SG10201508134VA - Workpiece Processing Method - Google Patents

Workpiece Processing Method

Info

Publication number
SG10201508134VA
SG10201508134VA SG10201508134VA SG10201508134VA SG10201508134VA SG 10201508134V A SG10201508134V A SG 10201508134VA SG 10201508134V A SG10201508134V A SG 10201508134VA SG 10201508134V A SG10201508134V A SG 10201508134VA SG 10201508134V A SG10201508134V A SG 10201508134VA
Authority
SG
Singapore
Prior art keywords
processing method
workpiece processing
workpiece
processing
Prior art date
Application number
SG10201508134VA
Inventor
Yoshihide Kihara
Toru Hisamatsu
Masanobu Honda
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG10201508134VA publication Critical patent/SG10201508134VA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065Plasma etching; Reactive-ion etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3244Gas supply means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32532Electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02164Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02258Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by anodic treatment, e.g. anodic oxidation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H01L21/02274Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
SG10201508134VA 2014-10-07 2015-09-30 Workpiece Processing Method SG10201508134VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014206614A JP6382055B2 (en) 2014-10-07 2014-10-07 Method for processing an object

Publications (1)

Publication Number Publication Date
SG10201508134VA true SG10201508134VA (en) 2016-05-30

Family

ID=54199559

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201508134VA SG10201508134VA (en) 2014-10-07 2015-09-30 Workpiece Processing Method

Country Status (7)

Country Link
US (1) US9607811B2 (en)
EP (1) EP3007205B1 (en)
JP (1) JP6382055B2 (en)
KR (1) KR102311575B1 (en)
CN (2) CN105489483A (en)
SG (1) SG10201508134VA (en)
TW (1) TWI661464B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6559430B2 (en) 2015-01-30 2019-08-14 東京エレクトロン株式会社 Method for processing an object
JP6462477B2 (en) 2015-04-27 2019-01-30 東京エレクトロン株式会社 Method for processing an object
KR102362282B1 (en) 2016-03-29 2022-02-11 도쿄엘렉트론가부시키가이샤 How to process the object
KR20170114579A (en) 2016-04-05 2017-10-16 주식회사 만도 Voltage control method and system thereof
JP6541618B2 (en) * 2016-05-25 2019-07-10 東京エレクトロン株式会社 Method of processing an object
JP6832171B2 (en) 2017-01-24 2021-02-24 東京エレクトロン株式会社 Plasma processing method including cleaning of the inside of the chamber body of the plasma processing device
JP6895352B2 (en) * 2017-09-12 2021-06-30 東京エレクトロン株式会社 How to process the work piece
JP6886940B2 (en) * 2018-04-23 2021-06-16 東京エレクトロン株式会社 Plasma processing method
CN110581050A (en) * 2018-06-07 2019-12-17 东京毅力科创株式会社 Processing method and plasma processing apparatus
JP7345283B2 (en) * 2018-07-26 2023-09-15 東京エレクトロン株式会社 Plasma treatment method and plasma treatment device
JP7178918B2 (en) 2019-01-30 2022-11-28 東京エレクトロン株式会社 Etching method, plasma processing apparatus, and processing system
JP7240946B2 (en) * 2019-04-26 2023-03-16 株式会社トリケミカル研究所 Silicon oxide film forming method
US11955318B2 (en) 2021-03-12 2024-04-09 Applied Materials, Inc. Ash rate recovery method in plasma strip chamber

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04137725A (en) * 1990-09-28 1992-05-12 Tonen Corp Glass substrate polycrystalline silicon film
JP4137725B2 (en) * 2002-07-10 2008-08-20 松下電器産業株式会社 Method and apparatus for determining processing dimension of joining member
WO2008149988A1 (en) 2007-06-08 2008-12-11 Tokyo Electron Limited Patterning method
US7790531B2 (en) * 2007-12-18 2010-09-07 Micron Technology, Inc. Methods for isolating portions of a loop of pitch-multiplied material and related structures
US8647722B2 (en) * 2008-11-14 2014-02-11 Asm Japan K.K. Method of forming insulation film using plasma treatment cycles
JP5698950B2 (en) * 2009-10-23 2015-04-08 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
JP4733214B1 (en) * 2010-04-02 2011-07-27 東京エレクトロン株式会社 Mask pattern forming method and semiconductor device manufacturing method
US8252691B2 (en) * 2010-04-14 2012-08-28 Asm Genitech Korea Ltd. Method of forming semiconductor patterns
KR20120001339A (en) 2010-06-29 2012-01-04 삼성전자주식회사 Method of forming a micropattern for semiconductor devices
JP5674375B2 (en) * 2010-08-03 2015-02-25 東京エレクトロン株式会社 Plasma processing method and plasma processing apparatus
US8298951B1 (en) * 2011-04-13 2012-10-30 Asm Japan K.K. Footing reduction using etch-selective layer
US9666414B2 (en) * 2011-10-27 2017-05-30 Applied Materials, Inc. Process chamber for etching low k and other dielectric films
TWI576890B (en) * 2012-02-20 2017-04-01 Tokyo Electron Ltd Power supply system, plasma processing device and plasma processing method
KR102052936B1 (en) * 2012-11-13 2019-12-06 삼성전자 주식회사 Method for fabricating semiconductor device
JP6366454B2 (en) * 2014-10-07 2018-08-01 東京エレクトロン株式会社 Method for processing an object

Also Published As

Publication number Publication date
US20160099131A1 (en) 2016-04-07
JP6382055B2 (en) 2018-08-29
EP3007205A1 (en) 2016-04-13
CN105489483A (en) 2016-04-13
US9607811B2 (en) 2017-03-28
TWI661464B (en) 2019-06-01
JP2016076621A (en) 2016-05-12
KR102311575B1 (en) 2021-10-08
CN112133630A (en) 2020-12-25
EP3007205B1 (en) 2017-08-16
TW201626434A (en) 2016-07-16
KR20160041764A (en) 2016-04-18

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