 251 and arc piece 24 outer wall contact.
As a specific embodiment of the present invention, a rotating shaft 26 is disposed at the bottom of the rotating block 25, a rotating arm 27 is disposed at a side of the rotating shaft 26 away from the rotating block 25, a motor seat 28 is disposed at a side of the rotating arm 27 away from the rotating shaft 26, a motor is disposed in the motor seat 28, a driving shaft in the motor is connected with the rotating arm 27, a moving seat 29 is disposed at a side of the motor seat 28 away from the rotating arm 27, and the moving seat 29 is slidably connected with the bottom of the grinding cavity 12 through a sliding rail.
As a specific embodiment of the present invention, a main gear is disposed at one end of the motor driving shaft in the motor base 28 passing through the rotating arm 27, a driven gear is disposed at one end of the rotating shaft 26 passing through the rotating arm 27, the rotating shaft 26 is rotatably connected with the rotating arm 27 through the driven gear, and an idler gear is meshed between the main gear and the driven gear;
the mechanical arm places the silicon wafer on the surface of the rotating block 25 through the placing opening 13, so that the lower surface of the silicon wafer is in contact with the sucking disc, then the controller controls the air pump in the rotating block 25 to start, the air pump pumps the air in the sucking disc outwards, then the silicon wafer is extruded on the surface of the rotating block 25 under the action of pressure, when the axis of the placing opening 13 is coincident with the axis of the rotating block 25, the moving seat 29 is at an eccentric position, then the controller controls the motor in the moving seat 29 to start, a driving shaft in the motor drives the moving seat 29 to move, the moving seat 29 moves towards the central position of the grinding cavity 12 along the sliding rail, in the moving process of the moving seat 29, the moving seat 29 drives the motor seat 28 to move, the motor seat 28 drives the rotating arm 27 to move, the rotating shaft 26 is driven to move when the rotating arm 27 moves, the rotating shaft 26 drives the rotating block 25 to move, and the rotating block 25 drives the silicon wafer to move, so that the silicon wafer stretches into a gap between the arc block 24 and the grinding ring 23;
when the silicon wafer moves to the bottom of the grinding ring 23, at this time, the moving seat 29 and the motor seat 28 are positioned at the axial position of the grinding cavity 12, the motor in the motor seat 28 is controlled by the controller to start, the driving shaft in the motor drives the rotating arm 27 to rotate, the rotating arm 27 rotates around the axial line of the grinding cavity 12, in the rotating process of the rotating arm 27, the rotating arm 27 drives the rotating shaft 26 to rotate, the rotating shaft 26 drives the rotating block 25 to rotate, and the rotating block 25 drives the silicon wafer to rotate, so that the silicon wafer revolves around the axial line of the grinding cavity 12;
in the process that the motor in the motor seat 28 drives the rotating arm 27 to rotate, the driving shaft in the motor also drives the main gear in the rotating arm 27 to rotate, the main gear is meshed with the transmission idler gear when rotating, the idler gear rotates to drive the driven gear to rotate, the driven gear rotates to drive the rotating shaft 26 to rotate, the rotating shaft 26 rotates immediately, the rotating shaft 26 rotates to drive the rotating block 25 to rotate, and the rotating block 25 drives the silicon wafer to rotate, so that the silicon wafer rotates around the axis of the rotating block 25;
the silicon wafer makes revolution motion and autorotation motion, so that the grinding ring 23 can uniformly conduct fine grinding treatment on the surface of the silicon wafer, and as the grinding ring 23 only covers two thirds of the silicon wafer during grinding, scraps on the surface of the silicon wafer outside the grinding ring 23 can be thrown outwards under the action of centrifugal force in the grinding process, the scraps leave the surface of the silicon wafer, and the silicon wafer is prevented from being damaged by scraps in the grinding process;
because the grinding ring 23 is composed of a plurality of sector plates, when the sector plates are severely worn, the controller controls the micro motor in the inner wall of the grinding cavity 12 to start, the driving shaft in the micro motor drives the gear to rotate, the gear is meshed with the transmission rack, then the lifting ring 21 moves under the action of the gear rack, the lifting ring 21 moves to one side far away from the grinding cavity 12, the lifting ring 21 moves to drive the sliding ring 22 to move, the sliding ring 22 drives the grinding ring 23 to move, when the lifting ring 21 moves to the farthest stroke, a worker controls the mechanical arm to take the sector plates severely worn out from the clamping grooves in the sliding ring 22 through the controller, then the sector plates are conveyed out of the grinding cavity 12 through the placement opening 13, then the mechanical arm is completely replaced, then the controller controls the lifting ring 21 to reset, and the lifting ring 21 drives the grinding ring 23 to reset, so that the grinding ring 23 is prevented from being worn;
when one of the fan-shaped plates is seriously worn, the controller controls the semicircular ring area where the severely worn fan-shaped plate is located to be lifted, and workers replace the severely worn fan-shaped plate, so that the whole lifting ring 21 is not required to be lifted in the replacement process, and one semicircular ring is not influenced when the other semicircular ring is lifted.
As a specific embodiment of the present invention, the cooling device 3 includes: the movable groove 31 is formed in the arc-shaped block 24, a pushing block 32 is connected in a sliding manner in the movable groove 31, a pushing plate 33 is arranged on one side, close to the movable groove 31, of the pushing block 32, and a spring is arranged between the pushing plate 33 and the pushing block 32; the one side that promotes board 33 is close to organism 1 is provided with transfer line 34, be provided with rubber hose 35 in the transfer line 34, rubber hose 35 top is provided with the liquid outlet, rubber hose 35 bottom is provided with the inlet, liquid outlet and inlet all are provided with the check valve.
As a specific embodiment of the present invention, a nozzle is disposed at the top of the infusion tube 34, a spraying groove 212 is formed around the inner ring of the lifting ring 21, the spraying groove 212 is communicated with the nozzle, the spraying groove 212 is composed of a chute and a flat groove, and the upper surface of the flat groove of the spraying groove 212 is in the same plane with the lower surface of the grinding ring 23.
As a specific embodiment of the present invention, a filter cavity 36 is disposed at the bottom of the grinding cavity 12, and the filter cavity 36 is filled with grinding fluid; a plurality of layers of filter screens are arranged in the filter cavity 36, a pump is arranged at the bottom of the filter cavity 36, and the filter cavity 36 is communicated with the infusion tube 34;
when the movable seat 29 drives the silicon wafer to move below the grinding ring 23, the controller controls the pump in the filter cavity 36 to start, the pump conveys the grinding fluid into the infusion tube 34, in the process of rotating the rotary block 25, the inner wall of the arc groove 251 is contacted with the outer wall of the arc block 24, in the process of contact, the arc groove 251 contacts the pushing block 32, the arc groove 251 pushes the pushing block 32 to one side far away from the rotary block 25, the pushing block 32 moves along the movable groove 31, in the process of moving the pushing block 32, the pushing block 32 drives the pushing plate 33 to move to one side close to the rubber hose 35, the pushing plate 33 immediately extrudes the rubber hose 35, the inner pressure is increased after extrusion, the grinding fluid in the rubber hose 35 is sprayed out to the top of the infusion tube 34 through the one-way valve in the liquid outlet, then the grinding fluid is conveyed into the spraying groove 212 through the spout at the top of the infusion tube 34, the chute of the spraying groove 212 slides to the flat groove, as the upper surface of the flat groove 212 is in the same plane with the lower surface of the grinding ring 23, the grinding fluid is sucked into the capillary ring 23 under the action, the action of the capillary action, the silicon wafer is prevented from being rotated to the surface of the grinding fluid from the grinding ring 23, and the chips are prevented from being scraped off the surface of the grinding fluid and falling from the grinding ring, and falling down from the grinding fluid is prevented from being placed under the action of the grinding ring;
the grinding fluid is mixed with the scraps and is thrown out of the surface of the silicon wafer and falls into the filter cavity 36, then the grinding fluid is filtered by the multi-layer filter screen in the filter cavity 36, the scraps are blocked and collected by the multi-layer filter screen, the filtered grinding fluid is conveyed into the infusion tube 34 under the action of the pump, after the fine grinding of the silicon wafer is finished, the controller controls the movable seat 29 to move, the movable seat 29 drives the rotary block 25 to move, the axis of the rotary block 25 coincides with the axis of the placing port 13, then the controller controls the air pump in the rotary block 25 to suck air, and the air is conveyed into the sucker through the pipeline, so that the silicon wafer is separated from the sucker, and then the mechanical arm takes away the silicon wafer.
The working principle of the invention is as follows:
the operator controls the mechanical arm to start, the mechanical arm conveys the silicon wafer to be finely ground into one of the processing cavities 11, the silicon wafer immediately enters the grinding cavity 12 through the placing opening 13 under the action of the mechanical arm, and then the silicon wafer is placed in the grinding device 2;
the mechanical arm places the silicon wafer on the surface of the rotating block 25 through the placing opening 13, so that the lower surface of the silicon wafer is in contact with the sucking disc, then the controller controls the air pump in the rotating block 25 to start, the air pump pumps the air in the sucking disc outwards, then the silicon wafer is extruded on the surface of the rotating block 25 under the action of pressure, when the axis of the placing opening 13 is coincident with the axis of the rotating block 25, the moving seat 29 is at an eccentric position, then the controller controls the motor in the moving seat 29 to start, a driving shaft in the motor drives the moving seat 29 to move, the moving seat 29 moves towards the central position of the grinding cavity 12 along the sliding rail, in the moving process of the moving seat 29, the moving seat 29 drives the motor seat 28 to move, the motor seat 28 drives the rotating arm 27 to move, the rotating shaft 26 is driven to move when the rotating arm 27 moves, the rotating shaft 26 drives the rotating block 25 to move, and the rotating block 25 drives the silicon wafer to move, so that the silicon wafer stretches into a gap between the arc block 24 and the grinding ring 23;
when the silicon wafer moves to the bottom of the grinding ring 23, at this time, the moving seat 29 and the motor seat 28 are positioned at the axial position of the grinding cavity 12, the motor in the motor seat 28 is controlled by the controller to start, the driving shaft in the motor drives the rotating arm 27 to rotate, the rotating arm 27 rotates around the axial line of the grinding cavity 12, in the rotating process of the rotating arm 27, the rotating arm 27 drives the rotating shaft 26 to rotate, the rotating shaft 26 drives the rotating block 25 to rotate, and the rotating block 25 drives the silicon wafer to rotate, so that the silicon wafer revolves around the axial line of the grinding cavity 12;
in the process that the motor in the motor seat 28 drives the rotating arm 27 to rotate, the driving shaft in the motor also drives the main gear in the rotating arm 27 to rotate, the main gear is meshed with the transmission idler gear when rotating, the idler gear rotates to drive the driven gear to rotate, the driven gear rotates to drive the rotating shaft 26 to rotate, the rotating shaft 26 rotates immediately, the rotating shaft 26 rotates to drive the rotating block 25 to rotate, and the rotating block 25 drives the silicon wafer to rotate, so that the silicon wafer rotates around the axis of the rotating block 25;
the silicon wafer makes revolution motion and autorotation motion, so that the grinding ring 23 can uniformly conduct fine grinding treatment on the surface of the silicon wafer, and as the grinding ring 23 only covers two thirds of the silicon wafer during grinding, scraps on the surface of the silicon wafer outside the grinding ring 23 can be thrown outwards under the action of centrifugal force in the grinding process, the scraps leave the surface of the silicon wafer, and the silicon wafer is prevented from being damaged by scraps in the grinding process;
because the grinding ring 23 is composed of a plurality of sector plates, when one sector plate is severely worn, the controller controls the micro motor in the inner wall of the grinding cavity 12 to start, the driving shaft in the micro motor drives the gear to rotate, the gear is meshed with the transmission rack, then the lifting ring 21 moves under the action of the gear rack, the lifting ring 21 moves to the side far away from the grinding cavity 12, the sliding ring 22 is driven to move when the lifting ring 21 moves, the sliding ring 22 drives the grinding ring 23 to move, when the lifting ring 21 moves to the farthest stroke, a worker removes the severely worn sector plate from the clamping groove in the sliding ring 22, then the sector plate is conveyed out of the grinding cavity 12 through the placement opening 13, then the mechanical arm is used for completely new replacement, then the controller controls the lifting ring 21 to reset, and the lifting ring 21 drives the grinding ring 23 to reset, so that the grinding ring 23 is prevented from being worn;
when the movable seat 29 drives the silicon wafer to move below the grinding ring 23, the controller controls the pump in the filter cavity 36 to start, the pump conveys the grinding fluid into the infusion tube 34, in the process of rotating the rotary block 25, the inner wall of the arc groove 251 is contacted with the outer wall of the arc block 24, in the process of contact, the arc groove 251 contacts the pushing block 32, the arc groove 251 pushes the pushing block 32 to one side far away from the rotary block 25, the pushing block 32 moves along the movable groove 31, in the process of moving the pushing block 32, the pushing block 32 drives the pushing plate 33 to move to one side close to the rubber hose 35, the pushing plate 33 immediately extrudes the rubber hose 35, the inner pressure is increased after extrusion, the grinding fluid in the rubber hose 35 is sprayed out to the top of the infusion tube 34 through the one-way valve in the liquid outlet, then the grinding fluid is conveyed into the spraying groove 212 through the spout at the top of the infusion tube 34, the chute of the spraying groove 212 slides to the flat groove, as the upper surface of the flat groove 212 is in the same plane with the lower surface of the grinding ring 23, the grinding fluid is sucked into the capillary ring 23 under the action, the action of the capillary action, the silicon wafer is prevented from being rotated to the surface of the grinding fluid from the grinding ring 23, and the chips are prevented from being scraped off the surface of the grinding fluid and falling from the grinding ring, and falling down from the grinding fluid is prevented from being placed under the action of the grinding ring;
the grinding fluid is mixed with the scraps and is thrown out of the surface of the silicon wafer and falls into the filter cavity 36, then the grinding fluid is filtered by the multi-layer filter screen in the filter cavity 36, the scraps are blocked and collected by the multi-layer filter screen, the filtered grinding fluid is conveyed into the infusion tube 34 under the action of the pump, after the fine grinding of the silicon wafer is finished, the controller controls the movable seat 29 to move, the movable seat 29 drives the rotary block 25 to move, the axis of the rotary block 25 coincides with the axis of the placing port 13, then the controller controls the air pump in the rotary block 25 to suck air, and the air is conveyed into the sucker through the pipeline, so that the silicon wafer is separated from the sucker, and then the mechanical arm takes away the silicon wafer.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A silicon wafer accurate grinding device capable of automatically adjusting and grinding workpieces is characterized in that: including organism (1), a plurality of processing chamber (11) have been seted up on organism (1), the center of organism (1) is provided with the arm, every be provided with processingequipment in processing chamber (11), processingequipment includes: grind chamber (12), be provided with grinder (2) in grinding chamber (12), grinder (2) intercommunication has heat sink (3), grinder (2) include: the lifting ring (21) is in sliding connection with the inner wall of the grinding cavity (12), a rack is arranged on the side wall of the lifting ring (21), a rotating gear is arranged on the inner wall of the grinding cavity (12), the rotating gear is driven by a micro motor, and the rack is meshed with the rotating gear;
the surface of the lifting ring (21) is provided with a sliding ring (22), the inner wall of the sliding ring (22) is provided with a placing opening (13), the bottom of the sliding ring (22) is provided with a grinding ring (23), the sliding ring (22) and the grinding ring (23) form a C-shaped structure, the grinding ring (23) is composed of a plurality of sector plates, and the sector plates are connected with the sliding ring (22) through clamping grooves;
the grinding device (2) further comprises: the grinding device comprises an arc-shaped block (24), wherein the arc-shaped block (24) is provided with a plurality of arc-shaped blocks (24) which are circumferentially arranged along the axis of a grinding cavity (12), one side, far away from the inner wall of the grinding cavity (12), of each arc-shaped block (24) is provided with a rotating block (25), the surface of each rotating block (25) is provided with a sucker, the inside of each rotating block (25) is provided with an air pump, the sucker is connected with the air pump through a pipeline, a plurality of arc-shaped grooves (251) are circumferentially formed in the side wall of each rotating block (25), and each arc-shaped groove (251) is in contact with the outer wall of each arc-shaped block (24);
the bottom of the rotating block (25) is provided with a rotating shaft (26), one side, away from the rotating block (25), of the rotating shaft (26) is provided with a rotating arm (27), one side, away from the rotating shaft (26), of the rotating arm (27) is provided with a motor base (28), a motor is arranged in the motor base (28), a driving shaft in the motor is connected with the rotating arm (27), one side, away from the rotating arm (27), of the motor base (28) is provided with a movable base (29), and the movable base (29) is in sliding connection with the bottom of the grinding cavity (12) through a sliding rail;
one end of a motor driving shaft in the motor base (28) penetrating through the rotating arm (27) is provided with a main gear, one end of the rotating shaft (26) penetrating through the rotating arm (27) is provided with a driven gear, the rotating shaft (26) is rotationally connected with the rotating arm (27) through the driven gear, and an idler gear is meshed between the main gear and the driven gear.
2. The silicon wafer finish grinding device for automatically adjusting and grinding workpieces according to claim 1, wherein: lifting ring (21) and slip ring (22) are by two semicircle rings constitution two semicircle rings of lifting ring (21) respectively with grind chamber (12) lateral wall sliding connection, two semicircle rings of slip ring (22) respectively with two semicircle rings of constituteing lifting ring (21), semicircle ring in slip ring (22) is unanimous with semicircle ring opening direction in lifting ring (21).
3. The silicon wafer finish grinding device for automatically adjusting and grinding workpieces according to claim 1, wherein: the cooling device (3) comprises: the movable groove (31) is formed in the arc-shaped block (24), a pushing block (32) is connected in the movable groove (31) in a sliding mode, a pushing plate (33) is arranged on one side, close to the movable groove (31), of the pushing block (32), and a spring is arranged between the pushing plate (33) and the pushing block (32); one side that promotes board (33) to be close to organism (1) is provided with transfer line (34), be provided with rubber hose (35) in transfer line (34), rubber hose (35) top is provided with the liquid outlet, rubber hose (35) bottom is provided with the inlet, liquid outlet and inlet all are provided with the check valve.
4. A silicon wafer finish grinding device for automatically adjusting a polished workpiece according to claim 3, wherein: the top of transfer line (34) is provided with the spout, spout groove (212) are walked around to the inside of lift ring (21), spout groove (212) intercommunication spout, spout groove (212) are constituteed by chute and plain groove, spout groove (212) planar upper surface and the lower surface of grinding ring (23) are in the coplanar.
5. A silicon wafer finish grinding device for automatically adjusting a polished workpiece according to claim 3, wherein: a filter cavity (36) is arranged at the bottom of the grinding cavity (12), and grinding liquid is filled in the filter cavity (36); a plurality of layers of filter screens are arranged in the filter cavity (36), a pump is arranged at the bottom of the filter cavity (36), and the filter cavity (36) is communicated with the infusion tube (34).
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