SG10201509978VA - Wafer processing method - Google Patents
Wafer processing methodInfo
- Publication number
- SG10201509978VA SG10201509978VA SG10201509978VA SG10201509978VA SG10201509978VA SG 10201509978V A SG10201509978V A SG 10201509978VA SG 10201509978V A SG10201509978V A SG 10201509978VA SG 10201509978V A SG10201509978V A SG 10201509978VA SG 10201509978V A SG10201509978V A SG 10201509978VA
- Authority
- SG
- Singapore
- Prior art keywords
- processing method
- wafer processing
- wafer
- processing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Dicing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014257621A JP2016119370A (en) | 2014-12-19 | 2014-12-19 | Wafer processing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201509978VA true SG10201509978VA (en) | 2016-07-28 |
Family
ID=56130296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201509978VA SG10201509978VA (en) | 2014-12-19 | 2015-12-04 | Wafer processing method |
Country Status (6)
Country | Link |
---|---|
US (1) | US9490155B2 (en) |
JP (1) | JP2016119370A (en) |
KR (1) | KR20160075326A (en) |
CN (1) | CN105720008A (en) |
SG (1) | SG10201509978VA (en) |
TW (1) | TWI662611B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11668864B2 (en) | 2016-12-22 | 2023-06-06 | Analog Devices, Inc. | Thin optical filter arrays |
KR102434021B1 (en) * | 2017-11-13 | 2022-08-24 | 삼성전자주식회사 | Method of debonding a carrier substrate from a device substrate, apparatus for performing the same, and method of singulating semiconductor chips including the same |
JP7075242B2 (en) * | 2018-02-28 | 2022-05-25 | 株式会社ディスコ | Processing method of work piece |
JP7083572B2 (en) * | 2018-04-09 | 2022-06-13 | 株式会社ディスコ | Wafer processing method |
JP7157861B1 (en) | 2021-10-15 | 2022-10-20 | リンテック株式会社 | Semiconductor device manufacturing method |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4796240B2 (en) * | 2001-05-09 | 2011-10-19 | 株式会社ディスコ | Semiconductor wafer grinding method |
JP2004160493A (en) | 2002-11-13 | 2004-06-10 | Disco Abrasive Syst Ltd | Laser machining method |
JP4494728B2 (en) * | 2003-05-26 | 2010-06-30 | 株式会社ディスコ | Non-metallic substrate division method |
JP2005223282A (en) | 2004-02-09 | 2005-08-18 | Disco Abrasive Syst Ltd | Method for dividing wafer |
JP2009123835A (en) * | 2007-11-13 | 2009-06-04 | Disco Abrasive Syst Ltd | Method of manufacturing semiconductor device |
JP5595716B2 (en) * | 2009-11-18 | 2014-09-24 | 株式会社ディスコ | Processing method of optical device wafer |
US9064686B2 (en) * | 2010-04-15 | 2015-06-23 | Suss Microtec Lithography, Gmbh | Method and apparatus for temporary bonding of ultra thin wafers |
JP2012074659A (en) * | 2010-09-30 | 2012-04-12 | Disco Abrasive Syst Ltd | Grinding method |
KR101751046B1 (en) * | 2011-02-01 | 2017-06-26 | 삼성전자 주식회사 | Wafer dicing press and its semiconductor wafer dicing system |
JP5988601B2 (en) | 2012-02-13 | 2016-09-07 | 株式会社ディスコ | Method for dividing optical device wafer |
JP2014017462A (en) * | 2012-03-02 | 2014-01-30 | Fujifilm Corp | Semiconductor device manufacturing method |
JP6026222B2 (en) * | 2012-10-23 | 2016-11-16 | 株式会社ディスコ | Wafer processing method |
-
2014
- 2014-12-19 JP JP2014257621A patent/JP2016119370A/en active Pending
-
2015
- 2015-11-10 TW TW104137001A patent/TWI662611B/en active
- 2015-12-04 SG SG10201509978VA patent/SG10201509978VA/en unknown
- 2015-12-11 KR KR1020150176673A patent/KR20160075326A/en not_active Application Discontinuation
- 2015-12-14 US US14/967,985 patent/US9490155B2/en active Active
- 2015-12-18 CN CN201510957302.2A patent/CN105720008A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
TWI662611B (en) | 2019-06-11 |
JP2016119370A (en) | 2016-06-30 |
CN105720008A (en) | 2016-06-29 |
TW201624557A (en) | 2016-07-01 |
KR20160075326A (en) | 2016-06-29 |
US20160181141A1 (en) | 2016-06-23 |
US9490155B2 (en) | 2016-11-08 |
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