JP3139753U - Double-side polishing machine - Google Patents

Abstract

Provided is a double-side polishing machine capable of performing high-efficiency polishing using a wider area of the polishing surface of an upper and lower surface plate.
Double-side polishing in which a carrier 20 holding an object 10 is sandwiched between an annular upper surface plate 30 and a lower surface plate 31 and the upper and lower surfaces of the object 10 are polished by moving the carrier 20 in a planetary motion. In the machine, the upper surface plate 30 and / or the lower surface plate 31 are rotated around a point shifted from the center of the figure.
[Selection] Figure 1

Description

  The present invention relates to a double-side polishing machine that simultaneously polishes both surfaces of a plate of metal, ceramics, crystal, glass, semiconductor or the like.

  Usually, a double-side polishing machine called a double-side lapping machine or double-side polishing machine is used for parallel flat polishing of a thin plate of optical material such as glass or a semiconductor wafer.

  In the planetary gear type double-side polishing machine, as shown in FIG. 3, a planetary gear type carrier 20 is sandwiched between annular upper and lower surface plates 50 and 51 each having an abrasive sheet attached to the inner surface thereof, and the carrier 20 revolves and rotates. Thus, the object to be polished 10 inserted into one or a plurality of holding holes 22 provided in the carrier 20 is polished.

  In such a conventional planetary gear type double-side polishing machine, as shown in FIG. 4, the region through which the workpiece 10 held by the carrier 20 that moves in a planetary path passes through the center of the polishing surface of the upper and lower surface plate (this Are called polishing regions 56, 58), and the inner and outer regions 57 and 59 are not used for polishing.

  The polishing regions 56 and 58 are gradually worn as the object 10 is polished, and the flatness of the object is deteriorated due to this wear. Therefore, when precise polishing is required, a correction carrier is attached instead of the polishing carrier every time polishing is performed for a certain period of time, and the polishing work 56 and 58 on the upper and lower surface plates is corrected.

  However, such correction of the polished surface of the upper and lower surface plates is accompanied by complicated work such as carrier replacement. In addition, the presence of the regions 57 and 59 that do not contribute to the polishing on the polishing surface of the upper and lower surface plates is useless, and if the steps with the polishing regions 56 and 58 are gradually increased, only a long time is required for correction. In the worst case, correction by the correction carrier itself cannot be performed.

JP 09-254026 A

  The present invention has been made to solve such a problem, and the object of the present invention is to perform high-efficiency polishing using a wider area of the polishing surface of the upper and lower surface plates. It is to provide a double-side polishing machine.

The double-side polishing machine according to the present invention made to solve the above problems is
In a double-side polishing machine that sandwiches a carrier holding an object to be polished between an annular upper surface plate and a lower surface plate, and polishes the upper and lower surfaces of the object to be polished by moving the carrier in a planetary motion,
The upper surface plate and / or the lower surface plate rotate around a point shifted from the center of the figure.

  Further, the upper surface plate and / or the lower surface plate may be rotated around a point shifted from the revolution axis of the carrier.

  In the double-side polishing machine according to the present invention, the upper surface plate and / or the lower surface plate rotate around the point deviated from the center of the figure, so it is used in the conventional double-side polishing machine by adjusting the eccentricity appropriately. The object to be polished also passes through the peripheral area of the upper and lower surface plates that have not been formed. Thereby, since the area which concerns on grinding | polishing of a to-be-polished object becomes large in the grinding | polishing surface of an upper and lower surface plate, while being able to use a grinding | polishing surface efficiently, deterioration of the flatness of a grinding | polishing surface can be delayed.

  The object to be polished is on the polished surface of the upper surface plate and / or lower surface plate while drawing a complicated trajectory in which the planetary motion of the carrier and the rotational motion around the eccentric point of the upper surface plate and / or the lower surface plate overlap. To move. For this reason, the trajectories of the objects to be polished are less likely to overlap, and deterioration of surface accuracy and parallelism on the upper and lower surface plates can be suppressed.

  As described above, in the double-side polishing machine according to the present invention, the polishing surface of the upper surface plate and / or the lower surface plate is not easily deteriorated even if the polishing is continuously performed for a longer time than before. Therefore, the number of corrections of the upper and lower surface plates can be reduced. Further, the entire polishing surface of the upper and lower surface plates can be used for efficient polishing.

  Hereinafter, an embodiment of a double-side polishing machine according to the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is a perspective view of a double-side polishing machine according to the present embodiment in a state where an upper surface plate is lifted. The double-side polishing machine according to the present embodiment includes a carrier driving mechanism for causing a plurality of carriers 20 that hold the object to be polished 10 to perform a planetary movement, an upper surface plate 30 and a lower surface that polish the upper and lower surfaces of the object 10 to be polished. A board 31 is provided. Each carrier 20 may have only one object 10 to be polished.

  The carrier driving mechanism includes a carrier 20 that is a planetary gear, an external gear 40 that is a sun gear, and an internal gear 41 that is an outer ring gear. When the carrier 20 is inserted between the external gear 40 and the internal gear 41 and meshed with the both, and the external gear 40 and the internal gear 41 are rotated, the carrier 20 rotates and the central axis A of the external gear 40 and the internal gear 41 is rotated. Revolve around. In FIG. 1, the carrier 20 has four holding holes 22, but the number of holding holes 22 may be determined as appropriate.

  The lower surface plate 31 and the upper surface plate 30 are in the shape of an annular plate, and each facing surface is a polished surface. The lower surface plate 31 is rotationally driven by a lower surface plate driving unit (not shown) provided below the lower surface plate 31. At this time, the connection between the lower surface plate driving unit and the lower surface plate is set so that the rotation center axis A ′ of the lower surface plate driving unit is slightly shifted from the graphic center C of the annular lower surface plate 31 as shown in FIG. . Further, the rotation center axis A ′ of the lower surface plate driving unit is made to coincide with the center axis A of the planetary gear.

  On the upper surface of the upper surface plate 30, there are provided circumferential and radial flow paths 32 for pouring the abrasive into the polishing surface, and two protruding inwardly (center direction) at positions opposite to the edge of the central opening. The pin 33 is provided. The upper surface plate 30 is rotationally driven by an upper surface plate driving unit 34 protruding from the opening of the lower surface plate 31. Although the rotation axis of the upper surface plate drive unit 34 coincides with the center axis A of the planetary gear, the upper surface plate 30 has a graphic center B slightly slightly from the rotation axis of the upper surface plate drive unit 34 as shown in FIG. Arrange them so that they deviate. Therefore, in this embodiment, the lengths of the two pins 33 projecting inward from the central opening of the upper surface plate 30 are different from each other, whereby the upper surface plate 30 is different from the upper surface plate driving unit 34. Make sure that it can be mounted eccentrically. On the contrary, the two pins provided on the upper surface plate 30 have the same length, and the two grooves 35 of the upper surface plate driving unit 34 have different lengths, or both have different lengths. Thus, the graphic center B of the upper surface plate 30 and the rotation axis A may be shifted.

  As described above, the center of rotation of the lower surface plate / upper surface plate is shifted from the center of the figure, so that the object to be polished 10 also passes through the conventional non-polishing region of the upper and lower surface plates in the double-side polishing machine of this embodiment. Thus, the polished surface of the upper and lower surface plates can be used more efficiently, and the deterioration of the polished surface can be delayed.

  Further, the object to be polished 10 moves on the polishing surface of the upper and lower surface plate while drawing a complicated trajectory in which the planetary motion of the carrier 20 and the rotational motion centered on the eccentric point of the upper and lower surface plate overlap. Object trajectories are less likely to overlap, and deterioration of surface accuracy and parallelism on the upper and lower surface plates can be suppressed.

  As described above, in the double-side polishing machine according to the present invention, the polishing surface of the upper and lower surface plates is less likely to deteriorate even if the polishing is continuously performed for a longer time than before. Therefore, the number of corrections of the upper and lower surface plates can be reduced. Further, the entire polishing surface of the upper and lower surface plates can be used for efficient polishing.

  The amount of deviation between the rotation axis of the upper and lower surface plate and the center of the figure may be appropriately determined according to the apparatus, processing conditions, and the like. At that time, in order to use the upper and lower surface plates efficiently, it is desirable to set so that the object to be polished passes through the entire upper and lower surface plates. Further, this shift may not be set on both the upper and lower surface plates, but only on one of the surface plates.

  FIG. 5 shows a modification of this embodiment. In this example, the rotation centers E and F of the upper surface plate 301 and the lower surface plate 311 are set to coincide with the center of the figure, but are set slightly deviated from the revolution axis D of the carrier 201. Even in such a configuration, the object to be polished also passes through the conventional non-polishing region of the upper and lower surface plates, and the same effect as described above can be obtained.

The perspective view of the state which lifted the upper surface plate 30 in the double-side polisher which is one Example of this invention The top view which shows the positional relationship of the upper surface plate 30, the lower surface plate 31, and the upper surface plate drive part 34 in an Example. The perspective view of the state which lifted the upper surface plate 50 in the conventional double-side polisher The figure which shows the grinding | polishing area | region 56 in the upper surface plate 50 of the conventional double-side polish machine, and the figure which shows the grinding | polishing area | region 58 in the lower surface plate 51 (b). The top view which shows the positional relationship of the revolution axis D of the carrier 20, the rotation center E of the upper surface plate 301, and the rotation center F of the lower surface plate 311 in the modification of an Example.

Explanation of symbols

10 ... Polished object 20, 201 ... Carrier 21 ... Gear 22 ... Holding holes 30, 301, 50 ... Upper platen 31, 311, 51 ... Lower platen 32 ... Channel 33, 53 ... Pins 34, 341, 54 ... Upper Surface plate driving portions 35, 55 ... grooves 40, 60 ... external gears 41, 61 ... internal gears 56, 58 ... polishing regions 57, 59 ... regions A that do not contribute to polishing A ... central axis A 'of external gear 40 and internal gear 41 ... rotational center axis B of lower surface plate drive unit ... graphic center C of upper surface plate 30 ... graphic center D of lower surface plate 31 ... revolution axis E of carrier 201 ... rotation center F of upper surface plate 301 ... rotation center of lower surface plate 311

Claims (4)

In a double-side polishing machine that sandwiches a carrier holding an object to be polished between an annular upper surface plate and a lower surface plate, and polishes the upper and lower surfaces of the object to be polished by moving the carrier in a planetary motion,
A double-side polishing machine, wherein the upper surface plate and / or the lower surface plate rotate about a point deviated from the center of the figure.   The upper surface plate or the lower surface plate is rotationally driven by engaging with a plurality of pins extending in the radial direction from the rotational drive shaft, and the deviation is provided by the lengths of the pins being different. 2. The double-side polishing machine according to claim 1, wherein In a double-side polishing machine that sandwiches a carrier holding an object to be polished between an annular upper surface plate and a lower surface plate, and polishes the upper and lower surfaces of the object to be polished by moving the carrier in a planetary motion,
The double-side polishing machine, wherein the upper surface plate and / or the lower surface plate rotate around a point shifted from the revolution axis of the carrier.   The deviation is set so that the workpiece to be polished passes through the entire polishing surface of the upper surface plate and / or the lower surface plate. Double-side polishing machine.

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