SG10201610623YA - Wafer processing method - Google Patents
Wafer processing methodInfo
- Publication number
- SG10201610623YA SG10201610623YA SG10201610623YA SG10201610623YA SG10201610623YA SG 10201610623Y A SG10201610623Y A SG 10201610623YA SG 10201610623Y A SG10201610623Y A SG 10201610623YA SG 10201610623Y A SG10201610623Y A SG 10201610623YA SG 10201610623Y A SG10201610623Y A SG 10201610623YA
- Authority
- SG
- Singapore
- Prior art keywords
- processing method
- wafer processing
- wafer
- processing
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015251359A JP6607639B2 (en) | 2015-12-24 | 2015-12-24 | Wafer processing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201610623YA true SG10201610623YA (en) | 2017-07-28 |
Family
ID=59010755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201610623YA SG10201610623YA (en) | 2015-12-24 | 2016-12-19 | Wafer processing method |
Country Status (7)
Country | Link |
---|---|
US (1) | US9779994B2 (en) |
JP (1) | JP6607639B2 (en) |
KR (1) | KR102510828B1 (en) |
CN (1) | CN106920775B (en) |
DE (1) | DE102016226180A1 (en) |
SG (1) | SG10201610623YA (en) |
TW (1) | TWI702642B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6812079B2 (en) * | 2017-03-13 | 2021-01-13 | 株式会社ディスコ | Processing method of work piece |
JP2019046923A (en) * | 2017-08-31 | 2019-03-22 | 株式会社ディスコ | Wafer processing method |
JP6979312B2 (en) * | 2017-09-08 | 2021-12-08 | 株式会社ディスコ | How to set the alignment pattern |
JP7064887B2 (en) * | 2018-01-12 | 2022-05-11 | 株式会社ディスコ | Processing equipment management method and processing equipment |
CN114340846B (en) * | 2019-09-27 | 2022-11-29 | 株式会社东京精密 | Cutting device and method |
JP7313253B2 (en) | 2019-10-10 | 2023-07-24 | 株式会社ディスコ | Wafer processing method |
JP7382833B2 (en) | 2020-01-06 | 2023-11-17 | 株式会社ディスコ | processing equipment |
JP7463037B2 (en) * | 2020-08-26 | 2024-04-08 | 株式会社ディスコ | Testing board and testing method |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06224296A (en) * | 1993-01-27 | 1994-08-12 | Sumitomo Electric Ind Ltd | Method and apparatus for dicing semiconductor wafer |
JP3280747B2 (en) * | 1993-05-11 | 2002-05-13 | 株式会社東京精密 | Dicing processing management method and processing quality management system |
JPH09270446A (en) * | 1996-03-29 | 1997-10-14 | Toshiba Corp | Semiconductor device inspection apparatus |
JPH10189443A (en) * | 1996-11-07 | 1998-07-21 | Nikon Corp | Mark for position detection, method and apparatus for detection of mark, and exposure device |
JP4377702B2 (en) * | 2004-01-08 | 2009-12-02 | 株式会社ディスコ | Cutting groove measurement method |
JP4753170B2 (en) * | 2004-03-05 | 2011-08-24 | 三洋電機株式会社 | Semiconductor device and manufacturing method thereof |
JP5134412B2 (en) * | 2008-03-28 | 2013-01-30 | 株式会社ディスコ | Chipping detection method |
JP2009278029A (en) * | 2008-05-19 | 2009-11-26 | Tokyo Seimitsu Co Ltd | Dicing apparatus |
JP2010137309A (en) * | 2008-12-10 | 2010-06-24 | Disco Abrasive Syst Ltd | Cutting method for cutting device at start of operation |
JP5602548B2 (en) * | 2010-09-01 | 2014-10-08 | 株式会社ディスコ | Machining position detection method |
JP2012151225A (en) * | 2011-01-18 | 2012-08-09 | Disco Abrasive Syst Ltd | Method for measuring cut groove |
JP5904721B2 (en) * | 2011-06-10 | 2016-04-20 | 株式会社ディスコ | Line detection method |
JP6108806B2 (en) * | 2012-12-10 | 2017-04-05 | 株式会社ディスコ | Processing equipment |
JP6215730B2 (en) * | 2014-02-26 | 2017-10-18 | 株式会社ディスコ | Wafer center detection method in processing equipment |
JP6228044B2 (en) * | 2014-03-10 | 2017-11-08 | 株式会社ディスコ | Processing method of plate |
JP6328513B2 (en) * | 2014-07-28 | 2018-05-23 | 株式会社ディスコ | Wafer processing method |
JP6465722B2 (en) * | 2015-04-06 | 2019-02-06 | 株式会社ディスコ | Processing equipment |
-
2015
- 2015-12-24 JP JP2015251359A patent/JP6607639B2/en active Active
-
2016
- 2016-11-10 TW TW105136685A patent/TWI702642B/en active
- 2016-12-05 KR KR1020160164454A patent/KR102510828B1/en active IP Right Grant
- 2016-12-16 CN CN201611166077.1A patent/CN106920775B/en active Active
- 2016-12-19 SG SG10201610623YA patent/SG10201610623YA/en unknown
- 2016-12-22 US US15/388,062 patent/US9779994B2/en active Active
- 2016-12-23 DE DE102016226180.0A patent/DE102016226180A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
JP6607639B2 (en) | 2019-11-20 |
TWI702642B (en) | 2020-08-21 |
DE102016226180A1 (en) | 2017-06-29 |
US20170186646A1 (en) | 2017-06-29 |
CN106920775B (en) | 2021-02-19 |
US9779994B2 (en) | 2017-10-03 |
JP2017117924A (en) | 2017-06-29 |
KR102510828B1 (en) | 2023-03-15 |
KR20170076554A (en) | 2017-07-04 |
TW201732909A (en) | 2017-09-16 |
CN106920775A (en) | 2017-07-04 |
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