JP7360844B2 - Measuring device, workpiece inspection method, and image data display method - Google Patents

Description

The present invention relates to a technique for measuring and inspecting a processed workpiece.

A technique is known in which a plate-shaped wafer, which is a workpiece, is subjected to dicing using a cutting blade or laser irradiation.

For example, in dicing processing using a cutting blade, the cutting groove formed by cutting is imaged and the size of chipping (chips that occur at the edge of the cutting groove), cutting groove width (kerf width), cutting position, etc. are confirmed. It is known that a so-called kerf check is performed for this purpose.

In Patent Document 1, the result of pre-cutting performed before dicing is detected by checking the kerf by image processing, and if the detection result is good, the wafer is diced, and if it is bad, pre-cutting is performed again. Techniques for accomplishing this are disclosed.

Patent Document 2 discloses a shape recognition step in which the position, shape, and size of the workpiece are recognized by a shape recognition means, and a kerf check is performed by positioning the kerf directly under an optical means based on the information obtained by the shape recognition. A kerf check method is disclosed, comprising: a kerf check step.

In the above kerf check, if the size of chipping, deviation of the cutting position, or width of the cutting groove exceeds a preset tolerance range through image analysis, a warning will be issued, the equipment will be stopped, inspection, etc. will be held.

Japanese Patent Application Publication No. 5-326700 Japanese Unexamined Patent Publication No. 7-130806

The kerf check is automatically performed at a preset location, and if the number of kerf checks increases, the time required for processing increases and productivity decreases.

In addition, in a dicing machine, the image data used for kerf check on the workpiece is usually deleted after the dicing of the workpiece is completed, so the image data is referenced after the dicing is completed to analyze the processing results. I couldn't.

In addition, like image data for kerf checks, the entire workpiece can be recorded, not just some set points on the workpiece, and the machining results for each workpiece can be recorded. There is a desire to be able to refer to it when needed.

In view of the above, the present invention provides a measuring device that records image data of the entire workpiece, thereby making it possible to check the processing results later when necessary.

According to one aspect of the invention,
A measuring device for measuring a workpiece after processing,
a measured object holding mechanism that holds the measured object;
an imaging mechanism that images the object to be measured held by the object-to-be-measured holding mechanism and forms image data;
a moving mechanism that moves the imaging mechanism relative to the object holding mechanism;
a controller having a storage unit that stores the image data;
a display monitor that displays the image data;
The display monitor is
a position designation image display area that displays a position designation image formed based on image data sequentially captured for each small section by moving the imaging mechanism using the moving mechanism;
The measuring device has an enlarged image of the specified position of the object to be measured displayed in the position specified image display area and/or an enlarged image display area that displays a predetermined measurement value.

Further, the object to be measured holding mechanism has a mounting surface made of a transparent body that constitutes a holding surface for holding the object to be measured,
The imaging unit is
an upper imaging unit that images the top surface of the object to be measured;
a lower imaging unit that is arranged to face the upper imaging unit across the mounting surface and captures an image of the lower surface of the object to be measured;
The position specified image display area and the enlarged image display area are
Each,
It is assumed that the upper imaging unit and the lower imaging unit are configured to be able to display at least one of a position designation image, an enlarged image, and a predetermined measurement value based on image data captured by the lower imaging unit.

Further, a holding step of holding the measured object with the measured object holding mechanism;
an imaging step of imaging the object to be measured held by the object-to-be-measured holding mechanism with the imaging mechanism;
After performing the imaging step, a step of carrying out the object to be measured from the object holding mechanism;
a display step of displaying at least one of a position designation image, an enlarged image, and a predetermined measurement value based on the image data on the display monitor after carrying out the step of carrying out the object to be measured;
This is an inspection method for a workpiece having the following characteristics.

Also, a method for displaying image data of a workpiece after processing, the method comprising:
a position designation image formed based on image data obtained by sequentially capturing images of the object to be measured in each small section;
an enlarged image that is an enlarged image of the object at the specified position of the position specification image;
a predetermined measurement value measured based on the image data;
A method of displaying image data of an object to be measured displays at least one of the following.

According to the configuration of the present invention, the entire workpiece is imaged and the image data is stored in the storage unit, so the processing results of the entire workpiece can be recorded, and the processing can be carried out if necessary later. You can check the results.

FIG. 2 is a perspective view schematically showing an object to be measured. FIG. 2 is a perspective view schematically showing an object to be measured divided into devices. FIG. 2 is a perspective view schematically showing a measuring device. FIG. 4(A) is a perspective view schematically showing the object holding mechanism, and FIG. 4(B) is a perspective view schematically showing the imaging mechanism. FIG. 1 is a perspective view schematically showing a processing device including a measuring device. FIG. 6(A) is a top view schematically showing the mounting section, and FIG. 6(B) is a cross-sectional view schematically showing the mounting section. FIG. 3 is a cross-sectional view schematically showing the positional relationship among the object holding mechanism, the imaging mechanism, and the object when inspecting the object. FIG. 8(A) is a diagram illustrating how the object to be measured is continuously imaged. FIG. 8(B) is a diagram illustrating the configuration of image data and a controller. FIG. 2 is a diagram illustrating a configuration example of a display screen (low magnification display) of a display monitor. FIG. 2 is a diagram illustrating a configuration example of a display screen (high magnification display) of a display monitor. FIGS. 11A to 11D are diagrams illustrating forming and displaying a position specifying image of a specific magnification using image data of a specific resolution.

Embodiments according to one aspect of the present invention will be described with reference to the accompanying drawings. The measuring device according to the present embodiment is capable of inspecting, for example, a workpiece (workpiece) processed by a processing device as an object to be measured, by imaging the object to be measured from the top and bottom surfaces simultaneously.

First, the object to be measured will be explained. The object to be measured is, for example, a substantially disk-shaped wafer made of a material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductors. . Alternatively, the object to be measured is a substrate made of a material such as sapphire, glass, or quartz. Further, the object to be measured may be a package substrate or the like that includes a plurality of device chips sealed with a mold resin or the like.

FIG. 1 is a perspective view schematically showing a wafer, which is an example of the object to be measured 1. As shown in FIG. The surface 1a of the object to be measured 1 is divided, for example, by a plurality of dividing lines called streets 3 that intersect with each other. Devices 5 such as ICs (Integrated Circuits) and LSIs (Large-Scale Integrated Circuits) are formed in each area defined by streets 3 on the front surface 1a of a wafer, which is the object 1 to be measured. Dividing the wafer along streets 3 allows the formation of individual device chips.

To divide the object to be measured 1, for example, a cutting device that can cut the object to be measured 1 along the streets 3 with an annular cutting blade is used. Alternatively, a laser processing device is used that irradiates the object to be measured 1 with a laser beam along the street 3 and processes the object to be measured 1 with a laser beam.

Before carrying the object to be measured 1 into a processing device such as a cutting device or a laser processing device, as shown in FIG. The frame unit 11 is formed by integrating the tape 7 and the frame unit 11. The object 1 to be measured, to which the tape 7 is attached and mounted on the frame 9 via the tape 7, is transported in this state to a processing device and processed.

FIG. 2 shows the state of the object to be measured 1 after being processed by the processing apparatus and divided into devices 5, 5. In this example, cutting is performed by blade dicing.

In order to confirm that the object to be measured 1 has been appropriately processed along the streets 3, the measuring device according to the present embodiment images the processed part of the object to be measured 1 and inspects the object to be measured 1. In this measuring device, for example, the object to be measured 1 is inspected along the street 3, and the position where machining marks are formed, the shape and size of chips, called chipping, formed on the object to be measured 1 along the machining marks, Distribution, cracks, etc. will be investigated. Furthermore, the size of the device chip formed by dividing the object to be measured 1 is confirmed. However, the usage of the measuring device is not limited to this.

The present embodiment will be described below using an example in which the object 1 is a wafer on which a plurality of devices 5 are formed and is divided along the streets 3, but the object 1 is not limited to this. The object to be measured 1 to be inspected by the measuring device according to this embodiment does not need to be processed by a processing device or the like.

FIG. 3 is a perspective view schematically showing the measuring device 56. The measuring device 56 includes a base 60 that supports each component of the measuring device 56. An opening 62 is formed in the base 60 along the X-axis direction. The measuring device 56 includes an object holding mechanism 58 that is arranged to straddle the opening 62 of the base 60 and can hold the object 1 to be measured, and an image of the object 1 held by the object holding mechanism 58. An imaging mechanism 82 is provided.

The measuring device 56 includes an X-axis moving unit 64a that can relatively move the object holding mechanism 58 and the imaging mechanism 82 along the X-axis direction, and a Y-axis moving unit 64a that can relatively move the object holding mechanism 58 and the imaging mechanism 82 along the Y-axis direction. A moving unit 64b is provided. FIG. 4A schematically shows a perspective view of the X-axis moving unit 64a of the measuring device 56 and the object holding mechanism 58. FIG. 4(B) schematically shows a perspective view of the imaging mechanism 82.

The X-axis moving unit 64a includes a guide rail 66a extending along the X-axis direction on the side of the opening 62 on the top surface of the base 60. Furthermore, a guide rail 66b extending parallel to the guide rail 66a is provided on the upper surface of the base 60 on the side of the opening 62 on the side opposite to the guide rail 66a. A movable body 68a is slidably mounted on the guide rail 66a, and a movable body 68b is slidably mounted on the guide rail 66b.

A bridge-like support structure 74 is disposed above the movable body 68a and the movable body 68b so as to straddle both the movable bodies 68a and 68b. Further, a nut portion (not shown) is provided at the lower end of one of the movable bodies 68a and the movable body 68b, and a ball screw 70 parallel to the guide rails 66a and 66b is screwed into this nut portion.

A pulse motor 72 is connected to one end of the ball screw 70. When the ball screw 70 is rotated by the pulse motor 72, the movable bodies 68a and 68b move in the X-axis direction along the guide rails 66a and 66b, and the bridge-like support structure 74 moves in the X-axis direction. The object holding mechanism 58 is supported by the support structure 74 at a position overlapping the opening 62 of the base 60 . The X-axis moving unit 64a can move the object holding mechanism 58 along the X-axis by moving the support structure 74 along the X-axis.

The object-to-be-measured holding mechanism 58 includes a mounting section 76 having a transparent body exposed at the top and bottom. The transparent body is made of a material such as glass or resin, for example. The upper surface of the transparent body becomes a mounting surface 76a on which the object to be measured 1 is mounted via the tape 7. The object holding mechanism 58 can support the object 1 placed on the mounting surface 76a.

Further, as shown in FIG. 3, the measuring device 56 is provided with a display monitor 89 configured as a touch panel as an operation interface, and is capable of displaying wafer inspection results, etc., as will be described in detail later. It has become.

The measuring device 56 configured as described above can also be used by being incorporated into a part of the processing device 2, as shown in FIG.

In the processing apparatus 2, a cassette support stand 6 is provided on a base 4, and a cassette containing a frame unit 11 (FIG. 1) is placed on the cassette support stand 6. The wafer carried out from the cassette is held by the workpiece holding unit 14, and the moving table 12 provided with the workpiece holding unit 14 is moved in the X-axis direction, and the processing feed is moved to the position of the processing units 32, 32. be done.

As shown in FIG. 2, cutting grooves 3a along the streets 3 (FIG. 1) are formed in the wafer (object to be measured 1) by the processing by the processing units 32, 32, and dicing is performed.

The processed wafer is cleaned by the cleaning device 40 and then transported to the mounting section 76 of the object holding mechanism 58 of the inspection unit.

Note that in this specification, the processing apparatus 2 can be configured not only by cutting a wafer (object to be measured 1) but also by a laser processing apparatus that performs laser dicing.

FIG. 6A is a top view schematically showing the object holding mechanism 58, and FIG. 6B is a cross-sectional view schematically showing the object holding mechanism 58. Since the transparent body is also exposed on the back side opposite to the mounting surface 76a, the object to be measured 1 placed on the mounting surface 76a can be observed from the lower surface side.

The object holding mechanism 58 includes a tape holding section 78 having a tape suction holding surface 78b on the outer peripheral side of the mounting section 76 . The tape holding section 78 has a suction groove 78a formed in a tape suction holding surface 78b. A suction source (not shown) is connected to the suction groove 78a via a suction path (not shown). The object holding mechanism 58 further includes an annular frame support part 80 that is arranged around the tape holding part 78 and can support the frame 9 of the frame unit 11.

When the frame unit 11 is placed on the object holding mechanism 58 so that the frame support part 80 and the frame 9 overlap, and the suction source is activated, the object is attached to the object holding mechanism 58 via the tape 7. The object 1 to be measured is held under suction. At this time, the space between the object holding mechanism 58 and the tape 7 is attracted, and the tape 7 is brought into close contact with the entire surface of the mounting surface 76a, so that the object 1 held by the object holding mechanism 58 is It will not shift during the inspection.

For example, even when the object to be measured 1 is a warped wafer or the like, when the object to be measured 1 is held by the object holding mechanism 58, the tape 7 is brought into close contact with the entire mounting surface 76a. Therefore, the object to be measured 1 is suction-held by the object-to-be-measured holding mechanism 58 in a state where the warpage is alleviated. When the warpage of the object 1 held by the object holding mechanism 58 is alleviated, the focus of the imaging unit becomes difficult to shift from the object 1 when capturing images of each region of the object 1 one after another. Therefore, the object to be measured 1 can be imaged more clearly.

Next, the imaging mechanism 82 will be explained.
As shown in FIGS. 3 and 4A, the imaging mechanism 82 is disposed on the base 60, for example, so as to straddle the opening 62, the X-axis moving unit 64a, and the object holding mechanism 58. It is supported by a gate-shaped support structure 84. A Y-axis moving unit 64b that moves the imaging mechanism 82 along the Y-axis direction is disposed on the support structure 84.

The Y-axis moving unit 64b includes a pair of guide rails 86 arranged along the Y-axis direction on the upper surface of the support structure 84. A moving body 88 that supports the imaging mechanism 82 is slidably mounted on the pair of guide rails 86 . A nut portion (not shown) is provided on the lower surface of the movable body 88, and a ball screw 90 parallel to the pair of guide rails 86 is screwed into this nut portion.

A pulse motor 92 is connected to one end of the ball screw 90. When the ball screw 90 is rotated by the pulse motor 92, the moving body 88 moves in the Y-axis direction along the guide rail 86, and the imaging mechanism 82 moves in the Y-axis direction. The X-axis moving unit 64a and the Y-axis moving unit 64b function together as a moving mechanism that can relatively move the object holding mechanism 58 and the imaging mechanism 82 in a direction parallel to the mounting surface 76a.

As shown in FIGS. 3 and 4B, the imaging mechanism 82 includes an upper imaging unit 106a disposed above the mounting section 76 of the object holding mechanism 58, and an upper imaging unit 106a disposed above the mounting section 76 of the object holding mechanism 58. It includes a lower imaging unit and 106b arranged below. Thereby, the measuring device 56 is configured as a measuring device that can simultaneously observe the same position of the object to be measured 1 from both the upper surface side (front surface 1a side) and the lower surface side (back surface 1b side).

The imaging mechanism 82 further includes a connecting portion 108 that connects the upper imaging unit 106a and the lower imaging unit 106b.

The upper imaging unit 106a is supported by a columnar support structure 94a. An elevating mechanism 96a for elevating and lowering the upper imaging unit 106a is disposed on the front surface of the columnar support structure 94a. The lifting mechanism 96a is screwed into a pair of guide rails 98a along the Z-axis direction, a moving body 100a slidably attached to the guide rails 98a, and a nut provided on the rear surface of the moving body 100a. and a ball screw 102a.

An upper imaging unit 106a is fixed to the front surface of the moving body 100a. A pulse motor 104a is connected to one end of the ball screw 102a. When the ball screw 102a is rotated by the pulse motor 104a, the movable body 100a moves in the Z-axis direction along the guide rail 98a, and the upper imaging unit 106a fixed to the movable body 100a moves up and down.

The upper end of the connecting part 108 is connected, for example, to the lower end on the rear side of the support structure 94a, and the lower end of the connecting part 108 is connected to the upper end on the rear side of the columnar support structure 94b that supports the lower imaging unit 106b. It is connected. A lifting mechanism 96b configured in the same manner as the lifting mechanism 96a provided on the supporting structure 94a is provided on the front surface of the supporting structure 94b.

The lifting mechanism 96b is screwed into a pair of guide rails 98b along the Z-axis direction, a moving body 100b slidably attached to the guide rails 98b, and a nut provided on the rear surface of the moving body 100b. and a ball screw 102b. A pulse motor 104b is connected to one end of the ball screw 102b. When the ball screw 102b is rotated by the pulse motor 104b, the lower imaging unit 106b fixed to the front surface of the moving body 100b moves up and down.

The upper imaging unit 106a faces downward and can image the object 1 placed on the upper surface of the object holding mechanism 58 from above. Further, the lower imaging unit 106b faces upward, and can image the object 1 from below through the mounting section 76 and the tape 7, which are made of a transparent body. The upper imaging unit 106a and the lower imaging unit 106b are, for example, an area camera, a line camera, a 3D camera, an infrared camera, or the like.

Next, an embodiment of imaging and inspection by the imaging unit will be described.
FIG. 7 schematically shows a cross-sectional view of the frame unit 11 and the object-to-be-measured holding mechanism 58 when the object-to-be-measured holding mechanism 58 is suction-holding the object 1 to be measured. As shown in FIG. 7, when the suction source is activated, the gap between the tape 7 and the mounting surface 76a is evacuated, and the tape 7 and the mounting surface 76a are brought into close contact with each other.

Note that after the inspection of the object to be measured 1 is completed, when the suction source is stopped and the frame unit 11 is taken out from the object holding mechanism 58, the tape 7 is easily peeled off from the mounting surface 76a. For example, the mounting surface 76a may be coated with fluororesin.

The surface of the object to be measured 1 located on the upper side in FIG. 7 is imaged by an upper imaging unit 106a composed of a visible light camera. As shown in FIG. 8(A), the imaging area of the object to be measured 1 (wafer) is divided into small sections A11, A12, . (front side) are imaged in order.

Similarly, the back surface of the object to be measured 1 located on the lower side in FIG. 7 is imaged by a lower imaging unit 106b composed of an infrared camera. Similarly, on this back surface, as shown in FIG. 8(A), images of each of the small sections A11, A12, . . . (on the back surface side) are sequentially captured.

The above imaging is executed under the control of the controller 400, as shown in FIG. 8(B), and the image data of the front and back sides of each small section A11, A12, etc. is sequentially stored in the storage unit 402 (storage). be done. For example, the image of the front side of the small section A11 is stored in the storage unit 402 as image data Ra11, and the image of the back side is stored as image data Rb11.

The calculation unit 401 of the controller 400 reads each image data stored in the storage unit 402 into the memory 404 (RAM), and as shown in FIG. The specified images 204 and 304 (see FIG. 9) are displayed on the display monitor 89. The position designation images 204, 304 (FIG. 9) are created by reducing the image data of each of the small sections A11, A12, etc. shown in FIG. They are arranged on the same plane and formed as one image.

FIG. 9 shows a display example of the display monitor 89, in which a first position designation image display area 202 is provided on the upper left side, and a position designation image 204 on the front side is displayed. Similarly, a second position specifying image display area 302 is provided on the upper right side, and a position specifying image 304 on the back side is displayed. The position designation images 204 and 304 shown in FIG. 9 are displayed when the magnification for displaying the entire object 1 to be measured is set. For example, the magnification at this time is "1x" as the default magnification. It is stipulated that

Note that in the first position specifying image display area 202, the position specifying images 204 and 304 on the front side and the back side may be selectively displayed, and the same applies to the second position specifying image display area 302. be. Further, a configuration may be adopted in which position specifying images 204 and 304 of different objects to be measured are displayed in the left and right position specifying image display areas 202 and 302, respectively, so that the two objects to be measured can be compared.

In the display mode of the display monitor 89 shown in FIG. A first enlarged image display area 206 is provided. Similarly, below the second position designation image display area 302, there is a second enlarged image display area 306 for displaying an enlarged image of an arbitrary area designated in the second position designation image display area 302. provided.

As shown in FIG. 9, enlargement designation frames 203 and 303 are displayed in the position designation image display areas 202 and 302, respectively. When the enlargement specification frames 203, 303 are touched, enlarged images 207, 307 of the position specification images 204, 304 included in the enlargement specification frames 203, 303 are displayed in the enlarged image display areas 206, 306. For example, the magnification of the enlarged images 207, 307 can be increased depending on the number of times the enlargement designation frame 203, 303 is touched, and the enlarged images 207, 307 can be enlarged twice each time the enlargement designation frame 203, 303 is touched. Enlargement and reduction buttons 212 and 312 are arranged near the enlarged image display areas 206 and 306, and enlargement and reduction can also be performed by touching the buttons 212 and 312.

The enlargement specifying frames 203, 303 can be moved arbitrarily within the position specifying image display areas 202, 302, and enlarged images 207, 307 of arbitrary positions of the object to be measured can be displayed. In this case, the display of the enlarged images 207, 307 may be automatically updated in conjunction with the movement of the enlargement designation frames 203, 303.

Alternatively, the enlargement designation frames 203, 303 may be fixed and the position designation images 204, 304 may be moved to display enlarged images 207, 307 at arbitrary positions of the object to be measured. In this case, the display of the enlarged images 207, 307 may be automatically updated in conjunction with the movement of the position specifying images 204, 304.

Furthermore, the size of the enlargement designation frames 203 and 303 may be configured to be able to be enlarged or reduced.

Furthermore, the position designation images 204, 304 displayed in the upper position designation image display areas 202, 302 can be enlarged and displayed from the state shown in FIG. 9 as shown in FIG. As a result, it becomes possible to enlarge a portion to be enlarged by touching the enlargement specification frames 203, 303 while referring to the enlarged position specification images 204, 304, and excellent operability can be achieved.

As shown in FIG. 10, predetermined automatically measured values are displayed next to the enlarged image display areas 206, 306. The predetermined measurement value is, for example, the average chipping size U1 (for example, the average value of the area of each chipping or the average value of the distance of each chipping from the kerf edge), the maximum pitching size U2 (for example, the average value of the area of each chipping, or the average value of the distance from the kerf edge of each chipping), groove width U3 (the vertical width of the cutting groove displayed in the horizontal direction and the horizontal width of the cutting groove displayed in the vertical direction, also called kerf width), etc. The calculation of each measurement item is performed by executing the program stored in the storage unit 402 in the calculation unit 401 in the controller 400 shown in FIG. 8(B). It is not limited.

Next, a description will be given of the method for displaying the position designation image 204 shown in FIGS. 11(A) to 11(D).
The position designation image 204 in FIG. 11(D) shown at the bottom shows the entire workpiece displayed at a magnification of 1x (default magnification).
Then, by the pinch-out operation, the display magnification increases in the order of 2T times in FIG. 11(C), 4T times in FIG. 11(D), and 8T times in FIG. 11(A), and the displayed image is enlarged. (T times 2T, 4T times, and 8T times are used for convenience of explanation and are natural numbers).

For example, frame A in the position specifying image display area 202 shown in FIG. 11(A) is displayed in the entire range of the position specifying image display area 202 in FIG. 11(B) by a pinch-out operation. There is.
Note that although FIGS. 11A to 11D describe the position designation image 204 displayed in the surface position designation image display area 202, the same applies to the surface position designation image display area 302 shown in FIG. It is.

The position designation image 204 displayed in FIG. 11A is an image generated by arranging the image data Ra11 (RAW), Ra12 (RAW), . . . shown on the left side in the same plane. In the position designation image display area 202, an example is shown in which a position designation image 204 is formed by arranging four adjacent image data Ra11 (RAW), Ra12 (RAW), Ra21 (RAW), and Ra22 (RAW). The image data Ra11 (RAW) etc. expressed in FIG. image).

The same is true in other FIGS. 11B to 11D, but the position designation image 204 is formed by reducing the captured image data Ra11 (RAW). For example, in FIG. 11B, the image data used to create the position specification image 204 in FIG. /4)... are arranged to form the position designation image 204. Note that the numerical value in parentheses of Ra11 (1/4) represents that the number of pixels is reduced to 1/4.

Similarly, in FIGS. 11B to 11C, it is expressed that the number of pixels is reduced to 1/4. FIG. 11(D) shows that the number of pixels is minimized to display the entire object to be measured.

The image data Ra11 (RAW), which is so-called raw data with the same number of pixels at the time of imaging shown in FIG. It will be used when displaying the highest magnification. In this way, by storing the image data Ra11 (RAW), which is so-called raw data, in the storage unit 402, it becomes possible to display a high-quality image without degrading the image quality.

As described above, the image data captured for each of the small sections A11, A12... (FIG. 8(A)) is stored in the storage unit 402 as image data Ra11 (RAW), Ra12 (RAW)... (FIG. 8(B)), and is read out as appropriate and used to form the position designation image 204.

Then, as shown in FIGS. 11A to 11D, image data is read out as appropriate according to the magnification of the position designation image 204, and the number of pixels is changed (reduced) and arranged, and the position designation image 204 is displayed. . For example, as shown in FIG. 11(C), when the magnification of the position specifying image 204 is low (2T times), image data Ra11 (1/16)... with the number of pixels reduced to 1/16 is used. A position designation image 204 is formed. At this time, there is no need to check the details of the position designation image 204, so there is no problem even if the image is displayed as a rough image.

Then, as shown in FIG. 11B, when the magnification of the position designation image 204 is increased, image data Ra11 (1/4)... having a larger number of pixels is used, and the position designation image 204 is formed.

On the other hand, as shown in FIG. 11(D), at the lowest magnification (1x), one overall map M is formed using image data with a smaller number of pixels, and this overall map M is used to specify the position. It is used as an image 204.

In addition to reading the image data as appropriate according to the magnification of the position designation image 204 and changing (reducing) the number of pixels, image data with the number of pixels reduced is created in advance and saved in the storage unit 402. It may also be read out.

In this way, as shown in FIG. 8B, the calculation unit 401 reduces the image data to the number of pixels corresponding to the enlargement magnification, loads it into the memory 404 (RAM), and specifies the position corresponding to the enlargement magnification. Image 204 can be formed. In this way, the amount of memory 404 used can be reduced and the display speed can be increased.

In addition, in creating the position designation image 204 shown in FIGS. 11A to 11D, only the image data Ra11 necessary for displaying within the range of the position designation image display area 202 is stored by changing the number of pixels appropriately. 404 (RAM). That is, instead of loading all of the image data Ra11 for creating the position designation image 204 with a specified magnification into the memory 404 (RAM), the position designation image 204 is created using a part of the image data Ra11. I decided to.

As a result, the calculation unit 401 loads the minimum number of image data required to create the position designation image 204 into the memory 404 (RAM) according to the enlargement magnification, and designates the position necessary to display it in the position designation image display area 202. Image 204 can be formed. In this way, the amount of memory 404 used can be reduced and the display speed can be increased.

The present invention can be implemented as described above.
That is, as shown in FIGS. 1, 3, 8(A)(B), and 9,
A measuring device 56 that measures the workpiece 1 after processing,
a measured object holding mechanism 58 that holds the measured object 1;
an imaging mechanism 82 that images the object 1 held by the object holding mechanism 58 and forms image data;
a moving mechanism (an X-axis moving unit 64a and a Y-axis moving unit 64b) that moves the imaging mechanism 82 relative to the object holding mechanism 58;
a controller 400 having a storage unit that stores image data;
A display monitor 89 for displaying image data,
The display monitor 89 is
A position specifying image that displays position specifying images 204, 304 formed based on image data Ra11, Ra12, etc., which are sequentially imaged for each small section A11, A12,... by moving the imaging mechanism 82 using a moving mechanism. Display areas 202, 302,
An enlarged image 207, 307 of the specified position of the object to be measured displayed in the position specification image display area 202, 302, and/or an enlarged image display area 206, 306 that displays a predetermined measurement value (average chipping size U1, etc.) The measuring device 56 has the following.

As a result, the entire workpiece is imaged and the image data is stored in the storage unit, so the processing results of the entire workpiece can be recorded and the processing results can be checked later when needed.

In addition, as shown in FIGS. 4(A) and (B),
The object to be measured holding mechanism 58 has a mounting surface 76a made of a transparent body that constitutes a holding surface for holding the object to be measured 1,
The imaging mechanism 82 is
an upper imaging unit 106a that images the upper surface of the object to be measured;
a lower imaging unit 106b that is arranged to face the upper imaging unit 106a across the mounting surface 76a and captures an image of the lower surface of the object to be measured 1;
The position designation image display areas 202, 302 and the enlarged image display areas 206, 306 are
Each,
At least one of position designation images 204, 304, enlarged images 207, 307, and a predetermined measurement value (average chipping size U1, etc.) based on image data captured by the upper imaging unit 106a and the lower imaging unit 106b, respectively. It shall be configured such that one can be displayed.

Thereby, both the front and back surfaces of the plate-shaped object to be measured can be measured and observed at the same time, and the throughput regarding measurement of the object to be measured can be improved.

Moreover, as shown in FIGS. 3 and 9,
An inspection method for inspecting an object to be measured 1 with a measuring device 56, comprising:
a holding step of holding the measured object 1 with the measured object holding mechanism 58;
an imaging step of imaging the object 1 held by the object holding mechanism 58 with the imaging mechanism 82;
After performing the imaging step, a measured object carrying out step of carrying out the measured object 1 from the measured object holding mechanism 58;
After performing the step of carrying out the object to be measured, at least one of the position designation images 204 and 304 based on the image data, the enlarged images 207 and 307, and a predetermined measurement value (average chipping size U1, etc.) is displayed on the display monitor 89. a display step;
This is an inspection method for a workpiece having the following characteristics.

Here, in the step of carrying out the object to be measured, in FIG. This is the step of carrying out the object to be measured, and the series of measurement steps ends with this step of carrying out the object to be measured. After the measurement is completed in this manner, the state of the object to be measured is checked and inspected using various images. This inspection can be performed even after a period of time has elapsed after the measurement, and this can be achieved by saving the image data. In this way, it is possible to meet the desire to check the machining results when necessary later.

Note that in order to be able to measure and observe the object to be measured after the fact, the device is configured so that the serial number of the object to be measured can be specified and various image data can be read out.

Moreover, as shown in FIGS. 8 to 11,
A method for displaying image data of a workpiece 1 after processing, the method comprising:
Position designation images 204, 304 formed based on image data Ra11, Ra12, etc. obtained by sequentially capturing images of the object to be measured 1 for each subdivision A11, A12,...
enlarged images 207, 307, which are enlarged images of the object to be measured at the specified position of the position specification images 204, 304;
A predetermined measurement value (average chipping size U1, etc.) measured based on the image data Ra11, Ra12...
The present invention provides a method for displaying imaged data of an object to be measured that displays at least one of the following.

In this configuration, by specifying a desired position while referring to the position specifying images 204, 304, enlarged images 207, 307 and predetermined measurement values can be confirmed, and an interactive display that is easy for the operator to operate. The method has been realized, and measurements and observations can be carried out efficiently.

1 Object to be measured 1a Front surface 1b Back surface 2 Processing device 3a Cutting groove 56 Measuring device 58 Object holding mechanism 89 Display monitor 106a Upper imaging unit 106b Lower imaging unit 202 First position designation image display area 203 Enlargement designation frame 303 Enlargement designation Frame 204 Position specification image 206 First enlarged image display area 207 Enlarged image 302 Second position specification image display area 304 Position specification image 306 Second enlarged image display area 307 Enlarged image A11 Small section Ra11 Image data U1 Average chipping size U2 Maximum pitching size U3 Groove width

Claims (4)

A measuring device for measuring a workpiece after processing,
a measured object holding mechanism that holds the measured object;
an imaging mechanism that images the object to be measured held by the object-to-be-measured holding mechanism and forms image data;
a moving mechanism that moves the imaging mechanism relative to the object holding mechanism;
a controller having a storage unit that stores the image data;
a display monitor that displays the image data;
The display monitor is
a position designation image display area that displays a position designation image formed based on image data sequentially captured for each small section by moving the imaging mechanism using the moving mechanism;
an enlarged image of the specified position of the object to be measured displayed in the position specified image display area and/or an enlarged image display area that displays a predetermined measurement value;
The position specifying image can be formed as one image by reducing the number of pixels of the image data of each of the small sections and arranging the image data with the reduced number of pixels on the same plane. The object holding mechanism has a mounting surface made of a transparent body that constitutes a holding surface that holds the object to be measured,
The imaging mechanism is
an upper imaging unit that images the top surface of the object to be measured;
a lower imaging unit that is arranged to face the upper imaging unit across the mounting surface and captures an image of the lower surface of the object to be measured;
The position designation image display area is configured to be able to display a position designation image based on image data respectively captured by the upper imaging unit and the lower imaging unit,
The enlarged image display area is
configured to be able to display an enlarged image of the designated position of the object to be measured and/or a predetermined measurement value displayed in the position designated image display area;
The measuring device according to claim 1, characterized in that: An inspection method for inspecting an object to be measured using the measuring device according to claim 1 or 2, comprising:
a holding step of holding the object to be measured with the object holding mechanism;
an imaging step of imaging the object to be measured held by the object-to-be-measured holding mechanism with the imaging mechanism;
After performing the imaging step, a step of carrying out the object to be measured from the object holding mechanism;
a display step of displaying at least one of a position designation image based on the image data, an enlarged image, and a predetermined measurement value on the display monitor after carrying out the step of carrying out the object to be measured;
A method for inspecting a workpiece having: A method for displaying image data of a workpiece after processing, the method comprising:
a position designation image formed based on image data obtained by sequentially capturing images of the object to be measured for each small section;
displaying an enlarged image that is an enlarged image of the object to be measured at a specified position of the position specification image and/or a predetermined measurement value measured based on the image data;
The position designation image can be formed as one image by reducing the number of pixels of the image data of each of the small sections and arranging the image data with the reduced number of pixels on the same plane.
How to display image data of the object to be measured.