SG10201509978VA - Wafer processing method - Google Patents

Wafer processing method

Info

Publication number
SG10201509978VA
SG10201509978VA SG10201509978VA SG10201509978VA SG10201509978VA SG 10201509978V A SG10201509978V A SG 10201509978VA SG 10201509978V A SG10201509978V A SG 10201509978VA SG 10201509978V A SG10201509978V A SG 10201509978VA SG 10201509978V A SG10201509978V A SG 10201509978VA
Authority
SG
Singapore
Prior art keywords
processing method
wafer processing
wafer
processing
Prior art date
Application number
SG10201509978VA
Inventor
Nakamura Masaru
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201509978VA publication Critical patent/SG10201509978VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
SG10201509978VA 2014-12-19 2015-12-04 Wafer processing method SG10201509978VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014257621A JP2016119370A (en) 2014-12-19 2014-12-19 Wafer processing method

Publications (1)

Publication Number Publication Date
SG10201509978VA true SG10201509978VA (en) 2016-07-28

Family

ID=56130296

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201509978VA SG10201509978VA (en) 2014-12-19 2015-12-04 Wafer processing method

Country Status (6)

Country Link
US (1) US9490155B2 (en)
JP (1) JP2016119370A (en)
KR (1) KR20160075326A (en)
CN (1) CN105720008A (en)
SG (1) SG10201509978VA (en)
TW (1) TWI662611B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11668864B2 (en) 2016-12-22 2023-06-06 Analog Devices, Inc. Thin optical filter arrays
KR102434021B1 (en) * 2017-11-13 2022-08-24 삼성전자주식회사 Method of debonding a carrier substrate from a device substrate, apparatus for performing the same, and method of singulating semiconductor chips including the same
JP7075242B2 (en) * 2018-02-28 2022-05-25 株式会社ディスコ Processing method of work piece
JP7083572B2 (en) * 2018-04-09 2022-06-13 株式会社ディスコ Wafer processing method
JP7157861B1 (en) 2021-10-15 2022-10-20 リンテック株式会社 Semiconductor device manufacturing method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4796240B2 (en) * 2001-05-09 2011-10-19 株式会社ディスコ Semiconductor wafer grinding method
JP2004160493A (en) 2002-11-13 2004-06-10 Disco Abrasive Syst Ltd Laser machining method
JP4494728B2 (en) * 2003-05-26 2010-06-30 株式会社ディスコ Non-metallic substrate division method
JP2005223282A (en) 2004-02-09 2005-08-18 Disco Abrasive Syst Ltd Method for dividing wafer
JP2009123835A (en) * 2007-11-13 2009-06-04 Disco Abrasive Syst Ltd Method of manufacturing semiconductor device
JP5595716B2 (en) * 2009-11-18 2014-09-24 株式会社ディスコ Processing method of optical device wafer
US9064686B2 (en) * 2010-04-15 2015-06-23 Suss Microtec Lithography, Gmbh Method and apparatus for temporary bonding of ultra thin wafers
JP2012074659A (en) * 2010-09-30 2012-04-12 Disco Abrasive Syst Ltd Grinding method
KR101751046B1 (en) * 2011-02-01 2017-06-26 삼성전자 주식회사 Wafer dicing press and its semiconductor wafer dicing system
JP5988601B2 (en) 2012-02-13 2016-09-07 株式会社ディスコ Method for dividing optical device wafer
JP2014017462A (en) * 2012-03-02 2014-01-30 Fujifilm Corp Semiconductor device manufacturing method
JP6026222B2 (en) * 2012-10-23 2016-11-16 株式会社ディスコ Wafer processing method

Also Published As

Publication number Publication date
CN105720008A (en) 2016-06-29
KR20160075326A (en) 2016-06-29
JP2016119370A (en) 2016-06-30
TW201624557A (en) 2016-07-01
TWI662611B (en) 2019-06-11
US9490155B2 (en) 2016-11-08
US20160181141A1 (en) 2016-06-23

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