JP2023163591A - Inspection method of workpiece, inspection device, processing method, and processing device - Google Patents

Abstract

To easily and accurately evaluate a change in quality of processing executed to a workpiece.SOLUTION: An inspection method of inspecting a workpiece which includes a front surface formed with a device region in which a device is formed in each region in which a plurality of division schedule lines intersecting each other are set and which is sectioned by the division schedule line, in which the device region includes a plurality of small sections including a structure having the same arrangement, and in which a processing mark is formed with processing along the division schedule line, includes: a holding step of holding the workpiece with a holding table; an imaging step of creating a plurality of evaluation images by imaging the workpiece at the same imaging position in the plurality of small sections in the device region of the workpiece held by the holding table; and a display step of making a display unit display two or more evaluation images in the plurality of evaluation images. In the display step, the two or more evaluation images are displayed on the display unit according to the processing order of the small sections in each evaluation image.SELECTED DRAWING: Figure 6

Description

The present invention relates to an inspection method and an inspection apparatus for inspecting a plate-shaped workpiece when the workpiece is machined along a dividing line to form processing marks. The present invention also relates to a method of processing a workpiece, and a processing apparatus, in which a plate-shaped workpiece is processed along a planned dividing line to form processing marks, and the workpiece is inspected.

In the manufacturing process of device chips used in electronic devices such as mobile phones and computers, grid-like dividing lines called streets are set on the surface of a wafer made of a semiconductor such as silicon. For example, devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integrations) are formed in each region defined by the dividing line on the surface of the wafer. The wafer can then be divided along the streets to form individual device chips.

Devices to be formed in each region divided by the planned dividing line are formed on the surface of the wafer through a process including exposure processing using a stepper. The stepper irradiates light through a reticle to each small section to transfer a circuit pattern onto a resist, and performs an etching process to form a predetermined pattern shape on the surface of a wafer. Therefore, structures with the same arrangement are formed on the surface of the wafer in each subdivision with a reticle as a unit.

The division of a workpiece such as a wafer is performed, for example, by a cutting device having a cutting blade. The cutting device rotates a cutting blade to cut into the workpiece along a street, thereby cutting the workpiece. Further, the workpiece may be divided using a laser processing device having a laser processing unit. The laser processing device irradiates the workpiece with a laser beam along the street to perform laser processing on the workpiece.

These processing devices include an imaging unit that photographs the workpiece. The processing device uses an imaging unit to photograph processing marks formed on a workpiece processed by the processing unit. Then, the quality of the machining marks is determined, such as whether the machining marks are formed at the planned positions and whether there are large chips on the edges of the machining marks (see, for example, Patent Documents 1 to 5). This feature is called kerf check.

In the control unit of the processing device, each evaluation item, evaluation method, allowable value of each judgment item, etc. are registered as judgment conditions used in the kerf check. Then, when determining the quality of machining marks formed on the workpiece, the registered determination conditions are read out and used. Furthermore, the position of the workpiece to be imaged by the imaging unit for kerf check is registered in the control unit. The operator registers an arbitrary position on the surface of the workpiece as an imaging location in the control unit.

Japanese Patent Application Publication No. 2005-197492 Japanese Patent Application Publication No. 2013-74198 Japanese Patent Application Publication No. 2010-10445 Japanese Patent Application Publication No. 2016-197702 Japanese Patent Application Publication No. 2009-246015

Structures such as TEGs and electrodes are formed on lines where a workpiece such as a wafer is to be divided. The condition and quality of machining marks formed on the workpiece along the planned dividing line are influenced by structures formed at the machining locations. Therefore, even if each part of the planned dividing line is processed in the same way, there will be variations in the processing marks formed at each part due to the structures formed at those places.

In the case where the imaging location for the kerf check is arbitrarily determined by the operator, it is possible to perform the kerf check at each imaging location and individually evaluate the quality of the machining marks formed at the location. However, it is not easy to accurately evaluate changes in the quality of machining while machining of a workpiece progresses with a machining device by eliminating the influence of variations caused by structures formed at each imaging location. do not have.

The present invention has been made in view of such problems, and its purpose is to provide an inspection method that can inspect a workpiece and easily and accurately evaluate changes in the quality of processing performed on the workpiece. and to provide inspection equipment, processing methods, and processing equipment.

According to one aspect of the present invention, a plurality of planned division lines that intersect with each other are set, and a device region is provided on a surface in which a device is formed in each region partitioned by the planned division lines, and the device regions are arranged mutually. is an inspection method for inspecting a workpiece that has a plurality of subdivisions including the same structure and that has been processed along the dividing line and has processing marks formed thereon, the workpiece is placed on a holding table. a holding step of holding the workpiece on the holding table facing a holding surface; and holding the workpiece at the same imaging position in each of the plurality of small sections of the device area of the workpiece held on the holding table. an imaging step of imaging a workpiece to create a plurality of evaluation images; and a display step of displaying two or more of the evaluation images on a display unit, the display step There is provided a method for inspecting a workpiece, characterized in that two or more evaluation images are displayed on the display unit in accordance with the processed order of the small sections appearing in the respective evaluation images.

Preferably, in the display step, the two or more evaluation images are arranged in the order and displayed on the display unit. Alternatively, preferably, in the display step, the two or more evaluation images are sequentially displayed in the order on the display unit.

Preferably, after the holding step and before the imaging step, a plurality of detection images are created by imaging a plurality of locations on the surface of the workpiece, and each of the plurality of detection images is a small section detection step of detecting the plurality of small sections included in the device area based on the imaging position on the surface of the object and the structure appearing in each of the plurality of detection images; After the step, the method further includes an imaging position determination step of determining the imaging position in the plurality of small sections of the workpiece imaged in the imaging step.

According to another aspect of the present invention, there is provided a device region on the surface in which a plurality of planned division lines that intersect with each other are set and a device is formed in each region partitioned by the planned division lines, and the device region is An inspection device for inspecting a workpiece that has a plurality of subdivisions including structures arranged in the same manner as each other and that has been processed along the planned dividing line to form processing marks, and has a holding surface, a holding table that holds the workpiece in contact with the holding surface; an imaging unit that images the workpiece held on the holding table to create a captured image; the holding table; and the imaging unit. , a display unit that displays the captured image created by the imaging unit, and a control unit. a small section storage unit that stores the arrangement of the plurality of small sections on the surface of the workpiece; an imaging position storage section that stores the same imaging position in the plurality of small sections; the holding table; and the imaging unit. , the feeding unit, and refers to the arrangement stored in the small section storage section and the imaging position stored in the imaging position storage section, and performs the imaging of the plurality of small sections. an evaluation image creation instruction section that causes the imaging unit to image the workpiece at each position to create a plurality of evaluation images; a display control unit for displaying the two or more evaluation images on the display unit according to the processed order of the small sections appearing in each of the evaluation images. An apparatus for inspecting a workpiece characterized by the present invention is provided.

Preferably, the display control section arranges the two or more evaluation images in the order and displays them on the display unit. Alternatively, preferably, the display control section sequentially displays the two or more evaluation images in the order on the display unit.

Preferably, the control unit controls the holding table, the imaging unit, and the feeding unit to target a plurality of locations on the surface of the workpiece held by the holding table. Cause the imaging unit to capture images to create a plurality of detection images, and based on the imaging position on the surface of each of the plurality of detection images and the structure reflected in each of the plurality of detection images, a small section detection unit that detects the plurality of small sections of the device area; and a small section detection section that determines the imaging position in the plurality of small sections of the workpiece detected by the small section detection section; It further includes an imaging position determination unit that stores the imaging position in the imaging position storage unit.

According to still another aspect of the present invention, the device region has a device region on the surface in which a plurality of planned division lines that intersect with each other are set and a device is formed in each region partitioned by the planned division lines, and the device region is a processing method for processing a workpiece having a plurality of small sections including structures arranged in the same way along the dividing line, the workpiece being faced to a holding surface of a holding table, a holding step of holding the workpiece on a table, a processing step of processing the workpiece held on the holding table along a plurality of lines to be divided, and simultaneously with the processing step or the processing After the step, an imaging step of imaging the workpiece at the same imaging position in each of the plurality of small sections of the device area of the workpiece held on the holding table to create a plurality of evaluation images. and a displaying step of displaying two or more of the plurality of evaluation images on a display unit, and in the displaying step, the two or more evaluation images are displayed on each of the evaluation images. There is provided a method for processing a workpiece, characterized in that the displayed small sections are displayed on the display unit in accordance with the order in which the small sections are processed in the processing step.

Preferably, in the display step, the two or more evaluation images are arranged in the order and displayed on the display unit. Alternatively, preferably, in the display step, the two or more evaluation images are sequentially displayed in the order on the display unit.

Preferably, in the processing step, the workpiece is processed with a cutting blade to form processing marks on the workpiece, and the evaluation image created in the imaging step includes the processing marks. Take a picture. Alternatively, preferably, in the processing step, the workpiece is irradiated with a laser beam to form processing marks, and the evaluation image created in the imaging step includes the processing marks or the laser beam. The light emitted from the workpiece when it is irradiated is captured.

According to still another aspect of the present invention, the surface has a device area in which a plurality of planned division lines that intersect with each other are set and a device is formed in each area partitioned by the planned division lines, and the device A processing device for processing a workpiece having a plurality of small sections whose regions include structures arranged the same as each other along the planned division line, the workpiece having a holding surface and in contact with the holding surface. a holding table that holds an object; a processing unit that processes the workpiece held on the holding table; and an imaging unit that images the workpiece held on the holding table to create a captured image; A feeding unit that relatively moves the holding table and the imaging unit in a direction parallel to the holding surface, a display unit that displays the captured image created by the imaging unit, and a control unit. The control unit includes a processing control section that controls the holding table and the processing unit to cause the processing unit to process the workpiece along the planned dividing line; a small section storage unit that stores the arrangement of the plurality of small sections on the surface; an imaging position storage section that stores the same imaging position in the plurality of small sections; and a processing control section that causes the processing unit to perform the processing. After or simultaneously with the processing of the object, the holding table, the imaging unit, and the feeding unit are controlled to store the arrangement and the imaging position stored in the small section storage section. an evaluation image creation instruction for causing the imaging unit to image the workpiece at each of the imaging positions of the plurality of small sections and create a plurality of evaluation images; and a display control section that causes the display unit to display two or more of the evaluation images among the plurality of evaluation images, and the display control section displays the two or more evaluation images for each of the evaluation images. There is provided an apparatus for processing a workpiece, characterized in that the display unit displays the small sections in the evaluation image in the order in which they were processed by the processing unit.

Preferably, the display control section arranges the two or more evaluation images in the order and displays them on the display unit. Alternatively, preferably, the display control section sequentially displays the two or more evaluation images in the order on the display unit.

Preferably, the processing unit is a cutting unit that cuts the workpiece with a cutting blade, and the evaluation image created by the imaging unit includes the image of the workpiece being cut with the cutting blade. The machining marks formed are visible. Alternatively, preferably, the processing unit is a laser processing unit that processes the workpiece by irradiating the workpiece with a laser beam, and the evaluation image created by the imaging unit includes the laser beam. A machining mark formed on the workpiece when the laser beam is irradiated or light emitted from the workpiece when the laser beam is irradiated is captured.

In a workpiece inspection method, inspection apparatus, processing method, and processing apparatus according to one aspect of the present invention, a workpiece whose surface device region has a plurality of small sections including structures arranged in the same manner as each other is inspected. . The workpiece is held on a holding table, and the front side is imaged. Two or more evaluation images among the plurality of evaluation images created are displayed on the display unit. At this time, each evaluation image is displayed on the display unit in accordance with the processed order of the small sections appearing in the evaluation image.

The evaluation images are created by imaging the workpiece at the same imaging position in each of a plurality of small sections of the workpiece. Therefore, the plurality of evaluation images displayed on the display unit include processing marks and the like formed by processing the workpiece in the same way. Therefore, it is possible to verify changes in machining quality while machining of a workpiece is progressing with the machining device, with the influence of variations due to structures and the like at each imaging location being eliminated.

Furthermore, since the plurality of evaluation images displayed on the display unit have the same arrangement of background structures, etc., it becomes easy to compare processing marks, etc. appearing in each evaluation image. Therefore, an operator who visually checks the display unit to inspect the quality of the processing result of the workpiece can perform the inspection extremely easily and with high precision.

Therefore, the present invention provides an inspection method, an inspection device, a processing method, and a processing device that can inspect a workpiece and easily and accurately evaluate changes in the quality of processing performed on the workpiece.

FIG. 2 is a perspective view schematically showing a processing device that can function as an inspection device. FIG. 2 is a perspective view schematically showing a workpiece being processed by the processing unit. FIG. 3 is a plan view schematically showing the front side of the workpiece. FIG. 2 is an enlarged plan view partially showing a device region on the surface of the workpiece. FIG. 2 is a plan view schematically showing an example of an evaluation image. FIG. 3 is a plan view schematically showing an example of a display of a display unit. FIG. 7 is a plan view schematically showing another example of the display of the display unit. FIG. 3 is a plan view schematically showing a workpiece being processed by another processing unit. It is a flowchart which shows the flow of each step of the processing method and inspection method of a workpiece.

Embodiments according to one aspect of the present invention will be described with reference to the accompanying drawings. In the inspection method, inspection apparatus, processing method, and processing apparatus according to the present embodiment, a workpiece such as a wafer made of a semiconductor is inspected. FIG. 2 is a perspective view schematically showing the workpiece 1 being processed by the processing device, and FIG. 3 is a plan view schematically showing the surface 1a side of the workpiece 1. FIG. 4 is an enlarged plan view schematically showing a part of the surface 1a of the workpiece 1. As shown in FIG. First, the workpiece 1 will be explained.

The workpiece 1 is a wafer made of a material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductors. Alternatively, it is a wafer formed from a double oxide such as LT (lithium tantalate) or LN (lithium niobate).

Alternatively, the workpiece 1 is a substantially disk-shaped substrate made of a material such as sapphire, glass, or quartz. Examples of the glass include alkali glass, non-alkali glass, soda lime glass, lead glass, borosilicate glass, and quartz glass. Alternatively, the workpiece 1 may be a package substrate formed by arranging a plurality of device chips in a matrix and sealing them with resin. Hereinafter, the case where the workpiece 1 is a semiconductor wafer will be described as an example, but the workpiece 1 is not limited to this.

The surface 1a of the workpiece 1 is divided by a plurality of dividing lines 3 that intersect with each other. Devices 5 such as ICs and LSIs are formed in each region of the surface 1a of the workpiece 1 divided by the dividing line 3. There are no restrictions on the type, quantity, arrangement, etc. of the devices 5. By dividing the workpiece 1 along the dividing line 3, individual device chips each including a device 5 can be formed. The area on the surface 1a of the workpiece 1 where the devices 5 are lined up is called a device area 5a, and the area around it is called an extra peripheral area 5b.

The device 5 is formed, for example, by a common photolithography process. That is, an insulating film, a metal film, etc. are formed on the surface 1a of the workpiece 1, or a photoresist is applied on the workpiece 1 without forming a film. Next, using an exposure device called a stepper, the photoresist is irradiated with light through a photomask called a reticle on which a pattern such as a circuit is drawn. Thereafter, a developing step is performed to expose the surface 1a of the workpiece 1 at predetermined locations, and unnecessary portions are removed by etching.

Device 5 is formed by repeating this photolithography process. Furthermore, while the photolithography process is repeated, structures 13 such as TEG and electrodes, which are used before the workpiece 1 is divided, are formed on the dividing line 3 on the surface 1a of the workpiece 1. Ru.

Here, after applying a photoresist to the surface 1a of the workpiece 1, when exposing the photoresist using a reticle, various parts of the surface 1a are sequentially exposed while moving the exposure area one after another. Therefore, as shown in FIG. 4, on the surface 1a of the workpiece 1, a plurality of small sections 15 in which various structures are arranged in the same manner are formed adjacent to each other. In other words, the device region 5a on the surface 1a of the workpiece 1 has a plurality of small sections 15 including structures arranged in the same way, each having a reticle as a unit.

In the example shown in FIG. 4, each small section 15 is divided by four planned dividing lines 3 along one direction and five planned dividing lines 3 along the other direction, and has 12 divided sections. It includes a device 5 and three structures 13. However, the configuration of the small section 15 is not limited to this. That is, the number and arrangement of structures 13 such as the dividing lines 3, devices 5, and TEGs included in one small section 15 are not limited to these.

Note that the surface 1a of the workpiece 1 may be exposed simultaneously in a plurality of small sections 15 using one reticle. That is, each small section 15 does not have to be based on a reticle. In other words, each small section 15 and the area of the reticle that is simultaneously exposed at one time do not necessarily have to coincide. In any case, the device region 5a on the surface 1a of the workpiece 1 has small sections 15 containing structures having the same arrangement and shape.

FIG. 2 schematically shows a perspective view of a frame unit 11 including a workpiece 1 to be processed by the processing device. When the workpiece 1 is carried into the processing apparatus, the workpiece 1, the adhesive tape 7, and the ring frame 9 are integrated to form a frame unit 11. The workpiece 1, in the form of a frame unit 11, is then carried into a processing device and processed.

The frame unit 11 includes a ring frame 9 and an adhesive tape 7 pasted so as to close an opening of the ring frame 9. An adhesive tape 7 exposed through the opening of the ring frame 9 is attached to the back side 1b of the workpiece 1. That is, the workpiece 1 is supported by the ring frame 9 via the adhesive tape 7. Note that instead of the adhesive tape 7, a non-adhesive resin sheet such as a polyolefin-based or polyester-based material may be integrated with the workpiece 1 and the ring frame 9 by thermocompression bonding to form the frame unit 11. good.

Next, an inspection device and a processing device that implement the inspection method according to this embodiment will be described. For example, an inspection device and a processing device that inspect the workpiece 1 inspect the workpiece 1 that has been processed along the planned dividing line 3 and has processing marks formed thereon. Alternatively, the inspection device and processing device according to the present embodiment process the workpiece 1 along the dividing line 3 and inspect the processed workpiece 1.

Hereinafter, a processing apparatus used for processing and inspecting the workpiece 1 will be described as an example of an inspection apparatus and a processing apparatus that carry out the inspection method according to the present embodiment. FIG. 1 is a perspective view schematically showing a cutting device 2, which is an example of a processing device. Hereinafter, a case where the processing device is the cutting device 2 will be described as an example, but the processing device is not limited to the cutting device 2.

The cutting device (inspection device, processing device) 2 includes a base 4 that supports each component. An opening 4a is formed in the front corner of the base 4, and a cassette support 8 that is raised and lowered by a lifting mechanism (not shown) is provided within the opening 4a. A cassette 10 that accommodates a plurality of workpieces 1 is mounted on the upper surface of the cassette support base 8 . Note that in FIG. 1, only the outline of the cassette 10 is shown for convenience of explanation.

A rectangular opening 4b is formed on the side of the cassette support base 8 so that the longitudinal direction thereof extends along the X-axis direction (back-and-forth direction, processing feed direction). A ball screw type X-axis moving mechanism (not shown), and a table cover 14 and a dust-proof and drip-proof cover 16 that cover the upper part of the X-axis moving mechanism are arranged in the opening 4b. The X-axis moving mechanism includes an X-axis moving table (not shown) covered by a table cover 14, and moves this X-axis moving table in the X-axis direction.

A holding table 18 is disposed on the upper surface of the X-axis moving table so as to be exposed from the table cover 14. The holding table 18 functions, for example, as a chuck table that suctions and holds the workpiece 1 placed on the holding surface 18a exposed above. The holding table 18 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis that is generally parallel to the Z-axis direction (vertical direction).

The holding table 18 includes a porous member 18c having the same diameter as the workpiece 1, and a frame body that covers the porous member 18c. A suction path (not shown) is formed inside the holding table 18 and one end thereof is connected to a suction source (not shown) such as an ejector provided outside the holding table 18 . The other end of the suction path reaches the porous member 18c.

The upper surface of the porous member 18c is exposed on the holding surface 18a of the holding table 18. The upper surface of the porous member 18c has the same diameter as the workpiece 1, and is formed approximately parallel to the X-axis direction and the Y-axis direction. Further, around the holding table 18, a plurality of clamps 18b are provided for fixing the ring frame 9 that supports the workpiece 1 from the periphery.

When holding the workpiece 1 on the holding table 18, first, the workpiece 1 is made to face the holding surface 18a, and the frame unit 11 is placed on the holding surface 18a of the holding table 18. Then, the suction source and the porous member 18c are connected through the suction path, and negative pressure is applied to the workpiece 1 through the adhesive tape 7. Then, the workpiece 1 is held by the holding table 18.

The cutting device 2 includes a transport unit (not shown) that transports the workpiece 1 to a holding table 18 or the like in a region adjacent to the opening 4b. A temporary placement mechanism for temporarily placing the workpiece 1 is provided at a position adjacent to the side of the cassette support stand 8 . The temporary placement mechanism includes, for example, a pair of guide rails 12 that are moved toward and away from each other while maintaining a parallel state in the Y-axis direction (indexing and feeding direction). The pair of guide rails 12 sandwich the workpiece 1 pulled out from the cassette 10 by the transport unit along the X-axis direction and adjust it to a predetermined position.

The workpiece 1 adjusted to a predetermined position is lifted up by the transport unit and transported to the holding table 18. At this time, the pair of guide rails 12 are separated from each other, and the workpiece 1 is passed between the pair of guide rails 12.

Above the holding table 18, a first processing unit 24a and a second processing unit 24b that cut (process) the workpiece 1 with an annular cutting blade are provided. A gate-shaped support structure 20 for supporting the first processing unit 24a and the second processing unit 24b is arranged on the upper surface of the base 4 so as to straddle the opening 4b.

At the upper front surface of the support structure 20, there is a first moving unit 22a that moves the first processing unit 24a in the Y-axis direction and the Z-axis direction, and a first moving unit 22a that moves the second processing unit 24b in the Y-axis direction and the Z-axis direction. A second moving unit 22b is provided. The first moving unit 22a includes a Y-axis moving plate 28a, and the second moving unit 22b includes a Y-axis moving plate 28b. The two Y-axis moving plates 28a and 28b are slidably mounted on a pair of Y-axis guide rails 26 arranged along the Y-axis direction on the front surface of the support structure 20.

A nut portion (not shown) is provided on the back side (rear side) of the Y-axis moving plate 28a, and a Y-axis ball screw 30a that is approximately parallel to the Y-axis guide rail 26 is screwed into this nut portion. ing. Further, a nut portion (not shown) is provided on the back side (rear side) of the Y-axis moving plate 28b, and a Y-axis ball screw 30b approximately parallel to the Y-axis guide rail 26 is screwed into this nut portion. are combined.

A Y-axis pulse motor 32a is connected to one end of the Y-axis ball screw 30a. By rotating the Y-axis ball screw 30a by the Y-axis pulse motor 32a, the Y-axis moving plate 28a moves in the Y-axis direction along the Y-axis guide rail 26. Further, a Y-axis pulse motor (not shown) is connected to one end of the Y-axis ball screw 30b. By rotating the Y-axis ball screw 30b by the Y-axis pulse motor, the Y-axis moving plate 28b moves in the Y-axis direction along the Y-axis guide rail 26.

A pair of Z-axis guide rails 34a are provided on the surface (front) side of the Y-axis moving plate 28a along the Z-axis direction, and a pair of Z-axis guide rails 34a are provided on the surface (front) side of the Y-axis moving plate 28b. A pair of Z-axis guide rails 34b are provided along. Furthermore, a Z-axis moving plate 36a is slidably attached to the pair of Z-axis guide rails 34a, and a Z-axis moving plate 36b is slidably attached to the pair of Z-axis guide rails 34b.

A nut portion (not shown) is provided on the back side (rear side) of the Z-axis moving plate 36a, and a nut portion (not shown) is provided along a direction generally parallel to the Z-axis guide rail 34a. A Z-axis ball screw 38a is screwed together. A Z-axis pulse motor 40a is connected to one end of the Z-axis ball screw 38a, and by rotating the Z-axis ball screw 38a with the Z-axis pulse motor 40a, the Z-axis moving plate 36a is moved along the Z-axis guide rail 34a. to move in the Z-axis direction.

A nut portion (not shown) is provided on the back side (rear side) of the Z-axis moving plate 36b, and a nut portion (not shown) is provided along a direction generally parallel to the Z-axis guide rail 34b. A Z-axis ball screw 38b is screwed together. A Z-axis pulse motor 40b is connected to one end of the Z-axis ball screw 38b, and by rotating the Z-axis ball screw 38b by the Z-axis pulse motor 40b, the Z-axis moving plate 36b is moved along the Z-axis guide rail 34b. to move in the Z-axis direction.

A first processing unit 24a is provided below the Z-axis moving plate 36a. At a position adjacent to the first processing unit 24a, an imaging unit 46a is provided for photographing the workpiece 1 held by the holding table 18 under suction. Further, a second processing unit 24b is provided below the Z-axis moving plate 36b. An imaging unit 46b for photographing the workpiece 1 suction-held by the holding table 18 is provided at a position adjacent to the second processing unit 24b.

The imaging units 46a and 46b include, for example, a photoelectric conversion element that receives light and converts it into an electrical signal, and a lens that focuses on the upper surface of the workpiece 1 held on a holding table. The photoelectric conversion element is, for example, a CMOS sensor or a CCD sensor. The imaging units 46a and 46b have a function of capturing an image of the upper surface (for example, the surface 1a) of the workpiece 1 to create a captured image, and transmitting the captured image to a control unit 56, which will be described later.

The first moving unit 22a controls the Y-axis and Z-axis positions of the first processing unit 24a and the imaging unit 46a, and the second moving unit 22b controls the Y-axis positions of the second processing unit 24b and the imaging unit 46b. The axial and Z-axis positions are controlled. The positions of the first processing unit 24a, etc., and the positions of the second processing unit 24b, etc. are each independently controlled.

To explain from another perspective, the cutting device 2 holds the holding table 18, the processing units 24a, 24b, and the imaging units 46a, 46b on the holding table in a direction parallel to the holding surface 18a of the holding table 18 (X-axis direction, Y-axis direction). (direction). This feeding unit is composed of the above-mentioned X-axis moving mechanism and moving units 22a and 22b.

FIG. 2 is a perspective view schematically showing a workpiece 1 that is cut by a processing unit 24 (first processing unit 24a or second processing unit 24b) that includes a cutting blade 44 as a processing tool. Note that, in FIG. 2, the clamp 18b of the holding table 18, the imaging units 46a, 46b, etc. are omitted. The processing unit (cutting unit) 24 includes an annular cutting blade 44 and a spindle (not shown) penetrated through a central through hole of the cutting blade 44. Rotating the spindle allows the cutting blade 44 to rotate.

The cutting blade 44 includes a grindstone portion on its outer periphery that includes countless abrasive grains such as diamond and a bond that disperses and fixes the abrasive grains. When the grindstone portion is brought into contact with the workpiece 1 along the planned dividing line 3 while rotating the cutting blade 44, the workpiece 1 is cut and a machining mark 3a is formed.

When processing the workpiece 1, first, the surface 1a of the workpiece 1 held on the holding table 18 is photographed by the imaging units 46a and 46b, and the planned dividing line 3 is detected. Then, the holding table 18 is rotated around an axis perpendicular to the holding surface 18a so that the extending direction of the planned dividing line 3 and the processing feed direction (X-axis direction) match. After that, the cutting blade 44 is positioned above the end of the planned dividing line 3 and the cutting blade 44 is rotated.

Thereafter, the processing unit 24 is lowered so that the lower end of the cutting blade 44 reaches the adhesive tape 7 below the back surface 1b of the workpiece 1. Then, when the workpiece 1 is processed and fed along the X-axis direction, the workpiece 1 is cut and a processing mark (cutting groove) 3a is formed along the dividing line 3. After machining the workpiece 1 along one dividing line 3, the processing unit 24 is indexed and fed in the Y-axis direction perpendicular to the X-axis direction, and the workpiece 1 is similarly machined along the other dividing line 3. Process 1.

After processing the workpieces 1 one after another in this way and processing the workpieces 1 along all the dividing lines 3 along one direction, the holding table 18 is rotated around an axis perpendicular to the holding surface 18a. and align the scheduled dividing line 3 along the other direction with the processing feed direction. Thereafter, the workpieces 1 are processed one after another along the dividing lines 3 along other directions. When the workpiece 1 is machined along all the planned division lines 3 and the machining marks 3a are formed, the machining of the workpiece 1 by the cutting device 2 is completed.

The processing unit 24 further includes a cutting water supply nozzle 24c that supplies cutting water such as pure water to the workpiece 1 to be processed. When the workpiece 1 is cut with the cutting blade 44, cutting waste is generated from the workpiece 1 and the cutting blade 44. Further, heat is generated due to friction between the workpiece 1 and the cutting blade 44. When the cutting water supply nozzle 24c is supplied while the workpiece 1 is being processed, cutting waste and heat are removed by the cutting water.

The cutting device (processing device) 2 will be further explained using FIG. An opening 4c is formed at a position opposite to the opening 4a with respect to the opening 4b. A cleaning unit 48 for cleaning the workpiece 1 is disposed within the opening 4c, and the workpiece 1 processed on the holding table 18 is cleaned by the cleaning unit 48. The workpiece 1 cleaned by the cleaning unit 48 is stored in the cassette 10 again.

Further, the cutting device 2 includes a display unit 50 that can display various information and the like. The display unit 50 displays information indicating the state of the cutting device 2 and the workpiece 1, information indicating the progress of machining, information indicating the presence or absence of an abnormality, etc., and displays these information for the user of the cutting device 2. Or notify the administrator, etc. Furthermore, the display unit 50 has a function of displaying images taken by the imaging units 46a and 46b. The display unit 50 is, for example, a monitor such as a liquid crystal display.

Further, the display unit 50 may include an input device (input interface) such as a touch panel. If the display unit 50 is a display with a touch panel, the user of the cutting device 2 can operate the cutting device 2 by inputting various commands and the like to the cutting device 2 using the display unit 50. In this case, the display unit 50 displays an operation screen.

Further, the cutting device (inspection device, processing device) 2 includes a control unit 56 that controls each component of the cutting device 2. The control unit 56 includes a feeding unit including an X-axis direction movement mechanism and movement units 22a and 22b, processing units 24a and 24b, imaging units 46a and 46b, a holding table 18, a cleaning unit 48, a display unit 50, and various types of conveyance. Control equipment, etc.

The control unit 56 controls each component to advance the processing of the workpiece 1 in the cutting device 2. Further, when the cutting device 2 functions as an inspection device, the control unit 56 controls each component to progress the inspection of the workpiece 1.

The control unit 56 is configured by a computer including, for example, a processing device such as a CPU or a microprocessor, and a storage device such as a flash memory or a hard disk drive. By operating the processing device according to software such as a program stored in the storage device, the processing device functions as a concrete means in which the software and the processing device (hardware resources) cooperate.

The control unit 56 includes a storage section 58 that stores processing conditions for processing various workpieces 1 by the processing units 24a and 24b, various information, and the like. That is, the storage section 58 includes a processing condition storage section 58a that stores processing conditions.

The machining conditions stored in the machining condition storage section 58a include the type and size of the workpiece 1 to be machined, the rotational speed and cutting depth of the cutting blade 44, the machining feed rate, the cutting water injection conditions, and the machining conditions. This includes information such as the type of cutting blade 44 used. A plurality of machining conditions are registered in advance in the machining condition storage unit 58a, and conditions suitable for machining the workpiece 1 to be machined are appropriately selected and referenced.

The control unit 56 reads the machining conditions stored in the machining condition storage section 58a, and performs machining control to control the X-axis direction movement mechanism, movement units 22a, 22b, machining units 24a, 24b, holding table 18, etc. according to the machining conditions. 60. The processing control unit 60 controls each component according to predetermined processing conditions to process the workpiece 1.

In the cutting device 2, when the workpiece 1 processed by the processing units 24a and 24b is photographed by the imaging units 46a and 46b, the formed processing marks 3a can be analyzed. The analysis work for the machining marks 3a is called a kerf check. When the kerf check is performed, the quality of the machining marks 3a formed on the workpiece 1 can be monitored. For example, if a machining mark 3a with an unacceptable shape is formed on the workpiece 1, the cutting device 2 can interrupt the machining or issue a warning to the administrator of the cutting device 2 to urge inspection. .

In the storage unit 58 of the control unit 56, each evaluation item, evaluation method, allowable value of each judgment item, etc. are registered as judgment conditions used in the kerf check. Then, when determining the quality of machining marks formed on the workpiece 1, the registered determination conditions are read out and used. The control unit 56 may include a determination unit 66 that reads the determination conditions registered in the storage unit 58 and controls the imaging units 46a, 46b, the feeding unit, etc. to perform a kerf check.

Here, a structure 13 (see FIG. 4) such as a TEG or an electrode is formed on the planned dividing line 3 of the workpiece 1 such as a wafer. The condition and quality of the machining marks 3a formed on the workpiece 1 along the planned dividing line 3 are influenced by the structures 13 formed at the machining locations. Therefore, even if each part of the planned dividing line 3 is processed in the same way, there will be variations in the processing marks 3a formed at each part due to the structures 13 and the like formed at that part.

In the case where the imaging location for the kerf check is arbitrarily determined by the operator, it is possible to conduct the kerf check at each imaging location and individually evaluate the quality of the machining marks 3a formed at the location. However, changes in the quality of machining while machining of the workpiece 1 progresses with the cutting device (processing device) 2 are evaluated by excluding the influence of variations caused by structures 13 etc. formed at each imaging location. It's not easy to do.

Therefore, in the inspection device and processing device (cutting device 2) according to the present embodiment, a plurality of A plurality of evaluation images are created by imaging the workpiece 1 at the same imaging position in the small section 15. In this case, since the locations shown in each evaluation image have the same structure 13, etc., the workpiece 1 is processed in the same way at each location, and the processing marks 3a are similarly formed. That is, since there is no difference in the machining state due to the structure 13 at each location to be machined, by comparing each evaluation image, changes in the quality of machining can be easily and precisely evaluated.

The explanation of the cutting device 2 will be continued below, focusing on the configuration for inspecting changes in the quality of machining in the cutting device (inspection device, processing device) 2. The control unit 56 includes a small section storage section 58b that stores the arrangement of the plurality of small sections 15 on the surface 1a of the workpiece 1, and an imaging position storage section 58c that stores the same imaging position in the plurality of small sections 15. Equipped with

The administrator of the cutting device 2 or the like may register the arrangement of the small sections 15 on the surface 1a of the workpiece 1 in advance in the small section storage section 58b of the control unit 56. For example, when the device 5 and the like are formed by irradiating light through a reticle and performing a photolithography process, structures having the same arrangement are formed on the surface 1a of the workpiece 1 for each reticle. In this case, each irradiated area that is irradiated with light at one time may be registered as a small section 15 in the small section storage section 58b.

However, the position of the small section 15 may be stored in the small section storage section 58b using another method. For example, the control unit 56 of the cutting device 2 causes the imaging units 46a and 46b to image the workpiece 1 held on the holding table 18, and detects a small section as a repeating unit as a small section 15 from the obtained captured images. It may have a section 70.

More specifically, the small section detection unit 70 controls the holding table 18, the imaging units 46a and 46b, and the above-mentioned feeding unit to detect the surface 1a of the workpiece 1 held on the holding table 18. The imaging units 46a and 46b are caused to take images of a plurality of locations. Then, the imaging units 46a and 46b are caused to create a plurality of detection images. The small section detection unit 70 compares the created detection images and detects the same structure or the like appearing in each detection image.

Then, the small section detection unit 70 detects the plurality of small sections included in the device region 5a based on the imaging position on the surface 1a of each of the plurality of detection images and the structure that appears in each of the plurality of detection images. Section 15 is detected. In this case, the small section detection section 70 stores the arrangement of the detected small sections 15 in the small section storage section 58b of the storage section 58.

Note that when the workpiece 1 is machined by the cutting device 2, the small section detection unit 70 detects the workpiece 1 after the workpiece 1 is held by the holding table 18 and before being processed by the processing units 24a and 24b. It is preferable to detect a small section 15 on the surface 1a of the object 1.

In this way, the cutting device (inspection device, processing device) 2 may detect the small section 15 of the workpiece 1 by itself using the imaging units 46a, 46b, etc. In this case, the arrangement of the small sections 15, etc. may not be stored in the small section storage section 58b in advance.

The imaging position storage section 58c of the control unit 56 stores imaging positions at which the imaging units 46a and 46b should take images when creating evaluation images to be described later. FIG. 4 schematically shows an example of the imaging position 15a. As shown in FIG. 4, each imaging position 15a is determined to be the same position in any of the small sections 15.

The administrator of the cutting device 2 or the like may register the suitable imaging position 15a in the imaging position storage section 58c of the control unit 56 in advance. For example, an administrator or the like inputs an instruction to the control unit 56 to display an image of the small section 15 on the display unit 50, and selects a suitable position in the area of the image to obtain information regarding changes in processing quality. is selected as the imaging position 15a. Then, the selected position is designated as the imaging position 15a and registered in the imaging position storage section 58c.

However, the imaging position 15a does not need to be stored in advance in the imaging position storage section 58c. For example, the control unit 56 includes an imaging position determination unit that determines the imaging position 15a in the plurality of small divisions 15 of the workpiece 1 detected by the small division detection unit 70 and stores the imaging position 15a in the imaging position storage unit 58c. 72 may be further provided. That is, the control unit 56 may determine the imaging position 15a by itself.

For example, the imaging position determining unit 72 is configured to set a position where it can image both the region where the structure 13 such as TEG is formed and the region where the structure 13 is not formed on the planned dividing line 3 of the workpiece 1. is determined as the imaging position 15a. Thereby, the quality of processing in various processing situations can be evaluated simultaneously from each evaluation image. However, the imaging position 15a is not limited to this. The imaging position 15a in the small section 15 determined by the imaging position determination unit 72 is stored in the imaging position storage unit 58c.

The control unit 56 controls the holding table 18, the imaging units 46a and 46b, and the above-mentioned feeding unit, and causes the imaging units 46a and 46b to image the surface 1a of the workpiece 1 at a predetermined position for evaluation. It includes an evaluation image creation instruction section 62 that forms an image.

The evaluation image creation instruction section 62 reads out the arrangement of the small sections 15 stored in the small section storage section 58b and the imaging position 15a stored in the imaging position storage section 58c. Then, referring to these, the imaging units 46a and 46b are caused to image the workpiece 1 at each of the imaging positions 15a of the plurality of small sections 15, and a plurality of evaluation images are created.

FIG. 5 is a plan view schematically showing an example of the evaluation image 17. The evaluation image 17 shown in FIG. A region 21 in which the processing marks 3a are formed is shown. Furthermore, the evaluation image 17 shown in FIG. 5 also shows structures 19a and 19b such as electrode patterns and elements that constitute the device 5. The processing marks 3a are also formed on the structure 13, such as TEG, formed on the planned dividing line 3.

In the cutting device (processing device, inspection device) 2, a kerf check may be performed using this evaluation image 17. That is, the width and position of the machining mark 3a, the occurrence of chipping, etc. may be evaluated. For example, the cutting device 2 may display the evaluation image 17 on the display unit 50, and the user of the cutting device 2 can judge the quality of the machining result based on the evaluation image 17 displayed on the display unit 50. It's okay.

Alternatively, the control unit 56 may include a determination section 66 that determines the quality of the processing result etc. based on the evaluation image 17. The storage unit 58 stores in advance determination conditions for the determination unit 66 to determine the quality of processing results and the like.

Here, a kerf check for machining marks 3a on the machined workpiece 1 will be explained. In the kerf check process, for example, the off-center amount indicating the deviation between the center line of the planned dividing line 3 and the center line of the processing mark 3a, the minimum kerf width, and the maximum kerf width are evaluated. Furthermore, the size of a chip called chipping formed at the outer edge of the machining mark 3a is evaluated. A permissible value is set for each determination item. The determination unit 66 determines the quality of the machining marks 3a by determining whether these determination items fall within allowable values based on the evaluation image 17.

The storage section 58 of the control unit 56 further includes an image storage section 58d that can store and accumulate the created evaluation images 17. For example, information regarding the imaging position on the surface 1a of the workpiece 1 may be stored together with each of the evaluation images 17 in the image storage unit 58d. As described later, the imaging position of each evaluation image 17 is useful for deriving the processed order of the small sections 15 appearing in each evaluation image 17. Furthermore, in the evaluation image 17 stored in the image storage unit 58d, instead of the information regarding the imaging position, the order in which the small sections 15 photographed may be processed may be registered in association with each other.

The control unit 56 further includes a display control section 64 that causes the display unit 50 to display two or more evaluation images 17 among the plurality of evaluation images 17. The display control unit 64 does not need to display all the evaluation images 17 stored in the image storage unit 58d on the display unit 50 as display targets, but it does display all the evaluation images 17 on the display unit 50 as display targets. You may let them.

Then, the display control section 64 causes the display unit 50 to display two or more evaluation images 17 to be displayed on the display unit 50 in accordance with the processed order of the small sections 15 appearing in each evaluation image 17. Here, displaying the evaluation images 17 on the display unit 50 in this order will be described in detail.

FIG. 6 is a plan view schematically showing a display unit 50 that displays a result display screen 50a including four evaluation images 17a, 17b, 17c, and 17d. On the result display screen 50a, the evaluation images 17a, 17b, 17c, and 17d are arranged in accordance with the processed order of the small sections 15 shown in each image.

For example, the evaluation image 17a that shows the earliest processed small section 15 among the small sections 15 in each image is displayed on the upper left side of the result display screen 50a, and the evaluation image 17a that shows the next processed small section 15 is displayed. 17b is displayed on the upper right side of the evaluation image 17a. Further, an evaluation image 17c in which the next processed small section 15 is displayed is displayed on the lower left side of the result display screen 50a as the next image after the evaluation image 17b, and an evaluation image 17c in which the next processed small section 15 is shown is displayed on the lower left side of the result display screen 50a. Image 17d is displayed on the lower right side. In this way, on the result display screen 50a, the evaluation images 17a, 17b, 17c, and 17d are arranged from left to right and from top to bottom according to the processed order of the small sections 15 that appear in each image.

Here, each evaluation image 17a, 17b, 17c, and 17d is an image obtained by being imaged at the same imaging position 15a in each small section 15. Therefore, in each of the evaluation images 17a, 17b, 17c, and 17d, the structures other than the machining marks 21a, 21b, 21c, and 21d that appear are the same, and only the machining marks 21a, 21b, 21c, and 21d that are in the background are the same. different. In this case, the machining marks 21a, 21b, 21c, and 21d can be compared very easily and with high precision.

The evaluation images 17a, 17b, 17c, and 17d are then arranged on the display unit 50 in the order in which the photographed small sections 15 were processed. Therefore, it is possible to verify changes in processing quality while processing of the workpiece 1 is progressing while the influence of variations caused by the structure 13 such as TEG is eliminated.

Note that the manner in which the evaluation images 17 are displayed on the display unit 50 according to the processed order of the photographed small sections 15 is not limited to this. For example, the display control section 64 may cause the display unit 50 to sequentially display two or more evaluation images 17 in the order in which the small sections 15 that appear are processed. FIG. 7 is a plan view schematically showing the display unit 50 on which the result display screen 50b on which the evaluation images 17 are sequentially displayed in this order is displayed.

On the result display screen 50b displayed on the display unit 50, for example, a plurality of evaluation images 17 are displayed one by one in that order, switching at regular intervals. The result display screen 50b includes an operation button 54b for inputting a command to the control unit 56 to temporarily stop switching of images displayed on the display unit 50 and continue displaying one evaluation image 17. May be displayed.

Further, the result display screen 50b may display an operation button 54c used to input a command to display the next evaluation image 17 after the displayed evaluation image 17. When the operation button 54c displayed on the display unit 50 is touched by a worker or the like, the display control section 64 causes the display unit 50 to display the next evaluation image 17 in that order.

Further, an operation button 54a used for inputting a command to display the evaluation image 17 before the displayed evaluation image 17 may be displayed on the result display screen 50b. When the operation button 54a displayed on the display unit 50 is touched by a worker or the like, the display control section 64 causes the display unit 50 to display the previous evaluation image 17 in the order.

In this manner, the evaluation images 17 are sequentially displayed on the display unit 50 according to the order in which the small sections 15 shown on the display unit 50 have been processed, so that the operator or the like looking at the display unit 50 can Changes, that is, changes in processing quality, can be easily grasped intuitively and with high precision.

Next, a procedure in which the workpiece 1 is processed and inspected by the cutting device (processing device, inspection device) 2 will be explained. That is, a method for processing a workpiece (inspection method) according to the present embodiment will be explained. FIG. 9 is a flowchart showing the flow of each step of the method for processing a workpiece according to this embodiment. In the processing method, steps not shown in this flowchart may be implemented. Hereinafter, a case will be described using as an example a case where the processing method of a workpiece according to the present embodiment is implemented in the cutting device 2, but the processing method (inspection method) may be implemented in another processing device (inspection device), etc. Good too.

In this processing method, a surface 1a has a device region 5a in which a device 5 is formed in each region divided by a plurality of division lines 3 that intersect with each other, and the device region 5a includes a plurality of structures having the same arrangement. This is a processing method for processing a workpiece 1 having a small section 15 of . In this processing method, the workpiece 1 is carried out from the cassette 10 placed on the cassette support stand 8, the workpiece 1 is made to face the holding surface 18a of the holding table 18, and the workpiece 1 is held by the holding table 18. A holding step S10 is carried out.

In the holding step S10, the workpiece 1 in the frame unit 11 (see FIG. 2) may be transported to the holding table 18. At this time, the adhesive tape 7 may be attached to the back surface 1b side of the workpiece 1 to expose the front surface 1a, or the adhesive tape 7 may be stuck to the front surface 1a side of the workpiece 1 to expose the back surface 1b. may be done.

When the workpiece 1 is placed on the holding surface 18a of the holding table 18 via the adhesive tape 7, the ring frame 9 is gripped by the clamp 18b, and negative pressure is applied to the workpiece 1 through the holding surface 18a, the holding table 18 The workpiece 1 can be held by suction.

Next, a processing step S20 is performed in which the workpiece 1 held on the holding table 18 is processed along a plurality of planned division lines 3. The processing step S20 may be performed, for example, by the function of the processing control section 60 of the control unit 56. The processing control section 60 reads predetermined processing conditions stored in the processing condition storage section 58a of the storage section 58, and controls each component of the cutting device 2 according to the processing conditions to advance processing of the workpiece 1.

In the machining step S20, first, the holding table 18 is rotated to align one dividing line 3 of the workpiece 1 with the X-axis direction (machining feed direction). Then, the X-axis moving mechanism or the like is operated so as to position the cutting blade 44 on an extension of one dividing line 3. At this time, it is preferable to take an image of the workpiece 1 using the imaging units 46a and 46b to confirm the position and direction of the planned dividing line 3.

Then, the rotation of the cutting blade 44 is started, the moving units 22a and 22b are operated to lower the rotating cutting blade 44, and the lower end of the cutting blade 44 is positioned between the upper end and the lower end of the adhesive tape 7. Then, the X-axis moving mechanism is operated to relatively move the holding table 18 that holds the workpiece 1 and the processing unit 24 along the X-axis direction. Then, the cutting blade 44 cuts the workpiece 1 along the planned dividing line 3, and a machining mark 3a is formed on the workpiece 1.

After the workpiece 1 is cut along one dividing line 3, the cutting blade 44 is raised, and the holding table 18 and processing unit 24 are relatively moved in opposite directions in the X-axis direction. Then, the workpiece 1 is similarly cut with the cutting blade 44 along another planned dividing line 3 parallel to the planned dividing line 3, thereby forming machining marks 3a on the workpiece 1 one after another. That is, at each scheduled dividing line 3, the cutting blade 44 cuts into the workpiece 1 from the same direction.

After cutting the workpiece 1 along all the dividing lines 3 along one direction, the holding table 18 is rotated around an axis perpendicular to the holding surface 18a, and the workpiece 1 is divided along the other direction. The workpiece 1 is similarly cut along the planned line 3. When the workpiece 1 is cut along all the dividing lines 3 and machining marks 3a are formed along all the dividing lines 3, cutting of the workpiece 1 is completed.

When the machining step S20 is performed to form the machining marks 3a on the workpiece 1, the workpiece 1 is divided into individual chips. The formed individual chips are subsequently supported by the adhesive tape 7. Here, if the quality of the machining marks 3a formed on the workpiece 1 is poor, the chip becomes a defective product. Therefore, a kerf check on the formed machining marks 3a and an inspection in which a captured image showing the machining marks 3a is displayed on the display unit 50 and the operator or the like evaluates the machining quality are performed.

Next, the imaging step S30 will be explained. The imaging step S30 is performed, for example, after the machining step S20 is performed and the machining mark 3a is formed on the workpiece 1. In the imaging step S30, the workpiece 1 is imaged at the same imaging position in each of the plurality of small sections 15 of the device area 5a of the workpiece 1 held on the holding table 18, and a plurality of evaluation images 17 (FIG. reference). In the imaging step S30, for example, imaging units 46a and 46b are used.

The evaluation image creation instructing section 62 of the control unit 56 reads information regarding the imaging position from the imaging position storage section 58c, and adjusts the positions of the holding table 18 and the imaging units 46a, 46b while setting each imaging position on the workpiece 1. The images of the workpieces 1 are taken one after another. Then, a plurality of evaluation images 17 are obtained.

The obtained evaluation image 17 is stored, for example, in the image storage section 58d of the control unit 56. As will be explained later, in order to display each evaluation image 17 on the display unit 50 in accordance with the processed order of the small sections 15 appearing in each evaluation image 17, the image storage unit 58d stores each evaluation image 17 along with each evaluation image 17. It is preferable that the imaging position when the evaluation image 17 is created is saved. In this case, the processed order of the small sections 15 appearing in each evaluation image 17 can be derived based on the imaging position of each evaluation image 17.

Alternatively, when each evaluation image 17 is created by the imaging units 46a and 46b and each evaluation image is stored in the image storage section 58d, the image storage section 58d stores the small section 15 that appears in each evaluation image 17. The processed order may be saved together with each evaluation image 17.

Here, the order in which each small section 15 of the workpiece 1 is processed in the processing step S20 and the order in which each small section 15 is imaged in the imaging step S30 will be described in detail. In the machining step S20, the rotating cutting blade 44 cuts (processes) the workpiece 1 by cutting from one side to the other in the machining feed direction on all the planned division lines 3 that are parallel to each other. One of the reasons for this is that when the cutting blade 44, which continues to rotate in a constant rotational direction, cuts from the other side of the machining feed direction to one side, the machining quality changes.

Therefore, after cutting the workpiece 1 with the cutting blade 44 from one side to the other in the processing feed direction along one dividing line 3, the cutting blade 44 is raised and the cutting blade 44 is moved to one side in the processing feed direction. Return to Then, the workpiece 1 is cut by the cutting blade 44 along the next planned dividing line 3 from one side to the other in the processing feed direction.

On the other hand, in the imaging step S30, the relative moving direction of the workpiece 1 and the imaging units 46a, 46b does not affect the content of the evaluation image 17 that is created. Therefore, first, images are taken sequentially from one side of the processing feed direction to the other at a group of imaging positions lined up along the processing feed direction, and then when images are taken at the next group of imaging positions lined up along the processing feed direction. , images may be taken sequentially from the other side to the one side in the processing feed direction. In this case, the relative moving distance between the workpiece 1 and the imaging units 46a and 46b can be reduced.

Therefore, the order in which the small sections 15 shown in each evaluation image 17 are processed in the processing step S20 and the order in which they are imaged in the imaging step S30 do not necessarily match. Therefore, information for specifying the processed order of the small sections 15 that appear in each evaluation image 17 later is stored in the image storage unit 58d together with each evaluation image 17. The information regarding the imaging position of each evaluation image 17 can be said to be information for specifying the order in which the small sections 15 appearing in each evaluation image 17 were processed.

Note that the imaging step S30 may be performed simultaneously with the processing step S20. For example, the workpiece 1 is cut by the cutting blade 44 from one side of the processing feed direction to the other along one planned dividing line 3 . Thereafter, when the cutting blade 44 is relatively returned to one side in the processing feed direction, the imaging units 46a and 46b sequentially image the workpiece 1 at each imaging position along this planned dividing line 3.

Alternatively, while cutting the workpiece 1 with the cutting blade 44 along one planned dividing line 3, images are taken at each imaging position along this scheduled dividing line 3 using the imaging units 46a and 46b that follow the processing unit 24. It's okay. Alternatively, while cutting the workpiece 1 along one dividing line 3 with the cutting blade 44, the imaging units 46a and 46b may be moved along another already cut (processed) dividing line 3. Images may be taken at each imaging position.

In these methods, the workpiece 1 is imaged at each imaging position while the workpiece 1 is successively cut along each planned dividing line 3 . In this way, when the processing step S20 and the imaging step S30 are performed simultaneously, a dedicated moving operation for positioning the imaging units 46a, 46b at each imaging position becomes unnecessary. In other words, the total relative movement distance between the workpiece 1 through the processing step S20 and the imaging step S30, and the processing unit 24 and imaging units 46a and 46b is shortened, which is efficient.

Next, a display step S40 is performed in which two or more of the plurality of evaluation images 17 are displayed on the display unit 50. The display step S40 is performed, for example, by the function of the display control section 64 of the control unit 56. The display control section 64 may cause the display unit 50 to display all of the evaluation images 17 among the plurality of evaluation images 17 stored in the image storage section 58d. Alternatively, the display control section 64 may not display some of the evaluation images 17 among the plurality of evaluation images 17 on the display unit 50.

Here, in the display step S40, two or more evaluation images 17 are displayed on the display unit 50 according to the order in which the small sections 15 appearing in each evaluation image 17 were processed in the processing step S20. For example, as described using FIG. 6, in the display step S40, the small sections 15 in which two or more evaluation images 17 appear may be arranged in the processed order and displayed on the display unit 50. Alternatively, as described using FIG. 7, in the display step S40, two or more evaluation images 17 may be sequentially displayed on the display unit 50 in this order.

When the two or more evaluation images 17 are displayed on the display unit 50 according to the processed order of the photographed small sections 15 in the display step S40, the operator can view each evaluation image 17 displayed on the display unit 50. It is possible to easily understand changes in processing quality based on In particular, since the various structures serving as the background appear in the same manner in each of the evaluation images 17, changes in the machining marks 3a can be easily grasped. Furthermore, since there is no difference in the structures at each imaging position, changes in the machining situation caused by the structures of the workpiece 1 can be excluded, and changes in the quality of machining can be easily and accurately evaluated.

In addition, regarding the case where the workpiece 1 is processed by the cutting blade 44 in the processing step S20 and a processing mark 3a is formed on the workpiece 1, and the processing mark 3a is reflected in the evaluation image 17 created in the imaging step S30. Mainly explained. However, the processing step S20 and the imaging step S30 are not limited to this.

For example, the method for processing the workpiece 1 according to the present embodiment may be performed using a laser processing device that includes a laser processing unit instead of the cutting device 2. The laser processing unit includes, for example, a laser oscillator and an optical system including a lens that focuses a laser beam emitted from the laser oscillator onto a workpiece.

For example, in the processing step S20, the workpiece 1 is irradiated with a laser beam of a wavelength that is absorbed by the workpiece 1, and the workpiece 1 is laser processed (ablation processing) and divided along the dividing line 3. Processing marks 3a such as grooves may be formed. Alternatively, in the processing step S20, a laser beam having a wavelength that can pass through the workpiece 1 is focused on the workpiece, and the workpiece 1 is laser-processed along the dividing line 3 to form a modified layer or the like. A mark 3a may also be formed. In these cases, the processing marks 3a appear in the evaluation image 17 created in the imaging step S30.

Furthermore, when the workpiece 1 is irradiated with a laser beam in processing step S20, light of a specific wavelength (plasma light) is emitted from the processing point. This light changes depending on the material of the structure of the workpiece 1 provided at the processing point, the output of the irradiated laser beam, etc. Therefore, based on this light, it is possible to determine whether or not the processing is proceeding as planned. That is, this light is useful for determining the quality of processing.

Therefore, the processing step S20 and the imaging step S30 may be performed simultaneously, and the processing point being laser processed may be imaged by the imaging units 46a, 46b, and the evaluation image 17 in which this light is captured may be created.

FIG. 8 is a plan view schematically showing an evaluation image 68 created by imaging the workpiece 1 being processed with a laser beam along the dividing line 3. As shown in FIG. 8, the evaluation image 68 includes processing marks 23 formed by processing, light (plasma light) 25 emitted from the processing point of the workpiece 1 when the laser beam is irradiated, and is reflected. By analyzing the light 25, it can be determined whether the processing is progressing as planned.

In the example shown in FIG. 8, the laser beam is not properly irradiated on the planned dividing line 3, but the outer edge of the device 5 is irradiated with the laser beam. In this case, the light 25 includes not only components originating from the structures existing on the planned dividing line 3 but also components originating from the structures existing in the device 5. Therefore, an error in the processing position is detected from the light 25 reflected in the evaluation image 68.

Further, even if the processing position is appropriate, if the output of the laser beam, etc. does not satisfy the permissible range, the light 25 reflected in the evaluation image 68 will be in a different form than usual. Therefore, from the light 25 reflected in the evaluation image 68, it is possible to detect various processing abnormalities such as insufficient output of the laser beam and abnormalities in the optical system, and it is possible to adjust the laser processing unit. Furthermore, in the processing method according to the present embodiment, it is easy to determine how the light 25 that is reflected in each of the plurality of evaluation images 68 changes, so that changes in processing quality can be easily and accurately evaluated.

Note that the present invention is not limited to the description of the embodiments described above, and can be implemented with various modifications. For example, in the above embodiment, the case where the workpiece 1 is processed by a processing device such as the cutting device 2, the workpiece 1 is imaged, and the evaluation image 17 is formed is described as an example. However, one embodiment of the present invention is not limited thereto. That is, an inspection apparatus that images the workpiece 1 without processing it to create an evaluation image, and an inspection method that images the workpiece 1 without processing it and creates an evaluation image are also aspects of the present invention. It is.

An inspection apparatus according to one aspect of the present invention includes a holding table that holds a workpiece 1, an imaging unit that images the surface 1a side of the workpiece 1 to create a captured image, and a holding table and the imaging unit that are arranged relative to each other. The display unit includes a feeding unit that moves the display unit, and a display unit. On the other hand, the inspection device according to one aspect of the present invention does not need to include a processing unit.

This inspection device is used, for example, when inspecting a workpiece 1 processed by another processing device. The control unit of the inspection device includes the small section storage section 58b, the imaging position storage section 58c, the evaluation image creation instruction section 62, and the display control section 64 of the control unit 56 of the cutting device 2 according to the above embodiment. include. That is, the above description regarding the control unit 56 of the cutting device 2 can be read as appropriate into the description of the control unit of this inspection device.

The display control section of the control unit of the inspection apparatus according to one aspect of the present invention displays two or more evaluation images 17 on the display unit 50 in accordance with the processed order of the small sections 15 appearing in each evaluation image 17. Therefore, it is possible to inspect the workpiece 1 processed by another processing device or the like and easily and accurately evaluate changes in the quality of the processing performed on the workpiece 1.

Further, the inspection method according to one aspect of the present invention includes a holding step S10 in which the workpiece is held on a holding table, an imaging step S30 in which a plurality of evaluation images are created by imaging the workpiece 1, and two steps. A display step S40 of displaying the evaluation image described above on a display unit is provided. On the other hand, the inspection method according to one aspect of the present invention does not need to include the processing step S20.

For this inspection method, a processing device such as the cutting device 2 according to the embodiment described above, the above-mentioned inspection device, or the like can be used. In display step S40 of the inspection method according to one aspect of the present invention, two or more evaluation images 17 are displayed on the display unit 50 in accordance with the processed order of the small sections 15 appearing in each evaluation image 17. Therefore, it is possible to inspect the workpiece 1 processed by the processing device or the like and easily and accurately evaluate changes in the quality of the processing performed on the workpiece 1.

Note that in the inspection method and processing method according to one aspect of the present invention, after the holding step S10 and before the imaging step S30, a plurality of small sections 15 included in the device region 5a on the surface 1a of the workpiece 1 are detected. A parcel detection step may be performed. This small section detection step is performed, for example, by the function of the small section detection section 70 of the control unit 56 described in the above embodiment. Therefore, as a description of the small partition detection step, the above description regarding the small partition detection unit 70 can be referred to as appropriate.

In the small section detection step, a plurality of locations on the surface 1a of the workpiece 1 are imaged to create a plurality of detection images. Then, the plurality of small sections included in the device area are detected based on the imaging position on the surface 1a of each of the plurality of detection images and the structure appearing in each of the plurality of detection images. The detection image is created, for example, by capturing an image of the workpiece 1 using the imaging units 46a and 46b. The arrangement of the small sections 15 detected in the small section detection step may be stored in the small section storage section 58b of the storage section 58, for example.

Further, in the inspection method and processing method according to one aspect of the present invention, after the small section detection step, an imaging position determining step of determining the imaging position in the plurality of small sections 15 of the workpiece 1 imaged in the imaging step S30. may be implemented. This imaging position determining step is performed, for example, by the function of the imaging position determining section 72 of the control unit 56 described in the above embodiment. Therefore, the description regarding the above-mentioned imaging position determination unit 72 can be referred to as appropriate for the explanation of the imaging position determination step.

In the imaging position determination step, for example, a position is determined at which images can be taken of both the region where the structure 13 such as TEG is formed and the region where the structure 13 is not formed on the planned dividing line 3 of the workpiece 1. This is determined as the imaging position 15a. Thereby, the quality of processing in various processing situations can be evaluated simultaneously from each evaluation image. However, the imaging position 15a is not limited to this. The imaging position 15a in the small section 15 determined in the imaging position determination step may be stored in the imaging position storage section 58c of the storage section 58, for example.

Further, in the above embodiment, a case has been described in which the planned dividing line 3 of the workpiece 1 is shown in the evaluation image 17, but one aspect of the present invention is not limited to this. That is, the imaging position of the evaluation image 17 does not need to be set on the planned division line 3, and the planned division line 3 does not need to be included in the evaluation image 17.

For example, when the workpiece 1 is processed along the planned dividing line 3, processing debris may be generated from the workpiece 1, etc., be scattered around, and may adhere to the device 5. In the processing apparatus (inspection apparatus) and the processing method (inspection method) according to one aspect of the present invention, by imaging the device 5 with the imaging units 46a and 46b and creating the evaluation image 17, processing waste is measured as processing quality. The state of scattering can be inspected.

In addition, the structure, method, etc. according to the above embodiments can be modified and implemented as appropriate without departing from the scope of the objective of the present invention.

1 Workpiece 1a Front side 1b Back side 3 Planned dividing line 3a, 21a, 21b, 21c, 21d Machining marks 5 Device 5a Device area 5b Surplus peripheral area 7 Adhesive tape 9 Ring frame 11 Frame unit 13 Structure 15 Small section 17, 17a , 17b, 17c, 17d Evaluation images 19a, 19b Structure 21 Formation area 23 Processing marks 25 Light 2 Cutting device 4 Base 4a, 4b, 4c Opening 8 Cassette support 10 Cassette 12 Guide rail 14 Table cover 16 Dust-proof and splash-proof Cover 18 Holding table 18a Holding surface 18b Clamp 18c Porous member 20 Support structure 22a, 22b Moving unit 24, 24a, 24b Processing unit 26, 34a, 34b Guide rail 28a, 28b, 36a, 36b Moving plate 30a, 30b, 38a, 38b Ball screw 32a, 40a, 40b Pulse motor 44 Cutting blade 46a, 46b Imaging unit 48 Cleaning unit 50 Display unit 50a, 50b Result display screen 54a, 54b, 54c Operation button 56 Control unit 58 Storage section 58a Machining condition storage section 58b Small section storage Section 58c Imaging position storage section 58d Image storage section 60 Processing control section 62 Evaluation image creation instruction section 64 Display control section 66 Judgment section 68 Evaluation image 70 Small section detection section 72 Imaging position determination section

Claims (18)

A plurality of planned division lines that intersect with each other are set, and a device area is formed on the surface in each area partitioned by the planned division lines, and the device area includes a plurality of small structures that are arranged in the same manner as each other. An inspection method for inspecting a workpiece that has a partition and has been processed along the planned dividing line to form processing marks, the method comprising:
a holding step of causing the workpiece to face a holding surface of a holding table and holding the workpiece on the holding table;
an imaging step of creating a plurality of evaluation images by imaging the workpiece at the same imaging position in each of the plurality of small sections of the device area of the workpiece held on the holding table;
a display step of displaying two or more of the plurality of evaluation images on a display unit;
In the displaying step, the two or more evaluation images are displayed on the display unit in accordance with the processed order of the small sections appearing in each evaluation image. 2. The method for inspecting a workpiece according to claim 1, wherein in the displaying step, the two or more evaluation images are arranged in the order and displayed on the display unit. 2. The method for inspecting a workpiece according to claim 1, wherein in the displaying step, the two or more evaluation images are sequentially displayed in the order on the display unit. After the holding step and before the imaging step, a plurality of detection images are created by imaging a plurality of locations on the surface of the workpiece, and each of the plurality of detection images is captured on the surface. a small section detection step of detecting the plurality of small sections included in the device area based on the position and the structure shown in each of the plurality of detection images;
After the small section detection step, the method further comprises an imaging position determining step of determining the imaging position in the plurality of small sections of the workpiece imaged in the imaging step. The method for inspecting a workpiece according to claim 3. A plurality of planned division lines that intersect with each other are set, and a device area is formed on the surface in each area partitioned by the planned division lines, and the device area includes a plurality of small structures that are arranged in the same manner as each other. An inspection device that inspects a workpiece that has a partition and has processing marks formed by processing along the planned dividing line,
a holding table having a holding surface and holding the workpiece in contact with the holding surface;
an imaging unit that images the workpiece held by the holding table to create a captured image;
a feeding unit that relatively moves the holding table and the imaging unit in a direction parallel to the holding surface;
a display unit that displays the captured image created by the imaging unit;
comprising a control unit;
The control unit includes:
a small section storage unit that stores the arrangement of the plurality of small sections on the surface of the workpiece;
an imaging position storage unit that stores the same imaging position in the plurality of small sections;
The holding table, the imaging unit, and the feeding unit are controlled to refer to the arrangement stored in the small section storage section and the imaging position stored in the imaging position storage section. , an evaluation image creation instruction unit that causes the imaging unit to image the workpiece at each of the imaging positions of the plurality of small sections, and creates a plurality of evaluation images;
a display control unit that causes the display unit to display two or more of the plurality of evaluation images,
The apparatus for inspecting a workpiece, wherein the display control section displays the two or more evaluation images on the display unit in accordance with the processed order of the small sections appearing in each of the evaluation images. 6. The workpiece inspection apparatus according to claim 5, wherein the display control section arranges the two or more evaluation images in the order and displays them on the display unit. 6. The workpiece inspection apparatus according to claim 5, wherein the display control section sequentially displays the two or more evaluation images in the order on the display unit. The control unit includes:
The holding table, the imaging unit, and the feeding unit are controlled to cause the imaging unit to take images of a plurality of locations on the surface of the workpiece held by the holding table for multiple detection purposes. A plurality of small sections included in the device area are generated based on the imaging position on the surface of each of the plurality of detection images and the structure reflected in each of the plurality of detection images. a small section detection unit that detects the
The method further includes: an imaging position determination section that determines the imaging position in the plurality of small sections of the workpiece detected by the small section detection section and stores the imaging position in the imaging position storage section. An inspection device for a workpiece according to any one of claims 5 to 7. A plurality of planned division lines that intersect with each other are set, and a device area is formed on the surface in each area partitioned by the planned division lines, and the device area includes a plurality of small structures that are arranged in the same manner as each other. A processing method for processing a workpiece having sections along the dividing line, the method comprising:
a holding step of causing the workpiece to face a holding surface of a holding table and holding the workpiece on the holding table;
a processing step of processing the workpiece held on the holding table along the plurality of dividing lines;
Simultaneously with the processing step or after the processing step, the workpiece is imaged at the same imaging position in each of the plurality of small sections of the device area of the workpiece held on the holding table. an imaging step of creating a plurality of evaluation images;
a display step of displaying two or more of the plurality of evaluation images on a display unit;
In the display step, the two or more evaluation images are displayed on the display unit according to the order in which the small sections appearing in each evaluation image were processed in the processing step. Processing method. 10. The method of processing a workpiece according to claim 9, wherein in the display step, the two or more evaluation images are arranged in the order and displayed on the display unit. 10. The method of processing a workpiece according to claim 9, wherein in the display step, the two or more evaluation images are sequentially displayed on the display unit in the order. In the processing step, the workpiece is processed with a cutting blade to form processing marks on the workpiece,
12. The method of processing a workpiece according to claim 9, wherein the evaluation image created in the imaging step includes the processing marks. In the processing step, the workpiece is irradiated with a laser beam to form processing marks,
The evaluation image created in the imaging step includes the machining marks or light emitted from the workpiece when irradiated with the laser beam. Item 12. The method for processing a workpiece according to any one of Item 11. A plurality of planned division lines that intersect with each other are set, and a device area is formed on the surface in each area partitioned by the planned division lines, and the device area includes a plurality of small structures that are arranged in the same manner as each other. A processing device that processes a workpiece having sections along the planned dividing line,
a holding table having a holding surface and holding the workpiece in contact with the holding surface;
a processing unit that processes the workpiece held by the holding table;
an imaging unit that images the workpiece held by the holding table to create a captured image;
a feeding unit that relatively moves the holding table and the imaging unit in a direction parallel to the holding surface;
a display unit that displays the captured image created by the imaging unit;
comprising a control unit;
The control unit includes:
a processing control unit that controls the holding table and the processing unit to cause the processing unit to process the workpiece along the planned dividing line;
a small section storage unit that stores the arrangement of the plurality of small sections on the surface of the workpiece;
an imaging position storage unit that stores the same imaging position in the plurality of small sections;
After or simultaneously with the processing of the workpiece, the processing control section controls the holding table, the imaging unit, and the feeding unit to store the small section. with reference to the arrangement stored in the unit and the imaging position stored in the imaging position storage unit, and causing the imaging unit to image the workpiece at each of the imaging positions of the plurality of small sections. an evaluation image creation instruction unit that creates a plurality of evaluation images;
a display control unit that causes the display unit to display two or more of the plurality of evaluation images,
The display control unit displays the two or more evaluation images on the display unit in accordance with the order in which the small sections shown in each evaluation image were processed by the processing unit. Processing equipment. 15. The workpiece processing apparatus according to claim 14, wherein the display control section arranges the two or more evaluation images in the order and displays them on the display unit. 15. The workpiece processing apparatus according to claim 14, wherein the display control section sequentially displays the two or more evaluation images in the order on the display unit. The processing unit is a cutting unit that cuts the workpiece with a cutting blade,
17. The evaluation image created by the imaging unit includes machining marks formed on the workpiece by cutting with the cutting blade. Equipment for processing workpieces. The processing unit is a laser processing unit that processes the workpiece by irradiating the workpiece with a laser beam,
The evaluation image created by the imaging unit includes machining marks formed on the workpiece by irradiation with the laser beam, or marks emitted from the workpiece when the laser beam was irradiated. 17. The workpiece processing apparatus according to claim 14, wherein light is reflected.

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