JP2023028108A - Inspection device and processing system - Google Patents

Abstract

To efficiently inspect the inside of a work-piece.SOLUTION: An inspection device, which inspects a work-piece, comprises: a holding table; an infrared camera unit that photographs the work-piece held on the holding table to form a photographed image; an inspecting part that processes the photographed image to inspects the work-piece; and a recording part that records a result of inspection of the work-piece performed by the inspecting part. The inspection device can obtain a first photographed image by making the infrared camera unit photograph the inside of the work-piece while putting a focus of the infrared camera unit on a first height between a front surface and a rear surface of the work-piece, can obtain a second photographed image by making the infrared camera unit photograph the inside of the work-piece while putting the focus on a second height which is different from the first height, and can record the obtained first photographed image and the obtained second photographed image in the recording part. The inspecting part can detect cracks or a modified layer occurring on the inside of the work-piece from the first photographed image and the second photographed image recorded in the recording part.SELECTED DRAWING: Figure 9

Description

The present invention relates to an inspection device that inspects a workpiece that has been processed by a processing device, and a processing system that includes the inspection device and the processing device.

A plurality of devices are formed on the surface of a thin plate-like wafer, the wafer is ground from the back side to thin it, and the wafer is divided into individual devices to form device chips to be mounted on electronic equipment. For grinding the wafer, a grinding device is used that can grind the workpiece with a grinding wheel on which a plurality of grinding wheels are arranged in a ring. For dividing a workpiece such as a wafer, for example, a cutting apparatus capable of cutting the workpiece with an annular cutting blade or a laser processing apparatus that processes the workpiece by irradiating the workpiece with a laser beam is used.

In these processing apparatuses, the workpiece is processed under predetermined processing conditions in order to obtain predetermined processing results. However, the workpiece may not be properly machined by the machining apparatus for reasons such as tool failure, machining apparatus failure, or workpiece failure. Then, there are cases where the workpiece or the chip is damaged, and the obtained chip becomes a defective product. Therefore, in order to confirm that the workpiece has been properly processed, the workpiece processed by the processing apparatus is photographed by a camera unit and inspected (see Patent Documents 1 and 2).

Japanese Patent Application Laid-Open No. 2021-32588 JP 2016-197702 A

Here, cutting blades used for cutting workpieces and grinding wheels used for grinding are worn out while workpieces are machined one after another, so they are replaced periodically. Immediately after replacement, the grindstones of these tools are likely to be in a state called clogging or clogging, and when these tools are used to machine a workpiece, the load applied to the workpiece increases and is called a crack. Cracks may form in the workpiece.

Cracks appearing outside the workpiece can be detected by observing the workpiece from the outside. However, cracks that cannot be detected by observing the workpiece from the outside, such as cracks that have progressed inward from the cut surface of the workpiece and cracks that do not appear on the outer surface of the workpiece, occur in the workpiece. Sometimes. In order to confirm that no unnecessary cracks are formed anywhere inside the workpiece, there is a demand for thoroughly inspecting the inside of the workpiece.

In addition, when laser processing is performed on a workpiece to form a modified layer by condensing a laser beam having a wavelength that passes through the workpiece at a predetermined height position inside the workpiece, the modified layer It is not easy to check from the outside of the workpiece whether or not the is properly formed. In other words, it is necessary to thoroughly inspect the inside of the workpiece to see if a modified layer is properly formed inside the workpiece and if an unnecessary modified layer is not formed inside the workpiece. is not easy.

SUMMARY OF THE INVENTION The present invention has been made in view of such problems, and an object of the present invention is to provide an inspection apparatus capable of efficiently inspecting the inside of a workpiece, and a processing system having the inspection apparatus.

According to one aspect of the present invention, there is provided an inspection apparatus for inspecting a workpiece, comprising: a holding table for holding the workpiece; an infrared camera unit to form an infrared camera unit, an inspection unit that processes the image formed by the infrared camera unit to inspect the workpiece, and a recording unit that records the inspection result of the workpiece by the inspection unit; and photographing the interior of the workpiece with the infrared camera unit with the focus of the infrared camera unit adjusted to a first height between the front surface and the back surface of the workpiece to obtain a first captured image with the infrared camera unit focusing the focus of the infrared camera unit on a second height different from the first height between the front surface and the back surface of the workpiece can obtain a second photographed image by photographing the inside of the, the obtained first photographed image and the second photographed image can be recorded in the recording unit, and the inspection unit is recorded in the recording unit Further, there is provided an inspection apparatus capable of detecting cracks or modified layers generated inside the workpiece from the first captured image and the second captured image.

Preferably, further comprising a moving unit for relatively moving the holding table and the infrared camera unit, and a display unit, wherein the first captured image and the second captured image are respectively the A moving unit relatively moves the holding table and the infrared camera unit to change the photographing area of the infrared camera unit while sequentially photographing the workpiece for each small section with the infrared camera unit. It is formed on the basis of small images.

Further, preferably, the display unit can display a first enlarged image obtained by enlarging a part of the first photographed image together with an area of the workpiece that is captured in the first enlarged image. A second magnified image obtained by magnifying a part of the photographed image of (1) can be displayed together with the area of the workpiece that appears in the second magnified image, and the inspection result of the inspection unit can be displayed.

Preferably, the holding table has an infrared transmitting plate that transmits infrared rays and supports the workpiece, and the infrared camera unit directly detects the workpiece supported by the holding table from above. an upper camera for photographing, and a lower camera for photographing the workpiece from below through the infrared transmission plate, wherein the recording unit includes an upper camera focused on the first height; an upper camera image formed by photographing a portion of the workpiece by the upper camera; and a lower camera focused on the first height to capture the portion of the workpiece. The first photographed image formed by a set associated with the lower camera image formed by photographing is recorded.

According to another aspect of the present invention, there is provided the inspection apparatus described above and a processing apparatus for processing the workpiece, and the workpiece processed by the processing apparatus is sent to the inspection apparatus. A processing system is provided characterized in that it is inspected by

Preferably, the processing device includes a chuck table that holds the workpiece, and a cutting unit that cuts the workpiece held on the chuck table with a cutting blade attached to the tip of a spindle, The inspection section of the inspection device can detect the crack extending from the dividing groove formed in the workpiece by the cutting blade.

Alternatively, preferably, the processing apparatus includes a chuck table holding the work piece, and a laser beam having a wavelength that can pass through the work piece. and a laser processing unit for forming the modified layer, wherein the inspection section of the inspection device can detect the modified layer formed inside the workpiece.

In the inspection apparatus and processing system according to one aspect of the present invention, the focus of the infrared camera unit is adjusted to the first height and the second height between the front surface and the back surface of the workpiece, and the inside of the workpiece is inspected. can acquire the 1st picked-up image and the 2nd picked-up image by picking up. That is, the infrared camera unit can photograph the interior of the workpiece at a plurality of different heights. Therefore, the inside of the workpiece can be thoroughly inspected from the obtained photographed image, and cracks or modified layers generated inside the workpiece can be reliably detected.

Therefore, the present invention provides an inspection apparatus capable of efficiently inspecting the inside of a workpiece, and a processing system having the inspection apparatus.

It is a perspective view which shows a to-be-processed object typically. It is a perspective view which shows a processing system typically. It is a top view which shows the structural example of a processing system typically. It is a perspective view which shows an inspection apparatus typically. FIG. 5A is a perspective view schematically showing a holding table, and FIG. 5B is a perspective view schematically showing an infrared camera unit. FIG. 4 is a cross-sectional view schematically showing the positional relationship between the holding table, the infrared camera unit, and the workpiece when inspecting the workpiece; FIG. 11 is a perspective view schematically showing another configuration example of the processing system; FIG. 5 is a plan view schematically showing how the workpiece is sequentially photographed while changing the photographing area of the infrared camera unit; FIG. 4 is a plan view schematically showing a display example of a display unit; FIG. 10A is a cross-sectional view schematically showing a workpiece to be cut, and FIG. 10B is a cross-sectional view schematically showing a workpiece to be laser-processed. FIG. 4 is an enlarged schematic cross-sectional view of a workpiece whose interior is photographed by an infrared camera unit; FIG. 12A is a plan view schematically showing a photographed image formed by photographing the workpiece at the height of the surface of the workpiece, and FIG. 12C is a plan view schematically showing a first photographed image formed by photographing the inside of the workpiece at the second height, and FIG. 12C is a plan view showing the inside of the workpiece photographed at the second height FIG. 11 is a plan view schematically showing a formed second captured image;

An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. FIG. 2 is a perspective view schematically showing the processing system 2 including the inspection device 56 according to this embodiment. The processing system 2 has a processing device 4 that processes a workpiece and an inspection device 56 that inspects the workpiece.

First, the workpiece will be described. The workpiece is, for example, a substantially disk-shaped wafer made of materials such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductors. . Alternatively, the workpiece is a substrate or the like made of a material such as sapphire, glass, or quartz. Also, the workpiece may be a package substrate or the like containing a plurality of device chips sealed with mold resin or the like.

FIG. 1 is a perspective view schematically showing a wafer, which is an example of the workpiece 1. As shown in FIG. The surface 1a of the workpiece 1 is partitioned, for example, by a plurality of dividing lines called streets 3 that intersect each other. Devices 5 such as ICs (Integrated Circuits) and LSIs (Large-Scale Integrated Circuits) are formed in respective regions of the surface 1a of the workpiece 1 that are partitioned by the streets 3 . By dividing the workpiece 1 along the streets 3, individual device chips can be formed.

However, the workpiece 1 to be processed by the processing system 2 is not limited to this, and the device may not be formed on the surface 1a. The processing system 2 and the inspection apparatus 56 will be described below by taking as an example a case where a plurality of devices 5 are formed and the wafer divided along the streets 3 is the workpiece 1 .

As shown in FIG. 1, before the workpiece 1 is carried into the processing apparatus 4, the workpiece 1 is surrounded by an annular frame 9 and a tape 7 applied to close the opening of the frame 9. They are integrated to form the frame unit 11 . The workpiece 1 attached to the tape 7 and mounted on the frame 9 via the tape 7 is carried into the processing apparatus 4 in this state and divided. The formed individual chips are then supported by the tape 7 . Forming the frame unit 11 facilitates handling of the workpiece 1 and chips.

For dividing the workpiece 1, for example, a laser processing apparatus that laser-processes the workpiece 1 by irradiating the workpiece 1 with a laser beam along the streets 3 is used. Alternatively, a cutting device that cuts the workpiece 1 along the streets 3 with an annular cutting blade is used. In order to finally obtain a thin device chip, the workpiece 1 is thinned by a grinding machine before being divided. The processing system 2 may have a grinding device for thinning the workpiece 1 as the processing device 4 . Hereinafter, the processing system 2 will be described with an example in which the processing device 4 is a cutting device, but the processing device 4 included in the processing system 2 is not limited to a cutting device.

In the processing system 2, in order to confirm that the workpiece 1 has been properly processed by the processing device 4, the processed workpiece 1 is sent to the inspection device 56, and the workpiece 1 is imaged and inspected. be. In the inspection device 56, for example, the workpiece 1 is inspected along the streets 3, and the positions and widths of the machining marks, and the shape and size of chippings formed in the workpiece 1 along the machining marks are determined. , distribution, etc. are investigated. Also, the sizes of the device chips formed by dividing the workpiece 1 are confirmed.

In the processing system 2, a processing device 4 and an inspection device 56 are connected. However, the processing device 4 and the inspection device 56 may be independent of each other, and the processing system 2 may include a plurality of processing devices 4 and a plurality of inspection devices 56 . FIG. 2 is a perspective view schematically showing the processing system 2 in which one processing device 4 and one inspection device 56 are connected to each other. In addition, in FIG. 2 and the like, a part of the configuration such as the housing constituting the processing device 4 and the inspection device 56 is omitted.

The processing device 4 includes a base 6a that supports each component. A vertically movable cassette support 6b is provided at the front corner of the base 6a. A cassette (not shown) containing a plurality of frame units 11 is placed on the upper surface of the cassette support base 6b.

A rectangular opening 10 elongated in the X-axis direction (processing feed direction) is formed on the upper surface of the base 6a at a position adjacent to the cassette support 6b. The opening 10 includes a chuck table 14, an X-axis direction moving mechanism (not shown) for moving the moving table 12 on which the chuck table 14 is placed in the X-axis direction, and a dust/splash proof cover 10a covering the X-axis direction moving mechanism. and is provided.

The processing apparatus 4 is provided with a transport unit 16 for loading and unloading the frame unit 11 accommodated in the cassette placed on the cassette support base 6b. The transport unit 16 has a pair of guide rails 18 parallel to the Y-axis direction and arranged on the front surface of the standing portion 6c of the base 6a. A moving body 20 is slidably attached to the pair of guide rails 18 . A nut portion (not shown) is provided on the rear side of the moving body 20, and a ball screw 22 parallel to the guide rail 18 is screwed into this nut portion.

A pulse motor 24 is connected to one end of the ball screw 22 . When the ball screw 22 is rotated by the pulse motor 24, the moving body 20 moves along the guide rail 18 in the Y-axis direction. An arm portion 26 extending along the X-axis direction is connected to the lower end of the moving body 20 via an elevating mechanism. A plurality of suction portions 28 arranged corresponding to the size of the frame 9 are arranged on the lower surface of the arm portion 26 . Further, a push-pull mechanism 30 facing the cassette support base 6b is arranged in the center of the arm portion 26. As shown in FIG.

A pair of conveying rails 8 are provided on the upper surface of the base 6a so as to straddle the opening 10. As shown in FIG. The pair of transport rails 8 are spaced apart from each other by a width smaller than the diameter of the frame 9, but are movable in directions away from each other.

The transfer unit 16 can move in the Y-axis direction to insert the front end of the push-pull mechanism 30 into the cassette placed on the cassette support base 6b to grip the frame 9 of the frame unit 11 accommodated in the cassette. By gripping the frame 9 with the push-pull mechanism 30 and moving the arm portion 26 in the opposite direction along the Y-axis direction, the frame unit 11 can be pulled out onto the pair of transport rails 8 .

After that, the push-pull mechanism 30 releases the grip of the frame 9 , the suction portion 28 of the transport unit 16 is brought into contact with the frame 9 from above, and the suction portion 28 suction-holds the frame 9 . Then, the frame unit 11 can be transported onto the chuck table 14 by lifting the frame unit 11 upward from the transport rails 8 to increase the distance between the pair of transport rails 8 and lowering the frame unit 11 .

A porous member is provided on the upper surface of the chuck table 14 that holds the workpiece 1 , and the upper surface of the porous member serves as a holding surface for holding the frame unit 11 . The porous member is connected to a suction source (not shown) through a suction path (not shown) formed inside the chuck table 14 . When this suction source is operated, a negative pressure acts on the frame unit 11 (work piece 1) via the suction path and the porous member, and the frame unit 11 can be suction-held by the chuck table 14 .

FIG. 3 is a plan view schematically showing the configuration of the processing system 2. As shown in FIG. The processing device 4 includes a processing unit 32 that processes the workpiece 1 . The processing unit 32 is, for example, a cutting unit that includes an annular cutting blade 34, a spindle 36a inserted through a through hole of the cutting blade 34, and a spindle housing 36 that accommodates one end of the spindle 36a.

The spindle 36a serves as a rotating shaft for rotating the cutting blade 34. As shown in FIG. The spindle housing 36 accommodates a rotation drive source such as a motor (not shown) that rotates the spindle 36a. When the rotating cutting blade 34 is caused to cut into the workpiece 1 held on the chuck table 14, the workpiece 1 is cut.

Although the processing device 4 shown in FIG. 3 is equipped with two processing units 32 for cutting the workpiece 1, the processing device 4 is not limited to this. For example, the processing unit 32 provided in the processing device 4 may be one. Further, when the processing device 4 is a laser processing device, the processing unit 32 becomes a laser processing unit that laser-processes the workpiece 1 .

As shown in FIGS. 2 and 3, the processing device 4 has an opening 38 at a position adjacent to the opening 10 on the upper surface of the base 6a. A cleaning device 40 capable of cleaning the workpiece 1 processed by the processing unit 32 is disposed inside the opening 38 . The workpiece 1 after machining is conveyed onto the washing table of the cleaning device 40 by the conveying unit 16 or the like, and a high pressure is applied to the workpiece 1 from a nozzle (not shown) while the washing table on which the workpiece 1 is placed is rotated at high speed. The workpiece 1 can be cleaned by ejecting the cleaning liquid.

It should be noted that the transfer unit 42 may carry the workpiece 1 into the cleaning device 40 . The transport unit 42 has a pair of guide rails 44 parallel to the Y-axis direction and arranged on the front surface of the standing portion of the base 6a. A moving body 46 is slidably attached to the pair of guide rails 44 . A nut portion (not shown) is provided on the rear side of the moving body 46, and a ball screw 48 parallel to the guide rail 44 is screwed into this nut portion.

A pulse motor 50 is connected to one end of the ball screw 48 . When the ball screw 48 is rotated by the pulse motor 50, the moving body 46 moves along the guide rail 44 in the Y-axis direction. An arm portion 52 is connected to the lower end of the moving body 46 via an elevating mechanism. The arm portion 52 is provided with a holding mechanism 54 having a plurality of suction portions (not shown) arranged corresponding to the size of the frame 9 .

For example, when a plurality of devices 5 are formed on the surface of the workpiece 1 and the workpiece 1 is divided into individual devices 5 by the processing unit 32 of the processing apparatus 4, individual device chips are formed. In order to confirm that the workpiece 1 is properly processed, the workpiece 1 after machining is inspected by the inspection device 56 according to the present embodiment.

After the cleaning of the workpiece 1 by the cleaning device 40 is completed, the workpiece 1 is held by the holding mechanism 54 and transported to the inspection device 56 by the transport unit 42 . Note that the workpiece 1 may be transported to the inspection device 56 by the transport unit 16 instead of the transport unit 42 . Here, if the direction of the cleaning table is adjusted in advance before the workpiece 1 is held by the transfer units 16 and 42, the workpiece 1 carried into the inspection device 56 can be oriented in a predetermined direction.

For example, in the inspection device 56, the workpiece 1 is inspected along the dividing grooves (processing traces) formed in the workpiece 1, and chipping called chipping formed in the workpiece 1 along the dividing grooves is detected. The shape, size, distribution, etc. of Also, the sizes of the device chips formed by dividing the workpiece 1 are confirmed.

The inspection device 56 can simultaneously observe a portion of the workpiece 1 from both the upper surface side (front surface 1a side) and the lower surface side (rear surface 1b side). When the inspection device 56 is connected to the processing device 4 as shown in FIG. 2 and the like, the workpiece 1 after processing can be inspected immediately. However, the inspection device 56 is not limited to this.

Here, if the processing device 4 is a cutting device, the cutting blade 34 used for cutting the workpiece 1 is worn out while the workpieces 1 are being machined one after another, so it is periodically replaced. Further, when the processing device 4 is a grinding device, the grinding wheel used for grinding the workpiece 1 is worn out, so the grinding wheel to which the grinding wheel is fixed is periodically replaced. Immediately after replacement, the grindstones of these tools are likely to be in a state called blinding or clogging, and when the workpiece 1 is processed with these tools, the load applied to the workpiece 1 increases, resulting in cracks. Explosive cracks may form in the workpiece 1 .

Cracks appearing outside the workpiece 1 can be detected by observing the workpiece 1 from the outside. However, cracks that cannot be detected by observing the workpiece 1 from the outside, such as cracks that have progressed inward from the cut surface of the workpiece 1, cracks that do not appear on the outer surface of the workpiece 1, etc. 1 may occur. In addition, there is a demand to thoroughly inspect the inside of the workpiece 1 in order to confirm that no unnecessary cracks are formed anywhere inside the workpiece 1 .

Therefore, in the inspection device 56 according to the present embodiment, the inside of the workpiece 1 is photographed at a predetermined height between the front surface 1a and the back surface 1b of the workpiece 1, and the photographed image is obtained. It is possible to detect cracks or the like formed inside 1. The inspection device 56 according to this embodiment will be described below.

FIG. 4 is a perspective view schematically showing the inspection device 56. As shown in FIG. The inspection device 56 includes a base 60 that supports each component of the inspection device 56 . An opening 62 is formed in the base 60 along the X-axis direction. The inspection device 56 includes a holding table 58 that is arranged across the opening 62 of the base 60 and can hold the workpiece 1, an infrared camera unit 82 that can photograph the workpiece 1 held on the holding table 58, Prepare.

The inspection device 56 includes an X-axis moving unit 64a capable of relatively moving the holding table 58 and the infrared camera unit 82 along the X-axis direction, and a Y-axis moving unit 64a capable of relatively moving along the Y-axis direction. 64b. FIG. 5A schematically shows a perspective view of the X-axis moving unit 64a and the holding table 58 of the inspection device 56. As shown in FIG. FIG. 5B schematically shows a perspective view of the infrared camera unit 82. As shown in FIG.

The X-axis movement unit 64a includes a guide rail 66a extending along the X-axis direction on the side of the opening 62 on the upper surface of the base 60. As shown in FIG. A guide rail 66b extending parallel to the guide rail 66a is provided on the side of the opening 62 opposite to the guide rail 66a on the upper surface of the base 60. As shown in FIG. A moving body 68a is slidably mounted on the guide rail 66a, and a moving body 68b is slidably mounted on the guide rail 66b.

A bridge-like support structure 74 is provided on the moving bodies 68a and 68b so as to straddle the moving bodies 68a and 68b. A nut portion (not shown) is provided at the lower end of one of the moving bodies 68a and 68b, and a ball screw 70 parallel to the guide rails 66a and 66b is screwed into this nut portion.

A pulse motor 72 is connected to one end of the ball screw 70 . When the ball screw 70 is rotated by the pulse motor 72, the moving bodies 68a and 68b move in the X-axis direction along the guide rails 66a and 66b, and the bridge-like support structure 74 moves in the X-axis direction. The holding table 58 is supported by the support structure 74 at a position overlapping the opening 62 of the base 60 . The X-axis moving unit 64a can move the holding table 58 along the X-axis direction by moving the support structure 74 along the X-axis direction.

The holding table 58 has a disk-shaped infrared transmission plate 76 exposed at the top and bottom. The infrared transmission plate 76 is made of material such as glass or resin, for example. The upper surface of the infrared transmission plate 76 serves as a mounting surface 76a on which the workpiece 1 is mounted with the tape 7 interposed therebetween. The holding table 58 can support the workpiece 1 placed on the infrared transparent plate 76 .

FIG. 6 includes a cross-sectional view schematically showing the holding table 58. As shown in FIG. The infrared transmitting plate 76 is also exposed on the rear surface side opposite to the mounting surface 76a. The infrared transmitting plate 76 transmits infrared rays of wavelengths captured by the infrared camera unit 82 . Therefore, the workpiece 1 placed on the mounting surface 76 a can be observed from the bottom side through the infrared transmitting plate 76 with the infrared camera unit 82 .

The holding table 58 includes a tape holding portion 78 having a tape suction holding surface 78b on the outer peripheral side of the mounting surface 76a. The tape holding portion 78 has a suction groove 78a formed in a tape suction holding surface 78b. A suction source (not shown) is connected to the suction groove 78a via a suction path (not shown). The holding table 58 further comprises an annular frame support 80 arranged around the tape holding portion 78 and capable of supporting the frame 9 of the frame unit 11 .

When the frame unit 11 is placed on the holding table 58 so that the frame support portion 80 and the frame 9 overlap each other, and the suction source is operated, the workpiece 1 is sucked and held on the holding table 58 via the tape 7. be done. At this time, since the space between the holding table 58 and the tape 7 is sucked and the tape 7 is brought into close contact with the entire mounting surface 76a, the workpiece 1 held by the holding table 58 will not shift during the inspection. do not have.

For example, even when the workpiece 1 is a warped wafer or the like, when the workpiece 1 is held on the holding table 58, the tape 7 is brought into close contact with the entire mounting surface 76a. Therefore, the workpiece 1 is suction-held by the holding table 58 in a state in which warpage is alleviated. If the warpage of the workpiece 1 held by the holding table 58 is alleviated, the focus of the camera is less likely to deviate from the workpiece 1 when photographing each region of the workpiece 1 one after another. Object 1 can be photographed more clearly.

Here, the height of the placement surface 76a of the infrared transmission plate 76 is preferably lower than the height of the tape suction holding surface 78b of the tape holding portion 78. As shown in FIG. Also, the suction groove 78 a formed in the tape suction holding surface 78 b may reach the infrared transmission plate 76 . In this case, when the frame unit 11 is placed on the holding table 58, a gap is formed between the tape 7 and the mounting surface 76a, and when the suction source connected to the suction groove 78a is operated, Through the gap, the area of the tape 7 overlapping the workpiece 1 is quickly sucked.

FIG. 6 schematically shows a sectional view of the frame unit 11 and the holding table 58 when the workpiece 1 is suction-held by the holding table 58. As shown in FIG. As shown in FIG. 6, when the suction source is activated, the gap between the tape 7 and the mounting surface 76a is evacuated, and the tape 7 and the mounting surface 76a are brought into close contact with each other.

After the inspection of the workpiece 1 is completed, when the suction source is stopped and the frame unit 11 is unloaded from the holding table 58, the tape 7 can be easily peeled off from the mounting surface 76a. , the mounting surface 76a may be coated with a fluorine resin.

Next, the infrared camera unit 82 will be described. As shown in FIG. 4, the infrared camera unit 82 is supported by a gate-shaped support structure 84 arranged on the base 60 so as to straddle the opening 62, the X-axis movement unit 64a, and the holding table 58, for example. be. A Y-axis movement unit 64b is arranged on the support structure 84 to move the infrared camera unit 82 along the Y-axis direction.

The Y-axis movement unit 64b includes a pair of guide rails 86 arranged on the upper surface of the support structure 84 along the Y-axis direction. A moving body 88 that supports the infrared camera unit 82 is slidably mounted on the pair of guide rails 86 . A nut portion (not shown) is provided on the lower surface of the moving body 88, and a ball screw 90 parallel to the pair of guide rails 86 is screwed into the nut portion.

A pulse motor 92 is connected to one end of the ball screw 90 . When the ball screw 90 is rotated by the pulse motor 92, the moving body 88 moves in the Y-axis direction along the guide rail 86, and the infrared camera unit 82 moves in the Y-axis direction. The X-axis movement unit 64a and the Y-axis movement unit 64b cooperate to function as a movement unit that can relatively move the holding table 58 and the infrared camera unit 82 in the direction parallel to the mounting surface 76a.

The infrared camera unit 82 includes one or both of an upper camera 106a disposed above the infrared transmission plate 76 of the holding table 58 and a lower camera 106b disposed below the infrared transmission plate 76. As shown in FIG. 5B, the infrared camera unit 82 further includes a connecting portion 108 that connects the upper camera 106a and the lower camera 106b.

The upper camera 106a is supported by a columnar support structure 94a. An elevating mechanism 96a for elevating the upper camera 106a is arranged on the front surface of the columnar support structure 94a. The lifting mechanism 96a includes a pair of guide rails 98a along the Z-axis direction, a moving body 100a slidably mounted on the guide rails 98a, and a nut portion provided on the rear surface of the moving body 100a. and a ball screw 102a.

An upper camera 106a is fixed to the front surface of the moving body 100a. A pulse motor 104a is connected to one end of the ball screw 102a. When the ball screw 102a is rotated by the pulse motor 104a, the moving body 100a moves along the guide rail 98a along the Z-axis direction, and the upper camera 106a fixed to the moving body 100a moves up and down.

The upper end of the connecting portion 108 is connected to, for example, the rear lower end of the support structure 94a, and the lower end of the connecting portion 108 is connected to the rear upper end of the columnar support structure 94b that supports the lower camera 106b. It is An elevating mechanism 96b configured similarly to the elevating mechanism 96a disposed on the supporting structure 94a is disposed on the front surface of the supporting structure 94b.

The lifting mechanism 96b includes a pair of guide rails 98b along the Z-axis direction, a moving body 100b slidably mounted on the guide rails 98b, and a nut portion provided on the rear surface of the moving body 100b. and a ball screw 102b. A pulse motor 104b is connected to one end of the ball screw 102b. When the ball screw 102b is rotated by the pulse motor 104b, the lower camera 106b fixed to the front surface of the moving body 100b moves up and down.

The upper camera 106a faces downward and can directly photograph the workpiece 1 supported by the holding table 58 from above. In addition, the lower camera 106b faces upward, and can photograph the workpiece 1 from below through the infrared transmission plate 76 and the tape 7. FIG. The upper camera 106a and the lower camera 106b are, for example, an area camera, a line camera, a 3D camera, or the like having an infrared sensor capable of receiving infrared rays. Here, the infrared sensor can receive infrared rays having a wavelength that can pass through the infrared transmitting plate 76 , the tape 7 and the workpiece 1 .

When the workpiece 1 is photographed through the infrared transmitting plate 76 and the tape 7, the contrast of the obtained photographed image may be lowered due to the influence of spherical aberration. Therefore, the lower camera 106b may have a correction unit configured with a correction ring or the like capable of reducing the influence of the spherical aberration.

In the infrared camera unit 82, the upper camera 106a and the lower camera 106b are connected to each other by a connecting portion 108 so that their positions in the direction parallel to the mounting surface 76a are the same. That is, the same position on the upper surface side and the lower surface side of the workpiece 1 can be photographed. The connecting portion 108 has a shape that does not interfere with the holding table 58 regardless of which part of the workpiece 1 is taken as the imaging position.

The processing device 4 will be further described using FIG. The processing device 4 includes a display unit 110 having a touch panel. An operator who operates the processing device 4 inputs processing conditions and the like to be performed in the processing device 4 through the touch panel of the display unit 110, for example. The display unit 110 also has a function of displaying various information, a function of displaying an input screen, a function of displaying various alarms, and the like.

The processing device 4 also includes a control unit 112 that controls each component of the processing device 4 . The control unit 112 includes, for example, a processing device such as a processor represented by a CPU (Central Processing Unit), and a main memory such as a DRAM (Dynamic Random Access Memory), an SRAM (Static Random Access Memory), and a ROM (Read Only Memory). It consists of a computer that includes devices and secondary storage devices such as flash memory, hard disk drives, solid state drives, and the like.

Software including a predetermined program is stored in the auxiliary storage device. The functions of the control unit 112 are implemented by operating the processor according to this software. By operating the processing device according to software such as programs stored in the auxiliary storage device, the software and the processing device (hardware resources) function as concrete means in cooperation. Details of the configuration and functions of the control unit 112 will be described later.

The inspection device 56 includes a display unit 114 configured by a liquid crystal display or the like having a touch panel. An operator who operates the display unit 114 inputs, for example, the conditions of the inspection performed by the inspection device 56 using the touch panel of the display unit 114, selects an image to be displayed on the display unit 114, and the like. The display unit 114 also has a function of displaying various information, a function of displaying an input screen, a function of displaying various alarms, and the like.

The inspection device 56 also includes a control unit 116 that controls each component of the inspection device 56 . The control unit 116 is, for example, configured similarly to the control unit 112 of the processing device 4 . Details of the configuration and function of the control unit 116 will be described later.

Here, in the processing system 2, the mutual control units 112 and 116 may be connected by wiring, or may be connected by wireless communication. Alternatively, the processing system 2 may comprise one integrated control unit that controls the processing device 4 and the inspection device 56 . Moreover, the processing system 2 may include one display unit that functions as both the display unit 110 of the processing device 4 and the display unit 114 of the inspection device 56 .

In the processing system 2, the workpieces 1 are successively pulled out from the cassette placed on the cassette support base 6b, processed by the processing device 4, inspected by the inspection device 56, and returned to the cassette again. However, not all the workpieces 1 accommodated in the cassette need to be inspected by the inspection device 56, and some selected workpieces 1 are inspected by the inspection device 56, and other workpieces 1 are inspected by the inspection device 56. Inspection may be omitted. The inspecting device 56 inspects whether there is an abnormality such as a crack, damage, or processing defect inside the workpiece 1 or the chip.

Further, in the processing system 2, the processing device 4 and the inspection device 56 may be separated. In this case, for example, the operator carries the workpiece 1 into the processing device 4 , processes the workpiece 1 with the processing device 4 , and transports the processed workpiece 1 from the processing device 4 to the inspection device 56 . , the inspection device 56 inspects the workpiece 1 and the chip.

Further, the processing system may include multiple processing devices and may include multiple inspection devices. FIG. 7 is a perspective view schematically showing a configuration example of a processing system 2a including three processing devices 4 and one inspection device 56. As shown in FIG. For example, the workpiece 1 is processed by one of the three processing devices 4 , and the processed workpiece 1 is inspected by the inspection device 56 .

The inspection device 56 can use the infrared camera unit 82 to obtain a photograph taken at a predetermined height inside the workpiece 1 . FIG. 11 is a cross-sectional view schematically showing how the inside of the workpiece 1 is photographed by adjusting the focal point 106c of the lower camera 106b constituting the infrared camera unit 82 to a predetermined height.

A workpiece 1 shown in FIG. 11 is machined by a machining apparatus 4 to form a dividing groove 3a along a street 3, and a crack 3b extending from the side wall of the dividing groove 3a into the workpiece 1 is formed. . Here, the crack 3b does not reach either the front surface 1a or the back surface 1b of the workpiece 1. As shown in FIG. Therefore, even if the front surface 1a or the back surface 1b of the workpiece 1 is focused and the workpiece 1 is photographed by the infrared camera unit 82 (the upper camera 106a and the lower camera 106b), the crack 3b is not present in the photographed image. Not captured.

FIG. 12A is a plan view schematically showing a photographed image 23a obtained by photographing the division groove 3a formed along the street 3 of the workpiece 1 from above with the upper camera 106a of the infrared camera unit 82. FIG. is. In the photographed image 23a, the device 5 formed on the surface 1a of the workpiece 1 and the dividing groove 3a are shown, and a chip called chipping 3c formed in the workpiece 1 outside the dividing groove 3a is also shown. be photographed. However, the crack 3b formed inside the workpiece 1 is not captured.

Therefore, the infrared camera unit 82 (the upper camera 106a and the lower camera 106b) photographs the inside of the workpiece 1 with the focus adjusted to the height between the front surface 1a and the back surface 1b of the workpiece 1. FIG. For example, as shown in FIG. 11, the focus 106c is set on the first height 1c between the front surface 1a and the back surface 1b of the workpiece 1, and the inside of the workpiece 1 is viewed by the lower camera 106b of the infrared camera unit 82. to shoot. The first height 1c is an arbitrary height between the front surface 1a and the rear surface 1b of the workpiece 1, and is not particularly limited.

FIG. 12B is a plan view schematically showing a first photographed image 23b obtained by photographing the inside of the workpiece 1 with the lower camera 106b with the focus 106c focused on the first height 1c. be. As shown in FIG. 12(B), a photograph obtained by photographing the workpiece 1 from the back surface 1b side so as to facilitate comparison with the photographed image obtained by photographing the workpiece 1 from the front surface 1a side The image may be flipped vertically or horizontally.

When the crack 3b is formed inside the workpiece 1 at the first height 1c, the first photographed image 23b obtained by focusing 106c on the first height 1c includes the crack 3b. is reflected. Therefore, when analyzing the first photographed image 23b obtained by focusing 106c on the first height 1c, it is possible to determine whether or not the crack 3b exists at the first height 1c inside the workpiece 1. can determine whether

In addition, in the inspection device 56, the inside of the object 1 to be processed may be photographed by the upper camera 106a at the first height 1c inside the object 1 to be processed. If the inside of the workpiece 1 is photographed from above and below at the same height, cracks and the like formed inside the workpiece 1 can be analyzed from various angles.

Moreover, in order to inspect the inside of the workpiece 1 in more detail, the inspection device 56 may photograph the inside of the workpiece 1 at a plurality of heights and obtain the photographed images. For example, with the focus 106c of the infrared camera unit 82 (upper camera 106a and lower camera 106b) set to a second height 1d different from the first height 1c between the front surface 1a and the back surface 1b of the workpiece 1, The infrared camera unit 82 photographs the interior of the workpiece 1 to obtain a second photographed image.

FIG. 12C is a plan view schematically showing a second photographed image 23c obtained by photographing the inside of the workpiece 1 with the lower camera 106b with the focus 106c focused on the second height 1d. be. A photographed image 23 shown in FIG. 12C is a horizontally reversed image.

When the crack 3b is formed inside the workpiece 1 at the second height 1d, the crack 3b is shown in the second photographed image 23c acquired by focusing 106c on the second height 1d. is reflected. Therefore, when analyzing the second photographed image 23c acquired by focusing 106c on the second height 1d, it is possible to determine whether or not the crack 3b exists at the second height 1d inside the workpiece 1. can determine whether

In this way, by photographing the interior of the workpiece 1 at different heights and obtaining a plurality of captured images, it is possible to thoroughly inspect whether or not the crack 3b is formed inside the workpiece 1 . However, in the inspection device 56, the photographed image of the front surface 1a of the workpiece 1 and the photographed image of the rear surface 1b of the workpiece 1 may be obtained by the infrared camera unit 82. FIG.

Moreover, the inside of the workpiece 1 may be photographed at a height other than the first height 1c and the second height 1d. If the inside of the workpiece 1 is photographed at many heights, the detection accuracy of the crack 3b is improved, and detection omission of the crack 3b is less likely to occur. However, when the number of times of photographing the inside of the workpiece 1 increases, the inspection takes time. For example, if the inside of the workpiece 1 is photographed at two heights and the workpiece 1 is inspected, the inspection time can be shortened.

Further, in the inspection device 56, the infrared camera unit 82 can simultaneously photograph the same portion of the workpiece 1 at the same height from above and below. For example, the first captured image and the second captured image are the upper camera image formed by capturing the inside of the workpiece 1 by the upper camera 106a and the inside of the workpiece 1 by the lower camera 106b. and the bottom camera image formed by . As a result, each region of the workpiece 1 can be checked from the front surface 1a side and the back surface 1b side, so that the workpiece 1 can be inspected in more detail.

It should be noted that an abnormality such as a crack may occur in any part of the workpiece 1 . Therefore, it is preferable that the entire area of the workpiece 1 is photographed by the infrared camera unit 82, and the entire area of the workpiece 1 is preferably captured in the photographed image. However, it is difficult for the infrared camera unit 82 to clearly photograph the entire area of the workpiece 1 at once. If the definition of the photographed image is insufficient, it is conceivable that the workpiece 1 cannot be precisely inspected.

Therefore, it is preferable that the infrared camera unit 82 enlarges the workpiece 1 for each small section and takes a high-definition photograph, and forms a photographed image based on the obtained small images. That is, when obtaining a photographed image, the holding table 58 that supports the workpiece 1 and the infrared camera unit 82 are relatively moved by the X-axis movement unit 64a and the Y-axis movement unit 64b to change the photographing area. The workpiece 1 is photographed while being changed. Then, a photographed image is formed based on a plurality of small images formed by sequentially photographing the workpiece 1 for each small section with the infrared camera unit 82 .

FIG. 8 is a plan view schematically showing an imaging region of the workpiece 1 that is imaged for each small section. In FIG. 8, a small section 134 that has already been imaged by the infrared camera unit 82 is indicated by a solid line, and a small section 136 that is to be imaged by the infrared camera unit 82 is indicated by a broken line.

When photographing the workpiece 1, the workpiece 1 is photographed in one small section, the holding table 58 and the like are moved by a distance corresponding to one side of the small section, and the workpiece is photographed in the next small section. Take a picture of object 1. By repeating this, the entire area of the workpiece 1 is photographed to obtain a plurality of small images. Each small section photographed by the infrared camera unit 82 may partially overlap adjacent small sections.

By combining the plurality of small images obtained, a first captured image and a second captured image can be formed. Since the obtained photographed image is a collection of high-definition and clear small images, each part of the workpiece 1 can be analyzed in detail by enlarging this as necessary.

FIG. 2 includes a block diagram showing the configuration of the control unit 116 of the inspection device 56 that constitutes the processing system 2. As shown in FIG. The inspection device 56 includes a recording section 118 in the control unit 116 for recording the photographed image formed by the infrared camera unit 82 . The inspection device 56 also has an inspection section 120 in the control unit 116 for processing the first captured image 23 b and the second captured image 23 c and inspecting the state of the workpiece 1 . More specifically, the inspection device 56 records the first captured image 23b and the second captured image 23c in the recording unit 118 in association with the inspection result.

For example, the inspection unit 120 detects the dividing grooves (processing marks) 3a formed in the workpiece 1 along the streets 3 based on the photographed image by image processing technology, and determines the quality of the dividing grooves (processing marks) 3a. to inspect. This inspection work is also called a kerf check.

In the kerf check, the inspection unit 120 evaluates the formation position of the dividing groove 3a in the street 3, the width of the dividing groove 3a, and the shape, size, amount, distribution, etc. of the chipping 3c formed on both side walls of the dividing groove 3a. do. For each item, it is determined that the machining result is normal when a predetermined criterion is satisfied, and it is determined that the workpiece 1 is abnormal when the predetermined criterion is not satisfied.

Furthermore, the inspection unit 120 analyzes the first captured image 23b and the second captured image 23c showing the inside of the workpiece 1 to detect the crack 3b extending inside the workpiece 1 . Also, the inspection unit 120 detects the location, size, length, number, amount, etc. of the cracks 3b. These pieces of information can be used to determine the quality of the workpiece 1, analyze abnormalities occurring in the workpiece 1, analyze causes of the abnormalities, and the like.

Further, the inspection unit 120 determines the crack 3b from the plurality of photographed images 23b and 23c, the heights 1c and 1d at which the photographed images 23b and 23c are photographed, and the shape of the crack 3b shown in the photographed images 23b and 23c. A three-dimensional structural model of the crack 3b may be created. At this time, the number of photographed images that form the basis of the three-dimensional structure model is not limited to two. A three-dimensional structural model that reflects the structure of the crack 3b with higher accuracy can be formed as the number of photographed images that serve as the basis increases.

In addition, as shown in FIG. 7, the processing device 4 preferably includes an information transmission unit 130 capable of transmitting various types of information to the inspection device 56 by wireless communication or wired communication. The inspection device 56 preferably includes an information receiving section 132 capable of receiving various types of information transmitted from the information transmitting section 130 of the processing device 4 .

For example, when the processing device 4 and the inspection device 56 are independent of each other, the information transmitting section 130 is an antenna capable of transmitting radio waves, and the information receiving section 132 is an antenna capable of receiving the radio waves. Further, for example, when the processing device 4 and the inspection device 56 are integrated, the information transmission unit 130 and the information reception unit 132 are wiring that connects the processing device 4 and the inspection device 56 .

Further, when the functions of the control unit 116 and the control unit 112 are realized by one integrated control unit, the information transmitting section 130 and the information receiving section 132 are electronic circuits or the like included in the control unit.

The functions of the information transmitting unit 130 and the information receiving unit 132 may be interchanged, and the information transmitting unit 130 and the information receiving unit 132 may be used for transmitting information from the inspection device 56 to the processing device 4. .

The inspection device 56 acquires information from the processing device 4 through the information transmitting unit 130 and the information receiving unit 132, and, for example, links the processing conditions of the workpiece 1 in the processing device 4 to the photographed image formed by the infrared camera unit 82. may be recorded in the recording unit 118 by In this case, when an abnormality such as a crack is detected in the workpiece 1 or the like, the cause of the abnormality can be investigated from various angles.

Furthermore, ID information for identification may be attached to each workpiece 1. In this case, the ID information read from the workpiece 1 is linked to the captured image and recorded in the recording unit 118. should be. In addition, the recording unit 118 may receive information about the storage position in the cassette in which the workpiece 1 was stored when the workpiece 1 was carried into the processing device 4, and the information is linked to the captured image and recorded. It may be recorded in the section 118 .

In the inspection device 56 according to this embodiment, the display unit 114 may display the captured image recorded in the recording unit 118 . FIG. 9 is a plan view schematically showing the display unit 114 that displays the photographed image of the workpiece 1. As shown in FIG. The control unit 116 of the inspection device 56 reads out various information and images from the recording unit 118 and causes the display unit 114 to display them.

As shown in FIG. 9 , for example, the first captured image 13a and the second captured image 13b are displayed side by side on the upper portion of the display unit 114 . Further, in the lower part of the display unit 114, a plurality of first enlarged images 17a obtained by enlarging a part of the first captured image 13a and a plurality of second enlarged images obtained by enlarging a part of the second captured image 13b are displayed. Enlarged image display areas 15a and 15b in which the image 17b and the image 17b are displayed side by side are provided.

For example, a full view of the workpiece 1 is displayed in each of the first captured image 13a and the second captured image 13b. Then, the area of the workpiece 1 shown in the enlarged images 17a and 17b is shown by the first captured image 13a and the second captured image 13b in which the entire view of the workpiece 1 is displayed. For example, frames 21a and 21b indicating areas in which the enlarged images 17a and 17b are captured are superimposed on the first captured image 13a and the second captured image 13b.

Also, on the screen of the display unit 114, the operator may be able to move the frames 21a and 21b by touch operation. It should be displayed at the bottom of the unit 114 . In addition, when one frame 21a, 21b is moved, the other frame 21a, 21b moves so that a specific region of the workpiece 1 can be confirmed at the first height 1c and the second height 1d at the same time. It is preferable to move together.

Moreover, when it is desired to specify the areas captured in the enlarged images 17a and 17b more precisely, it is preferable that the first captured image 13a and the second captured image 13b captured in the upper part of the screen can be enlarged. For example, the display unit 114 may display enlargement/reduction buttons 19a and 19b capable of changing the magnification of the first captured image 13a and the second captured image 13b. Then, when the operator touches the enlargement/reduction buttons 19a and 19b, the size and enlargement magnification of the first captured image 13a and the second captured image 13b are preferably changed.

Next, a process of machining the workpiece 1 by the machining device 4 and inspecting the workpiece 1 by the inspection device 56 in the machining system 2 will be described. First, the cassette containing the frame unit 11 including the workpiece 1 is placed on the cassette support base 6b of the processing apparatus 4 shown in FIG. Then, the frame unit 11 is pulled out from the cassette by the transport unit 16, transported onto the chuck table 14 of the processing device 4 by the transport unit 16, and held on the chuck table 14 by suction.

Next, the workpiece 1 is processed by the processing unit 32 . For example, if the processing device 4 is a cutting device, the workpiece 1 held on the chuck table 14 is cut by the cutting blade 34 attached to the tip of the spindle 36a. FIG. 10A is a cross-sectional view schematically showing the workpiece 1 to be cut by the cutting blade 34. FIG.

By rotating the spindle 36 a to rotate the cutting blade 34 and cutting the rotating cutting blade 34 into the workpiece 1 along the streets 3 , the dividing grooves 3 a can be formed in the workpiece 1 . Then, the frame unit 11 is transported to the cleaning device 40 by the transport unit 42 , and the workpiece 1 is cleaned by the cleaning device 40 .

Next, in order to inspect the processed workpiece 1 by the inspection device 56, the workpiece 1 is transported from the cleaning device 40 onto the holding table 58 of the inspection device 56 by the transport unit 42, and the holding table 58 is placed on the holding table 58. Hold in suction. Then, the infrared camera unit 82 photographs the workpiece 1 to acquire a photographed image of the workpiece 1 . FIG. 6 is a cross-sectional view schematically showing how the infrared camera unit 82 of the inspection device 56 takes an image of the workpiece 1. As shown in FIG.

First, the focus of each of the upper camera 106a and the lower camera 106b is set to the first height 1c (see FIG. 11) between the front surface 1a and the rear surface 1b of the workpiece 1 by operating the lifting mechanisms 96a and 96b. match. Then, while the moving units 64a and 64b are operated to scan the infrared camera unit 82 by the method shown in FIG. Form. A first captured image formed by the infrared camera unit 82 is recorded in the recording section 118 .

Next, the upper camera 106a and the lower camera 106b are each focused on the second height 1d (see FIG. 11) inside the workpiece 1 by operating the elevating mechanisms 96a and 96b. Similarly, various parts of the workpiece 1 are photographed by the upper camera 106a and the lower camera 106b to form a second photographed image. The second captured image formed by the infrared camera unit 82 is recorded in the recording unit 118 in association with the first captured image. Note that the inside of the workpiece 1 may be photographed at three or more heights by the infrared camera unit 82 .

The inspection unit 120 of the inspection device 56 performs image processing on the first captured image and the second captured image recorded in the recording unit 118 to detect the crack 3b formed inside the workpiece 1. try. As a result, when no cracks are detected inside the workpiece 1, or when the detected cracks are sufficiently small and allowable, the machined workpiece 1 is recognized as a normal product. On the other hand, when an impermissible crack formed inside the workpiece 1 is detected, the workpiece 1 or the chip containing the crack is identified as a defective product.

When a crack generated inside the workpiece 1 is detected, for example, it is conceivable that the load due to the machining performed on the workpiece 1 by the machining device 4 is large and the machining conditions are inappropriate. Therefore, it is preferable to verify whether or not the conditions for machining the workpiece 1 performed by the machining apparatus 4 are appropriate. The inspection result by the inspection unit 120 is preferably displayed on the display unit 114 together with the first captured image, the second captured image, and the like. The operator can verify the suitability of the processing conditions based on the inspection results displayed on the display unit 114 .

After photographing and inspecting the inside of the workpiece 1 by the inspection device 56, the frame unit 11 including the workpiece 1 is carried into the cassette supported by the cassette support table 6b by the transport unit 42 and the transport unit 16. . Then, the cassette is unloaded from the processing system 2 . Individual chips formed by dividing the workpiece 1 are picked up from the tape 7 and mounted on a predetermined mounting target.

As described above, according to the inspection device 56 according to the present embodiment, the inside of the workpiece 1 is photographed at a plurality of heights, and cracks formed inside the workpiece 1 are detected from the obtained photographed images. Efficient detection.

Note that one aspect of the present invention is not limited to the description of the above embodiments, and can be implemented with various modifications. For example, in the above-described embodiment, the processing device 4 is a cutting device, and the inspection device 56 photographs the inside of the workpiece 1 cut by the cutting blade 34, and the crack 3b formed inside the workpiece 1 is detected. The case where it is detected has been described. However, the processing device 4 is not limited to a cutting device, and the dividing groove 3a may not be formed in the workpiece 1, and the crack 3b formed inside the workpiece 1 may not be detected by the inspection device 56. good too.

For example, the processing device 4 of the processing system 2 may be a laser processing device that laser-processes the workpiece 1 to form a modified layer inside the workpiece 1. In the inspection device 56, the inside of the workpiece 1 You may detect the modified layer formed in. FIG. 10(B) is a cross-sectional view schematically showing the workpiece 1 processed by the laser processing apparatus 4a and having the modified layer 3d along the streets 3 formed therein.

The laser processing apparatus 4a includes a chuck table 14 that holds the workpiece 1, and a laser beam 34a having a wavelength that can pass through the workpiece 1. and a laser processing unit 32a for forming the thin layer 3d. When an external force is applied to the work piece 1 on which the modified layer 3d is formed, cracks are formed from the modified layer 3d to the front surface 1a and the back surface 1b of the work piece 1, and the work piece 1 moves along the streets 3. split. In other words, the modified layer 3d serves as a starting point for splitting the workpiece 1. As shown in FIG.

Here, if the workpiece 1 is not properly processed by the laser processing apparatus 4a and the modified layer 3d is not properly formed inside the workpiece 1, if cracks do not extend from the modified layer 3d, Cracks may propagate in the proper direction. Therefore, there is a demand to inspect whether or not the modified layer 3d is appropriately formed on the workpiece 1 laser-processed by the laser processing apparatus 4a.

However, since the modified layer 3 d formed inside the workpiece 1 does not appear on the outer surface of the workpiece 1 , the modified layer 3 d cannot be confirmed from the outside of the workpiece 1 . Therefore, it is preferable to photograph the inside of the workpiece 1 with the inspection device 56 according to one aspect of the present invention, and inspect the state of the modified layer 3d based on the obtained photographed image.

For example, in the inspection device 56, the infrared camera unit 82 is focused on the height at which the modified layer 3d is formed, and the infrared camera unit 82 photographs the inside of the workpiece 1 to obtain a photographed image showing the modified layer 3d. should be obtained. Then, the quality of the modified layer 3d formed inside the workpiece 1 may be determined based on the obtained photographed image.

Here, in order to reliably divide the workpiece 1 , a plurality of modified layers 3 d having different heights may be formed inside the workpiece 1 . In this case, in the inspection device 56, the infrared camera unit 82 should be focused on each height of the modified layer 3d, and a plurality of photographed images showing each layer of the modified layer 3d may be obtained. That is, the height at which one of the modified layers 3d is formed is defined as a first height 1c, and the height at which another modified layer 3d is formed is defined as a second height 1d, It is preferable to acquire the first captured image and the second captured image.

As described above, when the processing apparatus included in the processing system 2 is the laser processing apparatus 4a and the modified layer 3d is formed inside the workpiece 1, the inspection apparatus 56 according to one aspect of the present invention can be used. The inside of the workpiece 1 can be thoroughly inspected. Then, the modified layer 3d generated inside the workpiece 1 can be reliably detected.

In the above-described embodiment, the case where the infrared camera unit 82 photographs the interior of the workpiece 1 at both the first height 1c and the second height 1d has been described, but this is one aspect of the present invention. is not limited to That is, in the inspection device 56, the infrared camera unit 82 may photograph the inside of the workpiece 1 at one of the first height 1c and the second height 1d.

In addition, the structures, methods, and the like according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention.

REFERENCE SIGNS LIST 1 work piece 1a front surface 1b back surface 1c first height 1d second height 3 street 3a division groove 3b crack 3c chipping 3d modified layer 5 device 7 tape 9 frame 11 frame unit 13a, 23b first captured image 13b, 23c Second photographed image 15a, 15b Enlarged image display area 17a, 17b Enlarged image 19a, 19b Enlargement/reduction button 21a, 21b Frame 23 Photographed image 2, 2a Processing system 4 Processing device 4a Laser processing device 6a Base 6b Cassette Support stand 6c Standing portion 8 Conveyance rail 10 Opening 10a Dust and drip proof cover 12 Moving table 14 Chuck table 16, 42 Conveying unit 18, 44, 66a, 66b, 86, 98a, 98b Guide rail 20, 46, 68a, 68b, 88, 100a, 100b moving body 22, 48, 70, 90, 102a, 102b ball screw 24, 50, 72, 92, 104a, 104b pulse motor 26, 52 arm 28 suction section 30 push-pull mechanism 32 processing unit 32a laser processing Unit 34 Cutting blade 34a Laser beam 36 Spindle housing 36a Spindle 38 Opening 40 Cleaning device 54 Holding mechanism 56 Inspection device 58 Holding table 60 Base 62 Opening 64a, 64b Moving unit 74, 84, 94a, 94b Supporting structure 76 Infrared transmission plate 76a Mounting surface 78 Tape holding part 78a Suction groove 78b Tape suction holding surface 80 Frame support part 82 Infrared camera unit 96a, 96b Lifting mechanism 106a Upper camera 106b Lower camera 106c Focus 108 Connecting part 110, 114 Display unit 112, 116 Control unit 118 Recording unit 120 Examining unit 130 Information transmitting unit 132 Information receiving unit 134, 136 Small partition

Claims (7)

An inspection device for inspecting a workpiece,
a holding table holding the workpiece;
an infrared camera unit that photographs the workpiece held on the holding table to form a photographed image;
an inspection unit that processes the photographed image formed by the infrared camera unit and inspects the workpiece;
a recording unit for recording inspection results of the workpiece by the inspection unit;
A first photographed image can be acquired by photographing the interior of the workpiece with the infrared camera unit by adjusting the focus of the infrared camera unit to a first height between the front surface and the back surface of the workpiece. ,
photographing the interior of the workpiece with the infrared camera unit by adjusting the focal point of the infrared camera unit to a second height different from the first height between the front surface and the back surface of the workpiece; to acquire the second captured image,
The acquired first captured image and the second captured image can be recorded in the recording unit,
The inspection device, wherein the inspection unit can detect cracks or modified layers generated inside the workpiece from the first captured image and the second captured image recorded in the recording unit. a moving unit that relatively moves the holding table and the infrared camera unit;
further comprising a display unit;
The first photographed image and the second photographed image are respectively captured in small sections while changing the photographing area of the infrared camera unit by relatively moving the holding table and the infrared camera unit by the moving unit. 2. The inspection apparatus according to claim 1, wherein the inspection apparatus is formed based on a plurality of small images formed by sequentially photographing the workpiece with the infrared camera unit. The display unit is capable of displaying a first enlarged image obtained by enlarging a part of the first captured image as well as an area of the workpiece that is captured in the first enlarged image, and displaying a portion of the second captured image. 3. The inspection apparatus according to claim 2, wherein the second enlarged image obtained by enlarging the part can be displayed together with the area of the workpiece shown in the second enlarged image, and the inspection result of the inspection part can be displayed. The holding table has an infrared transparent plate that is transparent to infrared rays and supports the workpiece,
The infrared camera unit includes an upper camera that directly photographs the workpiece supported by the holding table from above, and a lower camera that photographs the workpiece from below through the infrared transmission plate,
The recording unit stores an upper camera image formed by photographing a part of the workpiece with the upper camera focused on the first height, and an upper camera image formed by the upper camera. The first photographed image is recorded as a set associated with a lower camera image formed by photographing the portion of the workpiece according to the first height by the lower camera. 4. The inspection apparatus according to any one of claims 1 to 3, characterized in that: The inspection device according to any one of claims 1 to 4;
a processing device for processing the workpiece,
A processing system, wherein the workpiece processed by the processing device is sent to the inspection device and inspected. The processing device is
a chuck table that holds the workpiece;
a cutting unit that cuts the workpiece held on the chuck table with a cutting blade attached to the tip of the spindle;
6. The processing system according to claim 5, wherein the inspection section of the inspection device can detect the crack extending from the dividing groove formed in the workpiece by the cutting blade. The processing device is
a chuck table that holds the workpiece;
a laser processing unit for condensing a laser beam having a wavelength that can pass through the workpiece inside the workpiece to form the modified layer inside the workpiece;
6. The processing system according to claim 5, wherein the inspection section of the inspection device can detect the modified layer formed inside the workpiece.

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