KR101104489B1 - Apparatus for conditioning pad, wafer polishing apparatus having the same and method of polishing wafer - Google Patents

Abstract

A pad compensator and a wafer polishing apparatus are disclosed. The pad compensator has a plate shape, includes a gear formed on the outside, the holder is formed with a receiving groove; And a seasoning plate disposed inside the receiving groove and having a plate shape. The pad of the wafer polishing apparatus is corrected by the pad compensator, and accordingly, the wafer polishing apparatus can manufacture a wafer having an improved flatness.

Description

A pad compensator, a wafer polishing apparatus including the same, and a method of polishing a wafer {APPARATUS FOR CONDITIONING PAD, WAFER POLISHING APPARATUS HAVING THE SAME AND METHOD OF POLISHING WAFER}

Embodiments relate to a pad compensator, a wafer polishing apparatus comprising the same, and a method of polishing a wafer.

Semiconductor technology is rapidly evolving into more integrated processes to reduce production costs and improve product performance. Accordingly, the flatness conditions required for silicon wafers are becoming more stringent.

Conventional tapping, etching and polishing silicon wafer manufacturing processes have limitations that cannot meet stringent flatness conditions. Processes applied to overcome these limitations include single-sided and double-sided polishing.

In the case of double-sided grinding, the uneven surfaces before and after the wafer are removed at the same time, so the overall shape and flatness of the wafer are excellent compared to the single-side polishing, and the level of nanotopography is also very good.

However, as the polishing counts accumulate, damage areas may occur in the pads, which may act as a factor that severely degrades the flatness of the polishing pad.

Embodiments provide a pad compensator for efficiently calibrating a pad and improving flatness of a wafer, and a wafer polishing apparatus including the same.

Pad correction apparatus according to the embodiment has a plate shape, a holder including a plurality of gears on the outside, the receiving groove is formed; And a seasoning plate disposed inside the receiving groove and having a plate shape.

Wafer polishing apparatus according to the embodiment includes a first pad; A holder disposed on the first pad, having a plate shape, including a plurality of gears on the outside thereof, and having a receiving groove formed therein; A seasoning plate disposed inside the receiving groove and having a plate shape; And a second pad disposed on the holder.

According to an embodiment, there is provided a method of polishing a wafer, using the pad correcting apparatus, correcting a pad; Checking the state of the pad; Polishing the wafer using the pad; And inspecting the wafer.

The pad compensator according to the embodiment includes a seasoning plate. The seasoning plate can calibrate the pads. In particular, the seasoning plate can even the surface of the pad. That is, since the seasoning plate has a plate shape, it includes a flat top surface and a bottom surface, and the surface of the pad is even by the top and bottom surfaces.

Accordingly, the surface of the pad can be conditioned by the pad compensator according to the embodiment, and the wafer can be polished flat by the conditioned pad.

In particular, when the seasoning plate contains a ceramic, the seasoning plate has durability to chemicals such as slurry and can effectively improve the surface state of the pad.

1 is an exploded perspective view showing a wafer double-side polishing apparatus according to the embodiment.
2 shows a holder and a seasoning plate.
3 shows the planar and side shapes of the seasoning plate.
4 and 5 illustrate a process of calibrating the first polishing pad and the second polishing pad.

In the description of the embodiment, each carrier, holder, plate, part, pad or wafer is formed on or under the "carrier" of each carrier, holder, plate, part, pad or wafer, or the like. When described as being "in" and "under" includes both those that are formed "directly" or "indirectly" through other components. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 is an exploded perspective view showing a wafer double-side polishing apparatus according to the embodiment. 2 shows a holder and a seasoning plate. 3 shows the planar and side shapes of the seasoning plate. 4 and 5 illustrate a process of calibrating the first polishing pad and the second polishing pad.

1 to 5, the wafer double-side polishing apparatus includes a lower plate 100, an upper plate 200, a holder 300, a plurality of seasoning plates 400, a sun gear 500 and an outer gear 600. ).

The lower plate 100 supports the holder 300. The lower plate 100 has a circular plate shape in which the hollow 130 is formed. For example, the lower plate 100 may have a donut shape. The lower surface plate 100 includes a first body portion 110 and a first polishing pad 120.

The first body part 110 supports the first polishing pad 120. The first body part 110 has a circular plate shape. The first body 110 may be rotated by a driving means such as a motor. As the first body part 110 rotates, the first polishing pad 120 also rotates together.

The first polishing pad 120 is disposed on the first body portion 110. The first polishing pad 120 may be combined with the first body 110. The first polishing pad 120 may be integrally formed with the first body portion 110.

The first polishing pad 120 is in direct contact with the wafer to be polished. In more detail, the first polishing pad 120 contacts the lower surface of the wafer to polish the lower surface of the wafer. A plurality of holes may be formed in the first polishing pad 120 to supply a slurry.

The first polishing pad 120 has a plate shape in which a hollow 130 is formed. In more detail, the first polishing pad 120 has a circular plate shape in which the hollow 130 is formed. For example, the first polishing pad 120 may have a donut shape. In addition, the hollow 130 may have a circular shape.

The upper plate 200 is disposed on the lower plate 100. The upper plate 200 is spaced apart from the lower plate 100 and faces the lower plate 100. That is, the upper plate 200 and the lower plate 100 face each other. Although not shown in the drawings, a hollow may be formed in the upper surface plate 200.

The upper plate 200 has a circular plate shape. The upper plate 200 includes a second body portion 210 and a second polishing pad 220.

The second body portion 210 supports the second polishing pad 220. The second body portion 210 has a circular plate shape. The second body portion 210 may be rotated by a driving means such as a motor. At this time, as the second body portion 210 rotates, the second polishing pad 220 also rotates together. In addition, the second body portion 210 may rotate in the same or different directions at the same speed or different speed as the first body portion 110.

The second polishing pad 220 is disposed below the second body portion 210. The second polishing pad 220 may be combined with the second body portion 210. The second polishing pad 220 may be integrally formed with the second body portion 210.

The second polishing pad 220 is in direct contact with the wafer. In more detail, the second polishing pad 220 may directly contact the upper surface of the wafer to polish the upper surface of the wafer.

A plurality of holes may be formed in the second polishing pad 220 to supply slurry to the wafer.

As shown in Figures 1 to 3, the holder 300 is disposed on the lower plate. In more detail, the holder 300 is disposed on the first polishing pad 120. In more detail, the holder 300 is interposed between the first polishing pad 120 and the second polishing pad 220.

The holder 300 includes a body plate 310 having a circular plate shape and a gear 320 formed on an outer circumferential surface 430 of the body plate 310. That is, the holder 300 has a circular plate shape as a whole. For example, the holder 300 is a circular plate in which gears are formed on the outside.

The holder 300 is disposed inside the outer gear 600 and is external to the sun gear 500. In more detail, the holder 300 is inscribed with the outer gear 600. In more detail, the holder 300 is in gear contact with the sun gear 500 and in gear contact with the outer gear 600. Accordingly, the holder 300 is driven by the sun gear 500 and the outer gear 600.

In addition, the holder 300 includes a dummy hole 301 formed in the central portion of the body plate 310 and a plurality of receiving grooves 302 formed around the dummy hole 301.

The dummy hole 301 penetrates through the body plate 310. Accordingly, the dummy hole 301 exposes the top surface of the first polishing pad 120. The dummy hole 301 easily detaches the holder 300 from the first polishing pad 120 in a process in which the first polishing pad 120 and the second polishing pad 220 are conditioned. Function can be performed. That is, the contact area of the holder 300 with respect to the first polishing pad 120 is reduced by the dummy hole 301, and accordingly, the holder 300 is removed from the first polishing pad 120. It can be easily detached.

A plurality of dummy holes 301 may be formed around the receiving groove 302 in addition to the central portion of the body plate 310.

The receiving grooves 302 are formed in the body plate 310. The receiving grooves 302 are formed around the dummy hole 301. Four receiving grooves 302 may be formed, for example. The receiving grooves 302 may pass through the holder 300.

The receiving grooves 302 receive the seasoning plates 400. That is, the seasoning plates 400 are disposed inside the receiving grooves 302, respectively. That is, the planar shape of the receiving grooves 302 may correspond to the planar shape of the seasoning plates 400. In addition, the diameter of the receiving grooves 302 may correspond to the diameter of the seasoning plates 400 or may be slightly larger than the diameter of the seasoning plates 400. For example, the diameter of the receiving grooves 302 may be about 10cm to about 15cm.

Examples of the material used for the holder 300 may include plastic and the like. More specifically, examples of the material used as the holder 300 may include a nylon-based polymer and the like. In more detail, examples of the material used as the holder 300 may include MC Nylon and the like. In addition, the thickness of the holder 300 may be about 0.5cm to about 2cm.

The holder 300 prevents detachment of the seasoning plate 400. That is, when the holder 300 rotates by the sun gear 500 and the outer gear 600, the holder 300 prevents the detachment of the seasoning plate 400.

The seasoning plates 400 are disposed in the receiving grooves 302, respectively. The seasoning plate 400 has a plate shape. In more detail, the seasoning plate 400 has a circular plate shape.

Examples of the material used for the seasoning plate 400 include ceramics and the like.

The seasoning plate 400 includes a flat top surface 410 and a flat bottom surface 420. The top surface 410 and the bottom surface 420 face each other. In addition, the seasoning plate 400 includes an outer circumferential surface 430 intersecting with the upper surface 410 and the bottom surface 420. The outer circumferential surface 430 may vertically intersect the upper surface 410 and the bottom surface 420.

At this time, the portion 440 where the upper surface 410 and the outer peripheral surface 430 intersect has a round shape. That is, the portion 440 where the upper surface 410 and the outer peripheral surface 430 intersect is rounded. In addition, the portion 450 where the bottom surface 420 and the outer circumferential surface 430 intersect also has a round shape. That is, the portion 450 where the bottom surface 420 and the outer circumferential surface 430 intersect is rounded.

That is, the edge portion of the seasoning plate 400 has a round shape. Accordingly, damage to the first polishing pad 120 and the second polishing pad 220 by the seasoning plate 400 can be prevented.

The diameter of the seasoning plate 400 may correspond to the diameter of the receiving groove 302 or may be slightly smaller than the diameter of the receiving groove 302. For example, the diameter of the seasoning plate 400 may be about 10 cm to about 15 cm. The thickness of the seasoning plate 400 may be greater than the thickness of the holder 300. For example, the thickness of the seasoning plate 400 may be about 1 cm to about 3 cm.

The holder 300 and the seasoning plates 400 are pad compensators for calibrating the first polishing pad 120 and the second polishing pad 220.

The sun gear 500 is interposed between the lower plate 100 and the upper plate 200. The sun gear 500 is located at the center of the lower plate 100 and the upper plate 200. The center of the sun gear 500 is substantially coincident with the center of the lower plate 100 and the upper plate 200.

The sun gear 500 may be driven together with the upper plate 200 and / or the lower plate 100. That is, the sun gear 500 may be fixed to the upper plate 200 and / or the lower plate 100.

Unlike this, the sun gear 500 may be driven separately from the upper plate 200 and the lower plate 100. For example, the sun gear 500 may be coupled to the rotating shaft passing through the hollow 130 formed in the upper plate 200 or the lower plate 100 to rotate.

The sun gear 500 is gear-coupled with the holder 300. That is, the holder 300 is driven by the rotation of the sun gear 500.

The outer gear 600 is disposed between the upper platen 200 and the lower platen 100. The outer gear 600 surrounds the sun gear 500 and the holder 300. The outer gear 600 is gear-coupled with the holder 300 to transmit power to the holder 300. That is, the outer circumferential surface 430 of the holder 300 and the inner circumferential surface of the outer gear 600 are geared to each other. By the rotation of the outer gear 600, the holder 300 is driven.

By the rotation of the sun gear 500 and the outer gear 600, the holder 300 is rotated, moving around the sun gear 500. That is, the holder 300 may receive power from the sun gear 500 and the outer gear 600 and rotate while itself.

The sun gear 500 and the outer gear 600 may rotate in the same direction and may rotate in different directions. In addition, the sun gear 500 and the outer gear 600 may rotate at the same angular speed, or may rotate at different angular speeds. As a result, the sun gear 500 and the outer gear 600 rotate in various manners to drive the holder 300. That is, the sun gear 500 and the outer gear 600 are rotation devices for relatively rotating the holder 300 with respect to the lower plate 100 and the upper plate 200.

As shown in FIGS. 4 and 5, the holder 300 is disposed inside the outer gear 600 in a state in which the seasoning plate 400 is accommodated. In addition, the holder 300 is disposed outside the sun gear 500.

In addition, the holder 300 is interposed between the lower plate 100 and the upper plate 200. That is, the holder 300 is interposed between the first polishing pad 120 and the second polishing pad 220. In this case, the seasoning plate 400 is in direct contact with the first polishing pad 120 and the second polishing pad 220. For example, the top surface 410 of the seasoning plate 400 is in direct contact with the second polishing pad 220, and the bottom surface 420 of the seasoning plate 400 is the first polishing pad 120. Direct contact with

In this state, the holder 300 is driven as described above. The holder 300 may rotate and revolve by the sun gear 500 and the outer gear 600. Accordingly, the seasoning plates 400 correct the first polishing pad 120 and the second polishing pad 220. That is, the seasoning plates 400 may condition the first polishing pad and the second polishing pad 220. Accordingly, the top surface 410 of the first polishing pad 120 and the bottom surface of the second polishing pad 220 may be evenly flattened as a whole.

As such, after the first polishing pad 120 and the second polishing pad 220 are corrected, the pad compensator, that is, the holder 300 and the seasoning plate 400 may be a first polishing pad ( 120 and separated from the second polishing pad 220.

Thereafter, the states of the first polishing pad 120 and the second polishing pad 220 may be inspected by the naked eye.

Thereafter, a carrier is disposed between the first polishing pad 120 and the second polishing pad 220. In addition, a wafer is disposed inside the carrier, and the wafer is double-sided polished by driving of the sun gear 500 and the outer gear 600. In order to polish the wafer, the sun gear 500 and the outer gear 600 can be driven as described above.

The carrier is interposed between the lower plate 100 and the upper plate 200. The carrier has a plate shape, accommodates the wafer, and temporarily stores the slurry supplied from the first polishing pad 120 and / or the second polishing pad 220. Examples of the material used as the carrier include epoxy resins such as epoxy glass and the like.

A plurality of teeth is formed in the outer region of the carrier. That is, the carrier receives the wafer and receives power from the sun gear 500 and the outer gear 600.

The carrier includes a wafer receiving groove and slurry reservoirs.

The wafer receiving groove accommodates the wafer. The wafer receiving groove is a through groove having a shape corresponding to that of the wafer. That is, the wafer receiving groove may have a circular shape and may have a diameter substantially the same as the diameter of the wafer.

The center of the wafer receiving groove may be eccentric with respect to the center of the carrier. That is, the center of the wafer receiving groove does not coincide with the center of the carrier. Accordingly, when the carrier rotates, the wafer accommodated in the wafer receiving groove rotates eccentrically.

The slurry reservoirs temporarily store the slurry. The slurry reservoirs are formed around the wafer receiving groove. The slurry reservoirs may be through grooves. In this case, the slurry reservoirs may have different diameters. In addition, in the present embodiment, the slurry reservoirs are shown as having a circular shape, but is not limited thereto, and the slurry reservoirs may have various shapes.

The polished wafer can then be inspected through various equipment.

The first polishing pad 120 and the second polishing pad 220 are used after the polishing process of the wafer several times or when the first polishing pad 120 is first applied to the wafer polishing process. As shown in Fig. 5, the pad calibration process must be performed.

Thereafter, after the first polishing pad 120 and the second polishing pad 220 are conditioned, a wafer double-side polishing process is performed as shown in FIG. 6.

As such, the first polishing pad 120 and the second polishing pad 220 are conditioned by seasoning plates 400 having a flat top surface 410 and a bottom surface 420. Accordingly, the wafer can be polished to have improved flatness.

Accordingly, the wafer double-side polishing apparatus according to the embodiment can provide a wafer having improved flatness.

In addition, the features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

Claims (9)

A holder having a plate shape and including a gear formed at an outer side thereof, the receiving groove being formed; And
A seasoning plate disposed inside the receiving groove and having a plate shape;
The seasoning plate
Upper and lower surfaces facing each other; And
An outer circumferential surface that meets the upper surface and the bottom surface,
And a portion where the upper surface and the outer circumferential surface meet and the portion where the bottom surface and the outer circumferential surface meet have a round shape. The method of claim 1 wherein the holder comprises a polymer,
The seasoning plate is a pad compensator comprising a ceramic. delete The pad compensator of claim 1, wherein a thickness of the seasoning plate is greater than a thickness of the holder. A first pad;
A holder disposed on the first pad, having a plate shape, including a plurality of gears on the outside thereof, and having a receiving groove formed therein;
A seasoning plate disposed inside the receiving groove and having a plate shape; And
A second pad disposed on the holder,
The seasoning plate
Upper and lower surfaces facing each other; And
An outer circumferential surface that meets the upper surface and the bottom surface,
And a portion where the top surface and the outer circumferential surface meet and a portion where the bottom surface and the outer circumferential surface meet each other have a round shape. The wafer polishing apparatus of claim 5, wherein the holder comprises a dummy hole exposing an upper surface of the first pad. The wafer polishing apparatus according to claim 5, wherein the seasoning plate has a circular plate shape. 6. The apparatus of claim 5, further comprising: a sun gear disposed adjacent the holder and in gear contact with the holder; And
And an outer gear surrounding the holder and the sun gear and in gear contact with the holder. A holder having a plate shape and including a gear formed at an outer side thereof, the receiving groove being formed; And calibrating the pad using a pad compensator disposed inside the receiving groove and including a seasoning plate having a plate shape.
Checking the state of the pad;
Polishing the wafer using the pad; And
Inspecting the wafer,
The seasoning plate
Upper and lower surfaces facing each other; And
An outer circumferential surface that meets the upper surface and the bottom surface,
And a portion where the top surface and the outer circumferential surface meet and a portion where the bottom surface and the outer circumferential surface meet have a round shape.

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