CN112185872A - Wafer accurate positioning device for chip processing - Google Patents
Wafer accurate positioning device for chip processing Download PDFInfo
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- CN112185872A CN112185872A CN202011002320.2A CN202011002320A CN112185872A CN 112185872 A CN112185872 A CN 112185872A CN 202011002320 A CN202011002320 A CN 202011002320A CN 112185872 A CN112185872 A CN 112185872A
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- 230000001174 ascending effect Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 40
- 210000003781 tooth socket Anatomy 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer accurate positioning device for chip processing, which comprises a positioning rack, wherein an operation table is arranged at the inner end of the positioning rack, a lower tooth groove is formed in the outer surface of the front end of the operation table, a gear is arranged on the inner surface of the upper end of the lower tooth groove, an upper sliding groove is formed in the outer end of the gear, which corresponds to the upper end of the lower tooth groove, a handle is arranged at the outer end of the upper sliding groove, which corresponds to the front end of the gear, a rotating shaft is arranged at the rear end of the handle, which corresponds to the center of the gear, a limiting block is arranged at the inner end of the rotating shaft, which corresponds to the operation table, a sliding bottom plate is arranged at the outer end of the limiting block, a sliding groove is formed. The wafer accurate positioning device for chip processing is provided with a device which is convenient to fix a wafer and move up and down, so that the wafer can be conveniently operated.
Description
Technical Field
The invention relates to the field of accurate positioning devices for wafers, in particular to an accurate positioning device for a wafer for chip processing.
Background
The wafer is a kind of silicon wafer used for making silicon semiconductor integrated circuit, it uses silicon as raw material, in the course of processing it, it needs to carry on the accurate positioning to it, the accurate positioning device of wafer in the prior patent publication CN209868385U, there are disadvantages in the course of using, it is not very good to put the wafer, and it is not very comprehensive to fix, secondly, when processing to the wafer, can't raise the mesa to it, for this reason, we propose a kind of accurate positioning device of wafer for chip processing.
Disclosure of Invention
The invention mainly aims to provide a wafer accurate positioning device for chip processing, which can effectively solve the problems in the background technology.
In order to achieve the purpose, the invention adopts the technical scheme that:
a wafer accurate positioning device for chip processing comprises a positioning rack, wherein an operation table is arranged at the inner end of the positioning rack, a lower tooth groove is formed in the outer surface of the front end of the operation table, a gear is arranged on the inner surface of the upper end of the lower tooth groove, an upper sliding groove is formed in the outer end of the gear, corresponding to the upper end of the lower tooth groove, a handle is arranged at the outer end of the upper sliding groove, corresponding to the front end of the gear, a rotating shaft is arranged at the rear end of the handle, corresponding to the center of the gear, a limiting block is arranged at the inner end of the operating table, corresponding to the outer end of the limiting block, a sliding bottom plate is arranged at the outer end of the sliding bottom plate, a fixing clamping plate is arranged at the upper end of the sliding bottom plate, a resistance disc is arranged on the upper surface of the center of the operation table, a fixing, the lower extreme that the lower extreme of fixed screw corresponds the resistance dish is provided with the dead lever, the central authorities of dead lever are provided with the through hole, the inner of through hole is provided with the connecting axle, the lower extreme of resistance dish is provided with the base, the outer end of going up the base is provided with down the base, the inner upper end that corresponds the location dress frame of base down is provided with the rotating electrical machines, the upper end of rotating electrical machines is provided with the rotary rod.
Preferably, the inner end of the positioning frame is fixedly connected with the operating platform, the length and the height of the operating platform are half of those of the positioning frame, the lower tooth socket is embedded in the outer surface of the front end of the operating platform, and the lower tooth socket is distributed in a vertical mirror image mode in the horizontal direction relative to the outer surface of the front end of the operating platform.
Preferably, the meshing is connected between the upper end internal surface of tooth's socket and the gear down, and down between tooth's socket and the last spout about the ascending translation position distribution of vertical direction, the gear passes through swing joint between pivot and the handle, the cross-sectional size of handle is greater than the cross-sectional size of pivot, and equal fixed connection between gear and pivot, pivot and handle, pivot and the stopper.
Preferably, the outer end of the limiting block is movably connected with the sliding bottom plate, the section of the limiting block is smaller than that of the handle, the section of the limiting block is larger than that of the rotating shaft, the sliding bottom plate is slidably connected with the sliding groove, a parallel sliding groove is arranged at the front end of the sliding groove corresponding to the horizontal position of the upper sliding groove, the parallel sliding groove is consistent with the shape and size of the upper sliding groove, and the upper end of the sliding bottom plate is fixedly connected with the fixed clamping plate.
Preferably, the fixed holes are embedded in the outer surface of the center of the resistance disc, the cross sections of the fixed holes are smaller than those of the resistance disc, the resistance disc is movably connected with the fixed rod through the fixed holes, the fixed screws and the fixed rods, and the cross sections of the resistance disc are larger than those of the fixed rods.
Preferably, the center of the fixing rod is transversely connected with the through hole in a penetrating manner, the through hole penetrates through the fixing rod and the outer surface of the upper base, the inner end of the through hole is connected with the connecting shaft in a sliding manner, and the length of the through hole is smaller than that of the connecting shaft.
Preferably, through hole and connecting axle swing joint between the lower extreme of resistance disc and the last base, sliding connection between last base and the lower base, swing joint between rotating electrical machines and the rotary rod, and the shape of rotary rod is the type of falling the tower, the upper end surface cross-section size of rotary rod equals the inner cross-section size of last base, the internal surface of rotary rod upper end surface and last base all is provided with the screw thread that corresponds each other.
Compared with the prior art, the invention has the following beneficial effects: the wafer accurate positioning device for chip processing comprises an operation table, an upper chute, a lower chute, a gear, a rotating shaft, a handle, a limiting block, a sliding bottom plate, a sliding chute, a resistance disc and a fixed clamping plate, wherein when a wafer needs to be fixed, the handle is rotated at first to enable the gear fixedly connected with the rotating shaft at the rear end of the handle to rotate on the lower chute at the lower end, the limiting block at the rear end of the rotating shaft is driven to pull the sliding bottom plate to move on the sliding chute, the fixed clamping plate slides along the sliding bottom plate, the wafer is placed at the upper end of the resistance disc, the wafer is adsorbed by the resistance disc and the friction on the surface of the wafer is increased, so that the wafer can be clamped conveniently, the position of the wafer is fixed, and by arranging the upper base, the lower base, the rotating rod and the rotating motor, when the fixed wafer needs to move up and down, the rotary rod is driven to rotate by electrifying the rotary motor, so that the upper base positioned at the outer end of the rotary rod moves upwards along the inner end of the lower base, and the vertical adjustment of the position of the wafer is realized, and the wafer is convenient.
Drawings
FIG. 1 is a schematic overall structure diagram of a wafer precision positioning apparatus for chip processing according to the present invention;
FIG. 2 is an enlarged schematic structural diagram of the front end of an operation table of the wafer precise positioning device for chip processing according to the present invention;
FIG. 3 is a partial cross sectional top view of an operation table of the wafer fine positioning device for chip processing according to the present invention;
FIG. 4 is a schematic diagram of a partially enlarged structure of an upper base of the wafer precision positioning device for chip processing according to the present invention;
FIG. 5 is a front view, partially in cross section, of an upper base and a lower base of a wafer fine positioning apparatus for chip processing according to the present invention.
In the figure: 1. positioning and mounting; 2. an operation table; 3. an upper chute; 4. a lower gullet; 5. a gear; 6. a rotating shaft; 7. a handle; 8. a limiting block; 9. a sliding bottom plate; 10. a sliding groove; 11. fixing the clamping plate; 12. an upper base; 13. a fixing hole; 14. fixing screws; 15. a resistance disc; 16. a connecting shaft; 17. a through hole; 18. a lower base; 19. fixing the rod; 20. rotating the rod; 21. a rotating electric machine.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
The first embodiment is as follows:
as shown in fig. 1, 2 and 3, a wafer precision positioning device for chip processing comprises a positioning rack 1, an operation table 2 is arranged at the inner end of the positioning rack 1, a lower tooth socket 4 is arranged on the outer surface of the front end of the operation table 2, a gear 5 is arranged on the inner surface of the upper end of the lower tooth socket 4, an upper chute 3 is arranged at the outer end of the gear 5 corresponding to the upper end of the lower tooth socket 4, a handle 7 is arranged at the outer end of the upper chute 3 corresponding to the front end of the gear 5, a rotating shaft 6 is arranged at the rear end of the handle 7 corresponding to the center of the gear 5, a limit block 8 is arranged at the rear end of the rotating shaft 6 corresponding to the inner end of the operation table 2, a sliding bottom plate 9 is arranged at the outer end of the limit block 8, a sliding groove 10 is arranged at the outer end of the sliding bottom plate 9, a fixed clamping plate 11 is arranged at the upper end, the inner of fixed orifices 13 is provided with set screw 14, the lower extreme of set screw 14 corresponds the lower extreme of resistance dish 15 and is provided with dead lever 19, the central authorities of dead lever 19 are provided with through hole 17, the inner of through hole 17 is provided with connecting axle 16, the lower extreme of resistance dish 15 is provided with upper base 12, the outer end of upper base 12 is provided with lower base 18, the inner of lower base 18 corresponds the upper end of location dress frame 1 and is provided with rotating electrical machines 21, the upper end of rotating electrical machines 21 is provided with rotary rod 20, through being provided with rotating electrical machines 21, conveniently rotate with rotary rod 20.
Fixed connection between the inner of location dress frame 1 and operation panel 2, and the length and the height of operation panel 2 are the length and the half of height of location dress frame 1, lower tooth's socket 4 is embedded in the front end surface of operation panel 2, and lower tooth's socket 4 is the perpendicular mirror image distribution on the horizontal direction about operation panel 2 front end surface, through being provided with lower tooth's socket 4, conveniently meshes the connection between the gear.
Meshing connection between the upper end internal surface of lower tooth's socket 4 and gear 5, and about the ascending translation position distribution of vertical direction between tooth's socket 4 and the last spout 3 down, gear 5 is through swing joint between pivot 6 and the handle 7, the cross-sectional size of handle 7 is greater than the cross-sectional size of pivot 6, and gear 5 and pivot 6, pivot 6 and handle 7, equal fixed connection between pivot 6 and the stopper 8, through being provided with gear 5, make things convenient for gear 5 to be under handle 7's rotation, drive the sliding bottom plate 9 of rear end and slide.
Swing joint between stopper 8's outer end and sliding bottom plate 9, stopper 8's cross-sectional size is less than the cross-sectional size of handle 7, and stopper 8's cross-sectional size is greater than the cross-sectional size of pivot 6, sliding connection between sliding bottom plate 9 and the sliding tray 10, and the horizontal position that the front end of sliding tray 10 corresponds last spout 3 is provided with parallel spout, parallel spout is unanimous with the shape size of last spout 3, fixed connection between sliding bottom plate 9's upper end and the fixed cardboard 11, be provided with stopper 8, the convenience slides on sliding tray 10 to sliding bottom plate 9.
Example two:
on the basis of the first embodiment, as shown in fig. 4 and 5, the fixing hole 13 is embedded in the central outer surface of the resistance disc 15, the cross-sectional size of the fixing hole 13 is smaller than that of the resistance disc 15, the resistance disc 15 is movably connected with the fixing screw 14 and the fixing rod 19 through the fixing hole 13, the cross-sectional size of the resistance disc 15 is larger than that of the fixing rod 19, and the friction force is conveniently increased on the lower surface of the wafer by arranging the resistance disc 15.
The center of the fixing rod 19 is transversely connected with the through hole 17 in a penetrating mode, the through hole 17 penetrates through the fixing rod 19 and the outer surface of the upper base 12, the inner end of the through hole 17 is connected with the connecting shaft 16 in a sliding mode, the length of the through hole 17 is smaller than that of the connecting shaft 16, and the through hole 17 and the connecting shaft 16 are arranged, so that the resistance disc 15 can be conveniently detached and replaced.
Through-hole 17 and connecting axle 16 swing joint between the lower extreme of resistance dish 15 and the last base 12, sliding connection between last base 12 and the lower base 18, swing joint between rotating electrical machines 21 and the rotary rod 20, and the shape of rotary rod 20 is the inverted tower type, the upper end surface cross-section size of rotary rod 20 equals the inner end cross-section size of last base 12, the internal surface of rotary rod 20 upper end surface and last base 12 all is provided with the screw thread that corresponds each other, utilize the rotary rod 20 of inverted tower type, the convenience is to being connected between rotating electrical machines 21 and the last base 12.
It should be noted that, the present invention is a wafer precise positioning device for chip processing, when in use, a user is not completely fixed to a wafer, and the fixing steps are complicated, when the wafer needs to be fixed, first, the handle 7 is rotated to rotate the gear 5 fixedly connected to the rear end of the handle 7 by the rotating shaft 6 on the lower tooth socket 4 at the lower end, the limiting block 8 at the rear end of the rotating shaft 6 is driven to pull the sliding bottom plate 9 to move on the sliding groove 10, so that the fixing clamping plate 11 slides along the sliding bottom plate 9, the wafer is placed on the upper end of the resistance plate 15, also in order to make the wafer adsorbed by the resistance plate 15 and increase the friction on the surface of the wafer, thereby realizing the clamping of the wafer, facilitating the fixing of the wafer position, when the user processes the wafer, the table top of the wafer cannot be lifted, when the fixed wafer needs to move up and down, the rotating rod 20 is driven to rotate by electrifying the rotating motor 21, so that the upper base 12 at the outer end of the rotating rod 20 moves upwards along the inner end of the lower base 18, and the position of the wafer can be adjusted up and down conveniently.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. The utility model provides a wafer accurate positioning device for chip processing, is put up (1) including the location, its characterized in that: an operation table (2) is arranged at the inner end of the positioning frame (1), a lower tooth groove (4) is arranged on the outer surface of the front end of the operation table (2), a gear (5) is arranged on the inner surface of the upper end of the lower tooth groove (4), an upper sliding groove (3) is arranged at the outer end of the gear (5) corresponding to the upper end of the lower tooth groove (4), a handle (7) is arranged at the outer end of the upper sliding groove (3) corresponding to the front end of the gear (5), a rotating shaft (6) is arranged at the rear end of the handle (7) corresponding to the center of the gear (5), a limit block (8) is arranged at the rear end of the rotating shaft (6) corresponding to the inner end of the operation table (2), a sliding bottom plate (9) is arranged at the outer end of the limit block (8), a sliding groove (10) is arranged at the outer end of the sliding bottom plate (9), a fixed clamping, the utility model discloses a resistance dish, including operation panel (2), central authorities' upper surface is provided with resistance dish (15), the central authorities of resistance dish (15) are provided with fixed orifices (13), the inner of fixed orifices (13) is provided with fixed screw (14), the lower extreme that the lower extreme of fixed screw (14) corresponds resistance dish (15) is provided with dead lever (19), the central authorities of dead lever (19) are provided with through hole (17), the inner of through hole (17) is provided with connecting axle (16), the lower extreme of resistance dish (15) is provided with base (12), the outer end of going up base (12) is provided with down base (18), the inner upper end that corresponds location dress frame (1) of base (18) is provided with rotating electrical machines (21) down, the upper end of rotating electrical machines (21) is provided with rotary rod (20).
2. The wafer accurate positioning device for chip processing according to claim 1, wherein: fixed connection between the inner of location dress frame (1) and operation panel (2), and the length and the height of operation panel (2) are the length and the half of height of location dress frame (1), lower tooth's socket (4) are embedded in the front end surface of operation panel (2), and tooth's socket (4) are the perpendicular mirror image distribution on the horizontal direction about operation panel (2) front end surface outward appearance down.
3. The wafer accurate positioning device for chip processing according to claim 2, wherein: meshing connection between the upper end internal surface of lower tooth's socket (4) and gear (5), and tooth's socket (4) and last spout (3) down distribute about the ascending translation position of vertical direction between, swing joint between gear (5) through pivot (6) and handle (7), the cross-sectional size of handle (7) is greater than the cross-sectional size of pivot (6), and equal fixed connection between gear (5) and pivot (6), pivot (6) and handle (7), pivot (6) and stopper (8).
4. The wafer accurate positioning device for chip processing according to claim 1, wherein: swing joint between the outer end of stopper (8) and sliding bottom plate (9), the cross-sectional size of stopper (8) is less than the cross-sectional size of handle (7), and the cross-sectional size of stopper (8) is greater than the cross-sectional size of pivot (6), sliding connection between sliding bottom plate (9) and sliding tray (10), and the horizontal position that the front end of sliding tray (10) corresponds last spout (3) is provided with parallel spout, and parallel spout is unanimous with the shape size of last spout (3), fixed connection between the upper end of sliding bottom plate (9) and fixed cardboard (11).
5. The device of claim 4, wherein the wafer positioning device for chip processing comprises: the fixed holes (13) are embedded in the outer surface of the center of the resistance disc (15), the section size of each fixed hole (13) is smaller than that of the corresponding resistance disc (15), the resistance discs (15) are movably connected with the fixed screws (14) and the fixed rods (19) through the fixed holes (13), and the section sizes of the resistance discs (15) are larger than that of the fixed rods (19).
6. The wafer accurate positioning device for chip processing according to claim 1, wherein: the center of the fixing rod (19) is transversely connected with the through hole (17) in a penetrating mode, the through hole (17) penetrates through the fixing rod (19) and the outer surface of the upper base (12), the inner end of the through hole (17) is connected with the connecting shaft (16) in a sliding mode, and the length of the through hole (17) is smaller than that of the connecting shaft (16).
7. The wafer accurate positioning device for chip processing according to claim 1, wherein: through hole (17) and connecting axle (16) swing joint between the lower extreme of resistance dish (15) and last base (12), sliding connection between last base (12) and lower base (18), swing joint between rotating electrical machines (21) and rotary rod (20), and the shape of rotary rod (20) is the type of falling the tower, the upper end surface cross-section size of rotary rod (20) equals the inner cross-section size of last base (12), the internal surface of rotary rod (20) upper end surface and last base (12) all is provided with the screw thread that corresponds each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011002320.2A CN112185872A (en) | 2020-09-22 | 2020-09-22 | Wafer accurate positioning device for chip processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011002320.2A CN112185872A (en) | 2020-09-22 | 2020-09-22 | Wafer accurate positioning device for chip processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112185872A true CN112185872A (en) | 2021-01-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011002320.2A Pending CN112185872A (en) | 2020-09-22 | 2020-09-22 | Wafer accurate positioning device for chip processing |
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| Country | Link |
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| CN (1) | CN112185872A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116564873A (en) * | 2023-06-05 | 2023-08-08 | 江苏纳沛斯半导体有限公司 | Fixed-point positioning mechanism and fixed-point positioning step for semiconductor wafer |
-
2020
- 2020-09-22 CN CN202011002320.2A patent/CN112185872A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116564873A (en) * | 2023-06-05 | 2023-08-08 | 江苏纳沛斯半导体有限公司 | Fixed-point positioning mechanism and fixed-point positioning step for semiconductor wafer |
| CN116564873B (en) * | 2023-06-05 | 2024-05-10 | 江苏纳沛斯半导体有限公司 | Fixed-point positioning mechanism and fixed-point positioning step for semiconductor wafer |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210105 |
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| WD01 | Invention patent application deemed withdrawn after publication |