JP2018078145A - Cutting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting apparatus that is able to detect a processing groove accurately while hindering an increase in time required for kerf check.SOLUTION: A cutting apparatus 1 comprises: a chuck table 10 holding a work piece W; a cutting unit 20 that forms a processing groove in the work piece W; an imaging unit 30 that images the work piece W; and a control unit 60 that controls each of compositional elements. The control unit 60 comprises: a processing-condition registering section 61 that registers a key pattern formed on the work piece W, and a distance between the key pattern and the processing groove; an imaging-position registering section 62 that uses the work piece W with the processing groove formed by the cutting unit 20 and registers imaging-position information to be imaged so as to be suitable for detection of the processing groove; and a determining section 63 that determines omission or a distance between the processing groove imaged by the imaging unit 30 and the key pattern.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a cutting apparatus.

  Cutting devices for cutting various plate-like workpieces such as optical device wafers made of semiconductor wafers, sapphire substrates, SiC (silicon carbide) substrates, resin package substrates, glass substrates, ceramic substrates, etc. with a cutting blade are known. .

  The cutting apparatus has a kerf check function that detects at any time during machining whether or not cutting is being performed along a scheduled division line set on the workpiece. The kerf check function captures an image of the machining groove with a camera and determines whether the machining groove is formed at a predetermined position (set based on the distance from the key pattern) and whether the chipping is below a predetermined value. To do. In the kerf check function, the cutting device notifies the operator of an abnormality with an alarm when the distance from the key pattern of the machining groove and chipping exceed a threshold value.

  The workpiece is reflected differently depending on the location due to the influence of TEG and the like formed on the division line. For this reason, the cutting device may not be able to detect the machining groove even if it is mechanically imaged under the same imaging conditions. For this purpose, a cutting device having a function of automatically adjusting the illumination condition has been devised (see, for example, Patent Document 1).

JP 2011-066233 A

  However, since the cutting apparatus shown in Patent Document 1 adjusts the illumination condition for each division line, there is a problem that the time required for the kerf check becomes long. In addition, the cutting device disclosed in Patent Document 1 adjusts the illumination conditions for each division line, so the way the machining grooves appear depends on the illumination conditions, and the machining grooves are accurately detected when the kerf check function is executed. The problem of not being able to occur.

  The present invention has been made in view of such problems, and an object thereof is to provide a cutting apparatus capable of accurately detecting a machining groove while suppressing an increase in the time required for kerf check. That is.

  In order to solve the above-described problems and achieve the object, a cutting apparatus of the present invention forms a chuck table for holding a workpiece on a holding surface, and a machining groove in the workpiece held on the chuck table. A processing unit, an imaging unit that images the workpiece held on the chuck table, and a control unit that controls each component, and in a region partitioned by a plurality of division lines formed on the surface A cutting apparatus for forming a machining groove along a division line on a workpiece including a device, wherein the control unit includes a key pattern formed on the workpiece, and the machining formed with the key pattern. A processing condition registration unit for registering the distance to the groove, and a workpiece in which the processing groove is formed by the processing unit, and an image capturing position information to be imaged suitable for detection of the processing groove A location registration unit, characterized in that it and a determination unit for determining distance or chipping of the said key pattern of the imaged the machined groove in the imaging unit.

  Therefore, the cutting device of the present invention has an effect that the machining groove can be accurately detected while suppressing an increase in the time required for the kerf check.

FIG. 1 is a perspective view illustrating a configuration example of a cutting apparatus according to the first embodiment. FIG. 2 is a plan view of a workpiece to be processed by the cutting apparatus according to the first embodiment. FIG. 3 is a diagram illustrating a configuration of an imaging unit of the cutting apparatus according to the first embodiment. FIG. 4 is a diagram illustrating an example of machining conditions registered by the machining condition registration unit of the cutting apparatus according to the first embodiment. FIG. 5 is a plan view showing an example of the distance between the key pattern under the processing conditions shown in FIG. FIG. 6 is a plan view illustrating an example of a workpiece in which the cutting unit of the cutting apparatus according to the first embodiment actually forms the machining grooves on the division lines. FIG. 7 is a diagram illustrating an example of imaging position information registered by the imaging position registration unit of the cutting apparatus according to the first embodiment. FIG. 8 is a diagram illustrating an example of an image obtained when the imaging unit of the cutting apparatus according to the first embodiment performs a kerf check. FIG. 9 is a flowchart showing a flow of a cutting method using the cutting apparatus according to the first embodiment. FIG. 10 is a flowchart showing the flow of the imaging position registration step of the cutting method shown in FIG. FIG. 11 is a diagram illustrating an example of imaging position information registered by the imaging position registration unit of the cutting apparatus according to the second embodiment.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment 1
A cutting apparatus according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view illustrating a configuration example of a cutting apparatus according to the first embodiment. FIG. 2 is a plan view of a workpiece to be processed by the cutting apparatus according to the first embodiment. FIG. 3 is a diagram illustrating a configuration of an imaging unit of the cutting apparatus according to the first embodiment.

  The cutting device 1 according to the first embodiment is a device that cuts (machines) a workpiece W that is a plate-like object. In the first embodiment, the workpiece W is a disk-shaped semiconductor wafer or optical device wafer whose base material is silicon, sapphire, gallium, or the like. As illustrated in FIG. 2, the workpiece W includes a device D in a region partitioned in a lattice pattern by a plurality of division lines L formed on the surface WS. Each device D of the workpiece W is formed with a key pattern KP for performing alignment and detecting the division line L. The key pattern KP is provided at a predetermined position on each device D. In the first embodiment, the key pattern KP is formed in a cross shape, but the shape of the key pattern KP is not limited to the cross shape. In the first embodiment, the key pattern KP is formed at the same position in all the devices D, but the position of the key pattern KP is not limited to this.

  The workpiece W is provided with a TEG (Test Element Group) 100. The TEG 100 is a test pattern that is formed of metal or the like and finds a problem in designing and manufacturing the device D. The TEG 100 is provided on the division planned line L at a predetermined position of the workpiece W. The workpieces W having the same structure (for example, the same product or the same rod) have the same position where the TEG 100 is provided. The workpieces W having different structures are different from each other at positions where the TEGs 100 are provided.

  In the first embodiment, the workpiece W is integrated with the annular frame F by attaching the adhesive tape T to the back surface WR and attaching the annular frame F to the outer periphery of the adhesive tape T. The workpiece W of the first embodiment is a semiconductor wafer or an optical device wafer, but may be a rectangular package substrate having a plurality of devices sealed with a resin, a ceramic plate, a glass plate, or the like in addition to the wafer. .

  The cutting apparatus 1 shown in FIG. 1 cuts (processes) the workpiece W to form a processed groove PD (shown by a broken line in FIG. 2) in the division line L on the workpiece W, and It is an apparatus that divides a workpiece W into individual devices D. As shown in FIG. 1, the cutting device 1 is a chuck table 10 that sucks and holds a workpiece W with a holding surface 10 a and a machining unit that forms a machining groove PD in the workpiece W held on the chuck table 10. A cutting unit 20, an imaging unit 30 that images the workpiece W held on the chuck table 10, and a control unit 60 are provided.

  Further, as shown in FIG. 1, the cutting device 1 includes an X-axis moving means (not shown) for feeding the chuck table 10 in the X-axis direction parallel to the horizontal direction, and a cutting unit 20 parallel to the horizontal direction and the X-axis. Y-axis moving means for indexing and feeding in the Y-axis direction orthogonal to the direction, and Z-axis moving means for cutting and feeding the cutting unit 20 in the Z-axis direction parallel to the vertical direction perpendicular to both the X-axis direction and the Y-axis direction And a transport unit 80 for transporting the workpiece W. As shown in FIG. 1, the cutting device 1 includes two cutting units 20, that is, a 2-spindle dicer, a so-called facing dual type cutting device.

  The chuck table 10 has a disc shape having a holding portion 11 provided with a holding surface 10 a for holding the workpiece W and formed of porous ceramic or the like, and a ring-shaped frame portion 12 surrounding the holding portion 11. is there. Further, the chuck table 10 is provided so as to be movable in the X-axis direction by the X-axis moving means and to be rotatable around an axis parallel to the Z-axis direction by a rotational drive source. The chuck table 10 is connected to a vacuum suction source (not shown), and sucks and holds the workpiece W by being sucked by the vacuum suction source.

  The cutting unit 20 includes a spindle (not shown) on which a cutting blade 21 for cutting the workpiece W held on the chuck table 10 is mounted. Each of the cutting units 20 is provided so as to be movable in the Y-axis direction by the Y-axis moving means with respect to the workpiece W held on the chuck table 10, and is movable in the Z-axis direction by the Z-axis moving means. Is provided.

  As shown in FIG. 1, one cutting unit 20 is provided on one column portion 3 a erected from the apparatus main body 2 via a Y-axis moving unit, a Z-axis moving unit, and the like. As shown in FIG. 1, the other cutting unit 20 is provided on the other column portion 3 b erected from the apparatus main body 2 via Y-axis moving means, Z-axis moving means, and the like. Note that the upper ends of the column portions 3a and 3b are connected by a horizontal beam 3c.

  The cutting unit 20 can position the cutting blade 21 at an arbitrary position on the holding surface 10a of the chuck table 10 by the Y-axis moving unit and the Z-axis moving unit. The cutting blade 21 is an extremely thin cutting grindstone having a substantially ring shape. The spindle cuts the workpiece W by rotating the cutting blade 21. The spindle is accommodated in the spindle housing, and the spindle housing is supported by the Z-axis moving means. The spindle of the cutting unit 20 and the axis of the cutting blade 21 are set parallel to the Y-axis direction. The cutting unit 20 cuts the workpiece W by the chuck table 10 being cut and fed in the X-axis direction by the X-axis moving unit while being indexed and fed in the Y-axis direction by the Y-axis moving unit.

  The X-axis moving unit is a processing feeding unit that moves the chuck table 10 in the X-axis direction by moving the chuck table 10 in the X-axis direction. The Y-axis moving means is an index feeding means for indexing and feeding the cutting unit 20 by moving the cutting unit 20 in the Y-axis direction. The Z-axis moving means cuts and feeds the cutting unit 20 by moving the cutting unit 20 in the Z-axis direction. The X-axis moving means, the Y-axis moving means, and the Z-axis moving means are known ball screws provided rotatably around the axis, known pulse motors that rotate the ball screw around the axis, and the chuck table 10 or cutting. A well-known guide rail that supports the unit 20 so as to be movable in the X-axis direction, the Y-axis direction, or the Z-axis direction is provided.

  The imaging unit 30 is fixed to one cutting unit 20 so as to move integrally with the one cutting unit 20. The imaging unit 30 images the surface WS of the workpiece W held on the chuck table 10. As shown in FIG. 3, the imaging unit 30 includes a light illuminator 31, an optical system 32, and a CCD (Charge Coupled Device) camera 33 that images the surface WS of the workpiece W.

  The optical illuminator 31 includes, for example, a halogen light source or an LED, and includes a coaxial illumination 31 a whose light amount is adjusted by the control unit 60. The coaxial illumination 31 a emits light toward the optical system 32. The optical system 32 directs the light emitted from the coaxial illumination 31a of the light illuminator 31 toward the workpiece W held on the chuck table 10 in parallel with the Z-axis direction. A reflecting half mirror 32b and an objective lens 32c provided in the case 32a and disposed below the half mirror 32b are provided.

  The CCD camera 33 is provided above the half mirror 32b, and picks up an image of the workpiece W illuminated by the light from the coaxial illumination 31a of the light illuminator 31 through the half mirror 32b and the objective lens 32c through the half mirror 32b. Then, an image obtained by imaging is output to the control unit 60. The CCD camera 33 obtains an image for performing alignment for aligning the workpiece W and the cutting blade 21 as an image.

  The light emitted from the coaxial illumination 31a and reflected by the half mirror 32b is coaxial with the optical axes of the CCD camera 33 and the objective lens 32c. The light illuminator 31 includes a slant illumination 31 b that is provided at the lower end of the case 32 a and on the outer periphery of the objective lens 32 c and irradiates light on the surface WS of the workpiece W held on the chuck table 10. The amount of light from the oblique illumination 31 b is adjusted by the control unit 60. In the present invention, the amount of light of the coaxial illumination 31a and the oblique illumination 31b is, for example, 100% when the maximum voltage allowed to be applied is applied, and 0% when no voltage is applied. .

  Further, the cutting apparatus 1 includes a cassette elevator 70 on which a cassette 71 that accommodates the workpiece W before and after cutting is placed and moves the cassette 71 in the Z-axis direction, and a cleaning device that cleans the workpiece W after cutting. 90, a loading / unloading means (not shown) for loading and unloading the workpiece W into and from the cassette 71, and a transport unit 80 for transporting the workpiece W. The transport unit 80 includes a first transport unit 81 that transports the workpiece W between the loading / unloading means and the chuck table 10, and a first transport unit 81 that transports the workpiece W between the chuck table 10 and the cleaning device 90. 2 transport units 82.

  The control unit 60 controls the above-described components to cause the cutting device 1 to perform a machining operation on the workpiece W. The control unit 60 is a computer. The control unit 60 is connected to a display device 91 configured by a liquid crystal display device or the like that displays a processing operation state or an image, and an input device 92 used when an operator registers processing content information. The input device 92 includes at least one of a touch panel provided on the display device 91 and an external input device such as a keyboard.

  The control unit 60 outputs an image acquired by the CCD camera 33 of the imaging unit 30 to the display device 91 and causes the display device 91 to display the image. The control unit 60 performs alignment for aligning the workpiece W and the cutting blade 21 before cutting the workpiece W, and is actually formed in the division line L during the cutting of the workpiece W. A kerf check is performed to determine whether or not the size of the chipping formed at both edges in the width direction of the processed groove PD and the processed groove PD is acceptable.

  As shown in FIG. 1, the control unit 60 includes a processing condition registration unit 61, an imaging position registration unit 62, and a determination unit 63.

  The machining condition registration unit 61 registers a machining condition PC shown as an example in FIG. FIG. 4 is a diagram illustrating an example of machining conditions registered by the machining condition registration unit of the cutting apparatus according to the first embodiment. FIG. 5 is a plan view showing an example of the distance between the key pattern under the processing conditions shown in FIG.

  The machining condition PC includes at least a distance DS between the key pattern KP formed on the workpiece W and the machining groove PD formed on the planned division line L. As shown in FIG. 5, the distance DS between the key pattern KP and the processing groove PD to be formed is the position (also referred to as coordinate information) of the key pattern KP to be imaged when performing alignment and the width direction of the processing groove PD to be formed. This is a distance DS in the Y-axis direction from the center C. In addition, the position (coordinate information) referred to in the present invention indicates coordinates in the X-axis direction and the Y-axis direction from the preset reference position of the workpiece W. Further, in the first embodiment, the machining condition PC includes the size SZ of the workpiece W, the machining feed speed PS, the rotation speed RS of the spindle, and the interval FI for indexing and feeding in the Y-axis direction. It is not limited to the processing conditions PC shown in FIG. Further, in the first embodiment, the key pattern KP is formed at the same position of all the devices D, and the distance DS between the key pattern KP of all the planned division lines L and the processing groove PD to be formed is equal. Includes only one distance DS, but if the distances DS between the key patterns KP of all the planned division lines L and the processed grooves PD to be formed are not equal, at least the positions where the key patterns KP are formed are different. The distance DS may be stored for each scheduled line L.

  The imaging position registration unit 62 is a diagram that causes the imaging unit 30 to capture an image when performing a kerf check using the workpiece W shown in FIG. 6 in which the machining groove PD is actually formed in the division line L by the cutting unit 20. 7 is registered. FIG. 6 is a plan view illustrating an example of a workpiece in which the cutting unit of the cutting apparatus according to the first embodiment actually forms the machining grooves on the division lines. FIG. 7 is a diagram illustrating an example of imaging position information registered by the imaging position registration unit of the cutting apparatus according to the first embodiment.

  The imaging position information IP is information indicating the position of the imaging position IL shown in FIG. 6 to be imaged suitable for detection of the processing groove PD from the image obtained by the imaging unit 30. In the first embodiment, the imaging position IL is a position where the TEG 100 that enables imaging of the planned division line L in which the processing groove PD is formed is not formed. The imaging position information IP associates each scheduled division line L with the position of the imaging position IL of each planned division line L on a one-to-one basis.

  When performing the kerf check during the cutting of the workpiece W, the determination unit 63 picks up the imaging position IL by the imaging unit 30 and uses the processing groove PD at the imaging position IL captured by the imaging unit 30. It is determined whether or not the distance DSA shown in FIG. 8 with respect to the key pattern KP at the center CA in the width direction or the size of chipping that is missing is acceptable. FIG. 8 is a diagram illustrating an example of an image obtained when the imaging unit of the cutting apparatus according to the first embodiment performs a kerf check.

  The determination unit 63 calculates a distance DSA from the image obtained by imaging the imaging position by the imaging unit 30 to the center CA of the processing groove PD from the key pattern KP. When the difference between the distance DS registered by the processing condition registration unit 61 and the distance DSA calculated from the image obtained by imaging the imaging position by the imaging unit 30 is equal to or less than a predetermined threshold, It is determined that the distance DSA from the key pattern KP of the processing groove PD at the position IP is acceptable, and it is determined that the distance DSA is not acceptable if it exceeds the threshold.

  The determination unit 63 determines the size of chipping formed in the processing groove PD at the imaging position when the protrusion amount EQ shown in FIG. 8 of chipping from both edges in the width direction of the processing groove PD is equal to or less than a predetermined threshold. Is determined to be acceptable, and is determined to be unacceptable when the threshold value is exceeded. If the determination unit 63 determines that both the distance DSA of the processing groove PD from the key pattern KP and the size of chipping are allowable, the processing unit 63 continues to perform the cutting of the workpiece W. If the determination unit 63 determines that at least one of the distance DSA from the key pattern KP of the processing groove PD and the size of chipping is not acceptable, the determination unit 63 displays an error message on the display device 91 and stops the cutting process. The operator replaces the cutting blade 21 when an error message is displayed on the display device 91.

  Next, the flow of the cutting method using the cutting device 1 will be described with reference to the drawings. FIG. 9 is a flowchart showing a flow of a cutting method using the cutting apparatus according to the first embodiment.

  In the cutting method using the cutting device 1, first, an operator accommodates the workpiece W having the same structure as an integral part of the annular frame F in the cassette 71 and places it on the cassette elevator 70 of the cutting device 1. As shown in FIG. 9, the cutting method using the cutting apparatus 1 includes a machining condition registration step ST1, a standard workpiece cutting step ST2, an imaging position registration step ST3, and a cutting step ST4.

  The machining condition registration step ST1 is a step in which, after the operator installs the cassette 71 in the cassette elevator 70, the input device 92 is operated to register the machining condition PC in the machining condition registration unit 61 of the control unit 60. In the machining condition registration step ST1, the operator operates the input device 92 to register the machining condition PC shown in the example shown in FIG. The machining condition registration step ST1 registers the distance DS between the position of the key pattern KP to be imaged when the operator performs alignment and the machining groove PD formed in the planned division line L. When the registration of the machining condition PC is completed in the machining condition registration step ST1, the process proceeds to the reference workpiece cutting step ST2.

  In the reference workpiece cutting step ST <b> 2, the cutting apparatus 1 forms the machining grooves PD in all the planned division lines L of any one workpiece W among the plurality of workpieces W accommodated in the cassette 71. It is a step to do.

  In the standard workpiece cutting step ST2, when the operator operates the input device 92 to input a cutting operation start instruction for one workpiece, the control unit 60 executes. In the reference workpiece cutting step ST <b> 2, the control unit 60 takes out one workpiece W before cutting from the cassette 71 and holds the workpiece W taken out by the loading / unloading means and the conveyance unit 80 on the chuck table 10. It is placed on the surface 10 a and sucked and held on the holding surface 10 a of the chuck table 10.

  Next, the control unit 60 moves the chuck table 10 toward the lower side of the one cutting unit 20 by the X-axis moving means, and moves the chuck table 10 below the imaging unit 30 attached to the one cutting unit 20. The held workpiece W is positioned and imaged by the imaging unit 30 to perform alignment of one of the scheduled division lines L orthogonal to each other. When performing the alignment, the control unit 60 causes the imaging unit 30 to image the key pattern KP associated with the preset division line L, moves the workpiece W in the X-axis direction, and so on. The key pattern KP is imaged by the imaging unit 30.

  The control unit 60 rotates the chuck table 10 about the axis so that the division line L is parallel to the X-axis direction, and the cutting blade 21 is positioned at a distance DS registered in the machining condition PC from the key pattern KP. In this way, the workpiece W and the cutting blade 21 are aligned. Then, the control unit 60 rotates the workpiece W by 90 degrees around the axis as a rotational drive source, and performs the other alignment of the division lines L orthogonal to each other in the same manner as one. Then, the control unit 60 uses the X-axis moving means, the Y-axis moving means, the Z-axis moving means, and the rotational drive source to divide the cutting blade 21 and the workpiece W along the planned division line L based on the machining conditions. By relatively moving, the processing groove PD is formed in the division line L by the cutting blade 21.

  When the control unit 60 forms the machining grooves PD in all the division lines L and divides the workpiece W into the individual devices D, the control unit 60 stops the cutting operation of the cutting apparatus 1 and proceeds to the imaging position registration step ST3. .

  The imaging position registration step ST3 is a step in which the operator operates the input device 92 to register the imaging position information IP illustrated in FIG. 7 in the imaging position registration unit 62 of the control unit 60. FIG. 10 is a flowchart showing the flow of the imaging position registration step of the cutting method shown in FIG.

  First, in the imaging position registration step ST3, the operator operates the input device 92 to cause the imaging unit 30 to image at least three outer edges of the workpiece W. Then, the control unit 60 calculates and stores the reference position of the workpiece W with respect to the chuck table 10 (coordinate information of the center of the workpiece W) (step ST31).

  In the imaging position registration step ST3, the operator operates the input device 92 to display an image captured by the imaging unit 30 on the display device 91, and the operator operates the input device 92 to operate the imaging unit 30 and the chuck table. The workpiece W in which the machining groove PD is formed in all the division planned lines L held at 10 is relatively moved. The operator operates the input device 92 to register the coordinate information in the control unit 60 with the position where the TEG 100 of each planned division line L is not formed as the imaging position IL. Correspondingly, the coordinate information of the imaging position IL is stored as the imaging position information IP (step ST32). When the coordinate information of the imaging position IL is stored in association with all the planned division lines L, the process proceeds to the cutting step ST4.

  The cutting step ST4 is a step of forming the machining grooves PD in all the division lines L in order while performing a kerf check on the workpiece W accommodated in the cassette 71.

  In the cutting step ST4, the control unit 60 takes out one workpiece W before cutting from the cassette 71, and places the workpiece W taken out by the loading / unloading means and the conveyance unit 80 on the holding surface 10a of the chuck table 10. And sucked and held on the holding surface 10 a of the chuck table 10.

  Then, the control unit 60 moves the chuck table 10 below the one cutting unit 20 by the X-axis moving means, and holds the chuck table 10 below the imaging unit 30 attached to the one cutting unit 20. The processed workpiece W is positioned, the imaging unit 30 is caused to capture images of at least three outer edges of the workpiece W, the position of the reference position of the workpiece W with respect to the chuck table 10 is calculated, and the imaging position registration is performed. Correction processing corresponding to the workpiece W newly holding the imaging position IL registered in step ST3 is performed. Thereby, the kerf check is performed at the same position of the workpiece W used in the imaging position registration step ST3 and the newly held workpiece W.

  In the cutting step ST4, the control unit 60 performs alignment in the same manner as the reference workpiece cutting step ST2, and based on the machining condition PC, the X-axis moving means, the Y-axis moving means, the Z-axis moving means, and the rotational drive source Thus, the cutting blade 21 and the workpiece W are relatively moved along the planned division line L, and the processing groove PD is formed in the planned division line L by the cutting blade 21.

  The control unit 60 forms the processing grooves PD in a predetermined number of predetermined division lines L (since almost no kerf check is performed on all the division division lines L. Basically, every five lines, The kerf check is performed at the timing of every 10 lines, etc. However, in the first embodiment, the imaging positions IL of all the planned division lines L are registered in advance so that the kerf check may be performed at an arbitrary timing. The imaging unit 30 is caused to image the imaging position IL associated with the planned division line L just formed with the processed groove PD, and the kerf check is performed. When the control unit 60 forms the machining grooves PD in all the division lines L and divides the workpiece W into the individual devices D, the chuck table 10 is retracted from below the cutting unit 20 and then the chuck table. Release 10 suction hold. Then, the control unit 60 uses the transport unit 80 to transport the processed workpiece W to the cleaning device 90, and after cleaning with the cleaning device 90, the cleaned workpiece W is accommodated in the cassette 71. To do. The control unit 60 again places the workpiece W before cutting on the chuck table 10 and repeats the above-described process to divide all the workpieces W in the cassette 71 into individual devices D.

  The control unit 60 described above includes an arithmetic processing unit having a microprocessor such as a CPU (central processing unit), a storage unit having a memory such as a read only memory (ROM) or a random access memory (RAM), and input / output. And an interface device. The arithmetic processing device of the control unit 60 performs arithmetic processing according to a computer program stored in the storage device, and sends a control signal for controlling the cutting device 1 to the above-mentioned of the cutting device 1 via the input / output interface device. Output to the specified component. In addition, the functions of the processing condition registration unit 61, the imaging position registration unit 62, and the determination unit 63 of the control unit 60 execute the computer program stored in the storage device by the arithmetic processing unit and store necessary information in the storage unit. It is realized by doing.

  The cutting apparatus 1 according to the first embodiment registers an imaging position IL that can be kerf-checked using the reference workpiece W in which the machining groove PD is formed in the reference workpiece cutting step ST2, and the imaging position IL is registered. Based on the information IP, a kerf check during the processing of the next workpiece W is performed. In addition, since the cutting apparatus 1 sets the imaging position IL to a position where the TEG 100 where the machining groove PD can be easily detected is not provided, there is no effect that the machining groove PD cannot be detected when performing the kerf check. Play.

  In the cutting apparatus 1 according to the first embodiment, since the imaging position IL is set to a position where the TEG 100 that can easily detect the machining groove PD is not provided, it is not necessary to adjust the illumination condition during the kerf check. It is possible to suppress an increase in the time required for the kerf check. As a result, the cutting apparatus 1 according to the first embodiment has an effect that the machining groove PD can be accurately detected while suppressing an increase in the time required for the kerf check.

[Embodiment 2]
A cutting apparatus according to Embodiment 2 of the present invention will be described with reference to the drawings. FIG. 11 is a diagram illustrating an example of imaging position information registered by the imaging position registration unit of the cutting apparatus according to the second embodiment.

  The cutting apparatus 1 according to the second embodiment is the same as the first embodiment except that the imaging position information IP-2 registered by the imaging position registration unit 62 is different from the first embodiment.

  As shown in FIG. 11, the imaging position information IP-2 registered by the imaging position registration unit 62 of the cutting apparatus 1 according to the second embodiment includes the planned division line L and the imaging position IL, and the light quantity of the coaxial illumination 31a. The light quantity of the oblique illumination 31b is associated with the presence / absence of black-and-white reversal of the kerf check binary image. The control unit 60 of the cutting apparatus 1 according to the second embodiment performs a kerf check of each division planned line L based on the imaging position information IP-2 shown in FIG.

  Similarly to the first embodiment, the cutting device 1 according to the second embodiment uses the workpiece W serving as a reference in which the machining groove PD is formed in the reference workpiece cutting step ST2 to obtain an imaging position IL that can be kerf-checked. Since it is registered, there is an effect that the processed groove PD cannot be detected when performing the kerf check. Further, in the cutting device 1 according to the second embodiment, the imaging position information IP-2 includes a binary image of the kerf check and the light quantity of the coaxial illumination 31a, the light quantity of the oblique illumination 31b, in addition to the division line L and the imaging position IL. Therefore, the condition for easily detecting the processing groove PD can be registered in the imaging position information IP-2.

  The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Cutting device 10 Chuck table 10a Holding surface 20 Cutting unit (processing unit)
30 imaging unit 60 control unit 61 machining condition registration unit 62 imaging position registration unit 63 determination unit W workpiece WS surface L division planned line D device PD machining groove KP key pattern DS, DSA distance IP imaging position information

Claims (1)

A chuck table that holds a workpiece on a holding surface, a machining unit that forms a machining groove in the workpiece held on the chuck table, an imaging unit that images the workpiece held on the chuck table, And a control unit that controls each component, and a cutting apparatus that forms a machining groove along the scheduled division line in a workpiece including a device in a region defined by a plurality of scheduled division lines formed on the surface. Because
The control unit is
A processing condition registration unit for registering a key pattern formed on the workpiece and a distance between the key pattern and the processing groove to be formed;
An imaging position registering unit for registering imaging position information to be imaged suitable for detection of the processing groove, using the workpiece in which the processing groove is formed in the processing unit;
A cutting device comprising: a determination unit that determines a distance or a chip of the machining groove imaged by the imaging unit.

Images