CN116713836A - Polishing device and polishing method for chip processing - Google Patents

Polishing device and polishing method for chip processing Download PDF

Info

Publication number
CN116713836A
CN116713836A CN202310854412.0A CN202310854412A CN116713836A CN 116713836 A CN116713836 A CN 116713836A CN 202310854412 A CN202310854412 A CN 202310854412A CN 116713836 A CN116713836 A CN 116713836A
Authority
CN
China
Prior art keywords
polishing
liquid
liquid storage
chip
lifting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310854412.0A
Other languages
Chinese (zh)
Inventor
张刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anhui Zhongke Tianqi Technology Co ltd
Original Assignee
Anhui Zhongke Tianqi Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anhui Zhongke Tianqi Technology Co ltd filed Critical Anhui Zhongke Tianqi Technology Co ltd
Priority to CN202310854412.0A priority Critical patent/CN116713836A/en
Publication of CN116713836A publication Critical patent/CN116713836A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention relates to the technical field of chip processing, in particular to a polishing device and a polishing method for chip processing. The device comprises a processing table; the upper end of processing platform sets up the mounting bracket, and inside from top to bottom sets gradually polishing groove and hold the cistern, and the outside sets up communicating pipe. The polishing groove is provided with a rotatable polishing disk; the polishing disk is provided with a mounting column and a positioning groove; the lifting translation assembly and the polishing piece are arranged on the mounting column; the polishing piece is lifted, translated, polished and discharged on two sides of the mounting column. The liquid storage tank is communicated with the positioning tank, and polishing grinding liquid is contained in the liquid storage tank. The communicating pipe is communicated with the liquid storage tank and the polishing piece. The polishing piece with the functions of liquid discharging, polishing, lifting and translating is arranged. On the one hand, the polishing is carried out by matching the polishing stone with polishing grinding liquid. On the other hand, the adjustment of the polishing range is controlled by the height and horizontal position adjustment. The polishing requirements of different chips are met. The polishing device has the advantages of large polishing range, strong flexibility and various polishing modes, and realizes batch, efficient, energy-saving and environment-friendly polishing processing.

Description

Polishing device and polishing method for chip processing
Technical Field
The invention relates to the technical field of chip processing, in particular to a polishing device and a polishing method for chip processing.
Background
In the production process of the chip, precise polishing is required to be carried out on the monocrystalline silicon substrate of the chip, and at present, a chemical mechanical polishing technology is often adopted, and the method specifically comprises the following steps: during polishing, the chip to be polished is polished under a certain pressure, meanwhile, the polishing solution flows between the chip and the polishing pad, chemical reaction is generated on the surface of the chip, and chemical reactants formed on the surface of the chip are removed by the mechanical friction action of the abrasive in the polishing solution. In the alternating process of chemical film forming and mechanical film removing, an extremely thin layer of material is removed from the surface of the chip under the combined action of chemistry and machinery, and finally ultra-precise surface machining is realized.
The prior art has the following defects: 1. the structure of physical polishing and chemical polishing is separated, so that the pertinence is not strong and the consumption is high when the chemical reagent is used. 2. The physical polishing position is fixed, causes the scope of polishing little, and the polishing effect is limited, and polishing efficiency is low. 3. Chips of the same specification can be processed at a time, and chips with different thicknesses are polished in batches.
Disclosure of Invention
Aiming at the problems in the background technology, a polishing device and a polishing method for chip processing are provided. The polishing piece with the functions of liquid discharging, polishing, lifting and translating is arranged. On the one hand, the polishing is carried out by matching the polishing stone with polishing grinding liquid. On the other hand, the adjustment of the polishing range is controlled by the height and horizontal position adjustment. The polishing requirements of different chips are met. The polishing device has the advantages of large polishing range, strong flexibility and various polishing modes, and realizes batch, efficient, energy-saving and environment-friendly polishing processing.
The invention provides a polishing device for chip processing, which comprises a processing table; the upper end of processing platform sets up the mounting bracket, and inside from top to bottom sets gradually polishing groove and hold the cistern, and the outside sets up communicating pipe. The polishing groove is open and is provided with a rotatable polishing disk; the rotation center of the polishing disk is provided with a mounting column, and the periphery of the polishing disk is provided with a plurality of groups of positioning grooves matched with the chip to be polished; the mounting column is arranged on the mounting frame and is rotationally connected with the polishing disc, and the lifting translation assembly and the polishing piece are arranged on the mounting column; the polishing piece has the functions of discharging liquid and polishing, and is driven by the lifting translation component to lift, translate, polish and discharge liquid on two sides of the mounting column. The liquid storage tank is communicated with the positioning tank, and polishing grinding liquid is contained in the liquid storage tank. The communicating pipe is communicated with the liquid storage tank and the polishing piece, and a liquid pump is arranged on the communicating pipe.
Preferably, the lifting translation assembly comprises a first motor; the mounting column is provided with a first mounting groove with a notch facing to two sides; a first lead screw is arranged in the first mounting groove; the first screw rod is driven by the first motor to realize rotation, and is also connected with the lifting plate in a threaded manner; lifting rods are arranged on two sides of the lifting plate; the lifting rod passes through the notch at the corresponding side, stretches across the polishing disc and is in sliding connection with the mounting frame, and a sliding block is arranged on the lifting rod; the upper end of the sliding block is provided with a translation part for driving the sliding block to horizontally move, and the lower end of the sliding block is connected with a polishing part.
Preferably, the mounting rack is provided with a sliding rail; the sliding rack I which moves up and down along the sliding rail I is arranged on the sliding rail; the mounting column is provided with a second sliding frame which moves up and down along the mounting column; one end of the lifting rod is connected with the first sliding frame, and the other end of the lifting rod is connected with the second sliding frame.
Preferably, the translation member comprises a second motor; the second motor is arranged on the first sliding frame, and the main shaft is connected with the second lead screw; the second lead screw is arranged in parallel with the lifting rod and is rotatably arranged between the first sliding frame and the second sliding frame; the sliding block is connected with the second screw rod in a threaded manner.
Preferably, a third motor is arranged on the sliding block; a main shaft of the motor III is connected with the gear I in a bonding way; the polishing piece comprises a liquid storage cylinder; the liquid storage cylinder is arranged at the bottom of the sliding block, the upper end of the liquid storage cylinder is communicated with the communicating pipe, and the lower end of the liquid storage cylinder is provided with a liquid outlet sleeve which can be communicated in a rotating way; the upper end of the liquid outlet sleeve is connected with a second gear in a bonding way, and the lower end of the liquid outlet sleeve is provided with a mounting seat; the first gear is meshed with the second gear; the detachable polishing stone is arranged on the mounting seat.
Preferably, the bottom of the liquid storage cylinder is provided with an inner liquid outlet hole; the liquid outlet sleeve is provided with an outer liquid outlet hole; the outer liquid outlet holes are staggered/communicated with the inner liquid outlet holes along with the liquid outlet sleeve.
Preferably, a filter screen is arranged in the liquid storage tank; a motor IV is arranged on the filter screen; and a main shaft of the motor IV extends into the polishing groove and is connected with the polishing disk.
Preferably, a connecting rod is further arranged on the side wall of the main shaft of the motor IV; the connecting rod is positioned below the polishing disk, and the end part of the connecting rod is provided with a cleaning seat; the cleaning seat is provided with cleaning brush hair; the cleaning brush hair acts on the filter screen.
Preferably, a positioning seat connected through threads is arranged in the positioning groove; a groove for limiting the chip is arranged in the positioning seat; the bottom of the groove is provided with a through hole communicated with the liquid storage tank and is also provided with a polishing protrusion.
The invention also provides a polishing method of the polishing device for chip processing, which comprises the following steps:
s1, placing chips to be polished into positioning seats one by one;
s2, screwing the positioning seats into the positioning grooves one by one according to the thickness difference of the chips, so that the heights of all the chips are consistent;
s3, driving a motor four to drive the polishing disc to rotate;
s4, the lifting translation assembly drives the polishing piece to lift and translate, so that the polishing stone is in movable contact with the chip;
s5, driving the liquid outlet sleeve to rotate by the motor three, synchronously rotating the polishing stone, rubbing the upper end of the polishing chip, and simultaneously, staggering/communicating the outer liquid outlet holes with the inner liquid outlet holes, and discharging polishing grinding liquid;
s6, polishing the lower end of the convex friction chip;
s7, polishing and grinding the polishing and grinding liquid, and flushing scraps generated by grinding into the liquid storage tank through the through hole;
s8, intercepting scraps by a filter screen; the cleaning brush hair rotates along with the polishing disc and synchronously rotates to clean the filter screen;
and S9, draining the filtered polishing grinding liquid by the communicating pipe, and returning the polishing grinding liquid to the liquid storage cylinder for recycling.
Compared with the prior art, the invention has the following beneficial technical effects:
1. the polishing piece with the functions of liquid outlet and polishing is arranged. Through going out liquid cover rotation, realized the rotatory grinding of polish on the one hand, on the other hand realizes that polishing grinding fluid flows out, and both cooperation polishes and grinds. In addition, the polishing grinding liquid has even action with the chip and the polishing stone, and can wash out scraps generated by grinding and recycle. And the polishing stone is subjected to height adjustment and horizontal position adjustment through the lifting translation assembly, and the adjustment of the polishing range is controlled. Finally, the polishing requirements of different chips are met. The polishing device has the advantages of large polishing range, strong flexibility and various polishing modes, and realizes batch, efficient, energy-saving and environment-friendly polishing processing.
2. According to the invention, the filter screen intercepts scraps to ensure the cleaning of the polishing grinding liquid, so that the polishing grinding liquid is convenient to circulate. Meanwhile, the connecting rod synchronously rotates along with the rotation of the polishing disc, and cleaning bristles of the cleaning seat can brush the filter screen, so that the effect of dredging the filter holes is achieved, and smooth and efficient filtering is ensured.
3. The positioning seat is in threaded connection with the positioning groove, and can move up and down in the positioning groove in a rotating mode to adjust the position of the upper surface of the chip in the groove. So that the heights of the tops of all the chips to be polished are uniform, thereby facilitating uniform polishing. Realize batch processing of chips with different thicknesses
4. The invention sets polishing protrusion to match with polishing liquid to process the bottom of the chip. So that the chip polishing is comprehensive and efficient.
5. The polishing method of the polishing device for chip processing has the characteristics of wide polishing range, multiple polishing modes and large polishing amount. The upper and lower ends of chips with different thicknesses can be polished uniformly. The machining process has strong automaticity and less polishing and grinding liquid consumption.
Drawings
FIG. 1 is a schematic diagram of an embodiment of the present invention;
FIG. 2 is a cross-sectional view (view I) of one embodiment of the present invention;
FIG. 3 is a cross-sectional view (view II) of one embodiment of the present invention;
FIG. 4 is an enlarged schematic view of FIG. 2 at A;
FIG. 5 is a block diagram of a polishing article according to one embodiment of the invention;
FIG. 6 is an exploded view of a polishing article according to one embodiment of the present invention;
FIG. 7 is an enlarged schematic view at B in FIG. 3;
fig. 8 is a schematic diagram illustrating the disassembly of the positioning seat according to an embodiment of the invention.
Reference numerals: 1. a processing table; 2. polishing disk; 3. a mounting frame; 4. a mounting column; 5. a lifting translation assembly; 6. a polishing member; 7. a communicating pipe; 8. a liquid storage tank; 9. a filter screen; 10. a positioning groove; 11. a first lead screw; 12. a lifting plate; 13. a first mounting groove; 14. a lifting rod; 15. a slide rail; 16. a first sliding frame; 17. a second sliding frame; 18. a second lead screw; 19. a slide block; 20. a liquid storage cylinder; 21. a second gear; 22. a liquid outlet sleeve; 23. a mounting base; 24. a polishing stone; 25. an outer liquid outlet hole; 26. a first gear; 27. a third motor; 28. a first motor; 29. an inner liquid outlet hole; 30. a fourth motor; 31. a connecting rod; 32. a cleaning seat; 33. cleaning bristles; 34. a positioning seat; 35. polishing the protrusions; 36. and a through hole.
Detailed Description
Example 1
As shown in fig. 1 to 3, the polishing device for chip processing provided by the invention comprises a processing table 1; the upper end of processing platform 1 sets up mounting bracket 3, and inside from top to bottom sets gradually polishing groove and reservoir 8, and the outside sets up communicating pipe 7. The polishing groove is open, and a rotatable polishing disk 2 is arranged; the rotation center of the polishing disk 2 is provided with a mounting column 4, and the periphery of the polishing disk is provided with a plurality of groups of positioning grooves 10 matched with the chip to be polished; the mounting column 4 is arranged on the mounting frame 3 and is in rotary connection with the polishing disc 2, and the lifting translation component 5 and the polishing piece 6 are arranged on the mounting column 4; the polishing piece 6 has the functions of discharging liquid and polishing, and is driven by the lifting translation component 5 to lift, translate, polish and discharge liquid on two sides of the mounting column 4. The liquid storage tank 8 is communicated with the positioning tank 10, and the inside of the liquid storage tank is filled with polishing grinding liquid. The communicating pipe 7 is communicated with the liquid storage tank 8 and the polishing piece 6, and a liquid pump is arranged on the communicating pipe 7.
This embodiment sets up to take out liquid and polishing function polishing piece 6, and polishing piece 6 can go up and down and translation simultaneously, through the position of adjusting the polishing, satisfies the polishing demand of different chips. The polishing device has the advantages of large polishing range, strong flexibility and various polishing modes, and finally realizes batch and efficient polishing processing. In addition, the polishing grinding fluid circulates through the communicating pipe 7, so that the energy conservation and environmental protection are strong.
Example two
As shown in fig. 1 to 3, the polishing device for chip processing provided by the invention comprises a processing table 1; the upper end of processing platform 1 sets up mounting bracket 3, and inside from top to bottom sets gradually polishing groove and reservoir 8, and the outside sets up communicating pipe 7. The polishing groove is open, and a rotatable polishing disk 2 is arranged; the rotation center of the polishing disk 2 is provided with a mounting column 4, and the periphery of the polishing disk is provided with a plurality of groups of positioning grooves 10 matched with the chip to be polished; the mounting column 4 is arranged on the mounting frame 3 and is in rotary connection with the polishing disc 2, and the lifting translation component 5 and the polishing piece 6 are arranged on the mounting column 4; the polishing piece 6 has the functions of discharging liquid and polishing, and is driven by the lifting translation component 5 to lift, translate, polish and discharge liquid on two sides of the mounting column 4. The liquid storage tank 8 is communicated with the positioning tank 10, and the inside of the liquid storage tank is filled with polishing grinding liquid. The communicating pipe 7 is communicated with the liquid storage tank 8 and the polishing piece 6, and a liquid pump is arranged on the communicating pipe 7.
As shown in fig. 4, the lifting and translation assembly 5 includes a first motor 28; the mounting column 4 is provided with a first mounting groove 13 with a notch facing to two sides; a first lead screw 11 is arranged in the first mounting groove 13; the first screw rod 11 realizes rotation through the transmission of the first motor 28, and is also connected with the lifting plate 12 in a threaded manner; lifting rods 14 are arranged on two sides of the lifting plate 12; the lifting rod 14 passes through the notch on the corresponding side, stretches across the polishing disk 2 and is in sliding connection with the mounting frame 3, and a sliding block 19 is arranged on the lifting rod 14; the upper end of the slide block 19 is provided with a translation member for driving the slide block to horizontally move, and the lower end of the slide block is connected with the polishing member 6.
It should be further noted that the mounting frame 3 is provided with a sliding rail 15; the slide rail 15 is provided with a first slide frame 16 which moves up and down along the slide rail; the mounting column 4 is provided with a second sliding frame 17 which moves up and down along the mounting column; one end of the lifting rod 14 is connected with the first sliding frame 16, and the other end is connected with the second sliding frame 17. The lifting rod 14 drives the first sliding frame 16 and the second sliding frame 17 to move up and down.
It should be further noted that the translation member includes a second motor; the second motor is arranged on the first sliding frame 16, and the main shaft is connected with the second lead screw 18; the second lead screw 18 is arranged in parallel with the lifting rod 14 and is rotatably arranged between the first sliding frame 16 and the second sliding frame 17; the slide block 19 is in threaded connection with the screw rod II 18. The first sliding frame 16 and the second sliding frame 17 drive the second screw rod 18 to move up and down.
In this embodiment, the lifting translation assembly 5 is specifically configured, and is driven by the first motor 28 during operation, so that the first screw 11 rotates, and the lifting plate 12 drives the lifting rods 14 arranged on two sides to lift and adjust the height. The second screw rod 18 is synchronously lifted, the second screw rod 18 is driven to rotate by the second motor, and the sliding block 19 horizontally moves on the lifting rod 14 to adjust the polishing range. The polishing pieces 6 on the two sides finally realize synchronous lifting and independent horizontal movement. The polishing device has the advantages of large polishing range, strong flexibility, and more efficient and accurate polishing.
Example III
As shown in fig. 1 to 3, the polishing device for chip processing provided by the invention comprises a processing table 1; the upper end of processing platform 1 sets up mounting bracket 3, and inside from top to bottom sets gradually polishing groove and reservoir 8, and the outside sets up communicating pipe 7. The polishing groove is open, and a rotatable polishing disk 2 is arranged; the rotation center of the polishing disk 2 is provided with a mounting column 4, and the periphery of the polishing disk is provided with a plurality of groups of positioning grooves 10 matched with the chip to be polished; the mounting column 4 is arranged on the mounting frame 3 and is in rotary connection with the polishing disc 2, and the lifting translation component 5 and the polishing piece 6 are arranged on the mounting column 4; the polishing piece 6 has the functions of discharging liquid and polishing, and is driven by the lifting translation component 5 to lift, translate, polish and discharge liquid on two sides of the mounting column 4. The liquid storage tank 8 is communicated with the positioning tank 10, and the inside of the liquid storage tank is filled with polishing grinding liquid. The communicating pipe 7 is communicated with the liquid storage tank 8 and the polishing piece 6, and a liquid pump is arranged on the communicating pipe 7.
As shown in fig. 4, the lifting and translation assembly 5 includes a first motor 28; the mounting column 4 is provided with a first mounting groove 13 with a notch facing to two sides; a first lead screw 11 is arranged in the first mounting groove 13; the first screw rod 11 realizes rotation through the transmission of the first motor 28, and is also connected with the lifting plate 12 in a threaded manner; lifting rods 14 are arranged on two sides of the lifting plate 12; the lifting rod 14 passes through the notch on the corresponding side, stretches across the polishing disk 2 and is in sliding connection with the mounting frame 3, and a sliding block 19 is arranged on the lifting rod 14; the upper end of the slide block 19 is provided with a translation member for driving the slide block to horizontally move, and the lower end of the slide block is connected with the polishing member 6.
It should be further noted that the mounting frame 3 is provided with a sliding rail 15; the slide rail 15 is provided with a first slide frame 16 which moves up and down along the slide rail; the mounting column 4 is provided with a second sliding frame 17 which moves up and down along the mounting column; one end of the lifting rod 14 is connected with the first sliding frame 16, and the other end is connected with the second sliding frame 17. The lifting rod 14 drives the first sliding frame 16 and the second sliding frame 17 to move up and down.
It should be further noted that the translation member includes a second motor; the second motor is arranged on the first sliding frame 16, and the main shaft is connected with the second lead screw 18; the second lead screw 18 is arranged in parallel with the lifting rod 14 and is rotatably arranged between the first sliding frame 16 and the second sliding frame 17; the slide block 19 is in threaded connection with the screw rod II 18. The first sliding frame 16 and the second sliding frame 17 drive the second screw rod 18 to move up and down.
As shown in fig. 5-6, a third motor 27 is arranged on the slide block 19; the main shaft of the motor III 27 is connected with the gear I26 in a bonding way; the polishing member 6 includes a liquid storage cylinder 20; the liquid storage cylinder 20 is arranged at the bottom of the slide block 19, the upper end of the liquid storage cylinder is communicated with the communicating pipe 7, and the lower end of the liquid storage cylinder is provided with a liquid outlet sleeve 22 which is rotatably communicated with the communicating pipe; the upper end of the liquid outlet sleeve 22 is connected with a second gear 21 in a bonding way, and the lower end of the liquid outlet sleeve is provided with a mounting seat 23; the first gear 26 is meshed with the second gear 21; a detachable polishing stone 24 is arranged on the mounting seat 23.
It should be further noted that the bottom of the liquid storage barrel 20 is provided with an inner liquid outlet 29; the liquid outlet sleeve 22 is provided with an outer liquid outlet hole 25; the outer liquid outlet holes 25 are staggered/communicating with the inner liquid outlet holes 29 along with the liquid outlet sleeve 22.
In this embodiment, a specific structure of the polishing member 6 is provided, and the slider 19 is lifted and translated to drive the liquid storage barrel 20 to move synchronously. Then the third motor 27 drives the first gear 26 and the second gear 21 to rotate, and the liquid outlet sleeve 22 can further rotate around the liquid storage barrel 20. During the rotation of the liquid outlet sleeve 22, on one hand, the rotation grinding of the polishing stone 24 is realized, and on the other hand, the staggering/communication of the outer liquid outlet holes 25 and the inner liquid outlet holes 29 is realized. The polishing slurry flows out and cooperates with the polishing stone 24 to further polish and grind the chip. And because the polishing grinding fluid flows out from the upper part of the polishing stone 24, the polishing grinding fluid can uniformly act on the chip and the polishing stone 24, and can wash out scraps generated by grinding, so that the pertinence is strong, and the utilization rate is high.
Example IV
As shown in fig. 1 to 3, the polishing device for chip processing provided by the invention comprises a processing table 1; the upper end of processing platform 1 sets up mounting bracket 3, and inside from top to bottom sets gradually polishing groove and reservoir 8, and the outside sets up communicating pipe 7. The polishing groove is open, and a rotatable polishing disk 2 is arranged; the rotation center of the polishing disk 2 is provided with a mounting column 4, and the periphery of the polishing disk is provided with a plurality of groups of positioning grooves 10 matched with the chip to be polished; the mounting column 4 is arranged on the mounting frame 3 and is in rotary connection with the polishing disc 2, and the lifting translation component 5 and the polishing piece 6 are arranged on the mounting column 4; the polishing piece 6 has the functions of discharging liquid and polishing, and is driven by the lifting translation component 5 to lift, translate, polish and discharge liquid on two sides of the mounting column 4. The liquid storage tank 8 is communicated with the positioning tank 10, and the inside of the liquid storage tank is filled with polishing grinding liquid. The communicating pipe 7 is communicated with the liquid storage tank 8 and the polishing piece 6, and a liquid pump is arranged on the communicating pipe 7.
As shown in fig. 4, the lifting and translation assembly 5 includes a first motor 28; the mounting column 4 is provided with a first mounting groove 13 with a notch facing to two sides; a first lead screw 11 is arranged in the first mounting groove 13; the first screw rod 11 realizes rotation through the transmission of the first motor 28, and is also connected with the lifting plate 12 in a threaded manner; lifting rods 14 are arranged on two sides of the lifting plate 12; the lifting rod 14 passes through the notch on the corresponding side, stretches across the polishing disk 2 and is in sliding connection with the mounting frame 3, and a sliding block 19 is arranged on the lifting rod 14; the upper end of the slide block 19 is provided with a translation member for driving the slide block to horizontally move, and the lower end of the slide block is connected with the polishing member 6.
It should be further noted that the mounting frame 3 is provided with a sliding rail 15; the slide rail 15 is provided with a first slide frame 16 which moves up and down along the slide rail; the mounting column 4 is provided with a second sliding frame 17 which moves up and down along the mounting column; one end of the lifting rod 14 is connected with the first sliding frame 16, and the other end is connected with the second sliding frame 17. The lifting rod 14 drives the first sliding frame 16 and the second sliding frame 17 to move up and down.
It should be further noted that the translation member includes a second motor; the second motor is arranged on the first sliding frame 16, and the main shaft is connected with the second lead screw 18; the second lead screw 18 is arranged in parallel with the lifting rod 14 and is rotatably arranged between the first sliding frame 16 and the second sliding frame 17; the slide block 19 is in threaded connection with the screw rod II 18. The first sliding frame 16 and the second sliding frame 17 drive the second screw rod 18 to move up and down.
As shown in fig. 5-6, a third motor 27 is arranged on the slide block 19; the main shaft of the motor III 27 is connected with the gear I26 in a bonding way; the polishing member 6 includes a liquid storage cylinder 20; the liquid storage cylinder 20 is arranged at the bottom of the slide block 19, the upper end of the liquid storage cylinder is communicated with the communicating pipe 7, and the lower end of the liquid storage cylinder is provided with a liquid outlet sleeve 22 which is rotatably communicated with the communicating pipe; the upper end of the liquid outlet sleeve 22 is connected with a second gear 21 in a bonding way, and the lower end of the liquid outlet sleeve is provided with a mounting seat 23; the first gear 26 is meshed with the second gear 21; a detachable polishing stone 24 is arranged on the mounting seat 23.
It should be further noted that the bottom of the liquid storage barrel 20 is provided with an inner liquid outlet 29; the liquid outlet sleeve 22 is provided with an outer liquid outlet hole 25; the outer liquid outlet holes 25 are staggered/communicating with the inner liquid outlet holes 29 along with the liquid outlet sleeve 22.
As shown in fig. 7, a filter screen 9 is arranged in the liquid storage tank 8; a motor IV 30 is arranged on the filter screen 9; the main shaft of the motor IV 30 extends into the polishing groove and is connected with the polishing disk 2. The filter screen 9 can intercept scraps generated by grinding, and filter polishing grinding liquid so that the polishing grinding liquid can be recycled.
It should be further noted that a connecting rod 31 is further disposed on the side wall of the spindle of the fourth motor 30; the connecting rod 31 is positioned below the polishing disk 2, and a cleaning seat 32 is arranged at the end part; the cleaning seat 32 is provided with cleaning bristles 33; the cleaning bristles 33 act on the filter screen 9. The connecting rod 31 rotates synchronously along with the rotation of the polishing disk 2, and the cleaning brush hair 33 of the cleaning seat 32 can brush the filter screen 9, so that the effect of dredging the filter holes is achieved, and the smooth and efficient filtering is ensured.
Example five
As shown in fig. 1 to 3, the polishing device for chip processing provided by the invention comprises a processing table 1; the upper end of processing platform 1 sets up mounting bracket 3, and inside from top to bottom sets gradually polishing groove and reservoir 8, and the outside sets up communicating pipe 7. The polishing groove is open, and a rotatable polishing disk 2 is arranged; the rotation center of the polishing disk 2 is provided with a mounting column 4, and the periphery of the polishing disk is provided with a plurality of groups of positioning grooves 10 matched with the chip to be polished; the mounting column 4 is arranged on the mounting frame 3 and is in rotary connection with the polishing disc 2, and the lifting translation component 5 and the polishing piece 6 are arranged on the mounting column 4; the polishing piece 6 has the functions of discharging liquid and polishing, and is driven by the lifting translation component 5 to lift, translate, polish and discharge liquid on two sides of the mounting column 4. The liquid storage tank 8 is communicated with the positioning tank 10, and the inside of the liquid storage tank is filled with polishing grinding liquid. The communicating pipe 7 is communicated with the liquid storage tank 8 and the polishing piece 6, and a liquid pump is arranged on the communicating pipe 7.
As shown in fig. 4, the lifting and translation assembly 5 includes a first motor 28; the mounting column 4 is provided with a first mounting groove 13 with a notch facing to two sides; a first lead screw 11 is arranged in the first mounting groove 13; the first screw rod 11 realizes rotation through the transmission of the first motor 28, and is also connected with the lifting plate 12 in a threaded manner; lifting rods 14 are arranged on two sides of the lifting plate 12; the lifting rod 14 passes through the notch on the corresponding side, stretches across the polishing disk 2 and is in sliding connection with the mounting frame 3, and a sliding block 19 is arranged on the lifting rod 14; the upper end of the slide block 19 is provided with a translation member for driving the slide block to horizontally move, and the lower end of the slide block is connected with the polishing member 6.
It should be further noted that the mounting frame 3 is provided with a sliding rail 15; the slide rail 15 is provided with a first slide frame 16 which moves up and down along the slide rail; the mounting column 4 is provided with a second sliding frame 17 which moves up and down along the mounting column; one end of the lifting rod 14 is connected with the first sliding frame 16, and the other end is connected with the second sliding frame 17. The lifting rod 14 drives the first sliding frame 16 and the second sliding frame 17 to move up and down.
It should be further noted that the translation member includes a second motor; the second motor is arranged on the first sliding frame 16, and the main shaft is connected with the second lead screw 18; the second lead screw 18 is arranged in parallel with the lifting rod 14 and is rotatably arranged between the first sliding frame 16 and the second sliding frame 17; the slide block 19 is in threaded connection with the screw rod II 18. The first sliding frame 16 and the second sliding frame 17 drive the second screw rod 18 to move up and down.
As shown in fig. 5-6, a third motor 27 is arranged on the slide block 19; the main shaft of the motor III 27 is connected with the gear I26 in a bonding way; the polishing member 6 includes a liquid storage cylinder 20; the liquid storage cylinder 20 is arranged at the bottom of the slide block 19, the upper end of the liquid storage cylinder is communicated with the communicating pipe 7, and the lower end of the liquid storage cylinder is provided with a liquid outlet sleeve 22 which is rotatably communicated with the communicating pipe; the upper end of the liquid outlet sleeve 22 is connected with a second gear 21 in a bonding way, and the lower end of the liquid outlet sleeve is provided with a mounting seat 23; the first gear 26 is meshed with the second gear 21; a detachable polishing stone 24 is arranged on the mounting seat 23.
It should be further noted that the bottom of the liquid storage barrel 20 is provided with an inner liquid outlet 29; the liquid outlet sleeve 22 is provided with an outer liquid outlet hole 25; the outer liquid outlet holes 25 are staggered/communicating with the inner liquid outlet holes 29 along with the liquid outlet sleeve 22.
As shown in fig. 7, a filter screen 9 is arranged in the liquid storage tank 8; a motor IV 30 is arranged on the filter screen 9; the main shaft of the motor IV 30 extends into the polishing groove and is connected with the polishing disk 2. The filter screen 9 can intercept scraps generated by grinding, and filter polishing grinding liquid so that the polishing grinding liquid can be recycled.
It should be further noted that a connecting rod 31 is further disposed on the side wall of the spindle of the fourth motor 30; the connecting rod 31 is positioned below the polishing disk 2, and a cleaning seat 32 is arranged at the end part; the cleaning seat 32 is provided with cleaning bristles 33; the cleaning bristles 33 act on the filter screen 9. The connecting rod 31 rotates synchronously along with the rotation of the polishing disk 2, and the cleaning brush hair 33 of the cleaning seat 32 can brush the filter screen 9, so that the effect of dredging the filter holes is achieved, and the smooth and efficient filtering is ensured.
As shown in fig. 8, a positioning seat 34 connected by screw threads is arranged in the positioning groove 10; a groove for limiting the chip is arranged in the positioning seat 34; the bottom of the groove is provided with a through hole 36 communicated with the liquid storage tank 8 and a polishing protrusion 35.
In this embodiment, the positioning seat 34 is screwed with the positioning groove 10, so that the positioning seat can move up and down in the positioning groove 10 in a rotating manner, and the position of the upper surface of the chip in the groove is adjusted. So that the heights of the tops of all the chips to be polished are uniform, thereby facilitating uniform polishing. Realize the batch processing to the chip of different thickness. In addition, the chip is pushed in the groove by the upper polishing stone 24, and moves. The polishing protrusions 35 cooperate with polishing slurry to treat the bottom of the chip. So that the chip polishing is comprehensive and efficient.
Example six
The invention also provides a polishing method of the polishing device for chip processing, which comprises the following steps:
s1, placing chips to be polished into the positioning seats 34 one by one;
s2, according to the thickness difference of the chips, the positioning seats 34 are screwed into the positioning grooves 10 one by one, so that the heights of all the chips are consistent;
s3, driving a motor IV 30 to drive the polishing disc 2 to rotate;
s4, the lifting translation assembly 5 drives the polishing piece 6 to lift and translate, so that the polishing stone 24 is in movable contact with the chip;
s5, a motor III 27 drives the liquid outlet sleeve 22 to rotate, the polishing stone 24 rotates synchronously, the upper end of the polishing chip is rubbed, meanwhile, the outer liquid outlet holes 25 are staggered/communicated with the inner liquid outlet holes 29, and polishing grinding liquid flows out;
s6, the polishing protrusions 35 rub the lower end of the chip;
s7, polishing and grinding the polishing and grinding liquid, and flushing scraps generated by grinding into the liquid storage tank 8 through the through hole 36;
s8, intercepting scraps by a filter screen 9; the cleaning brush hair 33 rotates along with the polishing disk 2 and synchronously rotates to clean the filter screen 9;
and S9, draining the filtered polishing grinding fluid by the communicating pipe 7, and returning the polishing grinding fluid to the fluid storage cylinder 20 for recycling.
The polishing method of the polishing device for chip processing in the embodiment has the characteristics of wide polishing range, multiple polishing modes and large polishing amount. The upper and lower ends of chips with different thicknesses can be polished uniformly. The machining process has strong automaticity and less polishing and grinding liquid consumption.
The embodiments of the present invention have been described in detail with reference to the drawings, but the present invention is not limited thereto, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present invention.

Claims (10)

1. A polishing device for chip processing is characterized by comprising a processing table (1); the upper end of the processing table (1) is provided with a mounting frame (3), a polishing groove and a liquid storage groove (8) are sequentially arranged in the processing table from top to bottom, and a communicating pipe (7) is arranged outside the processing table;
the polishing groove is open and is provided with a rotatable polishing disk (2); the rotation center of the polishing disk (2) is provided with a mounting column (4), and the periphery of the polishing disk is provided with a plurality of groups of positioning grooves (10) matched with the chip to be polished; the mounting column (4) is arranged on the mounting frame (3) and is rotationally connected with the polishing disc (2), and the lifting translation assembly (5) and the polishing piece (6) are arranged on the mounting column (4); the polishing piece (6) has the functions of liquid discharging and polishing, and is driven by the lifting translation component (5) to lift, translate, polish and discharge on the two sides of the mounting column (4);
the liquid storage tank (8) is communicated with the positioning tank (10) and internally holds polishing grinding liquid;
the communicating pipe (7) is communicated with the liquid storage tank (8) and the polishing piece (6), and the communicating pipe (7) is provided with a liquid pump.
2. The polishing apparatus for chip processing according to claim 1, wherein the lifting/lowering translation assembly (5) comprises a motor one (28); the mounting column (4) is provided with a first mounting groove (13) with a notch facing to two sides; a first lead screw (11) is arranged in the first mounting groove (13); the first lead screw (11) realizes rotation through the transmission of the first motor (28), and is also connected with the lifting plate (12) in a threaded manner; lifting rods (14) are arranged on two sides of the lifting plate (12); the lifting rod (14) passes through the notch at the corresponding side, stretches across the polishing disc (2) and is in sliding connection with the mounting frame (3), and the lifting rod (14) is provided with a sliding block (19); the upper end of the sliding block (19) is provided with a translation part for driving the sliding block to horizontally move, and the lower end of the sliding block is connected with the polishing part (6).
3. The polishing device for chip processing according to claim 2, wherein a slide rail (15) is provided on the mounting frame (3); a first sliding frame (16) which moves up and down along the sliding rail (15) is arranged on the sliding rail; the mounting column (4) is provided with a sliding frame II (17) which moves up and down along the mounting column; one end of the lifting rod (14) is connected with the first sliding frame (16), and the other end is connected with the second sliding frame (17).
4. A polishing apparatus for chip processing according to claim 3, wherein the translation member comprises a second motor; the second motor is arranged on the first sliding frame (16), and the main shaft is connected with the second lead screw (18); the second lead screw (18) is arranged in parallel with the lifting rod (14) and is rotatably arranged between the first sliding frame (16) and the second sliding frame (17); the sliding block (19) is in threaded connection with the screw rod II (18).
5. The polishing apparatus for chip processing according to claim 4, wherein a third motor (27) is provided on the slider (19); a spindle of the motor III (27) is connected with the gear I (26) in a bonding way; the polishing piece (6) comprises a liquid storage cylinder (20); the liquid storage cylinder (20) is arranged at the bottom of the sliding block (19), the upper end of the liquid storage cylinder is communicated with the communicating pipe (7), and the lower end of the liquid storage cylinder is provided with a liquid outlet sleeve (22) which is rotatably communicated with the communicating pipe; the upper end of the liquid outlet sleeve (22) is connected with a second gear (21) in a bonding way, and the lower end of the liquid outlet sleeve is provided with a mounting seat (23); the first gear (26) is meshed with the second gear (21); the detachable polishing stone (24) is arranged on the mounting seat (23).
6. The polishing apparatus for chip processing according to claim 5, wherein an inner liquid outlet hole (29) is provided at the bottom of the liquid storage cylinder (20); an outer liquid outlet hole (25) is arranged on the liquid outlet sleeve (22); the outer liquid outlet holes (25) are staggered/communicated with the inner liquid outlet holes (29) along with the liquid outlet sleeve (22).
7. The polishing apparatus for chip processing according to claim 1, wherein a filter screen (9) is provided in the liquid reservoir (8); a motor IV (30) is arranged on the filter screen (9); and a main shaft of the motor IV (30) extends into the polishing groove and is connected with the polishing disk (2).
8. The polishing device for chip processing according to claim 7, wherein a connecting rod (31) is further provided on a side wall of a spindle of the fourth motor (30); the connecting rod (31) is positioned below the polishing disc (2), and the end part of the connecting rod is provided with a cleaning seat (32); the cleaning seat (32) is provided with cleaning bristles (33); the cleaning brush hair (33) acts on the filter screen (9).
9. The polishing apparatus for chip processing according to claim 1, wherein a positioning seat (34) connected by screw is provided in the positioning groove (10); a groove for limiting the chip is arranged in the positioning seat (34); the bottom of the groove is provided with a through hole (36) communicated with the liquid storage tank (8), and a polishing protrusion (35) is also arranged.
10. A polishing method of the polishing apparatus for chip processing according to any one of claims 1 to 9, characterized by comprising the steps of:
s1, placing chips to be polished into positioning seats (34) one by one;
s2, screwing the positioning seats (34) into the positioning grooves (10) one by one according to the thickness difference of the chips, so that the heights of all the chips are consistent;
s3, driving a motor IV (30) to drive the polishing disc (2) to rotate;
s4, the lifting translation assembly (5) drives the polishing piece (6) to lift and translate, so that the polishing stone (24) is in movable contact with the chip;
s5, a motor III (27) drives the liquid outlet sleeve (22) to rotate, the polishing stone (24) rotates synchronously, the upper end of the polishing chip is rubbed, meanwhile, the outer liquid outlet holes (25) are staggered/communicated with the inner liquid outlet holes (29), and polishing grinding liquid flows out;
s6, rubbing the lower end of the chip by the polishing protrusion (35);
s7, polishing and grinding the polishing grinding liquid, and flushing scraps generated by grinding into the liquid storage tank (8) through the through hole (36);
s8, intercepting scraps by a filter screen (9); the cleaning brush hair (33) rotates along with the polishing disc (2) and synchronously rotates to clean the filter screen (9);
s9, draining the filtered polishing grinding fluid by the communicating pipe (7), and returning the polishing grinding fluid to the fluid storage cylinder (20) for recycling.
CN202310854412.0A 2023-07-12 2023-07-12 Polishing device and polishing method for chip processing Pending CN116713836A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310854412.0A CN116713836A (en) 2023-07-12 2023-07-12 Polishing device and polishing method for chip processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310854412.0A CN116713836A (en) 2023-07-12 2023-07-12 Polishing device and polishing method for chip processing

Publications (1)

Publication Number Publication Date
CN116713836A true CN116713836A (en) 2023-09-08

Family

ID=87869835

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310854412.0A Pending CN116713836A (en) 2023-07-12 2023-07-12 Polishing device and polishing method for chip processing

Country Status (1)

Country Link
CN (1) CN116713836A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117620883A (en) * 2024-01-24 2024-03-01 扬州群发换热器有限公司 OPA chip end face polishing grinder

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117620883A (en) * 2024-01-24 2024-03-01 扬州群发换热器有限公司 OPA chip end face polishing grinder
CN117620883B (en) * 2024-01-24 2024-03-26 扬州群发换热器有限公司 OPA chip end face polishing grinder

Similar Documents

Publication Publication Date Title
CN2763968Y (en) Chemical-mechanical abrading device
CN116713836A (en) Polishing device and polishing method for chip processing
CN116619164B (en) Grinding device for natural stone treatment
CN110871385A (en) Double-side polishing machine and polishing method
CN210010788U (en) A single face grinding polisher for prism
CN213080916U (en) Vertical grinding machine is used in quartz rod processing
CN214351423U (en) Polishing machine for producing plane mirror
CN112936534B (en) Ceramic blank inner and outer wall acid pickling polishing device and using method thereof
CN116021359B (en) Silicon wafer fine grinding device capable of automatically adjusting polished workpiece
CN212218146U (en) Material containing structure of environment-friendly automatic polishing machine
CN219380034U (en) Magnetic polishing machine convenient for discharging
CN110153866B (en) Polishing equipment of multistation circulation processing based on PLC automated control
CN109514394B (en) Conveniently change hydrologic cycle spiral-flow light decorations machine of abrasive material
CN105856056B (en) A kind of shaped face automatic polishing device
CN114131445A (en) Grinding and cleaning device for silicon wafer
JP5050064B2 (en) Surface polishing method, surface polishing apparatus and surface polishing plate
CN213765154U (en) Novel controllable high-speed glass polishing machine
CN211867377U (en) Multifunctional processing table for hardware processing
CN205271740U (en) Polishing pad dresser and polishing device
CN113231897A (en) Blue-light-proof resin lens production polishing processing machinery and processing method
CN112091736A (en) Surface treatment grinding equipment and process of meat food material cutting tool
CN208342453U (en) Adjustable type eyeglass polishing machine
CN220408188U (en) Lens washing and grinding machine
CN220740731U (en) Grooving structure and corresponding flat grinder
CN116493688B (en) Tooth surface efficient grinding machine for noise reduction gear

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination