CN116564873A - Fixed-point positioning mechanism and fixed-point positioning step for semiconductor wafer - Google Patents
Fixed-point positioning mechanism and fixed-point positioning step for semiconductor wafer Download PDFInfo
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- CN116564873A CN116564873A CN202310657335.XA CN202310657335A CN116564873A CN 116564873 A CN116564873 A CN 116564873A CN 202310657335 A CN202310657335 A CN 202310657335A CN 116564873 A CN116564873 A CN 116564873A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 230000007246 mechanism Effects 0.000 title claims abstract description 18
- 230000005540 biological transmission Effects 0.000 claims abstract description 31
- 238000006073 displacement reaction Methods 0.000 claims abstract description 20
- 235000012431 wafers Nutrition 0.000 claims description 57
- 239000000463 material Substances 0.000 claims description 14
- 238000010030 laminating Methods 0.000 claims 1
- 230000009471 action Effects 0.000 abstract description 6
- 230000002457 bidirectional effect Effects 0.000 abstract description 6
- 238000012545 processing Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of semiconductor processing, and discloses a semiconductor wafer fixed-point positioning mechanism and fixed-point positioning steps. According to the invention, the displacement assembly is arranged in the base, under the action of the bidirectional motor, the cross rod can drive the first bevel gear to rotate, the symmetrically arranged transmission rods drive the gear plates to rotate through the meshing arrangement of the first bevel gear and the second bevel gear, and the frame seat is moved on the surface of the fixed rod through the meshing arrangement of the gear plates and the racks, so that the displacement assembly can conveniently drive the positioning assembly to move on the surface of the base through the supporting plate, the wafer can be positioned below the infrared camera, and the infrared camera can conveniently and accurately identify and position the wafer.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a semiconductor wafer fixed-point positioning mechanism and a fixed-point positioning step.
Background
Semiconductors refer to materials with conductivity between conductors and insulators at normal temperature, and are used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion and the like, and the importance of semiconductors is very great from the viewpoint of technology or economic development, and most of electronic products, such as core units in computers, mobile phones or digital recorders, are very closely related to semiconductors.
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because of its round shape, various circuit element structures can be manufactured on the silicon wafer to form an IC product with specific electrical functions, the original material of the wafer is silicon, the surface of crust is useful and inexhaustible silicon dioxide, silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid, and distilled to obtain high-purity polysilicon.
As disclosed in chinese patent publication No. CN115632020B, a semiconductor wafer positioning device and a method for processing and positioning a semiconductor wafer, where the semiconductor wafer positioning device performs alignment recognition on a mask sheet by using a positioning sensor disposed at the bottom of a fixing block, positions a positioning assembly by using a positioning sensor disposed at the top of a positioning plate, and calculates data measured by the positioning sensor and the positioning sensor by using a controller, so that the controller controls a moving assembly to operate, and the moving assembly drives the positioning assembly to implement X, Y two-axis movement, so that the center of the positioning assembly is aligned with the center of the mask sheet, thereby solving the problem that the mask sheet is difficult to be in the same position with the previous mask sheet when the mask sheet is manually replaced by using conventional equipment.
Although the above disclosed technical scheme can realize the accurate center identification positioning of the wafer through movement, the device can only carry out single accurate center identification of the wafer through X, Y two-axis movement, and can not carry out the positioning of different positions on the surfaces of the wafers with different thicknesses, so that the application range of the device is limited, and in the existing overshoot of the positioning identification through the infrared camera, the wafer is easy to be influenced by the interference of refraction of the surfaces of the wafer, and the positioning accuracy of the wafer is affected.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the invention provides a semiconductor wafer fixed-point positioning mechanism and a fixed-point positioning step, which can solve the problems that the existing semiconductor wafer positioning device can only perform single accurate identification on a wafer through X, Y two-axis movement and cannot perform positioning on the surfaces of wafers with different thicknesses at different positions, so that the application range of the device is limited, and in the existing overshoot of positioning identification through an infrared camera, the wafer positioning accuracy is affected due to interference caused by refraction of the surfaces of the wafers.
(II) technical scheme
In order to achieve the above purpose, the present invention provides the following technical solutions: the fixed-point positioning mechanism for the semiconductor wafer comprises a base, a bracket fixed on the surface of the base, a top plate arranged at the top end of a vertical plate and an infrared camera arranged below the top plate, wherein a positioning assembly is arranged on the surface of the base, a material tray is arranged above the positioning assembly, and the material tray is arranged below the infrared camera;
the positioning assembly comprises a movable seat, a bracket is connected to the movable seat through a self-locking rotating shaft, a side plate is connected to the upper side of the bracket through a rotating rod, an outer toothed ring is integrally arranged on the outer bottom wall of the side plate, and a transmission gear is connected to the bottom end of the outer toothed ring in a meshed manner;
the transmission gear is arranged on the inner side of the bracket through a driving rod, the driving gear is further arranged on the outer wall of the driving rod, an auxiliary gear is connected to the outer wall of the bottom end of the driving gear in a meshed mode, and the auxiliary gear is arranged in the bracket through a movable rod;
the inside of the side plate is connected with a connecting frame, a motor is fixedly arranged in the connecting frame, the output end of the motor is connected with a rotary column, and the top end of the rotary column is connected with the bottom end of the material tray;
the positioning component is arranged on the surface of the base in a telescopic way through the displacement component;
the displacement assembly comprises a frame seat in the displacement assembly, a supporting plate is fixedly arranged at the top end of the frame seat, and the top of the supporting plate is fixedly arranged at the bottom end of the movable seat through bolts;
the outer part of the frame seat is provided with a bidirectional motor, the output end of the bidirectional motor is connected with a cross rod, the outer wall of the cross rod is provided with a first bevel gear, the bottom end of the first bevel gear is connected with a second bevel gear in a meshed manner, and the inner part of the second bevel gear is connected with the frame seat through a transmission rod;
the gear plate is installed to the outer wall of transfer line, and the outer wall meshing of gear plate is connected with the rack, the rack is installed at the outer wall of dead lever, and the dead lever is at the inside fixed mounting of base.
Preferably, one end of the driving rod is connected with a driving motor, and the driving motor is installed on the outer wall of the bracket.
Preferably, the side plates are of a semicircular structure, the side plates are symmetrically arranged on two sides of the connecting frame respectively, and the two groups of side plates and the connecting frame are of an H-shaped structure integrally.
Preferably, the support is in a structure, and one end of the support rotates in the movable seat through the self-locking rotating shaft.
Preferably, the tray is of a circular structure, and a circular groove capable of accommodating wafers is formed in the tray.
Preferably, one side of the bottom of the frame seat is connected with a mounting frame, a plurality of groups of guide cylinders are rotatably connected in the mounting frame, and the upper top wall of each guide cylinder is connected with the lower bottom wall of the fixing rod in a fitting mode.
Preferably, the cross bars and the transmission rods are vertically distributed, and two groups of gear plates are arranged on the outer walls of the transmission rods in parallel.
Preferably, the rack is symmetrically provided with two groups on the outer wall of the fixing rod, and the fixing rod is in a 'II' structure.
Preferably, a slot capable of accommodating the movement of the frame seat is formed in the surface of the base.
(III) beneficial effects
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, the displacement assembly is arranged in the base, under the action of the bidirectional motor, the cross rod can drive the first bevel gear to rotate, the symmetrically arranged transmission rods drive the gear plates to rotate through the meshing arrangement of the first bevel gear and the second bevel gear, and the frame seat is moved on the surface of the fixed rod through the meshing arrangement of the gear plates and the racks, so that the displacement assembly can conveniently drive the positioning assembly to move on the surface of the base through the supporting plate, the wafer can be positioned below the infrared camera, and the infrared camera can conveniently and accurately identify and position the wafer.
2. According to the invention, the bracket is connected with the bracket through the self-locking rotating shaft in the positioning assembly, so that the bracket can drive the material tray to carry out height adjustment, the bracket can conveniently carry out position adjustment below the infrared camera through the displacement assembly at the bottom, the identification accuracy of the infrared camera is further improved, meanwhile, the side plate is rotatably arranged on one side of the bracket, under the action of the driving motor, the side plate can drive the material tray to carry out up-down angle rotation at one end of the bracket, the flexibility of a wafer below the infrared camera is ensured, the refraction of the wafer below the infrared camera due to light is reduced, and the positioning and fixed-point effects of the device are ensured.
3. According to the invention, the motor is arranged between the side plate and the connecting frame, so that the tray can horizontally rotate above the bracket under the action of the rotating column, the tray can conveniently drive the wafer to rotate below the infrared camera, the device can conveniently and rapidly identify and position the large-area wafer, and the practicability and flexibility of the device are enhanced.
4. According to the invention, the mounting frame and the guide cylinder are arranged at the bottom of the frame seat, so that when the frame seat moves on the outer wall of the rack through the gear plate, the guide cylinder synchronously rotates on the bottom wall of the fixed rod, the moving accuracy of the frame seat on the outer wall of the fixed rod is ensured, a stable moving path of the frame seat is realized, and the safety of the wafer in the material plate is ensured.
Drawings
FIG. 1 is a schematic perspective view of a semiconductor wafer positioning mechanism according to the present invention;
FIG. 2 is a schematic perspective view of a positioning assembly and a displacement assembly according to the present invention;
FIG. 3 is a schematic side view of the positioning assembly and the displacement assembly according to the present invention;
FIG. 4 is an enlarged schematic view of the structure of FIG. 3A according to the present invention;
FIG. 5 is a schematic perspective view of a displacement assembly according to the present invention;
FIG. 6 is a schematic elevational cross-sectional view of a displacement assembly of the present invention;
FIG. 7 is a schematic perspective view of a positioning assembly according to the present invention;
FIG. 8 is a schematic perspective view of a side plate and a driving rod according to the present invention;
fig. 9 is a schematic perspective view of a tray according to the present invention.
In the figure: 1. a base; 2. a vertical plate; 3. a top plate; 4. an infrared camera; 5. a positioning assembly; 501. a movable seat; 502. a bracket; 503. a rotating rod; 504. a side plate; 505. an outer toothed ring; 506. a transmission gear; 507. a driving rod; 508. a drive gear; 509. an auxiliary gear; 5010. a connecting frame; 5011. a motor; 5012. a spin column; 5013. a driving motor; 6. a material tray; 7. a displacement assembly; 701. a frame base; 702. a supporting plate; 703. a bi-directional motor; 704. a cross bar; 705. a first bevel gear; 706. a second bevel gear; 707. a transmission rod; 708. a gear plate; 709. a rack; 7010. a fixed rod; 7011. a mounting frame; 7012. a guide cylinder.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-9, a semiconductor wafer fixed-point positioning mechanism comprises a base 1, a vertical plate 2 fixed on the surface of the base 1, a top plate 3 arranged at the top end of the vertical plate 2, an infrared camera 4 arranged below the top plate 3, a positioning component 5, a movable seat 501, a bracket 502, a rotating rod 503, a side plate 504, an outer tooth ring 505, a transmission gear 506, a driving rod 507, a driving gear 508, an auxiliary gear 509, a connecting frame 5010, a motor 5011, a rotating column 5012, a driving motor 5013, a material disc 6, a displacement component 7, a frame seat 701, a supporting plate 702, a bidirectional motor 703, a cross rod 704, a first bevel gear 705, a second bevel gear 706, a transmission rod 707, a gear disc 708, a rack 709, a fixed rod 7010, a mounting rack 7011 and a guide cylinder 7012, wherein the infrared camera 4 is arranged on the surface of the base 1 through the vertical plate 2 and the top plate 3, so that the wafer is positioned above the infrared camera 4;
specifically, the inside of the positioning component 5 includes a movable seat 501, the inside of the movable seat 501 is connected with a bracket 502 through a self-locking rotating shaft, and the bracket 502 is arranged in a type structure, so that one end of the bracket 502 can rotate in the inside of the movable seat 501 through the self-locking rotating shaft, thereby facilitating the angle adjustment of the bracket 502, meanwhile, a side plate 504 is connected above the bracket 502 through a rotating rod 503, the side plate 504 is in a semicircular structure, and the side plates 504 are respectively arranged on two sides of the bracket 502, meanwhile, in order to realize the stable rotation and transmission of the side plate 504, an outer toothed ring 505 is integrally arranged on the outer bottom wall of the side plate 504, and the bottom end of the outer toothed ring 505 is in meshed connection with a transmission gear 506, so that the transmission gear 506 can realize the rotation of the side plate 504 through the outer toothed ring 505, thereby facilitating the rotation of the side plate 504 in the bracket 502 through the rotating rod 503;
further, considering the transmission effect of the transmission gear 506, the transmission gear 506 is mounted on the inner side of the bracket 502 through the driving rod 507, so that the driving rod 507 can drive the transmission gear 506 to rotate, the rotation of the side plate 504 is realized through the engagement of the transmission gear 506 and the outer toothed ring 505, in order to drive the driving rod 507, one end of the driving rod 507 is connected with a driving motor 5013, and the driving motor 5013 is mounted on the outer wall of the bracket 502, so that the driving motor 5013 can synchronously drive the driving rod 507, meanwhile, in order to improve the rotation stability of the driving rod 507, the driving gear 508 is mounted on the outer wall of the driving rod 507, and the bottom end outer wall of the driving gear 508 is meshed with an auxiliary gear 509, so that the auxiliary gear 509 limits the driving rod 507 at the bottom, the rotation path of the driving rod 507 is ensured, and in order to realize the stable rotation of the auxiliary gear 509, the auxiliary gear 509 is mounted inside the bracket 502 through a movable rod, and the rotation effect of the auxiliary gear 509 is ensured;
in order to realize the angular rotation and rotation of the tray 6 above the bracket 502, a connecting frame 5010 is connected inside the side plates 504, and two groups of side plates 504 are symmetrically arranged on two sides of the connecting frame 5010, so that the two groups of side plates 504 and the connecting frame 5010 are in an H-shaped structure integrally, the connecting effect of the side plates 504 and the connecting frame 5010 is ensured, meanwhile, a motor 5011 is fixedly arranged inside the connecting frame 5010, the output end of the motor 5011 is connected with a rotating column 5012, the top end of the rotating column 5012 is connected with the bottom end of the tray 6, and the tray 6 can horizontally rotate through the rotating column 5012;
in order to achieve the moving effect and flexibility of the positioning component 5, the positioning component 5 is arranged on the surface of the base 1 in a telescopic manner through the displacement component 7, specifically, the inside of the displacement component 7 comprises a frame seat 701, in order to achieve the moving effect of the frame seat 701, a groove capable of accommodating the movement of the frame seat 701 is formed in the surface of the base 1, the frame seat 701 is convenient to displace, meanwhile, in order to achieve the next connection of the displacement component 7 and the positioning component 5, a supporting plate 702 is fixedly arranged at the top end of the frame seat 701, the top of the supporting plate 702 is fixedly arranged at the bottom end of the moving seat 501 through a bolt, the positioning component 5 is arranged on the surface of the supporting plate 702, and the frame seat 701 is convenient to drive the positioning component 5 to move through the supporting plate 702;
referring to fig. 3 to 6, a bi-directional motor 703 is installed at the outside of a frame 701, an output end of the bi-directional motor 703 is connected with a cross bar 704, the cross bar 704 is disposed inside the frame 701 through a bearing, a first bevel gear 705 is installed at the outer wall of the cross bar 704, a second bevel gear 706 is engaged and connected with the bottom end of the first bevel gear 705, meanwhile, the inside of the second bevel gear 706 is connected with the frame 701 through a transmission rod 707, the cross bar 704 and the transmission rod 707 are vertically distributed, under the engagement action of the first bevel gear 705 and the second bevel gear 706, the cross bar 704 can realize synchronous transmission of the transmission rod 707, and be provided with two sets of toothed disc 708 in parallel at the outer wall of transfer line 707, and the outer wall meshing of toothed disc 708 is connected with rack 709, then make toothed disc 708 can rotate at the outer wall of rack 709, simultaneously, install rack 709 at the outer wall of dead lever 7010, and set up two sets of rack 709 in the outer wall symmetry of dead lever 7010, the fixed effect and the positional stability of rack 709 have been ensured, and with dead lever 7010 at the inside fixed mounting of base 1, and with dead lever 7010 being "II" structure setting, then make frame 701 can carry out the position movement along dead lever 7010 through the meshing of toothed disc 708, rack 709, the effect that frame 701 drove locating component 5 has been ensured.
Further, in order to ensure the moving effect of the frame 701 outside the fixing rod 7010, a mounting frame 7011 is connected to one side of the bottom of the frame 701, two groups of guide cylinders 7012 are rotatably connected to the inside of the mounting frame 7011, the upper top wall of the guide cylinder 7012 is attached to the lower bottom wall of the fixing rod 7010, and then the frame 701 can stably move on the outer wall of the fixing rod 7010 through the guide cylinders 7012, so that the frame 701 drives the positioning assembly 5 to stably displace.
The following further provides a fixed-point positioning step performed by using the fixed-point positioning mechanism for the semiconductor wafer, specifically, the fixed-point positioning of the fixed-point positioning mechanism for the semiconductor wafer comprises the following steps:
step one: mounting the wafer on the surface of a material tray 6, and positioning the wafer through an infrared camera 4;
step two: in order to perform fixed-point positioning on different wafers, the bidirectional motor 703 in the displacement assembly 7 is electrified, so that the cross rod 704 drives the first bevel gear 705 to rotate, and under the action of the first bevel gear 705 and the second bevel gear 706, the gear disc 708 rotates on the outer wall of the rack 709, so that the frame 701 drives the positioning assembly 5 to perform position movement on the surface of the base 1 through the supporting plate 702, and the accuracy of the wafers below the infrared camera 4 is ensured;
step three: the wafer is arranged below the infrared camera 4, so that the angle of the bracket 502 is controlled through the self-locking rotating shaft in order to adjust the wafer below the infrared camera 4, and the bracket 502 is convenient for driving the material tray 6 to adjust the height of the wafer below the infrared camera 4;
step four: after the height of the wafer is adjusted, the driving motor 5013 is electrified, so that the driving rod 507 drives the transmission gear 506 to rotate through the driving gear 508, and under the meshing effect of the transmission gear 506 and the outer toothed ring 505, the side plate 504 is enabled to rotate at an angle in the bracket 502, so that the wafer is conveniently arranged at an upper angle and a lower angle below the infrared camera 4, the infrared camera 4 is conveniently and accurately positioned, and refraction and reflection of the surface of the wafer are avoided;
step five: through set up motor 5011 in link 5010's inside, under the effect of motor 5011 circular telegram, then make column of rotation 5012 can drive charging tray 6 and carry out horizontal rotation, the wafer of being convenient for is fixed a position in the different positions of infrared camera 4's below, has ensured infrared camera 4's working range.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides a semiconductor wafer fixed point positioning mechanism, includes base (1), fixes support (2) on base (1) surface, installs roof (3) on riser (2) top and sets up infrared camera (4) in roof (3) below, its characterized in that: the surface of the base (1) is provided with a positioning component (5), a material tray (6) is arranged above the positioning component (5), and the material tray (6) is arranged below the infrared camera (4);
the positioning assembly (5) comprises a movable seat (501), a bracket (502) is connected to the movable seat (501) through a self-locking rotating shaft, a side plate (504) is connected to the upper side of the bracket (502) through a rotating rod (503), an outer toothed ring (505) is integrally arranged on the outer bottom wall of the side plate (504), and a transmission gear (506) is connected to the bottom end of the outer toothed ring (505) in a meshed mode;
the transmission gear (506) is arranged on the inner side of the bracket (502) through a driving rod (507), a driving gear (508) is further arranged on the outer wall of the driving rod (507), an auxiliary gear (509) is connected to the outer wall of the bottom end of the driving gear (508) in a meshed mode, and the auxiliary gear (509) is arranged in the bracket (502) through a movable rod;
the inside of the side plate (504) is connected with a connecting frame (5010), a motor (5011) is fixedly arranged in the connecting frame (5010), the output end of the motor (5011) is connected with a rotary column (5012), and the top end of the rotary column (5012) is connected with the bottom end of the charging tray (6);
the positioning component (5) is arranged on the surface of the base (1) in a telescopic way through the displacement component (7);
the displacement assembly (7) comprises a frame seat (701), a supporting plate (702) is fixedly arranged at the top end of the frame seat (701), and the top of the supporting plate (702) is fixedly arranged at the bottom end of the movable seat (501) through bolts;
the two-way motor (703) is arranged outside the frame seat (701), the output end of the two-way motor (703) is connected with a cross rod (704), a first bevel gear (705) is arranged on the outer wall of the cross rod (704), a second bevel gear (706) is connected with the bottom end of the first bevel gear (705) in a meshed mode, and the inside of the second bevel gear (706) is connected with the frame seat (701) through a transmission rod (707);
the outer wall of the transmission rod (707) is provided with a gear disc (708), the outer wall of the gear disc (708) is connected with a rack (709) in a meshed mode, the rack (709) is arranged on the outer wall of the fixing rod (7010), and the fixing rod (7010) is fixedly arranged in the base (1).
2. The semiconductor wafer positioning mechanism of claim 1, wherein: one end of the driving rod (507) is connected with a driving motor (5013), and the driving motor (5013) is arranged on the outer wall of the bracket (502).
3. The semiconductor wafer positioning mechanism of claim 1, wherein: the side plates (504) are of semicircular structures, the side plates (504) are symmetrically arranged on two sides of the connecting frame (5010) respectively, and the two groups of side plates (504) and the connecting frame (5010) are of an H-shaped structure integrally.
4. A semiconductor wafer positioning apparatus according to claim 2, wherein: the bracket (502) is in a structure, and one end of the bracket (502) rotates in the movable seat (501) through the self-locking rotating shaft.
5. The semiconductor wafer positioning mechanism of claim 1, wherein: the charging tray (6) is of a circular structure, and a circular groove capable of containing wafers is formed in the charging tray (6).
6. The semiconductor wafer positioning mechanism of claim 1, wherein: the bottom one side of frame seat (701) is connected with mounting bracket (7011), and the inside rotation of mounting bracket (7011) is connected with multiunit guide cylinder (7012) to the upper roof of guide cylinder (7012) is connected with the laminating of the lower diapire of dead lever (7010).
7. The semiconductor wafer positioning mechanism of claim 1, wherein: the cross bars (704) and the transmission rods (707) are vertically distributed, and two groups of gear plates (708) are arranged on the outer walls of the transmission rods (707) in parallel.
8. The semiconductor wafer positioning mechanism of claim 1, wherein: two groups of racks (709) are symmetrically arranged on the outer wall of the fixing rod (7010), and the fixing rod (7010) is in a 'II' structure.
9. The semiconductor wafer positioning mechanism of claim 1, wherein: the surface of the base (1) is provided with a slot capable of accommodating the movement of the frame seat (701).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310657335.XA CN116564873B (en) | 2023-06-05 | 2023-06-05 | Fixed-point positioning mechanism and fixed-point positioning step for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310657335.XA CN116564873B (en) | 2023-06-05 | 2023-06-05 | Fixed-point positioning mechanism and fixed-point positioning step for semiconductor wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116564873A true CN116564873A (en) | 2023-08-08 |
| CN116564873B CN116564873B (en) | 2024-05-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310657335.XA Active CN116564873B (en) | 2023-06-05 | 2023-06-05 | Fixed-point positioning mechanism and fixed-point positioning step for semiconductor wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117612988A (en) * | 2024-01-19 | 2024-02-27 | 宇弘研科技(苏州)有限公司 | Wafer buffering type positioning bracket for glue spreading developing machine |
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| JPH07112803A (en) * | 1993-10-19 | 1995-05-02 | Kiyoshi Takahashi | Alignment and thrust up device for wafer |
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| CN117612988A (en) * | 2024-01-19 | 2024-02-27 | 宇弘研科技(苏州)有限公司 | Wafer buffering type positioning bracket for glue spreading developing machine |
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