SG10201501374UA - Plate-like object processing method - Google Patents
Plate-like object processing methodInfo
- Publication number
- SG10201501374UA SG10201501374UA SG10201501374UA SG10201501374UA SG10201501374UA SG 10201501374U A SG10201501374U A SG 10201501374UA SG 10201501374U A SG10201501374U A SG 10201501374UA SG 10201501374U A SG10201501374U A SG 10201501374UA SG 10201501374U A SG10201501374U A SG 10201501374UA
- Authority
- SG
- Singapore
- Prior art keywords
- plate
- processing method
- object processing
- processing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014043486A JP2015170675A (en) | 2014-03-06 | 2014-03-06 | Processing method of plate-like object |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201501374UA true SG10201501374UA (en) | 2015-10-29 |
Family
ID=53884199
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201501374UA SG10201501374UA (en) | 2014-03-06 | 2015-02-25 | Plate-like object processing method |
Country Status (7)
Country | Link |
---|---|
US (1) | US9455149B2 (en) |
JP (1) | JP2015170675A (en) |
KR (1) | KR20150105210A (en) |
CN (1) | CN104900507A (en) |
DE (1) | DE102015203961A1 (en) |
SG (1) | SG10201501374UA (en) |
TW (1) | TW201539565A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6716403B2 (en) * | 2016-09-09 | 2020-07-01 | 株式会社ディスコ | Laminated wafer processing method |
JP7310792B2 (en) * | 2018-02-22 | 2023-07-19 | 住友電気工業株式会社 | Optical fiber manufacturing method |
DE102019204457B4 (en) * | 2019-03-29 | 2024-01-25 | Disco Corporation | Substrate processing methods |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11503880A (en) * | 1996-02-09 | 1999-03-30 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | Laser splitting method for semiconductor device formed on semiconductor material wafer |
US6420245B1 (en) * | 1999-06-08 | 2002-07-16 | Kulicke & Soffa Investments, Inc. | Method for singulating semiconductor wafers |
JP4422463B2 (en) | 2003-11-07 | 2010-02-24 | 株式会社ディスコ | Semiconductor wafer dividing method |
JP2006041082A (en) * | 2004-07-26 | 2006-02-09 | Sharp Corp | Device and method for crystallizing semiconductor thin film |
JP2006187783A (en) * | 2005-01-05 | 2006-07-20 | Disco Abrasive Syst Ltd | Laser beam machine |
EP1779961B1 (en) * | 2005-10-31 | 2011-06-15 | Advanced Laser Separation International (ALSI) B.V. | Method for forming one or more separated scores in a surface of a substrate |
JP2007152420A (en) * | 2005-12-08 | 2007-06-21 | Aisin Seiki Co Ltd | Method of removing film on substrate |
US20070272666A1 (en) * | 2006-05-25 | 2007-11-29 | O'brien James N | Infrared laser wafer scribing using short pulses |
US8624157B2 (en) * | 2006-05-25 | 2014-01-07 | Electro Scientific Industries, Inc. | Ultrashort laser pulse wafer scribing |
JP5340807B2 (en) * | 2009-05-21 | 2013-11-13 | 株式会社ディスコ | Processing method of semiconductor wafer |
JP5340808B2 (en) * | 2009-05-21 | 2013-11-13 | 株式会社ディスコ | Laser processing method of semiconductor wafer |
JP2010283084A (en) * | 2009-06-03 | 2010-12-16 | Disco Abrasive Syst Ltd | Wafer processing method |
JP5473414B2 (en) * | 2009-06-10 | 2014-04-16 | 株式会社ディスコ | Laser processing equipment |
JP5360278B2 (en) * | 2012-09-27 | 2013-12-04 | 三星ダイヤモンド工業株式会社 | Laser processing apparatus, workpiece processing method, and workpiece dividing method |
-
2014
- 2014-03-06 JP JP2014043486A patent/JP2015170675A/en active Pending
-
2015
- 2015-02-03 TW TW104103560A patent/TW201539565A/en unknown
- 2015-02-25 SG SG10201501374UA patent/SG10201501374UA/en unknown
- 2015-02-25 KR KR1020150026537A patent/KR20150105210A/en not_active Application Discontinuation
- 2015-03-03 CN CN201510094374.9A patent/CN104900507A/en active Pending
- 2015-03-04 US US14/637,854 patent/US9455149B2/en active Active
- 2015-03-05 DE DE102015203961.7A patent/DE102015203961A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
DE102015203961A1 (en) | 2015-09-10 |
TW201539565A (en) | 2015-10-16 |
JP2015170675A (en) | 2015-09-28 |
US9455149B2 (en) | 2016-09-27 |
CN104900507A (en) | 2015-09-09 |
KR20150105210A (en) | 2015-09-16 |
US20150255288A1 (en) | 2015-09-10 |
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