JP6979312B2 - How to set the alignment pattern - Google Patents

Description

The present invention relates to an alignment pattern setting method for setting an alignment pattern used when detecting a machining position when dividing a wafer.

In wafers such as disc-shaped semiconductor wafers and optical device wafers whose base materials are silicon, sapphire, gallium, etc., devices are formed in a plurality of regions partitioned by grid-like division schedule lines on the surface. The wafer is divided into individual devices along a planned division line by a processing device such as a laser processing device or a cutting device (see, for example, Patent Document 1).

The processing apparatus shown in Patent Document 1 and the like performs image processing such as pattern matching on a preset alignment pattern and an image of an image of a wafer to be processed when the above-mentioned wafer is divided by full-automatic processing. Then, the alignment for aligning the processing means with respect to the wafer is performed, and the calf check for determining whether or not the processing position processed by the processing means is appropriate is performed.

Japanese Unexamined Patent Publication No. 2014-203386

The wafer to be processed by the processing apparatus shown in Patent Document 1 and the like has an alignment pattern formed for each device in order to carry out the above-mentioned alignment and calf check, and is mistakenly recognized as another part. It is preferred that the alignment pattern contains characteristic parts that are not found in other parts in order to avoid being damaged.

The present invention has been made in view of the above problems, and an object of the present invention is to provide an alignment pattern setting method capable of suppressing a decrease in alignment accuracy even if the alignment pattern does not include a characteristic portion. To provide.

In order to solve the above-mentioned problems and achieve the object, the alignment pattern setting method of the present invention divides a waiha in which a device is formed in a grid pattern by a plurality of streets on the surface along the streets. At that time, it is a method of setting an alignment pattern for detecting the position of the street, that is, an imaging step of capturing an image including the intersection of the street, and an operation screen of an apparatus in which the image including the intersection is displayed. the Street and a designation step of designating at least two or more areas including the boundary between the devices, and the overall view creation step of creating a general view that includes all of the specified area, specified among該全body diagram of the a mask forming an the outside of the region as a mask, a setting step of setting an overall view as an alignment pattern including a respective region and the mask the specified, and one of the regions of the alignment pattern, and the street It is characterized by having a storage step for memorizing the distance of.
In the method of setting the alignment pattern, image processing is performed on the image obtained by imaging the wafer and the image of the region of the alignment pattern, and the position of the street is determined based on the result of the image processing. May be done.
In the method of setting the alignment pattern, in the overall drawing creation step, the entire area surrounded by the maximum and minimum coordinates of the X-axis direction and Y-axis direction coordinates of the region specified in the designated step is entirely. It may be created as a figure.

In the method of setting the alignment pattern, the designated step may designate a position avoiding the parts or machining marks formed on the street as the region.

In the method of setting the alignment pattern, the designation step may designate the region by tracing the operation screen of the device on which the image including the intersection is displayed.

The method for setting an alignment pattern according to the present invention has an effect that a decrease in alignment accuracy can be suppressed even if the alignment pattern does not include a characteristic portion.

FIG. 1 is a perspective view showing a configuration example of a laser processing apparatus in which the alignment pattern setting method according to the first embodiment is implemented. FIG. 2 is a perspective view of a wafer to be processed by the laser processing apparatus shown in FIG. FIG. 3 is a flowchart showing the flow of the alignment pattern setting method according to the first embodiment. FIG. 4 is a diagram showing an example of an image obtained in the imaging step of the alignment pattern setting method shown in FIG. FIG. 5 is a diagram showing an example in which the designation step of the alignment pattern setting method shown in FIG. 3 is performed on the image shown in FIG. FIG. 6 is an enlarged view showing a main part of the image shown in FIG. FIG. 7 is a diagram showing an example in which an overall diagram creation step of the alignment pattern setting method shown in FIG. 3 is carried out on the image shown in FIG. FIG. 8 is a diagram showing an example in which a mask step of the alignment pattern setting method shown in FIG. 3 is performed on the image shown in FIG. 7. FIG. 9 is a diagram showing an example of the distance between the alignment pattern and the street stored in the storage step of the alignment pattern setting method. FIG. 10 is a diagram showing an example of an image of a designation step of the alignment pattern setting method according to the second embodiment. FIG. 11 is a diagram showing an example of an image after performing the designating step of the alignment pattern setting method according to the second embodiment. FIG. 12 is a diagram showing an example of an image obtained in the imaging step of the alignment pattern setting method according to the third embodiment. FIG. 13 is a diagram showing an example in which a designated step is performed on an image obtained in the imaging step of the alignment pattern setting method according to the third embodiment.

An embodiment (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions or changes of the configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
The method of setting the alignment pattern according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of a laser processing apparatus in which the alignment pattern setting method according to the first embodiment is implemented. FIG. 2 is a perspective view of a wafer to be processed by the laser processing apparatus shown in FIG.

The method for setting an alignment pattern according to the first embodiment is a method carried out when a processing apparatus used in a semiconductor manufacturing process or the like divides a wafer 100 shown in FIGS. 1 and 2. The processing device is the laser processing device 1 shown in FIG. 1 that divides the wafer 100 by laser processing, or a cutting device that cuts and divides the wafer 100.

The wafer 100 is a disk-shaped semiconductor wafer or optical device wafer whose base material is silicon, sapphire, gallium, or the like. As shown in FIG. 2, the wafer 100 has a device 103 formed on the surface 101 by a plurality of streets 102 in a grid pattern. Further, the wafer 100 forms a TEG (Test Element Group) 104, which is a component, on the street 102. The TEG 104 is made of metal or the like, and is a test pattern for finding problems in the design and manufacturing of the device 103. The TEG 104 is located at a predetermined position on the street 102 of the wafer 100.

Further, in the first embodiment, the positions where the TEG 104s are arranged differ between the streets 102, but in the present invention, the wafer 100 may include a plurality of streets 102 in which the positions where the TEG 104s are arranged are the same. Note that FIG. 2 shows the TEG 104 arranged on some streets 102, and omits the TEG 104 arranged on other streets 102. Further, in the first embodiment, the wafer 100 forms a component TEG104 on the street 102, but in the present invention, the wafer 100 is not limited to the TEG104, and a dummy pattern for CMP (Chemical Mechanical Polishing) is formed as a component. May be. The CMP dummy pattern is formed on the street 102 in order to uniformly scrape the wafer 100 during CMP polishing and suppress the variation in thickness, and is composed of a metal, an oxide film, a resin, or the like. Further, in the first embodiment, the wafer 100 is integrated with the annular frame 111 by attaching the adhesive tape 110 to the back surface 105 on the back side of the front surface 101 and attaching the annular frame 111 to the outer periphery of the adhesive tape 110. It has become.

As shown in FIG. 1, the laser processing apparatus 1 as an example of the processing apparatus has a chuck table 10 that sucks and holds the weight 100 on the holding surface 11 and can rotate around the axis by a rotation drive source, and a chuck table 10. A laser beam irradiation unit 20 that irradiates the wafer 100 with a laser beam having a wavelength that the held waha 100 has absorbency, an X-axis moving unit (not shown) that moves the chuck table 10 in the X-axis direction, and a chuck table 10 in the Y-axis direction. It is provided with a Y-axis moving unit (not shown) to be moved to. Further, the laser processing apparatus 1 mounts a cassette 30 accommodating a wafer 100 before and after laser processing, and raises and lowers the cassette 30 in the Z-axis direction. The wafer 100 is placed between the cassette 30 and the chuck table 10. A transport unit (not shown), an image pickup unit 50 that captures an image of a wafer 100 held on a chuck table 10, and a control unit 60 that is a computer that controls each component are provided.

The laser beam irradiation unit 20 includes a processing head 21 that faces the wafer 100 held by the chuck table 10 and irradiates the laser beam. The image pickup unit 50 is attached to the processing head 21 of the laser beam irradiation unit 20. The image pickup unit 50 includes a CCD (Charge Coupled Device) image pickup element or the like for photographing the surface 101 of the wafer 100 held on the chuck table 10. The image pickup unit 50 outputs the image obtained by taking a picture to the control unit 60.

The control unit 60 controls each of the above-mentioned components of the laser machining apparatus 1 to cause the laser machining apparatus 1 to perform a machining operation on the wafer 100. The control unit 60 is a computer. The control unit 60 includes an arithmetic processing unit having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device. And have.

The arithmetic processing unit of the control unit 60 performs arithmetic processing according to a computer program stored in the storage device, and sends a control signal for controlling the laser processing apparatus 1 to the laser processing apparatus 1 via an input / output interface apparatus. Output to the above-mentioned components of. Further, the control unit 60 is connected to a display unit 70 that displays a state of machining operation, an image, and the like, and an input unit 80 that the operator uses when registering machining content information and the like.

The display unit 70 includes a display device such as a liquid crystal display, an organic electro-luminescence display, or an inorganic electro-luminescence display. The screen 71 of the display device is an operation screen. The display unit 70 displays characters, images, symbols, figures, and the like on the screen. Further, the display unit 70 displays an image obtained by the image pickup unit 50.

The input unit 80 includes a touch panel 81 superimposed on the screen 71 of the display device constituting the display unit 70, and an external input device (not shown) such as a keyboard. The touch panel 81 detects contact or proximity of a finger, a pen, a stylus pen, or the like. The touch panel 81 can detect a position on the touch panel 81 when a plurality of fingers, pens, stylus pens, or the like are in contact with or close to each other. In the following description, a position where a plurality of fingers, pens, stylus pens, etc. detected by the touch panel 81 are in contact with or close to each other is referred to as a “detection position”. The input unit 80 outputs the contact or proximity of a finger or the like to the control unit 60 together with the detection position.

The laser machining apparatus 1 irradiates the wafer 100 with a laser beam from the machining head 21 of the laser beam irradiation unit 20 to street 102 the chuck table 10 and the machining head 21 on the X-axis moving unit, the rotation drive source, and the Y-axis moving unit. The ablation process is performed while relatively moving along the street 102 to form a laser machined groove on the street 102. In the first embodiment, the wafer 100 in which the laser processing groove is formed on the street 102 by the laser processing device 1 is divided into individual devices 103 by being broken along the laser processing groove or the like.

Further, in the laser processing device 1, the control unit 60 outputs the image captured by the image pickup unit 50 to the display unit 70 and displays it on the display unit 70. The control unit 60 performs alignment for aligning the wafer 100 and the machining head 21 before the laser machining of the wafer 100, and the position of the laser machining groove actually formed on the street 102 during the laser machining of the wafer 100 and the position of the laser machining groove. A calf check is performed to determine whether the size of the chipping formed on both edges in the width direction of the laser machined groove is acceptable. When the laser processing device 1 performs alignment, the control unit 60 performs image processing such as pattern matching on the alignment pattern 200 stored in advance in the storage device and the image obtained by the image pickup unit 50.

Next, a method of setting the alignment pattern according to the first embodiment will be described. FIG. 3 is a flowchart showing the flow of the alignment pattern setting method according to the first embodiment. FIG. 4 is a diagram showing an example of an image obtained in the imaging step of the alignment pattern setting method shown in FIG. FIG. 5 is a diagram showing an example in which the designation step of the alignment pattern setting method shown in FIG. 3 is performed on the image shown in FIG. FIG. 6 is an enlarged view showing a main part of the image shown in FIG. FIG. 7 is a diagram showing an example in which an overall diagram creation step of the alignment pattern setting method shown in FIG. 3 is carried out on the image shown in FIG. FIG. 8 is a diagram showing an example in which a mask step of the alignment pattern setting method shown in FIG. 3 is performed on the image shown in FIG. 7. FIG. 9 is a diagram showing an example of the distance between the alignment pattern and the street stored in the storage step of the alignment pattern setting method.

In the alignment pattern setting method according to the first embodiment (hereinafter, simply referred to as a setting method), a laser machined groove is formed in the street 102 of the wafer 100, and the wafer 100 is divided into individual devices 103 along the street 102. This is a method of setting an alignment pattern 200 for detecting the position of the street 102. The alignment pattern 200 is image information used in pattern matching when the control unit 60 of the laser processing apparatus 1 detects a position (coordinate information) for processing a laser processing groove on a street 102 (that is, performs alignment). It is set by the setting method according to the first embodiment and stored in the storage device. In the first embodiment, the position (coordinate information) indicates the coordinates in the X-axis direction and the Y-axis direction from the preset reference position of the wafer 100.

As for the setting method, first, the operator places the cassette 30 containing the wafer 100 integrated with the annular frame 111 on the cassette elevator 40 of the laser processing apparatus 1, and the operator operates the input unit 80 to perform alignment. The position of the surface 101 of the wafer 100 to be imaged by the image pickup unit 50 is registered in the control unit 60. In the first embodiment, the position of the surface 101 of the wafer 100 to be imaged when performing the alignment is a position where the intersection 106 (shown in FIG. 2) where the streets 102 intersect with each other can be imaged. As shown in FIG. 3, the setting method includes an imaging step ST1, a designated step ST2, an overall drawing creation step ST3, a mask step ST4, a setting step ST5, and a storage step ST6.

The imaging step ST1 is a step of imaging an image 300 (shown in FIG. 4) including the intersection 106 of the street 102 of the wafer 100. In the imaging step ST1, when the operator operates the input unit 80 and inputs the setting start instruction of the alignment pattern 200, the control unit 60 causes the transport unit to take out one wafer 100 before laser machining from the cassette 30 and chuck it. The wafer 100 is placed on the holding surface 11 of the table 10 and the wafer 100 is sucked and held on the holding surface 11 of the chuck table 10.

Next, the control unit 60 moves the chuck table 10 toward the lower side of the processing head 21 of the laser beam irradiation unit 20 by the X-axis moving unit, and the chuck table 10 is below the image pickup unit 50 attached to the processing head 21. The position to be imaged at the time of performing the alignment of the wafer 100 held in the image pickup unit 50 is arranged, and the surface 101 of the wafer 100 is imaged by the image pickup unit 50. As shown in FIG. 4, the control unit 60 displays the image 300 including the intersection 106 of the street 102 of the surface 101 of the surface 101 of the wafer 100 obtained by the image pickup unit 50 on the screen 71 which is the operation screen of the display unit 70. do. Since the image 300 is an image obtained by being imaged by the image pickup unit 50, it is an image in which the intensity of light is shown at a predetermined gradation, that is, an image having shading. The setting method proceeds to the designated step ST2 when the image 300 is displayed on the screen 71 of the display unit 70.

In the designation step ST2, at least two or more areas 400 including a boundary between a street 102 and a device 103 different from each other in the screen 71 of the display unit 70, which is a device on which the image 300 including the intersection 106 is displayed, are designated. Is. In the embodiment, in the designated step ST2, the area including the boundary between the street 102 of the image 300 displayed on the screen 71 of the display unit 70 and each device 103 and surrounding the position avoiding the TEG 104 arranged on the street 102. The stylus pen 90 is brought into contact with the outer edge of the 400 and moved, and traced with the stylus pen 90.

In the designated step ST2, the control unit 60 detects the locus of the stylus pen 90 moving on the screen 71 from the detection position of the stylus pen 90 of the touch panel 81 of the input unit 80 as the position of the outer edge of the area 400, and stores the stylus pen 90 in the storage device. Remember. In the first embodiment, the stylus pen 90 is traced in the designated step ST2, but in the present invention, the stylus pen 90 is not limited to the stylus pen 90, and a finger or a pen may be used for tracing.

When the control unit 60 detects and stores the position of the outer edge of the area 400, the touch panel 81 of the input unit 80 detects the position of the stylus pen 90 in pixel units of the screen 71 of the display unit 70, and the touch panel. The pixel at the detection position of the stylus pen 90 of 81 is quantified as, for example, "1", and the pixel excluding the detection position is quantified as, for example, "0". The control unit 60 calculates the position of the outer edge of the region 400 from the position of the pixel quantified as described above, the position of the surface 101 of the wafer 100 imaged by the image pickup unit 50 when performing the registered alignment, and the like. And specify the area 400. Further, in the designated step ST2, the control unit 60 displays the designated area 400 on the screen 71 of the display unit 70, as shown in FIG. Further, in the first embodiment, four regions 400 are designated in the designation step ST2, but in the present invention, not only four but two or more regions 400 may be designated.

When the outer edge of the area 400 is interrupted as shown in FIG. 6, the control unit 60 connects the interrupted ends 401 and 402 with a line passing the shortest as shown by the dotted line in FIG. The position of the outer edge of 400 is calculated. In this way, in the designated step ST2, at least the position including the boundary between the street 102 of the image 300 displayed on the screen 71 of the display unit 70 and the device 103 and avoiding the TEG 104 arranged on the street 102 is set as the area 400. Specify two or more. Further, in the designation step ST2, the operator designates the area 400 by tracing the screen 71 on which the image 300 of the display unit 70 is displayed with the stylus pen 90. As for the setting method, when the operator operates the input unit 80 and inputs that the designation of the area 400 is completed, the process proceeds to the overall drawing creation step ST3.

The overall drawing creation step ST3 is a step of creating an overall drawing 500 including all of the areas 400 designated in the designated step ST2. In the overall drawing creation step ST3, the control unit 60 calculates the maximum coordinates and the minimum coordinates among the coordinates in the X-axis direction and the Y-axis direction of each of the designated regions 400. The control unit 60 calculates the maximum X-axis direction coordinate 501 among the plurality of maximum coordinates in the X-axis direction of all the regions 400 and the minimum X-axis direction coordinate 502 among the plurality of minimum coordinates. At the same time, the maximum Y-axis direction coordinate 503 among the plurality of maximum coordinates in the Y-axis direction of all the regions 400 and the minimum Y-axis direction coordinate 504 among the plurality of minimum coordinates are calculated.

The control unit 60 has a region surrounded by the maximum X-axis coordinate 501, the minimum X-axis coordinate 502, the maximum Y-axis coordinate 503, and the minimum Y-axis coordinate 504 as an overall view 500. create. In the overall diagram creation step ST3, the control unit 60 displays the overall diagram 500 on the screen 71 of the display unit 70, as shown in FIG. 7. As for the setting method, when the control unit 60 creates the overall view 500, the process proceeds to the mask step ST4.

The mask step ST4 is a step of masking a region other than the designated area 400 in the overall drawing 500. In the mask step ST4, the control unit 60 performs image processing to make the outside of all the areas 400 in the overall view 500 displayed on the display unit 70 black as shown by shading in FIG. 8, and performs the mask 510. Form. That is, in the mask step ST4, the control unit 60 forms the outside of all the regions 400 in the overall view 500 as the mask 510. In the present invention, in the mask step ST4, the control unit 60 performs image processing to make the outside of all the regions 400 in the overall view 500 displayed on the display unit 70 white to form the mask 510. Is also good. The setting method proceeds to the setting step ST5 when the control unit 60 forms the mask 510.

The setting step ST5 is a step of setting the overall view 500 on which the mask 510 is formed as the alignment pattern 200. In the setting step ST5, the control unit 60 sets an overall view 500 including each region 400 and the mask 510 indicated by the intensity of light of a predetermined gradation as the alignment pattern 200 and stores it in the storage device. As for the setting method, when the control unit 60 stores the alignment pattern 200, the process proceeds to the storage step ST6.

The storage step ST6 is a step of storing the distance 201 (shown in FIG. 9) between any region 400 of the alignment pattern 200 and the center 107 in the width direction of the street 102. In the storage step ST6, the present invention may store the distance between any area 400 and the end of the street 102, that is, store the distance between any area 400 and an arbitrary position of the street 102. Just do it. In the storage step ST6, the operator operates the input unit 80 to input the distance 201 between any one of the plurality of regions 400 of the alignment pattern 200 and the center 107 in the width direction of the street 102, and the control unit 60 sets the control unit 60. The input distance 201 is stored in the storage device, and as shown in FIG. 9, the center 107 of the street 102 is displayed on the screen 71 of the display unit 70. The setting method ends when the control unit 60 stores the distance 201.

As described above, the control unit 60 of the laser processing apparatus 1 in which the alignment pattern 200 is set sets the position of the surface 101 of the wafer 100 to be imaged at the time of performing the alignment registered in advance when the alignment is performed. To image. When performing alignment, the control unit 60 performs image processing such as pattern matching on the image obtained by the image pickup unit 50 and the image in the region 400 of the alignment pattern 200. The control unit 60 determines the position of the street 102 from the image or the like obtained by the image pickup unit 50 based on the result of the image processing.

The control unit 60 rotates the chuck table 10 around the axis so that one of the streets 102 orthogonal to each other is parallel to the X-axis direction, and is located at a position at a distance 201 stored in the storage step ST6 from the area 400. The wafer 100 and the processing head 21 of the laser beam irradiation unit 20 are aligned so that the laser beam is irradiated. Then, the control unit 60 rotates the wafer 100 around the axis by 90 degrees to the rotation drive source, and performs the alignment of the other of the streets 102 orthogonal to each other in the same manner as the one. Then, the control unit 60 relatively moves the processing head 21 of the laser beam irradiation unit 20 and the wafer 100 along the street 102 by the X-axis moving unit, the Y-axis moving unit, and the rotation drive source based on the processing conditions. To form a laser-machined groove on the street 102.

In the setting method according to the first embodiment, four areas 400 including boundaries between the street 102 and the device 103 different from each other are designated in the designation step ST2. For this purpose, the setting method includes the region 400 including the boundary between the plurality of streets 102 and the device 103 in the alignment pattern 200. As a result, the setting method makes it possible to perform alignment using a plurality of regions 400 including boundaries between the plurality of streets 102 and the device 103, so that the region 400, that is, the alignment pattern 200 does not include a characteristic portion. However, it is possible to prevent the alignment accuracy from being lowered.

Further, in the setting method according to the first embodiment, in the designated step ST2, the position avoiding the TEG 104 arranged on the street 102 is designated as the area 400, and in the mask step ST4, the outside of the area 400 in the overall drawing 500 is masked 510. Form to. Therefore, it is possible to prevent the alignment pattern 200 set by the setting method from including the TEG 104 arranged on the street 102. As a result, the setting method can suppress the alignment pattern 200 from including the TEG 104 that reflects light, so that the deterioration of the alignment accuracy can be suppressed.

Further, in the setting method according to the first embodiment, since the area 400 is specified by tracing the screen 71 of the display unit 70, the area 400 can be easily specified and the alignment pattern 200 can be easily set.

[Embodiment 2]
The method of setting the alignment pattern according to the second embodiment of the present invention will be described with reference to the drawings. FIG. 10 is a diagram showing an example of an image of a designation step of the alignment pattern setting method according to the second embodiment. FIG. 11 is a diagram showing an example of an image after performing the designating step of the alignment pattern setting method according to the second embodiment. In FIGS. 10 and 11, the same parts as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

The alignment pattern setting method according to the second embodiment (hereinafter, simply referred to as a setting method) is the same as the setting method of the first embodiment except that the designated step ST2 is different from the first embodiment.

In the designation step ST2 of the setting method according to the second embodiment, as shown in FIG. 10, the control unit 60 displays the designated area 600 in the displayed image 300 on the screen 71 of the display unit 70, and from the input unit 80. The designated area 600 is moved on the image 300 according to the operation of the operator of. When the operation of the operator who determines the position of the designated area 600 is input from the input unit 80, the control unit 60 designates the determined designated area 600 as the above-mentioned area 400 in the same manner as in the first embodiment, as shown in FIG. (Calculate and memorize the position of the outer edge). In the second embodiment, the planar shape of the designated area 600 is rectangular, and only each corner portion 601 of the designated area 600 is displayed on the image 300. However, in the present invention, the shape and display method of the designated area 600 are different. , Not limited to those shown in Embodiment 2.

In the setting method according to the second embodiment, four areas 400 including boundaries between the street 102 and the device 103 different from each other are designated in the designation step ST2. For this purpose, the setting method includes a plurality of regions 400 including boundaries between the plurality of streets 102 and the device 103 in the alignment pattern 200, and the region 400, that is, the alignment pattern 200 is a characteristic portion as in the first embodiment. Even if the above is not included, it is possible to suppress the deterioration of the alignment accuracy.

[Embodiment 3]
The method of setting the alignment pattern according to the third embodiment of the present invention will be described with reference to the drawings. FIG. 12 is a diagram showing an example of an image obtained in the imaging step of the alignment pattern setting method according to the third embodiment. FIG. 13 is a diagram showing an example in which a designated step is performed on an image obtained in the imaging step of the alignment pattern setting method according to the third embodiment. In FIGS. 12 and 13, the same parts as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

The method for setting the alignment pattern according to the third embodiment (hereinafter, simply referred to as a setting method) is different from that, as shown in FIG. 12, laser grooving marks, which are processing marks, are arranged on each street 102 of the wafer 100. It is the same as the setting method of the first embodiment. The laser grooving mark 108 is used to prevent the low-dielectric-constant insulating film from peeling off due to cutting when a low-dielectric-constant insulating film (Low-k film) is formed on the surface 101 of the wafer 100. , Formed at both ends of each street 102 in the width direction. The laser grooving mark 108 is a so-called laser processing groove formed in parallel with the street 102 by ablation processing using a laser beam at both ends of each street 102 in the width direction. The low dielectric constant insulator film is composed of an inorganic film such as SiOF or BSG (SiOB) and an organic film which is a polymer film such as polyimide or parylene.

In step ST2 of designating the setting method according to the third embodiment, the operator includes the boundary between the street 102 of the image 300 displayed on the screen 71 of the display unit 70 and each device 103, and the TEG 104 and the laser grooving arranged on the street 102. The control unit 60 calculates the position of the outer edge of the area 400 by tracing the outer edge of the area 400 surrounding the position avoiding the mark 108 with the stylus pen 90, and designates the area 400. Further, in the designated step ST2, as shown in FIG. 13, the control unit 60 displays the area 400 designated on the screen 71 of the display unit 70. As described above, in the designation step ST2 of the setting method according to the third embodiment, the position avoiding the TEG 104 and the laser grooving mark 108 is designated as the region 400, but in the present invention, the TEG 104 is not arranged on the street 102 and the laser is used. When only the grooving mark 108 is arranged, it is desirable to designate a position avoiding the laser grooving mark 108 as the region 400 in the designation step ST2. That is, in the designated step ST2, the present invention designates a position avoiding at least one of the parts such as the TEG 104 and the dummy pattern for CMP and the laser grooving mark 108 which is a processing mark as the region 400.

In the setting method according to the third embodiment, four areas 400 including boundaries between the street 102 and the device 103 different from each other are designated in the designation step ST2. Therefore, as in the first embodiment, the setting method can suppress the deterioration of the alignment accuracy even if the region 400, that is, the alignment pattern 200 does not include a characteristic portion.

Further, in the setting method according to the third embodiment, in the designation step ST2, a position avoiding the TEG 104 and the laser grooving mark 108 arranged on the street 102 is designated as the region 400. As a result, the setting method can suppress the alignment pattern 200 from including the TEG 104 and the laser grooving mark 108 that reflect light, so that the deterioration of the alignment accuracy can be suppressed.

The present invention is not limited to the above embodiment. That is, it can be variously modified and carried out within a range that does not deviate from the gist of the present invention. In the above-mentioned first and second embodiments, the laser machining apparatus 1 is described as an example of the machining apparatus, but the method for setting the alignment pattern of the present invention may be used for the cutting apparatus.

70 Display unit (device)
71 screen (operation screen)
100 Wafer 101 Surface 102 Street 103 Device 104 TEG (Parts)
106 Intersection 107 Center 200 Alignment pattern 201 Distance 300 Image 400 Area 500 Overall view ST1 Imaging step ST2 Designated step ST3 Overall drawing creation step ST4 Mask step ST5 Setting step ST6 Storage step

Claims (5)

It is a method of setting an alignment pattern for detecting the position of a street when a wafer having a device formed of a device partitioned by a grid of a plurality of streets on the surface is divided along the street.
An imaging step for capturing an image including the intersection of the streets,
A designated step for designating at least two or more areas including the boundary between the street and the device in the operation screen of the device on which the image including the intersection is displayed.
An overall view creation step that creates an overall view that includes all of the specified area,
A mask forming an outer specified were region of該全body diagram as a mask,
A setting step for setting an overall view including the designated areas and the mask as an alignment pattern, and
A storage step of storing a one of said regions of the alignment pattern, the distance between the street,
A method of setting an alignment pattern, which is characterized by having. The alignment according to claim 1, wherein the image obtained by imaging the wafer and the image of the region of the alignment pattern are subjected to image processing, and the position of the street is determined based on the result of the image processing. How to set the pattern. The overall drawing creation step is characterized in that an area surrounded by the maximum and minimum coordinates of the X-axis direction and Y-axis direction coordinates of the area specified in the designated step is created as an overall view. The method for setting an alignment pattern according to claim 1. The method for setting an alignment pattern according to claim 1, claim 2 or 3 , wherein the designation step designates a position avoiding a part or a machining mark formed on the street as the region. The designation step, claim 1, wherein specifying the region by tracing the operation screen of the device on which an image is displayed including the crossing portion,請Motomeko 2, to claim 3 or claim 4 How to set the alignment pattern described.

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