CN102173758B - Composite ceramic polishing chip and preparation method thereof - Google Patents
Composite ceramic polishing chip and preparation method thereof Download PDFInfo
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- CN102173758B CN102173758B CN201110052374A CN201110052374A CN102173758B CN 102173758 B CN102173758 B CN 102173758B CN 201110052374 A CN201110052374 A CN 201110052374A CN 201110052374 A CN201110052374 A CN 201110052374A CN 102173758 B CN102173758 B CN 102173758B
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Abstract
The invention discloses a composite ceramic polishing chip and a preparation method thereof. The composite ceramic polishing chip is prepared by the following steps of: adding water into 2 to 4 weight parts of raw material and 6 to 8 weight parts of binding agent, mixing and stirring uniformly, mixing, performing extrusion molding and sintering, wherein the raw material is the mixture which comprises 85 to 95 percent of aluminum oxide and 5 to 15 percent of zirconium oxide base stock, and the bonding agent is the mixture which comprises 55 to 65 percent of kaolin and 35 to 45 percent of potash feldspar, and the zirconium oxide base stock is the mixture which comprises 97 to 99 percent of zirconium oxide and 1 to 3 percent of yttrium oxide. In the method, nano powder raw materials are bonded by using the bonding agent to form a spherical polishing chip. A chip electronic material is polished by using the polishing chip instead of the conventional powder abrasive material. The method is easy to operate, chemical aids are not needed to be added and pollution to the environment is small. The used equipment has low manufacturing cost, not only can perform one-side or double-side polishing processing, but also can perform omnibearing polishing, and can improve the polishing effect and stabilizing the polishing quality. The formula of the polishing chip is reasonable, and the polishing chip has high abrasive resistance, toughness and strength. After being sintered, the grains are refined and the grinding quality of workpieces is improved.
Description
Technical field
The present invention relates to a kind of rubbing down material that industry uses and preparation method thereof that grinds, particularly relate to a kind of composite ceramics polishing chip and preparation method thereof, belong to the abrasive substance technical field.
Background technology
At present; To the polishing of (comprising flaky materials such as all kinds of ceramic substrates, all print electronic circuit board, multiple wafer, ceramic disc capacitor substrate) of chip electronic material; Basically still adopt traditional powder glossing to polish; Have that working (machining) efficiency is low, processing output is little, can not continuous production, can not form the problem of robotization streamline operration; And can only carry out single or double rubbing down processing to workpiece, can not comprehensive rubbing down, thereby adopt that the traditional method polishing effect is undesirable, quality of finish is unstable.As adopt single or double grinding and polishing machine equipment that the chip electronic material is polished, and equipment manufacturing cost is expensive, and operation easier is big, and is high to shape, granularity and the material requirement of abrasive material, and needs a large amount of chemical assistants, and environmental pollution is bigger.
The problems referred to above are to perplex the technical problem of chip electronic material polishing for a long time, are effectively solved for a long time.
Summary of the invention
The objective of the invention is to: a kind of composite ceramics polishing chip and preparation method thereof is provided.Substitute the powder abrasive material with this composite ceramics polishing chip, cooperate existing oscillatory spin light polishing machine or spiral polisher lapper that the chip electronic material is polished, can overcome the deficiency of prior art.
Technical scheme of the present invention: a kind of composite ceramics polishing chip, by weight, add water with 2～4 parts of raw materials and 6～8 parts of wedding agents and puddle evenly, process through mixing, extrusion molding and sintering; Described raw material is that 85～95% aluminum oxide and 5～15% zirconium white base-material mix, and described wedding agent is that 55～65% kaolin and 35～45% potassium felspar sand mix; Described zirconium white base-material is to be mixed by 97～99% zirconium white and 1～3% yttrium oxide.
In the aforesaid composite ceramics polishing chip, the composite ceramics polishing chip is processed with 3 parts of raw materials and 7 parts of wedding agents.
In the aforesaid composite ceramics polishing chip, described raw material is the flour that the zirconium white base-material of 90% aluminum oxide and 10% mixes.
In the aforesaid composite ceramics polishing chip, described wedding agent is the flour that the potassium felspar sand of 60% kaolin and 40% mixes.
In the aforesaid composite ceramics polishing chip, the aluminum oxide in the said raw material is that granularity is 1100～1400 purpose flours, and the zirconium white in the zirconium white base-material and the granularity of yttrium oxide are nano level flour.
In the aforesaid composite ceramics polishing chip, the preparation method of said composite ceramics polishing chip processes by following step;
(1), powder raw material and powdery wedding agent mixing and water adding are stirred, the A article;
(2), that the A article are put into vacuum pugmill is mixing, the B article;
(3), with B article ball up, the C article;
(4), the C article are put into high temperature sintering kiln sintering, finished product.
Among the above-mentioned preparation method, said step (2) is for to put into vacuum pugmill with the A article ,-0.09～-0.1Mpa pressure under mixing secondary, the B article; Said step (3) is the spherical of 2～8mm for the B article are squeezed into diameter, gets the C article.
Among the above-mentioned preparation method, said step (2) is for to put into vacuum pugmill with the A article, mixing secondary under-0.095Mpa pressure, the B article.
Among the above-mentioned preparation method; Said mixing secondary is that mixing time is confirmed by vacuum pugmill automatically with the inlet input of A article from vacuum pugmill; Outlet output A article work in-process from vacuum pugmill; A article work in-process again from the inlet input of vacuum pugmill, after for the second time mixing, are got the B article;
Among the above-mentioned preparation method, said step (4) is for to put into the high temperature sintering kiln with the C article, 1200～1500 ℃ of sintering temperatures 40～60 minutes, finished product.
Among the above-mentioned preparation method, said step (4) is for to put into the high temperature sintering kiln with the C article, 1350～1400 ℃ of sintering temperatures 45 minutes, finished product.
Compared with prior art, the present invention is bonded to spherical composite ceramics polishing chip with the nanometer grade powder raw material with the inorganic ceramic wedding agent.Substitute existing powder abrasive material with this abrading block the chip electronic material is carried out rubbing down.Solved and adopted traditional powder glossing to polish, have that working (machining) efficiency is low, processing output is little, can not continuous production, can not form the problem of robotization streamline operration.In the rubbing down process, not only can carry out single or double rubbing down processing, can also comprehensive rubbing down, can improve polishing effect, stablize quality of finish.Also available existing oscillatory spin light polishing machine of composite ceramics polishing chip of the present invention or spiral polisher lapper polish the chip electronic material, and used equipment manufacturing cost is cheap, and is simple to operate, and environmental pollution is little.Solved the technical barrier of long-term puzzlement chip electronic material polishing.
Raw material of the present invention is employed in and adds yttrium oxide in the zirconium white, and yttrium oxide can play the effect of stabilizing zirconia, generates semistable zirconium white base-material, has improved the wear resistance of abrading block greatly.The granularity of control raw material is utilized the toughening effect of nano material in the nano level scope, improved the toughness of abrading block.Reduce sintering temperature, suppress crystal grain and grow up unusually, make grain refining behind the sintering, adopting spherically in shape simultaneously, can avoid workpiece is scratched, improved the Grinding Quality of workpiece.
The present invention fills a prescription rationally, and the preparation method is reasonable, and be easy to grasp, with short production cycle, production cost is low, composite ceramics polishing chip wear resistance, toughness and the intensity of making are all better.Substitute the powder abrasive material with this composite ceramics polishing chip, cooperate existing oscillatory spin light polishing machine or spiral polisher lapper that the chip electronic material is polished, can overcome the deficiency of prior art.
The present invention provides the abrasive material that is suitable for for existing oscillatory spin light polishing machine or spiral polisher lapper polish the chip electronic material; Alternative existing powder abrasive material; Do not need a large amount of chemical assistants; Reduced pollution greatly, solved in the polishing process of lapping and can only carry out the technology shortcoming that single or double grinds environment.After adopting product processing polishing chip electronic product of the present invention, product performance are improved, and output is big, and effect can improve tens of times, but continuous batch flowing water operations has reduced tooling cost significantly.
Embodiment
Embodiment 1.A kind of composite ceramics polishing chip by weight, adds water with 2 parts of raw materials and 8 parts of wedding agents and puddles evenly, processes through mixing, extrusion molding and sintering; Described raw material is that 95% aluminum oxide and 5% zirconium white base-material mix; Described wedding agent is that 55% kaolin and 45% potassium felspar sand mix.Described zirconium white base-material is that 99% zirconium white and 1% yttrium oxide mixes.
Raw material and wedding agent are processed by following step;
(1), powder raw material and powdery wedding agent are mixed 10～15% add water and stir, the A article;
(2), that the A article are put into the vacuum kneading stove is mixing, mixing secondary under-0.09Mpa pressure, the B article;
(3), the B article are squeezed into diameter is the spherical of 2～8mm, the C article;
(4), the C article are put into the sintering oven sintering, 1200 ℃ of sintering temperatures 60 minutes, finished product.
Embodiment 2.A kind of composite ceramics polishing chip by weight, adds water with 4 parts of raw materials and 6 parts of wedding agents and puddles evenly, processes through mixing, extrusion molding and sintering; Described raw material is that 85% aluminum oxide and 15% zirconium white base-material mix; Described wedding agent is that 65% kaolin and 35% potassium felspar sand mix; Described zirconium white base-material is that 97% zirconium white and 3% yttrium oxide mixes; The granularity of aluminum oxide is 1300 order flours in the raw material of said composite ceramics polishing chip, and the zirconium white in the raw material and the granularity of yttrium oxide can be nano level flours.
Raw material and wedding agent are processed by following step;
(1), powder raw material and powdery wedding agent are mixed 10～15% add water and stir, the A article;
(2), that the A article are put into the vacuum kneading stove is mixing, mixing secondary under-0.1Mpa pressure, the B article;
(3), the B article are squeezed into diameter is the spherical of 2～8mm, the C article;
(4), the C article are put into the sintering oven sintering, 1500 ℃ of sintering temperatures 40 minutes, finished product.
Embodiment 3.A kind of composite ceramics polishing chip by weight, adds water with 3 parts of raw materials and 7 parts of wedding agents and puddles evenly, processes through mixing, extrusion molding and sintering; Described raw material is that 90% aluminum oxide and 10% zirconium white base-material mix; Described wedding agent is that 60% kaolin and 40% potassium felspar sand mix; Described zirconium white base-material is that 98% zirconium white and 2% yttrium oxide mixes; The granularity of aluminum oxide is 1250 order flours in the raw material of said composite ceramics polishing chip, and the zirconium white in the raw material and the granularity of yttrium oxide are nano level flour.
Raw material and wedding agent are processed by following step;
(1), powder raw material and powdery wedding agent are mixed 10～15% add water and stir, the A article;
(2), that the A article are put into the vacuum kneading stove is mixing, mixing secondary under-0.095Mpa pressure, the B article;
(3), the B article are squeezed into diameter is the spherical of 2～8mm, the C article;
(4), the C article are put into the sintering oven sintering, 1370 ℃ of sintering temperatures 50 minutes, finished product.
Claims (6)
1. composite ceramics polishing chip is characterized in that: by weight, add water with 3 parts of raw materials and 7 parts of wedding agents and puddle evenly, process through mixing, extrusion molding and sintering; Described raw material is the flour that the zirconium white base-material of 90% aluminum oxide and 10% mixes, and described wedding agent is the flour that the potassium felspar sand of 60% kaolin and 40% mixes; Described zirconium white base-material is to be mixed by 97～99% zirconium white and 1～3% yttrium oxide; Aluminum oxide in the said raw material is that granularity is 1100～1400 purpose flours; The zirconium white in the zirconium white base-material and the granularity of yttrium oxide are nano level flour.
2. the preparation method of the said composite ceramics polishing chip of claim 1 is characterized in that: process by following step;
⑴, powder raw material and powdery wedding agent mixing and water adding are stirred, the A article;
⑵, that the A article are put into vacuum pugmill is mixing, the B article;
, with B article ball up, the C article;
⑷, the C article are put into high temperature sintering kiln sintering, finished product.
3. the preparation method of composite ceramics polishing chip according to claim 2 is characterized in that: said step ⑵ is for to put into vacuum pugmill with the A article ,-0.09～-0.1MPa pressure under mixing secondary, the B article; Said step ⑶ gets the C article for the B article are squeezed into the globe that diameter is 2～8mm.
4. the preparation method of composite ceramics polishing chip according to claim 2 is characterized in that: said step ⑵ is for to put into vacuum pugmill with the A article, mixing secondary under-0.095MPa pressure, the B article.
5. the preparation method of composite ceramics polishing chip according to claim 2 is characterized in that: said step ⑷ is for to put into the high temperature sintering kiln with the C article, 1200～1500 ℃ of sintering temperatures 40～60 minutes, finished product.
6. the preparation method of composite ceramics polishing chip according to claim 2 is characterized in that: said step ⑷ is for to put into the high temperature sintering kiln with the C article, 1350～1400 ℃ of sintering temperatures 45 minutes, finished product.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110052374A CN102173758B (en) | 2011-03-04 | 2011-03-04 | Composite ceramic polishing chip and preparation method thereof |
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| CN201110052374A CN102173758B (en) | 2011-03-04 | 2011-03-04 | Composite ceramic polishing chip and preparation method thereof |
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| CN102173758A CN102173758A (en) | 2011-09-07 |
| CN102173758B true CN102173758B (en) | 2012-10-03 |
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| CN109514359B (en) * | 2018-11-22 | 2020-11-24 | 江西天仙精藏设备有限公司 | Grinding tool for grinding hard alloy cutter and preparation method thereof |
| CN112239349A (en) * | 2020-09-28 | 2021-01-19 | 湖州星星研磨有限公司 | High-density corundum abrasive block and production process thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1403405A (en) * | 2002-10-11 | 2003-03-19 | 上海施迈尔精密陶瓷有限公司 | Making process of woven ceramic product of zirconia flexibilized alumina ceramic |
| CN1982398A (en) * | 2005-12-16 | 2007-06-20 | 湖州星星研磨有限公司 | Polishing grinding block |
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- 2011-03-04 CN CN201110052374A patent/CN102173758B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1403405A (en) * | 2002-10-11 | 2003-03-19 | 上海施迈尔精密陶瓷有限公司 | Making process of woven ceramic product of zirconia flexibilized alumina ceramic |
| CN1982398A (en) * | 2005-12-16 | 2007-06-20 | 湖州星星研磨有限公司 | Polishing grinding block |
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Denomination of invention: A kind of composite ceramic polishing block and preparation method thereof Effective date of registration: 20220830 Granted publication date: 20121003 Pledgee: Zhejiang Nanxun Rural Commercial Bank branch Shuanglin Limited by Share Ltd. Pledgor: Huzhou Xingxing Grinding Co.,Ltd. Registration number: Y2022330001958 |
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