JP2018113417A - Cutting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting device which can suppress clogging of a cutting blade, when detecting a reference position.SOLUTION: A cutting device 1 includes a chuck table 10 for holding a workpiece on a holding surface 10a, a cutting unit 20 having a cutting blade 21 for cutting the workpiece held on the chuck table 10, an X-axis movement unit performing relative processing feed of the chuck table 10 and the cutting unit 20 in the X-axis direction, a Z-axis movement unit 50 performing cutting feed of the cutting unit 20 in a Z-axis direction orthogonal to the holding surface 10a, and a reference position setting unit 60 for setting a reference position in the Z-axis direction where a leading end of the cutting blade 21 comes into contact with the holding surface 10a. The reference position setting unit 60 includes a camera 61 for imaging the chuck table 10 from a side face, and a distance detector 64 for detecting a distance K between an edge 21a of the cutting blade 21 and the holding surface 10a in the Z-axis direction, from an image captured by means of the camera 61.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a cutting apparatus.

  2. Description of the Related Art A cutting apparatus that divides a workpiece such as a semiconductor wafer, a package substrate, or a ceramic substrate into individual device chips with a cutting blade is known. The cutting device performs cutting by controlling the position of the cutting blade with the position where the tip (lower end) of the cutting blade contacts the holding surface of the chuck table as a reference position. The reference position is set using a mechanism that conducts when the cutting blade comes into contact with the chuck table (see, for example, Patent Document 1).

Utility Model Registration No. 2597808

  The above-described cutting apparatus disclosed in Patent Document 1 cuts the chuck table slightly with a cutting blade when detecting the reference position, and in particular cuts the metal frame portion of the chuck table. There was a problem that the blade was clogged or clogged.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a cutting apparatus capable of suppressing clogging of a cutting blade when detecting a reference position.

  In order to solve the above-described problems and achieve the object, a cutting apparatus of the present invention includes a chuck table that holds a workpiece on a holding surface, and a cutting blade that cuts the workpiece held on the chuck table. A cutting unit having a machining feed unit that relatively feeds the chuck table and the cutting unit in a machining feed direction parallel to the holding surface, and a cutting feed direction perpendicular to the holding surface. A cutting apparatus comprising: a cutting feed unit that feeds; and a reference position setting unit that sets a reference position in the cutting feed direction in which a tip of the cutting blade contacts the holding surface, the reference position setting unit comprising: A camera installed on a substantially extended line of the holding surface and taking an image of the chuck table from the side, and a cutting feed direction on the side of the chuck table A distance detecting unit that descends and detects the distance between the cutting edge and the holding surface in the cutting feed direction from an image obtained by imaging the cutting edge and the holding surface that are positioned on the substantially extended line of the holding surface with the camera And.

  The cutting device of the present invention has an effect that the cutting blade can be prevented from being clogged when the reference position is detected.

FIG. 1 is a perspective view illustrating a configuration example of a cutting apparatus according to the first embodiment. FIG. 2 is a side view of a main part of the cutting apparatus shown in FIG. FIG. 3 is a flowchart illustrating a flow in which the control unit of the cutting apparatus according to the first embodiment sets the reference position. FIG. 4 is a side view showing the cutting unit, chuck table and the like positioned at step ST3 in FIG. FIG. 5 is a diagram illustrating an image obtained by imaging the chuck table and the cutting blade illustrated in FIG. 4 with a camera. FIG. 6 is a side view showing the cutting unit, the chuck table, and the like positioned at step ST10 in FIG. FIG. 7 is a diagram illustrating an image obtained by imaging the chuck table and the cutting blade illustrated in FIG. 6 with a camera. FIG. 8 is a side view illustrating a cutting unit, a chuck table, and the like when setting a reference position of the cutting apparatus according to the second embodiment. FIG. 9 is a diagram illustrating an image obtained by imaging the chuck table and the cutting blade illustrated in FIG. 8 with a camera. FIG. 10 is a side view showing a cutting unit, a chuck table, and the like when setting a reference position of the cutting apparatus according to the third embodiment. FIG. 11 is a diagram illustrating an image obtained by imaging the chuck table and the cutting blade illustrated in FIG. 10 with a camera. FIG. 12 is a side view of the main part of the cutting device according to the fourth embodiment. FIG. 13 is a plan view of a main part of the cutting apparatus shown in FIG. FIG. 14 is a diagram illustrating an image obtained by imaging the chuck table and the cutting blade illustrated in FIG. 12 with a camera.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment 1
A cutting apparatus according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view illustrating a configuration example of a cutting apparatus according to the first embodiment. FIG. 2 is a side view of a main part of the cutting apparatus shown in FIG.

  A cutting apparatus 1 according to Embodiment 1 shown in FIG. 1 is an apparatus that cuts (processes) a workpiece W. In the first embodiment, the workpiece W is a disk-shaped semiconductor wafer or optical device wafer whose base material is silicon, sapphire, gallium, or the like. In the workpiece W, a device D is formed in an area defined by a plurality of division lines L formed in a lattice pattern on the surface WS.

  The workpiece W is formed by attaching the adhesive tape T to the back surface WR on the back side of the front surface WS on which a plurality of devices D are formed, and attaching the outer edge of the adhesive tape T to the annular frame F. Is supported by an adhesive tape T. In the first embodiment, the workpiece W is divided into individual devices D by being cut along the planned division line L while being supported by the adhesive tape T at the opening of the annular frame F. In the present invention, the workpiece W may be a so-called TAIKO wafer in which the central portion is thinned and the thick portion is formed on the outer peripheral portion. In addition to the wafer, there are a plurality of devices sealed with resin. A rectangular package substrate, a ceramic plate, a glass plate, or the like may be used.

  The cutting apparatus 1 shown in FIG. 1 is a processing apparatus that cuts (processes) the workpiece W and divides the workpiece W into individual devices D. As shown in FIG. 1, the cutting apparatus 1 includes a chuck table 10 that sucks and holds a workpiece W with a holding surface 10a, a cutting unit 20 that cuts the workpiece W held on the chuck table 10, and a machining feed. An X-axis movement unit 30 that is a unit, a Y-axis movement unit 40 that is an index feed unit, a Z-axis movement unit 50 that is a cutting feed unit, and a reference position setting unit 60 are provided. As shown in FIG. 1, the cutting device 1 includes two cutting units 20, that is, a 2-spindle dicer, a so-called facing dual type cutting device.

  The chuck table 10 has a disk shape and includes a holding portion 11 made of porous ceramic or the like and a ring-shaped outer peripheral flange portion 12 surrounding the holding portion 11. The surface of the holding unit 11 is a holding surface 10 a that holds the workpiece W. The holding surface 10a and the surface of the outer peripheral flange 12 are disposed on the same plane. Further, the chuck table 10 is provided so as to be movable by the X-axis moving unit 30 and to be rotatable by the rotation drive source 16. The chuck table 10 is connected to a vacuum suction source (not shown), and sucks and holds the workpiece W by being sucked by the vacuum suction source. The rotational drive source 16 is disposed on a moving table 15 that is moved in the X-axis direction by the X-axis moving unit 30.

  The cutting unit 20 includes a spindle (not shown) on which a cutting blade 21 for cutting the workpiece W held on the chuck table 10 is mounted. Each of the cutting units 20 is provided so as to be movable in the Y-axis direction by the Y-axis moving unit 40 with respect to the workpiece W held on the chuck table 10, and in the Z-axis direction by the Z-axis moving unit 50. It is provided movably.

  As shown in FIG. 1, one cutting unit 20 is provided on one column portion 3 a erected from the apparatus main body via a Y-axis moving unit 40, a Z-axis moving unit 50, and the like. As shown in FIG. 1, the other cutting unit 20 is provided on the other column portion 3 b erected from the apparatus main body 2 via a Y-axis movement unit 40, a Z-axis movement unit 50, and the like. Note that the upper ends of the column portions 3a and 3b are connected by a horizontal beam 3c.

  The cutting unit 20 can position the cutting blade 21 at an arbitrary position on the holding surface 10 a of the chuck table 10 by the Y-axis moving unit 40 and the Z-axis moving unit 50. In addition, one cutting unit 20 is fixed so that an imaging unit 80 that images the surface WS of the workpiece W moves integrally. The imaging unit 80 includes a CCD (Charge Coupled Device) camera that captures an area to be divided of the workpiece W before cutting held by the chuck table 10. The CCD camera images the workpiece W held on the chuck table 10 to obtain an image for performing alignment for aligning the workpiece W and the cutting blade 21, and the obtained image is used as a reference position. Output to the control unit 62 of the setting unit 60.

  The cutting blade 21 is an extremely thin cutting grindstone having a substantially ring shape. The spindle cuts the workpiece W by rotating the cutting blade 21. The spindle is accommodated in the spindle housing, and the spindle housing is supported by the Z-axis moving unit 50. The spindle of the cutting unit 20 and the axis of the cutting blade 21 are set parallel to the Y-axis direction.

  The X-axis moving unit 30 moves the chuck table 10 and the cutting unit 20 by moving the chuck table 10 in the X-axis direction, which is a machining feed direction parallel to both the holding surface 10a and the longitudinal direction of the apparatus main body 2. The workpiece is relatively fed along the X-axis direction. The Y-axis moving unit 40 moves the cutting unit 20 in the Y-axis direction that is an indexing feed direction that is parallel to both the holding surface 10a and the horizontal direction and orthogonal to the X-axis direction. 20 is relatively indexed and fed along the Y-axis direction. The Z-axis moving unit 50 cuts the chuck table 10 and the cutting unit 20 relatively along the Z-axis direction by moving the cutting unit 20 in the Z-axis direction that is a cutting feed direction orthogonal to the holding surface 10a. To send.

  The X-axis moving unit 30, the Y-axis moving unit 40, and the Z-axis moving unit 50 are arranged around the well-known ball screws 31, 41, 51 and ball screws 31, 41, 51 provided to be rotatable around the axis. And known guide rails 33, 43, and 53 that support the chuck table 10 or the cutting unit 20 movably in the X-axis direction, the Y-axis direction, or the Z-axis direction.

  Further, the cutting device 1 detects an X-axis direction position detection unit (not shown) for detecting the position of the chuck table 10 in the X-axis direction, and a Y-axis direction position (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction. A detection unit and a Z-axis direction position detection unit 54 for detecting the position of the cutting unit 20 in the Z-axis direction are provided. The X-axis direction position detection unit and the Y-axis direction position detection unit can be configured by a linear scale parallel to the X-axis direction or the Y-axis direction and a reading head. The Z-axis direction position detection unit 54 detects the position of the cutting unit 20 in the Z-axis direction with the pulse of the pulse motor 52. The X-axis direction position detection unit, the Y-axis direction position detection unit, and the Z-axis direction position detection unit 54 output the X-axis direction of the chuck table 10 and the position of the cutting unit 20 in the Y-axis direction or the Z-axis direction to the control unit 62. To do.

  The reference position setting unit 60 sets the reference position of the cutting unit 20 in the Z-axis direction in which the tip of the cutting edge 21a shown in FIG. 2 of the cutting blade 21 is in contact with the holding surface 10a (or is located on the same plane). is there. The reference position is a position in the Z-axis direction of the cutting unit 20 where the lower end, which is the tip of the cutting edge 21a of the cutting blade 21, is located on the same plane as the holding surface 10a.

  The reference position setting unit 60 includes a camera 61 and a control unit 62, as shown in FIGS. The camera 61 is installed on a substantially extended line of the holding surface 10a, and images the chuck table 10 from the side surface. The installation of the camera 61 on a substantially extended line of the holding surface 10a means that the holding surface 10a is located at the center in the Z-axis direction of the image captured by the camera 61, and the optical axis of the camera 61 is the same as that of the holding surface 10a. It is parallel and located on the same plane as the holding surface 10a. In the first embodiment, the camera 61 is attached to the pillar portion 3a and is configured by a CCD camera. The objective lens facing the side surface of the chuck table 10 of the camera 61 is protected by the shutter 63. The shutter 63 allows the camera 61 to expose the side surface of the chuck table 10 when the camera 61 takes an image, that is, sets a reference position, and allows the camera 61 to take an image of the side surface of the chuck table 10. When the value is not set, foreign objects adhere to the objective lens by covering the objective lens.

  The control unit 62 controls the above-described components of the cutting device 1 to cause the cutting device 1 to perform a machining operation on the workpiece W. The control unit 62 is a computer. The control unit 62 is connected to a display device (not shown) configured by a liquid crystal display device or the like that displays a processing operation state or an image and an input device (not shown) used when an operator registers processing content information. The input device includes at least one of a touch panel provided with a display device and an external input device such as a keyboard.

  The control unit 62 is configured such that the cutting unit 20 descends in the Z-axis direction on the side of the chuck table 10, and the lower end of the cutting edge 21 a of the cutting blade 21 and the holding surface 10 a that are positioned substantially on the extension line of the holding surface 10 a Is provided with a distance detection unit 64 that detects a distance K between the blade edge 21a and the holding surface 10a in the Z-axis direction from the image G captured in FIG. When the distance detector 64 detects the distance between the cutting edge 21a and the holding surface 10a in the Z-axis direction, the objective lens of the camera 61 is exposed to the shutter 63, the cutting unit 20 is lowered, and the camera 61 The chuck table 10 and the cutting blade 21 of the cutting unit 20 are imaged. The distance detection unit 64 detects the distance K in the Z-axis direction between the blade edge 21a and the holding surface 10a based on the image G obtained by the camera 61. The control unit 62 calculates the reference position based on the distance K detected by the distance detection unit 64, the detection result of the Z-axis direction position detection unit 54, and stores (sets) the calculated reference position. The control unit 62 sets a reference position for each cutting unit 20.

  Next, the machining operation of the cutting device 1 according to the first embodiment will be described. In the machining operation, the operator registers the machining content information in the control unit 62, and the cutting device 1 starts the machining operation when the operator gives an instruction to start the machining operation. First, when the operator places the workpiece W before cutting on the holding surface 10a of the chuck table 10, and receives an instruction to start the machining operation from the operator, the control unit 62 starts the machining operation.

  In the machining operation, the control unit 62 sucks and holds the workpiece W on the holding surface 10a of the chuck table 10, moves the chuck table 10 downward of the cutting unit 20 by the X-axis moving unit 30, and The workpiece W held on the chuck table 10 is positioned below the imaging unit 80 attached to the cutting unit 20, and the imaging unit 80 is caused to image the workpiece W. The control unit 62 performs image processing such as pattern matching for aligning the planned division line L of the workpiece W held on the chuck table 10 with the cutting blade 21 of the cutting unit 20, and the chuck table. The relative position between the workpiece W held by 10 and the cutting unit 20 is adjusted.

  Then, the control unit 62 plans to divide the cutting blade 21 and the workpiece W by the X-axis movement unit 30, the Y-axis movement unit 40, the Z-axis movement unit 50, and the rotational drive source 16 based on the machining content information. The line L is moved relatively along the line L, and the division line L is cut by the cutting blade 21.

  When the control unit 62 cuts all the division lines L and divides the workpiece W into the individual devices D, the chuck table 10 is retracted from below the cutting unit 20 and then the chuck table 10 is sucked and held. Is released.

  Next, a method for setting the reference position by the control unit 62 will be described with reference to the drawings. FIG. 3 is a flowchart illustrating a flow in which the control unit of the cutting apparatus according to the first embodiment sets the reference position. FIG. 4 is a side view showing the cutting unit, chuck table and the like positioned at step ST3 in FIG. FIG. 5 is a diagram illustrating an image obtained by imaging the chuck table and the cutting blade illustrated in FIG. 4 with a camera. FIG. 6 is a side view showing the cutting unit, the chuck table, and the like positioned at step ST10 in FIG. FIG. 7 is a diagram illustrating an image obtained by imaging the chuck table and the cutting blade illustrated in FIG. 6 with a camera.

  In the machining operation, the control unit 62 repeatedly executes the flowchart shown in FIG. 3 at a predetermined timing set in advance. The control unit 62 determines whether it is the reference position setting timing (step ST1). If the control unit 62 determines that it is not the reference position setting timing (step ST1: No), it repeats step ST1. The reference position setting timing is a timing for setting a reference position, and is, for example, at the start of a machining operation every time a predetermined number of division lines L are cut.

  When the control unit 62 determines that it is the reference position setting timing (step ST1: Yes), the objective lens of the camera 61 is exposed to the shutter 63 and whether or not the reference position has already been set, that is, the reference position is determined. It is determined whether or not it is stored (step ST2). When the reference position has already been set (step ST2: Yes), the control unit 62 lowers the cutting unit 20 to position the cutting unit 20 at the already set reference position, as shown in FIG. The camera 61 images the side surface of the chuck table 10 and the cutting blade 21 of the cutting unit 20. The camera 61 outputs an image G obtained by capturing an example shown in FIG. 5 to the control unit 62 (step ST3).

  The distance detection unit 64 of the control unit 62 extracts the holding surface 10a and the cutting edge 21a of the cutting blade 21 from the image G, and detects the distance K in the Z-axis direction between the holding surface 10a and the lower end of the cutting edge 21a (step ST4). ). Based on the reference position that has already been set and the distance K detected by the distance detector 64, the control unit 62 provides a new reference position at which the lower end of the cutting edge 21a of the cutting blade 21 is located on the same plane as the holding surface 10a. Is set as a new reference position (step ST5), and the process returns to step ST1.

  When the reference position is not set (step ST2: No), the control unit 62 causes the camera 61 to image the side surface of the chuck table 10 and the cutting blade 21 of the cutting unit 20 while lowering the cutting unit 20, and also uses the camera 61. The distance detection unit 64 detects the distance K in the Z-axis direction between the holding surface 10a and the lower end of the blade edge 21a from the image G obtained by imaging (step ST10). In step ST10, as shown in FIG. 6, the control unit 62 lowers the cutting unit 20 until the holding surface 10a and the lower end of the cutting edge 21a of the cutting blade 21 are located on the same plane. In step ST10, when the holding surface 10a and the lower end of the cutting edge 21a of the cutting blade 21 are located on the same plane in the image G obtained by the camera 61 as shown in FIG. The descent of the unit 20 is stopped. The control unit 62 calculates the reference position based on the detection result of the Z-axis direction position detection unit 54, sets the calculated reference position (step ST11), and returns to step ST1.

  As described above, according to the cutting apparatus 1 according to the first embodiment, the distance detection unit 64 uses the Z axis between the blade edge 21a and the holding surface 10a from the image G obtained by the camera 61 capturing an image from the side surface of the chuck table 10. Since the control unit 62 detects the direction distance K and sets the reference position, the reference position can be set without bringing the cutting blade 21 into contact with the chuck table 10. For this reason, the cutting device 1 has an effect that the cutting blade 21 is not damaged. As a result, the cutting apparatus 1 can suppress clogging of the cutting blade 21 when detecting the reference position. Further, since the cutting apparatus 1 can set the reference position without bringing the cutting blade 21 into contact with the chuck table 10, it is not necessary for the chuck table 10 to have conductivity, and the chuck table is not limited to a material. 10 can be produced.

  In the cutting device 1 according to the first embodiment, the control unit 62 sets the reference position from the image G obtained by the camera 61 capturing an image from the side surface of the chuck table 10. An image G having a light emitting portion and a light receiving portion with a cutting blade interposed therebetween and having a higher resolution than an optical sensor that detects the amount of light received by the light receiving portion is used. As a result, the cutting apparatus 1 can set the reference position with higher accuracy than when the reference position is set using the optical sensor.

[Embodiment 2]
A cutting apparatus according to Embodiment 2 of the present invention will be described. FIG. 8 is a side view illustrating a cutting unit, a chuck table, and the like when setting a reference position of the cutting apparatus according to the second embodiment. FIG. 9 is a diagram illustrating an image obtained by imaging the chuck table and the cutting blade illustrated in FIG. 8 with a camera. In FIG. 8 and FIG. 9, the same parts as those of the first embodiment are denoted by the same reference numerals and the description thereof is omitted. The cutting apparatus 1 according to the second embodiment has the same configuration as that of the first embodiment except that the reference position setting method is different from that of the first embodiment.

  When the control unit 62 of the cutting apparatus 1 according to the second embodiment determines that it is the reference position setting timing, the objective lens of the camera 61 is exposed to the shutter 63 and cutting is performed while the camera 61 images the side surface of the chuck table 10. The unit 20 is lowered. The control unit 62 of the cutting apparatus 1 according to the second embodiment causes the cutting unit 20 to descend when a predetermined time has elapsed since the cutting blade 21 began to appear in the image G obtained by the camera 61 as shown in FIG. Stop.

  The distance detection unit 64 of the control unit 62 of the cutting apparatus 1 according to the second embodiment extracts the holding surface 10a and the cutting edge 21a of the cutting blade 21 from the image G shown in FIG. The distance K in the Z-axis direction between the holding surface 10a and the lower end of the blade edge 21a is detected. Based on the detection result of the Z-axis direction position detection unit 54 and the distance K detected by the distance detection unit 64, the control unit 62 positions the lower end of the cutting edge 21a of the cutting blade 21 on the same plane as the holding surface 10a. Determine the reference position and set the reference position.

  According to the cutting device 1 according to the second embodiment, as in the first embodiment, the control unit 62 sets the reference position from the image G obtained by the camera 61 capturing an image from the side surface of the chuck table 10. The reference position can be set without bringing the cutting blade 21 into contact therewith. As a result, the cutting apparatus 1 can suppress clogging of the cutting blade 21 when detecting the reference position.

  The control unit 62 of the cutting apparatus 1 according to the second embodiment lowers the cutting unit 20 while imaging the side surface of the chuck table 10 with the camera 61, and the cutting blade 21 is added to the image G obtained by the camera 61. Although the lowering of the cutting unit 20 is stopped when a predetermined time has elapsed after starting to appear, in the present invention, if the cutting blade 21 appears in the image G without lowering the cutting unit 20, the cutting unit 20 is not lowered. A reference position may be set.

[Embodiment 3]
A cutting apparatus according to Embodiment 3 of the present invention will be described. FIG. 10 is a side view showing a cutting unit, a chuck table, and the like when setting a reference position of the cutting apparatus according to the third embodiment. FIG. 11 is a diagram illustrating an image obtained by imaging the chuck table and the cutting blade illustrated in FIG. 10 with a camera. In FIG. 10 and FIG. 11, the same parts as those of the first embodiment are denoted by the same reference numerals and the description thereof is omitted. The cutting apparatus 1 according to the third embodiment has the same configuration as that of the first embodiment except that the chuck table 10 includes a reference position setting mark 17.

  As shown in FIG. 10, the chuck table 10 of the cutting device 1 according to the third embodiment includes a reference position setting mark 17 (indicated by a parallel oblique line in FIG. 10). A distance K2 in the Z-axis direction from the holding surface 10a of the reference position setting mark 17 is predetermined. The reference position setting mark 17 is provided on the side surface of the chuck table 10 facing the camera 61. The reference position setting mark 17 is formed in a color different from the side surface of the chuck table 10, for example, a dark color such as black. In the third embodiment, the reference position setting mark 17 is formed in a straight line parallel to the horizontal direction, but the present invention is not limited to this shape.

  The control unit 62 of the cutting apparatus 1 according to the third embodiment stores the distance K2 between the reference position setting mark 17 and the holding surface 10a in the Z-axis direction in advance, and sets the reference position when the camera 61 is set. A distance K3 between the mark 17 and the lower end of the cutting edge 21a of the cutting blade 21 is calculated from the image G shown in FIG. 11 obtained by imaging, and the reference position is set as in the first embodiment. FIG. 11 shows an image G obtained by imaging by the camera in step ST10 of the flowchart shown in FIG. 3, but in the third embodiment, the camera 61 is also in step ST3 as in the first embodiment. An image G is obtained by imaging.

  According to the cutting apparatus 1 according to the third embodiment, as in the first embodiment, the control unit 62 sets the reference position from the image G obtained by the camera 61 capturing an image from the side surface of the chuck table 10. The reference position can be set without bringing the cutting blade 21 into contact therewith. As a result, the cutting apparatus 1 can suppress clogging of the cutting blade 21 when detecting the reference position. In the third embodiment, the reference position is set in the same manner as in the first embodiment. However, in the present invention, the reference position may be set in the same manner as in the second embodiment.

[Embodiment 4]
A cutting apparatus according to Embodiment 4 of the present invention will be described. FIG. 12 is a side view of the main part of the cutting device according to the fourth embodiment. FIG. 13 is a plan view of a main part of the cutting apparatus shown in FIG. FIG. 14 is a diagram illustrating an image obtained by imaging the chuck table and the cutting blade illustrated in FIG. 12 with a camera. 12 to 14, the same parts as those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted. The cutting device 1 according to the fourth embodiment has the same configuration as that of the first embodiment except that it includes an illumination unit 65.

  As shown in FIGS. 12 and 13, the cutting device 1 according to the fourth embodiment includes an illumination unit 65 that irradiates the side surface of the chuck table 10 with light LT. The illumination unit 65 is disposed at a position where the irradiated light LT is reflected by the side surface of the chuck table 10 and received by the camera 61. The illumination unit 65 is arranged at a position where the irradiated light LT does not hit the cutting blade 21. That is, the illumination unit 65 is disposed at a position that illuminates the side surface of the chuck table 10 and does not illuminate the cutting blade 21. For this reason, in the image G obtained by imaging the field of view V of the camera 61 shown in FIG. 13, the cutting blade 21 is dark and the chuck table 10 is brighter than the cutting blade 21 as shown in FIG. 14. Note that. The image G in FIG. 14 shows the cutting blade 21 with parallel diagonal lines, and the chuck table 10 with a white background. The control unit 62 of the cutting device 1 according to the fourth embodiment sets the reference position as in the first embodiment.

  According to the cutting apparatus 1 according to the fourth embodiment, as in the first embodiment, the control unit 62 sets the reference position from the image G obtained by the camera 61 capturing an image from the side surface of the chuck table 10. The reference position can be set without bringing the cutting blade 21 into contact therewith. As a result, the cutting apparatus 1 can suppress clogging of the cutting blade 21 when detecting the reference position.

  Further, the cutting apparatus 1 according to the fourth embodiment includes the illumination unit 65 that is disposed at a position that illuminates the side surface of the chuck table 10 and does not illuminate the cutting blade 21. The difference in contrast (brightness) between the chuck 21 and the chuck table 10 can be increased, and the reference position can be set accurately. In the fourth embodiment, the reference position is set in the same manner as in the first embodiment. However, in the present invention, the reference position may be set in the same manner as in the second embodiment. The mark 17 may be provided. In the fourth embodiment, the illumination unit 65 is disposed at a position where the side surface of the chuck table 10 is illuminated and the cutting blade 21 is not illuminated. However, in the present invention, the cutting blade 21 is illuminated and the side surface of the chuck table 10 is illuminated. The lighting unit 65 may be arranged at a position where it is not to be used.

  The control unit 62 of the cutting apparatus 1 according to the first to fourth embodiments described above includes an arithmetic processing unit having a microprocessor such as a CPU (central processing unit), a ROM (read only memory), or a RAM (random access memory). And the input / output interface device. The arithmetic processing device of the control unit 62 performs arithmetic processing according to a computer program stored in the storage device, and sends a control signal for controlling the cutting device 1 to the above-mentioned of the cutting device 1 via the input / output interface device. Output to the specified component. The functions of the control unit 62 and the distance detection unit 64 are realized when the arithmetic processing device executes a computer program stored in the storage device and stores necessary information in the storage device.

  The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Cutting device 10 Chuck table 10a Holding surface 20 Cutting unit 21 Cutting blade 30 X-axis movement unit (machining feed unit)
50 Z-axis moving unit (cutting feed unit)
60 Reference position setting unit 61 Camera 64 Distance detection unit W Workpiece G Image K Distance X Machining feed direction Z Cutting feed direction

Claims (1)

A chuck table for holding a workpiece on a holding surface, a cutting unit having a cutting blade for cutting the workpiece held on the chuck table, and the chuck table and the cutting in a machining feed direction parallel to the holding surface A machining feed unit that relatively feeds the unit, a cutting feed unit that cuts and feeds the cutting unit in a cutting feed direction orthogonal to the holding surface, and the notch in which the tip of the cutting blade contacts the holding surface A reference position setting unit for setting a reference position in the feed direction, and a cutting device comprising:
The reference position setting unit is
A camera installed on a substantially extended line of the holding surface and imaging the chuck table from the side surface;
From the image taken by the camera, the cutting edge and the holding surface, which are lowered in the cutting feed direction at the side of the chuck table and are positioned on the substantially extended line of the holding surface, the cutting of the cutting edge and the holding surface. A cutting device comprising: a distance detection unit that detects a distance in the feed direction.

Images