TW201913844A - Alignment pattern setting method - Google Patents

Abstract

The present invention provides a configuration method of alignment pattern, which can suppress a decrease in alignment accuracy even if the alignment pattern does not include a feature portion. The configuration method of alignment pattern of the present invention includes: a photographing step for photographing the image of the intersection including scribe lines of the wafer; an assigning step for designating more than two areas containing boundaries between scribe lines and the dissimilar devices in the operation screen of including the image of the intersection; an overall picture producing step for producing the overall picture including all the assigned areas; a shielding step for shielding the areas other than the designated areas in the overall picture; a configuration step for configuring the overall picture after shielding as the alignment pattern; and a storing step for storing the distance between the alignment pattern and the center in the width direction of the scribe line.

Description

Setting method of alignment pattern

FIELD OF THE INVENTION The present invention relates to a method for setting an alignment pattern, which is used to set an alignment pattern used when detecting a processing position when dividing a wafer.

BACKGROUND OF THE INVENTION Wafers such as silicon wafers, sapphire, gallium, and other wafer-like semiconductor wafers and optical device wafers are formed in a plurality of regions defined by a predetermined grid-like division line on the front side. Device. A wafer is a device that is divided into individual devices along a predetermined dividing line by a processing device such as a laser processing device or a dicing device (for example, refer to Patent Document 1).

In the processing apparatus shown in Patent Document 1 and the like, when the aforementioned wafer is divided by full-automatic processing, pattern matching is performed with a preset alignment pattern and an image of the wafer on which the processing target is captured. ), Etc., perform alignment of the position integration of the processing mechanism for the wafer, and perform a kerf check to determine whether the processing position processed by the processing mechanism is appropriate. Prior Art Literature Patent Literature

Patent Document 1: Japanese Patent Laid-Open No. 2014-203836

SUMMARY OF THE INVENTION Problems to be Solved by the Invention In order to perform the above-mentioned alignment and notch inspection, a wafer of a processing target shown in the processing apparatus shown in Patent Document 1 and the like has an alignment pattern formed on each device, and in order to avoid being mistaken for For other parts, it is preferable that the alignment pattern includes feature parts which are not present in other parts.

The present invention has been made in view of this problem, and an object thereof is to provide a method for setting an alignment pattern, which can suppress a decrease in alignment accuracy even if the alignment pattern does not include a characteristic portion. Means to solve the problem

In order to solve the above-mentioned problems and achieve the object, the method of setting the alignment pattern of the present invention is to form a wafer on the front surface of a device divided into a grid pattern by a plurality of scribe lines, and divide the wafer along the scribe lines using the scribe lines. A method of setting an alignment pattern to detect the position of the cutting path, the method of setting the alignment pattern is characterized by comprising: a photographing step of capturing an image of an intersection including the cutting path; In the operation screen of the image device, specify at least two or more designation steps that include the boundary between the scribe line and the device; create the overall drawing including the entire drawing of all the specified areas; in the overall drawing , The masking step of covering the area outside the designated area; the setting step of setting the entire figure to be masked as an alignment pattern; and the distance between any region storing the alignment pattern and the center of the width direction of the cutting path Of storage steps.

In the aforementioned setting method of the alignment pattern, the designation step may also designate a position avoiding a member or a processing mark formed on the cutting path as the region.

In the aforementioned setting method of the alignment pattern, the designation step may also designate the area by drawing an operation screen of a device displaying an image including the intersection portion. Invention effect

Even if the alignment pattern does not include a characteristic portion, the method for setting the alignment pattern of the present invention can have an effect of suppressing a decrease in alignment accuracy.

Aspects for Implementing the Invention The aspects (embodiments) for implementing the invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the constituent elements described below include those which can be easily conceived by persons having ordinary knowledge in the technical field to which they belong or are substantially the same. In addition, the structures described below can be appropriately combined. Moreover, various structures can be omitted, replaced, or changed without departing from the gist of the present invention.

[Embodiment 1] A method of setting an alignment pattern according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of a laser processing apparatus for performing an alignment pattern setting method according to the first embodiment. FIG. 2 is a perspective view of a wafer to be processed by the laser processing apparatus shown in FIG. 1.

The method of setting the alignment pattern in the first embodiment is a method performed when a processing device used in a semiconductor process or the like divides the wafer 100 shown in FIGS. 1 and 2. The processing device is a laser processing device 1 shown in FIG. 1 that divides the wafer 100 by laser processing, or a dicing device that cuts the wafer 100 for division.

The wafer 100 is a disk-shaped semiconductor wafer and an optical device wafer using silicon, sapphire, gallium or the like as a base material. As shown in FIG. 2, a wafer 100 is formed on the front side 101 with a plurality of devices 103 divided into a grid pattern by a plurality of scribe lines 102. In addition, a component, ie, a TEG (Test Element Group) 104 is formed on the scribe line 102 of the wafer 100. The TEG 104 is formed of a metal or the like, and is a test pattern for discovering problems in the design and manufacturing of the device 103. The TEG 104 is arranged at a predetermined predetermined position of the scribe line 102 of the wafer 100.

In the first embodiment, although the arrangement position of the TEG 104 is different from each of the scribe lines 102, the wafer 100 of the present invention may be provided with a plurality of scribe lines 102 that are the same as the arrangement position of the TEG 104. In addition, FIG. 2 shows the TEG 104 disposed on a part of the cutting track 102, and the TEG 104 disposed on the other cutting track 102 is omitted. In the first embodiment, although the wafer 100 is a member formed on the scribe line 102, that is, TEG104, the present invention is not limited to the TEG104, and a dummy (CMP) for CMP (Chemical Mechanical Polishing) dummy) pattern as a component. In the CMP virtual pattern, a pattern is formed on the scribe line 102 in order to grind the wafer 100 uniformly to suppress uneven thickness during CMP polishing, and the pattern is made of metal, oxide film, resin, or the like. Further, in Embodiment 1, the wafer 100 is bonded to the ring shape by attaching the adhesive tape 110 to the back surface 105 on the back side of the front surface 101, and attaching the ring frame 111 to the outer periphery of the adhesive tape 110. The frame 111 is integrated.

As shown in FIG. 1, a laser processing apparatus 1 as an example of a processing apparatus includes a work clamp table 10 that sucks and holds a wafer 100 by a holding surface 11 and is rotatable about an axis by a rotary driving source; The laser light irradiating unit 20 irradiates the laser light having a wavelength of absorptivity to the wafer 100 held on the work clamp table 10; the X-axis moving unit (not shown) makes the work clamp table 10 moves in the X-axis direction; and a Y-axis moving unit (not shown) moves the work clamp table 10 in the Y-axis direction. In addition, the laser processing apparatus 1 includes a cassette lifting portion 40 that mounts a cassette 30 that stores wafers 100 before and after laser processing, and raises and lowers the cassette 30 in the Z-axis direction; and a cassette 30 and a work clamp. A transfer unit (not shown) for transferring the wafer 100 between the tables 10; a photographing unit 50 for photographing the wafer 100 held on the work clamp table 10; and a computer that controls each constituent element, that is, a control unit 60.

The laser light irradiation unit 20 includes a processing head 21 that faces the wafer 100 held on the work table 10 and irradiates laser light. The imaging unit 50 is mounted on the processing head 21 of the laser light irradiation unit 20. The imaging unit 50 includes a CCD (Charge Coupled Device) imaging element or the like that images the front side 101 of the wafer 100 held on the work table 10. The shooting unit 50 outputs the captured image to the control unit 60.

The control unit 60 is a unit that individually controls the above-mentioned constituent elements of the laser processing apparatus 1 and causes the laser processing apparatus 1 to perform a processing operation on the wafer 100. The control unit 60 is a computer. The control unit 60 includes an arithmetic processing device, a storage device, and an input-output interface device. The arithmetic processing device has a microprocessor such as a CPU (central processing unit, central processing unit). The storage device includes a ROM (read only memory, only Read memory) or RAM (random access memory, random access memory) memory.

The arithmetic processing device of the control unit 60 performs arithmetic processing according to a computer program stored in a storage device, and outputs a control signal for controlling the laser processing device 1 to the laser processing device 1 through the input / output interface device. Requirements. The control unit 60 is connected to a display unit 70 and an input unit 80. The display unit 70 displays a state or image of a processing operation, and the input unit 80 is used when an operator registers processing content information and the like.

The display unit 70 includes display devices such as a liquid crystal display, an organic EL display (organic electro-luminescence display), or an inorganic EL display (Inorganic electro-luminescence display). The screen 71 of the display device is an operation screen. The display unit 70 displays characters, images, symbols, graphics, and the like on the screen. In addition, the display unit 70 displays an image obtained by the imaging unit 50.

The input unit 80 includes a touch panel 81 superimposed on a screen 71 of a display device constituting the display unit 70, and an external input device (not shown) such as a keyboard. The touch panel 81 detects contact or proximity of a finger, a pen, or a stylus. The touch panel 81 can detect positions on the touch panel 81 when a plurality of fingers, pens, or styluses are in contact or approached. In the following description, the positions when a plurality of fingers, pens, stylus pens, and the like detected by the touch panel 81 are in contact or approached are referred to as "detection positions". The input unit 80 outputs a contact or proximity and detection position of a finger or the like to the control unit 60.

The laser processing apparatus 1 irradiates laser light on the wafer 100 from the processing head 21 of the laser light irradiation unit 20, and uses the X-axis moving unit, the rotation driving source, and the Y-axis moving unit to make the work clamp table 10 and The processing head 21 relatively moves along the cutting path 102 and performs ablation processing to form a laser processing groove on the cutting path 102. In Embodiment 1, the wafer 100 in which a laser processing groove is formed on the dicing path 102 by the laser processing device 1 is cut along the laser processing groove, and the like is divided into individual devices 103. .

In the laser processing device 1, the control unit 60 outputs an image obtained by the imaging unit 50 to the display unit 70 and displays the image on the display unit 70. Before laser processing of the wafer 100, the control unit 60 performs alignment of the wafer 100 and the processing head 21, and performs a notch inspection during the laser processing of the wafer 100. The aforementioned notch inspection is used to determine Whether the positions of the laser processing grooves actually formed on the cutting track 102 and the sizes of the fragments formed on both sides of the laser processing grooves in the width direction are allowed. When the laser processing device 1 performs the alignment, the control unit 60 causes the control unit 60 to perform image processing such as pattern matching on an image obtained by photographing the alignment pattern 200 and the imaging unit 50 stored in the storage device in advance.

Next, a method of setting the alignment pattern in the first embodiment will be described. 3 is a flowchart showing a flow of a method of setting an alignment pattern in the first embodiment. FIG. 4 is a diagram showing an example of an image obtained in a photographing step of the setting method of the alignment pattern shown in FIG. 3. FIG. 5 is a diagram showing an example of designation steps for implementing the setting method of the alignment pattern shown in FIG. 3 in the image shown in FIG. 4. FIG. 6 is an enlarged view of a main part of the image shown in FIG. 5. FIG. 7 is a diagram showing an example of a whole drawing creation process for implementing the method of setting the alignment pattern shown in FIG. 3 in the image shown in FIG. 5. FIG. 8 is a diagram showing an example of a masking step for implementing the method of setting the alignment pattern shown in FIG. 3 in the image shown in FIG. 7. FIG. 9 is a diagram showing an example of the distance between the alignment pattern and the scribe line, etc., stored in the storing step of the alignment pattern setting method.

The alignment pattern setting method (hereinafter, simply referred to as a setting method) of Embodiment 1 is to form a laser processing groove on the scribe line 102 of the wafer 100, and divide the wafer 100 into individual pieces along the scribe line 102. In the case of the device 103, the method of setting the alignment pattern 200 for detecting the position of the dicing track 102 is set. The alignment pattern 200 is an image of pattern matching used when the control unit 60 of the laser processing apparatus 1 detects the position (coordinate information) of the laser processing groove on the cutting path 102 (that is, performs alignment). The information is set by the setting method of the first embodiment and stored in the storage device. In the first embodiment, the position (coordinate information) shows the coordinates in the X-axis direction and the Y-axis direction from a predetermined reference position of the wafer 100.

The setting method is that the operator first puts the cassette 30 containing the wafer 100 integrated with the ring frame 111 on the cassette lifting portion 40 of the laser processing apparatus 1, and then the operator operates the input unit 80, and The position of the front side 101 of the wafer 100 photographed by the imaging unit 50 when the alignment is performed is registered in the control unit 60. Furthermore, in Embodiment 1, the position of the front side 101 of the wafer 100 photographed when the alignment is performed is a position where the intersection 106 (shown in FIG. 2) where each of the scribe lines 102 intersect can be photographed. As shown in FIG. 3, the setting method includes a photographing step ST1, a designation step ST2, a whole map creation step ST3, a masking step ST4, a setting step ST5, and a storing step ST6.

The photographing step ST1 is a step of photographing an image 300 (shown in FIG. 4) including the intersection 106 of the scribe lines 102 of the wafer 100. In the shooting step ST1, when the operator operates the input unit 80 and inputs the setting start instruction of the alignment pattern 200, the control unit 60 takes out one wafer 100 before laser processing from the cassette 30 in the transport unit, and The wafer 100 is placed on the holding surface 11 of the work table 10, and the wafer 100 is attracted and held on the holding surface 11 of the work table 10.

Next, the control unit 60 moves the work clamp table 10 toward the processing head 21 of the laser light irradiation unit 20 by the X-axis moving unit, and arranges the work clamp table 10 on the imaging unit 50 mounted on the processing head 21. The photographing unit 50 photographs the front side 101 of the wafer 100 at a position where the photographing is performed when the wafer 100 held on the work clamp table 10 is aligned downward. As shown in FIG. 4, the control unit 60 displays an image 300 on the operation screen of the display unit 70, that is, on the screen 71. The image 300 includes the cutting path 102 of the front surface 101 of the wafer 100 obtained by the imaging unit 50. Intersection section 106. Furthermore, since the image 300 is an image captured by the imaging unit 50, the image with light intensity displayed in a predetermined gray scale, that is, an image with light and shade. The setting method is that when the image 300 is displayed on the screen 71 of the display unit 70, the process proceeds to a designation step ST2.

The designation step ST2 is a step of designating at least two or more regions 400 in the device 71 displaying the image 300 including the intersection 106, that is, the screen 71 of the display unit 70. The region 400 includes the cutting path 102 and the alien device 103. Boundary line. In the embodiment, in the designation step ST2, the operator touches the stylus pen 90 on the image 300 displayed on the screen 71 of the display unit 70, moves the stylus pen 90 on the outer edge of the area 400, and draws with the stylus pen 90. The aforementioned area 400 includes a boundary between the dicing track 102 and each device 103 and surrounds a position that avoids the TEG 104 disposed on the dicing track 102.

In the designation step ST2, the control unit 60 detects the trajectory of the stylus pen 90 on the screen 71 from the detection position of the stylus pen 90 of the touch panel 81 of the input unit 80 as the position of the outer edge of the area 400 And stored on a storage device. In the first embodiment, the stylus 90 is used for drawing in the designation step ST2. However, the present invention is not limited to the stylus 90, and may be drawn with a finger or a pen.

Furthermore, when the control unit 60 detects and stores the position of the outer edge of the area 400, the touch panel 81 of the input unit 80 detects the position of the touch pen 90 in pixel units of the screen 71 of the display unit 70, and The pixel at the detection position of the touch pen 90 of the touch panel 81 is digitized, for example, is "1", and the pixels at the positions other than the detection position are digitized, for example, "0". The control unit 60 calculates the position of the outer edge of the area 400 from the position of the aforementioned numerical pixel and the position of the front side 101 of the wafer 100 photographed by the imaging unit 50 when performing the registration after registration, and designates it as Area 400. In the designation step ST2, as shown in FIG. 5, the control unit 60 displays the designated area 400 on the screen 71 of the display unit 70. In the first embodiment, although four areas 400 are specified in the designation step ST2, the present invention is not limited to four, as long as two or more areas 400 are specified.

Furthermore, if the outer edge of the area 400 is disconnected as shown in FIG. 6, as shown by the dotted line in FIG. 6, the control unit 60 connects the disconnected ends 401 and 402 with the shortest line, The position of the outer edge of the area 400 is calculated. In this way, in the designation step ST2, the operator designates a region including the cut line 102 and the device 103 of the image 300 displayed on the screen 71 of the display unit 70 and avoids the position of the TEG 104 disposed on the cut line 102, and designates it as an area. 400, and specify at least two areas 400. In the designation step ST2, the operator designates the area 400 by drawing the screen 71 of the image 300 on which the display unit 70 is displayed with the stylus 90. The setting method is that when the operator operates the input unit 80 and the designation of the input area 400 has ended, the process proceeds to the whole map creation step ST3.

The whole map creation step ST3 is a step of creating a whole map 500 including all the areas 400 specified by the designation step ST2. In the whole map creation step ST3, the control unit 60 calculates the largest coordinate and the smallest coordinate among the respective coordinates of the X-axis direction and the Y-axis direction of each designated area 400. The control unit 60 calculates a maximum X-axis direction coordinate 501 of the plurality of maximum coordinates in the X-axis direction of all the regions 400 and a minimum X-axis direction coordinate 502 of the plurality of minimum coordinates, and calculates Y for all the regions 400 The largest Y-axis direction coordinate 503 of the plurality of largest coordinates in the axial direction, and the smallest Y-axis direction coordinate 504 of the plurality of smallest coordinates.

The control unit 60 prepares an area surrounded by the maximum X-axis direction coordinate 501, the minimum X-axis direction coordinate 502, the maximum Y-axis direction coordinate 503, and the minimum Y-axis direction coordinate 504 into an overall map 500. In the whole map creation step ST3, as shown in FIG. 7, the control unit 60 displays the whole map 500 on the screen 71 of the display unit 70. The setting method is that when the control unit 60 creates the whole map 500, the process proceeds to the masking step ST4.

The masking step ST4 is a step of masking the area other than the designated area 400 in the overall view 500. In the masking step ST4, the control unit 60 displays the outside of all the regions 400 in the entire map 500 of the display unit 70, as shown in the grid of FIG. 8, and performs blackened image processing to form a mask 510. . That is, in the masking step ST4, the control unit 60 forms the outer side of all the regions 400 in the overall view 500 as a mask 510. Furthermore, in the masking step ST4 of the present invention, the control unit 60 may perform whitening image processing on the outside of all the regions 400 in the entire map 500 of the display unit 70 to form a mask 510. The setting method is that when the control unit 60 forms the mask 510, the process proceeds to a setting step ST5.

The setting step ST5 is a step of setting the entire map 500 on which the mask 510 is formed as the alignment pattern 200. In the setting step ST5, the control unit 60 sets the entire map 500 including the area 400 and the mask 510 displayed with the intensity of light of a predetermined gray scale as the alignment pattern 200, and stores it in the storage device. The setting method is that when the control unit 60 stores the alignment pattern 200, the process proceeds to the storing step ST6.

The storing step ST6 is a step of storing a distance 201 (as shown in FIG. 9) between any area 400 of the alignment pattern 200 and the center 107 in the width direction of the cutting track 102. Furthermore, in the storage step ST6 of the present invention, the distance between any area 400 and the end of the cutting track 102 can also be stored. In short, the distance between any area 400 and any position of the cutting track 102 can be stored. distance. In the storing step ST6, the operator operates the input unit 80 and inputs the distance 201 between any one of the plurality of regions 400 of the alignment pattern 200 and the center 107 in the width direction of the cutting path 102, and the control unit 60 inputs The distance 201 is stored in the storage device, and as shown in FIG. 9, the center 107 of the cutting track 102 is displayed on the screen 71 of the display unit 70. The setting method is ended when the control unit 60 stores the distance 201.

As described above, the control unit 60 of the laser processing apparatus 1 with the alignment pattern 200 set causes the imaging unit 50 to take an image of the pre-registered imaging performed on the front side 101 of the wafer 100 when the alignment is performed. position. When the control unit 60 performs the alignment, the image obtained by the imaging unit 50 and the image of the area 400 of the alignment pattern 200 are subjected to image processing such as pattern matching. The control unit 60 calculates the position of the cutting track 102 based on the result of the image processing, from an image obtained by the imaging unit 50 and the like.

The control unit 60 rotates the work table 10 about the axis, makes one of the mutually orthogonal cutting paths 102 parallel to the X-axis direction, and causes the wafer 100 and the processing head 21 of the laser light irradiation unit 20 to perform The laser beam is aligned so that the laser light is irradiated from the area 400 to the position of the distance 201 stored in the storing step ST6. Then, the control unit 60 causes the rotary driving source to rotate the wafer 100 by 90 degrees around the axis, and performs alignment of the other of the mutually orthogonal dicing tracks 102 in the same manner as one of them. Then, the control unit 60 relatively moves the processing head 21 and the wafer 100 of the laser light irradiation unit 20 along the dicing path 102 by using the X-axis moving unit, the Y-axis moving unit, and the rotation driving source according to the processing conditions. A laser processing groove is formed on the cutting track 102.

In the setting method of the first embodiment, in the designation step ST2, four areas 400 including a boundary line between the scribe line 102 and the dissimilar device 103 are designated. Therefore, the setting method includes the area 400 including the boundary between the plurality of scribe lines 102 and the device 103 in the alignment pattern 200. As a result, since the setting method can use a plurality of regions 400 including a boundary between a plurality of scribe lines 102 and the device 103 for alignment, even if the region 400, that is, the alignment pattern 200 does not include a feature portion, alignment can be suppressed. Reduced quasi-precision.

Further, in the setting method of the first embodiment, in the designation step ST2, a position 400 that avoids the TEG 104 disposed on the cutting path 102 is designated as the area 400, and in the covering step ST4, the outside of the area 400 of the entire figure 500 is formed As a mask 510. Therefore, the alignment pattern 200 set by the setting method can be suppressed from including the TEG 104 arranged on the cutting track 102. As a result, since the setting method can suppress the alignment pattern 200 from including the TEG 104 of the reflected light, it is possible to suppress a decrease in alignment accuracy.

In the setting method of the first embodiment, the area 400 is specified by the screen 71 of the drawing display unit 70, so the area 400 can be easily specified, and the alignment pattern 200 can be easily set.

[Embodiment 2] A method for setting an alignment pattern according to Embodiment 2 of the present invention will be described with reference to the drawings. FIG. 10 is a diagram showing an example of an image showing a designation step of a method of setting an alignment pattern according to the second embodiment. FIG. 11 is a diagram showing an example of an image after the designation step of the alignment pattern setting method according to the second embodiment is performed. In addition, FIG. 10 and FIG. 11 are attached with the same code | symbol as the same part as Embodiment 1, and description is abbreviate | omitted.

The setting method of the alignment pattern in the second embodiment (hereinafter, simply referred to as a setting method) is the same as the setting method in the first embodiment except that the designation step ST2 is different from the first embodiment.

In the designation step ST2 of the setting method of the second embodiment, as shown in FIG. 10, the control unit 60 displays the designated area 600 in the image 300 displayed on the screen 71 of the display unit 70, and according to the operator from the input unit 80 Operation while moving the designated area 600 on the image 300. When the operator inputs an operation for determining the position of the designated area 600 from the input unit 80, as shown in FIG. 11, the control unit 60 designates the designated area 600 after the determination as the above-mentioned area 400 (calculated outside the calculation area) as in the first embodiment. Location of the edge and store). Furthermore, in the second embodiment, although the planar shape of the designated area 600 is rectangular, and only the corner portions 601 of the designated area 600 are displayed on the image 300, in the present invention, the shape and display method of the designated area 600 are not the same. It is not limited to the one shown in Embodiment 2.

In the setting method of the second embodiment, in the designation step ST2, four areas 400 including the boundary between the scribe line 102 and the dissimilar device 103 are designated. Therefore, the setting method is to include the plurality of regions 400 including the boundary between the plurality of scribe lines 102 and the device 103 in the alignment pattern 200. In the same manner as in Embodiment 1, even if the region 400 is the alignment pattern 200, No feature portion is included, and a reduction in alignment accuracy can be suppressed.

[Embodiment 3] A method of setting an alignment pattern according to Embodiment 3 of the present invention will be described with reference to the drawings. FIG. 12 is a diagram showing an example of an image obtained in a photographing step in a method of setting an alignment pattern in Embodiment 3. FIG. FIG. 13 is a diagram showing an example of the image obtained in the photographing step of the alignment pattern setting method in the third embodiment after the designation step is performed. In addition, in FIG.12 and FIG.13, the same code | symbol is attached | subjected to the same part as Embodiment 1, and description is abbreviate | omitted.

As shown in FIG. 12, the alignment pattern setting method (hereinafter, simply referred to as a setting method) of the third embodiment, except that laser grooving, which is a processing mark, is disposed on each scribe line 102 of the wafer 100 Other than the marks, the setting method is the same as that of the first embodiment. When a low-dielectric-value insulator film (Low-k film) is formed on the front surface 101 of the wafer 100, in order to suppress peeling of the low-dielectric-value insulator film due to dicing, etc., the width direction of each scribe line 102 is reduced. Laser notches 108 are formed at both ends of the laser. Laser notches 108 are so-called laser-processed grooves that are parallel to the cutting track 102 by performing ablation processing using laser light rays at both ends in the width direction of each cutting track 102. In addition, the low dielectric insulator film is made of an inorganic film such as SiOF or BSG (SiOB), a polymer film such as polyimide or parylene, That is, it is constituted by an organic-based film.

In the designation step ST2 of the setting method of the third embodiment, the operator draws the outer edge of the area 400 with the stylus 90, and the control unit 60 calculates the position of the outer edge of the area 400 and designates it as the area 400. The aforementioned area 400 is The position is as follows: the boundary between the scribe line 102 and each device 103 of the image 300 displayed on the screen 71 of the display unit 70 is surrounded by the TEG 104 and the laser scoring 108 arranged on the scribe line 102 to avoid it. In the designation step ST2, as shown in FIG. 13, the control unit 60 displays the designated area 400 on the screen 71 of the display unit 70. In this way, although in the designation step ST2 of the setting method of the third embodiment, the position avoiding the TEG104 and the laser notch 108 is designated as the area 400, the present invention does not arrange the TEG104 on the cutting path 102, but only In the case where the laser notches 108 are arranged, in the designation step ST2, it is desirable to designate a position avoiding the laser notches 108 as the area 400. That is, in the designation step ST2, in the present invention, the position of at least one of the member that avoids the TEG 104 or the dummy pattern for CMP, and the laser scoring 108 of the processing mark is designated as the area 400.

In the setting method of the third embodiment, in the designation step ST2, four areas 400 including the boundary between the scribe line 102 and the dissimilar device 103 are designated. Therefore, the setting method is the same as that of the first embodiment, and even if the feature pattern is not included in the alignment pattern 200 in the region 400, a reduction in alignment accuracy can be suppressed.

Further, in the setting method of the third embodiment, in the designation step ST2, a position avoiding the TEG 104 and the laser notch 108 arranged on the cutting path 102 is designated as the area 400. As a result, the setting method can suppress the alignment pattern 200 from including the TEG 104 and the laser scoring 108 of the reflected light, so that the reduction in the alignment accuracy can be suppressed.

The present invention is not limited to the embodiments described above. That is, various modifications can be made without departing from the gist of the present invention. Furthermore, in the foregoing first and second embodiments, the laser processing apparatus 1 is disclosed as an example of the processing apparatus, but the method for setting the alignment pattern of the present invention can also be used in a cutting apparatus.

1‧‧‧laser processing device

10‧‧‧Work clamp

11‧‧‧ keep face

100‧‧‧ wafer

101‧‧‧ Positive

102‧‧‧cut road

103‧‧‧device

104‧‧‧TEG (component)

105‧‧‧ back

106‧‧‧Intersection

107‧‧‧ Center

108‧‧‧Laser Notch

110‧‧‧adhesive tape

111‧‧‧ Ring Frame

20‧‧‧laser light irradiation unit

21‧‧‧Processing head

200‧‧‧ alignment pattern

201‧‧‧ Distance

30‧‧‧ box

300‧‧‧ images

40‧‧‧Box Lifter

400‧‧‧ area

401, 402‧‧‧ both ends

50‧‧‧ shooting unit

500‧‧‧ Whole picture

501‧‧‧Max X-axis coordinate

502‧‧‧Minimum X-axis coordinate

503‧‧‧maximum Y-axis coordinate

504‧‧‧Minimal Y-axis coordinate

510‧‧‧Mask

60‧‧‧Control unit

600‧‧‧ Designated area

601‧‧‧ Corner

70‧‧‧display unit (device)

71‧‧‧ screen (operation screen)

80‧‧‧ input unit

81‧‧‧Touch Panel

90‧‧‧ Stylus

X, Y, Z‧‧‧ directions

ST1‧‧‧Photographing steps

ST2‧‧‧Specification steps

ST3‧‧‧ Whole picture making steps

ST4‧‧‧ Covering steps

ST5‧‧‧Setting steps

ST6‧‧‧Storage steps

FIG. 1 is a perspective view showing a configuration example of a laser processing apparatus for performing a method of setting an alignment pattern according to the first embodiment. FIG. 2 is a perspective view of a wafer to be processed by the laser processing apparatus shown in FIG. 1. 3 is a flowchart showing a flow of a method of setting an alignment pattern in the first embodiment. FIG. 4 is a diagram showing an example of an image obtained in a photographing step of the setting method of the alignment pattern shown in FIG. 3. FIG. 5 is a diagram showing an example of a designation step in which the method shown in FIG. 3 is performed on the image shown in FIG. 4. FIG. 6 is a diagram showing an enlarged main part of the image shown in FIG. 5. FIG. 7 is a diagram showing an example of a whole drawing creation process in which the image shown in FIG. 5 is subjected to the method of setting the alignment pattern shown in FIG. 3. FIG. 8 is a diagram showing an example of a masking step in which the method shown in FIG. 3 is performed on the image shown in FIG. 7. FIG. 9 is a diagram showing an example of the distance between the alignment pattern and the scribe line, etc., stored in the storing step of the alignment pattern setting method. FIG. 10 is a diagram showing an example of an image showing a designation step of a method of setting an alignment pattern according to the second embodiment. FIG. 11 is a diagram showing an example of an image after the designation step of the alignment pattern setting method according to the second embodiment is performed. FIG. 12 is a diagram showing an example of an image obtained in a photographing step of a method of setting an alignment pattern in Embodiment 3. FIG. FIG. 13 is a diagram showing an example of an image obtained in a photographing step of a method of setting an alignment pattern according to the third embodiment after the designation step is performed.

Claims (3)

A method for setting an alignment pattern is to form a wafer on the front surface of which is divided into a grid by a plurality of scribe lines. When dividing along the scribe line, it is used to detect the position of the scribe line. The quasi-pattern setting method is characterized by having: a photographing step of capturing an image of an intersection including the cutting path; and a designation step of specifying at least two of the operation screens of the device including the image of the intersection. The above area includes the boundary between the scribe line and the device; the whole picture making step produces an entire picture including all the designated areas; the masking step, in the whole picture, covers the designated area outside the designated area; the setting step, the The entire covered image is set as an alignment pattern; and a storing step of storing a distance between any area of the alignment pattern and the cutting path. For example, the method for setting the alignment pattern of claim 1, wherein the designation step is to designate the area that avoids a member or a processing mark formed on the scribe line as a region. For example, the method for setting the alignment pattern of item 1 or 2, wherein the designation step is to designate the area by drawing an operation screen of a device displaying an image including the intersection.