JP7460272B2 - Processing Equipment - Google Patents

Description

The present invention relates to a processing device that processes a wafer on which devices are formed in each area defined by a plurality of planned division lines.

Electrical devices such as mobile phones and personal computers are equipped with device chips. Device chips are produced by cutting a wafer, in which devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) are formed in each of the areas divided by multiple planned dividing lines, along each scheduled dividing line. Manufactured by dividing into multiple device chips.

To divide the wafer, a processing unit such as a cutting unit having a cutting blade (see, for example, Patent Document 1), a laser irradiation unit that irradiates a laser beam having a wavelength that is absorbed by the wafer (see, for example, Patent Document 2), etc. is used. The processing equipment provided is used.

The processing device includes a chuck table provided below the processing unit. A processing feed unit that moves the chuck table along the processing feed direction (X-axis direction) is provided below the chuck table. Furthermore, an imaging unit is provided above the chuck table to take an image of the wafer held by the chuck table.

In addition, the processing device is provided with a control unit that controls the operation of each component, such as the processing unit, chuck table, processing feed unit, and imaging unit. After an operator inputs predetermined processing conditions into the control unit, each wafer is processed by the processing unit along the planned division line.

In order to confirm that the processing conditions are appropriate, the operator takes out a wafer that has actually been processed on several lines to be split from the processing equipment, and examines the lines to be split using a microscope installed outside the processing equipment. Multiple locations may be observed (ie, a kerf check).

Through this observation, the operator can determine whether, for example, the width of the cutting groove, the size and number of chips, the deviation between the center line of the cutting groove and the center line of the planned dividing line, etc. are within the allowable range. confirm. If the deviation exceeds the allowable range, the operator corrects the machining conditions as appropriate. Then, the wafer returned to the processing device is processed under the corrected processing conditions.

JP 2000-108119 A JP 2005-150523 A

However, removing the wafer from the processing equipment every time the processing conditions are checked under a microscope carries the risk of damaging the wafer during transport or contaminating it with foreign matter.

The present invention was made in consideration of these problems, and aims to provide a processing device that allows an operator to determine whether the processing conditions are appropriate without removing the wafer from the processing device.

According to one aspect of the present invention, a processing apparatus for processing a wafer having devices formed in each of a plurality of areas partitioned by a plurality of planned dividing lines set on a front surface side thereof includes a cassette table on which a cassette containing a plurality of wafers is placed, a chuck table for holding a wafer carried out from the cassette placed on the cassette table, a processing unit for processing an area corresponding to the planned dividing lines of the wafer held on the chuck table, a processing feed unit for processing and feeding the chuck table and the processing unit relatively, an imaging unit for imaging the wafer held on the chuck table, and a control unit for controlling the processing unit, the processing feed unit and the imaging unit, and the control unit operates the processing feed unit to move the chuck table after the processing unit has processed all of the areas corresponding to the planned dividing lines of the wafer held on the chuck table. a control unit which positions the chuck table directly below the imaging unit by moving it relatively to cause the imaging unit to image the wafer ; an arrangement determination unit which determines an arrangement of the two or more different areas when the number of the two or more different areas to be imaged by the imaging unit is specified; and a report creation unit which derives information on the processing state in each area based on images of two or more different areas individually captured among all of the regions corresponding to the planned division lines that have been processed, and creates a report in which the information and the images are recorded, wherein the arrangement determination unit, when arranging the areas in each of a first direction and a second direction perpendicular to each other on the surface, adjusts the spacing of the areas in the first direction so that the areas are equally spaced in the second direction and that the areas are equally spaced within the width of the surface in the first direction that passes through a predetermined position in the second direction, in accordance with the specified number of areas .

Preferably, the report creation section creates the report for the first wafer processed among the plurality of wafers housed in the cassette.

In addition, preferably, the information on the machining state includes the width of the groove formed in the area corresponding to the planned division line, the state of the chipping formed in the groove, and the amount of deviation of the groove from the center line of the planned division line.

Moreover, preferably, the processing device further includes a display unit for displaying the contents of the report.

Preferably, the processing unit is either a cutting unit rotatably equipped with a cutting blade or a laser beam irradiation unit equipped with a condenser that focuses a laser beam.

A control unit of a processing device according to one aspect of the present invention includes a control section and a report creation section. After the processing unit processes the area corresponding to all the scheduled dividing lines of the wafer held on the chuck table, the control section operates the processing feed unit to relatively move the chuck table so that the wafer is directly below the imaging unit. The chuck table is positioned to allow the imaging unit to image the wafer.

In addition, the report creation unit derives information regarding the processing status of each area based on images in which two or more different areas are individually captured among the areas corresponding to all planned division lines that have been processed, and A report is created in which the information and the image are recorded. By referring to this report, the operator can check whether the processing conditions were appropriate without taking out the wafer from the processing equipment. Therefore, it is possible to eliminate the risk of damage to the wafer, contamination, etc. due to taking the wafer out of the processing equipment.

FIG. FIG. FIG. 2 is a diagram showing how the front surface side of a wafer is imaged; FIG. 13 is an image showing an example of a report. It is a perspective view of the laser processing device concerning a 2nd embodiment. FIG. 7(A) is a diagram showing an example in which the inspection area located at the end is located outside the outer circumference of the wafer, and FIG. 7(B) is a diagram showing the arrangement of the inspection area after correction.

An embodiment of the present invention will be described with reference to the attached drawings. FIG. 1 is a perspective view of a cutting device (processing device) 2. Note that FIG. 1 shows some of the components of the cutting device 2 in functional blocks. In the following description, the X-axis direction (processing feed direction), Y-axis direction (indexing feed direction), and Z-axis direction (height direction) are mutually orthogonal.

An operation panel 4 is provided on the front side of the cutting device 2. The operator can set processing conditions and the like for the cutting device 2 by, for example, making predetermined inputs via the operation panel 4. A monitor (display unit) 6 is provided on the front side of the cutting device 2 .

The monitor 6 displays a guide screen that guides the operator on the operation, images captured by the imaging unit 24 described below, the contents of a report described below, etc. The monitor 6 may be a touch panel that also functions as the operation panel 4. In this case, the operation panel 4 may be omitted.

The cutting device 2 cuts (processes) a wafer 11 (see FIG. 2) made of a semiconductor material such as silicon. As shown in FIG. 2, on the front surface 11a side of the wafer 11, a plurality of dividing lines (streets) 13 are set in a grid pattern. A device 15 such as an IC (Integrated Circuit) or an LSI (Large Scale Integration) is formed in each area partitioned by a plurality of dividing lines 13 .

A circular adhesive tape (dicing tape 17) made of resin is attached to the back surface 11b of the wafer 11. The diameter of the dicing tape 17 is larger than the diameter of the wafer 11. The wafer 11 is attached to the center of the dicing tape 17, and one side of an annular frame 19 made of metal is attached to the outer periphery of the dicing tape 17.

The wafer 11, dicing tape 17, and frame 19 constitute a frame unit 21. Figure 2 is a perspective view of the frame unit 21. Multiple (e.g., 25) frame units 21 are stored in one cassette 8 (see Figure 1) and transported to the cutting device 2.

Returning to FIG. 1 again, other components of the cutting device 2 will be described. The cutting device 2 has a rectangular, plate-like cassette table 10. The cassette 8 described above is placed on the cassette table 10. Connected to the bottom of the cassette table 10 is a cassette elevator 12 that can move the cassette table 10 up and down.

A push-pull arm 14 is provided behind the cassette table 10. The push-pull arm 14 transports the uncut wafer 11 out of the cassette 8 while holding the frame 19 of the frame unit 21. The push-pull arm 14 can also transport the cut wafer 11 into the cassette 8 by pushing the frame 19.

A pair of positioning members (guide rails) 16 are provided on both sides of the movement path of the push-pull arm 14. A pair of positioning members 16 adjust the position of the frame unit 21 in the X-axis direction. A first transport unit 18 that transports the frame unit 21 from the pair of positioning members 16 is provided near the pair of positioning members 16 .

The first transport unit 18 includes an arm, a suction mechanism provided at one end of the arm, and a rotation mechanism provided at the other end of the arm. The first transport unit 18 transports the frame unit 21 by rotating the arm by a predetermined angle using the rotation mechanism while the frame 19 is attracted by the suction mechanism.

The first transport unit 18 transports the frame unit 21 to the chuck table 20 that has been moved to the area closest to the cassette table 10 in the X-axis direction. A disc-shaped porous plate is fixed to the upper surface side of the chuck table 20.

One end of a flow path (not shown) formed inside the chuck table 20 is connected to the underside of the porous plate, and the other end of this flow path is connected to a suction source (not shown) such as an ejector.

When the suction source is operated, negative pressure is generated on the upper surface of the porous plate, and the upper surface of the chuck table 20 functions as a holding surface 20a that holds the frame unit 21 by suction. The frame unit 21 is held by the holding surface 20a on the dicing tape 17 side so that the surface 11a side of the wafer 11 is exposed.

A number of clamp units 20b for fixing the frame 19 are provided on the outer periphery of the chuck table 20. In addition, a θ table (not shown) that rotates the chuck table 20 around a predetermined rotation axis is connected below the chuck table 20.

Below the θ table, a processing feed unit 22 that moves the chuck table 20 along the X-axis direction is connected. Note that FIG. 1 shows an outline of the position of the processing feed unit 22, but does not show its specific shape.

The processing feed unit 22 has an X-axis moving table (not shown) that supports the θ table. The X-axis moving table is provided in a slidable manner on a pair of X-axis guide rails (not shown) that are parallel to the X-axis.

A ball screw (not shown) is arranged along the X-axis direction between the pair of X-axis guide rails. A pulse motor (not shown) for rotating the ball screw is connected to one end of the ball screw.

A nut portion (not shown) is provided on the underside of the X-axis moving table, and this nut portion is rotatably connected to the ball screw. When the pulse motor is driven, the chuck table 20 moves along the X-axis direction together with the X-axis moving table, etc.

An imaging unit 24 is provided above the movement path of the chuck table 20 in such a manner that it can face the holding surface 20a. The imaging unit 24 includes a camera including a predetermined optical system and an imaging element such as a CCD image sensor or a CMOS image sensor, and for example, images the front surface 11a side of the wafer 11 held by the holding surface 20a. Get the image.

The acquired image is displayed, for example, on the monitor 6. A cutting unit (machining unit) 26 is provided on one side of the imaging unit 24 in the X-axis direction. The cutting unit 26 has a cylindrical spindle (not shown) arranged along the Y-axis direction.

A cutting blade 26a with an annular cutting edge is attached to one end of the spindle. A rotary drive source such as a motor is connected to the other end of the spindle. When the rotary drive source is operated, the cutting blade 26a rotates at high speed.

Here, we will explain the method of cutting the wafer 11 using the cutting unit 26. When cutting the wafer 11, first, the back surface 11b side of the wafer 11 (i.e., the dicing tape 17) is held by the holding surface 20a so that the front surface 11a is exposed, and the frame 19 is fixed by the multiple clamp units 20b.

Next, the imaging unit 24 images the front surface 11a of the wafer 11, and the image obtained by the imaging is subjected to image processing such as pattern matching, thereby detecting the coordinates of a predetermined alignment mark. Thereby, the position of the planned division line 13 that is a predetermined distance away from the coordinates of the alignment mark is specified.

Next, the cutting blade 26a is positioned on an extension of the first dividing line 13. Thereafter, the lower end of the rotated cutting blade 26a is positioned between the back surface 11b of the wafer 11 and the holding surface 20a.

Then, the processing feed unit 22 processes and feeds the chuck table 20, thereby moving the wafer 11 and the chuck table 20 relatively along the X-axis direction. As a result, the area corresponding to one of the planned division lines 13 is cut (processed), and a cutting groove 13a is formed (see FIG. 3).

After cutting the wafer 11 along one planned dividing line 13, the cutting unit 26 is moved along the Y-axis direction to position the cutting blade 26a on an extension line of another planned dividing line 13 adjacent to the one planned dividing line 13 in the Y-axis direction.

Then, the wafer 11 is cut along the other planned dividing lines 13. In the same manner, the wafer 11 is cut along the remaining planned dividing lines 13. After the wafer 11 has been cut along all the planned dividing lines 13 along the X-axis direction, the wafer 11 is rotated 90 degrees by the θ table.

Thereafter, the wafer 11 is cut along all the dividing lines 13 along the X-axis direction. Once the cutting grooves 13a have been formed in the regions corresponding to all the dividing lines 13 set in a grid pattern in this way, the cutting is finished.

After cutting, the frame unit 21 is transported by the second transport unit 28 from the chuck table 20 to the spinner cleaning unit 30 located behind the chuck table 20. In the spinner cleaning unit 30, the frame unit 21 is spin cleaned and spin dried.

The frame unit 21 that has been spin-cleaned and spin-dried in the spinner cleaning unit 30 is carried into the cassette 8 by the first transport unit 18, the positioning member 16, the push-pull arm 14, and the like. Next, the control unit 32 that controls the operation of the cutting device 2 will be explained.

The control unit 32 controls the operation of the cassette elevator 12, push-pull arm 14, positioning member 16, chuck table 20, processing feed unit 22, imaging unit 24, cutting unit 26, second transport unit 28, spinner cleaning unit 30, etc.

The control unit 32 is configured by a computer including, for example, a processing device such as a CPU (Central Processing Unit), a main storage device such as a DRAM (Dynamic Random Access Memory), and an auxiliary storage device such as a flash memory or a hard disk drive. The functions of the control unit 32 are realized by operating the processing device and the like in accordance with software including a specific program stored in the auxiliary storage device.

The control unit 32 includes a control section 34 configured of a program, for example. The control unit 34 controls, for example, the operation of a solenoid valve (not shown) provided between one end and the other end of a flow path formed inside the chuck table 20.

When the solenoid valve is opened, negative pressure is generated on the holding surface 20a, and when the solenoid valve is closed, the negative pressure on the holding surface 20a disappears. The control unit 34 also controls, for example, the operation of the rotation drive source of the cutting unit 26.

After all scheduled dividing lines 13 are cut by the cutting unit 26 according to the above-described cutting method of the wafer 11, the control unit 34 controls the pulse motor of the processing feed unit 22 to move the chuck table 20 directly below the imaging unit 24. Position the chuck table 20 at .

After that, the control section 34 operates the imaging unit 24 to cause the imaging unit 24 to image the front surface 11a side of the wafer 11. FIG. 3 is a diagram showing how the front surface 11a side of the wafer 11 is imaged.

The imaging unit 24 captures an image of the entire surface 11a side of the wafer 11, and also captures images of two or more predetermined inspection regions (areas) individually in an enlarged form compared to the entire image of the wafer 11. In this embodiment, the imaging unit 24 captures images of seven inspection regions located at different positions.

FIG. 4 is a diagram showing each inspection area. In this embodiment, the horizontal direction shown in FIG. 4 is referred to as the channel 1 (CH1) direction, and the vertical direction shown in FIG. 4 is referred to as the channel 2 (CH2) direction.

Each inspection area includes a predetermined range centered on the intersection of the planned division lines 13 in the CH1 direction and CH2 direction. As shown in the image of the inspection area A, chippings 13b are generated in the cut grooves 13a ₁ along the CH1 direction and the cut grooves 13a ₂ along the CH2 direction, respectively.

In the inspection area A, the center line of the cutting groove 13a ₁ in the CH1 direction is shifted to the rear side from the center line of the planned dividing line 13 in the CH1 direction. The center line of the cut groove 13a ₁ is a straight line parallel to the CH1 direction passing through the center position of the width of the cut groove 13a ₁ in the CH2 direction. Further, the center line of the planned division line 13 in the CH1 direction is a straight line parallel to the CH1 direction passing through the center position of the width of the planned division line 13 in the CH1 direction in the CH2 direction.

Inspection area B is located on the right side of inspection area A in the CH1 direction, and is located at the same position as inspection area A in the CH2 direction. In the inspection area B, the center line of the cut groove _13a2 in the CH2 direction is shifted to the left from the center line of the planned dividing line 13 in the CH2 direction.

The center line of the cut groove _13a2 is a straight line parallel to the CH2 direction passing through the center position of the width of the cut groove _13a2 in the CH1 direction. Further, the center line of the planned division line 13 in the CH2 direction is, for example, a straight line parallel to the CH2 direction that passes through the center position of the width of the planned division line 13 in the CH2 direction in the CH1 direction.

In the inspection area B, similarly to the inspection area A, the center line of the cut groove _13a1 in the CH1 direction is shifted rearward from the center line of the planned dividing line 13 in the CH1 direction. Note that no chipping 13b occurs in the cutting groove _13a1 in the CH1 direction.

Inspection area C is located to the left of inspection area A in the CH1 direction and in front of inspection area A in the CH2 direction. In inspection area C, the center line of cutting groove _13a1 in the CH1 direction is shifted rearward from the center line of planned division line 13 in the CH1 direction, and cutting groove _13a2 in the CH2 direction is shifted rightward from the center line of planned division line 13 in the CH2 direction.

Inspection area D is located approximately at the center of surface 11a. Inspection area D is located between inspection areas A and B in the CH1 direction, and at the same position as inspection area C in the CH2 direction. Also in the inspection area D, the center line of the cutting groove _13a1 in the CH1 direction is shifted to the rear side from the center line of the planned dividing line 13 in the CH1 direction.

The inspection area E is located on the right side of the inspection area B in the CH1 direction, and is located at the same position as the inspection areas C and D in the CH2 direction. Also in the inspection area E, the center line of the cut groove _13a1 in the CH1 direction is shifted to the rear side from the center line of the planned dividing line 13 in the CH1 direction.

Inspection area F is located at the same position as inspection area A in the CH1 direction, and is located in front of inspection area C in the CH2 direction. In inspection area F, the center line of cut groove _13a1 in the CH1 direction is shifted rearward from the center line of planned division line 13 in the CH1 direction.

Inspection area G is in the same position as inspection area B in the CH1 direction, and in the same position as inspection area F in the CH2 direction. In inspection area G, the center line of cutting groove _13a1 in the CH1 direction is shifted rearward from the center line of planned division line 13 in the CH1 direction, and the center line of cutting groove _13a2 in the CH2 direction is shifted leftward from the center line of planned division line 13 in the CH2 direction.

The arrangement of the inspection areas A to G is determined by the arrangement determining unit 36 that is part of the control unit 32 when the operator specifies the number of two or more different inspection areas (areas) to be imaged by the imaging unit 24. Ru. The arrangement determining unit 36 is configured by, for example, a program.

The arrangement determining unit 36 sets the coordinates of the intersection of the center line of the planned division line 13 in the CH1 direction and the center line of the planned division line 13 in the CH2 direction as the center coordinates of the inspection area. The arrangement determining unit 36 determines a plurality of center coordinates of the inspection areas according to the number of designated inspection areas.

For example, among the coordinates of the plurality of intersection points, the arrangement determining unit 36 selects one coordinate located approximately at the center of the surface 11a and a plurality of other coordinates located around the one coordinate, respectively, at the center of the inspection area. Coordinates. For example, the arrangement determining unit 36 determines the arrangement of the center coordinates of the inspection areas so that the center coordinates of at least two inspection areas are the same in the CH1 direction or the CH2 direction.

After the arrangement of the central coordinates of the inspection areas is determined, an image of a range of a predetermined diameter (e.g., 200 μm to 300 μm) from the central coordinates of each inspection area is captured by the imaging unit 24. Note that the range captured by the imaging unit 24 is not limited to a circle and may be any shape.

The control unit 32 further includes a report creation section 38 that creates a report in which images of each inspection area and information regarding the processing state of the wafer 11 in each inspection area are recorded. The report creation unit 38 is configured with a program, for example, and creates a report for the first wafer 11 to be processed among the plurality of wafers 11 housed in the cassette 8.

By referring to this report, the operator can check whether the processing conditions were appropriate without taking out the wafer 11 from the processing apparatus. If the machining conditions are inappropriate, the machining conditions can be corrected. Therefore, when processing the second and subsequent wafers 11, the wafers 11 can be processed under the corrected processing conditions.

The information on the machining state includes the width of the cut groove 13a, the state of the chipping 13b formed in the cut groove 13a, and the amount of deviation of the center line of the cut groove 13a from the center line of the planned division line 13. The width of the cut groove _13a1 along the CH1 direction is the length of the cut groove _13a1 in the CH2 direction, and the width of the cut groove _13a2 along the CH2 direction is the length of the cut groove _13a2 in the CH1 direction.

Further, the state of the chips 13b formed in the cutting groove 13a includes, for example, the number of chips 13b and the size of the chips 13b. For example, the size of the chip 13b means the maximum length of the chip 13b in the CH2 direction from the edge of the cut groove _13a1 , or the maximum length of the chip 13b in the CH1 direction from the edge of the cut groove _13a2 .

The report of this embodiment is displayed as an image on the monitor 6. FIG. 5 is an image showing an example of a report. An overall image of the front surface 11a of the wafer 11 is displayed in the upper right corner of the report. In this overall image, positions corresponding to the inspection areas A to G are indicated by circles.

Below the overall image of the wafer 11, a circle that is a simplified overall image is displayed, and inspection areas A to G are shown within this circle. An image of the inspection area is displayed on the left side of the overall image of the wafer 11. In the example shown in FIG. 5, an image of the inspection area D is displayed.

The operator can select the image of the desired inspection area to be displayed by specifying the desired inspection area. For example, the operator can switch the image of inspection area D to the image of inspection area A by specifying inspection area A, which is shown in a circle that simplifies the overall image.

Information regarding the processing state of the selected inspection area is displayed below the image of the inspection area. In the example shown in FIG. 5, information regarding the processing state of the inspection area D is displayed. Each piece of information is generated, for example, by the report creation unit 38 based on the obtained image.

As shown in "groove width" in Fig. 5, the width of cut groove _13a1 in inspection area D is 30 μm, and the width of cut groove _13a2 in inspection area D is 31 μm. Also, "chipping" in Fig. 5 indicates the number of chips less than 5 μm. As shown in Fig. 5, in inspection area D, the number of chips less than 5 μm in cut groove _13a1 is one, and the number of chips less than 5 μm in cut groove _13a2 is four.

"(5 μm or more)" in Fig. 5 indicates the number of chips of 5 μm or more. As shown in Fig. 5, in the inspection area D, there are no chips of 5 μm or more in the cut grooves _13a1 and _13a2 . Also, "street deviation" in Fig. 5 is the deviation amount of the center line of the cut groove 13a from the center line of the planned division line 13.

5, the center line of the cut groove _13a1 in the CH1 direction of the inspection region D is shifted by 3 μm from the center line of the planned division line 13 in the CH1 direction. Also, the center line of the cut groove _13a2 in the CH2 direction of the inspection region D is shifted by 2 μm from the center line of the planned division line 13 in the CH2 direction.

The report creation unit 38 derives the width of the cutting groove 13a, the number of chips less than 5 μm, the number of chips larger than 5 μm, street deviation, etc., based on the acquired image. Since the length per pixel of the acquired image is predetermined, the report creation unit 38 calculates, for example, the width of the cut groove 13a from the number of pixels corresponding to the width of the cut groove 13a in the image, and The position of the center line of the cutting groove 13a is calculated.

Similarly, the report creation unit 38 can calculate the size of a chip in a predetermined direction from the number of pixels in the predetermined direction corresponding to the chip in the image. Further, the report creation unit 38 can count the number of chips depending on the size of the chip. In this manner, the report creation unit 38 creates a report in which images of each inspection area and information regarding the processing state in each inspection area are recorded.

By referring to this report, the operator can confirm whether the processing conditions were appropriate without taking out the wafer 11 from the cutting device 2 and observing the planned dividing line 13 using a microscope or the like. Therefore, the risk of damage to the wafer 11, contamination, etc. due to taking the wafer 11 out of the cutting device 2 can be eliminated.

Note that the report is not limited to image display, and may be printed on paper. If the report is printed on paper, the cutting device 2 may include a report printing section (not shown) including a printer. Furthermore, instead of the report printing section, the report creation section 38 may output data necessary for creating a report to an external printer (not shown) and cause the printer to print the report.

When the report is printed on paper, it is preferable that the images of the inspection areas and information regarding the processing state are recorded in the report in a manner that allows identification of the correspondence between the images of each inspection area and the information regarding the processing state of the wafer 11 in each inspection area.

Next, a method for checking and correcting the machining conditions will be described. First, the operator inputs the specified machining conditions to the control unit 32 via the operation panel 4 (preparation step (S10)). The machining conditions include the type of cutting blade 26a, the flow rate of cutting water supplied to the machining point, the rotation speed of the spindle, etc.

In the preparation step (S10), the number of inspection regions (areas) to be imaged is also input, and the above-mentioned arrangement determining section 36 automatically determines the arrangement of the inspection regions. After inputting the processing conditions, the operator presses the automatic processing start button to cause the cutting device 2 to start processing the wafer 11.

When the automatic processing start button is pressed, the first frame unit 21 is transported from the cassette 8 onto the chuck table 20, and the frame unit 21 is held by the holding surface 20a and the clamp unit 20b (holding process (S20)).

After the holding step (S20), the areas of the wafer 11 corresponding to all of the planned dividing lines 13 are cut by the cutting unit 26 according to the cutting method described above (cutting step (S30)). After the cutting step (S30), the imaging unit 24 captures images of each inspection area designated by the arrangement determination unit 36 and the entire surface 11a side of the wafer 11 (imaging step (S40)).

After the imaging step (S40), the report creation unit 38 creates the above-mentioned report (report creation step (S50)). The operator refers to the created report to check whether the processing conditions entered in the preparation step (S10) were appropriate (confirmation step (S60)). This eliminates the risk of damage, contamination, etc. of the wafer 11 when the wafer 11 is removed from the cutting device 2.

After the confirmation step (S60), the first frame unit 21 is washed and dried in the spinner washing unit 30 and then loaded into the cassette 8. If the processing conditions are appropriate, the cutting step (S30) is performed on the second and subsequent frame units 21 under the same processing conditions.

However, if the processing conditions are inappropriate, after the confirmation step (S60), the processing conditions are corrected (correction step (S70)). In the correction step (S70), for example, the cutting blade 26a is replaced or reattached, the flow rate of cutting water is changed, the spindle speed is changed, etc.

After the correction step (S70), the second frame unit 21 is subjected to a holding step (S20) to a confirmation step (S60). If the processing conditions are appropriate, the second frame unit 21 is cleaned and dried, and then transported to the cassette 8. However, if the processing conditions are inappropriate, the correction step (S70) etc. are performed again.

Next, a second embodiment will be described. FIG. 6 is a perspective view of a laser processing device (processing device) 40 according to the second embodiment. The laser processing device 40 has a laser beam irradiation unit (processing unit) 42 instead of the cutting unit 26. This is where it differs from the cutting device 2.

The laser beam irradiation unit 42 has a laser beam generating section (not shown) that generates a pulsed laser beam having a wavelength that is absorbed by the wafer 11. The laser beam generating section includes a laser oscillator (not shown). The laser beam irradiation unit 42 has a cylindrical housing section 42a, and a head section 42b is provided at the tip of the housing section 42a.

The head portion 42b is provided with a condensing lens (not shown) that condenses the laser beam, and the head portion 42b functions as a condenser. The laser beam generated by the laser beam generation section passes through a predetermined optical system provided within the housing section 42a, and is emitted downward from the head section 42b.

When processing the wafer 11, for example, the back surface 11b side of the wafer 11 is held by the holding surface 20a in such a manner that the front surface 11a is exposed. Then, the area immediately below the head portion 42b is positioned on the extension line of the first dividing line 13.

When the chuck table 20 and the head section 42b are processed and fed relative to each other while being irradiated with a laser beam of a predetermined output from the head section 42b, the area corresponding to the planned dividing line 13 is ablated and a laser processing groove is formed. It is formed.

The laser processing device 40 also has a control unit 32 like the cutting device 2. Therefore, similarly to the first embodiment, a report is created by the report creation section 38 after laser processing grooves are formed on all of the dividing lines 13 of the first wafer 11.

By referring to this report, the operator can check whether the processing conditions were appropriate without taking out the wafer 11 from the processing apparatus. Therefore, the risk of damage to the wafer 11, contamination, etc. due to taking the wafer 11 out of the cutting device 2 can be eliminated.

Next, another example in which the placement determination unit 36 determines the placement of the inspection area will be described. The inspection area is meaningless unless it is set on the wafer 11. However, since the wafer 11 is disk-shaped, if multiple inspection areas are placed at equal intervals in the CH1 and CH2 directions, the inspection areas located at the ends may be located outside the outer periphery of the surface 11a.

Figure 7 (A) is a diagram showing an example in which the inspection region 13c located at the edge is located outside the outer periphery of the wafer 11. Note that in Figure 7 (A), the position of the inspection region 13c is simply indicated by a cross. In this case, the placement determination unit 36 corrects the placement of the inspection region 13c so that the interval between the inspection regions 13c becomes narrower in the CH1 or CH2 direction.

Figure 7 (B) shows the arrangement of the inspection area 13c after correction. The arrangement determination unit 36 corrects the coordinates of the inspection area 13c so that the inspection area 13c located at the edge is located inside the outer periphery of the surface 11a.

For example, the placement determination unit 36 sets the spacing in the CH1 direction between the five inspection regions 13c located between one end and the center in the CH2 direction and the five inspection regions 13c located between the other end and the center in the CH2 direction to a first spacing that is narrower than that in the case of FIG. 7(A).

Furthermore, the placement determination unit 36 sets the spacing in the CH1 direction between the five inspection regions 13c located at one end in the CH2 direction and the five inspection regions 13c located at the other end in the CH2 direction to a second spacing that is narrower than the first spacing. Note that in the modification example of FIG. 7(B), the spacing in the CH1 direction is narrowed, but instead, the spacing in the CH2 direction may be narrowed.

In this way, the placement determination unit 36 corrects the placement of the inspection areas 13c according to the number of inspection areas 13c specified by the operator, thereby preventing the imaging unit 24 from acquiring images outside the outer periphery of the wafer 11.

In addition, the structures, methods, etc. according to the above embodiments can be modified as appropriate without departing from the scope of the purpose of the present invention. For example, the cut groove 13a and the laser processed groove are not limited to grooves formed by cutting the wafer 11 (i.e., full cut), but may be half-cut grooves in which the wafer 11 is partially removed.

2 Cutting equipment (processing equipment)
4 Operation panel 6 Monitor (display unit)
8 Cassette 10 Cassette table 12 Cassette elevator 14 Push-pull arm 16 Positioning member 18 First transport unit 20 Chuck table 20a Holding surface 20b Clamp unit 22 Processing feed unit 24 Imaging unit 26 Cutting unit (processing unit)
26a Cutting blade 28 Second transport unit 30 Spinner cleaning unit 32 Control unit 34 Control section 36 Layout determining section 38 Report creation section 40 Laser processing device (processing device)
42 Laser beam irradiation unit (processing unit)
42a Housing part 42b Head part 11 Wafer 11a Front side 11b Back side 13 Planned dividing line 13a, 13a ₁ , 13a ₂ cutting grooves 13b Chip 13c Inspection area 15 Device 17 Dicing tape 19 Frame 21 Frame units A, B, C, D, E, F, G Inspection area

Claims (5)

A processing apparatus for processing a wafer having devices formed in each of a plurality of areas partitioned by a plurality of planned division lines set on a front surface side, comprising:
the wafer processing system includes a cassette table on which a cassette containing a plurality of wafers is placed, a chuck table which holds the wafers carried out from the cassette placed on the cassette table, a processing unit which processes an area of the wafer held on the chuck table which corresponds to a planned dividing line, a processing feed unit which relatively feeds the chuck table and the processing unit, an imaging unit which images the wafer held on the chuck table, and a control unit which controls the processing unit, the processing feed unit, and the imaging unit,
The control unit
a control unit that, after the processing unit has processed areas of the wafer held by the chuck table corresponding to all of the planned dividing lines, operates the processing feed unit to relatively move the chuck table to position the chuck table directly below the imaging unit and cause the imaging unit to image the wafer;
a report creation unit that derives information on a processing state in each area based on images of two or more different areas among all the areas corresponding to the planned dividing lines that have been processed, and creates a report in which the information and the images are recorded ;
an arrangement determination unit that determines an arrangement of the two or more different areas when the number of the two or more different areas to be imaged by the imaging unit is specified;
Including,
The processing apparatus is characterized in that, when arranging the areas in each of a first direction and a second direction perpendicular to each other on the surface in accordance with the number of areas specified, the arrangement determination unit adjusts the spacing of the areas in the first direction so that the areas are equally spaced in the second direction and multiple areas are arranged at equal intervals within the width of the surface in the first direction passing through a predetermined position in the second direction . The processing device according to claim 1, characterized in that the report creation unit creates the report for the first processed wafer among the plurality of wafers contained in the cassette. The processing device according to claim 1 or 2, characterized in that the information on the processing state includes the width of the groove formed in the area corresponding to the planned division line, the state of the chipping formed in the groove, and the amount of deviation of the groove from the center line of the planned division line. The processing device according to any one of claims 1 to 3, further comprising a display unit that displays the contents of the report. 5. The processing unit according to claim 1, wherein the processing unit is either a cutting unit rotatably equipped with a cutting blade or a laser beam irradiation unit equipped with a condenser that condenses a laser beam. The processing device according to any one of the above.

Images