JP2016127118A - Processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing device that can excellently perform processing in a short time when a parting schedule line containing TEG is processed.SOLUTION: An alignment target formed on a workpiece held on a chuck table is detected, a parting schedule line is found based on the target, an association table stored in storing means is referred to, a processing condition corresponding to the parting schedule line is acquired, and the workpiece is processed along the parting schedule line under the acquired processing condition. The processing condition contains a first processing condition set when the workpiece is processed along a parting schedule line containing no TEG, and a second processing condition set when the workpiece is processed along a parting schedule line containing TEG.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a processing apparatus.

  In order to accurately divide various plate-like workpieces such as semiconductor wafers, sapphire wafers, SiC (silicon carbide) substrates, and package substrates, cutting devices and laser processing devices are used. The workpiece to be held on the chuck table is imaged to detect a division line, and the workpiece is automatically machined under predetermined machining conditions along the detected division line.

  It is normal to process all the division lines on a single workpiece under uniform processing conditions (except for precut and the like). In a semiconductor wafer or the like, a TEG (test element group) may be locally formed on a specific division line. When the TEG is processed, the cutting blade may cause clogging of the back surface due to clogging, or the laser beam may cause division failure. For this reason, a machining condition suitable for a specific division line on which the TEG is formed is selected, and all lines of the workpiece are machined under the machining condition. However, since such a processing method often takes a long processing time, a technique has also been developed in which a cutting line is observed at any time, and when the observation result is poor, the processing speed is reduced (Patent Document 1).

Japanese Patent No. 2628256

  However, since normal processing is carried out until the observation result of the cut line becomes poor, there are cases where processing along the scheduled division line cannot be performed satisfactorily.

  Therefore, the present invention has been made in view of the above, and an object of the present invention is to provide a machining apparatus that can satisfactorily machine in a short time when machining a division planned line including a TEG.

  In order to solve the above-described problems and achieve the object, a processing apparatus according to the present invention is a processing apparatus that performs processing along a plurality of division lines set on a workpiece, A chuck table to be held, a processing means for processing a workpiece held by the chuck table, an X-axis moving means for processing and feeding the chuck table and the processing means relative to each other in the X-axis direction, Y-axis moving means for indexing and feeding the chuck table and the processing means in the Y-axis direction orthogonal to the X-axis direction, and imaging means for detecting a division-scheduled line set on the workpiece held on the chuck table; , Machining condition input means for setting machining conditions corresponding to the scheduled division lines having different characteristics when machining the planned division lines, positions of the plurality of scheduled division lines on the workpiece, and the respective division schedules Storage means for storing the machining conditions set to in, and performing alignment for detecting the division lines of the workpiece held on the chuck table by operating the imaging means, and the storage means The processing is performed under the processing conditions corresponding to each of the predetermined division lines stored at the predetermined position.

  In the processing apparatus, the processing means is preferably a processing means having a spindle on which a cutting blade is mounted or a laser beam irradiation means.

  According to the processing apparatus of the present invention, since processing is performed under the processing conditions corresponding to each scheduled division line, the processing time can be shortened and processing can be performed well along the planned division line.

FIG. 1 is a perspective view illustrating a configuration example of a processing apparatus. FIG. 2 is a perspective view illustrating a configuration example of a division planned line in the workpiece. FIG. 3 is a flowchart showing an operation example of the processing apparatus. FIG. 4 is a diagram illustrating an example of setting the machining conditions. FIG. 5 is a diagram illustrating a correspondence relationship between processing conditions. FIG. 6 is a front view showing an operation example of the processing means.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment
The processing apparatus according to the embodiment will be described. FIG. 1 is a perspective view illustrating a configuration example of a processing apparatus. FIG. 2 is a perspective view illustrating a configuration example of a division line on the workpiece, and FIG. 2B is an enlarged view of the enclosing portion MB illustrated in FIG.

  The processing apparatus 100 is an apparatus that performs a cutting process on the workpiece W, as shown in FIG. The machining apparatus 100 includes a chuck table 1, a machining means 2 having a cutting blade 21, an X-axis moving means 3, a portal frame 4, a Y-axis moving means 5, a Z-axis moving means 6, and a cassette elevator 7. And a cleaning means 8 and a control means 9. The processing apparatus 100 performs a cutting process on the workpiece W bonded to the opening of the annular frame F via the bonding tape T.

  The workpiece W is various processing materials such as a semiconductor wafer or an optical device wafer on which a semiconductor device or an optical device is formed, an inorganic material substrate, a ductile resin material substrate, a ceramic substrate, a glass plate, or the like. The workpiece W is formed in a disk shape.

  The index feed direction (Y-axis direction) is the direction of the rotation axis of the cutting blade 21. The cutting feed direction (X-axis direction) is a direction orthogonal to the rotation axis of the cutting blade 21. The cutting feed direction (Z-axis direction) is the vertical direction. The index feed direction and the cutting feed direction are orthogonal to each other on the same horizontal plane, and the cutting feed direction is orthogonal to the same horizontal plane.

  The chuck table 1 is formed in a disc shape and includes a holding surface 11 and a plurality of frame chucks 12. The chuck table 1 can be moved relative to the apparatus main body 101 in the cutting feed direction. The holding surface 11 holds the workpiece W. The holding surface 11 is the upper end surface in the vertical direction of the chuck table 1 and is formed flat with respect to the horizontal plane. The holding surface 11 is made of, for example, porous ceramic, and sucks and holds the workpiece W by a negative pressure of a vacuum suction source (not shown). The plurality of frame chucks 12 are arranged at four locations around the holding surface 11 and sandwich and fix the annular frame F.

The processing means 2 processes the workpiece W held on the chuck table 1 with a cutting blade 21. The processing means 2 is fixed to the portal frame 4 through the Y axis moving means 5 and the Z axis moving means 6 so as to be movable in the indexing direction and the cutting feed direction. Two processing means 2 are arranged across the chuck table 1 in the index feed direction. In addition to the cutting blade 21, the processing means 2 includes a spindle 22, a housing 23, a nozzle 24, and an imaging means 25. The cutting blade 21 is a cutting grindstone formed in an extremely thin disk shape and in an annular shape. The spindle 22 is detachably mounted with a cutting blade 21. The housing 23 has a drive source such as a motor, and supports the spindle 22 so as to be rotatable around a rotation axis in the indexing feed direction. The nozzle 24 supplies cutting water to the cutting blade 21 and the workpiece W. The image pickup means 25 is a camera having an image pickup element such as a CCD (Charge Coupled Device) image sensor. The imaging means 25 is a target for alignment corresponding to the division line L (L1 _{a to} L11 _a , L1 _{b to} L11 _b ) set on the workpiece W held on the chuck table 1 or the division line L. G is imaged and detected.

  The X-axis moving means 3 processes and feeds the chuck table 1 and the processing means 2 relatively in the cutting feed direction. The X-axis moving unit 3 includes, for example, a pulse motor, a ball screw, a guide rail, and the like. The X-axis moving unit 3 moves the moving base 31 on which the chuck table 1 is fixed relative to the apparatus main body 101 in the cutting feed direction.

  The portal frame 4 supports the processing means 2 so as to be movable in each of the index feed direction and the cut feed direction. The portal frame 4 is erected on the apparatus main body 101 across the X-axis moving means 3 in the index feeding direction.

  The Y-axis moving means 5 is disposed on the portal frame 4 and relatively moves the chuck table 1 and the processing means 2 in the indexing and feeding direction. The Y-axis moving unit 5 includes, for example, a pulse motor, a ball screw, a guide rail, and the like, and moves the processing unit 2 relative to the chuck table 1 in the indexing and feeding direction.

  The Z-axis moving means 6 is disposed on the portal frame 4 and relatively moves the chuck table 1 and the processing means 2 in the cutting and feeding direction. The Z-axis moving unit 6 includes, for example, a pulse motor, a ball screw, a guide rail, and the like. The Z-axis moving unit 6 moves the moving base 61 on which the processing unit 2 is fixed relative to the chuck table 1 in the cutting and feeding direction.

  The cassette elevator 7 supports the apparatus main body 101 such that a cassette 71 in which a plurality of workpieces W are accommodated is vertically movable.

  The cleaning means 8 cleans the workpiece W cut by the processing means 2 by holding it with a spinner table 81.

  The control means 9 controls the machining apparatus 100, and controls the machining means 2, the X-axis moving means 3, the Y-axis moving means 5 and the Z-axis moving means 6, and the work to be held held on the chuck table 1. The object W is cut by the processing means 2.

  The control unit 9 includes a touch panel 91 that is a processing condition input unit, and a storage unit 92. The touch panel 91 is used to set processing conditions when processing the division line L for dividing the workpiece W. Since there are scheduled division lines L having different characteristics in the planned division lines L, processing conditions corresponding to the divided division lines L having different characteristics are set. The touch panel 91 displays a setting screen for setting processing conditions. On the setting screen, a plurality of setting items and input fields corresponding to the setting items are displayed. When the input field corresponding to each setting item on the processing condition setting screen is tapped by the operator, the touch panel 91 causes the cursor to blink in the tapped input field and display a software key for inputting a numerical value. . When a numerical value is input by operating the software key by the operator, the touch panel 91 outputs an input value corresponding to the setting item to the control means 9.

  The processing conditions include the feed speed, the spindle rotation speed, the height position of the cutting blade 21, and the amount of cutting water. The feed speed is a speed at which the cutting blade 21 is moved in the cutting feed direction. The spindle rotation speed is the rotation speed per unit time of the spindle 22. The height position of the cutting blade 21 is a height at which the cutting blade 21 is positioned with respect to the holding surface 11 of the chuck table 1. The amount of cutting water is the amount of water supplied from the nozzle 24 to the cutting blade 21 during cutting.

  The scheduled division lines L having different characteristics include a scheduled division line L that includes the TEG 110 and a scheduled division line L that does not include the TEG 110. Here, the TEG 110 is a metal element for evaluation for finding out design and manufacturing problems occurring in the device D. Since the scheduled division line L including the TEG 110 is more difficult to cut than the planned division line L not including the TEG 110, a processing condition such as a slower feed speed of the cutting blade 21 is set.

  As shown in FIG. 2, the workpiece W is partitioned in a grid pattern by division planned lines L formed in a first direction and a second direction orthogonal to the first direction. In the workpiece W, a device D is formed in each partitioned area.

Each division line L can specify the position of the division line L in the workpiece W. On the workpiece W, alignment targets G (G1 to G8) are formed. For example, the target G has an L shape, and is formed at eight positions on a part of the corner of the workpiece W in which the device D is formed. A line segment connecting the target G1 and the target G2 and a line segment connecting the target G3 and the target G4 are formed in parallel with the planned division line L (L1 _{a to} L11 _a ) in the first direction. Further, the line segment connecting the target G5 and the target G6 and the line segment connecting the target G7 and the target G8 are formed in parallel with the planned division line L (L1 _{b to} L11 _b ) in the second direction.

By detecting the target G, the position of the division planned line L is specified. For example, dividing lines L1 _a in the first direction and is formed in the vicinity of the target G1, G2, when detecting the target G1, G2, can be uniquely specify the position of the dividing line L1 _a. If identifying the position of the dividing line L1 _a, can identify the position of the other division lines _{L2 a ~L11} a. For example, the distance between the target G7 and the target G8 is obtained, the obtained distance is divided by the number of devices D formed between the targets G7 and G8, and the interval between the division lines L is obtained from the divided result. When the interval of the planned division line L is obtained, the positions of the planned division lines L2 _{a to} L11 _a are specified by adding the intervals of the planned division line L with reference to the position of the planned division line L1 _a. be able to. In addition, the positions of the scheduled division lines L1 _{b to} L11 _b in the second direction can be specified in the same manner as the planned division lines L1 _{a to} L11 _{a in} the first direction.

  The storage unit 92 stores the machining conditions for each division planned line L. For example, the storage unit 92 stores the scheduled division line L and the machining conditions set for each scheduled division line L in association with each other. The storage unit 92 stores an alignment pattern.

  Next, an operation example of the processing apparatus 100 will be described. FIG. 3 is a flowchart showing an operation example of the processing apparatus. FIG. 4 is a diagram illustrating an example of setting the machining conditions. FIG. 5 is a diagram illustrating a correspondence relationship between processing conditions. FIG. 6 is a front view showing an operation example of the processing means.

  The operator holds the workpiece W supported by the annular frame F on the chuck table 1 (step S1 shown in FIG. 3). For example, the annular frame F is sandwiched between the frame chucks 12, and the workpiece W is sucked and held by the holding surface 11 of the chuck table 1 via the adhesive tape T.

The operator sets processing conditions for the workpiece W (step S2). For example, the operator operates the touch panel 91 to display a setting screen for setting processing conditions, and sets the processing conditions from the displayed setting screen. For example, the operator sets the feed speed of the cutting blade 21 and the spindle rotation speed, the height position of the cutting blade 21, and the amount of cutting water as predetermined values as the first processing condition. The operator assigns the first machining condition in which various values are set to each scheduled division line L displayed on the touch panel 91. For example, the operator assigns the first processing condition to the scheduled division lines L1 _a , L2 _a , L4 _{a to} L8 _a , L10 _a , L11 _a in the first direction and the scheduled division lines L1 _{b to} L11 _b in the second direction. . The division schedule lines L1 _a , L2 _a , L4 _{a to} L8 _a , L10 _a , L11 _a , and L1 _{b to} L11 _{b in} which the first machining conditions are set do not include the TEG 110.

Further, the operator sets the feed speed of the cutting blade 21 and the spindle rotation speed, the height position of the cutting blade 21, and the amount of cutting water to values different from the first machining condition as the second machining condition. For example, the operator sets the feed speed of the cutting blade 21 slower than the first processing condition, sets the spindle rotation speed higher than the first processing condition, and sets the height position of the cutting blade 21 to the holding surface of the chuck table 1. 11 is set so as to be closer to the first processing condition, and the cutting water amount is set to be supplied more than the first processing condition. The operator assigns the second machining conditions in which various values are set to the division planned lines L3 _a and L9 _a in the first direction. As shown in FIG. 2B, the TEGs 110 are locally included in the scheduled division lines L3 _a and L9 _a for which the second processing conditions are set. The first machining condition and the second machining condition set by the operator are stored in the storage means 92 as shown in FIG. Further, the processing conditions assigned to the division line L are stored in the storage unit 92 as shown in the correspondence table of FIG. For example, information indicating the position of the planned division line L is registered in the “division planned line” item. In the item “machining condition”, the first machining condition or the second machining condition corresponding to each scheduled division line L is registered. In the “division direction” item, the division direction (first direction or second direction) of the workpiece W corresponding to each planned division line L is registered.

Next, the control means 9 performs alignment (step S3). The control means 9 compares the image picked up by the image pickup means 25 with the alignment pattern stored in the storage means 92, detects a target G that matches the alignment pattern, and based on the detected target G The position of the division line L is determined. For example, the control unit 9 controls the Y-axis moving means 5, to move the cutting blade 21 in the vicinity of the outermost dividing line L1 _a workpiece W. The control unit 9 controls the X-axis moving unit 3 to move the workpiece W in the X-axis direction by the entire length of the workpiece W in the X-axis direction, and the image captured by the imaging unit 25 and the alignment pattern And two targets G1 and G2 that match the pattern are detected. The control means 9 acquires the detected Y coordinates of the targets G1 and G2. When the Y coordinates of the targets G1 and G2 are not equal, the direction of the planned division line L is not coincident with the X-axis direction and is inclined, so the chuck table 1 is rotated so that the direction of the planned division line L is the X-axis direction. Adjust the angle to match.

After the alignment adjustment, the control means 9 identifies the dividing lines L1 _a cutting target based on the target G1, G2. Control means 9, the processing conditions of the identified dividing lines L1 _a is, determines whether or not to cut the dividing lines that do not contain TEG110 (step S4). For example, the control means 9 refers to the correspondence table shown in FIG. 5 and acquires the machining condition “first machining condition” corresponding to the planned division line L1 _a . Control means 9, under the conditions set in the first machining condition shown in FIG. 4 (a), cutting the workpiece W along the dividing lines L1 _a and controls the feeding speed of the cutting blade 21 (Step S5).

After cutting the dividing lines L1 _a, the control unit 9 determines whether or not cut all the dividing line L (step S6). When the control means 9 determines that all the planned division lines L have been cut, the cutting process ends. When the control means 9 determines that all the planned division lines L have not been cut, the control blade 9 moves the cutting blade 21 to the next planned division line L (step S7). The processing conditions are obtained with reference to the correspondence table shown in (4).

In step S4, for example, if the division lines L is the dividing line L3 _a, the control unit 9 obtains a second machining condition. Control means 9 controls the FIG 4 (b) the feed rate of the second cutting blade 21 in a condition set in the machining conditions shown or the like, as shown in FIG. 6, along the dividing line L3 _a subject The workpiece W is cut (step S8). For example, the control means 9 moves the feed speed of the cutting blade 21 slower than the first processing condition, rotates the spindle rotation speed higher than the first processing condition, and sets the height position of the cutting blade 21 to the chuck table 1. The holding surface 11 is brought closer than the first processing condition, and a larger amount of cutting water is supplied than the first processing condition.

  As described above, according to the machining apparatus 100 according to the embodiment, alignment is performed by imaging and detecting the division line L of the workpiece W held on the chuck table 1 by operating the imaging unit 25 and storing the alignment. Processing is performed under the processing conditions corresponding to each of the scheduled division lines L stored by the means 92. Thereby, in the case of the division line L that does not include the TEG 110, the workpiece W can be cut along the division line L at a high machining speed, so that the machining time can be shortened. Further, in the case of the division line L including the TEG 110, the workpiece W can be reliably cut along the division line L by slowing the feed speed of the cutting blade 21 or the like. Therefore, clogging of the cutting blade 21 due to cutting the TEG 110 can be prevented, and back surface chipping on the back surface of the workpiece W can be prevented. In particular, when the TEG 110 is locally formed on the planned division line L, the cutting load is concentrated and increased. However, by cutting the TEG 110 under the second machining condition, the division planned line L including the TEG 110 is surely obtained. Can be cut. Further, as in the prior art, since it is not necessary to control the cutting line at any time by observing the cut line at any time and the observation result is defective, it causes a defect when cutting along the division line L. There is nothing.

[Modification]
In addition to processing the workpiece W along the division line L by the cutting blade 21, the workpiece W may be processed along the division line L by laser beam irradiation. In the case of laser beam irradiation, the feed rate and laser power of the laser beam irradiation means are set to predetermined values as the first processing condition for processing along the division line L that does not include the TEG 110. As a second processing condition for processing along the division line L including the TEG 110, the feed rate of the laser beam irradiation means is set slower than the first processing condition, and the laser power is set stronger than the first processing condition. As a result, the TEG 110 can be cut reliably, and the workpiece W can be cut along the scheduled division line L in a short time.

  In addition, the first processing condition and the second processing condition have been described as examples of processing conditions, but processing conditions may be further added. For example, when the TEG 110 having a different material or size is formed for each division line L, a third processing condition for processing the division line L including the different TEGs 110 may be added.

  In addition to changing the machining conditions for each division planned line L, the machining conditions may be changed in the middle of one line. For example, when the TEG 110 is locally formed near the center of the line to be divided L, the position (X coordinate) of the TEG 110 in the X-axis direction is stored in advance, and the cutting blade 21 is positioned near the center of the line. It is possible to perform the machining under the second machining condition only during the period, and when the cutting blade 21 is located at the machining start position and the machining end position, the machining may be performed under the first machining condition. Thereby, processing time can be further shortened.

  The position and shape of the alignment target G are not particularly limited as long as the alignment can be adjusted and the position of the division line L can be specified. For example, the alignment target G may be formed on the device D.

1 Chuck table 2 Processing means 25 Imaging means 3 X-axis moving means
5 Y-axis moving means
6 Z-axis moving means 9 Control means 91 Touch panel 92 Storage means 100 Processing device 110 TEG
G Target L for alignment Line to be split W Workpiece

Claims (2)

A processing device that performs processing along a plurality of scheduled division lines set on a workpiece,
A chuck table for holding the workpiece;
Processing means for processing the workpiece held on the chuck table;
X-axis moving means for relatively processing and feeding the chuck table and the processing means in the X-axis direction;
Y-axis moving means for indexing and feeding the chuck table and the processing means in the Y-axis direction orthogonal to the X-axis direction;
An imaging means for detecting a division line set on the workpiece held on the chuck table;
A machining condition input means for setting machining conditions corresponding to the division planned lines having different characteristics when machining the division planned lines;
Storage means for storing the positions of the plurality of division lines on the workpiece and the processing conditions set for each division line;
Alignment for detecting the division line of the workpiece held on the chuck table by operating the imaging unit is executed, and the processing conditions corresponding to each division line at a predetermined position stored in the storage unit Processing equipment characterized by processing with   2. The processing apparatus according to claim 1, wherein the processing means is a processing means having a spindle on which a cutting blade is mounted or a laser beam irradiation means.

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