JP6829467B2 - Double-sided polishing device - Google Patents

Description

The present invention is an invention relating to a double-sided polishing apparatus for polishing both sides of a work arranged between a lower surface plate and an upper surface plate.

Conventionally, the upper surface plate is connected to the cylinder shaft installed on the upper part of the device via a universal joint or a centering bearing, and the first groove and the first groove formed in the axial direction on the outer peripheral surface of the center drum are formed. A second groove having a different length from the above is formed, and the hook provided on the upper surface plate is engaged with the first groove or the second groove to transmit the rotational force of the center drum to the upper surface plate. A double-sided polishing device is known (see, for example, Patent Document 1).

JP-A-2017-1151

In the conventional double-sided polishing apparatus, a hook formed on the upper surface plate is inserted into the first groove in order to lower the upper surface plate to the work polishing position during work polishing. On the other hand, when cleaning or dressing the polishing pad attached to the upper surface plate (hereinafter referred to as "dressing"), a hook is inserted into the second groove. Then, the hook is supported by a support surface that supports the hook formed in the second groove from below, the upper surface plate is stopped at a position above the work polishing position, and then the upper surface plate during dressing is used. Maintain a horizontal position.
However, in this conventional double-sided polishing apparatus, the hook must be inserted into the groove at both the time of polishing the work and the time of dressing the polished surface. That is, even when dressing the upper surface plate, the relative rotation angle between the upper surface plate and the center drum must be adjusted so that the hook can be inserted into the desired groove, which reduces workability during dressing. The problem arises.
Further, in the conventional double-sided polishing apparatus, a pair of second grooves is formed, but if there is a difference in the groove depths of the pair of second grooves due to a problem of machining accuracy, during dressing. There is a concern that the upper surface plate will tilt.

The present invention has been made by paying attention to the above problems, and is a double-sided polishing apparatus capable of keeping the upper surface plate horizontal during dressing while suppressing a decrease in workability when dressing the upper surface plate. The purpose is to provide.

In order to achieve the above object, the present invention is a double-sided polishing device for polishing both sides of a work by a lower surface plate and an upper surface plate, in which a driver, a support mechanism, a hook, a groove, a contact area, and a protrusion are provided. And have.
The driver, through the center opening of the lower stool is closed and the drive shaft disposed along the axis, and can be inserted driver body central opening of the upper surface plate is formed at the distal end of the drive shaft, the together, it rotates around the axis.
The support mechanism, the upper platen hanging support to rotatable around swingably and axially line, Ru is lower the upper platen.
The hook extends toward the center of the upper stool from the periphery of the central opening of the upper stool.
The groove extends in the axial direction of the driver is formed in a peripheral surface of the gun body, it is open at least in upward direction driver body.
The contact region is formed on the upper surface of the driver body facing the upper surface plate, and the upper end of the groove portion is open .
The protrusions that protrude from the contact region upward.
Then, when the upper platen is lowered by the support mechanism, the hook comes into contact with the contact area when it does not face the groove in the vertical direction, and the protrusion comes into contact with the driver as the drive shaft rotates. The rotational force is transmitted from the driver and is inserted into the groove when it faces the groove in the vertical direction, and the inner surface of the groove comes into contact with the rotation of the drive shaft to transmit the rotational force from the driver.

As a result, it is possible to keep the upper surface plate horizontal during dressing while suppressing a decrease in workability when dressing the polished surface of the upper surface plate.

It is sectional drawing which shows schematic about the whole structure of the double-sided polishing apparatus of Example 1. FIG. It is a perspective view which shows the main part of the double-sided polishing apparatus of Example 1. FIG. It is a top view which shows the driver of the double-sided polishing apparatus of Example 1. FIG. It is a top view which shows the main part of the upper surface plate of the double-sided polishing apparatus of Example 1. FIG. It is a top view at the time of dressing in the double-sided polishing apparatus of Example 1. FIG. FIG. 5 is a sectional view taken along the line AA in FIG. It is a top view at the time of work polishing in the double-sided polishing apparatus of Example 1. FIG. FIG. 7 is a sectional view taken along line BB in FIG. It is a perspective view which shows the main part of the double-sided polishing apparatus of another example. It is a top view at the time of dressing in the double-sided polishing apparatus of another example. FIG. 5 is a cross-sectional view taken along the line CC in FIG. 10A. It is a top view at the time of work polishing in the double-sided polishing apparatus of another example. 11A is a cross-sectional view taken along the line DD in FIG. 11A. It is explanatory drawing which shows the deformation example of a hook and a protrusion. It is explanatory drawing which shows the modification of the driver.

Hereinafter, a mode for carrying out the double-sided polishing apparatus of the present invention will be described with reference to Example 1 shown in the drawings.

(Example 1)
First, the configuration will be described.
The double-sided polishing apparatus 1 in the first embodiment polishes both the front and back surfaces of a thin plate-shaped work WR such as a semiconductor wafer, a crystal wafer, a sapphire wafer, a glass wafer, or a ceramic wafer. Hereinafter, the configuration of the double-sided polishing apparatus 1 of the first embodiment will be described separately for "overall configuration", "detailed configuration of driver", and "detailed configuration of hook".

[overall structure]
FIG. 1 is a cross-sectional view schematically showing the overall configuration of the double-sided polishing apparatus of the first embodiment. Hereinafter, the overall configuration of the double-sided polishing apparatus of the first embodiment will be described with reference to FIG.

As shown in FIG. 1, the double-sided polishing apparatus 1 of the first embodiment has a lower surface plate 2 arranged concentrically about an axis L1, an upper surface plate 3, and a sun gear arranged in the center of the lower surface plate 2. It has 4 and an internal gear 5 arranged so as to surround the outer periphery of the lower surface plate 2.

The sun gear 4, the lower platen 2, and the internal gear 5 are connected to a drive source (not shown) via drive shafts 6, 7, and 8, respectively, and are rotationally driven.

On the other hand, the upper surface plate 3 is suspended and supported by the rod 9c of the elevating actuator 9 via the surface plate suspension 9a attached to the upper surface of the upper surface plate 3. Here, a centering bearing 9b such as a spherical bearing is interposed at the tip of the rod 9c. As a result, the upper surface plate 3 is swayably and rotatably suspended and supported by the elevating actuator 9. That is, a support mechanism for suspending and supporting the upper surface plate 3 is configured by the elevating actuator 9 and the centering bearing 9b.

Further, a driver 10 penetrating the lower surface plate 2 is provided below the upper surface plate 3. The driver 10 has a drive shaft 10a extending along the axis L1 and a driver body 10b formed at the tip of the drive shaft 10a.
The driver 10 has a drive shaft 10a connected to a drive source (not shown) and is rotatable around the axis L1. Further, a plurality of (here, four) groove portions 11 are formed on the peripheral surface of the driver body 10b. On the other hand, a plurality of (here, four) hooks 20 extending toward the center O of the upper surface plate 3 are attached to the peripheral edge (inner peripheral edge) of the central opening 3b of the upper surface plate 3.
Then, when polishing the work WR, the rod 9c protrudes from the elevating actuator 9 to lower the upper surface plate 3, and one hook 20 is inserted into each groove portion 11. Then, when the groove portion 11 and the hook 20 interfere with each other in the circumferential direction, the rotational force of the driver 10 is transmitted to the upper surface plate 3, and the upper surface plate 3 is rotationally driven.

Polishing pads 2a and 3a are attached to the surfaces of the lower surface plate 2 and the upper surface plate 3 facing each other, respectively.

Then, in this double-sided polishing apparatus 1, the work WR held by the carrier plate CA is arranged between the lower surface plate 2 and the upper surface plate 3. Here, the carrier plate CA meshes with the sun gear 4 and the internal gear 5 as shown in FIG. 1, and rotates and revolves by the rotation of the sun gear 4 and the internal gear 5. Then, due to the rotation and revolution of the carrier plate CA, the work WR held by the carrier plate CA moves between the lower surface plate 2 and the upper surface plate 3, and both sides are polished.

[Detailed driver configuration]
FIG. 2 is a perspective view showing a main part of the double-sided polishing apparatus of the first embodiment, and FIG. 3 is a plan view of the driver of the first embodiment. Hereinafter, the detailed configuration of the driver of the first embodiment will be described with reference to FIGS. 2 and 3.

As described above, the driver 10 is rotationally driven by a drive source (not shown) and transmits a rotational force to the upper surface plate 3 to rotationally drive the upper surface plate 3. As shown in FIG. 2, the driver 10 has a drive shaft 10a connected to a drive source and arranged along the axis L1, and a driver body 10b formed at the tip of the drive shaft 10a. There is.

The drive shaft 10a penetrates the central opening 2b of the lower platen 2 and supports the driver body 10b at a position protruding upward from the lower platen 2 (see FIG. 1).

In the driver body 10b, a plurality of (4 in this case) groove portions 11 are formed on the peripheral surface, a contact region 12 is formed on the upper surface 10c facing the upper surface plate 3, and a plurality of (here, 2) contact regions 12 are formed. The protrusions 13 are formed.

As shown in FIG. 2, the groove portion 11 extends along the axis L1, that is, the axial direction of the driver 10, and is open in the radial direction and the vertical direction of the driver main body 10b. Further, the groove width G1 of each of the four groove portions 11 is set to the same dimension into which the hook 20 can be inserted (see FIG. 3). The "groove width G1" is an interval dimension in the circumferential direction of the inner side surface 11a of the driver body 10b.
Further, in the first embodiment, four groove portions 11 are formed at intervals of 90 ° along the circumferential direction of the driver main body 10b, and these groove portions 11 have a center O (axis line L1) of the upper surface plate 3. It is arranged at a point-symmetrical position with the passing point) as the point of symmetry.

The contact area 12 is a region where the contact surface 22a of the tip portion 22 of the hook 20 can be contacted, and has a sufficiently wider area than the contact surface 22a. Here, as shown in FIG. 3, the region is along the peripheral edge of the driver body 10b. The groove portion 11 overlaps the contact region 12, and the upper end of the groove portion 11 is open in the contact region 12.

The protrusion 13 projects upward from the contact region 12 along the axial direction (axis L1) of the driver 10 and contacts the side surface 22b of the tip 22 of the hook 20 in contact with the contact region 12. It is possible. Here, as shown in FIG. 3, the protrusion 13 is curved along the circumferential direction of the driver body 10b, but the circumferential dimension G2 is sufficiently smaller than the distance between the groove portions 11. It is set. That is, the upper end of the groove 11 is opened in the contact area 12, and the protrusion 13 is formed in the contact area 12, which is the contact surface 22a of the tip 22 of the hook 20. A sufficient area for contact is secured.
The protrusion 13 may be formed separately from the driver body 10b and fixed to the driver body 10b by screws (not shown), welding, or the like, or may be integrally formed with the driver body 10b.

[Detailed configuration of hook]
FIG. 4 is a plan view of the central portion of the upper surface plate of the first embodiment. Hereinafter, the detailed configuration of the hook provided on the upper surface plate of the first embodiment will be described with reference to FIGS. 2 and 4.

The hook 20 is fixed to the peripheral edge (inner peripheral edge) of the central opening 3b of the upper surface plate 3 and extends toward the center O of the upper surface plate 3. As shown in FIG. 4, one end of the hook 20 is fixed to the upper surface of the upper surface plate 3, and the tip of the hook 20 is attached to a fixing portion 21 protruding inward of the central opening 3b of the upper surface plate 3 and the tip of the fixing portion 21. It has a tip portion 22 that is formed and extends toward the lower surface plate 2. Here, as shown in FIGS. 1 and 4, the fixing portion 21 extends until the tip portion 22 is located above the upper surface 10c of the driver body 10b, and when viewed in a plan view, the tip portion 22 is the driver. It overlaps with the upper surface 10c of the main body 10b.

Further, in this hook 20, the hook width W1 of the tip portion 22 is slightly smaller than the groove width G1 of the groove portion 11, and the side surface 22b of the tip portion 22 contacts the inner side surface 11a of the groove portion 11 when inserted into the groove portion 11. The first hook 20A and the hook width W2 of the tip portion 22 are sufficiently smaller than the groove width G1 of the groove portion 11, and the side surface 22b of the tip portion 22 contacts the inner side surface 11a of the groove portion 11 when inserted into the groove portion 11. It has a second hook 20B that does not. The "hook width" is the dimension of the hook tip portion in the circumferential direction of the upper surface plate 3.

Two first hooks 20A and two second hooks 20B are provided, and here, the first hook 20A and the second hook 20B are alternately arranged at 90 ° intervals along the circumferential direction of the upper surface plate 3. That is, as shown in FIG. 4, the four hooks 20 are arranged at point-symmetrical positions with the center O (the point through which the axis L1 passes) of the upper surface plate 3 as the symmetric point, and the first hooks 20A are connected to each other. The second hooks 20B are arranged at positions facing each other and facing each other.

Next, the operation of the double-sided polishing apparatus of Example 1 will be described separately as "upper surface plate supporting action during dressing" and "upper surface plate supporting action during work polishing".

[Upper surface plate support during dressing]
5 and 6 show the main parts when dressing the upper surface plate with the double-sided polishing apparatus of the first embodiment. Hereinafter, the action of supporting the upper surface plate during dressing in the double-sided polishing apparatus of Example 1 will be described with reference to FIGS. 5 and 6.

In the double-sided polishing apparatus 1 of the first embodiment, the upper surface plate 3 is lowered at the time of polishing the work, and the work WR placed on the lower surface plate 2 is sandwiched between the upper surface plate 3 and the lower surface plate 2.
Here, in order to make the pressing force acting on the work WR uniform even if the thickness of the carrier plate CA holding the work WR and the work WR varies, and also to make the lower surface plate 2 minute as the rotation of the lower surface plate 2 occurs. In order to make the upper surface plate 3 follow the vertical vibration (swing), the upper surface plate 3 is suspended and supported by the elevating actuator 9 via the centering bearing 9b, and deviates in the horizontal direction. It is possible to tolerate it.

On the other hand, polishing pads 2a and 3a are attached to the lower surface plate 2 and the upper surface plate 3, respectively, and the work WR is the rotation of the lower surface plate 2, the upper surface plate 3 and the carrier plate CA, and the polishing pads 2a and 3a. Is polished by a slurry supplied from a supply mechanism (not shown). However, if the double-sided polishing apparatus 1 is used for a long time, slurry, chips, etc. may enter the polishing pads 2a and 3a, causing clogging of the polishing pads 2a and 3a and deformation of the surfaces of the polishing pads 2a and 3a. .. Therefore, since the polishing rate is remarkably lowered, the polishing pads 2a and 3a are dressed.

Here, in the dressing of the polishing pads 2a and 3a, for example, a dressing member is inserted between the lower surface plate 2 and the upper surface plate 3, and the dressing member is further polished while rotating the lower surface plate 2 and the upper surface plate 3, respectively. This is performed by pressing the pads 2a and 3a against the polished surface and reciprocating between the outer peripheral portion and the inner peripheral portion of the lower surface plate 2 and the upper surface plate 3.
At this time, since it is necessary to insert the dressing member between the lower surface plate 2 and the upper surface plate 3, the upper surface plate 3 is held with a gap with respect to the lower surface plate 2. However, as described above, since the upper surface plate 3 is suspended and supported via the centering bearing 9b, when the dressing member is pressed against the polishing pad 3a of the upper surface plate 3, the upper surface plate 3 is tilted. This will change and the dressing member will not be able to properly contact the polishing pad 3a of the upper surface plate 3.

On the other hand, in the double-sided polishing apparatus 1 of the first embodiment, as shown in FIGS. 5 and 6, when the upper surface plate 3 is lowered by the elevating actuator 9, the hook 20 provided on the upper surface plate 3 The contact surface 22a of the tip portion 22 comes into contact with the contact region 12 formed on the upper surface 10c of the driver body 10b. As a result, the upper surface plate 3 is supported by the upper surface 10c of the driver 10 via the hook 20.

As a result, even if the dressing member is pressed against the polishing pad 3a of the upper surface plate 3 when dressing the upper surface plate 3, the hook 20 interferes with the upper surface 10c of the driver 10 to prevent the upper surface plate 3 from wobbling. To. Therefore, the upper surface plate 3 can be maintained horizontally during dressing.

Further, the contact region 12 with which the contact surface 22a of the tip portion 22 of the hook 20 comes into contact is a region along the peripheral edge portion of the driver body 10b, as shown in FIG. Further, in the contact region 12, the upper end of the groove 11 is opened and the protrusion 13 is formed, but a sufficient area for contact with the contact surface 22a of the tip 22 of the hook 20 is secured. There is. Therefore, if the upper surface plate 3 is lowered without strictly adjusting the relative rotation angle between the upper surface plate 3 and the driver 10 in the circumferential direction, the hook 20 is a contact region formed on the upper surface 10c of the driver body 10b. It comes into contact with 12. As a result, it is possible to suppress a decrease in workability during dressing.

Then, in the first embodiment, a protrusion 13 protruding upward along the axial direction (axis line L1) of the driver 10 is formed in the contact region 12 formed on the upper surface 10c of the driver body 10b, and the protrusion 13 is formed. Can come into contact with the side surface 22b of the tip portion 22 of the hook 20 which has come into contact with the contact area 12.
Therefore, when the drive shaft 10a of the driver 10 rotates, the protrusion 13 comes into contact with the side surface 22b of the tip 22 of the hook 20, as shown in FIG. As a result, the rotational force of the driver 10 is transmitted to the hook 20, and the upper surface plate 3 rotates.
That is, the rotational force of the driver 10 can be transmitted to the upper surface plate 3 through the protrusion 13, and the upper surface plate 3 can be rotated to perform dressing. As a result, the dressing work can be appropriately performed.

Further, in the first embodiment, two protrusions 13 are provided as opposed to four hooks 20. That is, the number of protrusions 13 (2) is smaller than the number of hooks 20 (4). Therefore, as shown in FIG. 5, all the hooks 20 do not come into contact with the protrusions 13, but the hooks 20 come into contact with the protrusions 13 and the rotational force is transmitted from the driver 10 (the second hook in FIG. 5). 20B) and a hook 20 (first hook 20A in FIG. 5) that does not come into contact with the protrusion 13 and does not transmit a rotational force are generated.
As a result, the rotational force is not input to all the hooks 20 at the time of dressing, and the hook 20 to which the rotational force is input differs each time the dressing is performed, depending on the relative rotation angle in the circumferential direction between the upper surface plate 3 and the driver 10. be able to. Therefore, the load acting on each hook 20 can be dispersed. As a result, it is possible to prevent the hook 20 from being damaged or malfunctioning.

In particular, as shown in FIG. 5, the hook width W1 of the tip portion 22 is slightly smaller than the groove width G1 of the groove portion 11, and the first hook 20A whose side surface 22b contacts the inner side surface 11a of the groove portion 11 is on the protrusion portion 13. When the hook width W2 of the tip portion 22 does not contact and the hook width W2 of the tip portion 22 is sufficiently smaller than the groove width G1 of the groove portion 11 and the side surface 22b does not contact the inner side surface 11a of the groove portion 11 when the second hook 20B contacts the protrusion portion 13. As will be described later, the rotational force from the driver 10 is transmitted only to the first hook 20A during work polishing, and is transmitted only to the second hook 20B during dressing.
Therefore, the hooks 20 to which the rotational force is transmitted can be made different between the time of polishing the work and the time of dressing, and the load acting on each hook 20 can be further dispersed. As a result, it is possible to prevent the hook 20 from being damaged or malfunctioning.
It is also possible that the hook width W1 of the first hook 20A and the hook width W2 of the second hook 20B have the same hook width.

[Upper surface plate support during work polishing]
7 and 8 show the main parts when the work is polished by the double-sided polishing apparatus of the first embodiment. Hereinafter, the upper surface plate supporting action during workpiece polishing in the double-sided polishing apparatus of Example 1 will be described with reference to FIGS. 7 and 8.

As described above, in the double-sided polishing apparatus 1 of the first embodiment, the upper surface plate 3 is lowered and the upper surface plate 3 is placed on the lower surface plate 2 to polish the work WR. That is, in order to polish the work WR, first, the angle in the rotation direction of the upper surface plate 3 or the rotation of the driver 10 so that the relative rotation angle of the upper surface plate 3 and the driver 10 in the circumferential direction becomes a predetermined angle. Adjust the angle of direction. The "predetermined angle" is an angle at which the hook 20 provided on the upper surface plate 3 and the groove portion 11 formed in the driver 10 face each other in the vertical direction.

Then, when the relative rotation angle of the upper surface plate 3 and the driver 10 in the circumferential direction becomes a predetermined angle and the hook 20 and the groove portion 11 face each other in the vertical direction, the rod 9c is projected from the elevating actuator 9 to perform the upper surface plate. Descend board 3. Then, as shown in FIGS. 7 and 8, the four hooks 20 are inserted into the four groove portions 11 as the upper surface plate 3 descends, so that the hooks 20 do not interfere with the driver body 10b. , The upper surface plate 3 can be placed on the lower surface plate 2.

Then, when the drive shaft 10a of the driver 10 rotates due to the hook 20 being inserted into the groove portion 11 in this way, the inner side surface 11a of the groove portion 11 becomes the side surface 22b of the first hook 20A as shown in FIG. Contact. As a result, the rotational force of the driver 10 is transmitted to the first hook 20A, and the upper surface plate 3 rotates.
That is, the rotational force of the driver 10 can be transmitted to the upper surface plate 3 through the groove portion 11, and the upper surface plate 3 can be rotated to polish the work WR. As a result, the work polishing work can be appropriately performed.

Further, in the first embodiment, as is clear from FIG. 7, the side surface 22b of the first hook 20A in which the hook width W1 of the tip portion 22 is slightly smaller than the groove width G1 of the groove portion 11 is the groove portion 11. The side surface 22b of the second hook 20B, which is in contact with the inner side surface 11a of the second hook 20B and whose hook width W2 of the tip portion 22 is sufficiently smaller than the groove width G1 of the groove portion 11, does not contact the inner side surface 11a of the groove portion 11. Therefore, the rotational force from the driver 10 is transmitted only to the first hook 20A, and the rotational force does not act on the second hook 20B. When polishing the work, each of the four hooks 20 must be inserted into the four groove portions 11, but for the second hook 20B, the dimensional accuracy required between the two hooks 20 and the groove portion 11 can be relaxed, and the four hooks 20 can be relaxed. The hook 20 can be easily inserted into the groove 11.

As described above, the first hook 20A that comes into contact with the inner side surface 11a of the groove portion 11 during work polishing has the contact surface 22a of the tip portion 22 in contact with at least the contact region 12 during dressing, so that the upper surface plate 3 is pressed. Can be supported. That is, the first hook 20A is a hook that simultaneously transmits the rotational force during work polishing and supports the upper surface plate during dressing.

Then, in the first embodiment, the four hooks 20 and the four groove portions 11 are formed at intervals of 90 ° along the circumferential direction, and both of them have the center O (axis line L1) of the upper surface plate 3. It is arranged at a point-symmetrical position with the passing point) as the point of symmetry.
Therefore, the upper surface plate 3 can be supported in a well-balanced manner by the four hooks 20 during dressing, and the wobbling of the upper surface plate 3 is suppressed regardless of the direction in which the force acts on the upper surface plate 3 during dressing. It can maintain a horizontal state. On the other hand, at the time of polishing the work, each hook 20 can be inserted into the groove portion 11, and the driver 10 does not hinder the lowering of the upper surface plate 3, and the work WR can be appropriately polished.

Next, the effect will be described.
In the double-sided polishing apparatus 1 of the first embodiment, the effects listed below can be obtained.

(1) In the double-sided polishing apparatus 1 for polishing both sides of the work WR by the lower surface plate 2 and the upper surface plate 3.
A driver 10 that penetrates the lower platen 2 and rotates around an axis,
A support mechanism (elevating actuator 9, centering bearing 9b) that suspends and supports the upper surface plate 3 so as to be swingable and rotatable, and
A hook 20 extending from the peripheral edge of the central opening 3b of the upper surface plate 3 toward the center O, and
The hook 20 can be inserted when the relative rotation angle between the upper surface plate 3 and the driver 10 in the circumferential direction is a predetermined angle while being formed on the peripheral surface of the driver 10 and extending in the axial direction of the driver 10. Groove 11 and
The contact region 12 formed on the upper surface 10c of the driver 10 and
A protrusion 13 provided in the contact area 12 and in contact with the hook 20 in a state where the hook 20 is in contact with the contact area 12.
The configuration was made with.
As a result, the upper surface plate 3 can be maintained horizontally during dressing while suppressing a decrease in workability when dressing the upper surface plate 3.

(2) A plurality (4) of the groove portions 11 are formed on the peripheral surface of the driver 10.
The hook 20 has a first hook 20A that contacts the inner side surface 11a of the groove 11 when inserted into the groove 11, and a first hook 20A that does not contact the inner surface 11a of the groove 11 when inserted into the groove 11. It is configured to have two hooks 20B.
As a result, in addition to the effect of (1), the dimensional accuracy required between the second hook 20B and the groove portion 11 can be relaxed, and a plurality of hooks 20 can be easily inserted into the groove portion 11.

(3) The hook 20 and the groove portion 11 are both provided at a plurality of point-symmetrical positions with the center O of the upper surface plate 3 as a symmetric point.
As a result, in addition to the effects of (1) or (2), the upper surface plate 3 can be supported in a well-balanced manner in the circumferential direction during dressing.

(4) The number of protrusions 13 (2) is smaller than the number of hooks 20 (4).
As a result, in addition to the effect of any one of (1) to (3), the hook 20 to which the rotational force is transmitted can be made different each time the dressing is performed, and the load acting on each hook 20 can be dispersed. It is possible to prevent the hook 20 from being damaged or malfunction.

Although the double-sided polishing apparatus of the present invention has been described above based on the first embodiment, the specific configuration is not limited to this embodiment, and the gist of the invention according to each claim in the claims. Design changes and additions are permitted as long as they do not deviate from.

In Example 1, four groove portions 11 and two protrusions 13 are formed on the driver body 10b, and four hooks 20 are provided on the upper surface plate 3. However, the number of grooves, protrusions, and hooks is not limited to this, and one or more of each may be provided. That is, for example, as shown in FIG. 9, three groove portions 11 and three protrusions 13 may be formed on the driver body 10b, and three hooks 20 may be provided on the upper surface plate 3.
Even in this case, as shown in FIGS. 10A and 10B, at the time of dressing, the three hooks 20 each contact the contact region 12 formed on the upper surface 10c of the driver body 10b and circulate around the upper surface plate 3. Can be supported in a well-balanced direction.

Further, at this time, the hook widths of the tip portions 22 of the three hooks 20 are all set to the same dimensions slightly smaller than the groove width G1. Therefore, as shown in FIGS. 11A and 11B, when the hooks 20 are inserted into the grooves 11 during work polishing, the side surfaces 22b of all the hooks 20 come into contact with the inner side surfaces 11a of the grooves 11. On the other hand, since the number of protrusions 13 (3) is the same as the number of hooks 20 (3), all the hooks 20 come into contact with the protrusions 13 during dressing.
Therefore, the rotational force input from the driver 10 can be received by all the hooks 20 in both the dressing and the work polishing, and the rotational force is distributed and input. As a result, the rotational force acting on the hook 20 is not concentrated, and it is possible to prevent the hook 20 from being damaged.

In the first embodiment, the hook 20 has a first hook 20A that comes into contact with the inner side surface 11a of the groove 11 during work polishing, and a second hook 20B that does not come into contact with the inner side surface 11a of the groove 11 during work polishing. Not limited to this. For example, the hook widths of the plurality of (4) hooks 20 may all have the same dimensions.
In this case, the rotational force input from the driver 10 at the time of polishing the work can be received by all the hooks 20, and the rotational force is distributed and input. As a result, the force acting on the hook 20 is not concentrated, and it is possible to prevent the hook 20 from being damaged or the like.

In the first embodiment, the hook width W1 of the first hook 20A is made slightly smaller than the groove width G1 of the groove portion 11, and the hook width W2 of the second hook 20B is made sufficiently smaller than the groove width G1 of the groove portion 11. a first hook 20A of the side surface 22b comes into contact with the inner side surface 11a of the groove 11 has been formed and a second hook 20B of the side surface 22b does not contact the inner side surface 11a of the groove 11 is not limited thereto. For example, to set all the hook widths of the plurality of hooks 20 are the same size, by varying the groove width of the groove 11 as appropriate, and the first hook 20A of the side surface 22b comes into contact with the inner side surface 11a of the groove 11, the side surface 22b There may be formed a second hook 20B does not contact with the inner side surface 11a of the groove 11.

In the first embodiment, the groove portion 11 formed on the peripheral surface of the driver main body 10b is opened in the radial direction and the vertical direction of the driver main body 10b, but the present invention is not limited to this. The groove portion 11 has a groove length that allows the hook 20 to be inserted by opening at least upward and allows the upper surface plate 3 to be lowered until the upper surface plate 3 is placed on the lower surface plate 2. It does not have to be open downward as long as it is.

In the first embodiment, an example is shown in which the contact region 12 is a region along the peripheral edge of the driver body 10b, but the present invention is not limited to this. The contact region 12 may be formed at least on the upper surface 10c of the driver body 10b, and the contact surface 22a of the tip portion 22 of the hook 20 may come into contact with the contact region 12. That is, for example, when the fixed portion 21 of the hook 20 is long, the contact region 12 may be provided at the central portion of the driver body 10b.

In the first embodiment, an example is shown in which the protrusion 13 protruding from the contact region 12 toward the upper surface plate 3 comes into contact with the side surface 22b of the tip 22 of the hook 20, but the present invention is not limited to this. For example, as shown in FIG. 12, a recessed portion 23 that is open downward is formed at the tip portion 22 of the hook 20. Then, when the hook 20 comes into contact with the contact region 12, the hook 20 may be brought into contact with the protrusion 13 by fitting the protrusion 13 into the recess 23.

In the first embodiment, the upper surface 10c of the driver body 10b is formed on a flat surface, but the present invention is not limited to this. For example, as in the driver 10 shown in FIG. 13, a stepped surface 10d lowered by one step along the peripheral edge is formed on the upper surface 10c of the driver body 10b, and a contact region 12 and a protrusion 13 are formed on the stepped surface 10d. At the same time, the upper end of the groove portion 11 may be opened.

Further, the hook provided on the upper surface plate has a drive hook and a contact hook whose axial distance to the driver body is longer than the drive hook, and the groove formed in the driver body is for drive. It may have a groove and a recessing groove.
In this case, at the time of dressing, the contact hook contacts the contact region formed on the upper surface of the driver body, and the upper surface plate is supported by the upper surface of the driver body. On the other hand, the drive hook is inserted into the drive groove, and the rotational drive force of the driver body is transmitted to the upper surface plate by the interference between the drive hook and the drive groove.
At the time of polishing the work, the driving hook is inserted into the driving groove as in the dressing, and the rotational driving force of the driver body is transmitted to the upper surface plate by the interference between the driving hook and the driving groove. At this time, the contact hook is inserted into the retracting groove. As a result, the upper surface plate can be lowered, and the upper surface plate is placed on the lower surface plate to enable polishing of the work.

1 Double-sided polishing device 2 Lower surface plate 2a Polishing pad 2b Center opening 3 Upper surface plate 3a Polishing pad 3b Center opening 9 Lifting actuator (support mechanism)
9b Alignment bearing (support mechanism)
10 Driver 10a Drive shaft 10b Driver body 10c Top surface 11 Groove 11a Inner side surface 12 Contact area 13 Protrusion 20 Hook 20A 1st hook 20B 2nd hook 21 Fixed part 22 Tip

Claims (4)

In a double-sided polishing machine that polishes both sides of a work with a lower surface plate and an upper surface plate,
Through the central opening of the lower surface plate, a drive shaft disposed along the axis, and can be inserted driver body central opening of the upper surface plate is formed at the distal end of the drive shaft, as well as have a , and drivers for rotation about said axis,
The upper platen swingably and suspended rotatable around the axis supporting, with the support mechanism Ru is lifting the on plate,
A hook extending toward the center of the upper surface plate from the periphery of the central opening of the upper surface plate,
A groove formed on the peripheral surface of the driver body and extending in the axial direction of the driver and opening at least upward of the driver body .
A contact region formed on the upper surface of the driver body facing the upper surface plate and the upper end of the groove portion is open , and
A protrusion protruding upward from the contact area and
Equipped with a,
When the upper surface plate is lowered by the support mechanism, the hook comes into contact with the contact region when it does not face the groove in the vertical direction, and the protruding portion is brought along with the rotation of the drive shaft. Is in contact with the driver to transmit a rotational force, and the driver is inserted into the groove when it faces the groove in the vertical direction, and the inner surface of the groove comes into contact with the rotation of the drive shaft. A double-sided polishing apparatus characterized in that the rotational force is transmitted from the driver . In the double-sided polishing apparatus according to claim 1,
A plurality of the grooves are formed on the peripheral surface of the driver body .
The hook has a first hook that contacts the inner surface of the groove when inserted into the groove and a second hook that does not contact the inner surface of the groove when inserted into the groove. A featured double-sided polishing device. In the double-sided polishing apparatus according to claim 1 or 2.
A double-sided polishing apparatus characterized in that a plurality of the hook and the groove portion are provided at point-symmetrical positions with the center of the upper surface plate as a symmetric point. In the double-sided polishing apparatus according to any one of claims 1 to 3.
A double-sided polishing apparatus characterized in that the number of protrusions is smaller than the number of hooks.