JP2020053477A - Processing device - Google Patents

Abstract

To provide a processing device capable of efficiently setting a light amount of a light irradiation unit.SOLUTION: A processing device includes an image of a wafer imaged by an imaging unit, an operation touch panel that displays at least one of a plurality of operation buttons for driving a control unit, and the control unit images a reference pattern to be imaged of the wafer a plurality of times under light amount conditions 84A1 to 84A4 in which the light amounts of a light irradiation units are different, acquires a plurality of light amount comparison images 84B1 to 84B4, and displays the light amount comparison images 84B1 to 84B4 in a light amount comparison image display area 84 of a light amount adjustment screen.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a processing apparatus provided with a light irradiation unit that irradiates a workpiece.

  Conventionally, a chuck table that holds a workpiece such as a semiconductor wafer, and a processing unit that performs cutting or laser processing on the workpiece held by the chuck table along a predetermined dividing line, and Processing devices are known. This type of processing apparatus includes a light irradiation unit that irradiates light to a workpiece held on a chuck table, an imaging unit that captures an image of the workpiece irradiated by the light irradiation unit, and an image that is captured by the imaging unit. An operation touch panel that displays the image of the workpiece and various operation buttons is provided.The operator can perform various operations such as alignment adjustment between the line to be divided of the workpiece and the processing unit and kerf check of the processing groove. At the time of execution, it is necessary to adjust the light irradiation unit while looking at a captured image of the workpiece displayed on the operation touch panel (for example, see Patent Document 1).

JP 2008-4885 A

  By the way, usually, the light irradiation unit of the processing apparatus includes two types of light sources: an epi-illumination that illuminates the upper surface (surface) of the workpiece from a vertical direction and an oblique light that illuminates the upper surface (surface) of the workpiece from an oblique direction. The workpiece is imaged by the imaging unit in a state where it is irradiated from two directions. In this case, the operation touch panel is provided with a plurality of operation buttons capable of adjusting the amounts of incident light and oblique light, for example, incident light + 5% and + 1%. The operator increases / decreases the ratio of incident light and oblique light for each imaging (working) target using the operation button, and sets the optimal balance of light amount while visually checking the captured image of the workpiece.

  However, since the optimal light intensity balance between the incident light and oblique light in the light irradiation unit differs depending on the work target described above, when the work target is changed, the operator clicks the operation button many times to change the work target before the change. It is necessary to adjust the light amount balance from the setting of the light amount balance to the optimum light amount balance for the work object after the change, and the light amount setting is complicated.

  The present invention has been made in view of the above, and an object of the present invention is to provide a processing apparatus capable of efficiently setting the light amount of a light irradiation unit.

  In order to solve the above-described problems and achieve the object, a processing apparatus according to the present invention includes a processing unit that processes a workpiece held on a chuck table, and a processing unit that is irradiated by a light irradiation unit. At least one of an imaging unit for imaging, a control unit for controlling various units of the processing apparatus, an image of the workpiece imaged by the imaging unit, and a plurality of operation buttons for driving the control unit is displayed. An operation touch panel for performing the operation. When the control unit detects that an operator has touched the operation button related to the light irradiation unit on the operation touch panel, the control unit detects that the light irradiation unit has a different light amount. A plurality of light amount comparison images are obtained by imaging a workpiece a plurality of times, and the light amount comparison images are displayed on the operation touch panel. .

  According to this configuration, the control unit obtains a plurality of light amount comparison images by imaging the workpiece a plurality of times in a state where the light irradiation units have different light amounts, and displays the light amount comparison images on the operation touch panel. Therefore, the operator can select an image having the best visibility from a plurality of light quantity comparison image selection candidates, and can easily adjust the light quantity of the light irradiation unit that has captured the image. For this reason, the light amount setting of the light irradiation unit can be executed efficiently.

  In this configuration, the light amount comparison image is the operation button, and the control unit is the same as any light amount comparison image touched by the operator among the plurality of light amount comparison images displayed on the operation touch panel. The light irradiation unit may be adjusted to the amount of light. According to this configuration, since the light amount of the light irradiation unit is adjusted to the same light amount as the image selected and touched by the operator, the light amount setting of the light irradiation unit can be executed efficiently.

  According to the present invention, the control unit acquires the plurality of light amount comparison images by imaging the workpiece a plurality of times in a state where the light irradiation units have different light amounts, and displays the light amount comparison images on the operation touch panel. Therefore, the operator can select an image having the best visibility from a plurality of light quantity comparison image selection candidates, and can easily adjust the light quantity of the light irradiation unit that has captured the image. For this reason, the light amount setting of the light irradiation unit can be executed efficiently.

FIG. 1 is an external perspective view illustrating a configuration example of a processing apparatus according to the present embodiment. FIG. 2 is a plan view illustrating a configuration example of a workpiece to be processed by the processing apparatus. FIG. 3 is a schematic sectional view illustrating a configuration example of the imaging unit. FIG. 4 is a schematic block diagram illustrating a configuration example of a control unit. FIG. 5 is a diagram illustrating an example of a display mode of the operation touch panel in the light amount adjustment mode. FIG. 6 is a diagram showing the light amount comparison image display area of FIG. FIG. 7 is a diagram for explaining an operation procedure when setting the light amount.

  An embodiment (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Further, the configurations described below can be appropriately combined. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the spirit of the present invention.

  FIG. 1 is an external perspective view illustrating a configuration example of a processing apparatus according to the present embodiment. FIG. 2 is a plan view illustrating a configuration example of a workpiece to be processed by the processing apparatus. FIG. 3 is a schematic sectional view illustrating a configuration example of the imaging unit. The processing apparatus 1 of the present embodiment cuts a wafer 200 as a workpiece along a line to be divided. As a basic configuration, a chuck table 10 for holding the wafer 200, a processing unit 20, an imaging unit 30, an X-axis moving unit 40, a Y-axis moving unit 50, a Z-axis moving unit 60, a control unit 70, and an operation touch panel 80.

  First, as shown in FIG. 2, the wafer 200 is a substantially disk-shaped semiconductor wafer or optical device wafer having a substrate 201 made of silicon, sapphire, gallium, or the like. In the wafer 200, devices 205 such as ICs and LSIs are formed in a region partitioned in a lattice by a plurality of planned dividing lines 204 formed on the surface 203 of the substrate 201. Further, the wafer 200 includes a device region 206 in which these devices 205 are formed, and an outer peripheral surplus region 207 surrounding the device region 206 and in which no device 205 is formed. Each device 205 is provided with, for example, a reference pattern 208 that is used as a reference when adjusting the alignment between the wafer 200 and the processing unit 20. The position where the reference pattern 208 is provided is not limited to each device 205 in the device area 206, but may be provided on the planned dividing line 204 or the outer peripheral surplus area 207.

  In the present embodiment, the wafer 200 has the front surface 203 side facing upward, the adhesive tape 210 is attached to the back surface, and the annular frame 211 is attached to the outer periphery of the adhesive tape 210, so that the annular frame 211 is attached. It is united with.

  As shown in FIG. 1, the chuck table 10 has a holding surface 11 formed of, for example, porous ceramic or the like and holding a wafer 200. The chuck table 10 is connected to a vacuum suction source (not shown), and sucks and holds the wafer 200 by being sucked by the vacuum suction source. The chuck table 10 is rotatably provided by a rotation drive source 12 about an axis parallel to the Z-axis direction. Further, the chuck table 10 is provided so as to be movable in the X-axis direction that is horizontal to the holding surface 11 by an X-axis moving unit 40 having a well-known configuration including a ball screw 41, a nut, a pulse motor 42, and the like. Is moved in the X-axis direction relative to the processing unit 20 and the imaging unit 30.

  The processing unit 20 cuts the wafer 200 held on the chuck table 10 along a line 204 to be divided by a rotating ring-shaped ultra-thin cutting blade 21. The cutting blade 21 is mounted on a spindle rotatably accommodated in a spindle housing 22, and the spindle housing 22 is supported by a Z-axis moving unit 60. The rotation axes of the cutting blade 21 and the spindle of the processing unit 20 are set parallel to the Y-axis direction. The processing unit 20 is provided to be relatively movable in the Y-axis direction with respect to a wafer 200 held on the chuck table 10 by a Y-axis moving unit 50 including a ball screw 51, a nut, a pulse motor 52, and the like, and , A ball screw, a nut, a pulse motor 61, and the like, so as to be movable in the Z-axis direction by a Z-axis moving unit 60. The chucking table 10 is cut and fed by the X-axis moving unit 40 in the X-axis direction while the processing unit 20 is indexed and fed in the Y-axis direction by the Y-axis moving unit 50 and cut and sent to the Z-axis moving unit 60. Thereby, the wafer 200 is cut.

  The imaging unit 30 is fixed to the spindle housing 22 of the processing unit 20 so as to move integrally with the processing unit 20. The imaging unit 30 is an electron microscope for photographing the surface of the wafer 200 held on the chuck table 10, and is used for operations such as alignment and kerf check. As shown in FIG. 3, the imaging unit 30 includes a light irradiation unit 31, an optical system 32, and a CCD (Charge Coupled Device) imaging device 33 which is a camera for imaging the surface of the wafer 200 held on the chuck table 10. Have.

  The light irradiation unit 31 is composed of, for example, a halogen light source or an LED, and includes an epi-illumination 31A and an oblique illumination 31B whose light amount is adjusted by the control unit 70. The epi-illumination 31A emits light toward the optical system 32. The optical system 32 is disposed above the case 32A and the case 32A, and specularly reflects light emitted from the epi-illumination 31A toward the wafer 200 held on the chuck table 10 in parallel with the Z-axis direction (FIG. 1). And a condenser lens 32C provided inside the case 32A and disposed below the half mirror 32B. The epi-illumination 31A irradiates the wafer 200 with light (incident light) 34 parallel to the Z-axis direction via the half mirror 32B and the condenser lens 32C.

  The oblique illumination 31B is provided on the outer periphery of the lower end of the case 32A. The oblique illumination 31B includes a plurality of light emitting elements 31C arranged at intervals in the circumferential direction around the condenser lens 32C, and irradiates the wafer 200 with light (oblique light) 36 intersecting with the Z-axis direction.

  The CCD imaging device 33 is provided above the half mirror 32B. The CCD image pickup device 33 receives the light reflected by the wafer 200 and passed through the condenser lens 32C and the half mirror 32B, and outputs an image obtained to the control unit 70. The control unit 70 illuminates the wafer 200 by combining one or both of the epi-illumination 31A and the oblique illumination 31B. When the epi-illumination 31A and the oblique illumination 31B are used in combination, the control unit 70 adjusts the light amounts of the epi-illumination 31A and the oblique illumination 31B, respectively.

  The operation touch panel 80 is disposed at a position that is easy to see and operate on the housing of the processing apparatus 1, and is controlled by the control unit 70 and is not only a captured image captured by the imaging unit 30 but also associated with processing. It has a touch panel configuration that also serves as a display panel that displays various necessary information and that displays operation buttons (operation keys) for performing input operations necessary for processing and the like.

  Next, the control unit 70 included in the processing apparatus 1 of the present embodiment will be described. FIG. 4 is a schematic block diagram illustrating a configuration example of a control unit. The control unit 70 is mainly configured by a microprocessor 71 that includes an arithmetic processing unit including a CPU or the like, a ROM, a RAM, and the like and controls the entire processing apparatus 1. The processing unit 20, the imaging unit 30, the X-axis movement unit 40, the Y-axis movement unit 50, and the Z-axis movement unit 60, which are the respective components of the processing apparatus 1, are connected to the microprocessor 71. Operations such as a processing operation and a movement operation are controlled.

  Further, the microprocessor 71 reads out display information necessary for the operation touch panel 80 from the storage unit 72 or the panel display screen storage unit 73 and controls the display contents via the display control unit 74. The input information operated by the instruction is analyzed to execute operation control, display control, and the like of each unit. The above-described panel display screen storage unit 73 stores display screen information in which display patterns such as operation buttons according to various modes (operation mode, setting mode, and the like) in the processing apparatus 1 are set.

  Further, the microprocessor 71 controls the image pickup operation of the image pickup unit 30 at the time of work such as alignment and kerf check, and also controls processing of image information picked up by the image pickup unit 30. As processing control of this image information, control is performed such that the image information captured by the imaging unit 30 is stored in the storage unit 72 as it is, or data obtained by performing image processing of the image information in the image processing unit 75 is stored in the storage unit 72. Do. Further, the microprocessor 71 executes control for adjusting the balance between the epi-illumination 31A and the oblique illumination 31B in the light irradiation unit 31 and the light amount. In the present embodiment, when the operator touches an operation button (for example, a light amount setting button) related to the light irradiation unit 31 on the operation touch panel 80, the mode shifts to the light amount adjustment mode. When the mode is shifted to the light amount adjustment mode in a state where the wafer 200 (for example, the reference pattern 208) is positioned below the imaging unit 30, the microprocessor 71 sets the light amount of the epi-illumination 31A and the oblique illumination 31B to a plurality of predetermined light amount conditions. And the imaging of the wafer 200 (for example, the reference pattern 208) is sequentially executed under the light amount adjusted to each condition. A plurality of light amount conditions for the light irradiation unit 31 have default values stored in the light amount setting storage unit 76, but can be independently changed (overwritten) by an operation of an operator. The light amount setting storage unit 76 stores a default light amount of the light irradiation unit 31 for each operation such as alignment or kerf check.

  The processing apparatus 1 having such a configuration allows the chuck table 10 to be moved to the processing unit 20 by the X-axis moving unit 40 while the cutting blade 21 rotated at a high speed is cut into the wafer 200 at a predetermined cutting depth. By relatively processing in the direction, the planned dividing line 204 on the wafer 200 can be cut to form a cut groove. Then, after forming cutting grooves for all the planned dividing lines 204 in the same direction, the wafer 200 is rotated by 90 degrees by the rotation of the chuck table 10, and processing is performed for all the planned dividing lines 204 newly arranged in the X-axis direction. By repeating the same cutting process in the unit 20, the device 20 can be divided into individual devices 205.

  Incidentally, the light irradiation unit 31 is configured to be able to adjust the light amount balance between the epi-illumination 31A and the oblique illumination 31B as described above. The following various operations are required when this kind of light amount balance adjustment is required.

(1) Alignment When using the processing apparatus 1 to automatically cut a plurality of wafers 200 having the same device 205 along the planned dividing line 204, the processing apparatus 1 first determines the position of the planned dividing line 204. sign up. This operation is called alignment, and specifically includes an operation of registering a reference pattern 208 (target) that is easy to detect and recording (measuring) the distance from the reference pattern 208 to the planned division line 204. When the alignment is performed, the operator operates the operation buttons of the operation touch panel 80 many times so that the epi-illumination 31A and the epi-illumination 31A and the It is necessary to increase or decrease the amount of light of the oblique illumination 31B to adjust the balance of the amount of light optimally.

(2) Dressing After the cutting blade 21 is attached to the spindle of the processing unit 20, the eccentricity of the cutting blade 21 is reduced, and the cutting edge of the cutting blade 21 is dressed with a dresser board ( (Not shown) to dress the cutting blade 21. When performing dressing, it is necessary to adjust the amount of light in order to align where on the dresser board to process (apply the cutting edge). The light amount at this time is set to the balance of the light amount at the time of the previous operation (at the time of alignment of the wafer 200 having the device 205 selected at that time or by default), so that the operator falls from the light amount setting of the previous operation. It is necessary to increase or decrease the light amounts of the illumination 31A and the oblique illumination 31B to adjust the light amount balance to the optimum.

(3) After performing pre-cut dressing, a so-called pre-cut operation is performed in order to sharpen the cutting edge of the cutting blade 21 using a silicon wafer in a state suitable for further processing. When performing precut, it is necessary to adjust the amount of light in order to align where to process (apply the blade edge) of the silicon wafer. Since the light quantity at this time is set to the light quantity at the time of the previous work (during dressing), the operator increases or decreases the light quantity of the epi-illumination illumination 31A and the oblique illumination 31B from the light quantity setting of the previous work, respectively, to obtain an optimal light quantity balance. Need to be adjusted.

(4) Calf check The use of the cutting blade 21 causes clogging and chipping due to use, resulting in a decrease in cutting ability, fine chipping (chipping) on both sides of a cutting groove formed during cutting, and an increase in groove width. In some cases, the quality of the device 205 is degraded. Therefore, when cutting is performed along a predetermined number (for example, 10) of the planned dividing lines 204, the cutting groove is imaged, and the state of the cutting groove is determined in order to determine whether dressing or replacement of the cutting blade 21 is necessary. A kerf check is performed to detect. When performing the kerf check, the operator increases or decreases the light amount of the epi-illumination light 31A and the oblique light 31B from the light amount setting of the previous work (or the default) so that the image of the target cut groove can be clearly imaged. Need to be adjusted.

(5) Others In addition to the above-described operations, when the rotation axis is adjusted so that the center of the chuck table 10 is memorized in the imaging unit 30, the width of the planned dividing line 204 of the wafer 200 or the width of the device 205 is simply measured, or the kerf is used. It is necessary to perform light amount adjustment also at the time of initial setting for determining the light amount at the time of checking.

  Thus, in a series of operations for cutting the wafer 200, the operator needs to frequently adjust the light amount of the light irradiation unit 31. Here, the optimal light amount balance of the epi-illumination 31A and the oblique illumination 31B in the light irradiation unit 31 greatly differs depending on the irradiation target and the operation (the above-described alignment, kerf check, etc.). For this reason, in the conventional configuration, when the work target is changed, the operator operates the operation button many times to change the light intensity setting of the previous work target (or the default) from the incident light 31A and the oblique light 31B. It is necessary to increase or decrease the light amount to adjust the light amount balance optimal for the work object after the change, and the light amount setting is complicated. For this reason, the processing apparatus 1 of the present embodiment has a configuration in which the light amount of the light irradiation unit 31 can be set efficiently.

  Next, the light amount setting operation of the light irradiation unit 31 will be described. Here, a light amount setting at the time of alignment of the wafer 200 will be exemplified. FIG. 5 is a diagram illustrating an example of a display mode of the operation touch panel in the light amount adjustment mode. FIG. 6 is a diagram showing the light amount comparison image display area of FIG. FIG. 7 is a diagram for explaining an operation procedure when setting the light amount. In FIG. 5, the light amount adjustment screen 81 includes an image display area 82 for displaying a captured image on the left side of the center, a light amount comparison image display area 84 located on the right side of the image display area 82, and a lower part of the light amount adjustment screen 81. It is divided into an image display area 82 and a light quantity adjustment button area 85 located below the light quantity comparison image display area 84. Further, on the right part of the light amount adjustment screen 81, for example, an ENTER button 86 for inputting an operator's instruction and an EXIT button 87 for exiting from a currently displayed page to a page on a higher layer are provided. The layout of the light amount adjustment screen 81 is merely an example, and the position, size, type, and the like of each region can be changed as appropriate.

  In the image display area 82, an image captured by the imaging unit 30 in real time, an image captured currently or in the past, and the like are displayed.

  In the light amount adjustment button area 85, various adjustment buttons for adjusting the light amount of the light irradiation unit 31 are provided. Specifically, an operation button 85A for lowering the light quantity of the epi-illumination 31A by 5%, an operation button 85B for decreasing the light quantity of the epi-illumination 31A by 1%, an operation button 85C for increasing the light quantity of the epi-illumination 31A by 1%, and an epi-illumination 31A And an operation button 85D for increasing the amount of light by 5%. Further, an operation button 85E for lowering the light amount of the oblique light 31B by 5%, an operation button 85F for lowering the light amount of the oblique light 31B by 1%, an operation button 85G for increasing the light amount of the oblique light 31B by 1%, and a light amount of the oblique light 31B An operation button 85H for raising 5% is provided.

  The operation buttons 85A to 85H for adjusting the light amounts of the epi-illumination 31A and the oblique illumination 31B respectively increase or decrease the light amount by a specified ratio each time the operation button is touched (touched). By operating the ENTER button 86, the light amounts of the currently illuminated epi-illumination 31A and oblique illumination 31B are respectively stored in the light amount setting storage unit 76 as new default light amounts.

  As shown in FIG. 6, in the light amount comparison image display area 84, a plurality of (four) predetermined different light amount conditions 84A1 to 84A4 and a plurality of image pickup units 30 sequentially imaged under the light amount conditions 84A1 to 84A4. Light intensity comparison images 84B1 to 84B4 are displayed. In the example of FIG. 6, the light amount conditions 84A1 to 84A4 are displayed side by side, and the light amount comparison images 84B1 to 84B4 corresponding to the light amount conditions 84A1 to 84A4 are respectively displayed immediately below the light amount conditions 84A1 to 84A4. The light amount conditions 84A1 to 84A4 are used by reading the set values stored in the light amount setting storage unit 76, respectively. The light amount comparison image display area 84 is provided with light amount comparison images 84B1 to 84B4 and a RESET button 84C side by side. By operating the RESET button 84C, for example, when the light amount comparison images 84B1 to 84B4 are unclear, the microprocessor 71 once erases the displayed light amount comparison images 84B1 to 84B4, and executes the light amount condition 84A1 described above. The light quantity comparison images 84B1 to 84B4 captured again at ８４84A4 are displayed. If the set values of the plurality of light amount conditions 84A1 to 84A4 have been changed by the operator, the set values are returned to the default values, and the light amount comparison images 84B1 to 84B4 captured again under the default light amount conditions 84A1 to 84A4. May be displayed.

  In the present embodiment, when the alignment of the wafer 200 is performed, for example, the reference pattern 208 (FIG. 2) of the wafer 200 is positioned immediately below the imaging unit 30, and the operator performs, for example, the light irradiation unit 31 on the upper hierarchical page. When an operation button (for example, a light amount setting button) is touched, the microprocessor 71 switches to the light amount adjustment screen 81 via the display control unit 74 and shifts to the light amount adjustment mode. Then, under the control of the microprocessor 71, the imaging unit 30 captures the light amount comparison images 84B1 to 84B4 under the light amount conditions 84A1 to 84A4 while changing the light amount conditions 84A1 to 84A4. These light quantity comparison images 84B1 to 84B4 are displayed in the light quantity comparison image display area 84 together with the light quantity conditions 84A1 to 84A4. It is preferable that the light amount condition and the light amount comparison image displayed in the light amount comparison image display area 84 be four or more, since the mutual comparison is easy. However, the present invention is not limited to this, and can be appropriately changed.

  The light amount comparison images 84B1 to 84B4 also function as operation buttons that can be touched. When the operator touches and selects any one of the selection candidates of the light amount comparison images 84B1 to 84B4, for example, the light amount comparison image 84B2 having the best visibility, the microprocessor 71 selects the light amount of the light irradiation unit 31. The light amount condition 84A2 corresponding to the obtained light amount comparison image 84B2 is set the same as the light amount condition 84A2, and an image 88 of the reference pattern 208 photographed in real time under the light amount condition 84A2 is displayed in the image display area 82 as shown in FIG. I do.

  Next, while viewing the image 88 displayed in the image display area 82, the operator operates the operation buttons 85A to 85H for adjusting the light amounts of the epi-illumination 31A and the oblique illumination 31B, respectively, to thereby optimize the light irradiation unit 31. Fine-tune the light intensity. For example, by touching the operation button 85C for raising the light quantity of the epi-illumination 31A by 1% three times, the light quantity of the epi-illumination 31A can be adjusted from 25% specified in the light quantity condition 84A2 to 28%.

  As described above, in the present embodiment, the control unit 70 images the reference pattern 208 that is the imaging target of the wafer 200 a plurality of times under the light amount conditions 84A1 to 84A4 in which the light amounts of the light irradiation units 31 are different from each other. In order to acquire the light intensity comparison images 84B1 to 84B4 and to display these light intensity comparison images 84B1 to 84B4 in the light intensity comparison image display area 84 of the light intensity adjustment screen 81, the operator selects the plurality of light intensity comparison images 84B1 to 84B4 from the selection candidates. Can be selected, and the amount of light of the light irradiation unit that has captured the image can be easily adjusted.

  Further, when the light amount comparison image 84B2 having the best visibility is selected from the displayed plurality of light amount comparison images 84B1 to 84B4, the control unit 70 determines the light amount of the light irradiation unit 31 as the selected light amount. Since the light amount condition 84A2 corresponding to the comparative image 84B2 is set the same, the light amount adjustment can be greatly facilitated. Further, since the image 88 of the reference pattern 208 photographed in real time under the light amount condition 84A2 is displayed in the image display area 82, the light amount of the light irradiation unit 31 can be easily adjusted to the optimum light amount while watching the image 88. The light amount setting of the light irradiation unit 31 can be executed efficiently.

  When the light amount comparison image 84B2 is held down while the light amount of the light irradiation unit 31 is finely adjusted, the finely adjusted light amount condition is stored in the light amount setting storage unit 76 as a new light amount condition 84A2. The new light amount condition 84A2 is stored in the light amount setting storage unit 76 not only when the operator presses the ENTER button 86, but also as a default value of the light amount irradiated at the time of alignment by long pressing the light amount comparison image 84B2. May be done. According to these configurations, there is an effect that the adjustment of the light amount of the light irradiation unit 31 when the alignment of the wafer 200 is performed after the next time becomes easier.

  In the present embodiment, the case where the light amount of the light irradiation unit 31 is adjusted (set) when the alignment of the wafer 200 is performed has been described, but the present invention can be applied to the case where the above-described operations are performed.

  The present invention is not limited to the description of the above embodiments and the like, and can be implemented with various modifications. For example, in the present embodiment, the processing apparatus 1 has a configuration in which the processing unit 20 includes the cutting blade 21 as the processing unit and performs the cutting processing. However, for example, when the alignment of the wafer 200 is performed, the processing unit is a wafer. By irradiating the laser beam 200 to the laser beam 200, laser processing may be performed along the planned dividing line 204 of the wafer 200.

DESCRIPTION OF SYMBOLS 1 Processing apparatus 10 Chuck table 20 Processing unit 21 Cutting blade 30 Imaging unit 31 Light irradiation unit 31A Epi-illumination 31B Oblique illumination 40 X-axis movement unit 50 Y-axis movement unit 60 Z-axis movement unit 70 Control unit 76 Light amount setting storage unit 80 Operation Touch panel 81 Light intensity adjustment screen 82 Image display area 84 Light intensity comparison image display area 84A1 to 84A4 Light intensity condition 84B1 to 84B4 Light intensity comparison image 85 Light intensity adjustment button area 88 Image 200 Wafer (workpiece)
Reference Signs List 201 substrate 204 scheduled division line 205 device 206 device region 207 outer peripheral surplus region 208 reference pattern 210 adhesive tape 211 annular frame

Claims (2)

A processing unit for processing the workpiece held on the chuck table,
An imaging unit for imaging the workpiece irradiated by the light irradiation unit,
A control unit for controlling various units of the processing device;
A processing apparatus comprising: an image of a workpiece imaged by the imaging unit, a plurality of operation buttons for driving the control unit, and an operation touch panel that displays at least one of the operation buttons,
The control unit comprises:
When detecting that the operator touches the operation button related to the light irradiation unit on the operation touch panel,
A processing apparatus, wherein the workpiece is imaged a plurality of times in a state where the light irradiation units have different light amounts to obtain a plurality of light amount comparison images, and the light amount comparison images are displayed on the operation touch panel. The light amount comparison image is the operation button,
The control unit comprises:
Among the plurality of light amount comparison images displayed on the operation touch panel,
The processing apparatus according to claim 1, wherein the light irradiation unit is adjusted to the same light amount as an arbitrary light amount comparison image touched by an operator.

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